CN101183555B - Electronic device and method for performing compensation operation to an electronic component - Google Patents
Electronic device and method for performing compensation operation to an electronic component Download PDFInfo
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- CN101183555B CN101183555B CN2007101881872A CN200710188187A CN101183555B CN 101183555 B CN101183555 B CN 101183555B CN 2007101881872 A CN2007101881872 A CN 2007101881872A CN 200710188187 A CN200710188187 A CN 200710188187A CN 101183555 B CN101183555 B CN 101183555B
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- compensation
- memory array
- electronic installation
- operating environment
- drive current
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000006698 induction Effects 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 31
- 230000005669 field effect Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000036413 temperature sense Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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Abstract
The invention discloses an electronic device and the corresponding method used for compensation operation for an electronic component; wherein, the electronic device comprises a control module, a drive module, an induction module, a compensation-control module, and a compensation-drive module. the control module is used for outputting one control signal according to one input signal; the drive module is coupled with the control module and the electronic component and used for providing drive current for the electronic component according to the control signal; the induction module is used for outputting at least one induction signal according to the changes of the operating environment, and the compensation control module is coupled on the induction module and used for outputting at least one compensation-control signal according to the at least one induction signal and the input signal; the compensation module is coupled with the electronic component and the compensation-control module and used for providing at least one compensation-drive current for the electronic component according to the at least one compensation-control signal.
Description
Technical field
What the present invention relates to is a kind of electronic installation that an electronic package is compensated operation that is used in, and refers to a kind of electronic installation that a memory array circuit (memory array circuit) is compensated operation that is used in especially.
Background technology
Please refer to Fig. 1, Fig. 1 illustrated is the rough schematic view to a memory array circuit (memory array circuit) 10 electronic installations that drive 100 of being used in according to prior art.As shown in Figure 1, electronic installation 100 includes a control module 110 and a driver element 120, wherein, control module 110 is to be used in according to an input signal Sa to export a controlling signal Sc, and driver element 120 is to be coupled in control module 110, memory array circuit 10, and between the operating voltage source Vo of memory array circuit 10, and be used in according to controlling signal Sc to provide a drive current to memory array circuit 10, yet, when the voltage quasi position of operating voltage source Vo or an operating environment temperature change of memory array circuit 10, described drive current also will change and probably cause the driving force (driving ability) of 100 pairs of memory array circuits 10 of electronic installation to change, further even can have a strong impact on the electrical performance (electric performance) of memory array circuit 10.For instance, when the voltage quasi position of operating voltage source Vo descends, drive current also can with decline, in addition, because the CMOS (Complementary Metal Oxide Semiconductor) field-effect transistor (CMOSFET) that is included in the memory array circuit 10 is when connecing surface temperature (junctiontemperature) reduction, its threshold voltage (threshold voltage) can improve, so under the situation of identical drive current, can cause transition comparatively to be not easy, therefore, when the operating environment temperature of memory array circuit 10 descended, driving memory array circuit 10 needed drive currents also will increase along with the operating environment decrease of temperature.
Summary of the invention
In view of this, one of purpose of the present invention is to provide a kind of electronic installation that a memory array circuit (memory array circuit) is compensated operation that is used in, to solve the above problems.
According to claim of the present invention, it is to disclose a kind of electronic installation that an electronic package is compensated operation that is used in, described electronic installation includes: a control module, a driver module, an induction module, a compensation control module and a compensation driver module, wherein, described control module is to be used in according to an input signal to export a controlling signal; Described driver module is to be coupled in described control module and described electronic package, and is used in according to described controlling signal to provide a drive current to described electronic package; Described induction module is to be used in according to the variation of an operating environment to export at least one sensor signal; Described compensation control module is to be coupled in described induction module, and is used in according to described at least one sensor signal and described input signal and exports at least one compensation controlling signal; And described compensation driver module is to be coupled in described electronic package and described compensation control module, and is used in according to described at least one compensation controlling signal to provide at least one compensation drive current to described electronic package.
According to claim of the present invention, it is that disclosing a kind of being used in compensates method of operating to an electronic package in addition, and described method includes: export a controlling signal according to an input signal; Come to provide a drive current according to described controlling signal to described electronic package; At least one sensor signal is exported in variation according to an operating environment; Export at least one compensation controlling signal according to described at least one sensor signal and described input signal; And the described at least one compensation controlling signal of foundation comes to provide at least one compensation drive current to described electronic package.
Description of drawings
Fig. 1 illustrated is the rough schematic view that is used in the electronic installation that a memory array circuit (memory arraycircuit) is driven according to prior art;
What Fig. 2 illustrated is according to being used in the rough schematic view that a memory array circuit is compensated the electronic installation of operation in one embodiment of the invention;
Fig. 3 illustrated is to summarize the present invention compensates an embodiment of method of operating to an electronic package (a for example memory array circuit) process flow diagram according to the function mode of the electronic installation of various embodiment of the present invention.
Description of reference numerals: 10,20-memory array circuit; 100,200-electronic installation; 110,210-control module; 120,220-driver module; The 230-induction module; 240-compensates control module; 250-compensates driver module.
Embodiment
In the middle of this instructions and follow-up claim, used some vocabulary to censure specific assembly, and the person with usual knowledge in their respective areas should understand, hardware manufacturer may be called same assembly with different nouns, this instructions and follow-up claim are not used as distinguishing the mode of assembly with the difference of title, but the criterion that is used as distinguishing with the difference of assembly on function, in the whole text in the middle of instructions and the follow-up request item carry and " including " be an open term, so should be construed to " include but be not limited to ", in addition, " coupling " speech is to comprise any direct and indirect means that are electrically connected at this, therefore, be coupled in one second device if describe one first device in the literary composition, then represent described first device can directly be electrically connected, or be electrically connected to described second device indirectly by other device or connection means at described second device.
The invention relates to a kind of electronic installation and correlation technique that an electronic package is compensated operation that be used in, and this instructions will be described some about using the embodiment of electronic installation of the present invention and correlation technique, usually know that the knowledgeable should the described the present invention of recognizing can be applied in various types of electronic packages but in correlative technology field, have, be not limited in the following description specific embodiment that is provided or the ad hoc approach of realizing the technical characterictic of these specific embodiments.
Generally speaking, the inventive method can be applied in the electronic package of any kind of, be to disclose a kind of electronic installation and correlation technique that is applied in a memory array circuit (memory array circuit) in this manual, but this just is used in and illustrates, rather than restrictive condition of the present invention, in addition, do not influencing under the disclosed situation of the technology of the present invention, will utilize memory array circuit electronic installation of the present invention and correlation technique to be described in this instructions as an example.
Please refer to Fig. 2, what Fig. 2 illustrated is according to being used in the rough schematic view that a memory array circuit 20 is compensated the electronic installation 200 of operation in one embodiment of the invention.As shown in Figure 2, electronic installation 200 includes a control module 210, a driver module 220, an induction module 230, a compensation control module 240 and a compensation driver module 250, wherein, control module 210 is to be used in according to an input signal Sa to export a controlling signal Sc, and driver element 220 is to be coupled between the operating voltage source Vo of control module 210, memory array circuit 20 and memory array circuit 20, and is used in according to controlling signal Sc to provide a drive current to memory array circuit 20.Induction module 230 is to be used in according to the variation of an operating environment to export at least one sensor signal Ss, for instance, in one embodiment of this invention, the variation of described operating environment can be that the voltage quasi position of the operating voltage source Vo of memory array circuit 20 changes, and induction module 230 can include a voltage sensor (not shown), and it is to be used in voltage quasi position according to described operating voltage source to change and export a voltage induced signal; In another embodiment of the present invention, the variation of described operating environment can be an operating environment variation of temperature of memory array circuit 20, and induction module 230 can include a temperature inductor (not shown), and it is to be used in according to described operating environment variation of temperature to export a temperature sense signal; In addition, in another embodiment of the present invention, the variation of described operating environment also can be that the voltage quasi position of the operating voltage source Vo of memory array circuit 20 changes and described operating environment variation of temperature simultaneously, and induction module 230 can include above-mentioned described voltage sensor and described temperature inductor, and it is to be used in voltage quasi position according to described operating voltage source to change and export a voltage induced signal and export a temperature sense signal according to described operating environment variation of temperature; Note that at this each above-mentioned embodiment only illustrates as of the present invention, rather than restrictive condition of the present invention.
In the embodiment of Fig. 2 of the present invention, driver module 220 is to include a P type MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) (PMOSFET), and compensation driver module 250 is to include a N type MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) (NMOSFET), please note at this, the above embodiments are only to illustrate as of the present invention, rather than restrictive condition of the present invention, for instance, in another embodiment of the present invention, compensation driver module 250 also can include a plurality of compensation drive unit (for example N type MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) or P type MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor)), and compensation control module 240 also can include a plurality of compensation control modules, it is to be used in to export a plurality of sensor signals respectively to described a plurality of compensation drive unit, exports a plurality of compensation drive currents respectively to memory array circuit 20 to control described a plurality of compensation drive unit.
Please refer to Fig. 3, Fig. 3 illustrated is to summarize the present invention compensates an embodiment of method of operating to an electronic package (a for example memory array circuit) process flow diagram according to the function mode of the electronic installation of the various embodiment of the invention described above.If can obtain identical result substantially, then the step in the flow process not necessarily needs to carry out according to order shown in Figure 3, and it is continuous also not necessarily needing, that is to say, and between these steps the step that can insert other.First embodiment of the inventive method includes the following step:
Step 300: beginning.
Step 310: export a controlling signal according to an input signal.
Step 320: come to provide a drive current to a memory array circuit according to described controlling signal.
Step 330: at least one sensor signal is exported in the variation according to an operating environment, and the voltage quasi position that the variation of wherein said operating environment can include an operating voltage source changes and an operating environment variation of temperature.
Step 340: export at least one compensation controlling signal according to described at least one sensor signal and described input signal.
Step 350: come to provide at least one compensation drive current to described memory array circuit according to described at least one compensation controlling signal.
Step 360: finish.
In sum, electronic installation 200 disclosed in this invention when the voltage quasi position of the operating voltage source Vo of memory array circuit 20 and (or) in the operating environment temperature change of memory array circuit 20, can utilize induction module 230 detecting real-times can have influence on the variation of drive current originally and export at least one sensor signal to above-mentioned these, and then utilize compensation control module 240 to export at least one compensation controlling signal according to a described at least one sensor signal and an input signal, then utilize compensation driver module 250 to come to provide at least one compensation drive current again to memory array circuit 20 according to described at least one compensation controlling signal, with the voltage quasi position of the operating voltage source Vo that avoids memory array circuit 20 and (or) the operating environment variation of temperature of memory array circuit 20 has influence on the electrical performance (electric performance) of memory array circuit 20.
The above only is preferred embodiment of the present invention, only is illustrative for the purpose of the present invention, and nonrestrictive.Those skilled in the art is understood, and can carry out many changes to it in the spirit and scope that claim of the present invention limited, revise, even equivalence, but all will fall within the scope of protection of the present invention.
Claims (9)
1. electronic installation that is used for memory array is compensated operation, it is characterized in that: described device is used for the drive current of memory array is compensated, and described electronic installation includes:
One control module is exported a controlling signal according to an input signal;
One driver module is coupled in described control module and described memory array, comes to provide a drive current to described memory array according to described controlling signal;
One induction module is exported at least one sensor signal according to the variation of an operating environment;
One compensation control module is coupled in described induction module, exports at least one compensation controlling signal according to described at least one sensor signal and described input signal; And
One compensation driver module is coupled in described memory array and described compensation control module, comes to provide at least one compensation drive current to described memory array according to described at least one compensation controlling signal.
2. electronic installation according to claim 1, it is characterized in that: the voltage quasi position of an operating voltage source that is changed to described electronic installation of described operating environment changes, and described induction module includes a voltage sensor, changes according to the voltage quasi position of described operating voltage source and exports described sensor signal.
3. electronic installation according to claim 1, it is characterized in that: an operating environment variation of temperature that is changed to described electronic installation of described operating environment, and described induction module includes a temperature inductor, exports described sensor signal according to described operating environment variation of temperature.
4. electronic installation according to claim 1, it is characterized in that: described compensation driver module includes a plurality of compensation drive unit, and described compensation control module includes a plurality of compensation control modules, be used in and export a plurality of sensor signals respectively, export at least one compensation drive current respectively to described memory array to control described a plurality of compensation drive unit to described a plurality of compensation drive unit.
5. electronic installation according to claim 4 is characterized in that: described a plurality of compensation drive unit are plurality of transistors.
6. electronic installation according to claim 5 is characterized in that: described plurality of transistors includes N type field-effect transistor or P type field-effect transistor.
7. one kind is used for a memory array is compensated method of operating, it is characterized in that: described method is used for the drive current of memory array is compensated, and described method includes:
Export a controlling signal according to an input signal;
Come to provide a drive current according to described controlling signal to described memory array;
At least one sensor signal is exported in variation according to an operating environment;
Export at least one compensation controlling signal according to described at least one sensor signal and described input signal; And
Come to provide at least one compensation drive current according to described at least one compensation controlling signal to described memory array.
8. method according to claim 7 is characterized in that: the step of exporting described at least one sensor signal according to the variation of described operating environment includes:
The voltage quasi position of foundation one operating voltage source changes exports described sensor signal.
9. method according to claim 7 is characterized in that: the step of exporting described at least one sensor signal according to the variation of described operating environment includes:
Export described sensor signal according to an operating environment variation of temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101881872A CN101183555B (en) | 2007-11-12 | 2007-11-12 | Electronic device and method for performing compensation operation to an electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101881872A CN101183555B (en) | 2007-11-12 | 2007-11-12 | Electronic device and method for performing compensation operation to an electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101183555A CN101183555A (en) | 2008-05-21 |
| CN101183555B true CN101183555B (en) | 2010-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101881872A Expired - Fee Related CN101183555B (en) | 2007-11-12 | 2007-11-12 | Electronic device and method for performing compensation operation to an electronic component |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1266266A (en) * | 1999-03-09 | 2000-09-13 | 因芬尼昂技术北美公司 | Capacitance coupled driving circuit |
| US6531911B1 (en) * | 2000-07-07 | 2003-03-11 | Ibm Corporation | Low-power band-gap reference and temperature sensor circuit |
| CN1423280A (en) * | 2001-12-03 | 2003-06-11 | 惠普公司 | Write current compensation for storing temp. change in array |
-
2007
- 2007-11-12 CN CN2007101881872A patent/CN101183555B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1266266A (en) * | 1999-03-09 | 2000-09-13 | 因芬尼昂技术北美公司 | Capacitance coupled driving circuit |
| US6531911B1 (en) * | 2000-07-07 | 2003-03-11 | Ibm Corporation | Low-power band-gap reference and temperature sensor circuit |
| CN1423280A (en) * | 2001-12-03 | 2003-06-11 | 惠普公司 | Write current compensation for storing temp. change in array |
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| CN101183555A (en) | 2008-05-21 |
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Granted publication date: 20100630 Termination date: 20181112 |