CN101156235A

CN101156235A - Method for establishing an electrical and mechanical connection between chip contact surfaces and antenna contact surfaces and transponder

Info

Publication number: CN101156235A
Application number: CNA2006800068027A
Authority: CN
Inventors: 沃尔克·布罗德
Original assignee: MILLBAUER AG (
Current assignee: MILLBAUER AG (; Muehlbauer GmbH and Co KG
Priority date: 2005-03-09
Filing date: 2006-03-08
Publication date: 2008-04-02

Abstract

The invention concerns a method for establishing an electrical and mechanical connection between contact surfaces (11, 12; 22, 23; 25, 26; 43; 47a) of a RFID chip (10; 21; 24; 42, 47) and contact surfaces (19, 20; 30, 31; 34, 35), located on a strip substrate (36; 45) and the contact surfaces (11, 12; 22, 23; 25, 26; 43; 47a) of the chip, having on their surfaces a plurality of wire hooks and/or wire eyelets, being hooked, by applying pressure (52, 53) on the associated contact surfaces (11, 12; 22, 23; 25, 26; 43; 48), having on their surfaces a plurality of wire hooks and/or wire eyelets (16). The invention also concerns a transponder.

Description

Between chip contact surface and antenna contact surface, set up the method and the transponder of electrical connection and mechanical connection

Technical field

The present invention relates to as the claim 1 chip contact surface at radio frequency identification (RFID) chip as described in the preamble be arranged on banding substrate on contact surface between set up the method that is electrically connected with mechanical connection, also relate to as claim 10 transponder as described in the preamble (transponder), described transponder comprises at least one RFID chip and at least one the RFID antenna that is arranged on the banding substrate.

Background technology

Semiconductor chip, be also referred to as nude film, RFID chip for example, be typically connected on the electronic circuit, as the RFID antenna, this antenna for example is placed on the normally flexible banding substrate continuously by the mode of adhesion, welding and/or projection combination, for example is used to produce the function transponder of little label (lable).It is consuming time that this class connects production, and the banding substrate that usually needs to move continuously stops.Moreover, for example, for application examples such as bonding agent and wlding and their are solidified, need extra equipment be set along the base material band, as the hot curing station, the cost costliness of this equipment need take a large amount of spaces in whole system.

Fig. 1 a and Fig. 1 b have showed flip-chip (flip-chip) method that combines with the connection mode of traditional adhesive bond.In the flip-chip method, the encapsulation of RFID chip and chip contact surface thereof are divided into several treatment steps to the connection of the contact-making surface of antenna 2, and wherein antenna 2 is arranged in rows on the banding substrate 1.Fig. 1 a has shown end view, and wherein Zuo Ce banding substrate is untied from cylinder (roll) (not drawing the figure), and the banding substrate on right side is rolled onto on the cylinder (not drawing among the figure), and banding substrate moves from left to right.At first, antenna 2 is attached on the base material with ring-type, for example, uses method of printing,, shown the floor map of the traditional method for packing shown in Fig. 1 a with reference to figure 1b.

Antenna 2 has two contact-making surfaces 3 at its end, when second treatment step, and the coated preferably adhesive of conduction.For this reason, adhesive coating unit 5 is used for applying the adhesive of scheduled volume, shown in double-head arrow 6.

In the 3rd treatment step, with known flip-chip method, chip 7 is positioned over attachment zone 4 down and is pressed thereon.Then, in the 4th treatment step, under the effect of the heat of the hot curing equipment 8 that can vertically place (shown in double-head arrow 9), adhesive is cured.

In so traditional method of attachment; banding substrate 1 can all temporarily stop will at each treatment step usually; the time of staying of base material 1 depends primarily on the curing time of used adhesive and chip 7 is moved on to the speed of the flip-chip equipment of attachment zone 4, especially in the relevant method of picking-placing.

Yet relatively the stop of long base material bar has significantly reduced the maximum possible production capacity of the whole system that is used to produce transponder.

Summary of the invention

Therefore, the purpose of this invention is to provide a kind of be used for the chip contact surface of RFID chip be arranged on banding substrate on contact surface between set up and be electrically connected and the mechanical connection method, and a kind of transponder, can connect simply fast, can guarantee that the equipment of implementing this method has very high production capacity.

This purpose uses the method for the described feature of claim 1 and the product of the described feature of claim 10 to realize.

A key point of the present invention is, be used for the chip contact surface of RFID chip be arranged on banding substrate on contact surface between set up the method that is electrically connected with mechanical connection, these chip contact surfaces all have the hook of some wire and/or the eyelet of wire to collude together, under the effect of pressure, relevant with it contact-making surface has the eyelet of some wire and/or the hook of wire.The size of the hook of wire and/or the eyelet of wire is preferably in millimicron scope, because each chip contact surface and a plurality of contact surface location relative to each other just can be accurate like this.So, can with simple mode the chip contact surface be arranged on banding substrate on contact surface between set up fast machinery and be electrically connected, described contact surface may belong to for example line electronic circuit of RFID antenna and so on, and does not need to stop mobile continuously base material band.

When using the method for attachment of flip-chip according to the present invention, though need the of short duration of base material band to stop, it is very little that this dwell time can reduce to, because do not need ensuing adhesive cured step.

Because the material of wire hook and wire eyelet can use the line or belt of conduction that the insulated wire of conduction coat is arranged, so except Mechanical Contact, also can set up electrical connection at chip contact surface and antenna contact surface.Therefore do not need other being used to electrically contact and/or the Connection Step of Mechanical Contact, for example connect with adhesive or scolding tin.

Preferably, semiconductor chip has hook or eyelet at its chip contact surface, and described hook or eyelet are by existing nanometer technology production in the manufacture of microchips.Next, such chip application is in line or a few row in wafer or in another band or feeder equipment, described feeder equipment and base material band at an angle, on the base material band that is placed on other antenna contact surface zone continuously.

On the moving direction of base material band, upside and downside are all installed cylinder, guarantee to apply very brief pressure on chip of placing and base material, and therefore the hook on a surface and another surperficial eyelet collude sustainably together or be meshing with each other.

Described line can be before the hook joint step makes by method of printing or by chip module contact surface and/or antenna contact surface roughening are made.

Only semiconductor chip is pressed onto on contact surface and the base material, can be in a short period of time and in the identical encapsulation step, under the effect of power, set up mechanical connection and electrical connection.When using flip chip technology (fct) and using the base material band of continuous motion, this all has advantageous effects in transponder production, in flip chip technology (fct), each RFID chip is placed on contact surface and the banding substrate from wafer, and be pressed on the latter, with hook joint together, and banding substrate has brief stay; When using the base material band of continuous motion, the RFID chip is placed continuously one by one.

Transponder comprises at least one RFID chip and at least one the RFID chip that is encapsulated on the base material, it is characterized in that the chip contact surface has the eyelet of hook or wire, and the antenna contact-making surface has complementary eyelet or hook.

From dependent claims, can obtain more preferred embodiment.

Description of drawings

From following and explanation that accompanying drawing combines, can find advantage and favourable part, wherein:

Fig. 1 a and b are the end views according to the method for packing of semiconductor chip of the prior art;

Fig. 2 is the enlarged diagram of the method according to this invention;

Fig. 3 is the various forms of schematic diagrames of chip contact surface and antenna contact surface when implementing method of the present invention;

Fig. 4 is the side schematic view of method of attachment according to an embodiment of the invention;

Fig. 5 is the side schematic view of method of attachment according to another embodiment of the invention;

Label list:

1,36,45 base material bands

2,15,18,28,29,32,33,37 antennas

3,19,20,30,31,34,35 antenna contact surfaces

4 attachment zones

5 adhesive applying apparatus

The moving direction of 6 adhesive applying apparatus

7,10,21,24,42,47 semiconductor chips

8 curing apparatus

The moving direction of 9 curing apparatus

11,12,22,23,25,26,43,47a chip contact surface

13 wire eyelets

14 lines

16 wire hooks

17 machineries and electrical connection

The cooperation of 27 contact surfaces

The moving direction of 38 zones of discontinuity transmission

39 nanostructure application apparatuss

40 nanostructures

41 flip-chip nanometer combinations

44 turning-over of chip

46 feeding units

48,49 speed

50,51 cylinders

52,53 power applies

Embodiment

Fig. 2 is the schematic diagram according to method of attachment of the present invention.Semiconductor chip 10 has the

chip contact surface

11,12 or the nanometer mating surface of point-like.These nanometers connect

surface

11,12 and are provided with the

wire eyelet

13,14 of size in nanometer range.

Wire eyelet 13 preferably includes conductor wire, as metal wire 14 or have the insulated wire of conductive coating.

Base material band (not shown) has

antenna

15,18, and described antenna part in the drawings shows.

Antenna part

15,18 provides the nanometer mating surface or has amplified the

antenna contact surface

19,20 that shows at its end.Antenna contact surface 19 has the hook 16 of the insulated wire that comprises metal wire or have conductive coating as can be seen from the figure that amplifies.When the antenna of semiconductor chip 10 and antenna part 15 combines, hook 16 and eyelet 13 hook joints, and set up mechanical and electrical connection with the method for so-called nanometer combination, shown in number in the figure 17.

Fig. 3 has shown the schematic diagram of various chip contact surfaces and antenna contact surface.For example, according to the present invention, chip 21 can have the

chip contact surface

22,23 of two band shapes, and they have the surface texture of hook-shaped or eyelet-like.Alternatively, chip 24 also can have very little rectangular

dies contact surface

25,26, and they have the surface texture of hook-shaped or eyelet-like.

Label 27 shows that dissimilar like this chip contact surfaces matches with different antenna contact surface.As an example,

antenna part

28,29 also can have the banded contact surface that hook or eyelet are arranged 30,31 at its end.Alternatively,

antenna part

32,33 has the Nanosurface 34,35 of rectangle, combines with chip contact-making

surface

25,26.

Fig. 4 is the side schematic view of method of attachment according to an embodiment of the invention.This method of attachment comprises the flip-chip method, has the base material band 36 of RFID antenna 37 from left to right to move discontinuously, just, brief stay is arranged, as shown in the reference numeral 38.

Nanostructure, just, the eyelet useful application equipment 39 of the hook of wire or wire is applied in each the RFID antenna 37 in the antenna contact surface zone.This zone is represented with label 40.

In ensuing Flipchip method 41, shift out and overturn the perforation shape disposed thereon or the chip 42 of hook-shaped line 43 from wafer (not shown herein), as shown in the reference numeral 44.

Then, the chip 42 that chip contact surface 43 is provided with in its lower section is placed on the antenna contact surface 40, the nanostructure that is necessary on antenna contact surface 40 is pushed momently, and therefore lasting machinery and electrical connection are just set up between chip contact surface 43 and antenna contact surface 40.

When cartridge chip 42 on antenna 37, base material band 36 stops momently.Do not need solidification process of the prior art.

Fig. 5 is the side schematic view of method of attachment according to another embodiment of the invention.The method of attachment that shows among this figure can fix up an aerial wire on chip soon, because base material 45 can move continuously.

With the method on the plane of feeding unit 46, chip 47 a row or several rows be sent to base material band place, wherein feeding unit is with respect to backing material plate at an angle.Therefore, chip is with speed 48 chargings, and speed 48 is corresponding to the speed 49 of base material 45.Chip 47 chip contact surface zone 47a has thereunder formed hook or eyelet.

Feeding unit 46 is also referred to as the chip feed appliance, comprises for example porous belts (blister tape), perforated tape (surf tape), chip mounter or combination feeder.

After chip 47 chargings, each chip is the spool 50,51 of the above and below by being installed in base material 45 all, spool applies power 52,53 at chip 47 with have on the base material band of antenna (not drawing) herein, thereby with the contact-making surface of chip contact surface and antenna hook joint enduringly.

Disclosed all features all are very important for purposes of the invention in the claim of present specification, if they separately or with the prior art combination after have novelty.

Claims

1. one kind at RFID chip (10; 21; 24; 42, chip contact surface (11,12 47); 22,23; 25,26; 43; 47a) with the contact surface (19,20 that is arranged on the banding substrate (36,45); 30,31; 34,35) set up the method for electrical connection and mechanical connection between, it is characterized in that described chip contact surface (11,12; 22,23; 25,26; 43; 47a) eyelet of some wire and/or the hook of wire (13) hook joint are arranged together on its surface, under the effect of pressure (52,53), relevant contact surface (11,12; 22,23; 25,26; 43; 48) hook of some wire and/or the eyelet of wire (16) are arranged on its surface.

2. method according to claim 1 is characterized in that, before the hook joint step, and RFID antenna (15,18; 28,29; 32,33; 37) and contact-making surface (11,12; 22,23; 25,26; 43; 47a) be applied on the banding substrate (36,45).

3. method according to claim 1 and 2 is characterized in that, the material of wire hook (16) and wire eyelet (13) is conductor wire (14).

4. method according to claim 1 and 2 is characterized in that, the material of wire hook (16) and wire eyelet (13) is the insulated wire (14) that has conductive coating.

5. according to claim 3 or 4 described methods, it is characterized in that before the hook joint step, line (14) is coated to chip contact-making surface (11,12 with method of printing; 22,23; 25,26; 43; 47a) and contact-making surface (19,20; 30,31; 34,35) on.

6. according to the described method of aforementioned each claim, it is characterized in that, before the hook joint step, make the contact surface (11,12 of chip module; 22,23; 25,26; 43; 47a) and/or contact-making surface (19,20; 30,31; 34,35) roughening produces wire hook (16).

7. according to the described method of aforementioned each claim, it is characterized in that the size of wire hook (16) and eyelet (13) is positioned at nanometer range.

8. according to the described method of aforementioned each claim, it is characterized in that each RFID chip (42) all uses the flip-chip method to be placed on contact surface (40) and the banded shape base material (36) from wafer, and is pressed, thereby hook joint together, and banded shape base material (36) is static simultaneously.

9. according to each described method of claim 1 to 7, it is characterized in that RFID chip (42) all is placed on the banding substrate (45) continuously one by one, and be placed in contact-making surface (40) that banding substrate (45) continues to move continuously (49) simultaneously.

10. a transponder comprises at least one RFID chip (10; 21,24; 42; 47) and be contained in banding substrate (36; 45) at least one the RFID antenna (15,18 on; 28,29; 32,33; 37), it is characterized in that chip contact-making surface (11,12; 22,23; 25,26; 43; 47a) eyelet of some wire and/or the hook of wire (13) are arranged on its surface, with antenna contact surface (19,20; 30,31; 34,35) hook on and/or eyelet (16) match.

11. transponder according to claim 10 is characterized in that, the material of wire hook (16) and wire eyelet (13) is conductor wire (14).

12. transponder according to claim 10 is characterized in that, the material of wire hook (16) and wire eyelet (13) is the insulated wire (14) that has conductive coating.