CN101206948A - Helical inductance element - Google Patents
Helical inductance element Download PDFInfo
- Publication number
- CN101206948A CN101206948A CNA2007101637958A CN200710163795A CN101206948A CN 101206948 A CN101206948 A CN 101206948A CN A2007101637958 A CNA2007101637958 A CN A2007101637958A CN 200710163795 A CN200710163795 A CN 200710163795A CN 101206948 A CN101206948 A CN 101206948A
- Authority
- CN
- China
- Prior art keywords
- conducting line
- spiral conducting
- end points
- inductance element
- points portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a spiral inductor, which comprises a first spiral lead wire which is of a multi-loop type and provided with an outer loop end point part and an inner loop end point part, a second spiral lead wire which is surrounded outside at least a part of the most outer loop of the lead wire of the first spiral lead wire and provided with a first end point part and a second end point part, and a connecting device which is communicated between the inner loop end point part and the first end point part. The quality factor of the spiral inductor of the invention is higher than the quality factor of the traditional spiral inductor, in addition, the quality of a radio frequency device system can be guaranteed, and the production cost is reduced.
Description
Technical field
The present invention is relevant for a kind of inductor, especially in regard to a kind of inductance element with multiplex conductor structure.
Background technology
As shown in Figure 1, in the silicon processing procedure of one 0.35 μ m, one silica layer 3 is arranged on the P type trap layer 2 on the silicon base 1, three metal level M1, M2, M3 are embedded in the silicon oxide layer 3, the metal level M3 of the superiors then is exposed to the upper surface of silicon oxide layer 3,4 capping oxidation silicon layers of a silicon nitride layer 3 and metal level M3.In three metal level M1, M2, M3, the thickness maximum of metal level M3, so its conductance is higher than other the two, and have minimum conductor losses (conductor loss), and be applicable to the radio-frequency (RF) component design of low loss.
Fig. 2 shows the vertical view of the inductance element 5 of traditional three circle formulas.The interior circle conductor part 6 of inductance element 5 has the highest magnetic flux, and therefore the inducing eddy-current that is produced in interior circle conductor part 6 can make distribution of current density herein very inhomogeneous.That is the electric current that flows can concentrate on the inboard of interior circle conductor part 6, and has reduced the mobile net sectional area of power supply stream herein significantly, and the performance of inductance element 5 is caused harmful effect and reduces its quality factor (quality factor; Q matter).And, when the frequency of electronic signal increases, just more violent to the harmful effect of the quality factor of inductance element 5.
Summary of the invention
In view of this, industry needs a kind of technology, can eliminate or reduce the situation of the electric current distribution inequality of inductance element inside, and promote the performance of inductance element whereby, promotes the quality factor of inductance element.
The invention provides a kind of helical inductance element, comprising: one first spiral conducting line, it is the multiturn formula, it has circle end points portion in an outer circle end points portion and; One second spiral conducting line is around the outside of at least a portion of the outermost turn conductor part of above-mentioned first spiral conducting line, and it has one first end points portion and one second end points portion; And a jockey, be electrically connected at above-mentioned between circle end points portion and the above-mentioned first end points portion.
The present invention provides a kind of helical inductance element again, comprising: an insulating barrier is arranged in the substrate; One first spiral conducting line, it is the multiturn formula, is arranged in the above-mentioned insulating barrier, it has circle end points portion in an outer circle end points portion and; One second spiral conducting line is arranged in the above-mentioned insulating barrier and around the outside of at least a portion of the outermost turn conductor part of above-mentioned first spiral conducting line, it has one first end points portion and one second end points portion, and above-mentioned first spiral conducting line and above-mentioned second spiral conducting line are to belong to same conductor layer; One first cylindrical conductor is electrically connected at above-mentioned interior circle end points portion and protrudes from above-mentioned first spiral conducting line; One second cylindrical conductor is electrically connected at the above-mentioned first end points portion and protrudes from above-mentioned second spiral conducting line, and its protrusion direction the protrusion direction with above-mentioned first cylindrical conductor is identical in fact; And a connecting line, being electrically connected between above-mentioned first cylindrical conductor and above-mentioned second cylindrical conductor, above-mentioned connecting line and above-mentioned first spiral conducting line are positioned at the different conductor layer.
Helical inductance element of the present invention, its quality factor is higher than the quality factor of conventional helical inductance element, in addition, can also guarantee the quality of radio-frequency unit system, reduces manufacturing cost.
Description of drawings
Fig. 1 is a profile, shows the structure of the semiconductor device of known silicon processing procedure.
Fig. 2 is a vertical view, shows the inductance element of three traditional circle formulas.
Fig. 3 is a vertical view, shows the helical inductance element of preferred embodiment of the present invention.
Fig. 4 is a profile, shows an application examples of the helical inductance element of preferred embodiment of the present invention.
Fig. 5 is a profile, shows the Another Application example of the helical inductance element of preferred embodiment of the present invention.
Fig. 6 is a profile, shows a version of application examples shown in Figure 5.
Fig. 7 is a profile, shows another version of application examples shown in Figure 5.
Embodiment
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, cited below particularlyly go out preferred embodiment, and cooperate appended graphicly, be described in detail below.
Hereinafter described " ' in fact ' is even ", " ' in fact ' is parallel ", " ' in fact ' equals ", " ' in fact ' (and with) ... identical " etc. narration, be meant that expectation in design is for even, parallel, equal, (with) ... identical, but be subject to the error in the actual manufacturing, and be difficult to reach as mathematics or geometry defined evenly on the reality, parallel, equal, (with) ... identical, if but its error falls within the scope person that corresponding manufacturing specification can allow, still be considered as evenly, parallel, equal, (with) ... identical.It will be understood by those skilled in the art that aforementioned manufacturing specification has different variations according to various conditions, so do not list one by one.
Please refer to Fig. 3, is a vertical view, shows the helical inductance element of preferred embodiment of the present invention.Helical inductance element shown in Figure 3 comprises a spiral conducting line 10, a spiral conducting line 20 and a jockey 30.
Spiral conducting line 10 is the spiral conducting line of multiturn formula, has circle end points portion 12 in an outer circle end points portion 11 and, and its integral body can be positioned at same level in fact, can also not be positioned at same level.Outer circle end points portion 11 is the section start of outermost turn conductor part 13, and interior circle end points portion 12 is the termination of interior circle conductor part 14; Or by another viewpoint, interior circle end points portion 12 is the section start of interior circle conductor part 14, and outer circle end points portion 11 is the termination of outermost turn conductor part 13.In the present embodiment, spiral conducting line 10 be by 11 beginnings of outer circle end points portion circling round clockwise till interior circle end points portion 12, and also visual its requirement change of those skilled in the art is for counterclockwise circling round.Though Fig. 3 shows that the number of turn of spiral conducting line 10 is 2, but also visual its number of turn of its increase in demand of those skilled in the art, and also the number of turn of spiral conducting line 10 can be integer, can also be non-integer that visual demand is changed.In addition, the external form of spiral conducting line 10 can be round, ellipse, square type, hexagonal, eight limit types or polygonal.In Fig. 3, be to illustrate as example with the square type.
Spiral conducting line 20 around the outside of at least a portion of the outermost turn conductor part 13 of spiral conducting line 10, also can be around the whole outside of the outermost turn conductor part 13 of spiral conducting line 10, it has an end points portion 21 and an end points portion 22, and its integral body can be positioned at same level in fact, can also not be positioned at same level.And be positioned in fact under the situation of same level in the integral body of spiral conducting line 10, spiral conducting line 20 can be positioned at same level, can also not be positioned at same level with spiral conducting line 10 in fact.In addition, spiral conducting line 20 does not stretch in the field 15 that spiral conducting line 10 centered on and does not contact spiral conducting line 10.Moreover because spiral conducting line 20 is the outermost turn conductor part 13 around spiral conducting line 10, its external form is looked the external form of selected spiral conducting line 10 and is changed.
And be demand in response to the external line of helical inductance element of preferred embodiment of the present invention, can set up signal input/ output end port 41,42 according to circumstances.Wherein signal input/output end port 41 is electrically connected at outer circle end points portion 11, and extends towards the direction away from spiral conducting line 10; And signal input/output end port 42 is electrically connected at end points portion 22, and extends towards the direction away from spiral conducting line 20.Signal input/output end port 41 can be parallel in fact or not parallel with 42 bearing of trend, and situation shown in Figure 3 then is that signal input/output end port 41 is parallel in fact with 42.
In addition, the number of turn of spiral conducting line 20 shown in Figure 3 is not enough but approaches a circle and make the arrangement position of signal input/ output end port 41,42 quite approaching; But in another embodiment, the number of turn of spiral conducting line 20 can on demand decide and be 3/4ths, 1/2nd or other less than 1 positive number, and thereby draw back the distance of signal input/output end port 41,42.That is, spiral conducting line 20 around the outside of at least a portion of the outermost turn conductor part 13 of spiral conducting line 10, also can be around the whole outside of the outermost turn conductor part 13 of spiral conducting line 10.
And in practicality, the material of spiral conducting line 10,20 and every dimensional parameters are preferably even in fact, with convenient inductance value and the performance of other performances of calculating, control the helical inductance element of preferred embodiment of the present invention.And the preferred dimensions parameter of next illustrated helical inductance element also can be applicable in applicable other application examples of application examples or those skilled in the art institute that this specification enumerated later.In addition, for convenience of description, can show parameter on some sizes with unknown number, aspect actual enforcement, these are to do suitable adjustment according to its demand by those skilled in the art with the represented numerical value of unknown number.
Spiral conducting line 10,20 is preferably and is positioned at same level in fact, for example can carry out graphically a conductor layer, and form spiral conducting line 10,20 simultaneously.Spiral conducting line 10 is preferably has in fact line width values W1 uniformly, and its live width demand of looking can change to some extent at some position, and for example the width value in interior circle end points portion 12 can fade to W2, and wherein W2 is greater than W1.In addition, the wire pitch (pitch) between each adjacent turn of spiral conducting line 10 is preferably and has distance values P in fact uniformly.In one embodiment, the width value of interior circle end points portion 12 can be identical with the line width values of spiral conducting line 10,20, is all W1 (not illustrating).
Spiral conducting line 20 is preferably also has live width in fact uniformly, and its line width values more preferably equals the line width values W1 of spiral conducting line 10 in fact.And set up in the situation of signal input/ output end port 41,42 in selection, the two can be positioned at same level in fact or be positioned at Different Plane.And in preferred embodiment, signal input/ output end port 41,42 can be positioned at same level in fact with spiral conducting line 10,20, for example spiral conducting line 10,20 o'clock can formed, by same patterned step, and form spiral conducting line 10,20 and signal input/ output end port 41,42 simultaneously.Signal input/ output end port 41,42 is preferably all has live width in fact uniformly, and line width values more preferably all equals the line width values W1 of spiral conducting line 10 in fact.
And spiral conducting line 20 and the outermost turn conductor part 13 of spiral conducting line 10 be preferably and be essentially parallelly, and the wire pitch of the outermost turn conductor part 13 of spiral conducting line 20 and spiral conducting line 10 more preferably equals the wire pitch value P between each adjacent turn of spiral conducting line 10 in fact.Set up in the situation of signal input/ output end port 41,42 selecting, the spacing of the two can be equal between each adjacent turn of spiral conducting line 10 wire pitch value P, can also be other numerical value greater than P.
Next the application examples of the helical inductance element of preferred embodiment of the present invention as chip built-in inductance element be described, the illustrative cross-section structure of one, promptly is along the cross-section structure of the AA ' line of Fig. 3, is illustrated in Fig. 4.
In Fig. 4, an insulating barrier 110 is arranged in the substrate 100.In the application examples of chip built-in inductance element, substrate 100 comprises a silicon base or other known semiconductor substrates.In addition, can comprise various element in the substrate 100, for example transistor, resistance and other known semiconductor elements.Moreover substrate 100 also can comprise other conductive layers (for example, copper, aluminium or its alloy) and insulating barrier (for example, silicon oxide layer, silicon nitride layer or low dielectric material layer).For simplicity of illustration, said structure is only represented with a smooth substrate herein.
Insulating barrier 110 normally has the multilayer film of multilayer different dielectric material, and its each layer corresponds respectively to embedding, is arranged at each conductor layer 122,123 of the intraconnections system in it.Similarly, for simplicity of illustration, said structure is only represented with single and smooth insulating barrier.
In Fig. 4, spiral conducting line the 10, the 20th belongs to the conductor layer 123 of the same the superiors, because the thickness of conductor layer 123 belongs to the maximum in each conductor layer, so its conductance is higher than other conductive layer, and have minimum conductor losses, and be applicable to the radio-frequency (RF) component design of low loss.And in other embodiment, the conductor layer that also spiral conducting line 10,20 can be arranged at other lower levels is for example in the conductor layer 122.
In the present embodiment, owing to spiral conducting line the 10, the 20th, belong to the conductor layer 123 of the same the superiors, jockey 30 (please refer to Fig. 3) in being electrically connected between circle end points portion 12 and the end points portion 21 then is the below that is arranged at spiral conducting line 10,20, and has structures such as cylindrical conductor 31, cylindrical conductor 32 and connecting line 33.
In addition, spiral conducting line 10,20 is arranged in the situation of conductor layer of other lower levels, connecting line 33 can be arranged in other conductive layers on its lower floor or upper strata, by the plug structure of similar cylindrical conductor 31,32, the electric connection in finishing between circle end points portion 12 and the end points portion 21.
Also have, set up in the situation of signal input/ output end port 41,42 in selection, though Fig. 4 does not illustrate, signal input/ output end port 41,42 can also be arranged in the conductor layer 123 identical with spiral conducting line 10,20, and directly electrically connects outer circle end points portion 11, end points portion 22 (please refer to Fig. 3); In another embodiment, signal input/ output end port 41,42 can also be arranged in the conductor layer different with spiral conducting line 10,20, and the structure by similar cylindrical conductor 31,32 electrically connects outer circle end points portion 11, end points portion 22 (please refer to Fig. 3).
Structure shown in Figure 4 is the helical inductance element of a preferred embodiment of the present invention illustrative cross-section structure as the application examples of chip built-in inductance element, yet also is applicable to that other devices with multilayer wiring structure are for example as the printed circuit board (PCB) of base plate for packaging, electronics motherboards or as the lead frame of the multilayer line of base plate for packaging.At this moment, substrate 100 can be the core substrate of said apparatus just, and the protective layer of being located on the insulating barrier 110 130 then can be used as welding resisting layer.
Stand in the viewpoint of helical inductance element, jockey 30 is an important element, and can be connected in series spiral conducting line 10,20 by jockey 30 becomes complete helical inductance element.And in other application examples, can only spiral conducting line 10,20 be formed in the intraconnections system, 30 of jockeys not necessarily need to be formed in this intraconnections system, and by making being connected of above-mentioned intraconnections system and an external device (ED), and electrically connect spiral conducting line 10,20, finish the helical inductance element of preferred embodiment of the present invention.
For example in chip built-in inductance element shown in Figure 4, printed circuit borad with built-in inductance element or lead frame built-in inductor element, can make electric connection between the end points portion 21 of the interior circle end points portion 12 of spiral conducting line 10 and spiral conducting line 20 not via its lower floor's conductive layer, but reach by the external device (ED) that is connected in spiral conducting line 10,20 tops.Thus, the helical inductance element that can make preferred embodiment of the present invention is incessantly applicable to the device with multiple layer inner connection wire system element, also applicable to only having the device of individual layer intraconnections system, for example as the printed circuit board (PCB) of the individual layer wiring of base plate for packaging or the lead frame of individual layer etc.The profile of one illustration structure of above-mentioned intraconnections system is illustrated in Fig. 5, and its vertical view also can be the shown person of Fig. 3; That is Fig. 5 also is the profile along the hatching AA ' of Fig. 3.
Elements such as the spiral conducting line 10 and 20 shown in Fig. 5, interior circle end points portion 12, end points portion 21, substrate 100, insulating barrier 110 and upper surface 110a thereof, conductor layer 123 and protective layer 130; with the element of same component symbol representative shown in Figure 4 is identical or equivalence element, so omit its narration at this.And in another embodiment, above-mentioned intraconnections system can only have the conductor layer 123 of individual layer; Or can set up one or several layers conductor layer for 123 times at conductive layer.
In Fig. 5; the upper surface of spiral conducting line 10,20 is exposed among the upper surface 110a of insulating barrier 110; can form openings 131,132 at protective layer 130, and expose end points portion 21 and interior circle end points portion 12 respectively to the open air, electrically connect end points portion 21 and interior circle end points portion 12 respectively so that make weld pad 34,35.Be preferably via suitable layout this moment, makes end points portion 21 and interior circle end points portion 12 be positioned at the position that is suitable for forming weld pad 34,35.After finishing the making of weld pad 34,35, visual demand forms a protective layer 140 again on protective layer 130 and weld pad 34,35, forms opening 141,142 again and exposes weld pad 34,35 respectively to the open air.
Below explanation forms the application examples of electric connection between the end points portion 21 of the interior circle end points portion 12 of spiral conducting line 10 and spiral conducting line 20.
For example in Fig. 6, can use the technology of wire bonds, form a bonding wire 36 and be electrically connected between the weld pad 34,35, and finish electric connection between the end points portion 21 of the interior circle end points portion 12 of spiral conducting line 10 and spiral conducting line 20.At this moment, weld pad 34,35 can be used as cylindrical conductor, and bonding wire 36 is then as connecting line, and constitutes jockey shown in Figure 3 30.
In another illustrative application examples, as shown in Figure 7, can provide an external device (ED) 50, it has connection end point 53,54 and is electrically connected at connecting line 37 between connection end point 53 and 54.External device (ED) 50 can be the device of printed circuit board (PCB), base plate for packaging, semiconductor chip, passive device or other tool internal wirings, and which kind of the intraconnections system shown in the view 5 belongs to for example to install semiconductor chip, printed circuit board (PCB), lead frame or other devices and decide.
Next be electrically connected between weld pad 34 and the connection end point 53 by conductive projection 51, and be electrically connected between weld pad 35 and the connection end point 54, and finish electric connection between the end points portion 21 of the interior circle end points portion 12 of spiral conducting line 10 and spiral conducting line 20 by conductive projection 52.At this moment, weld pad 34,35 can be used as cylindrical conductor, and the combination of conductive projection 51, connection end point 53, connecting line 37, connection end point 54 and conductive projection 52 is then as connecting line, and constitutes jockey shown in Figure 3 30.
In the Another Application example, bonding wire structure that can similar bonding wire 36 replaces conductive projection shown in Figure 7 51,52, this moment external device (ED) 50 just may not can above spiral conducting line 10,20, and may be below substrate 100 or the next door.
The helical inductance element of preferred embodiment of the present invention, it is the interior circle lead that replaces the conventional helical inductance element with spiral conducting line 20, and can be under the constant situation of total number of turns, improve the situation of eliminating or reducing the electric current distribution inequality of inductance element inside, and promote the performance of inductance element whereby, promote the quality factor (Q value) of inductance element.
Embodiments of the invention have multiple advantages.One, the manufacturing of the helical inductance element of preferred embodiment of the present invention is applicable to or is compatible to the silicon processing procedure of standard.In addition, prove by control experiment that the quality factor of the helical inductance element of preferred embodiment of the present invention (Q value) is higher than the quality factor (Q value) of conventional helical inductance element.In addition, the manufacturing of the helical inductance element of preferred embodiment of the present invention does not need special creating conditions.Also have, the enforcement of the helical inductance element by preferred embodiment of the present invention can be guaranteed the quality of radio-frequency unit system, and can reduce manufacturing cost.
The above only is preferred embodiment of the present invention; so it is not in order to limit scope of the present invention; any personnel that are familiar with this technology; without departing from the spirit and scope of the present invention; can do further improvement and variation on this basis, so the scope that claims were defined that protection scope of the present invention is worked as with the application is as the criterion.
Being simply described as follows of symbol in the accompanying drawing:
M1: metal level M2: metal level
M3: metal level 1: silicon base
2:P type trap layer 3: silicon oxide layer
4: silicon nitride layer 5: inductance element
6: interior circle conductor part 10: spiral conducting line
11: outer circle end points section 12: interior circle end points section
13: outermost circle conductor part 14: interior circle conductor part
15: field 20: spiral conducting line
21: end points portion 22: end points portion
30: jockey 31: cylindrical conductor
32: cylindrical conductor 33: connecting line
34: weld pad 35: weld pad
36: bonding wire 37: connecting line
41: signal input/output end port 42: the signal input/output end port
50: external device (ED) 51: conductive projection
52: conductive projection 53: connection end point
54: connection end point 100: substrate
110: insulating barrier 110a: upper surface
122: conductor layer 123: conductor layer
130: protective layer 131: opening
132: opening 140: protective layer
141: opening 142: opening.
Claims (10)
1. a helical inductance element is characterized in that, comprising:
One first spiral conducting line, it is the multiturn formula, it has circle end points portion in an outer circle end points portion and;
One second spiral conducting line is around the outside of at least a portion of the outermost turn conductor part of this first spiral conducting line, and it has one first end points portion and one second end points portion; And
One jockey is electrically connected between this interior circle end points portion and this first end points portion.
2. helical inductance element according to claim 1 is characterized in that, more comprises:
One first signal input/output end port is electrically connected at this outer circle end points portion, and extends towards the direction away from this first spiral conducting line; And
One secondary signal input/output end port is electrically connected at this second end points portion, and extends towards the direction away from this second spiral conducting line.
3. helical inductance element according to claim 1 is characterized in that, this second spiral conducting line does not stretch in the field that this first spiral conducting line centered on and do not contact this first spiral conducting line.
4. helical inductance element according to claim 1 is characterized in that, more comprises:
One insulating barrier is arranged in the substrate, and this first spiral conducting line, this second spiral conducting line be arranged in this insulating barrier, and this first spiral conducting line and this second spiral conducting line belong to same conductor layer;
One first cylindrical conductor is electrically connected at this interior circle end points portion and protrudes from this first spiral conducting line; And
One second cylindrical conductor, be electrically connected at this first end points portion and protrude from this second spiral conducting line, and its protrusion direction protrusion direction with this first cylindrical conductor in fact is identical, wherein this jockey is electrically connected between this first cylindrical conductor and this second cylindrical conductor, and this jockey and this first spiral conducting line are positioned at the different conductor layer.
5. helical inductance element according to claim 4, it is characterized in that, this first cylindrical conductor and this second cylindrical conductor are the plug structure that is arranged in this insulating barrier, and this jockey is positioned at lower floor's conductor layer of this first spiral conducting line and this second spiral conducting line.
6. helical inductance element according to claim 4 is characterized in that, this first cylindrical conductor and this second cylindrical conductor are the welding pad structure that is arranged at this insulating barrier top.
7. helical inductance element according to claim 6 is characterized in that, this jockey is a welding wire joint structure.
8. helical inductance element according to claim 4 is characterized in that, comprise that more an electronic component is electrically connected at this first cylindrical conductor and this second cylindrical conductor, and this electronic component comprises this jockey.
9. helical inductance element according to claim 4 is characterized in that, more comprises:
One first signal input/output end port is arranged in this insulating barrier and is electrically connected at this outer circle end points portion, and towards the direction extension away from this first spiral conducting line; And
One secondary signal input/output end port is arranged in this insulating barrier and is electrically connected at this second end points portion, and extends towards the direction away from this second spiral conducting line.
10. helical inductance element according to claim 4 is characterized in that, this second spiral conducting line does not stretch in the field that this first spiral conducting line centered on and do not contact this first spiral conducting line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101637958A CN101206948A (en) | 2007-11-08 | 2007-11-08 | Helical inductance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101637958A CN101206948A (en) | 2007-11-08 | 2007-11-08 | Helical inductance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101206948A true CN101206948A (en) | 2008-06-25 |
Family
ID=39567040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101637958A Pending CN101206948A (en) | 2007-11-08 | 2007-11-08 | Helical inductance element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101206948A (en) |
-
2007
- 2007-11-08 CN CNA2007101637958A patent/CN101206948A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI397930B (en) | Spiral inductor | |
| US7843303B2 (en) | Multilayer inductor | |
| US7170384B2 (en) | Printed circuit board having three-dimensional spiral inductor and method of fabricating same | |
| US8618631B2 (en) | On-chip ferrite bead inductor | |
| US5898991A (en) | Methods of fabrication of coaxial vias and magnetic devices | |
| US7248138B2 (en) | Multi-layer printed circuit board inductor winding with added metal foil layers | |
| US20050212640A1 (en) | Multi-layer printed circuit board transformer winding | |
| KR101532171B1 (en) | Inductor and Manufacturing Method for the Same | |
| EP3648128B1 (en) | Transformer module and power module | |
| US9620448B1 (en) | Power module | |
| KR20170133140A (en) | Coil electronic part and manufacturing method thereof | |
| JP2008171965A (en) | Microminiature power converter | |
| KR20100069604A (en) | Inductor module and circuit module | |
| JP2009016504A (en) | Multilayer wiring board with built-in inductor | |
| US10790792B2 (en) | LC composite device, processor, and method for manufacturing LC composite device | |
| JP2018532260A (en) | Inductor integration and wafer-to-wafer bonding by advanced node system on chip (SOC) using glass wafer with inductor | |
| US20150173197A1 (en) | Printed circuit board having inductor embedded therein and manufacturing method thereof | |
| TWI226647B (en) | Inductor formed between two layout layers | |
| US6535093B1 (en) | Inductor | |
| US10470309B2 (en) | Inductor and capacitor integrated on a substrate | |
| US7573721B2 (en) | Embedded passive device structure and manufacturing method thereof | |
| CN114582586A (en) | Integrated inductor and manufacturing method thereof, and direct current-direct current converter | |
| CN101206948A (en) | Helical inductance element | |
| CN100578696C (en) | Inductance structure | |
| KR100940529B1 (en) | Vertically Turned Metal Line Inductor and Electric Device including the Inductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20080625 |