CN101188904A - Circuit board assembly - Google Patents
Circuit board assembly Download PDFInfo
- Publication number
- CN101188904A CN101188904A CNA2007103010984A CN200710301098A CN101188904A CN 101188904 A CN101188904 A CN 101188904A CN A2007103010984 A CNA2007103010984 A CN A2007103010984A CN 200710301098 A CN200710301098 A CN 200710301098A CN 101188904 A CN101188904 A CN 101188904A
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- Prior art keywords
- circuit board
- board assembly
- coating
- assembly according
- heat
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to a circuit board assembly, which has a first surface and a second surface which is opposite to the first surface, and also comprises at least a base plate, a first lead structure and a coating layer. The first lead structure is formed on the first surface, and at least formed at a spreading coating area of the second surface, wherein, the coating layer has the characteristics of heat conduction and electric insulation, and is suitable for causing the heat to conduct outside from at least the base plate through the second surface, so as to improve the heat dissipation efficiency of the circuit board assembly.
Description
[technical field]
The present invention is about a kind of circuit board assembly, particularly a kind of LCD (lquid crystaldisplay, circuit board assembly LCD) of being used for.
[background technology]
LCD is a kind of display unit of full-color Display Technique, because have power saving, radiation is low, volume is little, advantage such as in light weight, on the monitor market, have suitable advantage, therefore at mobile phone, digital camera, personal digital assistant (personal digital assistant, PDA) and on the electronic product of tool display screen such as television set, can see the application of LCD, become the main flow of monitor market gradually.And because the liquid crystal of LCD itself can't be luminous, so extra light source need be provided, and after the optical filtering of the control of each picture element liquid crystal of process and colored filter, could last imaging.In general, this extra light source is existing backlight module.
Figure 1 shows that with the side schematic view of light-emitting diode as the backlight module 1 of light source, backlight module 1 is by at least one light-emitting diode 10, one printed circuit board (PCB) 11, one Heat Conduction Material 12 and a backboard 13 are formed, light-emitting diode 10 is to be arranged on the printed circuit board (PCB) 11, with electric current and the various control signal of accepting to be provided by printed circuit board (PCB) 11, Heat Conduction Material 12 is positioned at printed circuit board (PCB) 11 belows, with heat by conducting to backboard 13 (being generally metal backing) on the printed circuit board (PCB) 11, to provide preferable cooling mechanism, figure for better color uniformity at light-emitting diode 10.
As shown in Figure 2, existing printed circuit board (PCB) 11 more comprises substrate 111 and conductive structure 113, and conductive structure 113 is formed at the upper and lower surface of substrate 111.On the conductive structure 113 of printed circuit board (PCB) 11, can be coated with the anti-welding coating 115 of last layer (being green or brown usually) usually again.When printed circuit board (PCB) 11 in downstream when welding assembling, anti-welding coating 115 helps to make scolding tin only to limit to tin sticky in the institute specific region, in addition, in follow-up welding and the manufacturing process for cleaning, but also the baffle face not contaminated, avoid oxidation, reach the solder shorts equivalent risk.
Yet; the material of existing anti-welding coating; system belongs to a kind of conductivity and heat conducting bar; though in the framework of existing backlight module 1; Shi Changhui applies Heat Conduction Material 12 in the bottom surface of printed circuit board (PCB) 11; but intercept because heat still can be subjected to the anti-welding coating 115 of printed circuit board (PCB) 11, make radiating effect have a greatly reduced quality.At last, will be poor because of the radiating effect of printed circuit board (PCB) 11, the light source uniformity that causes backlight module 1 to be provided reduces, and the LCD overall quality is descended.
In sum, how making circuit board under with the framework of light-emitting diode as the backlight module of light source, can not be subjected to the influence of anti-welding coating, possess preferable radiating effect, is the target that industry still need make great efforts to reach.
[summary of the invention]
A purpose of the present invention is to provide a kind of circuit board assembly that promotes radiating efficiency, be formed with the coating of characteristics such as having heat conduction concurrently and be electrically insulated on this circuit board assembly, replace existing anti-welding coating, taking into account under the prerequisite of insulation characterisitic, improve the shortcoming of circuit board assembly poor heat radiation simultaneously.For reaching above-mentioned purpose, the disclosed circuit board assembly of the present invention has a first surface and a second surface relative with this first surface, and comprise at least one substrate, one first conductor structure and a coating, wherein, first conductor structure is formed on this first surface, and this coating is formed at the dispensing area on this second surface at least.Because this coating characteristic that can have heat conduction concurrently and be electrically insulated, suitable with heat from this at least one substrate, outwards conduct via second surface.
Another object of the present invention is to provide in the LCD a kind of backlight module that promotes radiating efficiency, this backlight module comprises a backboard, a light source, reaches aforesaid circuit board assembly.By being formed with the coating that has heat conduction concurrently and be electrically insulated characteristic on the circuit board assembly, replace existing anti-welding coating, with heat from substrate, conduct to backboard via second surface, promote radiating efficiency, improve the shortcoming of existing backlight module poor heat radiation, and then increase the integrated light source performance of backlight module.
After consulting execution mode graphic and that describe subsequently, affiliated technical field has knows that usually the knowledgeable just can understand purpose of the present invention, and technological means of the present invention and enforcement aspect.
[description of drawings]
Fig. 1 is the schematic diagram of existing backlight module;
Fig. 2 is the schematic diagram of available circuit plate;
Fig. 3 is the schematic diagram of one embodiment of the invention;
Fig. 4 is the schematic diagram of another embodiment of the present invention; And
Fig. 5 is the schematic diagram of the circuit board assembly of further embodiment of this invention.
[embodiment]
The preferred embodiment of backlight module of the present invention below will be described.See also Fig. 3, changing under the framework of existing backlight module not significantly, backlight module 3 of the present invention comprises a light source 30, a circuit board assembly 31 and a backboard 32, wherein, circuit board assembly 31 is to be arranged on the backboard 32, and definable has first surface 3100 and a second surface 3101 relative with first surface 3100, wherein, second surface 3101 is towards backboard 32, and first surface 3100 can be provided with thereon for light source 30.In the present embodiment, light source 30 is a light-emitting diode, and circuit board assembly 31 is a printed circuit board (PCB), and backboard 32 is a metal backing (as the copper backboard).In detail, circuit board assembly 31 more comprises at least one substrate 310, one first conductor structure 311 and a coating 312.
In addition, circuit board assembly 31 more is formed with through hole 3102,3103, and is formed with conductive structure in it respectively.Detailed speech, be formed with conductive structure 3104 at through hole 3102, can be filled in the through hole 3102 or only be formed at the perisporium of through hole 3102; Similarly, in through hole 3103, be formed with conductive structure 3105.By this, heat can be conducted to second surface 3101 from first surface 3100, and then conduct to backboard 32 through coating 312.
More include weld pad (pad) 313 on the circuit board assembly 31,314, be layed in first through hole 3102 respectively, 3103 on the periphery of first surface 3100, because conductive structure 3104,31 05 is (as metal material: copper) made by a heat sink material, and be formed at through hole 3102, in 3103, and with weld pad 313,314 connect, and light source 30 comprises lead 300,301, respectively with weld pad 313,314 are connected, so by conductive structure 3104,3105 and coating 312, just can be effectively with the heat conduction of light source 30 to backboard 32, to improve the integral heat sink efficient of backlight module 3.
In addition, also may be formed with a conductor structure (scheming not shown) on the second surface 3101 of substrate 310, at this moment, this conductor structure system is formed at 312 of the dispensing area of second surface 3101 and coatings, make coating 312 can cover this conductor structure, to reach the effect that is electrically insulated.In addition, be formed at first conductor structure 311 on the first surface 3100 of circuit board assembly 31,, can infer ground though can utilize the anti-welding coating of existing insulation (scheming not shown) to apply, if using coating 312 of the present invention instead simultaneously is coated on first conductor structure 311, more can increase radiating efficiency.
Another preferred embodiment of backlight module of the present invention as shown in Figure 4, the backlight module of this embodiment 4 is roughly the same with the backlight module 3 of previous embodiment, is only described at different parts at this.In present embodiment, in order to strengthen heat radiation at light source 30, substrate 310 can more be formed with a through hole 40, is provided with a conductive structure 41 in through hole 40, for example is filled in the through hole 40.Light source 30 can see through a radiating block 42 and contact with conductive structure 41, and by this, directly the heat that light source 30 is produced conducts to this backboard 32, more to improve backlight module integral heat sink efficient via radiating block 42, conductive structure 41 and coating 312.
The another preferred embodiment of backlight module of the present invention as shown in Figure 5, in this embodiment, circuit board assembly 5 is multi-layer sheet structures, for example comprise a plurality of substrate 51a that stack in regular turn each other, 51b, 51c, described substrate 51a, 51b, has at least one electrode layer between the 51c, Figure 5 shows that a plurality of electrode layer 52a, 52b, 52c, 52d, present embodiment is except coating 53c is coated on the bottom surface (being the second surface of previous embodiment) of circuit board assembly 5, coating 53a, 53b more is coated on electrode layer 52a, 52b, 52c, between the 52d, so that being electrically insulated between electrode layer to be provided, and has heat conducting effect simultaneously.And the end face of circuit board assembly 5 (being the first surface of previous embodiment) has now the anti-welding coating except using, and more preferably, present embodiment also can utilize coating 50 to replace, and more can improve the integral heat sink efficient of backlight module.
By above-mentioned exposure, backlight module of the present invention and circuit board assembly have heat conduction concurrently by one and the coating of the characteristic that is electrically insulated, the heat that light source produced on the circuit board assembly is exported on the backboard, by backboard the thermal transpiration that light source produced on the circuit board assembly is gone out, and then reach the purpose of the integral heat sink efficient that promotes backlight module, solve the shortcoming of existing anti-welding lacquer poor heat radiation; And this coating also has downstream its scolding tin of when welding assembling, and only to limit to tin sticky baffle face in specified region, follow-up welding and manufacturing process for cleaning contaminated and avoid the function of oxidation and solder shorts.
The above embodiments only are used for exemplifying enforcement aspect of the present invention, and explain technical characterictic of the present invention, are not to be used for limiting category of the present invention.Any be familiar with this operator can unlabored change or the arrangement of the isotropism scope that all belongs to the present invention and advocated, interest field of the present invention should be as the criterion with claim.
Claims (10)
1. a circuit board assembly has a first surface and a second surface relative with this first surface, and this circuit board assembly more comprises:
At least one substrate;
One first conductor structure is formed on this first surface; And
One coating is formed at the dispensing area on this second surface at least, wherein, the characteristic that this coating has heat conduction concurrently and is electrically insulated, suitable with heat from this at least one substrate, outwards conduct via this second surface.
2. circuit board assembly according to claim 1 is characterized in that, the material of this coating is selected from following group:
Boron nitride, carborundum, aluminium nitride, beryllium nitride and combination thereof.
3. circuit board assembly according to claim 2 is characterized in that this circuit board assembly is formed with a through hole, and has a conductive structure, and this conductive structure is formed in this through hole, so that heat is conducted to this second surface from this first surface.
4. circuit board assembly according to claim 3 more comprises a weld pad, is layed in this through hole on the periphery on this first surface.
5. circuit board assembly according to claim 4 is characterized in that this conductive structure is made by a heat sink material, and is filled in this through hole, and is connected with this weld pad.
6. circuit board assembly according to claim 1 more comprises one second conductor structure, is formed at the dispensing area on this second surface, covers this second conductor structure in order to do this coating.
7. circuit board assembly according to claim 1 is characterized in that, this coating more is coated on this first conductor structure.
8. circuit board assembly according to claim 1 is characterized in that, more comprises a coatings, is coated at least on this first conductor structure.
9. circuit board assembly according to claim 1 is characterized in that, this at least one substrate comprises a plurality of substrates, stacks in regular turn each other.
10. circuit board assembly according to claim 9 is characterized in that, be provided with a plurality of electrode layers between described substrate, and this coating is coated on more between the described electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007103010984A CN101188904A (en) | 2007-12-17 | 2007-12-17 | Circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007103010984A CN101188904A (en) | 2007-12-17 | 2007-12-17 | Circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101188904A true CN101188904A (en) | 2008-05-28 |
Family
ID=39481016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007103010984A Pending CN101188904A (en) | 2007-12-17 | 2007-12-17 | Circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101188904A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683548A (en) * | 2011-03-18 | 2012-09-19 | 隆达电子股份有限公司 | Semiconductor assembly |
| CN102752957A (en) * | 2011-04-20 | 2012-10-24 | 乾坤科技股份有限公司 | Metal core printed circuit board and electronic packaging structure |
| CN103199068A (en) * | 2013-04-11 | 2013-07-10 | 余原生 | Integration circuit integrated structure |
| CN103488262A (en) * | 2012-06-07 | 2014-01-01 | 苹果公司 | Solid-state drive with passive heat transfer |
| CN104244660A (en) * | 2013-06-07 | 2014-12-24 | 奥特润株式会社 | Electronic control apparatus for vehicle |
| CN113905517A (en) * | 2020-07-06 | 2022-01-07 | 庆鼎精密电子（淮安）有限公司 | Circuit board, preparation method thereof and backlight plate |
-
2007
- 2007-12-17 CN CNA2007103010984A patent/CN101188904A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683548A (en) * | 2011-03-18 | 2012-09-19 | 隆达电子股份有限公司 | Semiconductor assembly |
| CN102752957A (en) * | 2011-04-20 | 2012-10-24 | 乾坤科技股份有限公司 | Metal core printed circuit board and electronic packaging structure |
| CN102752957B (en) * | 2011-04-20 | 2014-12-31 | 乾坤科技股份有限公司 | Metal core printed circuit board and electronic packaging structure |
| CN103488262A (en) * | 2012-06-07 | 2014-01-01 | 苹果公司 | Solid-state drive with passive heat transfer |
| US9408328B2 (en) | 2012-06-07 | 2016-08-02 | Apple Inc. | Solid-state drive with passive heat transfer |
| CN103488262B (en) * | 2012-06-07 | 2017-03-22 | 苹果公司 | Solid-state drive with passive heat transfer |
| CN103199068A (en) * | 2013-04-11 | 2013-07-10 | 余原生 | Integration circuit integrated structure |
| CN103199068B (en) * | 2013-04-11 | 2016-06-08 | 余原生 | The integrated structure of integrated circuit |
| CN104244660A (en) * | 2013-06-07 | 2014-12-24 | 奥特润株式会社 | Electronic control apparatus for vehicle |
| CN113905517A (en) * | 2020-07-06 | 2022-01-07 | 庆鼎精密电子（淮安）有限公司 | Circuit board, preparation method thereof and backlight plate |
| CN113905517B (en) * | 2020-07-06 | 2023-09-22 | 庆鼎精密电子（淮安）有限公司 | Circuit board, preparation method thereof and backlight plate |
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Application publication date: 20080528 |