CN101156218B - Conductive paste composition and printed wiring board - Google Patents
Conductive paste composition and printed wiring board Download PDFInfo
- Publication number
- CN101156218B CN101156218B CN2006800109671A CN200680010967A CN101156218B CN 101156218 B CN101156218 B CN 101156218B CN 2006800109671 A CN2006800109671 A CN 2006800109671A CN 200680010967 A CN200680010967 A CN 200680010967A CN 101156218 B CN101156218 B CN 101156218B
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- China
- Prior art keywords
- conductive paste
- paste composition
- mentioned
- dihydroxylic alcohols
- ehter bond
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Disclosed is a conductive paste composition composed of a phenol resin, a melamine resin, a conductive powder, a solvent and a dihydric alcohol having an ether bond. Also disclosed is a printed wiring board characterized by using such a conductive paste composition. The conductive paste composition enables to form a coating film having a sufficient thickness by a single coating operation. By using this conductive paste composition, a bump having a sufficient height can be formed with a fewer number of coating operations than the conventional conductive paste compositions.
Description
Technical field
The present invention relates to novel conductive paste composition and printed substrate (printed wiring board).Especially, the conductive paste composition of the electrode bumps (Bump) used in connecting of the interlayer that the present invention relates to be particularly suitable for to be formed on multilayer printed circuit board and used the printed substrate of this conductive paste composition.
Background technology
All the time, conductive paste composition is used in person in electronics in many purposes such as IC circuit purposes, conductive adhesive, electromagnetic wave shielding.A kind of manufacture method of printed substrate has particularly been proposed recently, wherein, to and at least one face, be provided with second substrate of wiring pattern at first substrate that is provided with the coniform conductive projection made from conductive paste on the assigned position of at least one face, with face that is provided with above-mentioned conductive projection and the face that is provided with above-mentioned wiring pattern is that the inboard is faced mutually, between above-mentioned first substrate and above-mentioned second substrate, dispose insulator layer, constitute laminated body, by this laminated body of lamination, above-mentioned projection is connected at the thickness direction of insulator layer, form conducting wiring portion (Japanese kokai publication hei 6-350258 communique).
In addition, good in the laminated material connectivity, and it is damaged not produce cracking when connecting and during compacting, and can make the projection after the perforation and the big projection of cohesive force of wiring pattern, have in the manufacturing of printed substrate of through conducting wiring portion, the approach that provides as qualification rate height and connection reliability good electrical conductivity cream, a kind of printed substrate interlayer connection conductive paste composition has been proposed, this conductive paste contains melmac, phenol resin, epoxy resin, conductive powder and solvent and form, the softening point of this epoxy resin is more than 80 ℃, (TOHKEMY 2002-270033 communique) below 130 ℃.
In addition, can form high rigidity in order to provide a kind of, not have crackle to use the caking property composite cream with being connected with the printed substrate interlayer of the projection of the bad connection of wiring pattern, propose to use a kind of printed substrate interlayer to connect and used conductive paste composition, it is characterized in that, comprise at least any resin, conductive powder and the boiling point more than 180 ℃ that are selected from melmac, phenol resin and the epoxy resin dihydroxylic alcohols and (or) trihydroxy alcohol (TOHKEMY 2003-77337 communique).
In addition, according to No. 3588400 communique of Japan Patent, as being provided at the example that can wash the heat cured conductive resin composition of device, anchor clamps and container after the silk screen printing with water, known have a kind of conductive resin composition, it is characterized in that, comprise water miscible thermosetting resin, electroconductive particle, dihydroxylic alcohols.
According to Japanese kokai publication hei 9-286924 communique, as with No. the 3588400th, Japan Patent similarly, can wash the conductive resin composition of half tone after the printing etc. with water, known have comprise water miscible thermoplastic resin, the electroconductive particle of average grain diameter 0.05～50 μ m, the conductive resin composition of dihydroxylic alcohols.
According to TOHKEMY 2001-11388 communique, the known stacked capacitor that comprises water-soluble resin and the glycols electrode composite cream that can wash the version that is used to print with water.
According to TOHKEMY 2003-331648 communique and TOHKEMY 2004-265826 communique, as the metal cream that can burn till at low temperatures, known have IIIB family～VIIA family (3 families～15 families) organo-metallic compound of metal and the metal cream of alcoholic compound that comprises periodic table, and wherein alcoholic compound is preferably glycols.
Patent documentation 1: the spy opens flat 6-350258 communique
Patent documentation 2: the spy opens the 2002-270033 communique
Patent documentation 3: the spy opens the 2003-77337 communique
Patent documentation 4: No. 3588400 communique of Japan Patent
Patent documentation 5: the spy opens flat 9-286924 communique
Patent documentation 6: the spy opens the 2001-11388 communique
Patent documentation 7: the spy opens the 2003-331648 communique
Patent documentation 8: the spy opens the 2004-265826 communique
Summary of the invention
When the method for utilizing above-mentioned spy to open to put down in writing in the flat 6-350258 communique forms electrode bumps, using special opening under the situation of disclosed conductive paste composition in 2002-270033 communique and the Te Kai 2003-77337 communique, owing to operate the height of the projection that can not get to connect insulating barrier with the coating of 1 time conductive paste composition, therefore, the coating that need carry out conductive paste composition is repeatedly operated and is repeated print.Particularly for do not make when connecting insulating barrier and during compacting projection fracture, damaged, use the cream that does not make the projection shape excessively sharp, therefore, can not get the height of projection, the number of times of repeating print has often also increased.
Japan Patent No. 3588400 communique, spy open the technology of putting down in writing in flat 9-286924 communique and the Te Kai 2001-11388 communique and have used water-soluble resin, in addition, the spy opens the metal cream that the technology of putting down in writing in 2003-331648 communique and the Te Kai 2004-265826 communique has been used the type that burns till, the non-water-soluble non-conductive paste composition that burns till type as the present invention, be to apply the composite cream that operation just can obtain sufficient coating thickness with 1 time, this composite cream of the present invention is according to being unavailable in the past known to the present inventor.
The present invention solves above-mentioned problem by the solvent that utilization contains specific compound.
The conductive paste composition that the present invention relates to contains phenol resin, melmac, electroconductive powder, solvent and has the dihydroxylic alcohols of ehter bond.
The conductive paste composition that the present invention relates to like this comprises as preferred configuration, and above-mentioned dihydroxylic alcohols with ehter bond has the ethylenedioxy part in its molecular structure.
The conductive paste composition that the present invention relates to like this comprises as preferred configuration, and above-mentioned dihydroxylic alcohols with ehter bond has hydroxyl at two ends.
The conductive paste composition that the present invention relates to like this comprises as preferred configuration, and above-mentioned dihydroxylic alcohols with ehter bond is at least a kind that is selected from diethylene glycol (DEG), triethylene glycol, tetraethylene glycol, five glycol and the hexaethylene glycol.
The conductive paste composition that the present invention relates to like this comprises as preferred configuration, and under the situation of total amount as 100 quality % with above-mentioned solvent and above-mentioned dihydroxylic alcohols with ehter bond, above-mentioned dihydroxylic alcohols amount with ehter bond is 0.1～50 quality %.
The conductive paste composition that the present invention relates to like this, comprise that as preferred configuration above-mentioned solvent contains at least a kind that is selected from acetate of butyl carbitol, ethyl acetate, butyl acetate, ethyl cellosolve, butyl cellosolve, ethyl carbitol, butyl carbitol, isopropyl alcohol, butanols, terpineol, hexanol, butyl cellosolve acetate, the isophorone.
The conductive paste composition that the present invention relates to like this comprises as preferred configuration, further contains pigment, and preferred pigments is an extender pigment.
In addition, the printed substrate that the present invention relates to is characterized in that, has used above-mentioned conductive paste composition.
The invention effect
According to conductive paste composition of the present invention, can enough 1 coating operations form filming of abundant thickness.
Therefore, use the coating number of times that is less than in the past just can form the projection of abundant height.
Therefore, the number of times of repeating print of conductive paste composition can be reduced, the raising of productivity ratio can be sought.In addition, because the conductive paste composition that the present invention relates to is the non-type that burns till, therefore do not need to carry out firing operation.
Embodiment
＜conductive paste composition 〉
The conductive paste composition that the present invention relates to is characterized in that, the dihydroxylic alcohols that contains phenol resin, melmac, electroconductive powder, solvent and have an ehter bond forms.At this, so-called " containing ", do not get rid of the conductive paste composition that coexistence has above-mentioned essential composition (being phenol resin, melmac, electroconductive powder, solvent and the dihydroxylic alcohols with ehter bond) other compositions in addition.That is the conductive paste composition that, the present invention relates to only comprise by the above-mentioned conductive paste composition that must composition forms and contain above-mentioned must composition and these other compositions beyond must composition and the conductive paste composition that forms the two.In addition, in above-mentioned, so-called " conductivity " is meant that the volume resistance value is at least 1 * 10
-3Below the cm Ω.
The conductive paste composition that the present invention relates to, its viscosity is preferably 200～500Pas, is preferably 300～400Pas especially.Have, this viscosity is that the spiral viscosimeter that utilizes マ Le コ system company to make is measured down at 10rpm/ minute, 25 ℃ again.
In addition, the conductive paste composition that the present invention relates to, its thixotropic index is preferably 0.75～1.0, and especially preferably 0.8～0.95.Have again, this thixotropic index be by the spiral viscosimeter that adopts マ Le コ system company to make 10rpm/ minute, 5rpm/ minute, the viscosity of 25 ℃ of conductive pastes of measuring down, adopt thixotropic index calculating formula log (viscosity number the during viscosity number during 5rpm/10rpm)/log[10 (rpm)/5 (rpm)] calculate.Thixotropic index is that apparent viscosity rises when representing to leave standstill, and apparent viscosity reduces the index of the character of coating easily that becomes when acutely mixing.
(1) phenol resin
As the phenol resin that uses among the present invention, can utilize any of novolac-type and solvable phenol aldehyde type, as preferred resin, can exemplify out phenol, cresols, xylenols especially, poly-ly have a resin that aldehydes addition, condensations such as the material of phenol hydroxyl and formalin, furfural form etc. to vinylphenol, to alkylphenol, chlorophenol, bisphenol-A, phenolsulfonic acid, resorcinol etc.Wherein preferred especially poly-to vinylphenol.
(2) melmac
As the melmac that uses among the present invention, can preferably exemplify out for example melamine methylol, alkylated melamine.
(3) electroconductive powder
As the electroconductive powder that uses among the present invention, can use various conductive powders, for example metal dust of alloy powder of silver powder, bronze, copper powder, nickel powder, platinum powder, palladium powder, solder powder, above-mentioned metal etc. etc.These electroconductive powders also can be also with two or more.In addition, also can use metal electroconductive powder in addition, for example carbon dust.Electroconductive powder also can be by surface-treated.
The form of electroconductive powder and size, needing only without prejudice to purpose of the present invention just can be arbitrarily.In the present invention, the electroconductive powder of dendroid for example, flakey, spherical, laminar form be can use, flakey and spherical mixture especially preferably used.Preferred average grain diameter is 0.5～10 μ m, especially preferably 1.0～5.0 μ m.
(4) has the binary alcohol and solvent of ehter bond
The conductive paste composition that the present invention relates to is to contain dihydroxylic alcohols with ehter bond.In the present invention, in having the dihydroxylic alcohols of ehter bond, have the dihydroxylic alcohols of ethylenedioxy part in the preferred molecular structure, preferred especially two ends have the dihydroxylic alcohols of hydroxyl.As the concrete example of such preferred compound, for example can exemplify diethylene glycol (DEG), triethylene glycol, tetraethylene glycol, five glycol and hexaethylene glycol.Wherein, particularly preferably be triethylene glycol.In the present invention, can use a kind that is selected from these dihydroxylic alcohols with ehter bond separately, also two or more kinds may be used.
As the solvent that uses among the present invention, can use the various organic solvents that for example can form composite cream with above-mentioned phenol resin, melmac and electroconductive powder.As the preferred concrete example of such organic solvent, for example can exemplify the single solvent of acetate of butyl carbitol, ethyl acetate, butyl acetate, ethyl cellosolve, butyl cellosolve, ethyl carbitol, butyl carbitol, isopropyl alcohol, butanols, terpineol, hexanol, butyl cellosolve acetate, isophorone or their mixed solvent.
With solvent with have under the situation of total amount as 100 quality % of dihydroxylic alcohols of ehter bond, have ehter bond dihydroxylic alcohols contain proportional to be 0.1～50 quality %, to be preferably 0.5～40 quality %, more preferably 1～30 quality %.
(5) above-mentioned composition (composition arbitrarily) in addition
The conductive paste composition that the present invention relates to can comprise various compositions as required.As the concrete example of such composition that can comprise as required, can exemplify pigment as described below, thixotroping imparting agent, defoamer, dispersant, rust inhibitor, reducing agent and can with above-mentioned phenol resin and (or) other resinous principles (for example epoxy resin, acrylic resin) of mixing of melmac etc.
Pigment
The conductive paste composition that the present invention relates to can contain the pigment of various organic or inorganics as required, utilizes that such pigment can seek that the reinforcement of filming of conductive paste composition, function are additional, operability improvement, painted and increment etc.
In the present invention, especially can use extender pigment, for example the one matter of fine silicon dioxide, calcium carbonate, barium sulfate, magnesium carbonate, aluminium oxide etc. or their mixture.
(6) cooperation ratio
The cooperation ratio of each composition in the conductive paste composition that the present invention relates to is following, and (have, in following, the total amount of so-called resinous principle is meant the total amount of phenol resin and melmac again.But, under the situation that has phenol resin or melmac resin in addition, be meant the total amount of these each resinous principles).
Solvent and have the total amount of the dihydroxylic alcohols of ehter bond is measured 100 mass parts with respect to the total of resinous principle, is preferably 10～100 mass parts, more preferably 30～80 mass parts, more preferably 40～70 mass parts.
The amount of electroconductive powder with respect to resinous principle 100 mass parts, is preferably 300～1100 mass parts, more preferably 500～900 mass parts.
The amount of pigment with respect to resinous principle 100 mass parts, is preferably 1～30 mass parts, more preferably 5～25 mass parts.
The phenol resin in the resinous principle and the ratio of melmac are represented with mass ratio, and (phenol resin)/(melmac) is preferably 10/90～90/10, more preferably 30/70～70/30, and 60/40～40/60 scope more preferably.
(7) utilization of conductive paste composition
The conductive paste composition that the present invention relates to has good electrical conductivity, for example can utilize known print processes such as silk screen print method, metal mask print process to be printed on the substrate.Thereby the conductive paste composition that the present invention relates to can utilize in wide spectrum samely.
Because the conductive paste composition that the present invention relates to coating thickness of printing operation each time is thick, therefore, can form the conductive layer of abundant thickness efficiently.
Therefore, even the conductive paste composition that the present invention relates to adopts the coating number of times be less than in the past, 1 time coating number of times only for example also can form the projection of abundant height, therefore, can seek the raising of productivity ratio.
＜printed substrate 〉
The printed substrate that the present invention relates to is characterized in that, has used above-mentioned conductive paste composition.
The printed substrate that the present invention relates to like this comprises as preferred configuration, utilizes the projection that is formed by above-mentioned conductive paste composition to carry out the printed substrate that interlayer is electrically connected.
Embodiment
＜embodiment 1-7 〉
According to mass ratio mixed phenol resin, melmac, silver powder, extender pigment, the solvent of table 1 record with have the dihydroxylic alcohols of ehter bond, fully mixing with 3 roller mixing rolls, just made the conductive paste composition that the present invention relates to.The viscosity and the thixotropic index of this conductive paste composition are as shown in table 1.
Use this conductive paste to carry out silk screen (half tone) printing.Specifically, use the metallic mask of the aluminum in the hole that has Ф 220 μ m, use the squeegee (squeegee) of the polyurethane resin system of 80 ° of hardness, on one side atmospheric condition is controlled at 20 ℃ of temperature, humidity 50%, print on one side, form projection.
Estimate the height and the shape of the projection that forms.The result is as shown in table 1.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | ||
| Form | Phenol resin | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
| Melmac | 50 | 50 | 50 | 50 | 50 | 50 | 50 | |
| Silver powder | 700 | 700 | 700 | 700 | 700 | 700 | 700 | |
| Extender pigment | 10 | 10 | 10 | 10 | 10 | 10 | 10 | |
| Acetate of butyl carbitol | 45 | 45 | 45 | 45 | 45 | 45 | 45 | |
| Diethylene glycol (DEG) | 7.5 | - | - | - | - | - | - | |
| Triethylene glycol | - | 3.5 | 7.5 | 12.5 | - | - | - | |
| Tetraethylene glycol | - | - | - | - | 7.5 | - | - | |
| Five glycol | - | - | - | - | - | 7.5 | - | |
| Hexaethylene glycol | - | - | - | - | - | - | 7.5 | |
| Rerum natura | Viscosity (Pas/25 ℃) | 250 | 310 | 370 | 330 | 229 | 226 | 213 |
| Thixotropic index | 0.88 | 0.85 | 0.85 | 0.90 | 0.80 | 0.81 | 0.75 | |
| Bump height (μ m) | 77 | 86 | 85 | 76 | 84 | 75 | 75 | |
| The projection shape | Well | Well | Well | Well | Well | Well | Well |
＜comparative example 1～13 〉
Ratio according to record in table 2 and the table 3 is used solvent, and do not use dihydroxylic alcohols with ehter bond, make conductive paste composition (comparative example) in addition similarly to Example 1, similarly carry out silk screen printing, estimate the height and the shape of the projection that forms with embodiment.The result is as shown in table 2.
Table 2
| Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | Comparative example 6 | Comparative example 7 | ||
| Form | Phenol resin | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
| Melmac | 50 | 50 | 50 | 50 | 50 | 50 | 50 | |
| Silver powder | 700 | 700 | 700 | 700 | 700 | 700 | 700 | |
| Extender pigment | 10 | 10 | 10 | 10 | 10 | 10 | 10 | |
| Acetate of butyl carbitol | 45 | 45 | 45 | 45 | 45 | 45 | 45 | |
| The 2-butene-1, the 4-glycol | - | 7.5 | - | - | - | - | - | |
| 1, the 3-butanediol | - | - | 7.5 | - | - | - | - | |
| 1, ammediol | - | - | - | 7.5 | - | - | - | |
| 1, the 5-pentanediol | - | - | - | - | 7.5 | - | - | |
| 2, the 3-butanediol | - | - | - | - | - | 7.5 | - | |
| Propylene glycol | - | - | - | - | - | - | 7.5 | |
| 1,2, the 6-hexanetriol | - | - | - | - | - | - | - | |
| 1, the 4-butanediol | - | - | - | - | - | - | - | |
| 1, the 2-butanediol | - | - | - | - | - | - | - | |
| The 3-methyl isophthalic acid, the 5-pentanediol | - | - | - | - | - | - | - | |
| 2-methyl-2, the 4-pentanediol | - | - | - | - | - | - | - | |
| Diethylene glycol monoethyl ether | - | - | - | - | - | - | - | |
| Rerum natura | Viscosity (Pas/25 ℃) | 250 | 177 | 171 | 223 | 172 | 153 | 162 |
| Thixotropic index | 0.50 | 0.82 | 0.69 | 0.92 | 0.60 | 0.54 | 0.69 | |
| Bump height (μ m) | 58 | 61 | 54 | 63 | 54 | 57 | 56 | |
| The projection shape | Well | Well | Well | Well | Well | Well | Well |
Table 3
| Comparative example 8 | Comparative example 9 | Comparative example 10 | Comparative example 11 | Comparative example 12 | Comparative example 13 | ||
| Form | Phenol resin | 50 | 50 | 50 | 50 | 50 | 50 |
| Melmac | 50 | 50 | 50 | 50 | 50 | 50 | |
| Silver powder | 700 | 700 | 700 | 700 | 700 | 700 | |
| Extender pigment | 10 | 10 | 10 | 10 | 10 | 10 | |
| Acetate of butyl carbitol | 45 | 45 | 45 | 45 | 45 | 45 | |
| The 2-butene-1, the 4-glycol | - | - | - | - | - | - | |
| 1, the 3-butanediol | - | - | - | - | - | - | |
| 1, ammediol | - | - | - | - | - | - | |
| 1, the 5-pentanediol | - | - | - | - | - | - | |
| 2, the 3-butanediol | - | - | - | - | - | - | |
| Propylene glycol | - | - | - | - | - | - | |
| 1,2, the 6-hexanetriol | 7.5 | - | - | - | - | - | |
| 1, the 4-butanediol | - | 7.5 | - | - | - | - | |
| 1, the 2-butanediol | - | - | 7.5 | - | - | - | |
| The 3-methyl isophthalic acid, the 5-pentanediol | - | - | - | 7.5 | - | - | |
| 2-methyl-2, the 4-pentanediol | - | - | - | - | 7.5 | - | |
| Diethylene glycol monoethyl ether | - | - | - | - | - | 7.5 | |
| Rerum natura | Viscosity (Pas/25 ℃) | 210 | 185 | 150 | 158 | 152 | 144 |
| Thixotropic index | 0.57 | 0.74 | 0.60 | 0.53 | 0.53 | 0.62 | |
| Bump height (μ m) | 62 | 57 | 54 | 53 | 57 | 54 | |
| The projection shape | Well | Well | Well | Well | Well | Well | |
＜estimate
As can be known clear and definite from above-mentioned table 1, table 2 and table 3, in the embodiment 1～7 of the dihydroxylic alcohols that contains defined with ehter bond, can form bump height is projection (the projection diameter: 220 μ m) of 75 μ m～86 μ m, compare with the comparative example 1 that does not use the dihydroxylic alcohols with ehter bond (bump height: 58 μ m, projection diameter 220 μ m), bump height has improved 29～48% significantly.In addition, the projection shape also is conical, and shape is good.
Using monobasic, binary or trihydroxy alcohol to be substituted in the comparative example 2～13 of the dihydroxylic alcohols that uses among the embodiment 1～7, can see that the projection shape becomes the projection of circle, bump height step-down with ehter bond.In addition, even projection has uprised, only see that also the bump height maximum has also only improved about 8.6%.
Claims (6)
1. conductive paste composition, contain phenol resin, melmac, electroconductive powder, solvent and have the dihydroxylic alcohols of ehter bond, above-mentioned dihydroxylic alcohols with ehter bond has hydroxyl at two ends, is selected from least a kind in diethylene glycol (DEG), triethylene glycol, tetraethylene glycol, five glycol and the hexaethylene glycol.
2. conductive paste composition as claimed in claim 1, wherein, under the situation of total amount as 100 quality % with above-mentioned solvent and above-mentioned dihydroxylic alcohols with ehter bond, above-mentioned dihydroxylic alcohols with ehter bond is 0.1～50 quality %.
3. conductive paste composition as claimed in claim 1 or 2, wherein, above-mentioned solvent contains at least a kind that is selected from acetate of butyl carbitol, ethyl acetate, butyl acetate, ethyl cellosolve, butyl cellosolve, ethyl carbitol, butyl carbitol, isopropyl alcohol, butanols, terpineol, hexanol, butyl cellosolve acetate, the isophorone.
4. conductive paste composition as claimed in claim 1 or 2 further contains pigment.
5. conductive paste composition as claimed in claim 4, described pigment is extender pigment.
6. a printed substrate is characterized in that, has used claim 1 or 2 described conductive paste compositions.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP103932/2005 | 2005-03-31 | ||
| JP2005103932A JP4841158B2 (en) | 2005-03-31 | 2005-03-31 | Conductive paste composition and printed wiring board |
| PCT/JP2006/306709 WO2006106849A1 (en) | 2005-03-31 | 2006-03-30 | Conductive paste composition and printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101156218A CN101156218A (en) | 2008-04-02 |
| CN101156218B true CN101156218B (en) | 2010-12-08 |
Family
ID=37073405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800109671A Expired - Fee Related CN101156218B (en) | 2005-03-31 | 2006-03-30 | Conductive paste composition and printed wiring board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4841158B2 (en) |
| KR (1) | KR100995607B1 (en) |
| CN (1) | CN101156218B (en) |
| TW (1) | TW200701259A (en) |
| WO (1) | WO2006106849A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102576581B (en) * | 2009-10-15 | 2015-07-22 | 东洋纺织株式会社 | Electrically conductive paste, electrically conductive film, touch panel, and process for production of electrically conductive thin film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10312712A (en) * | 1997-05-14 | 1998-11-24 | Asahi Chem Ind Co Ltd | Solderable conductive paste |
| JP4572023B2 (en) * | 2000-07-11 | 2010-10-27 | 株式会社槌屋 | Colored conductive paste, conductive laminate using the same, and method for producing the same |
| JP4365053B2 (en) * | 2001-09-04 | 2009-11-18 | 大日本印刷株式会社 | Conductive paste composition and printed wiring board |
| JP3659348B2 (en) * | 2002-03-05 | 2005-06-15 | 三井化学株式会社 | Bump formation method |
| JP2004315871A (en) * | 2003-04-15 | 2004-11-11 | Asahi Kasei Corp | Method for producing metal hyperfine particle and production apparatus for metal hyperfine particle |
-
2005
- 2005-03-31 JP JP2005103932A patent/JP4841158B2/en not_active Expired - Fee Related
-
2006
- 2006-03-30 WO PCT/JP2006/306709 patent/WO2006106849A1/en active Application Filing
- 2006-03-30 KR KR1020077025031A patent/KR100995607B1/en not_active IP Right Cessation
- 2006-03-30 CN CN2006800109671A patent/CN101156218B/en not_active Expired - Fee Related
- 2006-03-31 TW TW095111582A patent/TW200701259A/en not_active IP Right Cessation
Non-Patent Citations (1)
| Title |
|---|
| JP特开平10-312712A 1998.11.24 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070116673A (en) | 2007-12-10 |
| WO2006106849A1 (en) | 2006-10-12 |
| CN101156218A (en) | 2008-04-02 |
| TW200701259A (en) | 2007-01-01 |
| JP4841158B2 (en) | 2011-12-21 |
| TWI342571B (en) | 2011-05-21 |
| JP2006286367A (en) | 2006-10-19 |
| KR100995607B1 (en) | 2010-11-22 |
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