CN101198221A - Segmenting stannum gushing technique of soldering tin stove - Google Patents
Segmenting stannum gushing technique of soldering tin stove Download PDFInfo
- Publication number
- CN101198221A CN101198221A CNA2007101913106A CN200710191310A CN101198221A CN 101198221 A CN101198221 A CN 101198221A CN A2007101913106 A CNA2007101913106 A CN A2007101913106A CN 200710191310 A CN200710191310 A CN 200710191310A CN 101198221 A CN101198221 A CN 101198221A
- Authority
- CN
- China
- Prior art keywords
- tin
- pcb board
- crest
- wave crest
- gushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The invention relates to a soldering tin process used in a solder furnace, in particular to a solder furnace segmented tin gushing process, wherein, the solder furnace tin gushing comprises four stages, i.e. a primary high wave crest, an intermediate wave crest, a low wave crest and a secondary high wave crest; during the primary high wave crest, a PCB board is moved towards a tin nozzle, and the tin nozzle is preheated by means of a high-temperature peak for 2 seconds to 3 seconds; when the PCB board is moved above the pot mouth of the solder furnace, the tin wave falls back to the intermediate wave crest, and the PCB board drops to cling closely to the tin nozzle; meanwhile, the tine wave reaches the low wave crest to preheat the PCB board positioned at a welded part for 3 seconds to 5 seconds; after preheating, the tin wave goes up again and reaches the secondary high wave crest to weld the PCB board. The solder furnace segmented tin gushing process preheats the PCB board while ensuring higher welding temperature of molten tin, thereby making full use of the power of soldering flux to reach the goal of high-quality welding.
Description
Technical field
The present invention relates to a kind of solder furnace soldering tin technique that is used for, especially a kind of segmenting stannum gushing technique of soldering tin stove.
Background technology
At present to gush the tin mode only be pcb board when arriving kettle mouth top to colleague's tin stove, and tin liquor is gushed out by Hu Kou, and pcb board is welded, and after this tin ripple falls after rise again to the kettle mouth.This mode is welded pcb board, because the relative tin liquor temperature of Xi Zui is lower, the place gushes out tin when chewing in tin liquor, and Xi Zui can draw the heat of tin liquor, makes tin liquor temperature when carrying out the pcb board welding easily be lower than best welding temperature.In addition,, after PCB arrives Xi Zui, just directly weld, substantially pcb board is not carried out preheating, make the effect of scaling powder be difficult for performance, influence welding performance owing to before PCB welds, sprayed scaling powder in its to-be-welded region.
Summary of the invention
In order to improve welding performance, the effect of scaling powder is given full play to, improve welding quality, the invention provides a kind of segmenting stannum gushing technique of soldering tin stove.
The technical solution adopted for the present invention to solve the technical problems is: a kind of segmenting stannum gushing technique of soldering tin stove is characterized in that: described solder furnace is gushed tin through four-stage, the once high crest-medium wave peak-low high crest of crest-secondary;
When high crest first, pcb board is at this moment to tin to be chewed in the moving process, utilizes the high temperature peak that Xi Zui is carried out preheating, and the duration is 2～3s;
Treat that pcb board waits to move to tin furnace kettle mouth top place, the tin ripple falls after rise, reaches medium wave peak, and pcb board descends and is close to Xi Zui, and this moment, the tin ripple arrived low crest, thus pcb board preheating that will the welding position, duration 3～5s;
After preheating finished, the tin ripple went up, and arrived the high crest of secondary, and pcb board is welded.
Segmenting stannum gushing technique of soldering tin stove of the present invention by adopting the tin that gushes of four-stage, when guaranteeing that tin liquor has higher welding temperature, carries out preheating to pcb board, gives full play to the power of scaling powder, thereby reaches high-quality welding purpose.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a FB(flow block) of the present invention.
Embodiment
A kind of segmenting stannum gushing technique of soldering tin stove as shown in Figure 1, described solder furnace gush tin through four-stage, the once high crest-medium wave peak-low high crest of crest-secondary;
When high crest first, pcb board is at this moment to tin to be chewed in the moving process, utilizes the high temperature peak that Xi Zui is carried out preheating, and the duration is 2～3s;
Treat that pcb board waits to move to tin furnace kettle mouth top place, the tin ripple falls after rise, reaches medium wave peak, and pcb board descends and is close to Xi Zui, and this moment, the tin ripple arrived low crest, thus pcb board preheating that will the welding position, duration 3～5s;
After preheating finished, the tin ripple went up, and arrived the high crest of secondary, and pcb board is welded.
Claims (1)
1. segmenting stannum gushing technique of soldering tin stove is characterized in that: described solder furnace is gushed tin through four-stage, the once high crest-medium wave peak-low high crest of crest-secondary;
When high crest first, pcb board is at this moment to tin to be chewed in the moving process, utilizes the high temperature peak that Xi Zui is carried out preheating, and the duration is 2～3s;
Treat that pcb board waits to move to tin furnace kettle mouth top place, the tin ripple falls after rise, reaches medium wave peak, and pcb board descends and is close to Xi Zui, and this moment, the tin ripple arrived low crest, thus pcb board preheating that will the welding position, duration 3～5s;
After preheating finished, the tin ripple went up, and arrived the high crest of secondary, and pcb board is welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101913106A CN101198221A (en) | 2007-12-18 | 2007-12-18 | Segmenting stannum gushing technique of soldering tin stove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101913106A CN101198221A (en) | 2007-12-18 | 2007-12-18 | Segmenting stannum gushing technique of soldering tin stove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101198221A true CN101198221A (en) | 2008-06-11 |
Family
ID=39548291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101913106A Pending CN101198221A (en) | 2007-12-18 | 2007-12-18 | Segmenting stannum gushing technique of soldering tin stove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101198221A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102266996A (en) * | 2010-06-07 | 2011-12-07 | 宇达电脑（上海）有限公司 | Intelligent control type solder pot |
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
| CN103831504A (en) * | 2014-02-19 | 2014-06-04 | 广州中逸光电子科技有限公司 | Dip soldering device and method |
-
2007
- 2007-12-18 CN CNA2007101913106A patent/CN101198221A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102266996A (en) * | 2010-06-07 | 2011-12-07 | 宇达电脑（上海）有限公司 | Intelligent control type solder pot |
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
| CN103781290B (en) * | 2014-01-24 | 2016-11-23 | 南通苏禾车灯配件有限公司 | The peak welding system of a kind of LED plug-in unit lamp plate and control method thereof |
| CN103831504A (en) * | 2014-02-19 | 2014-06-04 | 广州中逸光电子科技有限公司 | Dip soldering device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102139412B (en) | Laser welding method | |
| CN103934534B (en) | The vacuum welding method of a kind of thick film substrate and power shell | |
| CN101198221A (en) | Segmenting stannum gushing technique of soldering tin stove | |
| CN104668688A (en) | Vacuum resistive brazing method for lap piece | |
| CN102225483A (en) | Welding method of vertically brazed joint of stainless steel conduit | |
| CN204353607U (en) | Welder | |
| CN209363801U (en) | A kind of inductor helping weldering atmosphere with gas | |
| CN104607745A (en) | Swirler vacuum brazing method | |
| CN110248495A (en) | Tin cream Reflow Soldering and glue technique for fixing | |
| CN106735984A (en) | A kind of temperature controller temperature sensing tube and capillary Welding method | |
| CN101184368A (en) | Segmentation control stannum-gushing technique for automatic selectivity soldering stove | |
| CN110256096A (en) | The process of multiple ceramic substrates and shell reflow soldering | |
| CN205309489U (en) | Ultrasonic wave soldering machine | |
| CN106181113B (en) | A kind of preparation method of soldering composite aluminium alloy solder silk | |
| CN102513635A (en) | Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device | |
| CN104551306B (en) | Tin spraying machine | |
| CN105562873A (en) | Method for welding circuit components | |
| CN104651768B (en) | Process for coating bottom solder terminal device with tin | |
| CN104308313B (en) | A kind of rustless steel heat-generating pipe and flange nickel-base soldering processes | |
| CN102935535B (en) | Manual electric soldering bit capable of increasing welding efficiency of lead and bonding pad and improving welding reliability of lead and bonding pad | |
| CN201201090Y (en) | Vector flow-adjustable valve of wave soldering tin stove | |
| CN101709442B (en) | Processing method after alloy cutter welding | |
| CN106624255B (en) | Slag cleaning device and its clinker removal method for wave soldering device | |
| CN211135835U (en) | Selective wave-soldering nitrogen protection device | |
| CN212704866U (en) | Uniform-speed crest welder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhao Feng Document name: Notification of before Expiration of Request of Examination as to Substance |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080611 |