CN101197202A - Chip resistor and method of producing the same - Google Patents
Chip resistor and method of producing the same Download PDFInfo
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- CN101197202A CN101197202A CNA2006101633929A CN200610163392A CN101197202A CN 101197202 A CN101197202 A CN 101197202A CN A2006101633929 A CNA2006101633929 A CN A2006101633929A CN 200610163392 A CN200610163392 A CN 200610163392A CN 101197202 A CN101197202 A CN 101197202A
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Abstract
The invention discloses a chip resistor and a production method thereof. The chip resistor is provided with at least one resistive film, a pair of upper side electrodes on the left end and right end of the resistive film and a protective coating covering the resistive film which are arranged on a chip type insulated substrate. Side electrodes are formed by electrically conducting with the upper side electrodes on the left end face and the right end face of the insulated substrate; the side electrodes partially cover the upper side electrodes and the protective coating, and the surfaces of the side electrodes are respectively provided with metal plating. The production method includes the following steps: at least one resistive film, a pair of upper side electrodes on the left end and right end of the resistive film and the protective coating covering the resistive film are formed on the chip type insulated substrate. Side electrodes are formed by electrically conducting with the upper side electrodes on the left end face and the right end face of the insulated substrate; the side electrodes partially cover the upper side electrodes and the protective coating, and the surfaces of the side electrodes are respectively provided with metal plating.
Description
Technical field
The present invention relates to a kind of electronic device and manufacture method thereof, relate in particular to a kind of chip resistor and manufacture method thereof.
Background technology
Chip resistor is widely used in the electronic circuit.Its typical structure as shown in Figure 1; on chip-shaped insulated substrate 1, form a resistive film 2 with required resistance value; form the overlying electrode 5 of separating about coupled at the two ends, the left and right sides of resistive film 2; on the end face of the left and right sides of insulated substrate 1; form the side electrode 7 that electrically conducts with overlying electrode 5; be formed with the coat of metal 8 on the surface of side electrode 7; this coat of metal 8 covers the expose portion of overlying electrode; on described resistive film 2, be coated with protective finish; concrete, this protective finish can comprise inner protective layer 3 and external protection 4.In order to satisfy the requirement of chip resistor manufacturing process, the lower electrodes 6 that can also below insulated substrate 1, separate about formation, at this moment, the coat of metal 8 further covers the expose portions of lower electrodes.
In the chip resistor of above-mentioned typical structure; because the coat of metal 8 meeting attenuation gradually of overlying electrode 5 and external protection 4 intersections; therefore, the sulfurous gas in the atmosphere is easy to invade on the overlying electrode 5 overlying electrode 5 is caused corrosion, finally causes chip resistor the open circuit phenomenon to occur.
For addressing the above problem, Chinese patent application discloses a kind of chip resistor and manufacture method thereof, and this patent application was on August 25th, 2004 in open day, and publication number is CN 1524275A.In the disclosure document; chip resistor as shown in Figure 2 is provided; on form chip-shaped insulated substrate 1; be formed with at least one resistive film 2; be positioned at the pair of right and left overlying electrode 5 at these resistive film 2 two ends; and the external coating that covers above-mentioned resistive film 2; this external coating can specifically comprise inner protective layer 3 and external protection 4; on above-mentioned overlying electrode 5; form auxiliary overlying electrode 9 with respect to above-mentioned external coating with overlapping; on the end face of the left and right sides of above-mentioned insulated substrate 1; form side electrode 7 with above-mentioned overlying electrode 5 and auxiliary overlying electrode 9 conductings ground; surface at above-mentioned auxiliary overlying electrode 9 and side electrode 7 is formed with the coat of metal 8; on above-mentioned external coating, with respect to the part that overlaps in the above-mentioned auxiliary overlying electrode 9 on the above-mentioned external coating; be formed with the external coating 10 of the superiors with overlapping.
The disclosure document also discloses the method for making above-mentioned chip resistor, comprises following operation:
At least one resistive film of formation and the operation that is positioned at the overlying electrode at these resistive film two ends on chip-shaped insulated substrate;
Formation covers the operation of the external coating of above-mentioned resistive film on above-mentioned insulated substrate;
Overlap on above-mentioned two overlying electrode and form with overlapping the operation of auxiliary overlying electrode with respect to above-mentioned external coating;
At least form the operation of side electrode with above-mentioned overlying electrode at the two ends of above-mentioned insulated substrate with electrically conducting;
On above-mentioned external coating, with respect to overlapping part on the above-mentioned external coating in the above-mentioned auxiliary overlying electrode, forming the operation of the external coating of the superiors that cover this external coating with overlapping;
Form the operation of the coat of metal on the surface of above-mentioned auxiliary overlying electrode and side electrode.
Disclosed chip resistor in the above-mentioned open source literature, the protection of the external coating by the auxiliary overlying electrode and the superiors, make airborne sulfurous gas difficulty invade on the overlying electrode, reduced the destruction that sulfurous gas causes resistor.But, because the external coating of the superiors and the intersection of the coat of metal are still very thin, when auxiliary overlying electrode is when being made of silver slurry or copper slurry, the as easy as rolling off a log coat of metal that approaches that sees through of corrosive gas penetrates on the auxiliary overlying electrode, corrode auxiliary overlying electrode and then corrode overlying electrode, cause resistor change in resistance or open circuit; When auxiliary overlying electrode is made of for the conductive paste of main component nickel or carbon etc., sintering process to auxiliary overlying electrode requires high, inadvisable property is arranged on technology, simultaneously, owing to increased the printing of auxiliary overlying electrode, both influence production efficient, improved the processing cost of product again.
Summary of the invention
The present invention is directed to the shortcoming of prior art, a kind of simple in structure, easily manufactured, chip resistor and manufacture method thereof that corrosion resistance is high are provided.
Chip resistor provided by the invention; on form chip-shaped insulated substrate; be formed with at least one resistive film, be positioned at a pair of overlying electrode at two ends, the left and right sides of this resistive film and the protective finish that covers above-mentioned resistive film; on the end face of the left and right sides of described insulated substrate; the formation side electrode that electrically conducts with overlying electrode; described side electrode partly covers overlying electrode and protective finish, and is formed with the coat of metal on the side electrode surface.
As above-mentioned chip resistor, two ends, the left and right sides below described insulated substrate also are formed with a pair of lower electrodes, described lower electrodes electrically conducts with the side electrode of respective side and is connected, and side electrode partly covers lower electrodes, the expose portion of described coat of metal extension covering lower electrodes.
Above-mentioned protective finish comprises that the inner protective layer that directly overlays above the resistive film and upper part thereof cover the external protection of overlying electrode.
The present invention also provides a kind of manufacture method of chip resistor, comprises the steps:
Among the present invention, described protective finish comprises that the inner protective layer that directly overlays above the resistive film and upper part thereof cover the external protection of overlying electrode.
The total length L 1 of above-mentioned external protection is:
L1＝L-2A
Wherein, L represents the length of insulated substrate, and A represents not the length of the overlying electrode that covered by external protection, and unit of measurement is a millimeter.
The length L 2 that above-mentioned side electrode covers external protection is:
L2＝(L-L1)/2+B
Wherein, L represents the length of insulated substrate, and L1 represents the total length of external protection, and B represents that side electrode covers the length of external protection, and unit of measurement is a millimeter.
Among the present invention; covered securely by side electrode with the external protection of overlying electrode junction; make the coat of metal can be good at covering the binding site of overlying electrode and external protection; thereby the overlying electrode of having avoided the junction is because of touching the phenomenon that being corroded appears in corrosive gass such as sulfur-bearing; prevented that effectively change in resistance or open circuit from appearring in resistor; simultaneously; because it is one-shot forming that side electrode extends to external protection; needn't increase production procedure; thereby reduced production process, reduced production cost.
Description of drawings
Fig. 1 is the vertical profile schematic diagram of typical chip resistor in the prior art;
Fig. 2 is the vertical profile schematic diagram of disclosed chip resistor in the open source literature;
Fig. 3 is the vertical profile schematic diagram of the chip resistor that obtains behind first procedure in chip resistor manufacture method of the present invention;
Fig. 4 is the vertical profile schematic diagram of the chip resistor that obtains after the second operation work in chip resistor manufacture method of the present invention;
Fig. 5 is the vertical profile schematic diagram of the chip resistor that obtains behind the three process in chip resistor manufacture method of the present invention;
Fig. 6 is the vertical profile schematic diagram of the chip resistor that obtains behind the 4th procedure in chip resistor manufacture method of the present invention;
Fig. 7 is the vertical profile schematic diagram of the chip resistor that obtains behind the five processes in chip resistor manufacture method of the present invention;
Fig. 8 is the vertical profile schematic diagram of the chip resistor that obtains behind the 6th procedure in chip resistor manufacture method of the present invention;
Fig. 9 is the schematic flow sheet of chip resistor manufacture method of the present invention.
Embodiment
Among the present invention, by changing the structure of chip resistor side electrode, thereby better realize the corrosion resistance of chip resistor.
The present invention will be further described below in conjunction with accompanying drawing.
As shown in Figure 8, chip resistor of the present invention comprises chip-shaped insulated substrate 1, and this insulated substrate 1 can be made of insulating material such as aluminium oxide or pottery or glass; On described insulated substrate 1, be formed with at least one resistive film 2, and a pair of overlying electrode 5 of starching the two ends, the left and right sides that are positioned at this resistive film 2 that constitute by silver; Be coated with protective finish on resistive film 2, concrete, this protective finish can comprise the external protection 4 that the inner protective layer 3 that directly overlays above the resistive film 2 and upper part thereof cover overlying electrode 5; Above-mentioned inner protective layer 3 can be made of glass paste, and external protection 4 can be made of glass paste or resin slurry; Among the present invention, resistive film 2 can be repaiied through laser with inner protective layer 3 and reached set point with the resistance value of adjusting chip resistor quarter; On the end face of the left and right sides of insulated substrate 1, with the formation side electrode 7 that overlying electrode 5 electrically conducts, these side electrode 7 parts cover overlying electrode 5 and protective finish, and described side electrode 7 can be made of base metal materials such as silver slurry or nickel; Be formed with the coat of metal 8 on the surface of side electrode 7, this coat of metal 8 can comprise the nickel coating and the outer field tin coating of internal layer.
In the chip resistor of said structure, because the restriction of technology, side electrode 7 also can limit to some extent at the development length of the lower surface of insulated substrate 1.Therefore, in order to reach normal result of use, take to increase the means of lower electrodes 6 usually at the lower surface of insulated substrate 1.As shown in Figure 8, two ends, the left and right sides below insulated substrate 1 form a pair of lower electrodes 6, and described lower electrodes 6 electrically conducts with the side electrode 7 of respective side and is connected, and side electrode 7 parts cover lower electrodes 6, at this moment, the described coat of metal 8 extends the expose portion that covers lower electrodes 6.
Among the present invention; because side electrode 7 must cover external protection 4 and overlying electrode 5 relative overlapping parts; and; require side electrode 7 one-shot formings in the mill; therefore, certain requirement has been proposed all for the design and the end-blocking length of external protection 4, concrete; the design length of external protection 4 can be prolonged or increases the length of side electrode 7 covering external protections 4, or above-mentioned two kinds of situations combine.
When the design length overtime with external protection 4, the total length L 1 of external protection 4 can be formulated as:
L1＝L-2A
In the above-mentioned formula, unit of measurement is a millimeter, and L represents the length of insulated substrate 1, and A represents not the length of the overlying electrode that covered by external protection 4, and for the chip resistor of main flow size, the representative value of A is 0.05mm～0.30mm.
When increasing the length of side electrode 7 covering external protections 4, the length L 2 that side electrode 7 covers external protections can be formulated as:
L2＝(L-L1)/2+B
In the above-mentioned formula, unit of measurement is a millimeter, and L represents the length of insulated substrate 1, and L1 represents the total length of external protection 4, and B represents that side electrode 7 covers the length of external protection 4, and for the chip resistor of main flow size, the representative value of B is 0.02mm～0.60mm.
The present invention also provides a kind of manufacture method of chip resistor, as shown in Figure 9, comprises the steps:
In this step, the two ends, the left and right sides on insulated substrate 1 by the electrode coated slurry of silk screen printing, afterwards, through super-dry and sintering, can form overlying electrode 5, and the temperature of described sintering is 830～870 degrees centigrade.
In this step, also can further comprise the step that forms lower electrodes 7, promptly adopt and the same method of the above-mentioned overlying electrode of formation that the two ends, the left and right sides below insulated substrate 1 form lower electrodes 6.As shown in Figure 3, be the vertical profile schematic diagram after forming overlying electrode 5 and lower electrodes 6 on the insulated substrate 1 in this step.
Between the left and right sides overlying electrode 5 on insulated substrate 1, apply resistance slurry by silk screen printing, form the resistive film 2 that is connected with above-mentioned overlying electrode 5 behind super-dry and sintering, the temperature of described sintering is 830～870 degrees centigrade.As shown in Figure 4, be the vertical profile schematic diagram after forming resistive film 2 on the insulated substrate 1 in this step.The operation of above-mentioned formation resistive film 2 also can be carried out before forming overlying electrode 5, promptly applied resistance slurry by silk screen printing earlier, again by the electrode coated slurry of silk screen printing, afterwards, unified through super-dry and sintering, thus sintering number can be reduced, reduce manufacturing cost.
In this step, on insulated substrate 1, form the protective finish that covers resistive film 2.Specifically, described protective finish can be divided into inner protective layer 3 and external protection 4.For inner protective layer 3, on resistive film 2,, behind super-dry and sintering, form the inner protective layer 3 that covers resistive film 2 by silk screen printing coated glass slurry, the temperature of described sintering is 590～620 degrees centigrade.As shown in Figure 5, be the vertical profile schematic diagram after forming inner protective layer 3 on the insulated substrate 1 in this step.After inner protective layer 3 forms; utilize the resistance test probe to put on and carry out resistance measurement on the overlying electrode 5; when the resistance value of measuring gained does not fall into and is lower than in the predetermined margin of tolerance; repair on inner protective layer 3 and resistive film 2 by emission of lasering beam and to carve laser grooving, till the resistance value that to the last records enters within the predetermined margin of tolerance.For external protection 4, on inner protective layer 3,, behind super-dry and sintering, form the external protection 4 that covers resistive film 2, inner protective layer 3, reaches part overlying electrode 5 by silk screen printing coated glass slurry or resin slurry.When external protection 4 was glass paste, the temperature of sintering was 590～620 degrees centigrade; When external protection 4 was resin slurry, the temperature of sintering was 180～250 degrees centigrade.As shown in Figure 6, be the vertical profile schematic diagram after forming external protection 4 on the insulated substrate 1 in this step.
In this step; on the end face of the left and right sides of insulated substrate 1; apply electrode slurry by soaking envelope or roller coating mode; or (for example apply the base metal material by the vacuum sputtering mode; nickel etc.), thus form electrically conduct with overlying electrode and part cover the side electrode 7 of overlying electrode 5 and protective finish.When having lower electrodes 6 below the insulated substrate 1, described side electrode 7 also need satisfy part and cover lower electrodes 6.As shown in Figure 7, be the vertical profile schematic diagram after forming side electrode 7 on the end face of the left and right sides of insulated substrate 1 in this step.
In the process of above-mentioned formation side electrode 7, if in the electrode slurry of side electrode 7 when containing glass ingredient, need be through super-dry and sintering program, the temperature of sintering is 590～620 degrees centigrade; If when containing resinous principle in the electrode slurry of side electrode 7, need be through super-dry and program curing, the temperature of curing is 180～250 degrees centigrade.According to the above-mentioned sintering or the temperature of curing, also external protection 4 and side electrode 7 co-sintered or curing with minimizing sintering or curing number of times, thereby can be reduced manufacturing cost.
Among the present invention; because side electrode 7 must cover external protection 4 and overlying electrode 5 relative overlapping parts; and; require side electrode 7 one-shot formings in the mill; therefore, certain requirement has been proposed all for the design and the end-blocking length of external protection 4, concrete; the design length of external protection 4 can be prolonged or increases the length of side electrode 7 covering external protections 4, or above-mentioned two kinds of situations combine.
When the design length overtime with external protection 4, the total length L 1 of external protection 4 can be formulated as:
L1＝L-2A
In the above-mentioned formula, unit of measurement is a millimeter, and L represents the length of insulated substrate 1, and A represents not the length of the overlying electrode that covered by external protection 4, and for the chip resistor of main flow size, the representative value of A is 0.05mm～0.30mm.
When increasing the length of side electrode 7 covering external protections 4, the length L 2 that side electrode 7 covers external protections can be formulated as:
L2＝(L-L1)/2+B
In the above-mentioned formula, unit of measurement is a millimeter, and L represents the length of insulated substrate 1, and L1 represents the total length of external protection 4, and B represents that side electrode 7 covers the length of external protection 4, and for the chip resistor of main flow size, the representative value of B is 0.02mm～0.60mm.
Step 103 forms the coat of metal on the side electrode surface.
In this step, by plating mode, form the coat of metal 8 on the surface of side electrode 7, this coat of metal 8 has covered side electrode 7, and has extended and covered the overlapping part of external protection 4 and overlying electrode 5.
When being formed with lower electrodes 6 below the insulated substrate 1 of described chip resistor, the described coat of metal 8 also need further extend the expose portion that covers lower electrodes 6 on the basis of above-mentioned coverage.As shown in Figure 8, be the vertical profile schematic diagram after side electrode 7 surfaces form the coat of metal 8 in this step
The described coat of metal 8 comprises nickel coating and tin coating, promptly first nickel coating, tin coating again.
Among the present invention; the lap of external protection 4 and overlying electrode 5 is got up by side electrode 7 firm coverings; and then the coat of metal 8 also can well cover the lap of overlying electrode 5 and external protection 4; thereby avoided corrosive gas; particularly the sulfurous gas in the atmosphere is invaded overlying electrode 5 and overlying electrode 5 is caused corrosion; and; because it is one-shot formings that side electrode 7 extends to external protection 4; needn't increase production procedure, also make the manufacturing cost of chip resistor of the present invention reduce greatly.
Although embodiment of the present invention are open as above, but it is not restricted to listed utilization in specification and the execution mode, it can be applied to various suitable the field of the invention fully, for those skilled in the art, can easily realize other modification, therefore under the universal that does not deviate from claim and equivalency range and limited, the legend that the present invention is not limited to specific details and illustrates here and describe.
Claims (12)
1. chip resistor; on form chip-shaped insulated substrate; be formed with at least one resistive film, be positioned at a pair of overlying electrode at two ends, the left and right sides of this resistive film and the protective finish that covers above-mentioned resistive film; on the end face of the left and right sides of described insulated substrate; formation side electrode with overlying electrode electrically conducts is characterized in that:
Described side electrode partly covers overlying electrode and protective finish, and is formed with the coat of metal on the side electrode surface.
2. chip resistor as claimed in claim 1, it is characterized in that, two ends, the left and right sides below the described insulated substrate are formed with a pair of lower electrodes, described lower electrodes electrically conducts with the side electrode of respective side and is connected, and side electrode partly covers lower electrodes, and the described coat of metal extends the expose portion that covers lower electrodes.
3. chip resistor as claimed in claim 1 or 2 is characterized in that, described protective finish comprises that the inner protective layer that directly overlays above the resistive film and upper part thereof cover the external protection of overlying electrode.
4. chip resistor as claimed in claim 3 is characterized in that, the total length L 1 of described external protection is:
L1＝L-2A
Wherein, L represents the length of insulated substrate, and A represents not the length of the overlying electrode that covered by external protection, and unit of measurement is a millimeter.
5. chip resistor as claimed in claim 3 is characterized in that, the length L 2 that described side electrode covers external protection is:
L2＝(L-L1)/2+B
Wherein, L represents the length of insulated substrate, and L1 represents the total length of external protection, and B represents that side electrode covers the length of external protection, and unit of measurement is a millimeter.
6. chip resistor as claimed in claim 1 is characterized in that, the described coat of metal comprises the nickel coating and the outer field tin coating of internal layer.
7. the manufacture method of a chip resistor is characterized in that, comprises the steps:
Step 1 on chip-shaped insulated substrate, is formed with at least one resistive film, is positioned at a pair of overlying electrode at two ends, the left and right sides of this resistive film and the protective finish that covers above-mentioned resistive film;
Step 2, on the end face of the left and right sides of above-mentioned insulated substrate, with the formation side electrode that overlying electrode electrically conducts, described side electrode partly covers overlying electrode and protective finish;
Step 3 forms the coat of metal on the side electrode surface.
8. manufacture method as claimed in claim 7 is characterized in that,
Comprise further in the described step 1 that the two ends, the left and right sides below insulated substrate are formed with a pair of lower electrodes;
Comprise further in the step 2 that described lower electrodes electrically conducts with the side electrode of respective side and is connected, and side electrode partly covers lower electrodes;
Comprise further in the step 3 that the described coat of metal extends the expose portion that covers lower electrodes.
9. as claim 7 or 8 described manufacture methods, it is characterized in that described protective finish comprises that the inner protective layer that directly overlays above the resistive film and upper part thereof cover the external protection of overlying electrode.
10. as claim 7 or 8 described manufacture methods, it is characterized in that the described coat of metal comprises the nickel coating and the outer field tin coating of internal layer.
11. manufacture method as claimed in claim 9 is characterized in that, the total length L 1 of described external protection is:
L1＝L-2A
Wherein, L represents the length of insulated substrate, and A represents not the length of the overlying electrode that covered by external protection, and unit of measurement is a millimeter.
12. manufacture method as claimed in claim 9 is characterized in that, the length L 2 that described side electrode covers external protection is:
L2＝(L-L1)/2+B
Wherein, L represents the length of insulated substrate, and L1 represents the total length of external protection, and B represents that side electrode covers the length of external protection, and unit of measurement is a millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101633929A CN101197202A (en) | 2006-12-04 | 2006-12-04 | Chip resistor and method of producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101633929A CN101197202A (en) | 2006-12-04 | 2006-12-04 | Chip resistor and method of producing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101197202A true CN101197202A (en) | 2008-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101633929A Pending CN101197202A (en) | 2006-12-04 | 2006-12-04 | Chip resistor and method of producing the same |
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| CN (1) | CN101197202A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947779A (en) * | 2015-01-19 | 2018-04-20 | 广东欧珀移动通信有限公司 | Touch control key strcture, electronic equipment and a kind of touch control key strcture manufacture method |
| JP2020150273A (en) * | 2015-02-19 | 2020-09-17 | ローム株式会社 | Chip resistor, and manufacturing method of chip resistor |
-
2006
- 2006-12-04 CN CNA2006101633929A patent/CN101197202A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947779A (en) * | 2015-01-19 | 2018-04-20 | 广东欧珀移动通信有限公司 | Touch control key strcture, electronic equipment and a kind of touch control key strcture manufacture method |
| JP2020150273A (en) * | 2015-02-19 | 2020-09-17 | ローム株式会社 | Chip resistor, and manufacturing method of chip resistor |
| JP7093382B2 (en) | 2015-02-19 | 2022-06-29 | ローム株式会社 | Chip resistor |
| JP2022105204A (en) * | 2015-02-19 | 2022-07-12 | ローム株式会社 | Chip resistor |
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Open date: 20080611 |