CN101150238A - Connecting device - Google Patents
Connecting device Download PDFInfo
- Publication number
- CN101150238A CN101150238A CNA2007101534114A CN200710153411A CN101150238A CN 101150238 A CN101150238 A CN 101150238A CN A2007101534114 A CNA2007101534114 A CN A2007101534114A CN 200710153411 A CN200710153411 A CN 200710153411A CN 101150238 A CN101150238 A CN 101150238A
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- CN
- China
- Prior art keywords
- elastic arm
- jockey
- coating
- electrode
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
The invention provides a connection device capable of inhibiting generation of intermetallics when a stannous protrusion electrode is crimped on an elastic arm in a connection device for the protrusion electrode contact of electron components such as IC split charging. A junction formed by precision sheet metal process or plating process comprises a helical elastic arm (22) on the surface of a core (30) with a conducting layer (31) and an elastic layer (32) , which is provided with a coating layer (33) formed by a metal layer of platinum family preferred Pd coating. Metal diffusion is uneasy to happen at the contact part when the stannous protrusion electrode (42) and the coating layer (33) are set to be contacted and the generation and accumulation of intermetallics at the contact part can both be inhibited.
Description
Technical field
The present invention relates to be arranged on the jockey that the IC encapsulation waits the electrode that is provided with on the electronic component, relate in particular to and be suitable for the jockey that contacts repeatedly by the electrode that Sn-containing alloy forms.
Background technology
In following patent documentation 1, disclose the jockey that possesses a plurality of spiral helicine elastic arms.The bottom surface of electronic components such as IC encapsulation is provided with a plurality of spherical projection electrodes, and each projection electrode is suppressed by elastic arm, and projection electrode is connected respectively with man-to-man relation with elastic arm.
The spiral helicine elastic arm of record in the patent documentation 1, be to the outstanding three-dimensional shape of electronic component, when being arranged on electronic component on the jockey, elastic arm is highlighted electrode and suppresses and be out of shape in the mode of crushing, and is suppressed by described projection electrode under the effect of elastic arm elastic recovering force at this moment.
Patent documentation 1: TOHKEMY 2004-234872 communique
The spiral helicine elastic arm of record is formed by conductive materials such as copper in the patent documentation 1.And in order to reduce the contact resistance of this elastic arm and projection electrode, what generally adopt is by the most surperficial formation gold layer of modes such as plating at elastic arm.
But, be formed at the gold layer on elastic arm surface, because be not easy oxidation, so its surface energy is kept higher state.Therefore, if the described projection electrode that is formed by Sn-containing alloy is crimped on elastic arm, then gold diffusion generates the intermetallic compound of gold and tin easily to projection electrode.Particularly under projection electrode and elastic arm state of contact, if environment temperature reaches more than 100 ℃ or more than 150 ℃, then can promote the generation of intermetallic compound.For example, under the state of the scolder of stanniferous and contact element contacts, if in 150 ℃ environment through 300 hours, the thickness of described intermetallic compound reaches about 50 μ.
Therefore, for example, if will have the inspection device that the jockey of described elastic arm is used for electronic components such as IC, the electronic component that is provided with the projection electrode of stanniferous is installed repeatedly, further each electronic component is carried out heating test, then the ashbury metal of piling up described intermetallic compound and linking to each other easily on the surface of elastic arm with this compound.If this intermetallic compound and ashbury metal are oxidized, then the resistance on elastic arm surface increases, and descends significantly as the function of contact element.
In addition, because the intermetallic compound of tin and gold is very hard, so the intermetallic compound that is deposited on the elastic arm causes damage to projection electrode easily.
Summary of the invention
The present invention is in order to solve above-mentioned problem in the past, and purpose is to provide a kind of jockey, contacts repeatedly even contain tin electrode, also is not easy compound between deposit on the contact element, and the contact resistance on contact element surface is also low in addition.
Jockey of the present invention, it is provided with the electronic component with a plurality of electrodes in the bottom, it is characterized in that, be provided with a plurality of connecting portions, these a plurality of connecting portions connect the described electrode that is formed by Sn-containing alloy, be provided with the elastic arm that has elastic force and be crimped on the conductivity of described electrode at each connecting portion, described elastic arm has the core and the coating of conductivity, described coating covers the surface of this core, reduce the contact resistance that described elastic arm contacts with described electrode, described coating is formed by the platinum group metal metal level.
In the present invention, be the platinum group metal metal level because be arranged at the coating on elastic arm surface, so little with the contact resistance of electrode.And when the electrode that forms at the alloy by stanniferous contacted with elastic arm, the platinum group metal metal level was not easy to spread in electrode, is not easy to form intermetallic compound between elastic arm surface and electrode.
The thickness of described platinum group metal metal level of the present invention is below the above 2 μ m of 0.1 μ m.Be more preferably at below the 0.5 μ m.If the thickness of platinum group metal metal level is in described scope, then the platinum group metal metal level can be given full play to the function that reduces the contact resistance that contacts with electrode.
The present invention also can form the gold layer of thickness below 0.06 μ m on the surface of described platinum group metal metal level.
The most surperficial formation gold layer by at elastic arm can further dwindle the contact resistance that contacts with electrode.In addition if the thickness of gold layer in described scope, though then gold spreads in electrode, because of the amount of the tin that diffuses to form and golden intermetallic compound seldom, can not produce a lot of situation of such in the past accumulation.
In the present invention, described core is by copper or copper alloy, become with at least one square of nickel or nickel alloy.
The present invention in addition, for described connecting portion, the installation of described electronic component with described electrode with separate the inspection of carrying out repeatedly under the situation about using effectively.At this moment, for elevated temperature under the state of described electronic component is being installed, the inspection of internal circuit of carrying out electronic component is effective.
Under the situation that jockey of the present invention is used to check,, also can prevent compound between the elastic arm deposit even the electrode that is formed by Sn-containing alloy is contacted with elastic arm repeatedly.
The present invention is preferred, and described platinum group metal metal level is the coating of palladium.This can realize the electroless plating layer.If use palladium, then can form thin coating effectively on the surface of elastic arm.
The invention effect
Jockey of the present invention, little and when contacting repeatedly at the contact resistance that contacts with electrode by the electrode that Sn-containing alloy forms, between the surface of elastic arm and electrode, be not easy compound between deposit.Therefore can prolong the life-span of connecting portion.
Description of drawings
Fig. 1 is the partial section of the jockey of embodiment of the present invention;
Fig. 2 is the local amplification sectional view of the connecting portion of described jockey;
Fig. 3 is the amplification plan view that has amplified the plane of connecting portion;
Fig. 4 is the amplification sectional view of the contact site of expression elastic arm and projection electrode;
Fig. 5 is the amplification sectional view of the coating of expression elastic arm;
Fig. 6 is the amplification sectional view of variation of the coating of expression elastic arm;
Fig. 7 is the amplification sectional view of the coating of expression the present invention the 2nd execution mode.
Among the figure
The 1-jockey; The 10-base station; The 12-bearing-surface; The 15-brace; The 16-substrate sheets; The 20-connecting portion; The 21-support; The 22-elastic arm; The 30-core; The 31-conductive layer; The 32-elastic layer; The 33-coating; The 34-coating; 34a-platinum group metal metal level; 34b-gold layer; The 40-electronic component; The 42-projection electrode.
Embodiment
Fig. 1 is the partial section of the jockey of embodiment of the present invention, and Fig. 2 is the amplification sectional view of connecting portion, and Fig. 3 is the vertical view of connecting portion, and Fig. 4 is the cross section enlarged drawing of the contact condition of expression elastic arm of connecting portion and projection electrode.
Jockey 1 shown in Figure 1 has base station 10.The flat shape of base station 10 is squares, is formed with the side wall portion 10a that approximate vertical is holded up respectively on four limits of base station 10.Side wall portion 10a area surrounded by four limits is a recess, and the upper surface of its bottom 10b is a bearing-surface 12.Described bearing-surface 12 is provided with brace 15.Brace 15 is provided with a plurality of connecting portions 20 on the surface of the substrate sheets 16 of flexible.
As shown in Figure 2, be formed with a plurality of through holes (through hole) 16a, be formed with conductive layer 17 by means such as platings at the inner peripheral surface of each through hole 16a in described substrate sheets 16.On the surface of substrate sheets 16, be formed with the connection pads 17a with the table side of described conductive layer 17 conductings, at the back side of substrate sheets 16, be formed with dorsal part connection pads 17b with described conductive layer 17 conductings.
Described connecting portion 20 carries out stamping-out to thin conductive metal plate and forms, and has carried out plating and handled, and each connecting portion 20 is engaged in the surface of described connection pads 17a with conductive adhesive etc.Perhaps, connecting portion 20 uses conductive materials such as copper or nickel to form in the plating operation.For example, form a plurality of connecting portions 20 at the sheet surface that is independent of beyond the substrate sheets 16, described thin slice is overlapped with substrate sheets 16, each connecting portion 20 is engaged in described connection pads 17a with conductive adhesive etc. by the plating operation.
Each connecting portion 20 on being set at substrate sheets 16 after, be applied in external force and form three-dimensional shape.At this moment, remove inner residual stress by heat treated, connecting portion 20 can be brought into play elastic force with three-dimensional shape.
As shown in Figure 2, in the rear side of substrate sheets 16, be formed with the salient pole 18 of the conductive material that is connected with described connection pads 17b respectively.As shown in Figure 1, if the surface that brace 15 is arranged at the bottom 10b of base station 10 is a bearing-surface 12, then described salient pole 18 is connected with conductive part on being arranged at described bearing-surface 12.
The arrangement pitches of the connecting portion 20 on described bearing-surface 12 for example is below the 2mm or below the 1mm.The maximum of the overall dimension of connecting portion 20 also is below the 2mm or below the 1mm.
As Fig. 2 and shown in Figure 3, connecting portion 20 is formed continuously by support 21 and elastic arm 22 one.Elastic arm 22 forms spiral-shaped, and the convolution starting end of elastic arm 22 is that base portion 22a and support 21 form one.It is the central part that leading section 22b is positioned at spiral that the convolution of elastic arm 22 finishes end.As shown in Figure 2, the support 21 that constitutes connecting portion 20 is connected with described connection pads 17a, and the leading section 22b of elastic arm 22 is left from bearing-surface 12 by solid forming.
Shown in the sectional view of Fig. 4, elastic arm 22 has core 30 and covers the coating 33 in the full week of surface of this core 30.Full periderm elastic layer 32 covers around the conductive layer 31 of core 30.Conductive layer 31 is individual layers of copper or copper-bearing alloy.Copper alloy preferably uses Cu, the Si with high conductivity and high mechanical properties, section gloomy (Corson) alloy of Ni.Corson alloy for example is Cu-Ni-Si-Mg, and Cu is that 96.2 quality %, Ni are that 3.0 quality %, Si are that 0.65 quality %, Mg are 0.15 quality %.
In Fig. 4, the sectional area of described elastic layer 32 is preferably more than 20% of the sectional area of core 30 below 80%.If described scope, then core 30 can be brought into play conductivity and these both sides' of elasticity function.In the sectional view of Fig. 4, the gauge of core 30 and width dimensions all are more than the 1 μ m, below the 100 μ m in addition.
Described coating 33 covers the full week of core 30 and forms.Fig. 5 further amplifies the cross section of elastic arm shown in Figure 4 22.The thickness t1 of described coating 33 is below the above 2 μ m of 0.1 μ m, preferably below 0.5 μ m.If in this scope, then can reduce the contact resistance of electronic component and projection electrode, and can constitute with low cost.That is, coating 33 is the coatings that are used to reduce surperficial contact resistance, and with respect to the thickness of elastic arm, the thickness of coating 33 is below 1/10 and then is below 1/100.
As shown in Figure 2, be provided with electronic component 40 at jockey 1.Electronic component 40 is IC encapsulation etc., is sealed with various electronic components such as IC nude film in body 41.Be provided with a plurality of projection electrodes 42 at the bottom surface of body 41 41a, the circuit turn-on in each projection electrode 42 and the body 41.The described projection electrode 42 of the electronic component 40 of this execution mode is spherical.In addition, projection electrode 42 also can be a truncated cone.
Described projection electrode 42 is formed by the conductivity alloy of stanniferous.That is, being formed by lead-free scolder, is sn-bi alloy or sn-ag alloy.
The jockey 1 of execution mode is used to check electronic component 40, and as shown in Figure 1, checked property is that electronic component 40 is installed in the recess of base station 10.At this moment, electronic component 40 is positioned, make each projection electrode 42 that its bottom surface 41a is provided be arranged on described connecting portion 20 above.Base station 10 is provided with not shown pushing lid, if this lid covers on the base station 10, then pushes electronic component 40 by this lid to arrow F direction.Under the effect of this pressing force, each projection electrode 42 is urged to elastic arm 22, and the elastic arm 22 of three-dimensional shape collapses under pressure, and makes each projection electrode 42 and elastic arm 22 independent conductings respectively.
When jockey 1 being used for so-called aging (burn in) inspection, under the state that environment temperature is set at about 150 ℃, the circuit of using from visual examination provides electric current through connecting portion 20 to projection electrode 42, checks whether the body 41 interior circuit of electronic component 40 break.Perhaps, provide the signal of regulation to projection electrode 42, carry out the action test of the circuit in the body 41 from connecting portion 20.
Take out the electronic component 40 that inspection is through with from jockey 1, then the electronic component 40 that the next one will be checked is set in jockey 1, carry out same inspection.Repeat this inspection.For this reason, the projection electrode 42 of new electronic component 40 is contacted with the elastic arm 22 of connecting portion 20 singly.
As shown in Figure 4, elastic arm 22 is formed with coating 33 on the surface of the core 30 that is formed by conductive metal, and this coating 33 is to be the platinum group metal metal level of representative with Pt.When the projection electrode 42 of stanniferous is crimped on the coating 33 that is formed by the platinum group metal metal level, the platinum group metal metal is not easy diffusion in projection electrode 42, is not easy to generate the intermetallic compound of platinum group metal metal and tin at the contact site of coating 33 and projection electrode 42.
Whether the metal on the surface of elastic arm 22 spreads in projection electrode 42 and generates intermetallic compound, mainly exists with ... following 2 conditions.
A condition is the metallic surface energy that covers elastic arm 22.On the surface of elastic arm 22 is under the situation of gold layer, oxidized because gold is not easy, so the surface energy height, therefore, if the projection electrode 42 of stanniferous is contacted with the gold layer, then because of described surface energy, the easy combination of Jin Yuxi, consequently gold diffusion in projection electrode 42.Relative therewith, be the platinum group metal metal of representative with Pd, because at surface formation oxide-film as thin as a wafer, so surface energy is stable, Pd etc. are not easy diffusion in projection electrode 42.And oxide-film because tunnel effect can not hinder passing through of electric current, therefore also can not make the sheet resistance step-down of elastic arm 22 as thin as a wafer.
Another condition is the case hardness of elastic arm 22.Generation when elastic arm 22 contacts with projection electrode 42, intermetallic compound is the thermal diffusion of metal, and is proportional with the contact area both sides of temperature and two members.If the surface of elastic arm 22 is gold layers, then,, be easy to generate the thermal diffusion of metal so the contact area that contacts with projection electrode 42 broadens because the hardness on surface is low, generate and pile up the intermetallic compound of tin and gold easily.Relative therewith, platinum group metal metal level hardness height, for example the Vickers hardness of Pd is about 440～550Hv, the Vickers hardness of Ru is about 650～700Hv.This is that AuCo (about 160Hv), AuNi (about 170～300Hv), AuIn (about 210Hv) compare enough height with the alloy that contains gold.Therefore, when the coating 33 on the surface of elastic arm 22 is the platinum group metal metal level, because case hardness height, contact area when therefore pushing projection electrode 42 can not become big, therefore the metal of platinum group metal is not easy diffusion in projection electrode 42, is not easy to generate intermetallic compound between elastic arm and projection electrode.
If coating 33 is platinum group metal metal levels, then different with the gold layer, be not easy to generate intermetallic compound.Therefore, can always keep the contact resistance on the surface of elastic arm 22 very low, the damage that projection electrode 42 is brought also diminishes.In addition, also be not easy to take place projection electrode 42 to be caused the phenomenon of damage because of intermetallic compound.
Fig. 6 represents the variation of described jockey.Fig. 6 amplifies the part in the cross section of the elastic arm 22A that represents variation.The coating 34 as the surface of the elastic layer 32 of core of this elastic arm 22 is 2 layers of structure.On the surface of elastic arm 22A, with same thickness t1 shown in Figure 5, be formed with platinum group metal metal level 34a such as Pd, and be formed with gold layer 34b on its surface.Gold layer 34b is also thin more a lot of than the thickness of platinum group metal metal level 34a, and its thickness t 2 is below the 0.06 μ m.
The gold layer 34b of this thickness t 2 is extremely thin, and owing to be formed with the high platinum group metal metal level 34a of hardness in its lower section, so the contact area that contacts with projection electrode 42 diminishes, is not easy to generate the intermetallic compound of tin and gold.In addition because gold layer 34b is extremely thin, so even generate intermetallic compound, its amount is also considerably less, because of intermetallic compound causes the situation of damage also few to projection electrode 42.
Fig. 7 represents the 2nd execution mode of the present invention, is the amplification sectional view of elastic arm 22B.The core of this elastic arm 22B is only formed by Ni or Ni alloy, and for example the amorphous alloy by Ni-P forms.And, be formed with coating shown in Figure 5 33 or coating 34 shown in Figure 6 at its outer peripheral face.This elastic arm 22B is because based on Ni or Ni alloy and constitute, so whole rigidity and elasticity of flexure coefficient height.And the contact resistance on surface is step-down also.
Claims (7)
1. jockey, it is provided with the electronic component with a plurality of electrodes in the bottom, it is characterized in that,
Be provided with a plurality of connecting portions, these a plurality of connecting portions connect the described electrode that is formed by Sn-containing alloy, are provided with the elastic arm that has elastic force and be crimped on the conductivity of described electrode at each connecting portion,
Described elastic arm has the core and the coating of conductivity, and described coating covers the surface of this core, reduces the contact resistance of described elastic arm and described electrode, and described coating is formed by the platinum group metal metal level.
2. jockey as claimed in claim 1, wherein,
The thickness of described platinum group metal metal level is below the above 2 μ m of 0.1 μ m.
3. as claim 1 or the described jockey of claim 2, wherein,
Be formed with the gold layer of thickness below 0.06 μ m on the surface of described platinum group metal metal level.
4. as claim 1 or the described jockey of claim 2, wherein,
Described core is by copper or copper alloy, become with at least one square of nickel or nickel alloy.
5. as claim 1 or the described jockey of claim 2, wherein,
For described connecting portion, in the installation of the described electronic component that has described electrode repeatedly and the inspection that separates, use.
6. jockey as claimed in claim 5, wherein,
In that elevated temperature under the state of described electronic component is installed, carry out the inspection of the internal circuit of electronic component.
7. as claim 1 or the described jockey of claim 2, wherein,
Described platinum group metal metal level is the coating of palladium.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006257550 | 2006-09-22 | ||
| JP2006257550A JP2008078032A (en) | 2006-09-22 | 2006-09-22 | Connecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101150238A true CN101150238A (en) | 2008-03-26 |
Family
ID=39250628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101534114A Pending CN101150238A (en) | 2006-09-22 | 2007-09-19 | Connecting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008078032A (en) |
| KR (1) | KR20080027182A (en) |
| CN (1) | CN101150238A (en) |
| TW (1) | TW200830649A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102369447A (en) * | 2009-04-03 | 2012-03-07 | 日本发条株式会社 | Spring wire, contact probe, and probe unit |
| CN101794942B (en) * | 2009-01-29 | 2013-02-06 | 阿尔卑斯电气株式会社 | Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same |
| CN104205508A (en) * | 2012-03-21 | 2014-12-10 | 恩普乐股份有限公司 | Electric contact and socket for electric component |
| CN104364660A (en) * | 2012-06-06 | 2015-02-18 | 恩普乐股份有限公司 | Electrical contactor and socket for electrical part |
| CN110024065A (en) * | 2016-12-01 | 2019-07-16 | 株式会社村田制作所 | Chip-type electronic component |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153236A (en) * | 2008-12-25 | 2010-07-08 | Alps Electric Co Ltd | Method of manufacturing contactor equipped with elastically deforming part |
| JP2010192130A (en) * | 2009-02-16 | 2010-09-02 | Alps Electric Co Ltd | Electrical contact |
| US8652649B2 (en) * | 2009-07-10 | 2014-02-18 | Xtalic Corporation | Coated articles and methods |
| KR102148316B1 (en) * | 2018-12-11 | 2020-08-26 | 히로세코리아 주식회사 | Electrical contact terminal |
-
2006
- 2006-09-22 JP JP2006257550A patent/JP2008078032A/en active Pending
-
2007
- 2007-08-06 TW TW096128895A patent/TW200830649A/en unknown
- 2007-09-19 CN CNA2007101534114A patent/CN101150238A/en active Pending
- 2007-09-20 KR KR1020070096029A patent/KR20080027182A/en not_active Application Discontinuation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794942B (en) * | 2009-01-29 | 2013-02-06 | 阿尔卑斯电气株式会社 | Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same |
| CN102369447A (en) * | 2009-04-03 | 2012-03-07 | 日本发条株式会社 | Spring wire, contact probe, and probe unit |
| CN104205508A (en) * | 2012-03-21 | 2014-12-10 | 恩普乐股份有限公司 | Electric contact and socket for electric component |
| CN104364660A (en) * | 2012-06-06 | 2015-02-18 | 恩普乐股份有限公司 | Electrical contactor and socket for electrical part |
| CN104364660B (en) * | 2012-06-06 | 2018-09-21 | 恩普乐股份有限公司 | Electrical contact and plug seat for electrical component part |
| CN110024065A (en) * | 2016-12-01 | 2019-07-16 | 株式会社村田制作所 | Chip-type electronic component |
| CN110024065B (en) * | 2016-12-01 | 2021-03-19 | 株式会社村田制作所 | Chip-type electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080027182A (en) | 2008-03-26 |
| JP2008078032A (en) | 2008-04-03 |
| TW200830649A (en) | 2008-07-16 |
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| PB01 | Publication | ||
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Open date: 20080326 |