CN101206287A - Photoelectricity substrate and manufacturing method therefor - Google Patents
Photoelectricity substrate and manufacturing method therefor Download PDFInfo
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- CN101206287A CN101206287A CNA2006101707871A CN200610170787A CN101206287A CN 101206287 A CN101206287 A CN 101206287A CN A2006101707871 A CNA2006101707871 A CN A2006101707871A CN 200610170787 A CN200610170787 A CN 200610170787A CN 101206287 A CN101206287 A CN 101206287A
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- support plate
- light
- conductive hole
- optical waveguide
- waveguide structure
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Abstract
The invention relates to a photoelectric substrate and a manufacturing method thereof, wherein, the photoelectric substrate comprises a carrier plate, an optical waveguide structure, a metallic layer and euphotic material; the carrier plate has a light guide hole connecting the upper side face and the lower side face of the carrier plate; the optical waveguide structure is formed on the lower side face of the carrier plate and covers the opening of the light guide hole, thereby ensuring that light signal is transmitted by the light guide hole between the optical waveguide structure and the upper side face of the carrier plate; the metallic layer, which is formed on the internal wall of the light guide hole, is used to reduce the roughness of the internal wall of the light guide hole; moreover, light signal is reflected by means of the reflective characteristics of metal, thereby avoiding light signal attenuation due to too frequent reflection or absorption caused by the rough internal wall of the light guide hole; the euphotic material, which is filled in the light guide hole and can be penetrated by the light signal, can prevent external material from entering into the light guide hole during manufacture.
Description
Technical field
The present invention relates to light signal and transmit field, particularly a kind of photoelectric substrates that is used for integrated optical wave guide structure and photoelectric subassembly.
Background technology
Present high-velocity electrons transmission system is still carried out the electric signal transmission with plain conductor mostly.For the communication frequency range promotes, the frequency of electric signal is greatly improved, the intense electromagnetic ripple that the electric signal of high frequency running produces, and cause serious electromagnetic interference (EMI).In order to reduce Electromagnetic Interference, the transmitting bandwidth and the frequency of electric signal are restricted, and the data traffic that makes electric signal to transmit is difficult for further promoting again.Do not leak and can not generate electromagnetic waves during optical signal transmission, can not be subjected to the external electromagnetic wave interference yet, therefore be integrated in gradually in the circuit design, as signal channel.
Existing optical signal transmission utilizes optical fiber to transmit signal, by coupling mechanism optical fiber is connected with photoelectric subassembly again, makes light signal be converted to electric signal and transfers to other electronic package again.Existing design inclination is integrated in optical waveguide structure and photoelectric subassembly on the circuit board, form photoelectric substrates, No. 6512861 patent cases of U.S. Pat for example, the photoelectric subassembly of one convertible photosignal is set in the upper side of a support plate, downside in support plate forms optical waveguide structure, make optical waveguide structure be covered in the light-conductive hole of support plate, make the optical signals light-conductive hole and between photoelectric subassembly and optical waveguide assembly, transmit.
But above-mentioned design still has problem to exist.Generally speaking do, for the printed circuit board (PCB) of support plate is that plexiglas fiber and plain conductor constitute.In the subsequent manufacturing processes of circuit board, must utilize chemical substance to carry out the development etching of the removing of through hole glue slag, metallic circuit, or carry out assembly or multilayer board pressing then with viscose, among above-mentioned two kinds of processes, all can cause chemical substance or viscose enters in the light-conductive hole.Chemical substance such as potassium hydroxide highly basic such as (KOH), or strong acid all can produce corrosive attack to the light-conductive hole inwall, make the light-conductive hole inner wall coarse, make the light signal reflection efficiency of light-conductive hole inwall not good, cause light signal intensity after by light-conductive hole to decay rapidly.Viscose then can be clogged in light-conductive hole, blocks the course of light signal, directly influences the quality of manufacture process.Therefore how to guarantee that the light-conductive hole structure can be not destroyed in manufacture process, become problem to be solved.
Summary of the invention
Photoelectric substrates of the prior art does not propose solution at the problem that the light-conductive hole structure is damaged in manufacture process.In view of above problem, the invention provides a kind of photoelectric substrates and manufacture method thereof, can avoid light-conductive hole destructurized, keep the light signal transfer strength.
Photoelectric substrates provided by the invention includes a support plate, an optical waveguide structure, a metal level and a light-transmitting materials.Offer a light-conductive hole on the support plate, be communicated with the upper side and the downside of support plate.Optical waveguide structure then is formed at the downside of support plate, and is covered in light-conductive hole, with so that optical signals light-conductive hole and transmitting between the upper side of optical waveguide structure and support plate.Metal level is formed at the inwall of light-conductive hole, in order to the roughness of the inwall that reduces light-conductive hole, and by the reflection characteristic reflected light signal of metal, avoids making the light signal order of reflection too much or be absorbed and decay because the inner wall surface of light-conductive hole is coarse.Light-transmitting materials is filled in the light-conductive hole, can be penetrated by light signal, and avoid foreign material in the manufacture process, and for example chemical agent or viscose enter in the light-conductive hole.
The present invention also further provides a kind of manufacture method of photoelectric substrates, and it includes the following step: a support plate is provided; On support plate, form a light-conductive hole, make light-conductive hole be communicated with the upper side and the downside of support plate; Form metal level in the inwall of light-conductive hole, in order to the roughness of the inwall that reduces light-conductive hole, and by the reflection characteristic reflected light signal of metal, avoid making the light signal order of reflection too much or be absorbed and decay because the inner wall surface of light-conductive hole is coarse; Fill a light-transmitting materials in light-conductive hole, use for the light signal transmission; Form the downside of an optical waveguide structure, and make optical waveguide structure be covered in light-conductive hole, with so that optical signals light-conductive hole and between the upper side of optical waveguide structure and support plate, transmitting in support plate.
The present invention can effectively reduce the inner wall roughness of light-conductive hole, and by the reflection characteristic of metal, makes the improved efficiency that is reflected of light signal, and then makes and can not decay rapidly by the light signal of light-conductive hole.Be filled in the light-conductive hole by light-transmitting materials simultaneously, chemical agent, the viscose that can avoid using in the manufacture process enter in the light-conductive hole, avoid the destroyed or obstruction of light-conductive hole effectively, and promote the integral manufacturing qualification rate, to reduce the manufacture difficulty and the cost of photoelectric substrates.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the diagrammatic cross-section of the disclosed a kind of photoelectric substrates of first embodiment of the invention;
Fig. 2 A, Fig. 2 B, Fig. 2 C, Fig. 2 D, Fig. 2 E and Fig. 2 F are the first embodiment method for making schematic flow sheet;
Fig. 3 is the diagrammatic cross-section of the disclosed a kind of photoelectric substrates of second embodiment of the invention; And
Fig. 4 A, Fig. 4 B, Fig. 4 C, Fig. 4 D and Fig. 4 E are the first embodiment method for making schematic flow sheet.
Wherein, Reference numeral
10 support plates, 10 ' auxiliary support plate
12,12 ' conducting wire layer, 14 light-conductive hole 14
16 metal levels, 18 light-transmitting materials
19 auxiliary light-conductive hole 20 optical waveguide structures
22 mirror surface structures, 30 grafting materials
100 photoelectric substrates, 200 photoelectric subassemblys
300 photoelectric substrates
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows now.
See also shown in Figure 1, diagrammatic cross-section for the disclosed a kind of photoelectric substrates 100 of first embodiment of the invention, this photoelectric substrates includes a support plate 10 and an optical waveguide structure 20, and light signal can be passed to the photoelectric subassembly 200 that is arranged on this photoelectric substrates 100 by optical waveguide structure 20.
Please consult shown in Figure 1ly again, support plate 10 can be a printed circuit board (PCB) or flexible circuit board, and in order to carrying photoelectric subassembly 200 or electronic package (figure does not show), the size and the kenel of support plate 10 are tailored shaping in advance according to the demand of photoelectric substrates 100 simultaneously.Support plate 10 has two conducting wire layers 12, is formed at the upper side and the downside of support plate 10 respectively.The production method of each conducting wire layer 12 is according to the demand of inner plating circuit, sticks Copper Foil or copper film prior to the upper side and the downside of support plate 10, develops etching again and forms the conducting wire layer 12 with predetermined inner plating circuit.Conducting wire layer 12 is in order to connect photoelectric subassembly 200, to transmit electric signal.The number of conducting wire layer 12 also can be one in addition, is formed at the upper side of support plate 10.
Light-transmitting materials 18 can be penetrated by light signal, and corrosion that can anti-chemical agent.Because light-transmitting materials 18 fills up light-conductive hole 14, the etching solution, viscose that therefore can avoid subsequent manufacturing processes causes harmful effect to entering in the light-conductive hole 14 to light-conductive hole 14 inwall conditioned reflexes.Light-transmitting materials can be inorganic material, organic material or organic-inorganic composite material.Wherein inorganic material can be glass fibre (Glasses Fiber); Organic material can be polyamide (Polyimide, PI), polycarbonate (Polycarbonate, PC) and silica gel (Silical Gel) select one or mix arbitrarily.The organic-inorganic composite material is with the potpourri of organic material and silicon (silicates), the organic material that mixes with silicon can be aforesaid macromolecular material, for example polyamide (Polyimide, PI), polycarbonate (Polycarbonate, PC) or silica gel (Silical Gel).
Please consult shown in Figure 1ly again, optical waveguide structure 20 is formed at the downside of support plate 10, in order to transmitting light signal, and at the conducting wire layer 12 of support plate 10 downsides between support plate 10 and optical waveguide structure 20.Optical waveguide structure 20 is covered in light-conductive hole 14, makes optical signals light-conductive hole 14 and transmits between optical waveguide structure 20 and support plate 10 upper sides.And photoelectric subassembly 200 or electronic package system are arranged at the upper side of support plate 10, and are covered in light-conductive hole 14, and photoelectric subassembly 200 just can be by being coupled in optical waveguide structure 20 to carry out the transmission of light signal thus.The above, in the multilayer board structure, the structure with single photoelectric substrates 100 of optical waveguide structure 20 is formed, and below its method for making will be described again.
See also shown in Fig. 2 A～Fig. 2 D, be the method for making of photoelectric substrates, it comprises the following step.
According to the preliminary dimension demand, cut hard circuit board or soft circuit board, so that a support plate 10 to be provided.By an inner plating manufacture process, attach Copper Foil, aluminium foils or plate copper film in support plate 10,, form the conducting wire layer 12 that constitutes by internal layer circuit in the upper side and the downside of support plate 10 again to the etching of developing of Copper Foil, aluminium foil or copper film, in order to the power supply signal transmission, shown in Fig. 2 A.
Utilize job sequences such as laser, machine drilling, on support plate 10, form several light-conductive holes 14.The number of light-conductive hole 14 is according to the configuration of light signal transmission demand, and the number of light-conductive hole 14 is two in present embodiment.Light-conductive hole 14 runs through support plate 10, and is communicated with the upper side and the downside of support plate 10, transmits between the upper side of support plate 10 and downside for light signal, shown in Fig. 2 B.
Form a metal level 16 in each light-conductive hole 14 inwall, cover the inwall of whole light-conductive hole 14, shown in Fig. 2 C.After increasing the thickness of metal level 16 gradually, metal level 16 can reduce the surfaceness of light-conductive hole 14 inwalls.Simultaneously by the reflection characteristic of metal, but metal level 16 reflected light signals avoid because light-conductive hole 14 inner wall surface are coarse, make the light signal order of reflection too much or be absorbed and decay.The material of metal level 16 is according to the wavelength of light signal, selected metal with high reflectance, with electroplate or electroless-plating mode plated film in light-conductive hole 14 inwalls, in order to promote the light signal reflectivity of light-conductive hole 14 inwalls, slow down the decay of light signal the time by light-conductive hole 14.Light signal with the 850nm wavelength is an example, and the material of metal level 16 can be selected gold, tin, silver or aluminium, following at the wavelength of optical signal of 850nm, and the reflection efficiency of gold has 99% approximately, and the reflection efficiency of silver has 97% approximately, and aluminium then has 91% reflection efficiency.
Then can be anti-chemical agent corrosion and can being inserted in the light-conductive hole 14 by the light-transmitting materials 18 that light signal penetrates, light-conductive hole 14 is solid, shown in Fig. 2 D.Light-transmitting materials 18 can be selected at the employed chemical agent of subsequent manufacturing processes, so that be filled in the corrosion that the light-transmitting materials 18 of light-conductive hole 14 can be resisted chemical agent.Light-transmitting materials 18 can be inorganic material, organic material or organic-inorganic composite material, uses for light signal to penetrate, and can resist the corrosion of chemical agents such as chromic acid, sulfuric acid or potassinm permanganate.Because light-transmitting materials 18 fills up whole light-conductive hole 14, so these chemical agents just can not enter in the light-conductive hole 14 metal level 16 or the inwall of light-conductive hole 14 produces erosion-corrosion, also can avoid viscose to enter in the light-conductive hole 14 simultaneously and cause obstruction.
At last, form an optical waveguide structure 20 in the downside of support plate 10, and be covered in light-conductive hole 14, make optical signals light-conductive hole 14 and between the upper side of optical waveguide structure 20 and support plate 10, transmit.Wherein optical waveguide structure 20 can see through yellow light lithography manufacture process, laser is inscribed manufacture processes such as manufacture process or pressing mold and made, and makes a side of support plate 10 be formed with the optical waveguide structure 20 that lightwave circuit constitutes.
Production process is not limited to aforementioned order, for example can form light-conductive hole 14 again prior to after support plate 10 making conducting wire layers 12 and the optical waveguide structure 20, then forms metal level 16 and fills light-transmitting materials 18, for example shown in Fig. 2 E and Fig. 2 F.Also or prior to offering light-conductive hole 14 on the support plate 10, inserting after the light-transmitting materials 18, then carry out the following process manufacture process, with at the beginning of beginning from manufacture process with regard to the 14 performance protective effects of 18 pairs of light-conductive holes of light-transmitting materials.
The above is in the multilayer board structure, and the structure with single photoelectric substrates 100 of optical waveguide structure is formed, and will further introduce the photoelectric substrates with multilayer board structure below.
See also shown in Figure 3ly, be the photoelectric substrates 300 of the disclosed a kind of multilayer board structure of second embodiment of the invention, it includes a support plate 10, one an auxiliary support plate 10 ' and an optical waveguide structure 20.Support plate 10 has two conducting wire layers 12, be formed at respectively support plate 10 upper side and downside.And support plate 10 has several light-conductive holes 14, and each light-conductive hole 14 runs through support plate 10, and is communicated with the upper side and the downside of support plate 10.The inwall of light-conductive hole 14 forms a metal level 16, and also further inserts light-transmitting materials 18 in the light-conductive hole 14 to fill up light-conductive hole 14.
Please consult Fig. 3 again, optical waveguide structure 20 is formed at the downside of support plate 10, and is covered in light-conductive hole 14, makes optical signals light-conductive hole 14 and penetrates light-transmitting materials 18, and transmit between the upper side of optical waveguide structure 20 and support plate 10.And in optical waveguide structure 20, be provided with a mirror surface structure 22,, change the light signal bang path in order to reflected light signal corresponding to light-conductive hole 14.Thus, the light signal that moves horizontally in optical waveguide structure 20 can be reflected by mirror surface structure 22 and change direction, enters in the light-conductive hole 14.
See also Fig. 4 A～Fig. 4 E, be the method for making of photoelectric substrates 300.
Shown in Fig. 4 A, the production process of second embodiment, make the structure of single photoelectric substrates earlier, its program is identical with first embodiment, in regular turn in forming conducting wire layer 12 on the support plate 10, forming light-conductive holes 14, form metal level 16 and insert light-transmitting materials 18 in light-conductive hole 14 in the inwall of light-conductive hole 14 in support plate 10.Follow in the downside that optical waveguide structure 20 is formed at support plate 10, and in optical waveguide structure 20, form a mirror surface structure 22.
Then, one grafting material 30 is coated in the outside that support plate 10 forms optical waveguide structure 20, and the auxiliary support plate 10 ' that will have conducting wire layer 12 ' is pressed on grafting material 30, will assist support plate 10 ' to be fixed in the downside of support plate 10, and optical waveguide structure 20 is folded between support plate 10 and the auxiliary support plate 10 ', shown in Fig. 4 B.This step is not limited to optical waveguide structure 20 is folded between support plate 10 and the auxiliary support plate 10 ', also can be the stacked combination of a plurality of support plates 10 or auxiliary support plate 10 ', forms the photoelectric substrates with multilayer board structure.
Form several auxiliary light-conductive holes 19, make each auxiliary light-conductive hole 19 run through support plate 10 and auxiliary support plate 10 ', light signal is transmitted, between support plate 10 and auxiliary support plate 10 ' shown in Fig. 4 C.
Carry out full plate copper facing manufacture process in the upper side of support plate 10 and the downside of auxiliary support plate 10 ', make the upper side of support plate 10 and the downside of auxiliary support plate 10 ' plate a side copper film 40, shown in Fig. 4 D.
Make in copper film 40 enterprising line roads, the program of doing of circuit such as anti-solder ink coating, anti-welding figure are developed, spray tin, finish this photoelectric substrates 300 that possesses the multilayer board structure, shown in Fig. 4 E.
The present invention mainly plates metal level 16 in light-conductive hole 14 inwalls, reduces the roughness of light-conductive hole 14 inwalls, and passes through the reflection characteristic reflected light signal of metal, promotes the light signal reflectivity, the attenuation rate when passing through light-conductive hole 14 to reduce light signal.Simultaneously, filled light-transmitting materials 18 in the light-conductive hole 14, also avoided the foreign material in the manufacture process, for example chemical agent, glutinous agent etc. enter and influence the light signal transmission in the light-conductive hole 14.Promote the manufacturing fiduciary level effectively, and promoted the whole light path efficiency of photoelectric substrates.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (16)
1. a photoelectric substrates is characterized in that, includes:
One support plate has at least one light-conductive hole, is communicated with the upper side and the downside of this support plate;
One optical waveguide structure is formed at the downside of this support plate, and is covered in this light-conductive hole, with so that this light-conductive hole of an optical signals and transmitting between the upper side of this optical waveguide structure and this support plate; And
One light-transmitting materials is filled in this light-conductive hole, is penetrated by this light signal.
2. photoelectric substrates according to claim 1 is characterized in that, this light-transmitting materials is inorganic material, organic material or organic-inorganic composite material.
3. photoelectric substrates according to claim 1 is characterized in that, this support plate comprises a conducting wire layer, is formed at the upper side of this support plate, in order to transmit electric signal.
4. photoelectric substrates according to claim 1, it is characterized in that this support plate comprises two conducting wire layers, be formed at the upper side and the downside of this support plate respectively, in order to transmitting electric signal, and at the conducting wire layer of the downside of support plate between this support plate and this optical waveguide structure.
5. photoelectric substrates according to claim 1 is characterized in that, this support plate is a printed circuit board (PCB) or a flexible circuit board.
6. photoelectric substrates according to claim 1 is characterized in that, also comprises a metal level, is formed at the inwall of this light-conductive hole, in order to the roughness of the inwall that reduces this light-conductive hole, and reflected light signal.
7. photoelectric substrates according to claim 6 is characterized in that, the material of this metal level is selected from gold, tin, silver, copper and aluminium institute and becomes combination.
8. photoelectric substrates according to claim 1 is characterized in that, also comprises an auxiliary support plate, is fixed in the downside of this support plate, makes this optical waveguide structure reach and should assist between the support plate at this support plate.
9. photoelectric substrates according to claim 8 is characterized in that, also comprises at least one auxiliary light-conductive hole, runs through this support plate and should assist support plate, uses for light signal to reach and should transmit between the auxiliary support plate in this support plate.
10. the manufacture method of a photoelectric substrates is characterized in that, includes the following step:
One support plate is provided;
On this support plate, form at least one light-conductive hole, make this light-conductive hole be communicated with the upper side and the downside of this support plate;
Fill a light-transmitting materials in this light-conductive hole, use for a light signal transmission; And
Form the downside of an optical waveguide structure, and cover this light-conductive hole, make this light-conductive hole of this optical signals and between the upper side of this optical waveguide structure and this support plate, transmit in support plate.
11. the manufacture method of photoelectric substrates according to claim 10 is characterized in that, also comprises a step, forms at least one conducting wire layer in the upper side of this support plate, uses for an electrical signal transfer.
12. photoelectric substrates according to claim 10 is characterized in that, this light-transmitting materials is inorganic material, organic material or organic-inorganic composite material.
13. the manufacture method of photoelectric substrates according to claim 11 is characterized in that also comprising a step, forms the inwall of a metal level in this light-conductive hole, in order to the roughness of the inwall that reduces this light-conductive hole, and reflects this light signal.
14. the manufacture method of photoelectric substrates according to claim 13 is characterized in that, the material of this metal level is selected from gold, tin, silver, copper and aluminium institute and becomes combination.
15. the manufacture method of photoelectric substrates according to claim 11 is characterized in that, also comprises a step, pressing one auxiliary support plate makes this optical waveguide structure reach and should assist between the support plate at this support plate in the downside of this support plate.
16. the manufacture method of photoelectric substrates according to claim 15, it is characterized in that, also comprise a step, form at least one auxiliary light-conductive hole, make this auxiliary light-conductive hole run through this support plate and be somebody's turn to do and assist support plate, use for this light signal to reach and to transmit between the auxiliary support plate in this support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNA2006101707871A CN101206287A (en) | 2006-12-22 | 2006-12-22 | Photoelectricity substrate and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2006101707871A CN101206287A (en) | 2006-12-22 | 2006-12-22 | Photoelectricity substrate and manufacturing method therefor |
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| CN101206287A true CN101206287A (en) | 2008-06-25 |
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| CNA2006101707871A Pending CN101206287A (en) | 2006-12-22 | 2006-12-22 | Photoelectricity substrate and manufacturing method therefor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957475A (en) * | 2009-07-17 | 2011-01-26 | 日东电工株式会社 | The manufacture method of optical waveguide device |
| CN102648428A (en) * | 2009-10-08 | 2012-08-22 | Lg伊诺特有限公司 | Optical printed circuit board and method of fabricating the same |
| CN104101958A (en) * | 2013-04-03 | 2014-10-15 | 鸿富锦精密工业（深圳）有限公司 | Light communication device |
| CN104238045A (en) * | 2014-09-22 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Slide glass used for photoelectric device packaging |
| CN113658936A (en) * | 2021-08-16 | 2021-11-16 | 浙江水晶光电科技股份有限公司 | Metallized glass and preparation method thereof |
-
2006
- 2006-12-22 CN CNA2006101707871A patent/CN101206287A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957475A (en) * | 2009-07-17 | 2011-01-26 | 日东电工株式会社 | The manufacture method of optical waveguide device |
| CN102648428A (en) * | 2009-10-08 | 2012-08-22 | Lg伊诺特有限公司 | Optical printed circuit board and method of fabricating the same |
| CN102648428B (en) * | 2009-10-08 | 2015-09-09 | Lg伊诺特有限公司 | Optical printed circuit board and manufacture method thereof |
| CN104101958A (en) * | 2013-04-03 | 2014-10-15 | 鸿富锦精密工业（深圳）有限公司 | Light communication device |
| CN104101958B (en) * | 2013-04-03 | 2017-10-03 | 赛恩倍吉科技顾问（深圳）有限公司 | optical communication device |
| CN104238045A (en) * | 2014-09-22 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Slide glass used for photoelectric device packaging |
| CN113658936A (en) * | 2021-08-16 | 2021-11-16 | 浙江水晶光电科技股份有限公司 | Metallized glass and preparation method thereof |
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Open date: 20080625 |