CN101174508A - Lead frame, upside-down mounted terminal solid electrolyte capacitor and its manufacturing method using lead frame - Google Patents
Lead frame, upside-down mounted terminal solid electrolyte capacitor and its manufacturing method using lead frame Download PDFInfo
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- CN101174508A CN101174508A CNA2006100644540A CN200610064454A CN101174508A CN 101174508 A CN101174508 A CN 101174508A CN A2006100644540 A CNA2006100644540 A CN A2006100644540A CN 200610064454 A CN200610064454 A CN 200610064454A CN 101174508 A CN101174508 A CN 101174508A
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Abstract
The invention relates to a lead frame and the method using the lead wire frame to manufacture a solid electrolytic capacitor with back terminals, wherein, the solid electrolytic capacitor with back terminals is provided with a capacitor element (11), an anode terminal and a cathode terminal; in the lead wire frame (100), the frame body (110) is provided with a connecting part (111) for connecting with the capacitor element (11); the connecting part (111) is extended from the cathode terminal forming part (22) to the position close to the anode terminal forming part (22) in the first direction (A1); the anode terminal forming part (22) is connected with the frame body (110) for forming the anode terminal; the cathode terminal forming part (22) is connected with the frame body (110) for forming the cathode terminal; the anode terminal forming part (22) and the cathode terminal forming part (22) are separated mutually on the main surface (112) of the frame body (110) in the first direction (A1).
Description
Background technology
The present invention relates generally to a kind of lead frame that uses in the manufacturing of face-down terminals type solid electrolytic capacitor (hereinafter with " face-down terminals (face-down terminal) solid electrolytic capacitor " expression), this electrolytic capacitor has the electrode of directly pulling out or leading to the plate installation side, and relates to a kind of upside-down mounted terminal solid electrolyte capacitor that uses this lead frame to make the method for upside-down mounted terminal solid electrolyte capacitor and utilize this method to make.
Use that tantalum, niobium etc. are little as the solid electrolytic capacitor size of valve metal, capacitance is big, frequency characteristic is remarkable, so, be widely used in the decoupling circuit and power circuit of CPU for example.Along with the development of recent portable electronic equipment, have the electrode that directly is drawn out to the plate installation side and especially in high frequency band the whole capacitor utensil upside-down mounted terminal solid electrolyte capacitor of little ESR (equivalent serial resistance) and little ESL (sensing element) is arranged by commercialization day by day.
For example, in open (JP-A) No.2003-133177 (patent documentation 1) of Japanese unexamined patent, disclosed a kind of like this upside-down mounted terminal solid electrolyte capacitor.This capacitor is made as follows.Prepare a housing, it comprises anode part and the cathode portion that faces with each other, and anode and cathode portion have the interconnective lower end of the coupling unit of utilization.One capacitor element is being set to be connected electrically between anode and the cathode portion between this anode and the cathode portion.Behind the zone that covers with synthetic resin between this anode and the cathode portion, this coupling unit be grounded or remove with this anode and cathode portion mutually electricity isolate, and expose anode and the cathode portion that is used for face circuit board to the open air.
For example, in open (JP-A) No.2004-349270 (patent documentation 2) of Japanese unexamined patent, disclosed another kind of upside-down mounted terminal solid electrolyte capacitor.In this capacitor, the negative electrode exposed portion that exposes to the open air from potting resin is arranged on relative cathode terminal at least two positions at grade.
Yet, the electrode terminal structure defectiveness of above-mentioned upside-down mounted terminal solid electrolyte capacitor.Particularly, distance of the current path between this anode and negative electrode or the distance of the conductive path from this capacitor element to this circuit board are quite long.In addition, skin depth reduces at high frequency band, and therefore, ESR of whole capacitor device (equivalent serial resistance) and ESL (inductive component) increase very significantly.Therefore can not realize the enough low ESR and the ESL value of whole capacitor device.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of lead frame, and it can reduce the current path distance between anode and the negative electrode, to realize the enough low ESR and the ESL value of whole capacitor device.
Another object of the present invention is that a kind of manufacture method of using the upside-down mounted terminal solid electrolyte capacitor of above-mentioned lead frame will be provided.
Another purpose of the present invention is that a kind of upside-down mounted terminal solid electrolyte capacitor that utilizes said method to make will be provided.
According to an aspect of the present invention, provide a kind of and had the lead frame that uses in the upside-down mounted terminal solid electrolyte capacitor of capacitor element, anode terminal and cathode terminal in manufacturing, this lead frame is included in the upwardly extending framework of first party; The anode terminal that is connected to form anode terminal with this framework forms part; And the cathode terminal that is connected to form cathode terminal with this framework forms part, this anode terminal forms part and cathode terminal forms partly separated from one another on the first direction on this framework first type surface, wherein this framework comprises and is used for the coupling part that is connected with this capacitor element, and this coupling part forms part from this cathode terminal and extends to the position that forms part near this anode terminal on this first direction.
Above-mentioned lead frame can constitute like this, makes the coupling part limit a join domain that is electrically connected with this capacitor element that forms at this anode terminal between part and the cathode terminal formation part.
Above-mentioned lead frame can constitute like this, make this solid electrolytic capacitor have one and connect end face and be connected the anode tap that end face is drawn from this, and this anode terminal formation part is used for being connected with this anode tap.
Above-mentioned lead frame can constitute like this, makes this coupling part form part from this cathode terminal and extends near the position along the plane of reference of this connection end face.
Above-mentioned lead frame can constitute like this, makes this join domain form part from this cathode terminal and extends to along the plane of reference of this connection end face.
Above-mentioned lead frame can constitute like this, makes this anode terminal formation part form a crushed element, and it is given prominence to from this first type surface on perpendicular to the second direction of this first type surface, to have recessed surface and to be recessed into the relative convex surfaces in surface with this.
In above-mentioned lead frame, but plating should recessed surface.
Above-mentioned lead frame can constitute like this, make this protrusion surface comprise with the planar section of this major surfaces in parallel and certainly this planar section extend on this first direction the sloping portion that forms part away from this cathode terminal, and this sloping portion that tilts is with near this first type surface.
According to the basic structure of aforesaid this lead frame, the current path between this anode and negative electrode shortens, thereby the ESR of whole capacitor device and ESL have enough low value.
In above-mentioned lead frame, this crushed element can form by drawing or calendering technology.
In the above-mentioned lead frame of mentioning, this crushed element can form by mould pressing process.
The above-mentioned lead frame of mentioning can constitute like this, and making this recessed surface is polygonal shape in being parallel to the cross section of this first type surface.
The above-mentioned lead frame of mentioning can constitute like this, and this recessed surface is being parallel on the cross section of this first type surface for having the shape of at least one straight line.
Recessed surface with this shape is easy to the cutting that chip body is separated from this lead frame.At this, chip body representative is connected with this lead frame and the main body of the upside-down mounted terminal solid electrolyte capacitor that is cut.
Above-mentioned lead frame can constitute like this, makes this crushed element have the ledge that stretches out and form away from first type surface and on the third direction perpendicular to this first and second direction.
Above-mentioned lead frame can constitute like this, and this crushed element is had away from first type surface and the formation recess that extends internally on the third direction perpendicular to this first and second direction.
By providing the convex surfaces with ledge or recess in this mode, this ledge or recess are used as the fixture (anchors) of this potting resin, thereby have improved installation strength.
In above-mentioned lead frame, each this anode terminal formation part and cathode terminal form partly can be provided with and comprise film at least a among Ag, Au, Cu, Pd and the Sn.
In above-mentioned lead frame, each this anode terminal formation part and cathode terminal form partly can be provided with on perpendicular to the surface on the direction of this first type surface and comprise film at least a among Ag, Au, Cu, Pd and the Sn, to form this anode terminal and this cathode terminal respectively.
By forming part setting and comprise film at least a among Ag, Au, Cu, Pd and the Sn for each this anode terminal forms part and this cathode terminal, increased the adhesion of contact-making surface place scolder etc. in this mode.
About current path, especially in high frequency band, skin depth δ is by δ=(ρ/π f μ)
1/2Provide, wherein ρ represents resistance coefficient, and f represents frequency, and μ represents magnetic conductivity.According to this formula, because kelvin effect in high frequency band, tens microns or surface current pathdepth still less have influence.Therefore, in order to reduce this ESL, the structure that adopts plating to have the Au of low-resistance coefficient ρ is a best method.In addition, if anode terminal and cathode terminal are cut to arrange shape in the part as the current path between anode and the negative electrode on the thickness direction, so preferred surface with plating is retained in the mode of the recessed surface of electrode terminal formation part (anode terminal forms part and cathode terminal formation part) and cuts.Like this, can reduce ESL.
According to the present invention, a kind of method of making upside-down mounted terminal solid electrolyte capacitor also is provided, this method comprises this lead frame that preparation is above-mentioned; Preparation has the capacitor element of anode tap; This capacitor element is combined with this lead frame; Coat molded this capacitor element and this lead frame with potting resin; Cut this lead frame, anode tap and this potting resin, thereby form an outer surface as the side surface of this solid electrolytic capacitor.
Above-mentioned method can constitute like this, make anode terminal form part and cathode terminal and form part and have coating surface, and in the coating surface one cuts and remains next coating surface.
Above-mentioned method also can comprise, before this combination, an insulating resin is applied to the part that this anode terminal forms part.
According to the present invention, also provide a kind of upside-down mounted terminal solid electrolyte capacitor that utilizes above-mentioned method to make.Wherein this capacitor element comprise be formed on successively make by valve metal and have from lip-deep dielectric layer, electrolyte layer and the cathode layer of the porous sintered body of its anode tap of pulling out; The anode terminal that formation at one end is connected with anode tap and the other end is located as the anode terminal formation part of external connection terminals; The cathode terminal that formation at one end is connected with the cathode layer of capacitor element and the other end is located as the cathode terminal formation part of external connection terminals; Potting resin covers this capacitor element, and arranges like this make the exterior side surfaces that each anode terminal and cathode terminal have exposed surface and are substantially perpendicular to installation surface on the installation surface for plate.
In addition, in the above-mentioned upside-down mounted terminal solid electrolyte capacitor of mentioning, improved the structure of lead frame.Therefore, the current path between anode and the negative electrode shortens, thereby the ESR of whole capacitor device and ESL have enough low value.Therefore, guaranteed remarkable reliability.
Description of drawings
The end view of Figure 1A for seeing from anode-side as the upside-down mounted terminal solid electrolyte capacitor basic structure of describing prior to background technology of the present invention;
Figure 1B is removed with the cross-section front view under the state of showing this capacitor inside by part at potting resin for the capacitor among Figure 1A; And
Fig. 1 C this capacitor end view for seeing from cathode side;
Fig. 2 illustrates a pilot process that the capacitor that illustrates among Figure 1A to 1C the makes cross-section front view under capacitor element and state that lead frame combines;
Fig. 3 A is the end view that illustrates that upside-down mounted terminal solid electrolyte capacitor basic structure is according to an embodiment of the invention seen from anode-side;
Fig. 3 B is removed with the cross-section front view under the state of showing this capacitor inside by part at potting resin for the capacitor among Fig. 3 A;
Fig. 3 C this capacitor end view for seeing from cathode side;
Fig. 4 illustrates a pilot process that the capacitor that illustrates among Fig. 3 A to 3C the makes cross-section front view under capacitor element and state that lead frame combines;
Fig. 5 A is the amplification cross sectional view that the ledge on the convex surfaces that the electrode connecting portion of the lead frame that is formed on Fig. 4 divides is shown;
Fig. 5 B is the amplification cross sectional view that the recess on the convex surfaces that the electrode connecting portion of the lead frame that is formed on Fig. 4 divides is shown;
Fig. 6 is the flow chart of the manufacturing step of the upside-down mounted terminal solid electrolyte capacitor shown in description Fig. 3 A to 3C.
Embodiment
Be easy to understand the present invention, with the basic structure that at first illustrates prior to the upside-down mounted terminal solid electrolyte capacitor of prior art of the present invention.Such upside-down mounted terminal solid electrolyte capacitor is proposed in Japanese patent application No.2004-002180, Japanese patent application No.2004-358094, Japanese patent application No.2004-358095 etc. by this obligee.
Referring to Figure 1A to 1C, this upside-down mounted terminal solid electrolyte capacitor comprises the capacitor element 71 with lip-deep dielectric layer, electrolyte layer and cathode layer of being formed on the porous sintered body of being made by valve metal successively, and the anode tap 72 of pulling out from this capacitor element 71.Lead frame 200 has anode terminal and forms part 81 and cathode terminal formation part 82.By this lead frame 200 is applied to this capacitor element 71, one end is connected with this anode tap 72 and the other end is formed on this anode terminal as the upside-down mounting anode terminal 73 of external connection terminals and forms part 81 places, and the upside-down mounting cathode terminal 74 that an end is connected with the cathode layer of this capacitor element 71 and the other end is used as external connection terminals is formed on this cathode terminal formation part 82 places.In addition, with potting resin 99 coat molded with cover this capacitor element 71 and make anode terminal 73 and cathode terminal 74 in each all have exposed surface that is positioned at the installation surface place that will be installed on the plate and the exterior side surfaces that is basically perpendicular to this installation surface.
Here, anode terminal 73 is formed on anode terminal formation part 81 places that part is coated with insulating resin 77 in advance.Cathode terminal 74 is formed on cathode terminal and forms part 82 places, is connected with capacitor element 71 to utilize electroconductive binder 80.Be exposed to anode-side, and be exposed to cathode side by the cathode side orle of plating surface 76b by the anode-side orle of plating surface 76a.
Figure 1A shows the normally anode terminal cut surface 79 of U-shaped, Fig. 1 C shows cathode terminal cut surface 78, the surface that Figure 1B shows the recessed surface with plating inner surface in a longitudinal direction an end face and the place, other end respectively as the state of anode-side orle surface 76a and cathode side orle surface 76b.Be provided at anode-side ledge 25a that the end face on this longitudinal direction exposes to the open air and the cathode side ledge 25b that exposes to the open air in the other end as terminal, be used to obtain to enter the fixed effect in this potting resin 99.
Referring to Fig. 2, capacitor element 71 combines with lead frame 200 so that use in producing this upside-down mounted terminal solid electrolyte capacitor.Coat molded lead frame 200 and capacitor element 71 with potting resin 99.Therefore, the structure of this description is the interstage of the manufacturing before cutting step.
Now, will the manufacturing step of above-mentioned upside-down mounted terminal solid electrolyte capacitor be described.At first, form this lead frame 200 with predetermined plate frame shape.
In this lead frame 200, the anode coupling part comprises that the anode terminal that is used to form this anode terminal 73 forms part 81 (coarse line region), and forms part 81 extensions to guarantee the connection between anode terminal 73 and the anode tap 72 from this anode terminal.The anode coupling part of lead frame 200 by on perpendicular to the direction of this installation surface with the direction different with it on drawing or extruding or mould pressing process distortion, thereby form the anode terminal crushed element.This crushed element has the recessed surperficial S1 that is arranged on this installation surface side and the convex surfaces S2 relative with this installation surface (as respectively from installation surface side and the profile in the anode coupling part of lead frame 200 seen with installation surface side opposite side).This crushed element has a pair of perpendicular to upwardly extending vertical component 81a in the side of the installation surface that is inserted with anode-side cut surface 83a and the bridging part 81b that is connected vertical component 81a.This bridging part 81b is provided with and is parallel to installation surface and extends and tilt with near the sloping portion 86 away from the installation surface of planar section 87 as the planar section 87 of welded edge with from planar section 87.Therefore, above-mentioned series of steps can be called the inclination operation of anode terminal crushed element.The anode coupling part that is used to form anode terminal formation part 81 has inclination with approaching as follows away from the reason of the sloping portion 86 of the installation surface of planar section 87 as bridging part 81b.Have above-mentioned structure, during resistance welded, pad is positioned at the cut surface inboard on anode tap 72.Because the existence of this sloping portion 86, this pad is concentrated into a target position.
Equally, in this lead frame 200, the negative electrode coupling part comprises that the cathode terminal that is used to form this cathode terminal 74 forms part 82 (coarse line region), and forms part 82 extensions from this cathode terminal.The negative electrode coupling part of lead frame 200 by on perpendicular to the direction of this installation surface with the direction different with it on by drawing or extrusion process distortion, thereby formation cathode terminal crushed element.This crushed element has the recessed surperficial S1 that is arranged on the installation surface side and the convex surfaces S2 relative with installation surface (as respectively from installation surface side and the profile in the negative electrode coupling part of lead frame 200 seen with installation surface side opposite side).This crushed element have a pair of perpendicular to the upwardly extending vertical component 82a in the side of the installation surface that is inserted with cathode side cut surface 83b be parallel to installation surface and extend and be connected the bridging part 82b of vertical component 82a.The combination that the inclination processing of anode terminal crushed element and the inclination of cathode terminal crushed element are handled can be called the deformation process that is used for the electrode terminal distortion jointly.
Then, lead frame 200 comprises recessed surperficial S1 by plating, and capacitor element 71 is fixed and is attached to lead frame 200.In addition, after molded with potting resin 99 coatings, potting resin 99 and lead frame 200 are cut along anode-side cut surface 83a and cathode side cut surface 83b (being positioned at the anode-side orle surface recessed portion 84a and the recessed portion 84b outside, cathode side orle surface).
In order to save cost,, can before lead frame 200 formation, carry out plating just in case coating layer is residual after lead frame forms and is used for the deformation process of electrode terminal distortion.
In any case, be attached to lead frame 200 and overmold is shaped under the state of potting resin 99 at capacitor element 71, form that anode terminal forms part 81 and cathode terminal forms part 82.By carrying out cutting to obtain a chip along anode-side cut surface 83a and cathode side cut surface 83b, after cutting, anode-side orle surface recessed portion 84a and cathode side orle surface recessed portion 84b are as the orle surface.Here, recessed surperficial by this is provided at the plating that anode terminal forms in part 81 and the cathode terminal formation part 82, need not after cutting, to carry out plating and handle.
Referring to Figure 1B, according to background technology described above, cathode terminal 74 and capacitor element 71 interconnect in join domain by utilizing electroconductive binder 80, and this join domain only exists only in the cathode side zone about the plane of reference 17.Here, this plane of reference 17 is provided by the connection end face of the capacitor element 71 that inserts anode tap 72.(in other words the installation surface place part that cathode terminal 74 utilizes electroconductive binder 80 to connect with the join domain that exists in corresponding to the cathode side zone exposes to the open air, cathode terminal 74 does not exist near the plane of reference 17, and does not expose to the open air at the installation surface place near the plane of reference 17).Have such structure, increased the current path distance between anode and negative electrode, thereby be increased in the ESR and the ESL of whole capacitor device on the high frequency band.
Just, in this obligee each upside-down mounted terminal solid electrolyte capacitor that technology proposes as a setting, the current path from capacitor element 71 to circuit board is because electrode terminal structure and elongated.Therefore, as the situation in patent documentation 1 and patent documentation 2, the skin depth on high frequency band is little, and therefore, it is big that the ESR of whole capacitor device and ESL become.
Hereinafter, will describe lead frame of the present invention in conjunction with the preferred embodiments in detail, utilize the manufacture method of upside-down mounted terminal solid electrolyte capacitor of this lead frame and the upside-down mounted terminal solid electrolyte capacitor that utilizes this method to make.
Referring to Fig. 3 A to 3C, upside-down mounted terminal solid electrolyte capacitor according to this embodiment comprises capacitor element 11, this capacitor element 11 has lip-deep dielectric layer, electrolyte layer and the cathode layer that is formed on the porous sintered body of being made by valve metal successively, and pulls out an anode tap 12 from this capacitor element 11.By lead frame 100 (back will describe in detail) is applied to this capacitor element 11, form upside-down mounting anode terminal 13 and upside-down mounting cathode terminal 14.Upside-down mounting anode terminal 13 has an end that is connected with anode tap 12 and the other end that is used as external connection terminals.Upside-down mounting cathode terminal 14 has an end that is connected with the cathode layer of this capacitor element 11 and the other end that is used as external connection terminals.In addition, coat molded potting resin 19 with covering capacitor element 11 and make in anode terminal 13 and the cathode terminal 14 each all have exposed surface at the installation surface place, that is, will be installed to the bottom surface on the plate and be substantially perpendicular to the exterior side surfaces of this installation surface.The structure of above-mentioned similar in background technology.Yet in this embodiment, cathode terminal 14 and capacitor element 11 are interconnecting 17 join domains that extend from the cathode side part to the plane of reference by utilizing electroconductive binder 20.Here, this plane of reference 17 is provided by the connection end face 113 that capacitor element 11 is inserted with anode tap., notice the distance that this join domain extensible is slightly short here, that is, partly to the plane of reference 17 position before, need only join domain and be positioned near this plane of reference 17 from cathode side.
The lead frame 100 that has improved by use, upside-down mounted terminal solid electrolyte capacitor according to this embodiment constitutes like this, make cathode terminal 14 utilize electroconductive binder 20 connect with on corresponding to the installation surface of 17 join domains that extend from the cathode side part to the plane of reference all (or part) expose to the open air.
Anode terminal 13 is formed on anode terminal and forms part place (preferred, anode terminal forms part and partly is coated with insulating resin in advance).Cathode terminal 14 is formed on cathode terminal and forms part and sentence with electroconductive binder 20 and be connected with capacitor element 11.Exposed to the open air in anode-side, exposed to the open air at cathode side by the orle of plating surface 15b by the orle of plating surface 15a.
Fig. 3 A shows the normally anode terminal cut surface 16 of U-shaped, Fig. 3 C shows cathode terminal cut surface 18, and Fig. 3 B shows an end face and the anode-side orle surface 15a at place, other end and the state of cathode side orle surface 15b on the solid electrolytic capacitor longitudinal direction of being respectively formed at.Provide anode-side ledge 25a that the end face in a longitudinal direction as terminal exposes to the open air and the cathode side ledge 25b that exposes to the open air in the other end, to obtain to enter the fixed effect (anchor effect) of this potting resin 19.
Referring to Fig. 4, capacitor element 11 combines with lead frame 100 to use in producing this upside-down mounted terminal solid electrolyte capacitor.Lead frame 100 and capacitor element 11 overmold are shaped on potting resin 19.Therefore, the structure of this description is the interstage of the manufacturing before cutting step.
Compare with the lead frame 200 according to background technology, each size on this first direction A1 that this anode terminal forms part and cathode terminal formation part 21 and 22 has all reduced.Therefore, what this embodiment was different from background technology is that the cathode terminal 14 that is formed on cathode terminal formation part 22 places extends to and is formed on the anode terminal 13 that anode terminal forms part 21 places, and exposes to the open air at the installation surface place.
In lead frame 100, the anode coupling part comprises that the anode terminal that is used to form anode terminal 13 forms part 21 (coarse line region), and forms part 21 extensions to guarantee the connection between anode terminal 13 and anode tap 12 from this anode terminal.This anode coupling part by on perpendicular to the direction of first type surface 112 with the direction different with it on drawing or mold pressing (extruding) handle distortion, thereby formation anode terminal crushed element.In other words, anode terminal forms part 21 and forms as crushed element, and it is given prominence to from first type surface 112 on perpendicular to the second direction A2 of first type surface 112.This crushed element have recessed surperficial S1 with the recessed relative convex surfaces S2 of surperficial S1.This crushed element has a pair of anode-side cut surface 23a that has and is inserted in vertical component 21a wherein, that extend and extends to be connected the bridging part 21b of vertical component 21a on this second direction A2.Vertical component 21a is by plating, and bridging part 21b is provided with and is parallel to first type surface, extends away from cathode terminal formation portion 22 and tilt with near the sloping portion 26 of this first type surface away from planar section 27 as the planar section 27 of welded edge with from this planar section 27.This sloping portion 26 can utilize extrusion process to form.Be used to form anode coupling part that anode terminal forms part 21 have inclination with this bridging part 21b during away from planar section 27 reason near the sloping portion 26 of first type surface as follows.According to above-mentioned structure, when the resistance welded of antianode lead-in wire 12, pad is positioned at the cut surface inboard.Because the existence of sloping portion 26, pad is concentrated into a target position.
Equally, in lead frame 100, the negative electrode coupling part comprises that being used to form these cathode terminal 14 cathode terminals forms part 22 (coarse line region), and forms part 22 extensions from cathode terminal.The negative electrode coupling part of lead frame 100 by on this second direction A2 with the direction different with it on drawing or extrusion process distortion, thereby form the cathode terminal crushed element.This crushed element has the recessed surperficial S1 that is arranged on the installation surface side and the convex surfaces S2 relative with installation surface (as respectively from installation surface side and the profile in the negative electrode coupling part of lead frame 100 seen with the installation surface opposite side).This crushed element has a pair of vertical component 22a that extends and is parallel to this installation surface and extends and be connected the bridging part 22b of vertical component 22a on the second direction A2 that is inserted with cathode side cut surface 23b.Be parallel to this first type surface 112 if this crushed element has, be polygonal shape or cross section with shape (usually, having the polygonal shape at three or more angles) of at least one straight line, cutting is to separate a chip body from this lead frame 100 easily.
In addition, each bridging part 21b and 22b are provided with and are formed on lip-deep ledge 31 (Fig. 5 A) or the recess 32 (Fig. 5 B) that is basically perpendicular to first type surface 112, and this ledge 31 or this recess 32 extend and form away from first type surface on perpendicular to the third direction A3 of the first and second direction A1 and A2.By such structure, ledge 31 or recess 32 are as the set portion of this potting resin 19, to improve this constant intensity.
In addition, anode terminal forms part 21 and cathode terminal and forms part 22 and be respectively arranged with at least one the film that comprises among Ag, Au, Cu, Pd and the Sn to form anode terminal 13 and cathode terminal 14.Similarly, anode terminal forms and to be respectively arranged with at least one the film that comprises among Ag, Au, Cu, Pd and the Sn on each surface on second direction A2 that part 21 and cathode terminal form part 22 to form anode terminal 13 and cathode terminal 14.By such structure, increased adhesion at contact-making surface place scolder etc.
Referring to Fig. 6, with the manufacture process of the above-mentioned upside-down mounted terminal solid electrolyte capacitor of explanation.With with background technology in the same way as that illustrates, at first form lead frame 100 (step S1) with predetermined grillage shape.As an independent element, prepare to have the capacitor element 11 of anode tap 12.
Comprise the anode terminal that is used to form anode terminal 13 form part 21 (coarse line region) and from anode terminal form part 21 extend with guarantee the anode coupling part of the lead frame 100 of the connection between anode terminal 13 and the anode tap 12 by on this second direction A2 with the direction different with it on drawing or extrusion process distortion.Thereby, form the anode terminal crushed element.This crushed element has the recessed surperficial S1 and the convex surfaces S2 relative with installation surface that is positioned at the installation surface side.This crushed element has and has anode-side cut surface 23a and be inserted in vertical component 21a wherein, that extend and extend to be connected the bridging part 21b of vertical component 21a on second direction A2.In the forming process of this crushed element, the inclination of carrying out the anode terminal crushed element handle (step S2) with provide have be parallel to installation surface and extend and tilt with away from the bridging part 21b of planar section 27 as the planar section 27 of welded edge with from planar section 27 near the sloping portion 26 of installation surface.In addition, with with background technology in the same way as that illustrates, be used to provide cathode terminal form part 22 with the negative electrode coupling part that forms this cathode terminal 14 by on this second direction A2 with the direction different with it on drawing or extrusion process distortion, thereby form the cathode terminal crushed element.This crushed element has the recessed surface and the convex surfaces relative with installation surface that is positioned on the installation surface side.This crushed element has the vertical component 22a that extends and is parallel to this installation surface and extends and be connected the bridging part 22b of vertical component 22a on the second direction A2 that is inserted with cathode side cut surface 23b.The combination that the inclination processing of anode terminal crushed element and the inclination of cathode terminal crushed element are handled can be called the deformation process that is used for the electrode terminal distortion jointly.
Then, comprise that the lead frame 100 of vertical component 21a and 22a is by plating (step S3).Then, capacitor element 11 is fixedly attached to lead frame 100 (step S4).In addition, coating molded back (step S5) with potting resin 19, potting resin 19 and lead frame 100 quilts are along anode-side cut surface 23a and cathode side cut surface 23b (being positioned at the anode-side orle surface recessed portion 24a and the recessed portion 24b outside, cathode side orle surface) cutting (step S6).
Only in the inclination of anode terminal crushed element is handled, carry out drawing and handle under the situation of (S2), can before forming vertical component 21a and 22a, carry out plating.Especially, comprise deformation process that the anode terminal crushed element tilts to handle (step S2) plating planar shaped lead frame 100 before what lead frame 100 formed (step S1) and was used for the electrode terminal distortion.
At this, notice, secure bond capacitor element 11 to the step (step S4) of lead frame 100 corresponding to the capacitor integrating step that capacitor element 11 is attached to lead frame 100 in the manufacture method of the above-mentioned upside-down mounted terminal solid electrolyte capacitor of mentioning.In addition, coat molded step (step S5) corresponding to the resin-molded step that coats molded capacitor element 11 and lead frame 100 with potting resin 19 with potting resin 19.In addition, cutting step (step S6) is corresponding to anode tap 12 and potting resin 19 along one of the coating surface of each vertical component 21a and 22a cutting lead frame 100, capacitor element 11, and stay one of coating surface, form step thereby form outer surface with outer surface as the side surface of product.As mentioned above, in the capacitor integrating step, before capacitor element 11 being attached to anode terminal formation part 21, preferably forming part 21 and apply insulating resin to the segment anode terminal.
In any case, be attached to lead frame 100 and overmold is shaped under the state of potting resin 19 at capacitor element 11, as shown in Figure 4, form that anode terminal forms part 21 and cathode terminal forms part 22.By cutting to obtain a chip body along anode-side cut surface 23a and cathode side cut surface 23b, after cutting, anode-side orle surface recessed portion 24a and cathode side orle surface recessed portion 24b are as the orle surface.Here, by being provided at plating vertical surface 21a and the 22a in anode terminal formation part 21 and the cathode terminal formation part 22, need not after cutting, to carry out plating and handle.
In a word, comply with manufacturing as described below according to the upside-down mounted terminal solid electrolyte capacitor of this embodiment.Manufacturing has the lead frame 100 of flat shape as original-shape.Then, form part 21 and cathode terminal forms part 22 for anode terminal, vertical component 21a and 22a and the bridging part 21b that is connected vertical component 21a and 22a and the 22b downside from the drawing thin plate respectively constitute the shape shown in Fig. 4.Capacitor element 11 lead frames 100 that are attached to as described below.On anode-side, capacitor element 11 utilizes laser welding or resistance welded to be connected with anode tap 12.On cathode side, capacitor element 11 utilizes the electroconductive binder 20 that comprises Ag to connect.Then, after utilizing transfer modling (transfer mold) to coat molded potting resin 19, utilize wafer dicing saw along two planes, that is, anode-side cut surface 23a and cathode side cut surface 23b corresponding to the product side surface cut.Thereby, obtain upside-down mounted terminal solid electrolyte capacitor according to this embodiment.
In any case, in this embodiment in the lead frame 100 of Miao Shuing, the join domain (that is, cathode terminal forms the position of part 22) that is used to utilize electroconductive binder 20 to interconnect cathode terminal 14 and capacitor element 11 partly extends to this plane of reference 17 from cathode side.The plane of reference 17 is provided by the connection end face that capacitor element 11 is inserted with anode tap 12.Cathode terminal 14 usefulness electroconductive binders 20 connect, expose (that is, cathode terminal 14 extends to the plane of reference 17 or exposes to the open air near the position of anode terminal 13 and at the installation surface place) to the open air in installation surface to small part with join domain corresponding to the position that partly extends to the plane of reference 17 or the close plane of reference 17 from cathode side.Therefore, the current path between anode and negative electrode shortens, thereby the ESR of whole capacitor device and ESL reduce.
In addition, in above-mentioned lead frame 100,, select to have low-resistance coating material because the kelvin effect on high frequency band considers that coating is used as current path.In addition, in anode terminal 13 and cathode terminal 14 are cut with the situation of arranging this shape as the part current path between anode and the negative electrode, be retained in coating surface that electrode terminal forms the vertical component 21a of part (anode terminal forms part 21 and cathode terminal forms part 22) and the mode at 22a place is cut on thickness direction.Thereby, can reduce ESL.Therefore, except shortening the current path between anode and the negative electrode, also fully realized the minimizing of ESL.So the manufacture method according to the upside-down mounted terminal solid electrolyte capacitor that uses lead frame 100 can provide the upside-down mounted terminal solid electrolyte capacitor with high productivity ratio, wherein the ESR of whole capacitor device and ESL reduce, and have remarkable reliability.
The upside-down mounted terminal solid electrolyte capacitor that comprises lead frame 100 according to previous embodiment only is exemplary, can make various changes and modification to the detailed structure of various piece by design variation.Therefore, lead frame of the present invention, use this lead frame upside-down mounted terminal solid electrolyte capacitor manufacture method and utilize the upside-down mounted terminal solid electrolyte capacitor of this method manufacturing to be not limited to those disclosed in this embodiment.
Claims (20)
1. one kind has the lead frame (111) that uses in the upside-down mounted terminal solid electrolyte capacitor of capacitor element (11), anode terminal (13) and cathode terminal (14) in manufacturing, and described lead frame comprises:
Go up the framework (110) of extending at first direction (A1);
The anode terminal that is connected with described framework forms part (21), is used to form described anode terminal; And
The cathode terminal that is connected with described framework forms part (22), is used to form described cathode terminal, and described anode terminal forms part and described cathode terminal formation part is separated from one another on the described first direction on the first type surface in described framework, wherein:
Described framework comprises and is used for the coupling part (111) that is connected with described capacitor element that described coupling part forms part from described cathode terminal and extends to the position that forms part near described anode terminal on described first direction.
2. lead frame according to claim 1, wherein said coupling part limit a join domain that is electrically connected with described capacitor element between described anode terminal formation part and described cathode terminal formation part.
3. lead frame according to claim 2, wherein said solid electrolytic capacitor have one and connect end face (113) and be connected the anode tap that end face is drawn from described, and described anode terminal forms part and is used for being connected with described anode tap.
4. lead frame according to claim 3, wherein said coupling part forms part from described cathode terminal and extends near the position along the plane of reference of described connection end face.
5. lead frame according to claim 3, wherein said join domain forms part from described cathode terminal and extends to along the plane of reference of described connection end face.
6. lead frame according to claim 1, wherein said anode terminal forms part and forms crushed element, it goes up from described first type surface outstanding in the second direction (A2) perpendicular to described first type surface, to have recessed surface (S1) and the convex surfaces (S2) surperficial relative with the female.
7. lead frame according to claim 6, wherein said recessed surface is by plating.
8. lead frame according to claim 6, wherein said convex surfaces comprises:
The planar section that is parallel to described first type surface; And
From the sloping portion that described planar section extends, to form part away from described cathode terminal on this first direction, the described sloping portion that tilts is with approaching described first type surface.
9. lead frame according to claim 6, wherein said crushed element utilize drawing or extrusion process to form.
10. lead frame according to claim 6, wherein said crushed element utilize mould pressing process to form.
11. lead frame according to claim 6, wherein said recessed surface is a polygonal shape being parallel on the cross section of described first type surface.
12. lead frame according to claim 6, wherein said recessed surface is the shape with at least one straight sides being parallel on the cross section of described first type surface.
Form 13. lead frame according to claim 8, wherein said crushed element have away from described first type surface, and perpendicular to described first and the third direction (A3) of described second direction go up outward extending ledge (31).
14. lead frame according to claim 8, wherein said crushed element has, form away from described first type surface, and perpendicular to described first and the third direction of described second direction on the recess (32) that extends internally.
15. lead frame according to claim 1, wherein said anode terminal form part and described cathode terminal and form partly each and all be provided with the film that comprises among Ag, Au, Cu, Pd and the Sn at least one.
16. lead frame according to claim 1, wherein said anode terminal forms part and described cathode terminal and forms partly each all be provided with the film that comprises among Ag, Au, Cu, Pd and the Sn at least one on perpendicular to the surface on the direction of described first type surface, to form described anode terminal and described cathode terminal respectively.
17. the manufacture method of a upside-down mounted terminal solid electrolyte capacitor, described method comprises:
Preparation is according to this lead frame of claim 1;
Preparation has the capacitor element of anode tap;
Described capacitor element is attached to described lead frame;
Coat molded described capacitor element and described lead frame with potting resin; And
Cut described lead frame, described anode tap and described potting resin, thereby form outer surface as a side surface of described solid electrolytic capacitor.
18. method according to claim 17, wherein this anode terminal forms partly to form partly with this cathode terminal and has coating surface, carries out this cutting along one of this coating surface, and keeps one of described coating surface.
19. method according to claim 12, also be included in conjunction with before, insulating resin is applied to the described anode terminal of part forms on the part.
20. a upside-down mounted terminal solid electrolyte capacitor of making according to the method for claim 12, wherein:
Described capacitor element is included in dielectric layer, electrolyte layer and the cathode layer that forms successively on the surface of the porous sintered body of being made by valve metal, and has the described anode tap of drawing from it;
Described anode terminal formation at one end is connected with described anode tap and the other end is located as the described anode terminal formation part of external connection terminals;
Described cathode terminal formation at one end is connected with the described cathode layer of described capacitor element and the other end is located as the described cathode terminal formation part of external connection terminals;
Described potting resin covers described capacitor element, and is arranged as and makes each exterior side surfaces that has exposed surface and be substantially perpendicular to described installation surface on the installation surface about plate of described anode terminal and described cathode terminal.
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| CN2006100644540A CN101174508B (en) | 2006-10-31 | 2006-10-31 | Lead frame, upside-down mounted terminal solid electrolyte capacitor and its manufacturing method using lead frame |
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| CN2006100644540A CN101174508B (en) | 2006-10-31 | 2006-10-31 | Lead frame, upside-down mounted terminal solid electrolyte capacitor and its manufacturing method using lead frame |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101826399A (en) * | 2009-03-03 | 2010-09-08 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN101853741A (en) * | 2009-03-30 | 2010-10-06 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN109983591A (en) * | 2016-11-11 | 2019-07-05 | 亮锐控股有限公司 | The method for manufacturing lead frame |
| CN112992546A (en) * | 2019-12-12 | 2021-06-18 | 三星电机株式会社 | Tantalum capacitor and method for manufacturing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101052215B1 (en) * | 2003-03-03 | 2011-07-29 | 쇼와 덴코 가부시키가이샤 | Chip On Solid Electrolytic Capacitors |
| JP4878103B2 (en) * | 2004-01-07 | 2012-02-15 | Ｎｅｃトーキン株式会社 | Manufacturing method of chip-type solid electrolytic capacitor |
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2006
- 2006-10-31 CN CN2006100644540A patent/CN101174508B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101826399A (en) * | 2009-03-03 | 2010-09-08 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN101826399B (en) * | 2009-03-03 | 2014-06-04 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN101853741A (en) * | 2009-03-30 | 2010-10-06 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN101853741B (en) * | 2009-03-30 | 2013-07-17 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN109983591A (en) * | 2016-11-11 | 2019-07-05 | 亮锐控股有限公司 | The method for manufacturing lead frame |
| CN109983591B (en) * | 2016-11-11 | 2022-10-04 | 亮锐控股有限公司 | Method for manufacturing lead frame |
| CN112992546A (en) * | 2019-12-12 | 2021-06-18 | 三星电机株式会社 | Tantalum capacitor and method for manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN101174508B (en) | 2011-11-23 |
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Address after: Sendai City, Miyagi Prefecture, Japan Patentee after: Tokin Corporation Address before: Sendai City, Miyagi Prefecture, Japan Patentee before: NEC Tokin Corp. |