CN101176172B - Stacked type solid electrolytic capacitor and method for manufacturing same - Google Patents
Stacked type solid electrolytic capacitor and method for manufacturing same Download PDFInfo
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- CN101176172B CN101176172B CN2005800497761A CN200580049776A CN101176172B CN 101176172 B CN101176172 B CN 101176172B CN 2005800497761 A CN2005800497761 A CN 2005800497761A CN 200580049776 A CN200580049776 A CN 200580049776A CN 101176172 B CN101176172 B CN 101176172B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/06—Mounting in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
Abstract
A solid electrolytic capacitor has a structure wherein a capacitor element (30) is arranged by being stacked, and an anode section (30a) is fixed by being welded on anode mounting planes of anode mounting sections (7a, 7b) provided on an anode terminal. The solid electrolytic capacitor is characterized in that the two anode mounting sections (7a, 7b) are provided, the anode mounting sections (7a, 7b) are arranged in parallel, and the adjacent anode mounting sections (7a, 7b) are mutually connected by a connecting section (9).
Description
Technical field
The present invention relates to a kind of stacked solid electrolytic capacitor and manufacturing approach thereof.
Background technology
Stacked solid electrolytic capacitor involved in the present invention for example can be used as chip mounted capacitor on printed base plate and uses.For such stacked solid electrolytic capacitor; Adopted TCNQ complex salt or polypyrrole, polythiophene, gathered medium electrical property high polymers such as furans, polyaniline and get most of the attention as the electrolytic capacitor of solid electrolyte; Among the requirement of electronics miniaturization, current small-sized, the high capacity that requires solid electrolytic capacitor.In addition, in order to realize high speed, the low power consumptionization of signal processing such as CPU, strengthened the technology tendency of high frequency and big electric currentization, the low ESR of strong request capacitor.
Here, existing stacked solid electrolytic capacitor is processed through following manufacturing approach.Promptly shown in figure 15, the part on the surface of the metal with valve function 41 (for example aluminium) forms dielectric oxide scale film 42, solid electrolyte layer 43, carbon-coating 44 and silver coating 45 in order, thereby processes capacitor element 46.
Then; Shown in figure 16; With the integrally formed anode installation portion 51 of anode terminal 52, and with a face of the integrally formed negative electrode installation portion 47 of cathode terminal 48 on, according to range upon range of state configuration after a plurality of capacitor elements 46, utilize outer dress resin 54 to implement to be covered; Perhaps shown in figure 17, two faces of anode installation portion 51 and negative electrode installation portion 47 with range upon range of state configuration after a plurality of capacitor elements 46, implement the process of lining through utilizing outer dress resin 54, processed stacked solid electrolytic capacitor.
In addition; When above-mentioned capacitor element 46 being carried out when range upon range of; At first negative pole part (main part) 46b to capacitor element 46 keep and conveyance, place its year on the lead frame after; Anode portion 46a with capacitor element 46 is connected with anode terminal 52 through resistance welded, then, the anode portion 46a of newly range upon range of capacitor element 46 is welded to the anode portion 46a of this connected capacitor element 46.On the other hand, through connecting between the negative electrode of electrically conducting adhesive 57 with capacitor element 46.Then, carry out range upon range of (with reference to following patent documentation 1) through repeating such operation repeatedly.Wherein, why so cascade capacitor element 46 is in order to improve the condenser capacitance characteristic and to reduce ESR.
Patent documentation 1: the spy opens flat 11-135367 communique
But, in above-mentioned stacked solid electrolytic capacitor shown in figure 16, shown in figure 15; Because the thickness L10 ≈ 100 μ m of anode portion 46a; The thickness L11 ≈ 230 μ m of negative pole part 46b cause the difference of thickness L2 of thickness L1 and the negative pole part 46b of anode portion 46a to increase, so; Capacitor element 46 can tilt, and causes the pressure of mechanical aspects to become big.This situation in being disposed at (depart from anode the installation portion 47 and configuration) capacitor element 46 on top very significantly.And the deviation of the bonding strength that causes because of welding also increases.In view of such circumstances, existing can the bad problem of the frequent LC of generation in stacked solid electrolytic capacitor.In addition, only range upon range of 4 capacitor elements 46 in stacked solid electrolytic capacitor shown in Figure 16 when range upon range of more capacitor element 46, can significantly produce above-mentioned problem.
In addition, in above-mentioned stacked solid electrolytic capacitor shown in Figure 17, though above-mentioned problem alleviated to a certain extent owing to only have an anode terminal 52, so the load that puts on anode terminal 52 increases.As a result, owing to increased the pressure of mechanical aspects, so be difficult to solve above-mentioned problem.
Summary of the invention
The present invention proposes in view of above-mentioned problem, and its purpose is, the mechanical pressure when suppressing to weld, and range upon range of number is increased, and the inclination of suppression element more, thus it is bad to alleviate LC, realizes the lifting of electrostatic capacitance thereby can dissolve through multilayer.
To achieve these goals, the invention of technical scheme 1 relates to a kind of solid electrolytic capacitor among the present invention, it is characterized in that, possesses a plurality of capacitor elements, and said capacitor element possesses: the anode bodies with anode portion; Formed the negative pole part of dielectric oxide scale film and cathode layer successively with surface at this anode bodies; And these capacitor elements are with range upon range of state configuration; And said anode portion is weldingly fixed on the anode installed surface of the anode installation portion that is arranged at anode terminal; Wherein, Be provided with a plurality of above-mentioned anode installation portions, and these anode installation portions are configured to be parallel to each other, and connect through connecting portion respectively between the anode installation portion of adjacency.
According to above-mentioned formation,, then can will carry out range upon range of capacitor element and be electrically connected with each anode installation portion by stack if a plurality of anode installation portions are set.Therefore, because the capacitor element that is connected with each anode installation portion reduces relatively,, thereby relax mechanical pressure so the inclination of the capacitor element that can dispose departing from the anode installation portion suppresses.And, can also alleviate the deviation of the bonding strength that causes because of welding.Thus, can suppress the bad generation of LC in the stacked solid electrolytic capacitor.
And, be electrically connected with each anode installation portion owing to can will carry out range upon range of capacitor element by stack, so can reduce the energising resistance in the capacitor, "on" position is remained well than prior art.
And, owing to connect through connecting portion between the anode installation portion, so, not only increased integral intensity, and because each anode installation portion can support a plurality of anode portion respectively, so, can guarantee stable maintenance.
And then because the anode installation portion is configured to be parallel to each other, so any capacitor element that is connected with the anode installation portion can be not crooked, meeting is by fitly range upon range of, and the result can prevent to cause the maximization of stacked solid electrolytic capacitor.
The invention of technical scheme 2 is according to the invention of technical scheme 1; It is characterized in that; Between the adjacent negative pole part of above-mentioned capacitor element, the negative pole part of the negative electrode installation portion that is electrically connected with cathode terminal and the capacitor element that on this negative electrode installation portion, disposes, be electrically connected through conductive adhesive.
According to above-mentioned formation, through utilize conductive adhesive with between the negative pole part, and negative electrode installation portion and be configured in negative pole part on this negative electrode installation portion and carry out bondingly, can guarantee the conductivity between the negative electrode of a plurality of capacitor elements.
The invention that technical scheme 3 is put down in writing according to technical scheme 1 or 2 is characterized in that, the anode installation portion of above-mentioned adjacency and the above-mentioned connecting portion angulation that is connected these anode installation portions are restricted to approximate vertical respectively.
According to above-mentioned formation; If the anode installation portion of adjacency and the connecting portion angulation difference approximate vertical that is connected these anode installation portions; Then two anode installation portions and connecting portion become roughly コ word shape; Therefore, not only can be to firmly keeping between this three, and can make the anode portion of capacitor element stably range upon range of in the anode installation portion.
The invention of technical scheme 4 is according to technical scheme 1～3 described invention; It is characterized in that; Dispose according to opposed mode between the anode installed surface of the anode installation portion of above-mentioned adjacency; And be defined as: connect the height of the connecting portion between the anode installation portion with these anode installed surfaces, and the gross thickness that is present in the capacitor element between the anode installation portion of adjacency about equally.
According to above-mentioned formation; If will have the height of the connecting portion that connects between the anode installation portion of anode installed surface; The gross thickness that is defined as and is present in the capacitor element between the anode installation portion of adjacency about equally; Then produce the gap between the capacitor element, so capacitor element can be range upon range of by more stably owing to being suppressed at.
The invention of technical scheme 5 is characterized in that according to technical scheme 1～4 described invention, is formed with recess at the intersection of above-mentioned anode installation portion and above-mentioned connecting portion.
Through recess so is set, easily the lead frame that possesses anode installation portion and connecting portion is carried out bending machining.
The invention of technical scheme 6 is according to technical scheme 1～3 described invention; It is characterized in that; Contacted configuration between the face opposite of the anode installation portion of above-mentioned adjacency with the anode installed surface; And be defined as: connect the height of the connecting portion between the anode installation portion with these anode installed surfaces, with the gross thickness of two anode installation portions about equally.
According to above-mentioned formation; Contact configuration between the face opposite of the anode installation portion through adjacency, promptly, can be reduced the necessary space of bending with opposite folded lead frame in showing with the anode installed surface; Therefore, can realize the miniaturization of stacked solid electrolytic capacitor.
The invention of technical scheme 7 is characterized in that according to technical scheme 6 described inventions, is formed with recess at the central portion of above-mentioned connecting portion.
Through recess so is set, carry out the bending machining of lead frame easily.
The invention of technical scheme 8 is characterized in that according to technical scheme 1～7 described invention, at above-mentioned anode terminal and intersection above-mentioned anode installation portion, is formed with limiting wall portion along the direction identical with the stacked direction of capacitor element.
According to above-mentioned formation; If on anode terminal, be formed with limiting wall portion, promptly lead frame has been implemented bending machining, then owing to increased the intensity of lead frame along the direction identical with the stacked direction of capacitor element; So, can more firmly keep capacitor element.And it is easy that the location of the relative lead frame of capacitor element becomes.
The invention of technical scheme 9 is characterized in that according to technical scheme 1～8 described invention the anode terminal of adjacency all bending forms コ word shape, is soldered fixing in this bending position between the anode terminal of adjacency.
Through like this bending position being welded, can improve the intensity of lead frame self, therefore, can stablize the maintenance capacitor element.
The invention of technical scheme 10 is characterized in that according to technical scheme 2～9 described inventions above-mentioned negative electrode installation portion and above-mentioned anode installation portion are provided with same number.
According to above-mentioned formation,, then can more firmly keep capacitor element if negative electrode installation portion and above-mentioned anode installation portion are provided with same number.
In addition; To achieve these goals; The invention of technical scheme 11 provides a kind of manufacturing approach of stacked solid electrolytic capacitor among the present invention, has: the part through on the surface of anode bodies forms dielectric oxide scale film and cathode layer successively, makes a plurality ofly to be in the capacitor element that the anode portion of exposing state constitutes by negative pole part and anode bodies; And, make the first step have a plurality of anode installation portions and to connect the lead frame between the anode installation portion of adjacency by connecting portion respectively; Make above-mentioned a plurality of capacitor element respectively in the anode installation portion laminated multilayer of above-mentioned lead frame, with the second fixing step of welding between anode installation portion and anode portion and the anode portion; And come the third step of clinched lead frame according to parallel mode between the anode installation portion of adjacency.
According to said method, the stacked solid electrolytic capacitor of manufacturing technology scheme 1 easily.
The invention of technical scheme 12 is according to technical scheme 11 described inventions; It is characterized in that; In above-mentioned first step, according to the length of above-mentioned connecting portion be present in and two anode installation portions that connecting portion is connected between the gross thickness mode about equally of capacitor element make lead frame, and; In above-mentioned third step, lead frame is carried out bending according to opposed mode between two anode installed surfaces of adjacency.
According to said method, the stacked solid electrolytic capacitor of manufacturing technology scheme 4 easily.
The invention of technical scheme 13 is according to technical scheme 11 described inventions; It is characterized in that; In above-mentioned first step, make lead frame according to the length of above-mentioned connecting portion and the gross thickness mode about equally of two anode installation portions, and; In above-mentioned third step, make the lead frame bending according to the mode that is contacted configuration between two of the adjacency faces opposite with the anode installed surface.
According to said method, the stacked solid electrolytic capacitor of manufacturing technology scheme 6 easily.
The invention effect
According to the present invention, the mechanical pressure in the time of not only can suppressing to weld, and, but increase the inclination of suppression element more of range upon range of number more, thus it is bad to alleviate LC, has realized the rate of finished products raising, and can seek to dissolve through multilayer and improve the effect of electrostatic capacitance.
Description of drawings
Fig. 1 is the vertical profile end view of stacked solid electrolytic capacitor involved in the present invention.
Fig. 2 is the vertical profile end view of the capacitor element that adopted in the stacked solid electrolytic capacitor involved in the present invention.
Fig. 3 is the vertical view of the lead frame (lead frame) of stacked solid electrolytic capacitor involved in the present invention.
Fig. 4 is the stereogram of the major part of the lead frame of the stacked solid electrolytic capacitor of Fig. 3 among the present invention.
Fig. 5 is the stereogram of one procedure of the manufacturing approach of expression stacked solid electrolytic capacitor involved in the present invention.
Fig. 6 is the stereogram of one procedure of the manufacturing approach of expression stacked solid electrolytic capacitor involved in the present invention.
Fig. 7 is the vertical view of the lead frame that adopted in the stacked solid electrolytic capacitor of variation 1.
Fig. 8 is the stereogram of one procedure of manufacturing approach of the stacked solid electrolytic capacitor of expression variation 1.
Fig. 9 is the vertical view of the lead frame of other modes of being adopted in the stacked solid electrolytic capacitor of variation 1.
Figure 10 is the vertical view of the lead frame that adopted in the stacked solid electrolytic capacitor of variation 2.
Figure 11 is the stereogram of one procedure of manufacturing approach of the stacked solid electrolytic capacitor of expression variation 2.
Figure 12 is the vertical profile end view of one procedure of manufacturing approach of the stacked solid electrolytic capacitor of expression variation 2.
Figure 13 is the vertical view of the lead frame that adopted in the stacked solid electrolytic capacitor of variation 3.
Figure 14 is the stereogram of one procedure of manufacturing approach of the stacked solid electrolytic capacitor of expression variation 3.
Figure 15 is the longitudinal section of the capacitor element that adopted in the stacked solid electrolytic capacitor of prior art.
Figure 16 is the longitudinal section of the stacked solid electrolytic capacitor of expression prior art.
Figure 17 is the longitudinal section of other modes of the stacked solid electrolytic capacitor of expression prior art.
Among the figure: 1-anode bodies, 2-dielectric layer, 3-cathode layer, 5-silver coating; 6-negative electrode installation portion, 7a-anode installation portion, 7b-anode installation portion, 8-outward adorn resin; 9-dielectricity bonding agent, 10-cathode terminal, 11-anode terminal, 12-lead frame; 30-capacitor element (aluminium monolithic component), 30a-anode portion, 30b-negative pole part (main part).
Embodiment
Below, according to Fig. 1～Figure 10, stacked solid electrolytic capacitor involved in the present invention and manufacturing approach thereof are elaborated.Wherein, stacked solid electrolytic capacitor of the present invention and manufacturing approach thereof are not limited to following preferred forms, change and enforcement that can be suitable in the scope that does not change its purport.
(structure of stacked solid electrolytic capacitor)
Stacked solid electrolytic capacitor of the present invention is as shown in Figure 1; The a plurality of capacitor elements 30 that are in range upon range of state are synthesized the housing (housing) of resin, promptly outer dress resin 8 covers; The anode portion 30a of above-mentioned capacitor element 30 connects with the anode installation portion 7a that is connected with anode terminal 11,7b; On the other hand, the negative pole part of above-mentioned capacitor element 30 (main part) 30b connects with the negative electrode installation portion that is connected with cathode terminal 10 6.Specific as follows said.
As shown in Figure 2; Above-mentioned capacitor element 30 is in the part on the surface of the anode bodies 31 that is made up of the metal with valve action (in this instance for aluminium), is that the negative pole part 30b that constituted of solid electrolyte layer 33, carbon-coating 34, silver coating 35 that electric conductive polymer constitutes and the anode portion 30a that has exposed anode bodies 31 constitute by dielectric oxide scale film 32, polythiophene.
The anode portion 30a of above-mentioned capacitor element 30 is carried out interval that range upon range of two fixing anode installation portion 7a, 7b separate regulation by arranged opposite, and each anode installation portion 7a, 7b connect through connecting portion 9 respectively.Anode installation portion 7a and connecting portion 9, anode installation portion 7b and connecting portion 9 angulations are approximate vertical respectively, and therefore, the shape that is made up of anode installation portion 7a, 7b and connecting portion 9 is roughly コ word shape.And; Between above-mentioned two anode installation portion 7a, 7b; One group of anode portion 30a of above-mentioned a plurality of capacitor element 30 each other with conduction state by the range upon range of anode installation portion 7a that is fixed in a side, another group anode portion 30a each other with conduction state by the range upon range of anode installation portion 7b that is fixed in the opposing party.Particularly; Between the anode portion 30a of four capacitor elements 30 and be soldered fixing with the anode portion 30a and the anode installation portion 7a of anode installation portion 7a adjacency; In addition, between the anode portion 30a of four capacitor elements 30 and be soldered fixing with the anode portion 30a and the anode installation portion 7b of anode installation portion 7b adjacency.In addition, anode terminal 11 is connected with above-mentioned anode installation portion 7a, 7b respectively, and the part of a side anode terminal 11 is adorned resin 8 and exposed outside above-mentioned.
And; Not extending to the folding surface 27a of the outside anode terminal 11 of capacitor (being the anode terminal 11 that is arranged in upside in Fig. 1) and the folding surface 27b of the anode terminal 11 that extends to the capacitor outside (is the anode terminal 11 that is positioned at downside at Fig. 1) is soldered fixing; Thus, can realize the raising of capacitor intensity.
On the other hand, the negative pole part 30b of above-mentioned capacitor element 30 each other with conduction state by range upon range of and integrated, and negative pole part 30b and the negative electrode installation portion 6 that are positioned on the negative electrode installation portion 6 are connected with conduction state.Particularly, between the negative pole part 30b and between negative pole part 30b on the negative electrode installation portion 6 and negative electrode installation portion 6, be folded with conductive adhesive 25.In addition, above-mentioned negative electrode installation portion 6 is integrally formed from the cathode terminal 10 that outer dress resin 8 exposes with a part.
(structure of the lead frame that this mode adopted)
In this mode, capacitor element 30 is being installed on lead frame 12, is forming in the operation of stacked solid electrolytic capacitor and have a characteristic.Below, with the structure of showing lead frame.
Fig. 3 is the vertical view that becomes the metallic plate 29 of lead frame 12.At first, to being that the metallic plate 29 of main component carries out stamping-out with copper, offer opening 16.In the metallic plate of so making 29, the connecting portion 15 that extends with linearity in the part (rest parts) beyond opening 16, between 15, dispose: the anode installation portion 7a, the 7b that connect the anode portion 30a of capacitor element 30; Connect the connecting portion 9 between these anode installation portions 7a, the 7b; The negative electrode installation portion 6 that is connecting negative pole part 30b; The anode terminal 11 that the side edge part of anode installation portion 7b and metallic plate 29 is connected; With the cathode terminal 10 that negative electrode installation portion 6 is connected with the side edge part of metallic plate 29.Wherein, through at above-mentioned connecting portion 15, the lead frame 20 that exists between 15, make a stacked solid electrolytic capacitor.
Here, describe according near the concrete structure Fig. 4 target installation portion 6 and anode installation portion 7a, the 7b.As shown in Figure 4; In cathode terminal 10 and boundary part negative electrode installation portion 6; Be formed with about 90 ° of first bend 17a,, be formed with about 90 ° of second bend 17b to foreign side's bending at the position of departing from this first bend 17a distance L 1 to the top bending.And; In anode terminal 11 and boundary part anode installation portion 7a, 7b; Be formed with about 90 ° of first bend 18a,, be formed with about 90 ° of second bend 18b to foreign side's bending at position from this first bend 18a deviation distance L2 to the top bending.Above-mentioned distance L 1 (height of the 17c of limiting wall portion that is formed by the first bend 17a and the second bend 17b), above-mentioned distance L 2 (height of the 18c of limiting wall portion that is formed by the first bend 18a and the second bend 18b) constitute roughly the same; Particularly; Be installed on the gross thickness of the negative pole part 30b in the capacitor element 30 (in this mode being 4) of anode installation portion 7a and negative electrode installation portion 6, the gross thickness that perhaps is installed on the negative pole part 30b in the capacitor element 30 (in this mode being 4) of anode installation portion 7b is essentially consistent length.And, in the boundary of anode installation portion 7a and connecting portion 9 and the boundary of anode installation portion 7b and connecting portion 9, being formed with the recess 13 that makes lead frame 12 be easy to bending, the distance L 3 between these recesses 13 is roughly 2 times of above-mentioned distance L 1.
And, above-mentioned lead frame 12 near the above-mentioned limiting wall 17c of portion of the folding surface 27c of cathode terminal 10 and the above-mentioned limiting wall 18c of portion of the folding surface 27a of anode terminal 11,27b near be formed with opening 28, for these openings 28; Because carried out stamping-out meeting weight reduction naturally; Capacitor element 30 is carried out range upon range of when, through being alignd with opening 28 in the center at its both ends, find the center easily; And, the location of contraposition position in the time of can correctly carrying out bending.In addition because when filling outer dress resin 8, resin can invade opening 28, so, make lead frame with adorn outward resin 8 combine firm.
And when lead frame 12 was bent into コ word shape, above-mentioned folding surface 27a, 27b formed bearing surface each other, and it is stable that the コ word is formed, and therefore, can avoid applying the load that is difficult to expect from direction the opposing party of single range upon range of capacitor element 30.
(manufacturing approach)
At first, with aluminium foil be cut into tabular, form anode bodies 31, in the for example phosphate aqueous solution of 0.001～2wt% or the adipic acid aqueous solution, it is carried out that electrolytics is synthetic to be handled, through forming by Al on its surface
2O
3The dielectric layer 32 that constitutes is made element.
Then, said elements is impregnated into by 3,4-ethylidene dioxy thiophene, P-p-methyl benzenesulfonic acid iron (III), reaches in the chemical polymerization liquid of 1-butanols formation, on dielectric layer 32, form the cathode layer 33 that constitutes by polythiophene.Then, on cathode layer 33, form carbon-coating 34, silver coating 35 successively, thereby accomplish capacitor element (aluminium monolithic component) 30.
Then, as shown in Figure 5, capacitor element 30 carried in advance put on the lead frame 12.At this moment; The anode installation portion 7a of the anode portion 30a of capacitor element 30 and lead frame 12,7b, and anode portion 30a between be electrically connected through resistance welded; In addition, the negative electrode installation portion 6 of the negative pole part 30b of capacitor element 30 and lead frame 12, and negative pole part 30b between be electrically connected through conductive adhesive.
Like this; After 44 ground are laminated to capacitor element 30 on the lead frame 12; Anode terminal 11 and cathode terminal 10 are downcut in the position by double dot dash line 19 expressions at Fig. 3, and then, at recess 13 places lead frame 12 is bent into コ word shape; As shown in Figure 6, connecting portion 9 is configured to the side of capacitor element 30.Thus, can under the not crooked state of 8 capacitor elements 30, carry out range upon range of.Then; Bending anode terminal 11 and cathode terminal 10; And between the folding surface 27a of anode terminal 11,27b, weld; And then through forming outer dress resin 8, as shown in Figure 1, be made into the stacked solid electrolytic capacitor that the part of anode terminal 11 and cathode terminal 10 is exposed from outer dress resin 8.
Wherein, the range upon range of number to the capacitor element 30 among each anode installation portion 7a, the 7b is made as equal number with the two in the present embodiment, but also needn't be made as equal number.And, after under the anode installation portion the stated situation about constituting by more than 3, need not be respectively identical quantity yet.
(variation 1)
In lead frame shown in Figure 7 12, except the negative electrode installation portion 6 that the number corresponding with anode installation portion 7b is set, constitute identical with above-mentioned best mode.In addition, to giving identical Reference numeral with the parts that above-mentioned best mode has a said function.Particularly, negative electrode installation portion 6 and anode installation portion 7a, 7b's and to put structure same, separate regulation the interval, be set up in parallel with same shape.For such lead frame 12, as shown in Figure 8, also same in 4 capacitor elements 30 of the upside among 8 capacitor elements 30 with 4 capacitor elements 30 of downside, be electrically connected with a side negative electrode installation portion 6.
Through adopting such structure, when cascade capacitor element 30 and during clinched lead frame 12, can stably block anode, the negative electrode of capacitor element 30.
In addition, as shown in Figure 9, negative electrode installation portion 6,6 is also same with anode installation portion 7a, 7b, connects through connecting portion 21, and adjacent negative electrode installation portion 6, lead frame 12 bendings between 6 are formed the コ word shape.According to such structure, can further bring into play above-mentioned effect, effect.
(variation 2)
Shown in figure 10, except between the anode installation portion 7a of lead frame 12,7b, being provided with the recess 13a, constitute with above-mentioned best mode same.
In such lead frame 12; Reverse with above-mentioned best mode; Can turn bending ground around and make stacked solid electrolytic capacitor, thus, anode installation portion 7a and anode installation portion 7b can be connected through (with the gross thickness equal length of two anode installation portion 7a, the 7b) connecting portion 9 of extremely lacking.
In addition; In the above-mentioned formation, though between a side 30 groups of capacitor elements and negative electrode installation portion 6, produce the gap, like Figure 11 and shown in Figure 12; Establish conductive adhesive 14 through folder between this gap, can make negative electrode installation portion 6 and be electrically connected with the negative pole part 30b of these negative electrode installation portion 6 adjacency.
(variation 3)
Shown in figure 13, except in lead frame, being provided with a negative electrode installation portion 6 and anode installation portion 7b (promptly three three are provided with negative electrode installation portion and anode installation portion), its formation and above-mentioned variation 1 are same more.
Specifically shown in figure 14, with a side anode installation portion 7b towards folding with the same direction of above-mentioned variation 1, with the opposing party's anode installation portion 7b towards folding with above-mentioned variation 1 rightabout.According to such structure, more capacitor element 30 can be installed.
In addition, the consecutive numbers of these 3 anode installation portion 7a, 7b can increase in the scope that design allows as required, can also can be 5 for 4.Its wrap direction of bending under this situation is opposite in order.
(other business)
(1) in the aforesaid way, in the boundary of anode installation portion 7a and connecting portion 9 and the places such as boundary of anode installation portion 7b and connecting portion 9, is formed with the recess 13 that makes lead frame 12 bendings easily, but on formation of the present invention, not necessarily needs this recess 13.
(2) in the aforesaid way, be provided with the 17c of limiting wall portion of cathode side and the 18c of limiting wall portion of anode-side, but on formation of the present invention, not necessarily need the 17c of this limiting wall portion, 18c.
(3) be not limited to above-mentioned aluminium as metal with valve action; Can be tantalum, niobium etc.; And solid electrolyte layer is not limited to the electric conductive polymer of polythiophene system, also can be polypyrrole system, polyphenylamine series, gather electric conductive polymer such as furans system or manganese dioxide etc.
Utilizability on the industry
The present invention for example can be used as chip mounted capacitor on printed base plate and uses, and in addition, can also in various fields, utilize.
Claims (12)
1. a stacked solid electrolytic capacitor possesses a plurality of capacitor elements, and said capacitor element possesses: the anode bodies with anode portion; Formed the negative pole part of dielectric oxide scale film and cathode layer successively with surface at this anode bodies; And these capacitor elements form at least 2 groups with range upon range of state configuration,
Wherein, anode terminal is provided with a plurality of said anode installation portions, and these anode installation portions are configured to be parallel to each other, and,
Between the anode installation portion of adjacency, thereby respectively through 1 metallic plate warpage is connected with the connecting portion of the adjacent integrated formation of each anode installation portion,
The anode portion of one group capacitor element is drawn and is weldingly fixed in adjacent that among a plurality of said anode installation portion that is provided with on the said anode terminal,
The anode terminal of adjacency all flexagon becomes コ word shape, is soldered fixing in this flex location between the anode terminal of adjacency.
2. folded type solid electrolytic capacitor according to claim 1 is characterized in that,
Between the adjacent negative pole part of said capacitor element, and the negative pole part of the negative electrode installation portion that is electrically connected with cathode terminal and the capacitor element that on this negative electrode installation portion, disposes, be electrically connected through conductive adhesive.
3. folded type solid electrolytic capacitor according to claim 1 and 2 is characterized in that,
The anode installation portion of said adjacency and the said connecting portion angulation that these anode installation portions are connected are restricted to vertical respectively.
4. folded type solid electrolytic capacitor according to claim 1 and 2 is characterized in that,
Dispose according to opposed mode between the anode installed surface of the anode installation portion of said adjacency; And the height that will have the connecting portion that connects between the anode installation portion of these anode installed surfaces is defined as with the gross thickness of the capacitor element that between the anode installation portion of adjacency, exists and equates.
5. folded type solid electrolytic capacitor according to claim 1 and 2 is characterized in that,
Intersection at said anode installation portion and said connecting portion is formed with incised notch.
6. folded type solid electrolytic capacitor according to claim 1 and 2 is characterized in that,
By contact configuration, and with these height, be defined as with the gross thickness of two anode installation portions and equate between the anti-anode installed surface of the anode installation portion of said adjacency with the connecting portion that connects between the anode installation portion of anode installed surface.
7. folded type solid electrolytic capacitor according to claim 6 is characterized in that,
Central portion at said connecting portion is formed with incised notch.
8. folded type solid electrolytic capacitor according to claim 1 and 2 is characterized in that,
At said anode terminal and intersection said anode installation portion, be formed with limiting wall portion along the direction identical with the stacked direction of capacitor element.
9. folded type solid electrolytic capacitor according to claim 2 is characterized in that,
Said negative electrode installation portion and said anode installation portion are provided with same number.
10. the manufacturing approach of a stacked solid electrolytic capacitor; Have: the part through on the surface of anode bodies forms dielectric oxide scale film and cathode layer successively; Make and a plurality ofly be in the capacitor element that the anode portion of exposing state constitutes by negative pole part and anode bodies; And, make the first step have a plurality of anode installation portions and to connect the lead frame that constitutes by 1 metallic plate between the anode installation portion of adjacency by connecting portion respectively;
Make said a plurality of capacitor element respectively in the anode installation portion laminated multilayer of said lead frame, and with the second fixing step of welding between anode installation portion and anode portion and the anode portion; With
Come the third step of the said lead frame of warpage according to parallel mode between the anode installation portion of adjacency.
11. the manufacturing approach of stacked solid electrolytic capacitor according to claim 10 is characterized in that,
In said first step; According to the length of said connecting portion with and two anode installation portions being connected of connecting portion between the mode that equates of the gross thickness of the capacitor element that exists make lead frame; And; In said third step, lead frame is carried out warpage according to opposed mode between two anode installed surfaces of adjacency.
12. the manufacturing approach of stacked solid electrolytic capacitor according to claim 10 is characterized in that,
In said first step; Length according to said connecting portion is made lead frame with the mode that the gross thickness of two anode installation portions equates; And, in said third step, according to being made the lead frame warpage by the mode of contact configuration between two anti-anode installed surfaces of adjacency.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005140992 | 2005-05-13 | ||
| JP140992/2005 | 2005-05-13 | ||
| PCT/JP2005/023731 WO2006120779A1 (en) | 2005-05-13 | 2005-12-26 | Stacked type solid electrolytic capacitor and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101176172A CN101176172A (en) | 2008-05-07 |
| CN101176172B true CN101176172B (en) | 2012-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005800497761A Active CN101176172B (en) | 2005-05-13 | 2005-12-26 | Stacked type solid electrolytic capacitor and method for manufacturing same |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7916457B2 (en) |
| JP (1) | JP4688875B2 (en) |
| KR (1) | KR101117041B1 (en) |
| CN (1) | CN101176172B (en) |
| TW (1) | TWI292164B (en) |
| WO (1) | WO2006120779A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5041982B2 (en) * | 2007-11-20 | 2012-10-03 | 三洋電機株式会社 | Solid electrolytic capacitor |
| JP5132374B2 (en) * | 2008-03-18 | 2013-01-30 | 三洋電機株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| JP4725623B2 (en) * | 2008-09-25 | 2011-07-13 | Ｔｄｋ株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| JP5158966B2 (en) * | 2008-10-28 | 2013-03-06 | 三洋電機株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| US8614880B2 (en) | 2008-12-29 | 2013-12-24 | Showa Denko K.K. | Solid electrolytic capacitor including positive and negative electrode lead terminals |
| CN102074383B (en) * | 2009-11-19 | 2013-05-29 | 钰邦电子（无锡）有限公司 | Stack solid electrolytic capacitor with multi-end pins |
| CN102074354B (en) * | 2009-11-20 | 2014-04-23 | 钰邦电子（无锡）有限公司 | Stack capacitor with multi-end anode pins |
| TWI469162B (en) * | 2009-11-23 | 2015-01-11 | Stacked solid electrolytic capacitor and method for manufacturing the same | |
| JP5879491B2 (en) * | 2012-02-28 | 2016-03-08 | パナソニックＩｐマネジメント株式会社 | Solid electrolytic capacitor |
| US20130258555A1 (en) * | 2012-04-02 | 2013-10-03 | Apaq Technology Co., Ltd. | Capacitor unit and stacked solid electrolytic capacitor having the same |
| TWI502611B (en) * | 2013-02-06 | 2015-10-01 | Apaq Technology Co Ltd | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same |
| US20140307365A1 (en) * | 2013-04-11 | 2014-10-16 | Apaq Technology Co., Ltd. | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same |
| DE102015102866B4 (en) | 2015-02-27 | 2023-02-02 | Tdk Electronics Ag | Ceramic component, component arrangement and method for producing a ceramic component |
| JP6702427B2 (en) * | 2016-11-04 | 2020-06-03 | 株式会社村田製作所 | Solid electrolytic capacitor |
| JP7102256B2 (en) * | 2018-06-27 | 2022-07-19 | 株式会社村田製作所 | Multilayer ceramic electronic components |
| CN109637811B (en) * | 2018-12-13 | 2021-03-23 | 福建国光电子科技有限公司 | Ultra-thin polymer sheet type laminated solid aluminum electrolytic capacitor and preparation method thereof |
| TWM616164U (en) | 2021-06-24 | 2021-08-21 | 立隆電子工業股份有限公司 | Stacked aluminum electrolytic capacitor |
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| CN1327246A (en) * | 2000-05-26 | 2001-12-19 | 松下电器产业株式会社 | Solid electrolytic capacitor |
| US6343004B1 (en) * | 1998-08-26 | 2002-01-29 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
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| JP2645562B2 (en) | 1987-12-25 | 1997-08-25 | 日通工株式会社 | Manufacturing method of multilayer solid electrolytic capacitor |
| JPH01278011A (en) * | 1988-04-28 | 1989-11-08 | Nitsuko Corp | Layer-built solid electrolytic capacitor |
| JPH05205984A (en) * | 1992-01-27 | 1993-08-13 | Nec Corp | Laminated solid electrolytic capacitor |
| JP3079780B2 (en) * | 1992-06-24 | 2000-08-21 | 日本電気株式会社 | Multilayer solid electrolytic capacitor and method of manufacturing the same |
| JPH11135367A (en) | 1997-10-29 | 1999-05-21 | Nitsuko Corp | Multilayered solid electrolytic capacitor |
| JP2003045755A (en) * | 2001-07-30 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor and manufacturing method therefor |
| DE10222405B4 (en) * | 2002-05-21 | 2007-09-27 | Epcos Ag | Chip capacitor and method for its production |
| TWI226648B (en) * | 2002-07-18 | 2005-01-11 | Epcos Ag | Surface-mountable component and its production method |
| JP2004253615A (en) * | 2003-02-20 | 2004-09-09 | Nec Tokin Corp | Solid electrolytic capacitor and manufacturing method thereof |
| JP4472277B2 (en) * | 2003-04-10 | 2010-06-02 | Ｎｅｃトーキン株式会社 | Chip type solid electrolytic capacitor |
| JP2005005642A (en) * | 2003-06-16 | 2005-01-06 | Nec Tokin Corp | Chip type solid electrolytic capacitor and its manufacturing method |
| JP2005166832A (en) * | 2003-12-01 | 2005-06-23 | Rohm Co Ltd | Solid-state electrolytic capacitor |
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- 2005-12-26 US US11/914,184 patent/US7916457B2/en not_active Expired - Fee Related
- 2005-12-26 KR KR1020077026288A patent/KR101117041B1/en not_active IP Right Cessation
- 2005-12-26 WO PCT/JP2005/023731 patent/WO2006120779A1/en active Application Filing
- 2005-12-26 CN CN2005800497761A patent/CN101176172B/en active Active
- 2005-12-26 JP JP2007526813A patent/JP4688875B2/en active Active
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- 2006-03-06 TW TW095107395A patent/TWI292164B/en not_active IP Right Cessation
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| US6343004B1 (en) * | 1998-08-26 | 2002-01-29 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| CN1327246A (en) * | 2000-05-26 | 2001-12-19 | 松下电器产业株式会社 | Solid electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080010413A (en) | 2008-01-30 |
| JPWO2006120779A1 (en) | 2008-12-18 |
| KR101117041B1 (en) | 2012-03-19 |
| US7916457B2 (en) | 2011-03-29 |
| CN101176172A (en) | 2008-05-07 |
| WO2006120779A1 (en) | 2006-11-16 |
| TWI292164B (en) | 2008-01-01 |
| TW200641941A (en) | 2006-12-01 |
| JP4688875B2 (en) | 2011-05-25 |
| US20090080146A1 (en) | 2009-03-26 |
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