CN101206179B - Light emission microscope sample - Google Patents
Light emission microscope sample Download PDFInfo
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- CN101206179B CN101206179B CN2006101477935A CN200610147793A CN101206179B CN 101206179 B CN101206179 B CN 101206179B CN 2006101477935 A CN2006101477935 A CN 2006101477935A CN 200610147793 A CN200610147793 A CN 200610147793A CN 101206179 B CN101206179 B CN 101206179B
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Abstract
A photo emission microscope sample comprises: a chip which has a first bonding pad; a PCB board which has a second bonding pad electrically connected with the first bonding pad; and a fixing carrying assembly which is used for carrying and fixing the chip. The photo emission microscope sample further comprises: a transparent base plate which passes through an embedding hole of the PCB board and bears the chip; a fixing assembly which is used for fixing the chip mechanically onto to the transparent base plate, wherein the transparent base plate and the PCB board are interlocked and in parallel with each other; and an inversion assembly which is used for inverting the PCB board around a shaft and locking the PCB board. The photo emission microscope sample has quick preparation and high quality.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors and material analysis technical field, relate in particular to light emission microscope sample.
Background technology
Along with the progress of material science, microstructure is very huge in the influence in nature of material itself, so the character of desire understanding material itself, just good microscopic analysis technology and instrument must be able to be arranged.General optical microscope is subject to factors such as optical wavelength, aberration, and enlargement ratio is limited, and based on more powerful demand, new " micro-" equipment slowly develops, and light emission microscope is exactly one of them.
Light emission microscope is a kind of high sensitivity that grows up the nineties, high-resolution novel defect location analytical technology.Along with the continuous decline of semiconductor devices live width, light emission microscope has been widely used in the location and the analysis of failure mechanism of failpoints such as electric leakage in IC and the discrete device, puncture, hot carrier.
It is described in 200510033194 the Chinese patent application that existing light emission microscope sample structure please refer to application number, as shown in Figure 1, the structure of existing light emission microscope sample comprises chip 104, chip 104 comprises silica-based bottom surface 106 and silicon base opposite face 107, and pad 103 is arranged on the silicon base opposite face 107; Transparency carrier 100 is stained with conductive copper glue 101, and described conductive copper glue 101 is connected with pad 103 by strong zygonema 105; Tackifier 102, the silica-based bottom surface 10 and the transparency carrier 100 of chip 104 is bonding.
Existing light emission microscope sample since chip be bonded on the transparency carrier will be with transparent tackifier, be easy to cause between chip back and the transparency carrier bubble is arranged, light emission microscope sample is obtained picture have very big influence from the back side, therefore the light emission microscope sample poor quality who obtains; The intact back of light emission microscope analysis light emission microscope sample takes off process from transparency carrier, and tackifier is easy to stain chip surface, and the handling again of failure analysis of back caused very big influence.
Summary of the invention
The problem that the present invention solves provides a kind of preparation method of light emission microscope sample, prevents the light emission microscope sample poor quality for preparing, and influences the subsequent failure analysis.
For addressing the above problem, the invention provides a kind of light emission microscope sample, comprising: chip has first pad; Pcb board has second pad that is electrically connected with first pad; Immobilized assembly, be used to carry fixed chip, further comprise: penetrate pcb board embedded hole, place in the embedded hole and the transparency carrier of carries chips and chip is mechanically anchored in fixation kit on the transparency carrier, wherein transparency carrier locks with pcb board and the plate face is parallel each other; And the upset assembly, be used for around axle upset pcb board and locking pcb board.
Transparency carrier locks with pcb board by snapping in the embedded hole sidewall, and the length of described transparency carrier is 1cm～2cm, and wide is 1cm～2cm, and height is 0.6cm～1cm.
Fixation kit comprises: fixed screw is positioned on the chip; Fixed bar has the fixed orifice and the two ends that are connected with fixed screw and has fixed leg; The pcb board through hole is positioned at embedded hole symmetry both sides, is used for being connected with fixed leg fixed bar is locked in pcb board.
Described fixed screw diameter is 0.2cm～0.4cm, and length is 0.5cm～1cm, and the length of described fixed bar is 3cm～6cm, and the diameter of fixed leg is 0.3cm～0.5cm, and length is 0.5cm～1cm.
The upset assembly comprises: the underframe frame, be positioned at the pcb board periphery, and symmetrical both sides have swingle; Rotating hole is positioned at pcb board symmetry side and cooperates with swingle.
The length of underframe frame housing is 6.5cm～13cm, and wide is 5.5cm～11cm, and the length of underframe frame inside casing is 6cm～12cm, and wide is 5cm～10cm.
The length of described swingle is 0.5cm～0.8cm, and the diameter of rotating hole is 0.3cm～0.5cm, and the degree of depth is 0.8cm～1.2cm.
The length of described pcb board is 5cm～10cm, and wide is 4cm～8cm, and height is 0.8cm～1.2cm.
First pad and second pad are electrically connected by bonding line.
Compared with prior art, the present invention has the following advantages: the present invention is fixed on the transparency carrier with immobilized assembly carries chips and with chip, owing to do not need to use tackifier that chip and transparency carrier is bonding, so can not produce bubble, light emission microscope sample is obtained picture can not exert an influence from the back side, so light emission microscope sample quality height; The intact back of light emission microscope sample analysis sample takes off very convenient from transparency carrier, and does not use any pollution, can not impact the processing again of the failure analysis of back; Simultaneously, directly can rotary sample with the upset assembly, make easy to detect; Light emission microscope sample of the present invention is easy to prepare fast, has saved the time of specimen preparation.
Description of drawings
Fig. 1 is the light emission microscope sample sectional view of prior art for preparing;
Fig. 2 A, Fig. 2 A ', Fig. 2 A ", Fig. 2 B, Fig. 2 B ', Fig. 2 B ", Fig. 2 C, Fig. 2 C ' and Fig. 2 C " be the light emission microscope sample synoptic diagram that the present invention prepares;
Fig. 3 A, Fig. 3 A ', Fig. 3 A ", Fig. 3 B, Fig. 3 B ', Fig. 3 B ", Fig. 3 C, Fig. 3 C ' and Fig. 3 C " be the light emission microscope sample preferred embodiment synoptic diagram that the present invention prepares.
Embodiment
Since existing light emission microscope sample since chip be bonded on the transparency carrier will be with transparent tackifier, be easy to cause between chip back and the transparency carrier bubble is arranged, light emission microscope sample is obtained picture have very big influence from the back side, therefore the light emission microscope sample poor quality who obtains; The intact back of light emission microscope analysis light emission microscope sample takes off process from transparency carrier, and tackifier is easy to stain chip surface, and the handling again of failure analysis of back caused very big influence.The present invention is fixed on the transparency carrier with immobilized assembly carries chips and with chip, owing to do not need to use tackifier that chip and transparency carrier is bonding, so can not produce bubble, light emission microscope sample is obtained picture can not exert an influence from the back side, so light emission microscope sample quality height; The intact back of light emission microscope sample analysis sample takes off very convenient from transparency carrier, and does not use any pollution, can not impact the processing again of the failure analysis of back; Simultaneously, directly can rotary sample with the upset assembly, make easy to detect; Light emission microscope sample of the present invention is easy to prepare fast, has saved the time of specimen preparation.For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
The light emission microscope sample of the present invention's preparation, comprising: chip has first pad; Pcb board has second pad that is electrically connected with first pad; Immobilized assembly, be used to carry fixed chip, further comprise: penetrate pcb board embedded hole, place in the embedded hole and the transparency carrier of carries chips and chip is mechanically anchored in fixation kit on the transparency carrier, wherein transparency carrier locks with pcb board and the plate face is parallel each other; And the upset assembly, be used for around axle upset pcb board and locking pcb board.
Fig. 2 A, Fig. 2 A ', Fig. 2 A ", Fig. 2 B, Fig. 2 B ', Fig. 2 B ", Fig. 2 C, Fig. 2 C ' and Fig. 2 C " be the light emission microscope sample synoptic diagram that the present invention prepares.As Fig. 2 A, Fig. 2 A ' and Fig. 2 A " shown in (Fig. 2 A ' be the A-A of Fig. 2 A to sectional view, Fig. 2 A " A '-A ' of Fig. 2 A is to sectional view), comprise second pad 201 in the light emission microscope sample of present embodiment on the pcb board 200; The dual-side vertical with A '-A ' direction at pcb board 200 has pcb board screw 223 respectively, and the diameter of pcb board screw 223 is 0.3cm～0.5cm, and the degree of depth is 0.8cm～1.2cm, is used for subsequent fixed pcb board 200; It is 0.3cm～0.5cm that the dual-side vertical with the A-A direction has diameter, and the degree of depth is the rotating hole 222 of 0.8cm～1.2cm, is used for follow-up rotation pcb board 200; Penetrate the embedded hole 211 of pcb board 200, wherein, embedded hole 211 length are 1cm～2cm, and wide is that 1cm～2cm and embedded hole 211 both sides are second pad 201; Place the transparency carrier 202 in the embedded hole 211, wherein transparency carrier 202 is with pcb board 200 lockings and the plate face is parallel each other, and transparency carrier 202 is long to be 1cm～2cm, and wide is 1cm～2cm, and height is 0.6cm～1cm; In embedded hole 211 symmetrical both sides the pcb board through hole 215 that penetrates pcb board 200 is arranged, wherein the pcb board through hole 215 and second pad 201 be not in the same side of embedded hole 211.
In the present embodiment, the length of described pcb board 200 is 5cm～10cm, concrete long be 5cm, 6cm, 7cm, 8cm, 9cm or 10cm; Wide is 4cm～8cm, and concrete wide is 4cm, 5cm, 6cm, 7cm or 8cm; Height is 0.8cm～1.2cm, and concrete height is 0.8cm, 0.9cm, 1cm, 1.1cm or 1.2cm.
The pcb board screw 223 that is used for subsequent fixed pcb board 200 can also be a circular hole except that screw.The diameter of pcb board screw 223 is specially 0.3cm, 0.4cm or 0.5cm; The degree of depth is specially 0.8cm, 0.9cm, 1cm, 1.1cm or 1.2cm.Pcb board screw 223 can be positioned at the optional position of pcb board 200 dual-sides, is preferably placed at the centre position of pcb board 200 dual-sides in the present embodiment.
The diameter of rotating hole 222 is specially 0.3cm, 0.4cm or 0.5cm; The degree of depth is specially 0.8cm, 0.9cm, 1cm, 1.1cm or 1.2cm.
Except that present embodiment, the dual-side vertical with A '-A ' direction at pcb board 200 can be rotating hole 222 also, and the dual-side vertical with the A-A direction is exactly pcb board screw 223; And rotating hole 222 and pcb board screw 223 can be positioned at the same side of pcb board.
In the present embodiment, embedded hole 211 can still must have second pad 201 in embedded hole 211 symmetrical both sides in the optional position in the pcb board 200.Embedded hole 211 long 1cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or the 2cm of being specially; Wide 1cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or the 2cm of being specially.
In the present embodiment, described transparency carrier 202 can be cover glass or organic glass etc.; The length of transparency carrier 202 is specially 1.0cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or 2cm; Wide 1.0cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or the 2cm of being specially; Height is specially 0.6cm, 0.7cm, 0.8cm, 0.9cm or 1.0cm.
The diameter of pcb board through hole 215 is 0.3cm～0.5cm, and concrete diameter is 0.3cm, 0.4cm or 0.5cm.Except that present embodiment, pcb board through hole 215 also can with the same side of second pad 201 at embedded hole 211, only otherwise touch with second pad 201; In the present embodiment, pcb board through hole 215 is positioned at embedded hole 211 both sides and the center of circle of pcb board through hole 215 and the centerline collineation of embedded hole 311 different with second pad 201.
As Fig. 2 B, 2B ' and 2B " shown in (Fig. 2 B ' is that the A-A of Fig. 2 B is to sectional view; Fig. 2 B " be that A '-A ' of Fig. 2 B is to sectional view), light emission microscope sample comprises: be positioned over the chip 204 on the transparency carrier 202, have first pad 203 on the chip 204, its chips 204 does not contact with transparency carrier 202 with the face of first pad 203; Bonding line 205 is connected first pad 203 on the chip 204 with second pad on the pcb board 200; Chip 204 is mechanically anchored in fixation kit on the transparency carrier 202, and wherein fixation kit comprises: fixed screw 206, be positioned on the chip 204, and wherein the nut 207 of fixed screw 206 and chip 204 surfaces contact; Fixed bar 210 with fixed orifice and fixed leg 208,209, wherein fixed screw 206 passes fixed orifice, and fixed screw 206 and fixed bar 210 are locked by hold-down nut 212, fixed leg 208,209 is positioned at fixed bar 210 two ends, fixed leg 208,209 also locks fixed bar 210 and pcb board 200 with nut 213,214 by pcb board through hole 215, if compress chip 204, tighten hold-down nut 212 and nut 213,214 simultaneously, if take out chip 204, then unscrew hold-down nut 212 and nut 213,214 simultaneously.
In the present embodiment, described fixed screw 206 diameters are 0.2cm～0.4cm, and concrete diameter is 0.2cm, 0.3cm or 0.4cm; Length is 0.5cm～1cm, and concrete length is 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm or 1cm.The area of nut 207 is 0.3 * 0.3cm
2～0.5 * 0.5cm
2, concrete area is 0.3 * 0.3cm
2, 0.4 * 0.4cm
2Or 0.5 * 0.5cm
2Except that embodiment, fixed screw 206 cylinder that also can be fixed substitutes.
In the present embodiment, the length of fixed bar 210 is 3cm～6cm, and concrete length is 3cm, 4cm, 5cm or 6cm; Width is 0.5cm～0.8cm, and concrete width is 0.5cm, 0.6cm, 0.7cm or 0.8cm.The diameter of the fixed leg 208,209 at fixed bar 210 two ends is 0.3cm～0.5cm, and concrete diameter is 0.3cm, 0.4cm or 0.5cm; Length is 0.5cm～1cm, and concrete length is 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm or 1cm.If the fixed orifice on the fixed bar 210 cooperates with fixed screw 206, fixed orifice can be a through hole, fixed screw 206 is locked fixed screw 206 and fixed bar 210 by hold-down nut 212 after passing through hole, also can be the screw that cooperates with fixed screw 206, fixed screw 206 can be regulated by being screwed into to back-out; If the fixed orifice on the fixed bar 210 cooperates with fixed cylinder, fixed orifice can be and the close-fitting through hole of fixed cylinder.The fixed leg 208,209 at fixed bar 210 two ends can be that cylinder also can be a double-screw bolt.
Except that present embodiment, fixation kit can be that an end is fixed on the jump ring on the pcb boards in the embedded hole 211, and wherein jump ring can spring or shell fragment; Fixation kit can also be that an end is positioned on the pcb board and can to serve as the axle rotation with this end go to buckle on the chip 204 with the other end.
The material that the material of described bonding line 205 is is gold, copper, aluminium or X alloy.
As Fig. 2 C, 2C ' and 2C " shown in (Fig. 2 C ' be the A-A of Fig. 2 C to sectional view, Fig. 2 C " be that A '-A ' of Fig. 2 C is to sectional view), the upset assembly comprises: the underframe frame and 216 that is positioned at pcb board 200 peripheries; At the dual-side vertical with the A-A direction swingle 220 conjuncted with bottom framework 216 arranged, rotating hole 222 is connected on swingle 220 and the pcb board 200, is used for around axle upset pcb board 200; Have at the vertical dual-side of underframe frame 216 and A '-A ' direction and to penetrate underframe frame 216 and the underframe frame through hole corresponding with pcb board screw 223; Screw 218 passes underframe frame through hole and enters the pcb board screw, makes pcb board 200 fixing with underframe frame 216; When if follow-up needs change the face detection chip, screw 218 can be withdrawed from from pcb board screw 223, be the pcb board 200 that the rotating shaft rotation has chip 204 with swingle 220 then.
In the present embodiment, the length 0.5～0.8cm of swingle 220, concrete length is 0.5cm, 0.6cm, 0.7cm or 0.8cm.The position of swingle 220 is with the change in location of rotating hole 222, and pcb board 200 is overturn around axle.Swingle 220 and rotating hole 222 complete driving fits also can play the effect of locking pcb board simultaneously.
The position of underframe frame through hole must change corresponding with pcb board screw 223 and thereupon.
The length 1cm of screw 218～2cm is specially 1cm, 1.5cm or 2cm; Diameter 0.3cm～0.5cm is specially 0.3cm, 0.4cm or 0.5cm.
The length of underframe frame 216 housings is 6.5cm～13cm, concrete long be 6.5cm, 7cm, 8cm, 9cm, 10cm, 11cm, 12cm or 13cm; Wide is 5.5cm～11cm, and concrete wide is 5.5cm, 6cm, 7cm, 8cm, 9cm, 10cm or 11cm.The length of underframe frame 216 inside casings is 6cm～12cm, concrete long be 6cm, 7cm, 8cm, 9cm, 10cm, 11cm or 12cm; Wide is 5cm～10cm, and concrete wide is 5cm, 6cm, 7cm, 8cm, 9cm, embedding 10cm.
Fig. 3 A, Fig. 3 A ', Fig. 3 A ", Fig. 3 B, Fig. 3 B ', Fig. 3 B ", Fig. 3 C, Fig. 3 C ' and Fig. 3 C " be the light emission microscope sample preferred embodiment synoptic diagram that the present invention prepares.As Fig. 3 A, Fig. 3 A ' and Fig. 3 A " shown in (Fig. 3 A ' be the A-A of Fig. 3 A to sectional view, Fig. 3 A " A '-A ' of Fig. 3 A is to sectional view), comprise second pad 301 in the light emission microscope sample of present embodiment on the pcb board 300; Centre position at pcb board 300 dual-side vertical with A '-A ' direction has pcb board screw 323 respectively, and the diameter of pcb board screw 323 is 0.3cm～0.5cm, and the degree of depth is 0.8cm～1.2cm, is used for subsequent fixed pcb board 300; It is 0.3cm～0.5cm that the interposition of the dual-side vertical with the A-A direction is equipped with diameter, and the degree of depth is the rotating hole 322 of 0.8cm～1.2cm, is used for follow-up rotation pcb board 300; Be positioned at the pcb board center and penetrate the embedded hole 311 of pcb board 300, wherein, embedded hole 311 is long to be 1cm～2cm, wide for 1cm～2cm and embedded hole 311 both sides be second pad 301; Place the transparency carrier 302 in the embedded hole 311, wherein transparency carrier 302 is with pcb board 300 lockings and the plate face is parallel each other, and transparency carrier 302 is long to be 1cm～2cm, and wide is 1cm～2cm, and height is 0.6cm～1cm; In embedded hole 311 symmetrical both sides the pcb board through hole 315 that penetrates pcb board 300 is arranged, the centerline collineation of the center of circle of pcb board through hole 315 and embedded hole 311, and pcb board through hole 315 and second pad 301 be not in the same side of embedded hole 311.
In the present embodiment, the length of described pcb board 300 is 5cm～10cm, concrete long be 5cm, 6cm, 7cm, 8cm, 9cm or 10cm; Wide is 4cm～8cm, and concrete wide is 4cm, 5cm, 6cm, 7cm or 8cm; Height is 0.8cm～1.2cm, and concrete height is 0.8cm, 0.9cm, 1cm, 1.1cm or 1.2cm.
The pcb board screw 323 that is used for subsequent fixed pcb board 300 can also be a circular hole except that screw.The diameter of pcb board screw 323 is specially 0.3cm, 0.4cm or 0.5cm; The degree of depth is specially 0.8cm, 0.9cm, 1cm, 1.1cm or 1.2cm.
The diameter of rotating hole 322 is specially 0.3cm, 0.4cm or 0.5cm; The degree of depth is specially 0.8cm, 0.9cm, 1cm, 1.1cm or 1.2cm.
Embedded hole 311 long 1cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or the 2cm of being specially; Wide 1cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or the 2cm of being specially.
Described transparency carrier 302 can be cover glass or organic glass etc.; The length of transparency carrier 302 is specially 1cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or 2cm; Wide 1cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm or the 2cm of being specially; Height is specially 0.6cm, 0.7cm, 0.8cm, 0.9cm or 1cm.
The diameter of pcb board through hole 315 is 0.3cm～0.5cm, and concrete diameter is 0.3cm, 0.4cm or 0.5cm.
As Fig. 3 B, 3B ' and 3B " shown in (Fig. 3 B ' is that the A-A of Fig. 3 B is to sectional view; Fig. 3 B " be that A '-A ' of Fig. 3 B is to sectional view), light emission microscope sample comprises: be positioned over the chip 304 on the transparency carrier 302, have first pad 303 on the chip 304, its chips 304 does not contact with transparency carrier 302 with the face of first pad 303; Bonding line 305 is connected first pad 303 on the chip 304 with second pad on the pcb board 300; Chip 304 is mechanically anchored in fixation kit on the transparency carrier 302, and wherein fixation kit comprises: fixed screw 306, be positioned on the chip 304, and wherein the nut 307 of fixed screw 306 and chip 304 surfaces contact; Fixed bar 310 with fixed orifice and fixed leg 308,309, wherein fixed screw 306 passes fixed orifice, and fixed screw 306 and fixed bar 310 are locked by hold-down nut 312, fixed leg 308,309 is positioned at fixed bar 310 two ends, fixed leg 308,309 also locks fixed bar 310 and pcb board 300 with nut 313,314 by pcb board through hole 315, if compress chip 304, tighten hold-down nut 312 and nut 313,314 simultaneously, if take out chip 304, then unscrew hold-down nut 312 and nut 313,314 simultaneously.
In the present embodiment, described fixed screw 306 diameters are 0.2cm～0.4cm, and concrete diameter is 0.2cm, 0.3cm or 0.4cm; Length is 0.5cm～1cm, and concrete length is 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm or 1cm.The area of nut 307 is 0.3 * 0.3cm
2～0.5 * 0.5cm
2, concrete area is 0.3 * 0.3cm
2, 0.4 * 0.4cm
2Or 0.5 * 0.5cm
2Except that embodiment, fixed screw 306 cylinder that also can be fixed substitutes.
In the present embodiment, the length of fixed bar 310 is 3cm～6cm, and concrete length is 3cm, 4cm, 5cm or 6cm; Width is 0.5cm～0.8cm, and concrete width is 0.5cm, 0.6cm, 0.7cm or 0.8cm.The diameter of the fixed leg 308,309 at fixed bar 310 two ends is 0.3cm～0.5cm, and concrete diameter is 0.3cm, 0.4cm or 0.5cm; Length is 0.5cm～1cm, and concrete length is 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm or 1cm.If the fixed orifice on the fixed bar 310 cooperates with fixed screw 306, fixed orifice can be a through hole, and fixed screw 306 is locked fixed screw 306 and fixed bar 310 by hold-down nut 312 after passing through hole; Fixed orifice also can be the screw that cooperates with fixed screw 306, and fixed screw 306 can be regulated by being screwed into to back-out; If the fixed orifice on the fixed bar 310 cooperates with fixed cylinder, fixed orifice can be and the close-fitting through hole of fixed cylinder.The fixed leg 308,309 at fixed bar 310 two ends can be that cylinder also can be a double-screw bolt.
Except that present embodiment, fixation kit can be that an end is fixed on the jump ring on the pcb boards in the embedded hole 311, and wherein jump ring can spring or shell fragment; Fixation kit can also be that an end is positioned on the pcb board and can to serve as the axle rotation with this end go to buckle on the chip 304 with the other end.
The material that the material of described bonding line 305 is is gold, copper, aluminium or X alloy.
As Fig. 3 C, 3C ' and 3C " shown in (Fig. 3 C ' be the A-A of Fig. 3 C to sectional view, Fig. 3 C " be that A '-A ' of Fig. 3 C is to sectional view), the upset assembly comprises: the underframe frame and 316 that is positioned at pcb board 300 peripheries; Be equipped with the swingle 320 conjuncted with bottom framework 316 in the dual-side interposition vertical with the A-A direction, rotating hole 322 is connected on swingle 320 and the pcb board 300, is used for around axle upset pcb board 300; Be equipped with in the vertical dual-side interposition of underframe frame 316 and A '-A ' direction and penetrate underframe frame 316 and the underframe frame through hole corresponding with pcb board screw 323; Screw 318 passes underframe frame through hole and enters the pcb board screw, makes pcb board 300 fixing with underframe frame 316; When if follow-up needs change the face detection chip, screw 318 can be withdrawed from from pcb board screw 323, be the pcb board 300 that the rotating shaft rotation has chip 304 with swingle 320 then; In addition bottom framework 316 wherein a side have conjuncted with bottom framework 316 and with the opposite handle 322 of one of them swingle 320 position consistency direction, handle 322 act as the light emission microscope sample of conveniently taking.
Length 0.5～the 0.8cm of swingle 320, concrete length is 0.5cm, 0.6cm, 0.7cm or 0.8cm.Handle 322 length 2～4cm, concrete length is 2cm, 3cm or 4cm.Swingle 320 and rotating hole 322 complete driving fits also can play the effect of locking pcb board.
Except that embodiment, two handles 322 can be set, be positioned at two swingle 320 correspondence positions and opposite with swingle 320 directions, perhaps a handle all can be set in the arbitrary position of arbitrary side of underframe frame 316.
The length 1cm of screw 318～2cm is specially 1cm, 1.5cm or 2cm; Diameter 0.3cm～0.5cm is specially 0.3cm, 0.4cm or 0.5cm.
The length of underframe frame 316 housings is 6.5cm～13cm, concrete long be 6.5cm, 7cm, 8cm, 9cm, 10cm, 11cm, 12cm or 13cm; Wide is 5.5cm～11cm, and concrete wide is 5.5cm, 6cm, 7cm, 8cm, 9cm, 10cm or 11cm.The length of underframe frame 316 inside casings is 6cm～12cm, concrete long be 6cm, 7cm, 8cm, 9cm, 10cm, 11cm or 12cm; Wide is 5cm～10cm, and concrete wide is 5cm, 6cm, 7cm, 8cm, 9cm or 10cm.
Though the present invention with preferred embodiment openly as above; but it is not to be used for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible change and modification, so protection scope of the present invention should be as the criterion with the scope that claim of the present invention was defined.
Claims (14)
1. a light emission microscope sample is characterized in that, comprising:
Chip has first pad;
Pcb board has second pad that is electrically connected with first pad;
Immobilized assembly, be used to carry fixed chip, further comprise: penetrate pcb board embedded hole, place in the embedded hole and the transparency carrier of carries chips and chip is mechanically anchored in fixation kit on the transparency carrier, described chip does not contact with transparency carrier with the face of first pad, wherein transparency carrier and pcb board locking and the plate face is parallel each other; And
The upset assembly is used for around axle upset pcb board and locking pcb board.
2. light emission microscope sample according to claim 1 is characterized in that: transparency carrier locks with pcb board by snapping in the embedded hole sidewall.
3. light emission microscope sample according to claim 2 is characterized in that: the length of described transparency carrier is 1cm～2cm, and wide is 1cm～2cm, and height is 0.6cm～1cm.
4. light emission microscope sample according to claim 1, it is characterized in that: fixation kit comprises:
Fixed screw is positioned on the chip;
Fixed bar has the fixed orifice and the two ends that are connected with fixed screw and has fixed leg;
The pcb board through hole is positioned at embedded hole symmetry both sides, is used for being connected with fixed leg fixed bar is locked in pcb board.
5. light emission microscope sample according to claim 4 is characterized in that: described fixed screw diameter is 0.2cm～0.4cm, and length is 0.5cm～1cm.
6. light emission microscope sample according to claim 4 is characterized in that: the length of described fixed bar is 3cm～6cm.
7. light emission microscope sample according to claim 4 is characterized in that: the diameter of fixed leg is 0.3cm～0.5cm, and length is 0.5cm～1cm.
8. light emission microscope sample according to claim 1 is characterized in that: the upset assembly comprises:
The underframe frame is positioned at the pcb board periphery, and symmetrical both sides have swingle;
Rotating hole is positioned at pcb board symmetry side and cooperates with swingle.
9. light emission microscope sample according to claim 8 is characterized in that: the length of underframe frame housing is 6.5cm～13cm, and wide is 5.5cm～11cm.
10. light emission microscope sample according to claim 9 is characterized in that: the length of underframe frame inside casing is 6cm～12cm, and wide is 5cm～10cm.
11. light emission microscope sample according to claim 9 is characterized in that: the length of described swingle is 0.5cm～0.8cm.
12. light emission microscope sample according to claim 11 is characterized in that: the diameter of rotating hole is 0.3cm～0.5cm, and the degree of depth is 0.8cm～1.2cm.
13. light emission microscope sample according to claim 1 is characterized in that: the length of described pcb board is 5cm～10cm, and wide is 4cm～8cm, and height is 0.8cm～1.2cm.
14. light emission microscope sample according to claim 1 is characterized in that: first pad and second pad are electrically connected by bonding line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101477935A CN101206179B (en) | 2006-12-22 | 2006-12-22 | Light emission microscope sample |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101477935A CN101206179B (en) | 2006-12-22 | 2006-12-22 | Light emission microscope sample |
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| CN101206179B true CN101206179B (en) | 2010-08-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637615A (en) * | 2012-03-31 | 2012-08-15 | 上海华力微电子有限公司 | Sample preparation method for wafer-level back failure positioning in failure analysis |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102467977B (en) * | 2010-11-01 | 2015-04-01 | 中芯国际集成电路制造(上海)有限公司 | Chip fixing pedestal and chip fixed-connection mode |
| CN103487744B (en) * | 2013-05-07 | 2016-01-27 | 上海华力微电子有限公司 | A kind of dynamically EMMI system and its implementation and methods for using them |
| CN103645352A (en) * | 2013-11-22 | 2014-03-19 | 上海华力微电子有限公司 | Micro-size chip fixing device |
| CN109633418A (en) * | 2018-12-29 | 2019-04-16 | 上海华力集成电路制造有限公司 | Photon radiation microscope example seat, test method and microscopie unit |
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| US3882532A (en) * | 1972-07-03 | 1975-05-06 | Ibm | Externally accessing mechanically difficult to access circuit nodes in integrated circuits |
| CN1326592A (en) * | 1998-11-20 | 2001-12-12 | 索尼计算机娱乐公司 | Integrated circuit chip, integrated circuit, printed-circuit board and electronic device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3882532A (en) * | 1972-07-03 | 1975-05-06 | Ibm | Externally accessing mechanically difficult to access circuit nodes in integrated circuits |
| CN1326592A (en) * | 1998-11-20 | 2001-12-12 | 索尼计算机娱乐公司 | Integrated circuit chip, integrated circuit, printed-circuit board and electronic device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637615A (en) * | 2012-03-31 | 2012-08-15 | 上海华力微电子有限公司 | Sample preparation method for wafer-level back failure positioning in failure analysis |
| CN102637615B (en) * | 2012-03-31 | 2014-09-17 | 上海华力微电子有限公司 | Sample preparation method for wafer-level back failure positioning in failure analysis |
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| CN101206179A (en) | 2008-06-25 |
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