CN101155475B - Substrate manufacturing method, control substrate and projection apparatus - Google Patents
Substrate manufacturing method, control substrate and projection apparatus Download PDFInfo
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- CN101155475B CN101155475B CN2006101399616A CN200610139961A CN101155475B CN 101155475 B CN101155475 B CN 101155475B CN 2006101399616 A CN2006101399616 A CN 2006101399616A CN 200610139961 A CN200610139961 A CN 200610139961A CN 101155475 B CN101155475 B CN 101155475B
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Abstract
The invention aims at providing manufacturing method of a substrate which is coated with guard block reliably and high-efficiently, controlling substrate and projector. The controlling substrate (20) has FPC insertion hole (25) which is disposed and regulated by lateral wall part (25a) in order to insert FPC (22), and a surface part is coated with antiflux (32) in order to restraint solder diffuse to the outer part of welding part when cabling formed on the surface part of the controlling substrate (20) is coated with solder. Antiflux (32) is divided into external surface antiflux (32a) and internal surface antiflux (32b), and lateral wall part (25a) is coated and covered with them respectively.
Description
Technical field
The present invention relates to be used to make the manufacture of substrates of substrate, the projecting apparatus that utilizes the control basal plate of substrate manufacturing method manufactured and have control basal plate with the hole portion that inserts logical flexible printed circuit board etc.
Background technology
In the past, in projecting apparatus, in order to save the space and to carry out the high density assembling, known method is with flexible printed circuit board (Flexible Printed Circuit board, below, be expressed as FPC) insert near the logical hole portion of connector that is configured on the control basal plate, be connected with connector.According to this method, can be or not FPC is not circuitous and be connected (for example, referring to patent documentation 1) with connector at the periphery of control basal plate.
Below, describe the hole portion that is used for inserting logical FPC in detail.Fig. 9 is the stereogram of the FPC patchhole of expression prior art.As shown in Figure 9, FPC patchhole (hole portion) 25 is arranged on the control basal plate 20, and the allocation position of FPC patchhole 25 is near the connector 21 that is used to connect FPC22.Like this, can make the length of the FPC22 that is connected with connector 21 become the shortest length.In addition, in recent years, implemented part to the control basal plate 20 that is formed with FPC patchhole 25 as guard block and the method for adhesive-applying 28.The coating of bonding agent 28 and drying are carried out in the operation that control basal plate 20 is assembled in projecting apparatus.By applying this bonding agent 28; because bonding agent 28 becomes guard block, so, FPC22 is inserted in FPC patchhole 25 when logical; can suppress FPC22 and directly contact, thereby can reduce the undesirable condition that the contact owing to FPC22 causes with hard control basal plate 20.
[patent documentation 1] spy opens the 2003-215700 communique
But, in existing technology, because bonding agent 28 has bonding force, so, in assembling procedure, be difficult to rapidly bonding agent 28 is coated to the part of the part of the control basal plate 20 that is formed with FPC patchhole 25.Therefore, or produce the part that the bonding agent uncoated arrives, or need the regular hour that operating efficiency is reduced because of the coating of bonding agent 28.In addition, during bonding agent 28 dry insufficient, bonding agent 28 will be attached to the contact portion of the FPC22 that inserts to connector 21, thereby can find the unusual of projected picture when delivery test.
Summary of the invention
The present invention is motion in order to address the above problem, and purpose aims to provide manufacture of substrates, control basal plate and the projecting apparatus that can reliably and effectively guard block be coated on the substrate.
Manufacture of substrates of the present invention is characterised in that, comprises; The hole portion of side wall portion that setting is defined in the shape of the hole portion that forms on the substrate with wiring forms operation; The mode that covers with the side wall portion with hole portion is coated with the working procedure of coating that is applied at the anti-solder flux that carries out the part diffusion of soldering process time limit system braze beyond soldering portion at wiring; The exposure process that will make it to solidify with resisting the solder flux exposure.
According to this manufacture of substrates, will resist the hole portion coating of solder flux to the substrate that forms operation formation in hole portion at working procedure of coating.Hole portion runs through substrate and forms, by the side wall portion regulation shape as the face that runs through substrate partly.In addition, anti-flux coating is to substrate the time, from the edge of the end of side wall portion to the direction expansion of side wall portion and side wall portion is covered.That is, owing to surface tension is detained, the anti-solder flux of this delay is to the direction expansion of side wall portion in the marginal portion for anti-solder flux.Therefore, for the side wall portion of hole portion, can not spend the man-hour of the anti-solder flux of direct coating and the side wall portion of hole portion is covered with anti-solder flux.Anti-solder flux has photonasty, solidifies rapidly by exposure process.Therefore, after exposure, can enter subsequent processing rapidly.In addition, utilize anti-solder flux the side wall portion of the coarse face of machining and sharp keen edges cover even other parts etc. contact with hole portion, can be able to not made parts generation undesirable condition yet.
At this moment, working procedure of coating preferably applies anti-solder flux from surface and this surperficial opposite side surfaces of a side of substrate respectively.
According to this method, the coating of anti-solder flux on substrate, two face side from the substrate at the opening place of hole portion apply respectively.Therefore, anti-solder flux is respectively from the border extended at the two ends of side wall portion and side wall portion is covered.Like this, as long as apply anti-solder flux, just can reliably side wall portion be covered from two face side of substrate.
Manufacture of substrates of the present invention is characterised in that, comprising: the wiring that forms wiring on substrate forms operation; The hole portion formation operation of regulation for the side wall portion of the shape of the slotting hole portion of leading to flexible printed circuit board and forming on substrate is set; On substrate, be coated with the working procedure of coating that is applied at the anti-solder flux that carries out the part diffusion of soldering process time limit system braze beyond soldering portion at wiring; To resist the solder flux exposure selectively and exposure process that makes it to solidify and the developing procedure that will resist the uncured part of solder flux to remove by development; Wherein, anti-solder flux is coated in the mode that side wall portion is covered in working procedure of coating, and the part of side wall portion is cured in exposure process.
According to this manufacture of substrates, in working procedure of coating, the anti-solder flux of coating on the substrate of the hole portion that in being included in hole portion formation operation, forms.Hole portion connects substrate and forms, by the side wall portion regulation shape as the face of the substrate of the part that connects.In substrate processing, along with the densification of the wiring of substrate and assembling etc., need be with the processing thick and fast on substrate of braze such as welding compound.Therefore, thus can use by resisting solder flux to solidify the method that the restriction scolder spreads to unwanted part to the configuration of the part of needs.Therefore, the working procedure of coating at the anti-solder flux of the diffusion that is used for limiting scolder also applies anti-solder flux to side wall portion.Anti-flux coating is to substrate the time, flows and side wall portion is covered from the edge of the end of side wall portion to the direction expansion of side wall portion.That is, owing to surface tension is detained, the anti-solder flux of this delay is to the direction diffusion of side wall portion in the part at edge for anti-solder flux.Therefore, can not need to consider the position of each hole portion and apply the trouble formality of anti-solder flux partly and cover by the side wall portion of anti-solder flux with hole portion along side wall portion.In addition, the anti-solder flux of side wall portion solidifies, and can not remove by developing.Like this, the side wall portion of the coarse face of machining and sharp keen edges cover even other parts etc. contact with hole portion, can be able to not made parts generation undesirable condition yet.
At this moment, working procedure of coating preferably applies anti-solder flux from surface and this surperficial opposite side surfaces of a side of substrate respectively.
According to this method, the coating of anti-solder flux on substrate, two face side from the substrate at the opening place of hole portion apply respectively.Therefore, anti-solder flux is respectively from the border extended at the two ends of side wall portion and side wall portion is covered.Like this, as long as apply anti-solder flux, just can reliably side wall portion be covered from two face side of substrate.
A kind of control basal plate of the present invention is characterized in that having: in the wiring of surface element formation; In order to insert the hole portion that is used for the flexible printed circuit board that is connected with wiring and is provided with by the side wall portion regulation; With the anti-solder flux that applies to surface element for the part of restriction braze beyond soldering portion when carrying out soldering at wiring spreads; Anti-solder flux is coated in the mode that side wall portion is covered.
According to this control basal plate, anti-flux coating is on the control basal plate that comprises hole portion.Hole portion connects control basal plate and forms, by the side wall portion regulation shape as the face that connects control basal plate partly.In the processing of control basal plate, along with the densification of the wiring of the surface element of control basal plate and assembling etc., need be with the processing thick and fast on substrate of braze such as welding compound.Therefore, thus can use by resisting solder flux to solidify the method that the restriction scolder spreads to unwanted part to the configuration of the part of needs.Therefore, in working procedure of coating, also apply anti-solder flux to side wall portion for the anti-solder flux of the diffusion that limits scolder.Anti-flux coating is to substrate the time, flows and side wall portion is covered from the edge of the end of side wall portion to the direction expansion of side wall portion.That is, owing to surface tension is detained, the anti-solder flux of this delay is to the direction diffusion of side wall portion in the part at edge for anti-solder flux.Therefore, can not need to consider the position of each hole portion and apply the trouble formality of anti-solder flux partly and cover by the side wall portion of anti-solder flux with hole portion along side wall portion.Like this, the side wall portion of the coarse face of machining and sharp keen edges cover even other parts etc. contact with hole portion, can be able to not made parts generation undesirable condition yet.
At this moment, anti-solder flux is preferably respectively from a side's of surface element surface and the coating of this surperficial opposite side surfaces, and and then solidifies by exposure.
According to this structure, anti-solder flux applies from two face side of the control basal plate at the opening place of hole portion respectively.Therefore, anti-solder flux covers side wall portion from the border extended at the two ends of side wall portion respectively, and control basal plate is covered side wall portion reliably by anti-solder flux.In addition, the anti-solder flux of side wall portion solidifies, and can not remove by development.
Projecting apparatus of the present invention is characterised in that: assembled above-mentioned control basal plate.
According to this projecting apparatus, thereby cover miscellaneous part etc. and contact the substrate that undesirable condition also can not take place with hole portion even assembled the sharp keen edge that the side wall portion of hole portion had by anti-solder flux and coarse face.In addition, just apply anti-solder flux when substrate is not taken a lot of work, improved production efficiency.Therefore, thus can provide parts and substrate contacts that undesirable condition can not take place can not find the projecting apparatus that projected picture is unusual when delivery test.
Description of drawings
Fig. 1 is the stereogram of the outward appearance of expression projecting apparatus.
Fig. 2 is that the stereogram of the inside of the projecting apparatus of dress outside the top has been removed in expression.
Fig. 3 is that the stereogram of the inside of the projecting apparatus of dress, barricade and control basal plate outside the top has been removed in expression.
Fig. 4 is expression applies a flow chart from the operation of anti-solder flux to the FPC patchhole.
Fig. 5 (a) is the vertical view that the wiring on the expression substrate surface forms, and Fig. 5 (b) is the vertical view of indication window portion processing.
Fig. 6 (c) is the vertical view of the coating of the anti-solder flux of expression, and Fig. 6 (d) is the vertical view of expression masking plate.
Fig. 7 (e) is the vertical view of peeling off of the anti-solder flux of expression, and Fig. 7 (f) is the sectional view of the structure of expression FPC patchhole.
Fig. 8 is the stereogram of inserting logical partial cross section of expression FPC to the FPC patchhole.
Fig. 9 is the stereogram of the FPC patchhole of expression prior art.
Symbol description
1... projecting apparatus, 2... adorns outside the top, and 3... adorns outside the bottom, 4... anterior outer dress, 5... guidance panel, 6... projecting lens, 11... exhaust unit, 12... optical unit, 15... power subsystem, 20... be as the control basal plate of substrate, 20a... surface element or as the outer surface of substrate on a side surface, 20b... surface element or as the substrate inner surface of opposite side surfaces, 21...FPC connector, 22...FPC, 25... is as the FPC patchhole of hole portion, 25a... side wall portion, 30... wiring figure, the anti-solder flux of 32..., the anti-solder flux of 32a... outer surface side, 32b... the anti-solder flux of inner surface side, 32c, 32c ', 32d, 32d ' ... the anti-solder flux of side wall surface.
Embodiment
Below, the embodiment that the present invention is specialized is described.In an embodiment, be example with the control basal plate (substrate) that is assemblied in projecting apparatus, describe with reference to accompanying drawing.Projecting apparatus is separated into red, blue, green coloured light with the light of light source, and the liquid crystal panel that the light after the beam split is used to each look penetrates, and then synthesizes at each liquid crystal panel and carried out the optical image of modulation according to each coloured light, thereby generates coloured image.
Embodiment.
Fig. 1 is the stereogram of the outward appearance of expression projecting apparatus.In addition, Fig. 2 is that the stereogram of the inside of the projecting apparatus of dress outside the top has been removed in expression, and Fig. 3 is that the stereogram of the inside of the projecting apparatus of dress, barricade and control basal plate outside the top has been removed in expression.
As shown in Figure 1, projecting apparatus 1 has by adorning 2 outside the top, adorning 3 and the anterior outer 4 roughly rectangular-shaped outward appearances that constitute of adorning outside the bottom, and each outer dress is a casing of taking in mechanism's part of projecting apparatus 1.And, outside top, adorn 2 anterior outside adorn and be provided with the guidance panel 5 that is used to operate projecting apparatus 1 on 4.In addition, forwardly outer the dress on 4 is provided with otch near guidance panel 5, and projecting lens portion 6 is configured in this notch portion.In addition, in projecting lens portion 6, be provided with the control lever 7 that is used to carry out zoom operation and focusing operation.
In addition, the forwardly outer opposition side position of adorning 4 projecting lens portion 6 is provided with the exhaust outlet 8 that is used for the heat that output mechanism partly produces, and the side of adorning 3 projecting lens portion 6 sides outside the bottom is provided with the air entry 9 of the air that is used to suck cooling usefulness.Like this, cooling air just always circulates to exhaust outlet 8 from air entry 9, thereby the temperature of mechanism's part can not risen to more than or equal to assigned temperature.In addition, as shown in Figure 2, adorn outside the bottom on 3, the forwardly outer rear portion of adorning 4 opposition side is provided with loud speaker 13 and is used to introduce the power connector 14 of external power source.
Below, the 26S Proteasome Structure and Function of the mechanism part of projecting apparatus 1 is described simply.As shown in Figures 2 and 3, forwardly outer 4 sides of adorning have disposed above-mentioned projecting lens portion 6, position and exhaust outlet 8 adjacent exhaust unit 11, the power subsystem 15 between projecting lens portion 6 and exhaust unit 11, at the rear portion of exhaust unit 11 and power subsystem 15, disposed the plane and seen the optical unit 12 (12a, 12b, 12c, 12d) that slightly is L word shape.And, outside the top of power subsystem 15, optical unit 12 and projecting lens portion 6, adorn 2 sides, disposed the control basal plate 20 that is equipped with the control part that constitutes by various circuit (not shown)s that are used to control projecting apparatus 1 etc. and be used to prevent the barricade 23 that the electromagnetic noise of power subsystem 15 grades leaks.
The light source portion 12a of optical unit 12 comprises that the radial light of illuminator and reflection source lamp makes it to become the reflector of parallel rays, and parallel rays is penetrated to integration Lighting Division 12b.Integration Lighting Division 12b is by the set of lenses of the image forming area that is used for roughly shining equably 3 liquid crystal panels and to the optical system of look separated part 12c outgoing beam.It will be red, blue, green coloured light from the light beam beam split of integration Lighting Division 12b that look separated part 12c utilizes dichronic mirror and speculum, penetrate to the 12d of Optical devices portion.And the 12d of Optical devices portion is that the light beam of red, blue, green coloured light is to the liquid crystal panel guiding with each look corresponding with beam split.On each liquid crystal panel, to light modulation light beam of all kinds, form optical image according to the image information of coming from the FPC22 transmission.And, by prism that the optical image of each coloured light is synthetic, form coloured image.Coloured image by projecting lens portion 6 enlarging projections to screen.
The control part (not shown) of controlling such mechanism part is arranged on Fig. 2 and the control basal plate 20 shown in Figure 3.Control basal plate 20 is the so-called glass epoxy substrates that are made of glass and epoxy resin, comprise outer surface of substrate (side surface) 20a that adorns 2 sides outside the top and substrate inner surface (surface of the opposition side) 20b that covers optical unit 12 and power subsystem 15 sides, as shown in Figure 2, be provided with the 20c of board connector portion that is connected usefulness with external device (ED) at the rear portion of substrate inner surface 20b.The 20c of board connector portion comprises RGB input terminal, video input terminal, S video input terminal, USB input terminal and the sound input terminal that is used to be entered as sub-signal.
In addition, as shown in Figure 3, on control basal plate 20, form 3 FPC patchholes 25 accordingly with the part that is used for to 3 FPC22 places of 3 liquid crystal panel images information.FPC22 is the cable that wraps up the connection usefulness of leads such as copper, silver with the base material of the such flexibility of polyimides.Near FPC patchhole 25, be provided with the FPC connector 21 that is used for connecting respectively FPC22.As shown in Figure 2, FPC22 inserts logical FPC patchhole 25 and is connected with FPC connector 21, and the liquid crystal panel that becomes the 12d of Optical devices portion carries out the shortest structure that is connected with the control part of control basal plate 20.
At this moment, when FPC22 was inserted logical FPC patchhole 25, damage etc. had not applied the anti-solder flux as guard block on FPC patchhole 25 with 25 frictions of FPC patchhole in order to make FPC22.Below, the manufacture method that comprises the control basal plate 20 of anti-solder flux in FPC patchhole 25 is coated in is described.
Fig. 4 is expression applies a flow chart from the operation of anti-solder flux to the FPC patchhole.Each figure of Fig. 5～Fig. 7 is the figure that is used to describe in detail each step shown in the flow chart of Fig. 4.Fig. 5 (a) is the vertical view that the wiring on the expression substrate surface forms, and Fig. 5 (b) is the vertical view of indication window portion processing.Fig. 6 (c) is the vertical view of the coating of the anti-solder flux of expression, and Fig. 6 (d) is the vertical view of expression masking plate.Fig. 7 (e) is the vertical view of peeling off of the anti-solder flux of expression, and Fig. 7 (f) is the sectional view of the structure of expression FPC patchhole.
At the step S1 of the flow chart of Fig. 4, on control basal plate 20, form the figure of wiring 30.The part of the figure of wiring 30 is shown in Fig. 5 (a).At this moment, control basal plate 20 forms on the big mother substrate of a plurality of control basal plate 20 can describing, and downcuts from mother substrate respectively then.It is photoetching technique and forming that wiring 30 figure utilizes known typical method.The formation of Fig. 5 (a) expression wiring 30 on the outer surface of substrate 20a of control basal plate 20, same, on substrate inner surface 20b, also form wiring.Step S1 is corresponding with wiring formation operation.After wiring forms, just enter step S2.
At step S2, shown in Fig. 5 (b), processing FPC patchhole 25 and substrate aperture 31.Substrate aperture 31 is used to insert component terminal such as board connector 20c welds with wiring 30, or is used to make the wiring 30 of outer surface of substrate 20a and wiring 30 conductings of substrate inner surface 20b.These holes utilize machinings such as punch process or boring and form.In addition, the plane of regulation FPC patchhole 25 sees that the machined surface that is elliptoid shape is side wall portion 25a.It is corresponding that step S2 and hole portion form operation.After forming hole portion, just enter step S3.
At step S3, shown in Fig. 6 (c), the anti-solder flux 32 of coating on control basal plate 20.At this moment, because control part is assemblied on the two sides of the outer surface of substrate 20a of control basal plate 20 and substrate inner surface 20b, so, will resist solder flux 32 to be coated on the two sides of control basal plate 20 respectively by silk screen printing.In addition, anti-solder flux 32 except the part of solidifying by the described exposure in back, use by development peel off remove the anti-solder flux of so-called minus.Anti-solder flux 32 be used to make welding compound the part beyond wiring 30 do not carry out unnecessary diffusion, and the side wall portion 25a that is coated in FPC patchhole 25 goes up as guard block.The back illustrates state from coating to side wall portion 25a that go up with reference to Fig. 7 (f).Step S3 is corresponding with working procedure of coating.After anti-solder flux 32 coatings, enter step S4.
At step S4, shown in Fig. 6 (d), carry out sheltering at the outer surface of substrate 20a of control basal plate 20.Sheltering is to utilize glass masking sheet 33 that outer surface of substrate 20a is covered, and glass masking sheet 33 has the light shielding part 33a that is used to make the part of not removing anti-solder flux 32 can not solidify by exposure.At this moment, configuration light shielding part 33a be wiring 30 substrate aperture 31 around and the part of assembling FPC connector 21 etc.After formation is sheltered, enter step S5.
At step S5, by glass masking sheet 33 to anti-solder flux 32 irradiation ultraviolet radiations (Ultra Violet).Anti-solder flux 32 has only been blocked illuminated ultraviolet partly solidified beyond the ultraviolet part by light shielding part 33a.Step S4 and S5 are corresponding with the exposure process that outer surface of substrate 20a to control basal plate 20 carries out.After exposure, enter step S6.
At step S6, S4 is the same with step, carries out sheltering at the substrate inner surface 20b of control basal plate 20.After sheltering, enter step S7.
At step S7, S5 is the same with step, by glass masking sheet 33 to anti-solder flux 32 irradiation ultraviolet radiations.Step S6 and S7 are corresponding with the exposure process that substrate inner surface 20b to control basal plate 20 carries out.After exposure, enter step S8.
At step S8, shown in Fig. 7 (e), peel off anti-solder flux 32.Peeling off of anti-solder flux 32 at first peeled off glass masking sheet 33 from control basal plate 20, and the control basal plate 20 after will exposing then is impregnated in the developer solution develops.In development, thereby being developed liquid, removes unexposed uncured anti-solder flux 32, become the stripping portion 34 of having peeled off anti-solder flux 32.Near the substrate aperture 31 of wiring 30 stripping portion 34 is exposed wiring 30.If scolder is coated onto on the stripping portion 34, then can prevent the part diffusion of scolder beyond stripping portion 34.Therefore, even fine and closely woven wiring 30, because the formation of stripping portion 34, scolder also can be coated onto needed part reliably.Step S8 is corresponding with developing procedure.
As mentioned above; by being used for scolder compactly and reliably is coated onto the coating of the anti-solder flux 32 on the control basal plate 20 simultaneously; with to the coating of the side wall portion 25a of FPC patchhole 25C anti-solder flux 32 as guard block; can save by other approach each side wall portion 25a is applied guard block needed man-hour respectively partly, thereby can improve operating efficiency.
Shown in Fig. 7 (f), be coated on the side wall portion 25a as the anti-solder flux 32 of guard block.From the anti-solder flux 32a of the outer surface of substrate 20a side of control basal plate 20 coating when side wall portion 25a expand, as anti-solder flux 32c, along with expand the applied thickness attenuation to substrate inner surface 20b side.Even this state also can cover side wall portion 25a and plays the effect of guard block, and is in addition, by apply anti-solder flux 32b from substrate inner surface 20b side, as anti-solder flux 32d, to the expansion of the outer surface of substrate 20a of side wall portion 25a side, overlapping with anti-solder flux 32c.Like this, can make as the thickness of the anti-solder flux 32 of side wall portion 25a even.
In addition, thereby even if the state of no show substrate inner surface 20b as anti-solder flux 32c ' takes place fully not expand to side wall portion 25a from the anti-solder flux 32a of the outer surface of substrate 20a side of control basal plate 20 coating, also can be by applying anti-solder flux 32b from substrate inner surface 20b side, the expansion of the part of the side wall portion 25a that can as anti-solder flux 32d ', not expand to anti-solder flux 32c ', thereby with all coverings of side wall portion 25a.Like this, just can avoid on side wall portion 25a, taking place the part of not anti-solder flux 32.By will resisting solder flux 32 to utilize and apply anti-solder flux 32 from the two sides of control basal plate 20 as guard block, can be reliably to the anti-solder flux 32 of all coatings of the side wall portion 25a of FPC patchhole 25.
Below, simple declaration FPC22 inserting in FPC patchhole 25 led to operation.Fig. 8 is expression FPC inserts a stereogram from logical partial cross section to the FPC patchhole.FPC22 inserts logical and pulls out from the substrate inner surface 20b side direction outer surface of substrate 20a side of FPC patchhole 25 when the mechanism of projecting apparatus 1 partly assembles respectively in the control basal plate 20 that cuts down from mother substrate.At this moment, when inserting, though FPC22 and the mutual friction mutually of anti-solder flux 32,,,, thereby can cause harmful effect to FPC22 hardly also than the glass epoxy resin softness of control basal plate 20 even anti-solder flux 32 has solidified.In addition, because the side wall portion 25a of FPC patchhole 25 and the sharp keen marginal portion that is formed by outer surface of substrate 20a or substrate inner surface 20b are covered by anti-solder flux 32, become the state of band fillet.Therefore, can prevent the edge and cause undesirable conditions such as FPC22 damage, thereby the projected picture that can prevent the projecting apparatus 1 that such undesirable condition causes takes place unusual.
Below, conclude the effect of the specific embodiment of above explanation.
(1), the coarse face of the side wall portion 25a of machining and sharp keen edges cover even FPC22 contacts with FPC patchhole 25 and rubs, can be able to not caused the unusual of projected picture yet by will resisting solder flux 32 to be coated on the side wall portion 25a of FPC patchhole 25.Like this, can improve the quality of projecting apparatus 1.
(2) when preventing that welding compound from applying anti-solder flux 32 to control basal plate 20 diffusion; by simultaneously applying anti-solder flux 32 as guard block, can save the man-hour that in other assembling procedure etc., applies guard block respectively partly to each side wall portion 25a to the side wall portion 25a of FPC patchhole 25.
(3) owing to apply anti-solder flux 32 towards side wall portion 25a from two of outer surface of substrate 20a and substrate inner surface 20b, so, compare with situation about simultaneously applying from certain, can utilize of all covering of anti-solder flux 32 more reliably with side wall portion 25a.
(4) since with anti-solder flux with FPC patchhole 25 coverings, so, can not take place to come off and cause that projected picture is unusual, thereby can improve the quality of projecting apparatus 1 attached to fine dust, burr on the side wall surface 25a of the FPC patchhole 25 of machining etc.
In addition, the present invention does not limit the foregoing description, and the variation of enumerating below also can obtain the effect same with the foregoing description.
Variation 1.
Hole portion does not limit the FPC patchhole 25 of inserting the FPC22 that logical liquid crystal panel uses, can be to insert logical other the patchhole of wiring cable, parts etc. yet.Can prevent undesirable condition to inserting logical any parts.
The shape of FPC patchhole 25 is not limited to ellipse, also can be circle, rectangle etc.Can set neatly according to wiring 30 figure.
Also can be step S3 at flow chart, do not apply anti-solder flux 32 to the outer surface of substrate 20a of control basal plate 20 and the two sides of substrate inner surface 20b, and before step S4, only apply anti-solder flux 32 to outer surface of substrate 20a, before step S6, only apply the operation of anti-solder flux 32 to substrate inner surface 20b.Perhaps, also can apply anti-solder flux 32 to the two sides after, remove the ultraviolet irradiation of step S5, and in the ultraviolet irradiation of step S6 simultaneously with anti-solder flux 32 exposure of outer surface of substrate 20a and substrate inner surface 20b.In a word, can guarantee and the identical effect of situation that applies according to flow chart.
Control basal plate 20 does not limit as shown in Figure 5 and is describing the anti-solder flux 32 of coating under a plurality of states on the mother substrate, can apply anti-solder flux 32 separately to each control basal plate 20 that cuts down after step S2 yet.
Variation 5.
The machining of FPC patchhole 25 and anti-solder flux 32 are to the coating of FPC patchhole 25 and solidify in the operation shown in the flow chart that also can not be included in Fig. 4, and are undertaken by other operation.
Control basal plate 20 is not limited to assembling in projecting apparatus 1.Can be widely used in electronic instruments such as computer, printer, television set, digital camera from logical parts to the hole of substrate portion that insert.
Claims (6)
1. a manufacture of substrates is characterized in that, comprising:
The wiring that forms wiring on substrate forms operation;
The hole portion that side wall portion is set forms operation, and wherein above-mentioned side wall portion has been stipulated in order to insert the shape of the hole portion of leading to flexible printed circuit board and forming on aforesaid substrate;
On aforesaid substrate, be coated with the working procedure of coating that is applied at the anti-solder flux that carries out the part diffusion of soldering process time limit system braze beyond soldering portion at above-mentioned wiring;
The exposure process that selectively above-mentioned anti-solder flux is exposed and make it to solidify; With
The developing procedure that the part that above-mentioned anti-solder flux is uncured is removed by development;
Wherein, above-mentioned anti-solder flux is coated in the mode that above-mentioned side wall portion is covered in above-mentioned working procedure of coating, and the part of above-mentioned side wall portion is cured in above-mentioned exposure process.
2. manufacture of substrates according to claim 1 is characterized in that: above-mentioned working procedure of coating applies above-mentioned anti-solder flux from surface and this surperficial opposite side surfaces of a side of aforesaid substrate respectively.
3. a projecting apparatus is characterized in that: the control basal plate of having assembled substrate manufacturing method manufactured according to claim 1 and 2.
4. control basal plate is characterized in that possessing:
Wiring in surface element formation;
In order to insert the hole portion that is used for the flexible printed circuit board that is connected with above-mentioned wiring and is provided with by the side wall portion regulation; With
The anti-solder flux that applies to above-mentioned surface element for the part of restriction braze beyond soldering portion when carrying out soldering at above-mentioned wiring spreads;
Wherein, above-mentioned anti-solder flux is coated in the mode that above-mentioned side wall portion is covered, and then solidifies by exposure.
5. control basal plate according to claim 4 is characterized in that: above-mentioned anti-solder flux applies from surface and this surperficial opposite side surfaces of a side of above-mentioned surface element respectively.
6. a projecting apparatus is characterized in that: assembled claim 4 or 5 described control basal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101399616A CN101155475B (en) | 2006-09-28 | 2006-09-28 | Substrate manufacturing method, control substrate and projection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101399616A CN101155475B (en) | 2006-09-28 | 2006-09-28 | Substrate manufacturing method, control substrate and projection apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101155475A CN101155475A (en) | 2008-04-02 |
| CN101155475B true CN101155475B (en) | 2010-09-22 |
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| CN2006101399616A Active CN101155475B (en) | 2006-09-28 | 2006-09-28 | Substrate manufacturing method, control substrate and projection apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012003039A (en) * | 2010-06-17 | 2012-01-05 | Seiko Epson Corp | Substrate connection structure and projector |
| JP5990948B2 (en) * | 2011-06-22 | 2016-09-14 | セイコーエプソン株式会社 | projector |
| CN106713551A (en) * | 2017-01-22 | 2017-05-24 | 上海与德信息技术有限公司 | Mobile terminal shell structure and mobile terminal |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1592573A (en) * | 2003-02-07 | 2005-03-09 | 松下电器产业株式会社 | Substrate holder, method for producing substrate holder, and method for producing mold |
| CN1627880A (en) * | 2003-12-09 | 2005-06-15 | 三星Techwin株式会社 | Flexible printed circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1592573A (en) * | 2003-02-07 | 2005-03-09 | 松下电器产业株式会社 | Substrate holder, method for producing substrate holder, and method for producing mold |
| CN1627880A (en) * | 2003-12-09 | 2005-06-15 | 三星Techwin株式会社 | Flexible printed circuit board |
Non-Patent Citations (3)
| Title |
|---|
| JP平3-12991A 1991.01.21 |
| JP特开2003-23238A 2003.01.24 |
| JP特开平11-354473A 1999.12.24 |
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