CN101199110B - Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator - Google Patents
Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator Download PDFInfo
- Publication number
- CN101199110B CN101199110B CN2006800214875A CN200680021487A CN101199110B CN 101199110 B CN101199110 B CN 101199110B CN 2006800214875 A CN2006800214875 A CN 2006800214875A CN 200680021487 A CN200680021487 A CN 200680021487A CN 101199110 B CN101199110 B CN 101199110B
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- Prior art keywords
- packaging body
- lead frame
- outside terminal
- lead
- piezoelectric oscillator
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- 238000004891 communication Methods 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims description 80
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 7
- 241000781618 Ochna pulchra Species 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 238000005549 size reduction Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
Abstract
A package structure for a piezoelectric oscillator for further size reduction and thinning of the piezoelectric oscillator. The piezoelectric oscillator is provided with a first package (2) wherein a circuit element (1) for constituting an oscillation circuit is stored, and a second package (4) which is fixed over the first package and has a piezoelectric oscillating element (3) stored inside. The first package (2) includes a lead frame (5) and a transfer lead frame (6), and some of the ends of the lead frame (5) are permitted to be external terminals (5b) exposed by facing the outer plane of the first package by being bent. The transfer lead frame (6) is so formed as to have the ends of a wiring pattern exposed by facing a peeling plane side of a molded resin as external terminals (6a), by arranging the wiring pattern on the base material during resin molding and peeling the base material after the resin molding.
Description
Technical field
The present invention relates to a kind of piezoelectric oscillator that is used for communication equipments such as portable phone or electronic equipment etc., particularly relate to the package body structure of this piezoelectric oscillator.
Background technology
Because along with the universal low price that brings of mobile communicating equipment such as portable phone and developing rapidly of miniaturization, for the piezoelectric oscillators such as quartz (controlled) oscillator that use in these communication equipments, the requirement of miniaturization and slimming also improves.
At present, structure as piezoelectric oscillator, known shown in patent documentation 1, by first packaging body of taking in the circuit element that is used to constitute oscillating circuit with overlappingly be fixed on the piezoelectric oscillator that second packaging part of taking in piezoelectric vibration device on this first packaging body and in inside constitutes.And, in above-mentioned patent documentation 1, the installation base plate that utilizes each lead frame to be configured for being electrically connected piezoelectric oscillator has been installed and the lead frame of first packaging body and be used to be electrically connected the lead frame of first packaging body and second packaging body, by these each leadframe configuration being become the position overlaid of vertical direction, realize the miniaturization of piezoelectric oscillator.
Other structure as piezoelectric oscillator, known piezoelectric vibration device and circuit element are accommodated in one-piece type packaging body in the same packaging body, perhaps shown in patent documentation 2, on inside is taken in below the container body of piezoelectric vibration device, be provided with the circuit element of control usefulness and below on have the surface mounting piezoelectric oscillator of a pair of foot of outside terminal.
Patent documentation 1: the spy opens the 2004-166230 communique
Patent documentation 2: the spy opens the 2004-260626 communique
Summary of the invention
Invent technical problem to be solved
But, along with popularizing of portable phone, the miniaturization of communication equipment or electronic equipment part, the requirement of slimming are further improved, shown in above-mentioned patent documentation 1, this technology of overlapping simply lead frame can not adapt to this requirement.Therefore that is, in the technology of above-mentioned patent documentation 1, owing to the overlapping lead frame that makes is intensive, wiring can not successfully be carried out, and it is restricted to be used for the thin spaceization of lead frame of miniaturization, slimming.In addition, intensity also reduces when making the thickness attenuation of lead frame for miniaturization, slimming, causes in the processing when assembling etc. the lead frame distortion takes place, thereby problem such as can't handle in some cases.
In addition, though one-piece type packaging body is that circuit element and piezoelectric vibration device are accommodated in structure in the same packaging body, but for example when this piezoelectric vibration device generation abnormal conditions, even circuit element is a good state, but this one-piece type packaging body has also become substandard products, therefore produces the problem of cost up.
On the other hand, in above-mentioned patent documentation 2 disclosed surface installing type structures, owing to use pottery or glass epoxy substrate in taking in the container body of piezoelectric vibration device, therefore the thickness that produces owing to this substrate makes the conditional problem of slimming.
Therefore, the objective of the invention is to, the package body structure of the piezoelectric oscillator of a kind of miniaturization more or slimming is provided.
The technical scheme of technical solution problem
The present invention adopts by the pin configuration at first packaging body of taking in the circuit element that is used for constituting oscillating circuit and shifts lead frame (transfer lead frame), thereby has solved the problems referred to above.Herein, so-called " transfer lead frame " is meant the lead frame of following formation: with the first packaging body resin forming time on basis material the laying-out and wiring pattern, behind resin forming, peel basis material, thereby wiring pattern stays in the mode that is transferred in release surface one side of moulding resin, in the present invention, the end of wiring pattern as outside terminal, is formed towards release surface one side of moulding resin and exposes.
Promptly, piezoelectric oscillator of the present invention has: first packaging body and overlapping second packaging body of taking in piezoelectric vibration device on this first packaging body and in inside that is fixed on of taking in the circuit element that is used to constitute oscillating circuit, wherein, first packaging body comprises lead frame and shifts lead frame; Several ends of lead frame are by being bent to form the outside terminal that exposes towards the outside of first packaging body; Shift the following formation of lead frame: when making the first packaging body resin forming on basis material the laying-out and wiring pattern, behind resin forming, peel off basis material, thereby described wiring pattern is stayed on the release surface of moulding resin with the form that is transferred, the end of described wiring pattern as outside terminal, is exposed towards release surface one side of moulding resin; Circuit element is electrically connected lead frame and the terminal that shifts lead frame; Be exposed to first packaging body top or following among any one face on outside terminal as mounting terminal, be electrically connected being exposed to the outside terminal on another face and the outside terminal of second packaging body.
In addition, in the present invention, the part in the outside terminal that exposes towards the outside of first packaging body can form the shape different with other outside terminal.By this kind structure, only just can distinguish top outside terminal and the outside terminal of bottom surface simply with a glance, therefore in manufacturing process etc., can prevent and wrong first packaging body is installed, so that be connected and fixed top and this situation in bottom surface on the contrary.In addition, by top outside terminal according to outside terminal effect separately, form the shape different with the outside terminal above other, when connecting, can easily confirm corresponding outside terminal.
In addition, by with the part of the lead-in wire of lead frame downwards or the top crooked and be exposed to the outside of first packaging body, be used as outside terminal, the remaining lead-in wire of described lead frame also can prolong along level, as control terminal with lead-in wire.By this kind structure, the touch controls terminals such as pin that only will check usefulness just can be checked simply with lead-in wire.
In addition, also can with as the side end of the outside terminal of lead frame mounting terminal towards first packaging body expose peripherally or outstanding.By this kind structure, in the time of on piezoelectric oscillator being installed in installation base plate etc. by welding, the side that the scolder of seeing from the interarea of described mounting terminal upwards pushes away mounting terminal.Therefore, connection substrate and mounting terminal securely, and can easily observe the state of connection from the outside.
In addition, utilize resin-sealed circuit element periphery, from basis material peel shift lead frame after, remaining necessary lead-in wire by utilizing metal pattern etc. to cut off first packaging body, can be separated into monolithic again.By this kind structure, basis material is removed when forming product, therefore can not have influence on the thickness of first packaging body.And then, can be as required the thickness (intensity) of selected this basis material arbitrarily, can avoid because the product that cause, that cause because of lead frame distortion etc. of the processing during resin forming is defective.
In addition, can on lead frame, extend to form lead-in wire,, its end is exposed to above first packaging body, thereby form outside terminal the interior side direction or the direction bending laterally above the packaging body of described lead-in wire above packaging body.By this kind structure, can be connected accordingly with the size change of second packaging body of mounting or the configuration of outside terminal in the above.
And,, can realize miniaturization, the slimming of equipment by above-mentioned piezoelectric oscillator is installed on communication equipment or the electronic equipment.
The invention effect
According to the present invention, shift lead frame by using, compare with the situation of the overlapping use lead frame of multi-disc in packaging body and limited thickness, thereby can adapt to miniaturization, slimming.
In addition, adopt and shift lead frame, can form the fine wiring pattern, thereby the packaging body of the circuit element of having taken in the exploitation needs that satisfy piezoelectric vibration device can be provided.And, by carrying out the design of suitable wiring pattern, can avoid lead is connected up and down etc. across, thereby not have lead or connect the waste of operation, cheap piezoelectric oscillator can be provided.
In addition, compare with existing one-piece type packaging body, therefore the present invention can carry out qualified, underproof inspection respectively owing to be separated into first packaging body of taking in circuit element and second packaging body of taking in piezoelectric vibration device.Thus, can only make up qualified product and make piezoelectric oscillator, can not become defective item, thereby reduce manufacturing cost owing to the defective piezoelectric oscillator that causes of the piezoelectric oscillator part after the assembling itself.
Description of drawings
Fig. 1 is the exploded perspective view of the piezoelectric oscillator of first embodiment of the invention.
Fig. 2 is the cutaway view of piezoelectric oscillator shown in Figure 1.
Fig. 3 is the top view of first packaging body of piezoelectric oscillator shown in Figure 1.
Fig. 4 is the plane graph of the lead frame of formation piezoelectric oscillator shown in Figure 1.
Fig. 5 is the cutaway view of the variation of expression first embodiment of the invention.
Fig. 6 is the exploded perspective view of another variation of expression first embodiment of the invention.
Fig. 7 is the cutaway view of the piezoelectric oscillator of second embodiment of the invention.
Symbol description
1 circuit element
2 first packaging bodies
3 piezoelectric vibration devices
4 second packaging bodies
5 lead frames
The 5a control terminal is with going between
The 5b outside terminal
The secondary lead-in wire of 5c
5d blocks bar
The 5e guide hole
5f periphery framework
The 5g lead-in wire
6 shift lead frame
The 6a outside terminal
7 bonding wires
8,9 resin moulding-dies
10 lids
11 outside terminals
12 conductive adhesives
Embodiment
Below, illustrated embodiment illustrates embodiments of the present invention with reference to the accompanying drawings.
Embodiment 1
Fig. 1 is the exploded perspective view of the piezoelectric oscillator of first embodiment of the invention.Fig. 2 is the cutaway view of piezoelectric oscillator shown in Figure 1, and Fig. 3 is the top view of first packaging body of piezoelectric oscillator shown in Figure 1.
Piezoelectric oscillator of the present invention has: first packaging body 2 of having taken in the circuit element 1 that is used to constitute oscillating circuit; With second packaging body 4 of having taken in piezoelectric vibration device 3, and with second packaging body, 4 overlapping being fixed on first packaging body 2.
At first, adhesive-applying on the surface of the basis material (not shown) of for example copper or stainless steel etc., the transfer lead frame 6 of configuration conductivity on its applicator surface, and install and fix circuit element 1 thereon.
Then, one or more lead frame 5 of configuration above transfer lead frame 6.On lead frame 5, form the control terminal is connected with circuit element 1 with the pair that is formed with outside terminal 5b on lead-in wire 5a, the top go between 5c, in manufacture process support they also stop mobile obstruction bar 5d of sealing resin and peripheral framework 5f with guide hole 5e.Wherein, the top ends of the outside terminal 5b side of secondary lead-in wire 5c is utilized bendings upward such as metal pattern as shown in Figures 1 and 2.The formation after resin-molded of the height of this outside terminal 5b can be exposed to the size above first packaging body 2.In addition, in first packaging body 2 as shown in Figures 1 and 2, because the outside terminal 5b and second packaging body 4 that are exposed to above it are electrically connected, therefore expose or the different shape of outside terminal 6a of outstanding outside terminal formation and the bottom surface of first packaging body 2.In addition, make top outside terminal 5b form the shape different according to separately effect with the outside terminal above other.On the other hand, control terminal prolongs along level with lead-in wire 5a.And, the control terminal also flexible as required one-tenth of lead-in wire 5a shape arbitrarily.
Then, be electrically connected these lead frames 5, shift lead frame 6 and circuit element 1 with bonding wire 7, and with the periphery of resin-molded potted circuit element 1.And, be electrically connected and for example can use also that the flip-chip connection waits other to be electrically connected method.
After the mold pressing sealing, by peeling basis material and resin moulding-die 8 (moulding resin), the wiring pattern that shifts lead frame 6 is stayed stripper surface one side of resin moulding-die 8 with the form that is transferred, and expose towards stripper surface one side of resin moulding-die 8 as outside terminal 6a its end.Because this outside terminal 6a is as mounting terminal, so its side end is exposed to the outside of first packaging body 2.
On the other hand, second packaging body 4 is taken in piezoelectric vibration device 3 in resin moulding-die 9, and is sealed with lid 10.In addition, by making conductive adhesive 12 sclerosis piezoelectric vibration device 3 is bonded on the following outside terminal 11 that is exposed to second packaging body 4.
With these second packaging body, 4 overlapping being fixed on first packaging body 2, utilizing outside terminal 5b, 11 to be electrically connected, thereby form piezoelectric oscillator.Afterwards, cut off at each packaging body (each piezoelectric oscillator).And, also can be after cutting off first packaging body overlapping second packaging body of fixing.
Fig. 5 represents the variation of the foregoing description.Shift lead-in wire 6 though below first packaging body 2, formed in the above-described embodiments, but in the example of Fig. 5, shift lead-in wire 6 also can be formed on first packaging body 2 above.
Fig. 6 represents another variation of the foregoing description.In the foregoing description, though disposed several lead-in wires in the lead frame as the control terminal lead-in wire, in the example of Fig. 6, also can be not form control terminal to use lead-in wire and the structure of limit levels direction size.
Fig. 7 is the cutaway view of the piezoelectric oscillator of second embodiment of the invention.In this embodiment, form following structure, that is, be formed extended at both sides the lead-in wire 5g of the outside terminal 5b with lead frame 5, and be projected on the profile of first packaging body 2.Specifically, make after 2 moulding of first packaging body with resin moulding-die, the interior side direction bending lead 5g above first packaging body 2, thereby make outside terminal 5b be exposed to first packaging body 2 above.And, sometimes also can be according to the size or the wiring pattern of second packaging body, direction bending lead 5g laterally above first packaging body 2.
Claims (8)
1. piezoelectric oscillator has: take in first packaging body and overlapping second packaging body of taking in piezoelectric vibration device on this first packaging body and in inside that is fixed on of the circuit element that is used to constitute oscillating circuit, wherein,
First packaging body comprises lead frame and shifts lead frame;
Several ends of lead frame are by being bent to form the outside terminal that exposes towards the outside of first packaging body;
Shift the following formation of lead frame: when making the first packaging body resin forming on basis material the laying-out and wiring pattern, behind resin forming, peel off basis material, thereby described wiring pattern is stayed on the release surface of moulding resin with the form that is transferred, the end of described wiring pattern as outside terminal, is exposed towards release surface one side of moulding resin;
Circuit element is electrically connected lead frame and the terminal that shifts lead frame;
Be exposed to first packaging body top or following among any one face on outside terminal as mounting terminal, be electrically connected being exposed to the outside terminal on another face and the outside terminal of second packaging body.
2. the piezoelectric oscillator of putting down in writing as claim 1, wherein, the part in the outside terminal that exposes towards the outside of described first packaging body has the shape different with other outside terminal.
3. as claim 1 or 2 piezoelectric oscillators of being put down in writing, wherein, the part of the lead-in wire of described lead frame by downwards or be bent upwards and be exposed to first packaging body the outside and as outside terminal, the remaining lead-in wire of described lead frame along level prolong and as control terminal with lead-in wire.
4. as claim 1 or 2 piezoelectric oscillators of being put down in writing, wherein,, expose towards the outside of first packaging body or outstanding as the side end of the outside terminal of the mounting terminal of described lead frame.
5. as claim 1 or 2 piezoelectric oscillators of being put down in writing, wherein, after will shifting lead frame and peeling from basis material, remaining necessary lead-in wire is separated into monolithic by cutting off first packaging body again.
6. as claim 1 or 2 piezoelectric oscillators of being put down in writing, wherein, on lead frame, be formed extended at both sides lead-in wire, with interior side direction or along first packaging body above the laterally direction bending of described lead-in wire above first packaging body, make its end be exposed to first packaging body above be used as outside terminal.
7. communication equipment has each piezoelectric oscillator of putting down in writing among the claim 1 to 6.
8. electronic equipment has each piezoelectric oscillator of putting down in writing among the claim 1 to 6.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP173902/2005 | 2005-06-14 | ||
| JP2005173902A JP3947545B2 (en) | 2005-06-14 | 2005-06-14 | Piezoelectric oscillator, communication device and electronic device including the same |
| PCT/JP2006/310990 WO2006134780A1 (en) | 2005-06-14 | 2006-06-01 | Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101199110A CN101199110A (en) | 2008-06-11 |
| CN101199110B true CN101199110B (en) | 2010-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800214875A Active CN101199110B (en) | 2005-06-14 | 2006-06-01 | Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3947545B2 (en) |
| CN (1) | CN101199110B (en) |
| WO (1) | WO2006134780A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4551461B2 (en) * | 2008-03-10 | 2010-09-29 | 吉川工業株式会社 | Semiconductor device and communication device and electronic device provided with the same |
| US8717108B2 (en) | 2011-04-12 | 2014-05-06 | The Boeing Company | Resonator device |
| JP6344544B2 (en) * | 2013-11-11 | 2018-06-20 | セイコーエプソン株式会社 | Oscillator manufacturing method, semiconductor circuit device manufacturing method, and semiconductor circuit device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1271998A (en) * | 1999-04-23 | 2000-11-01 | 株式会社村田制作所 | Piezoelectric device and piezoelectric resonator using same |
| CN1343043A (en) * | 2000-08-31 | 2002-04-03 | 精工爱普生株式会社 | Piezoelectric device and manufacturing method thereof and manufacturing method for piezoelectric oscillator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4222147B2 (en) * | 2002-10-23 | 2009-02-12 | セイコーエプソン株式会社 | Piezoelectric oscillator, mobile phone device using piezoelectric oscillator, and electronic device using piezoelectric oscillator |
| JP4222020B2 (en) * | 2002-12-17 | 2009-02-12 | セイコーエプソン株式会社 | Piezoelectric oscillator |
| JP2004297554A (en) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | Piezoelectric oscillator, portable telephone and electronic device using it |
-
2005
- 2005-06-14 JP JP2005173902A patent/JP3947545B2/en active Active
-
2006
- 2006-06-01 WO PCT/JP2006/310990 patent/WO2006134780A1/en active Application Filing
- 2006-06-01 CN CN2006800214875A patent/CN101199110B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1271998A (en) * | 1999-04-23 | 2000-11-01 | 株式会社村田制作所 | Piezoelectric device and piezoelectric resonator using same |
| CN1343043A (en) * | 2000-08-31 | 2002-04-03 | 精工爱普生株式会社 | Piezoelectric device and manufacturing method thereof and manufacturing method for piezoelectric oscillator |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2004-166230A 2004.06.10 |
| JP特开2004-200916A 2004.07.15 |
| JP特开2004-297554A 2004.10.21 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101199110A (en) | 2008-06-11 |
| JP2006352349A (en) | 2006-12-28 |
| WO2006134780A1 (en) | 2006-12-21 |
| JP3947545B2 (en) | 2007-07-25 |
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