CN101190503A - Method for finishing resin binding agent diamond abrasive wheel by combining laser and machinery - Google Patents
Method for finishing resin binding agent diamond abrasive wheel by combining laser and machinery Download PDFInfo
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- CN101190503A CN101190503A CNA2006101367831A CN200610136783A CN101190503A CN 101190503 A CN101190503 A CN 101190503A CN A2006101367831 A CNA2006101367831 A CN A2006101367831A CN 200610136783 A CN200610136783 A CN 200610136783A CN 101190503 A CN101190503 A CN 101190503A
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Abstract
The invention provides a laser and mechanical composition finishing resin binder diamond grinding wheel method, comprising: adopting high power density pulse laser, focusing a laser beam by focusing lens and irradiating vertically to the grinding surface of the grinding wheel, rotating a grinding wheel, measuring the fluctuation of the grinding wheel round, adjusting the focus position of the laser to lead the focus to be dropped at the maximum position of the fluctuation of the round, adjusting the parameter of the laser in order to lead the maximum position of the fluctuation of the grinding wheel round to reach the value, axially and repeatedly feeding and rotating the grinding wheel till diamond grinding grain part close to the maximum position of the fluctuation round is wholly removed or partly and slightly removed or partly lost with holding force owning to the removal of the bonder through a plurality of finishing, shaping the grinding wheel by using a single-crystal diamond pen or a carborundum idler wheel with definite tip, removing the grinding grain which loses the holding force and the grinding grain metamorphosing layer burned by laser, and repeatedly carrying out the composition processes till required round fluctuation and topography and geomorphology are reached. The invention obviously improves the finishing efficiency of the grinding wheel and leads the cutting surface of the grinding wheel to obtain excellent topography and geomorphology.
Description
Technical field
The present invention relates to resinoid bond diamond grinding wheel dressing method, further be meant the method that adopts laser and mechanical compound finishing and realize the precision truing and the dressing of resinoid bond skive.
Background technology
The resinoid bond skive has unusual good grinding performance, has wide practical use in grinding, accurate ultra grinding, plunge grinding, high efficient grinding and the grinding automation of difficult-to-machine material.In recent years, because correlation techniques such as emery wheel manufacturing, numerically-controlled precise grinding machine are broken through, this emery wheel is used sharply to be increased.Because this emery wheel self character, repair very difficult, dressing accuracy cannot say for sure the card, make grinding efficiency, precision, quality be a greater impact, having had a strong impact on giving full play to of its good grinding performance, is the key technology difficult problem in its bottleneck problem further applied and the numerically-controlled precise grinding machine.
The finishing of resinoid bond skive is divided into shaping and dressing two procedures usually: shaping is emery wheel to be carried out trace remove, and makes emery wheel reach desired geometrical precision; Dressing is by removing the bond between the emery wheel abrasive particle, make abrasive particle protrude the bond certain height, form cutting edge, producing enough chip spaces simultaneously.The height of emery wheel dressing precision has determined the dimensional accuracy of institute's processing work.
Diamond is a hardest present material.Traditional be difficult to adapt to the resinoid bond diamond grinding wheel dressing based on the machine finish method of power fully, the dressing accuracy of the above emery wheel of micro powder grade is difficult to reach requirement.For this reason, seek a kind of suitable resinoid bond skive can shaping again can dressing new method, become the target and the focus of various countries' scholar's research.
Summary of the invention
The problem to be solved in the present invention is, the extremely difficult problem of finishing at resinoid bond skive in the prior art, the method of a kind of laser and mechanical finishing resin binding agent diamond abrasive wheel by combining is proposed, this method can realize precision truing to described emery wheel, simultaneously can carry out dressing again, thereby obtain good topography and geomorphology; Satisfy requirement efficient, accurate grinding.
Technical scheme of the present invention is to adopt focusing back power density to reach and remove diamond power density threshold value 3 * 10
8W/cm
2Above high power density pulse laser, implement following processing step:
(1) at the non-formed grinding wheel of resinoid bond diamond, laser beam is focused on vertical wheel grinding face irradiation by condenser lens;
(2) revolving wheel is measured the emery wheel circle by amesdial and is beated, and adjusts focal position of laser, makes focus drop on the round maximum of beating;
(3) adjust laser parameter, make the emery wheel circle maximum of beating reach described removal diamond power density threshold value, thereby remove diamond and resinoid bond;
(4) described emery wheel reciprocating feed vertically, emery wheel is done gyration simultaneously, ablate through several times, near its circle is beated maximum the diamond abrasive grain part by whole peel off, part by trace remove, part loses hold because bond removes;
(5) then, use single-crystal diamond pen or the described emery wheel of carborundum pair of rollers to carry out shaping, remove and lose the abrasive particle of hold and by the abrasive particle metamorphic layer of laser ablation with clear and definite point of a knife;
(6) repeat the recombination process that above laser reconditioning and Mechanical Method shaping hocket, beat and topography and geomorphology until reaching required circle.
Below the present invention made further specify.
Among the present invention, the continuous output mean power of described laser can be 0-60W, repetition rate 0.5kHz-10kHz, pulsewidth 160ns-500ns; Described grinding wheel speed is 1-2m/s;
The focal length of described laser is 15mm-30mm, the spot diameter 0.20mm-0.22mm behind the pulse laser focusing.
In the technical process of the present invention, measure the emery wheel circle by amesdial and beat, adjust focal position of laser, make focus drop on the round maximum (laser ablation power maximum herein) of beating; Reduce along with beating, radially laser focusing begins out of focus, makes power density reduce, less than ablation power density threshold value.So only near the maximum of beating, just can remove diamond, each pulse removal amount is at micron order, adjust suitable kinematic parameter, make the ablation pit tangent or overlap, through after the several times revolutions, circle beat near the maximum diamond abrasive grain part by whole peel off, part by trace remove, part loses hold because bond removes.
Reduce along with beating with emery wheel during the emery wheel revolution, laser is radiated at the wheel face hot spot and increases gradually, power density can reduce gradually, then adjust laser parameter, as (power density are subjected to these parameter influences) such as mean power, repetition rate (pulsewidth and peak power), defocusing amounts, the feasible maximum of beating reaches ablation power density threshold value, thereby removes diamond and resinoid bond.
Know-why of the present invention is, in order to overcome the defective of prior art, by theoretical research and a large amount of test optimization, set up a kind of compound dressing method, be at first to avoid " confronting the tough with toughnees " in the process, employing is repaired in advance based on the method for the laser ablation retrofit of microcell heat effect, adopts the Mechanical Method shaping with clear and definite point of a knife then.
The method of above-mentioned laser of the present invention and mechanical finishing resin binding agent diamond abrasive wheel by combining has significantly improved resinoid bond diamond grinding wheel dressing efficient and has made the wheel grinding face obtain good topography and geomorphology than prior art; Satisfy requirement efficient, accurate grinding.Fig. 1 is the surface topography of observing before the resinoid bond diamond grinding wheel dressing, and surperficial abrasive particle does not protrude; Fig. 2 is the surface topography after the finishing in 24 hours of carborundum roller, and the circle runout error only is reduced to 25 μ m from 50 μ m, and surface topography is poor; Fig. 3 is 3 hours surface topography of composite algorithm finishing, and the circle runout error is reduced to 5 μ m from 50 μ m, and surface topography is good.
Description of drawings
Fig. 1 is the surface topography of observing before the crushing;
Fig. 2 is the surface topography of carborundum roller finishing;
Fig. 3 is the surface topography of composite algorithm finishing;
Fig. 4 is a kind of embodiment frock schematic diagram of implementing the inventive method, wherein:
1-high power density pulse laser, 2-condenser lens, 3-resinoid bond skive, 4-single-point diamond pen or SiC roller, 5-grinding machine.
The specific embodiment
Fig. 4 is a kind of embodiment of laser of the present invention and mechanical finishing resin binding agent diamond abrasive wheel by combining method.Wherein:
High power density pulse laser 1 adopts the power density threshold value can reach 3 * 10
8W/cm
2Acousto-optic Q modulation YAG pulse laser, export mean power 0-60W continuously, repetition rate 0.5kHz-10kHz, pulsewidth 160ns-500ns;
The focal length of condenser lens 2 is 30mm, the spot diameter 0.22mm behind the pulse laser focusing.
Measure the emery wheel circle with amesdial and beat, write down the highest place of beating, if new emery wheel, circle is beated and is often beated greater than 0.1mm; Open laser instrument output small-power pulse laser, regulate grinding machine 5, rotate emery wheel 3, transfer, make focus drop on the highest point of beating with the thin sheet of metal examination; Increase laser power gradually, reach and remove diamond threshold value 3 * 10
8W/cm
2, for making diamond ablation metamorphic layer few, should adopt low pulse frequency, narrow pulsewidth; Emery wheel is feeding vertically, through several times back and forth after the finishing, along near the diamond abrasive grain part peak by whole peel off, part by trace remove, part loses hold because bond removes; Then adopt single-crystal diamond pen 4 or the shaping of carborundum roller; After the part diamond abrasive grain of waiting to lose hold comes off, measure the emery wheel circle with amesdial and beat, if reach requirement then finish.Whether detect topography and geomorphology more passable, if need further to remove bond, then turn down power density and remove below the power density threshold value to diamond abrasive grain, resinoid bond removal power density threshold value is above, and (it is 1.8 * 10 that resinoid bond is removed the power density threshold value
5W/cm
2), carry out dressing, to reaching requirement.If circle is beated do not reach requirement then repeat laser shaping and dressing, Mechanical Method shaping process.
Claims (4)
1. the method for laser and mechanical finishing resin binding agent diamond abrasive wheel by combining is characterized in that, this method is,
Adopt focusing back power density to reach and remove diamond power density threshold value 3 * 10
8W/cm
2Above high power density pulse laser, implement following processing step:
(1) at the non-formed grinding wheel of resinoid bond diamond, laser beam is focused on vertical wheel grinding face irradiation by condenser lens;
(2) revolving wheel is measured the emery wheel circle by amesdial and is beated, and adjusts focal position of laser, makes focus drop on the round maximum of beating;
(3) adjust laser parameter, make the emery wheel circle maximum of beating reach described removal diamond power density threshold value, thereby remove diamond and resinoid bond;
(4) described emery wheel reciprocating feed vertically, emery wheel is done gyration simultaneously, ablate through several times, near its circle is beated maximum the diamond abrasive grain part by whole peel off, part by trace remove, part loses hold because bond removes;
(5) then, use single-crystal diamond pen or the described emery wheel of carborundum pair of rollers to carry out shaping, remove and lose the abrasive particle of hold and by the abrasive particle metamorphic layer of laser ablation with clear and definite point of a knife;
(6) repeat the recombination process that above laser reconditioning and Mechanical Method shaping hocket, beat and topography and geomorphology until reaching required circle.
2. according to the method for described laser of claim 1 and mechanical finishing resin binding agent diamond abrasive wheel by combining, it is characterized in that the continuous output mean power 0-60W of described laser, repetition rate 0.5kHz-10kHz, pulsewidth 160ns-500ns.
3. according to the method for described laser of claim 1 and mechanical finishing resin binding agent diamond abrasive wheel by combining, it is characterized in that grinding wheel speed is 1-2m/s.
4. according to the method for described laser of claim 1 and mechanical finishing resin binding agent diamond abrasive wheel by combining, it is characterized in that the focal length of described laser is 15mm-30mm, the spot diameter 0.20mm-0.22mm behind the pulse laser focusing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101367831A CN101190503A (en) | 2006-11-30 | 2006-11-30 | Method for finishing resin binding agent diamond abrasive wheel by combining laser and machinery |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101367831A CN101190503A (en) | 2006-11-30 | 2006-11-30 | Method for finishing resin binding agent diamond abrasive wheel by combining laser and machinery |
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| CN101190503A true CN101190503A (en) | 2008-06-04 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042468A (en) * | 2013-01-09 | 2013-04-17 | 湖南大学 | Method for roughly trimming diamond grinding wheel |
| CN103802024A (en) * | 2013-11-21 | 2014-05-21 | 湖南大学 | Method for trimming ultra-thin and ultra-hard material grinding wheel through double light beams |
| CN103878693A (en) * | 2013-11-21 | 2014-06-25 | 湖南大学 | Laser shaping device and method for electroplated superabrasive grinding wheels |
| CN108747824A (en) * | 2018-06-19 | 2018-11-06 | 湖南大学 | A kind of full-automatic compound finishing integrated control method of omnipotent abrasive wheel |
| CN108941715A (en) * | 2018-06-29 | 2018-12-07 | 南京航空航天大学 | A kind of preparation method of the micro- milling cutter of cvd diamond |
| EP3584035A1 (en) * | 2018-06-19 | 2019-12-25 | Hunan University | Universal automatic composite grinding wheel finisher |
| CN110757274A (en) * | 2019-11-05 | 2020-02-07 | 南通大学 | Method and device for laser-assisted grinding of end face of grinding wheel |
-
2006
- 2006-11-30 CN CNA2006101367831A patent/CN101190503A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042468A (en) * | 2013-01-09 | 2013-04-17 | 湖南大学 | Method for roughly trimming diamond grinding wheel |
| CN103802024A (en) * | 2013-11-21 | 2014-05-21 | 湖南大学 | Method for trimming ultra-thin and ultra-hard material grinding wheel through double light beams |
| CN103878693A (en) * | 2013-11-21 | 2014-06-25 | 湖南大学 | Laser shaping device and method for electroplated superabrasive grinding wheels |
| CN103878693B (en) * | 2013-11-21 | 2016-08-17 | 湖南大学 | A kind of plating super-abrasive grinding wheel laser shaping Apparatus and method for |
| CN103802024B (en) * | 2013-11-21 | 2016-09-28 | 湖南大学 | A kind of Apparatus and method for using dual-beam to repair ultra-thin extra hard material grinding wheel |
| CN108747824A (en) * | 2018-06-19 | 2018-11-06 | 湖南大学 | A kind of full-automatic compound finishing integrated control method of omnipotent abrasive wheel |
| EP3584035A1 (en) * | 2018-06-19 | 2019-12-25 | Hunan University | Universal automatic composite grinding wheel finisher |
| CN108747824B (en) * | 2018-06-19 | 2021-04-23 | 湖南大学 | Grinding wheel full-automatic composite finishing integrated control method |
| CN108941715A (en) * | 2018-06-29 | 2018-12-07 | 南京航空航天大学 | A kind of preparation method of the micro- milling cutter of cvd diamond |
| CN110757274A (en) * | 2019-11-05 | 2020-02-07 | 南通大学 | Method and device for laser-assisted grinding of end face of grinding wheel |
| CN110757274B (en) * | 2019-11-05 | 2022-05-27 | 南通大学 | Method and device for laser-assisted grinding of end face of grinding wheel |
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Open date: 20080604 |