CN101197185A - Prerecording three-dimensional memory module and its broadcasting system - Google Patents
Prerecording three-dimensional memory module and its broadcasting system Download PDFInfo
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- CN101197185A CN101197185A CNA2006100224440A CN200610022444A CN101197185A CN 101197185 A CN101197185 A CN 101197185A CN A2006100224440 A CNA2006100224440 A CN A2006100224440A CN 200610022444 A CN200610022444 A CN 200610022444A CN 101197185 A CN101197185 A CN 101197185A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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Abstract
The invention provides a prerecorded three-dimensional storage module and a play system thereof. The invention adopts the three-dimensional storage module to store multi-media database. Based on that the three-dimensional storage module of a three-dimensional storage has super large capacity, the invention is particularly suitable for storing film and TV database. The three-dimensional storage module had better be issued through adopting the prerecording form. Meanwhile, in order to protect benefits of data dealers and users, the access of prerecorded database is needed to be controlled.
Description
Technical field
The present invention relates to electronic system, or rather, relate to multimedia storer and Play System thereof.
Background technology
Nonvolatile memory (NVM) is the important carrier of storage multimedia document.Three-dimensional storage (3-dimensionalmemory abbreviates 3D-M as, referring to Chinese patent 98119572.5 etc.) as a kind of NVM with vast capacity, is paid attention to by industry day by day.In three-dimensional storage, a plurality of accumulation layers are stacked mutually on perpendicular to the direction of substrate.Some three-dimensional storages that have market potential comprise three-dimensional electric programming storer (3-dimensional electrically programmablememory, abbreviate 3D-EPM as) and three-dimensional masking film program storer (3-dimensional mask-programmablememory abbreviates 3D-MPM as).
Fig. 1 is the sectional view of a kind of 3D-EPM 0E.This embodiment contains 2 accumulation layer ML 100, ML 200, and they are separated by interlayer medium 27.Each accumulation layer (as ML 100) contains many word lines (as 20a ') and bit line (as 30a, 30b).At word line and bit line infall one storage element (as 1a ' a, 1a ' b) is arranged, it contains diode film (as 3a ' a, 3a ' b) and anti-fuse film 25a.Anti-fuse film is in high resistance state when not programming; After programming, be in low resistance state, at this moment the state of storage element overturns.
Fig. 2 is the sectional view of a kind of 3D-MPM 0M.This embodiment contains 4 accumulation layer ML 100-ML 400.Each accumulation layer (as ML 100) contains many word lines (as 20a) and bit line (as 30a, 30b).At word line and bit line infall one storage element (as 1aa, 1ab) is arranged, it contains diode film (as 3aa, 3ab).Simultaneously, based on its canned data, storage element can also contain deielectric-coating (as 23a) is set: as storage element 1aa deielectric-coating 23a is set, obstructed electric current between word line 30a and the bit line 20a, its presentation logic " 0 "; Storage element 1ab does not have the deielectric-coating of setting, galvanization between word line 30b and the bit line 20a, its presentation logic " 1 ".Reduce cost and storage density in order further to improve, this embodiment has adopted new technologies and methods, comprises that nF opening (referring to Chinese patent application 200610153561.0), N ary mask programming (referring to Chinese patent application 200610100860.8), interlayer intersect (referring to Chinese patent application 02113333.6) and mixed layer structure (referring to the Chinese patent application of being submitted on Dec 1st, 2006 by same inventor " hybrid layer three-dimensional storage ").
The memory capacity of the more various NVM chips of table 1 (Fig. 3) (here, "? " represent the difficult realization of this capacity).In 2006, a 140mm
2The memory capacity of flash chip can reach 2GB, i.e. 16Gb; The 3D-EPM chip of similar size can be stored～3x information doubly, promptly～and 6GB; Compare with them, the capacity of 3D-MPM chip is bigger, can reach～16GB.To the year two thousand twenty, these numerals will be more surprising, can reach～128GB as the capacity of a 3D-MPM chip.
Main application of NVM is the storage multimedia database, comprises written historical materials storehouse (as book, dictionary), library music (as song, melody) and television data storehouse (as film, TV programme, serial, video-game etc.).As can be seen from Table 1, existing NVM chip is enough to store general written historical materials storehouse and library music.But for the television data storehouse, situation is different.The required storage space in television data storehouse is much larger than written historical materials storehouse and library music.Table 2 (Fig. 4) has been listed the film number and the storage demand thereof of a few class films in the movielink movie library (http://www.movielink.com).In all kinds of films, minimum film number is 206 (documentary films), the storage space of its needs～100GB.Existing NVM chip also can't reach this requirement far away.In order to overcome this difficulty, the present invention proposes a kind of prerecording three-dimensional memory module and Play System thereof.
Summary of the invention
Fundamental purpose of the present invention provides a kind of prerecording three-dimensional memory module and the Play System thereof that can store multimedia database.
Another object of the present invention provides a kind of prerecording three-dimensional memory module and the Play System thereof that can store the television data storehouse.
According to these and other purpose, the present invention proposes a kind of prerecording three-dimensional memory module and Play System thereof.It adopts three-dimensional memory module to store multimedia database.Here, three-dimensional memory module (3-dimensional memory module abbreviates 3D-MM as, referring to Chinese patent application 200610128742.8) contains a plurality of storage chips that pile up mutually.3D-MM based on 3D-M (abbreviates (3D) as
2-MM) having the capacity of super large, its especially is fit to storage television data storehouse.The inventor thinks, three-dimensional memory module preferably adopts the form distribution of prerecording, promptly multimedia database before the three-dimensional memory module distribution by typing in advance.Use prerecording three-dimensional memory module can guarantee that the mobile subscriber can visit its required data whenever and wherever possible.
Store great mass of data in the prerecording three-dimensional memory module, to the data dealer, especially the copyright owner has suitable risk to so a large amount of data centralized stores in a storer.In order to protect data dealer's interests, need the visit of 3D-MM data bank is controlled.On the other hand, if the user just can be directly after obtaining prerecording three-dimensional memory module access profile storehouse unrestrictedly, he need pay a large amount of copyright royalties so, it is very expensive that three-dimensional memory module will become.In fact, each user only can be interested in the part information in the data bank, and only should be these data payment usage charges.In order to protect user's interests, also need the visit of 3D-MM data bank is controlled.Correspondingly, prerecording three-dimensional memory module and Play System thereof also need to have access control function.
In sum, the present invention proposes a kind of prerecording three-dimensional memory module and Play System thereof, it is characterized in that containing: a three-dimensional memory module (100), this three-dimensional memory module contains a plurality of storage chips that pile up mutually (110a-110d), pre-record at least one storage chip be shaped on a plurality of information papers (C1, C2...Cn); With a player (200), this player contains the access control block (ACB) (220) that a control conducts interviews to described data.
The invention allows for a kind of user control pre-recorded three-dimensional memory module, the user can only read out in the data that is authorized in the prerecording three-dimensional memory module, it is characterized in that containing: a plurality of storage chips that pile up mutually (130a-130c), pre-record at least one storage chip be shaped on a plurality of information papers (C1, C2...Cn); The access control block (ACB) (150) that described data is conducted interviews with a control.
Description of drawings
Fig. 1 represents a kind of three-dimensional electric programming storer.
Fig. 2 represents a kind of three-dimensional masking film program storer.
The memory capacity of the more various nonvolatile memories of Fig. 3 (table 1).
Fig. 4 (table 2) has listed the film number and the storage demand thereof of a few class films in the movielink movie library.
The memory capacity of the more various three-dimensional memory modules of Fig. 5 (table 3).
Fig. 6 represents a kind of prerecording three-dimensional memory module and Play System thereof.
Fig. 7 represents a kind of three-dimensional memory module.
Fig. 8 is the circuit function block diagram of a kind of prerecording three-dimensional memory module and Play System thereof.
Fig. 9 represents a kind of user control pre-recorded three-dimensional memory module.
Figure 10 is a kind of circuit function block diagram of user control pre-recorded three-dimensional memory module.
Figure 11 is the circuit function block diagram of another kind of user control pre-recorded three-dimensional memory module.
Figure 12 represents the use pattern of a kind of prerecording three-dimensional memory module and Play System thereof.
Figure 13 represents that a kind of user supplements process with money.
Figure 14 represents a kind of user's use.
Figure 15 represents a kind of method of selecting access module.
User interface when Figure 16 A-Figure 16 C represents the multiple choices access module.
Embodiment
The present invention proposes a kind of prerecording three-dimensional memory module and Play System thereof.It adopts three-dimensional memory module to store multimedia database.Here, three-dimensional memory module (3-dimensional memory module abbreviates 3D-MM as, referring to Chinese patent application 200610128742.8) contains a plurality of storage chips that pile up mutually.3D-MM based on 3D-M (abbreviates (3D) as
2-MM) having vast capacity, it especially is fit to storage television data storehouse.Shown in table 3 (Fig. 5), in 2006, a 3D-MM who contains 4 3D-MPM chips (abbreviated (3D) as
2-MPMM) capacity can reach～64GB, and it can store one and contain～the written historical materials storehouse of 64000 books, one contain～library music of 16000 first songs or one contains～the television data storehouse of 130 films.To the year two thousand twenty, (3D) who contains 8 chips
2-MPMM capacity can arrive～1TB, it can store one and contain～80000 books ,～30000 first songs and～data bank of 1600 films, this is enough to satisfy most demands of mobile subscriber.The inventor thinks, three-dimensional memory module preferably adopts the form distribution of prerecording, promptly multimedia database before the three-dimensional memory module distribution by typing in advance.Use prerecording three-dimensional memory module can guarantee that the mobile subscriber can visit its required data whenever and wherever possible.
Store great mass of data in the prerecording three-dimensional memory module, to the data dealer, especially the copyright owner has suitable risk to so a large amount of data centralized stores in a storer.In order to protect data dealer's interests, need the visit of 3D-MM data bank is controlled.On the other hand, if the user just can be directly after obtaining prerecording three-dimensional memory module access profile storehouse unrestrictedly, he need pay a large amount of copyright royalties so, it is very expensive that three-dimensional memory module will become.In fact, each user only can be interested in the part information in the data bank, and only should be these data payment usage charges.In order to protect user's interests, also need the visit of 3D-MM data bank is controlled.Correspondingly, prerecording three-dimensional memory module and Play System thereof also need to have access control function.
Fig. 6 represents a kind of prerecording three-dimensional memory module and Play System 300 thereof.It contains a prerecording three-dimensional memory module 100 and a player 200.Pre-record on the three-dimensional memory module 100 and be shaped on multimedia database, comprise data C1, C2...Cn.In order to protect copyright, data is encrypted.Player 200 contains access control block (ACB) 220 (dotted line represents that 220 are positioned at 200), and its control is to the visit of data bank.Have only the visit to authorizing, access control block (ACB) just can be sent corresponding key.
Fig. 7 is a kind of sectional view of three-dimensional memory module 100.It is a two-sided three-dimensional memory module, and promptly chipset 110 and 120 lays respectively at the two sides of substrate 111.Each chipset (as 110) contains 4 storage chip 110a-110d, and they can be flash chip, or three-dimensional memory chip.Chip in chipset 110 can be similar, and 110a-110d is three-dimensional memory chip as chip; Also can be mixed type, be flash chip as chip 110a, and chip 110b-110d is a three-dimensional memory chip.Chip 110a-110d in the chipset 110 piles up mutually and is bonded together by binder 117.Each chip (as 110b) can expose the contact mat (as 113a) of lower chip 110a like this with respect to following chip 110a edge-x direction displacement.By lead-in wire 115a and 115b, chip 110a can transmit data with substrate 111 and chip 110b.Chipset 110,120 is loaded in protectiveness encapsulation 140 (as the moulding compounds) at last.Other embodiment of three-dimensional memory module 100 can be with reference to Chinese patent application 200610128742.8.
Fig. 8 is the circuit function block diagram of a kind of prerecording three-dimensional memory module and Play System thereof.Prerecording three-dimensional memory module 100 has the information paper C1 of a plurality of encryptions, C2...Cn.Player 200 contains decipher 211, demoder 213, output 202, microprocessor 222, storer 224 and communication interface 219.Wherein, microprocessor 222, storer 224 and decipher 211 are formed access control block (ACB) 220.Information such as storer 224 storage subscriber identity codes, user account remaining sum, the usage charges of various access modules, the various access modules of having selected, key.According to the information in the storer 224, whether microprocessor 222 decision users can visit a file, then its key are delivered to decipher 211 as allowing.Data after the deciphering is delivered to output 202 by demoder 213.Communication interface 219 provides the communication between player 200 and the data servomechanism, to realize that user account is supplemented with money (referring to Figure 13).
Fig. 9 represents a kind of user control pre-recorded three-dimensional memory module 100.In this embodiment, the user can only read out in the data that is authorized in the prerecording three-dimensional memory module.It contains a groups of memory chips 130, comprises chip 130a-130c.Except that groups of memory chips 130, it also contains an access control block (ACB) 150.In this embodiment, access control block (ACB) is an access control chip, and it is by lead-in wire 115 and groups of memory chips 130 transmission data.The copyright of access control block (ACB) 150 protection data bank, its status and important.In order to prevent that the bootlegger from invading, access control block (ACB) 150 can not gently be exposed to the bootlegger.A kind of possible embodiment is that near small part groups of memory chips 130 is stacked and be bonded in access control chip 150 tops, or access control chip 150 is placed in the middle of the groups of memory chips 130.Like this, the bootlegger must at first destroy the data bank in the groups of memory chips 130 when invading, and this is against the original intention of piracy.
Figure 10 is a kind of circuit function block diagram of user control pre-recorded three-dimensional memory module 100, and it contains a groups of memory chips 130 and an access control block (ACB) 150.Groups of memory chips 130 stores the information paper C1 of a plurality of encryptions, C2...Cn.Access control block (ACB) 150 contains microprocessor 152, storer 154 and decipher 151, and the access control block (ACB) 220 among its function and Fig. 8 is similar, promptly controls the visit to groups of memory chips 130.
Figure 11 is the circuit function block diagram of another kind of user control pre-recorded three-dimensional memory module 100.Compare with Figure 10, its access control block (ACB) 150 also has playing function.Particularly, it also contains demoder 153 and digital to analog converter (D/A) 155.Its output 163 contains simulating signal.Because simulating signal is difficult to be duplicated by " number ", so this three-dimensional memory module 100 can provide stronger copyright protection.
Figure 12 represents the use pattern of a kind of prerecording three-dimensional memory module and Play System 300 thereof.Because player 200 can be controlled the visit to three-dimensional memory module 100, the price of hardware (as three-dimensional memory module 100) can be lower.Under certain condition, data dealer even can be with its free of cost (step 40).The user allows to a certain extent three-dimensional memory module 100 on probation, as one section song of audition or watch one section film (step 50).Supplement with money in the process the user, the user at first pays the bill, and the dealer supplements (step 60) with money to user account then.In user's use, the usage charges of its selected access module are deducted (step 70) from user account.Repeating step 50-70, user can visit all his interested data.Notice that step 50-70 not necessarily need carry out in proper order according to this, can use earlier, pay again as the user.After the user used certain hour, manufacturer can be by being pumped into the cost (step 80) of regaining three-dimensional memory module 100 to usage charges.Because the user can be to obtain hardware at a low price, the use door of Play System is greatly diminished.
Figure 13 represents that a kind of user supplements process 60 with money.At first, user capture data servomechanism (step 61).Servomechanism is generally controlled by the data dealer.It carries out authentication (step 63) to the user earlier.Then, the user can use payments (step 65) such as credit card, mobile phone card.Afterwards, servomechanism is sent a charge code.In case this charge code is input in the player 200 (step 67), then p that the user pays the bill just is injected towards among the user account remaining sum b, i.e. b=b+p (step 69).
Figure 14 represents a kind of user's use 70.At first, the user selects use pattern (step 71).The details of selection use pattern can be referring to Figure 15-Figure 16 C.Each use pattern all has corresponding usage charges v (referring to Figure 16 A-Figure 16 C).Then, calculate behind deduction usage charges v, whether user account remaining sum b is also greater than minimal balance b
Limit, i.e. b-v＞b
Limit(step 73).If greater than, then from user account remaining sum b deduction usage charges v, i.e. b=b-v (step 77), and authorize the user required access right (step 79).If b is not enough for the user account remaining sum, then denied access (step 75).
In Figure 12-Figure 14, user account remaining sum b is stored in user side, promptly in the player 200.Only when supplementing with money, player 200 just needs the access profile servomechanism.In use, player 200 can fully independently determine whether to authorize user capture power, does not need the access profile servomechanism, can further facilitate the mobile subscriber like this.
Figure 15 represents the method for a kind of selection access module (step 71).It is divided into two steps: first step is a selection data scope (step 92), and second step is to select restrict access (step 94).The data scope can be single file, file group or all data.Restrict access then can be unrestricted (promptly can the selected file of random access), number of times restriction (promptly visit selected file and can not surpass certain number of times), period restriction (promptly can only visit selected file in a certain amount of time) and the period-number of times limits (promptly visit selected file in a certain amount of time and can not surpass certain number of times) etc.
User interface when Figure 16 A-Figure 16 C represents the multiple choices access module.User interface when Figure 16 A represents to select single file access to limit.In this embodiment, the user selects the restrict access of file C1.When he clicks " number of times " icon, " 1 time (1 point) ", " 2 times (2 point) ", " 10 times (6 point) " 3 selections appear:.Their expressions:, need 1 usage charges as selecting access file C11 time; Then need 2 usage charges 2 times; Then need 6 usage charges 10 times.User interface when similarly, Figure 16 B represents the restriction of select File group access.In this embodiment, the user selects the restrict access of the G1 of file group.When he clicks " period " icon, " 1 month (30 point) ", " 2 months (50 point) " 2 selections appear:.Their expressions: as be chosen in 1 month data among the G1 of random access group, need 30 usage charges; As in 2 months, then needing 50 usage charges.User interface when Figure 16 C represents to select all data restrict access.In this embodiment, when the user clicks " period-number of times " icon, " 1 month 20 times (20 point) ", " 2 months 40 times (35 point) " 2 selections appear:.Their expressions: as be chosen in 1 month all data of visit 20 times, need 20 usage charges; As in 2 months, visiting all data 40 times, then need 35 usage charges.
Though above instructions has specifically described examples more of the present invention, those skilled in the art should understand, under prerequisite not away from the spirit and scope of the present invention, can change form of the present invention and details, as except chip-stacked (die stacking), three-dimensional memory module can also use encapsulation stacking (package stacking).This does not hinder them to use spirit of the present invention.Therefore, except the spirit according to additional claims, the present invention should not be subjected to any restriction.
Claims (10)
1. prerecording three-dimensional memory module and Play System (300) thereof is characterized in that containing:
A three-dimensional memory module (100), this three-dimensional memory module contain a plurality of storage chips that pile up mutually (110a, 110b...), pre-record at least one storage chip be shaped on a plurality of information papers (C1, C2...Cn); With a player (200), this player contains the access control block (ACB) (220) that a control conducts interviews to described data.
2. a user control pre-recorded three-dimensional memory module (100) is characterized in that containing:
A plurality of storage chips that pile up mutually (130a, 130b...), pre-record at least one storage chip be shaped on a plurality of information papers (C1, C2...Cn); With
The access control block (ACB) (150) that one control conducts interviews to described data.
3. according to claim 1 and 2 described prerecording three-dimensional memory module and Play Systems thereof, its feature also is: at least one storage chip is three-dimensional memory chip or flash memory.
4. prerecording three-dimensional memory module according to claim 3 and Play System thereof, its feature also is: described three-dimensional storage is three-dimensional electric programming storer or three-dimensional masking film program storer.
5. according to claim 1 and 2 described prerecording three-dimensional memory module and Play Systems thereof, its feature also is: described a plurality of storage chips are different kinds of chips.
6. user control pre-recorded three-dimensional memory module according to claim 2, its feature also are to contain: one is positioned at the playing function piece of this three-dimensional memory module, and the output of this playing function piece contains simulating signal.
7. user control pre-recorded three-dimensional memory module according to claim 2, its feature also is: this access control block (ACB) is an access control chip, this access control chip is positioned at described centre or below of piling up storage chip mutually.
8. according to claim 1 and 2 described prerecording three-dimensional memory module and Play Systems thereof, its feature also is to contain:
One contains first encapsulation of at least one described storage chip; With
One contains second encapsulation of another described storage chip at least, and this second encapsulation stacking is in this first encapsulation top.
9. according to claim 1 and 2 described prerecording three-dimensional memory module and Play Systems thereof, its feature also is: described information paper is at least a in written historical materials, music information and the television data.
10. according to claim 1 and 2 described prerecording three-dimensional memory module and Play Systems thereof, its feature also is: at least one storage chip is a three-dimensional memory chip, and this three-dimensional storage chip has television data.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100224440A CN101197185A (en) | 2006-12-08 | 2006-12-08 | Prerecording three-dimensional memory module and its broadcasting system |
| US11/736,777 US7952903B2 (en) | 2006-08-30 | 2007-04-18 | Multimedia three-dimensional memory module (M3DMM) system |
| US12/043,128 US7952904B2 (en) | 2006-08-30 | 2008-03-05 | Three-dimensional memory-based three-dimensional memory module |
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| CNA2006100224440A CN101197185A (en) | 2006-12-08 | 2006-12-08 | Prerecording three-dimensional memory module and its broadcasting system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969029A (en) * | 2011-09-01 | 2013-03-13 | 成都海存艾匹科技有限公司 | Field-repair system and method |
| CN109417075A (en) * | 2018-09-20 | 2019-03-01 | 长江存储科技有限责任公司 | Multiple pileup layer three-dimensional storage part |
-
2006
- 2006-12-08 CN CNA2006100224440A patent/CN101197185A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969029A (en) * | 2011-09-01 | 2013-03-13 | 成都海存艾匹科技有限公司 | Field-repair system and method |
| CN109417075A (en) * | 2018-09-20 | 2019-03-01 | 长江存储科技有限责任公司 | Multiple pileup layer three-dimensional storage part |
| US10600781B1 (en) | 2018-09-20 | 2020-03-24 | Yangtze Memory Technologies, Co., Ltd. | Multi-stack three-dimensional memory devices |
| CN111415941A (en) * | 2018-09-20 | 2020-07-14 | 长江存储科技有限责任公司 | Multi-stacked-layer three-dimensional memory device |
| CN111415941B (en) * | 2018-09-20 | 2021-07-30 | 长江存储科技有限责任公司 | Multi-stacked-layer three-dimensional memory device |
| US11145645B2 (en) | 2018-09-20 | 2021-10-12 | Yangtze Memory Technologies Co., Ltd. | Multi-stack three-dimensional memory devices |
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Application publication date: 20080611 |