CN101179655A - Image sensing element and manufacturing method thereof - Google Patents
Image sensing element and manufacturing method thereof Download PDFInfo
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- CN101179655A CN101179655A CNA2006101464583A CN200610146458A CN101179655A CN 101179655 A CN101179655 A CN 101179655A CN A2006101464583 A CNA2006101464583 A CN A2006101464583A CN 200610146458 A CN200610146458 A CN 200610146458A CN 101179655 A CN101179655 A CN 101179655A
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- image sensing
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- type colloid
- circuit board
- sensing chip
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Abstract
The invention discloses a video sensing element, which includes a circuit board, a video sensing chip, a plurality of electric wires, a first annular colloid, a second annular colloid and an optical filter. The video sensing chip is arranged on the circuit board, and the video sensing chip is provided with an active surface which is far from the circuit board. The electric wires connect the video sensing chip and the circuit board. The first annular colloid is arranged on the circuit board. The first annular colloid is around the video sensing chip and the surrounding area which covers the electric wires and the active surface. The second annular colloid is arranged on the first annular colloid. The optical filter is arranged on the second annular colloid to cover the video sensing chip. In this way, the video sensing chip is not easily to be contaminated by dust.
Description
Technical field
The present invention is relevant for a kind of sensing element and preparation method thereof, and is particularly to a kind of image sensing element and preparation method thereof.
Background technology
CMOS image sensor (complementary metal-oxidesemiconductor image sensor, CIS) with CMOS (Complementary Metal Oxide Semiconductor) (complementarymetal-oxide semiconductor, process-compatible CMOS).Because this image sensor can be incorporated on the same chip with other peripheral circuits at an easy rate, therefore, can significantly reduce the cost and the consumed power of image sensor.In addition, in the application in low price field, CMOS image sensor has become the substitute of charge coupled cell in recent years, and then makes the importance of CMOS image sensor grow with each passing day.
Fig. 1 is the generalized section of existing a kind of image sensing element.See also Fig. 1, this image sensing element 100 comprises a flexible circuit board (flexible circuit board) 110, one image sensing chip (image-sensing chip) 120, many leads (bonding wire) 130, one lid (cap) 140 and a filter (filter) 150.Image sensing chip 120 is disposed on the flexible circuit board 110 with pick-up image, and image sensing chip 120 is a kind of image sensing chip of CMOS (Complementary Metal Oxide Semiconductor) kenel.These leads 130 are to see through routing joining technique (wire bonding technology) to be electrically connected between flexible circuit board 110 and the image sensing chip 120.Lid 140 is disposed on the flexible circuit board 110, and cover cap lives image sensing chip 120, avoids being undermined with protection image sensing chip 120 and makes moist.
Lid 140 comprises a microscope base (lens holder) 142, one lens (lens) 144 and a lens barrel (barrel) 146.Microscope base 142 is disposed on the flexible circuit board 110.Microscope base 142 has an opening 142a, and opening 142a is positioned at the top of image sensing chip 120.Lens barrel 146 is bolted in the opening 142a place of microscope base 142, and lens 144 are equipped in the lens barrel 146, and is positioned at the top of image sensing chip 120, so that light focusing is on image sensing chip 120.Distance between lens 144 and the image sensing chip 120 can adjust by lens barrel 146.In addition, filter 150 is opening 142a places of being fixed in microscope base 142, and is disposed at the top of image sensing chip 120, in order to filter unnecessary light.
The production method of image sensing element 100 is after image sensing chip 120 and flexible circuit board 110 electrically connect now, just lid 140 cover caps is lived image sensing chip 120.Yet before configuration lid 140, image sensing chip 120 is to be exposed in the external environment always.So, be easy to have dust or other foreign matters and stain image sensing chip 120, and then cause 120 picked image of image sensing chip stain to occur and destroy the quality of image.Therefore, before being configured lid 140, image sensing chip 120 can be through the program of cleaning, to remove dust or other foreign matters on the image sensing chip 120 usually.Yet, so but can cause the Production Time of image sensing element 100 to increase, and the cost that increases cleaning image sensing chip 120.
Summary of the invention
The purpose of this invention is to provide a kind of image sensing element, avoid being stain by dust or other foreign matters to protect its inner image sensing chip.
Another object of the present invention provides a kind of manufacture method of image sensing element, to improve the shortcoming that the image sensing chip is stain easily in manufacturing process.
For reaching above-mentioned or other purposes, the present invention proposes a kind of image sensing element, and it comprises a circuit board, an image sensing chip, many leads, one first ring-type colloid (ring encapsulant), one second ring-type colloid and filters.The image sensing chip configuration is on circuit board, and this image survey chip has an active surface away from circuit board.Many lead electrically connects image sensing chip and circuit board.The first ring-type colloid is disposed on the circuit board.The first ring-type colloid is around image sensing chip and the peripheral region that coats these leads and active surface.The second ring-type colloid is disposed on the first ring-type colloid.Filter is disposed on the second ring-type colloid to cover the image sensing chip.
In an embodiment of the present invention, the curing temperature of the first ring-type colloid can be greater than the curing temperature of the second ring-type colloid.
In an embodiment of the present invention, above-mentioned image sensing chip more can have a sensing unit (sensing area) that is disposed on the active surface, and the part second ring-type colloid is disposed on the part active surface, and around sensing unit.
In an embodiment of the present invention, the above-mentioned first ring-type colloid for example is a hot-setting adhesive (heat-curedencapsulant).
In an embodiment of the present invention, the above-mentioned second ring-type colloid for example is a ultraviolet cured adhesive (UV-curedencapsulant).
In an embodiment of the present invention, above-mentioned image sensing element also comprises a lid, and this lid is disposed on the circuit board, and covers the image sensing chip.Lid comprises a microscope base, a lens barrel and lens.Microscope base is disposed on the circuit board, and this microscope base has an opening, and opening is positioned at image sensing chip top.Lens barrel is bolted in the opening part of microscope base.Lens configuration is in lens barrel, and the distance between lens and the image sensing chip can adjust by lens barrel.
In an embodiment of the present invention, the foregoing circuit plate for example is a flexible circuit board.
The present invention proposes a kind of manufacture method of image sensing element again, and it may further comprise the steps.At first, provide a circuit board.Then, on circuit board, make active surface one image sensing chip configuration with an active surface away from circuit board.Then, form many leads, to electrically connect image sensing chip and circuit board.Afterwards, form one first ring-type colloid on circuit board, make the ring-type colloid of winning, and coat the peripheral region of these leads and active surface around the image sensing chip.Afterwards, solidify the first ring-type colloid.Then, form one second ring-type colloid on the first ring-type colloid.Then, a filter is disposed on the second ring-type colloid to cover the image sensing chip.Then, solidify the second ring-type colloid.
In an embodiment of the present invention, the method for the above-mentioned formation first ring-type colloid comprises a glue (dispensing).
In an embodiment of the present invention, the method for the above-mentioned formation second ring-type colloid comprises a glue.
In an embodiment of the present invention, the curing temperature of the first ring-type colloid can be greater than the curing temperature of the second ring-type colloid.
In an embodiment of the present invention, the above-mentioned first ring-type colloid for example is a hot-setting adhesive, and the method for the above-mentioned curing first ring-type colloid comprises the heated baking first ring-type colloid.
In an embodiment of the present invention, the above-mentioned second ring-type colloid for example is a ultraviolet cured adhesive, and the method for the above-mentioned curing second ring-type colloid comprises with the UV-irradiation second ring-type colloid.
In an embodiment of the present invention, the manufacture method of above-mentioned image sensing element also comprises a lid is disposed on the circuit board, and covers the image sensing chip.Wherein, lid comprises a microscope base, a lens barrel and lens.Microscope base is disposed on the circuit board, and this microscope base has an opening, and opening is positioned at image sensing chip top.Lens barrel is bolted in the opening part of microscope base.Lens configuration is in lens barrel, and the distance between lens and the image sensing chip can adjust by lens barrel.
Image sensing element of the present invention can pass through filter, the first ring-type colloid and second ring-type colloid protection image sensing chip, makes the image sensing chip avoid extraneous dust or other foreign matters are infected with.In addition, the manufacture method of image sensing element of the present invention can be improved in making the image sensing element process, the shortcoming that the image sensing chip is stain easily.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the generalized section of existing a kind of image sensing element.
Fig. 2 is the generalized section of the image sensing element of one embodiment of the invention.
Fig. 3 A to Fig. 3 F is the generalized section of the image sensing element manufacture method of Fig. 2.
Embodiment
Fig. 2 is the generalized section of one embodiment of the invention image sensing element.See also Fig. 2, image sensing element 200 comprises a circuit board 210, an image sensing chip 220, many leads 230, one first ring-type colloid 240a, one second ring-type colloid 240b and filters 250.Wherein, circuit board 210 for example be flexible circuit board or general printed circuit board (PCB) (printed circuit board, PCB).Image sensing chip 220 is disposed on the circuit board 210, and has an active surface 222 away from circuit board 210.Many lead 230 electrically connects image sensing chip 220 and circuit board 210, and these leads 230 can be connected between image sensing chip 220 and the circuit board 210 by the routing joining technique.The first ring-type colloid 240a is disposed on the circuit board 210, and around image sensing chip 220, and the peripheral region that coats these leads 230 and active surface 222.The second ring-type colloid 240b is disposed on the first ring-type colloid 240a.Filter 250 is disposed at the second ring-type colloid 240b and goes up with covering image sensing chip 220, and filters some unnecessary light, for example infrared ray (infrared ray) and ultraviolet light (ultraviolet ray) etc.
Because image sensing is surveyed chip 220 and can be protected by the first ring-type colloid 240a, the second ring-type colloid 240b and filter 250; therefore (see aftermentioned for details) in successive process, the active surface 222 of image sensing chip 220 can be avoided the contamination of extraneous dust, dirt or other foreign matters.
As shown in Figure 2, the function of the first ring-type colloid 240a not only is used for protecting these leads 230, also can support filter 250, and the major function of the second ring-type colloid 240b is filter 250 to be sticked together be fixed on the first ring-type colloid 240a.In addition; what emphasize once more is; be not subjected to extraneous foreign substance pollution, circuit board 210, the first ring-type colloid 240a, the second ring-type colloid 240b and filter 250 can form an enclosure space jointly in order to make image sensing chip 220 in successive process, (see aftermentioned for details) with protection image sensing chip 220.It should be noted that the designer can be according to its design requirement and partly the second ring-type colloid 240b be disposed on the part active surface 222 and, can make that so filter 250 more firmly is disposed at the top of active surface 222 around sensing unit 224.Mandatory declaration be, in the present embodiment, though all some covers the peripheral region of active surface 222 for the first ring-type colloid 240a and the second ring-type colloid 240b, but above-mentioned two colloid 240a, 240b do not cover sensing unit 224, so can the function of the pick-up image of image sensing chip 220 not impacted.
In the present embodiment, the first ring-type colloid 240a can be a hot-setting adhesive, and the second ring-type colloid 240b can be a ultraviolet cured adhesive.Because the curing temperature of the second ring-type colloid 240b is less than the curing temperature of the first ring-type colloid 240a; therefore when solidifying the second ring-type colloid 240b; the first ring-type colloid 240a can not take place rotten or distortion, makes the ring-type colloid 240a that wins still can keep these leads 230 of protection and the function that supports filter 250.
In the present embodiment, image sensing element 200 comprises that lid 260 makes moist to protect image sensing chip 220 to avoid being undermined more.Lid 260 is configurable on circuit board 210, and covers image sensing chip 220.
Lid 260 comprises a microscope base 262, a lens barrel 264 and lens 266.Microscope base 262 is disposed on the circuit board 210, and can be perspex, opaque plastic cement or other materials.Microscope base 262 has an opening 262a, and opening 262a is positioned at image sensing chip 220 tops.Lens barrel 264 is bolted in the opening 262a place of microscope base 262, and at least one lens 266 of configuration in the lens barrel 264.Wherein, lens 266 can be disposed at the top of image sensing chip 220, in order to focused ray.Distance between lens 266 and the image sensing chip 220 can adjust by lens barrel 264, makes light focusing on sensing unit 224.So, make that 200 picked image of image sensing element are more clear.After lens 266 to the distance of sensing unit 224 is adjusted into the best, lens barrel 264 can be fixed on the microscope base 262, change again to avoid lens 266 to the distance of sensing unit 224.
Manufacture method at the image sensing element 200 of present embodiment below will cooperate Fig. 3 A～Fig. 3 F to be illustrated.Fig. 3 A～Fig. 3 F is the generalized section of manufacture method of the image sensing element of Fig. 2.The manufacture method of image sensing element 200 may further comprise the steps.At first, see also Fig. 3 A, circuit board 210 is provided.Then, the image sensing chip 220 that will have active surface 222 is disposed on the circuit board 210, makes active surface 222 away from circuit board 210, and make on the active surface 222 sensing unit 224 up.Wherein, image sensing chip 220 can be attached on the circuit board 210 by sticking together glue (not illustrating).
Then, see also Fig. 3 B, form many leads 230, to electrically connect image sensing chip 220 and circuit board 210.These leads 230 can be by the routing joining technique with between the active surface 222 and circuit board 210 that are electrically connected at image sensing chip 220.
Afterwards, see also Fig. 3 C, on circuit board 210, form the first ring-type colloid 240a, make the ring-type colloid 240a that wins around image sensing chip 220 and coat the peripheral region of these leads 230 and active surface 222.In the present embodiment, the mode that forms the first ring-type colloid 240a can adopt the mode of a glue.After forming the first ring-type colloid 240a, the first ring-type colloid 240a is solidified.Because the first ring-type colloid 240a of present embodiment can be a hot-setting adhesive, but the therefore heated baking first ring-type colloid 240a, so that its curing.
Then, see also Fig. 3 D, form the second ring-type colloid 240b on the first ring-type colloid 240a that solidifies.In the present embodiment, the mode that forms the second ring-type colloid 240b also can be a glue, and the second ring-type colloid 240b can be formed on also that the first ring-type colloid 240a goes up and the peripheral region of active surface 222 on.Mandatory declaration be that no matter be to form the first ring-type colloid 240a or the second ring-type colloid 240b, above-mentioned two colloid 240a, 240b all do not cover sensing unit 224, so can the function of the pick-up image of image sensing chip 220 not impacted.
Then, see also Fig. 3 E, filter 250 is disposed at the second ring-type colloid 240b goes up to cover image sensing chip 220.In the present embodiment, filter 250 on being disposed at the second ring-type colloid 240b after, filter 250 can be parallel to the sensing unit 224 of image sensing chip 220, so that 220 picked image of image sensing chip can deflections or be fuzzy.
After configuring filter 250, solidify the second ring-type colloid 240b.Because the second ring-type colloid 240b can be a ultraviolet cured adhesive, therefore the available UV-irradiation second ring-type colloid 240b is to solidify the second ring-type colloid 240b.What must emphasize once more is; because the curing temperature of the second ring-type colloid 240b is less than the curing temperature of the first ring-type colloid 240a; therefore when solidifying the second ring-type colloid 240b; the first ring-type colloid 240a can not take place rotten or distortion, makes the ring-type colloid 240a that wins still can keep these leads 230 of protection and the function that supports filter 250.So far, a kind of image sensing element 200 is finished basically.
See also Fig. 3 F, in the present embodiment, the manufacture method of image sensing element 200 also comprises lid 260 is disposed on the circuit board 210, and covers image sensing chip 220.The method of configuration lid 260 for example uses B rank glue (B-staged epoxy) or ultraviolet cured adhesive that lid 260 is fixed on the circuit board 210.
Because image sensing chip 220 is protected by the first ring-type colloid 240a, the second ring-type colloid 240b and filter 250; therefore before configuration lid 260, the sensing unit 224 of image sensing chip 220 can not be subjected to the contamination of extraneous dust or foreign matter as image sensing chip 120 (see figure 1)s of prior art.In addition, owing to still have certain distance between image sensing chip 220 and the filter 250, therefore attached to the dust on the filter 250 or foreign matter will because of and image sensing chip 220 between distance excessive and lose burnt thereby can't imaging, so the optical quality of image sensing element 200 can not be affected.
In sum, because image sensing element of the present invention is protected the image sensing chip by filter, the first ring-type colloid and the second ring-type colloid, therefore in carrying out successive process, the image sensing chip can be avoided extraneous dust or other foreign matters are infected with.In addition, the manufacture method of image sensing element of the present invention can be exempted the fabrication steps of cleaning image sensing chip in the prior art and the cost of saving cleaning image sensing chip.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those of ordinary skills, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (14)
1. image sensing element comprises:
One circuit board;
One image sensing chip is disposed on this circuit board, and wherein this image survey chip has an active surface away from this circuit board;
Many leads electrically connect this image sensing chip and this circuit board;
One first ring-type colloid is disposed on this circuit board, and centers on this image sensing chip, and coats the peripheral region of those leads and this active surface;
One second ring-type colloid is disposed on this first ring-type colloid; And
One filter is disposed on this second ring-type colloid to cover this image sensing chip.
2. image sensing element as claimed in claim 1 is characterized in that, the curing temperature of this first ring-type colloid is greater than the curing temperature of this second ring-type colloid.
3. image sensing element as claimed in claim 1 is characterized in that, this image sensing chip also has a sensing unit that is disposed on this active surface, and partly this second ring-type colloid is disposed on this active surface of part, and around this sensing unit.
4. image sensing element as claimed in claim 1 is characterized in that, this first ring-type colloid is a hot-setting adhesive.
5. image sensing element as claimed in claim 1 is characterized in that, this second ring-type colloid is a ultraviolet cured adhesive.
6. image sensing element as claimed in claim 1 is characterized in that, also comprises a lid, is disposed on this circuit board, and covers this image sensing chip, and wherein this lid comprises:
One microscope base is disposed on this circuit board, and wherein this microscope base has an opening, and this opening is positioned at this image sensing chip top;
One lens barrel is bolted in this opening part of this microscope base; And
One lens are disposed in this lens barrel, and the distance between these lens and this image sensing chip can adjust by this lens barrel.
7. image sensing element as claimed in claim 1 is characterized in that, this circuit board is a flexible circuit board.
8. the manufacture method of an image sensing element comprises:
One circuit board is provided;
On this circuit board, make this active surface one image sensing chip configuration with an active surface away from this circuit board;
Form many leads, to electrically connect this image sensing chip and this circuit board;
Form one first ring-type colloid on this circuit board, make this first ring-type colloid, and coat the peripheral region of those leads and this active surface around this image sensing chip;
Solidify this first ring-type colloid;
Form one second ring-type colloid on this first ring-type colloid;
One filter is disposed on this second ring-type colloid to cover this image sensing chip; And
Solidify this second ring-type colloid.
9. the manufacture method of image sensing element as claimed in claim 8 is characterized in that, the method that forms this first ring-type colloid comprises a glue.
10. the manufacture method of image sensing element as claimed in claim 8 is characterized in that, the method that forms this second ring-type colloid comprises a glue.
11. the manufacture method of image sensing element as claimed in claim 8 is characterized in that, the curing temperature of this first ring-type colloid is greater than the curing temperature of this second ring-type colloid.
12. the manufacture method of image sensing element as claimed in claim 8 is characterized in that, this first ring-type colloid is a hot-setting adhesive, and the method for solidifying this first ring-type colloid comprises this first ring-type colloid of heated baking.
13. the manufacture method of image sensing element as claimed in claim 8 is characterized in that, this second ring-type colloid is a ultraviolet cured adhesive, and the method for solidifying this second ring-type colloid comprises with this second ring-type colloid of UV-irradiation.
14. the manufacture method of image sensing element as claimed in claim 8 is characterized in that, also comprises a lid is disposed on this circuit board, and covers this image sensing chip, wherein this lid comprises:
One microscope base is disposed on this circuit board, and wherein this microscope base has an opening, and this opening is positioned at this image sensing chip top;
One lens barrel is bolted in this opening part of this microscope base; And
One lens are disposed in this lens barrel, and the distance between these lens and this image sensing chip can adjust by this lens barrel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101464583A CN100550984C (en) | 2006-11-08 | 2006-11-08 | Image sensing element and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101464583A CN100550984C (en) | 2006-11-08 | 2006-11-08 | Image sensing element and preparation method thereof |
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| CN101179655A true CN101179655A (en) | 2008-05-14 |
| CN100550984C CN100550984C (en) | 2009-10-14 |
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| CNB2006101464583A Expired - Fee Related CN100550984C (en) | 2006-11-08 | 2006-11-08 | Image sensing element and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402049A (en) * | 2013-07-28 | 2013-11-20 | 宁波远大成立科技股份有限公司 | Image sensing element and manufacturing method |
| CN113364955A (en) * | 2021-06-04 | 2021-09-07 | 烟台艾睿光电科技有限公司 | Infrared module |
| CN115209015A (en) * | 2021-04-09 | 2022-10-18 | Aptiv技术有限公司 | Method of assembling an optical device and optical device assembled according to the method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412709A (en) * | 2018-04-28 | 2019-11-05 | 三赢科技（深圳）有限公司 | The assemble method of lens module and the lens module |
-
2006
- 2006-11-08 CN CNB2006101464583A patent/CN100550984C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402049A (en) * | 2013-07-28 | 2013-11-20 | 宁波远大成立科技股份有限公司 | Image sensing element and manufacturing method |
| CN115209015A (en) * | 2021-04-09 | 2022-10-18 | Aptiv技术有限公司 | Method of assembling an optical device and optical device assembled according to the method |
| CN115209015B (en) * | 2021-04-09 | 2024-01-23 | Aptiv技术有限公司 | Method of assembling optical device and optical device assembled according to the method |
| CN113364955A (en) * | 2021-06-04 | 2021-09-07 | 烟台艾睿光电科技有限公司 | Infrared module |
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| CN100550984C (en) | 2009-10-14 |
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