CN101144887A - Embedded type camera lens module group and its production method - Google Patents
Embedded type camera lens module group and its production method Download PDFInfo
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- CN101144887A CN101144887A CNA2006101538106A CN200610153810A CN101144887A CN 101144887 A CN101144887 A CN 101144887A CN A2006101538106 A CNA2006101538106 A CN A2006101538106A CN 200610153810 A CN200610153810 A CN 200610153810A CN 101144887 A CN101144887 A CN 101144887A
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- circuit board
- printed circuit
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- module
- camera lens
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Abstract
The present invention provides an embedded camera lens module and a producing method thereof, and includes the following procedures that a printed circuit board is provided, a first surface of the printed circuit board has a first electric joint, and a second surface of the printed circuit board forms an layout of a second electric joint, and the first electric joint communicates with the second electric joint; an integrated circuit component is provided, a connecting foot of the integrated circuit component is electrically connected to the first electric joint on the first surface of the printed circuit board; the edge above one side of the printed circuit board is bent towards the first surface, and through the second electric joint a semi-finished article of the image module whose side face contacts with the edge is formed; the semi-finished article of the image module is placed in a mold; a filling is arranged in the mold, gas in the mold between the integrated circuit component and the printed circuit board is discharged, and an embedded image module is defined and formed; a lens seat is embedded in the embedded image module, and the lens seat and the embedded image module are integrated into the embedded camera lens module through the filling; and the mold is disassembled.
Description
Technical field
The present invention is about a kind of embedded type camera lens module and manufacture method thereof; Clearer and more definite, the present invention relates to more microminiaturized camera lens module.
Background technology
The electronic industry in modern age is flourish constantly, and electronic product miscellaneous makes people's life more comfortable and convenient, and many electronic products all face needs the littler size of challenge to meet consumer demand.
See also Fig. 4, be existing camera lens module diagrammatic cross-section, its highly crucial hard printed circuit board 25, lens mount 41, viscose 26 and lens group 50 4 height sums that are the bottom.Stress under the more and more frivolous situation for the range of application of present camera module, the camera lens deviser tries every possible means invariably and reduces its height, makes it be applied in electronic product in the modern trend.
Comprehensive above-mentioned, desire can be complied with the slimming of camera lens module above-mentioned hard printed circuit board 25, lens mount 41, viscose 26 and lens group 50 4 and be set about.Yet if desire to keep the camera lens effect of former functional character, then must spend mint of money and go the novel lens group of development research, this also involves the program and the time of a series of complexity, in addition, the height of change lens mount 41 then influences existing image module action in its below even interference because of the worker missionary society in producing, the thickness itself that adds hard printed circuit board 25 also is a preset parameter, so need an energy with the simple and easy production of camera lens module slimming and method with low cost really at present.
Summary of the invention
Because the shortcoming of prior art is desire exploitation thin type lens group, then must spend mint of money and go the novel lens group of development research, this also involves the program and the time of a series of complexity, in addition, the action of the existing image module below changing the height of lens mount then the influence of worker's difference can making when producing is affected even interferes, the thickness itself that adds hard printed circuit board also is a preset parameter, so can't be with the slimming of camera lens module.For this reason, the object of the present invention is to provide a kind of embedded type camera lens module and manufacture method thereof,,, reach the embedded type camera lens module and the manufacture method thereof of slimming to reduce the height of lens mount by improving printed circuit board (PCB) material and manufacturing method thereof.
Another object of the present invention is to provide a kind of embedded type camera lens module and manufacture method thereof, utilize stuff to reduce the height of lens mount, to reach the embedded type camera lens module and the manufacture method thereof of slimming.
For solving above-mentioned shortcoming, reach the effect of thin type camera lens module slimming, the invention provides a kind of embedded type camera lens module making method, at least comprise: a printed circuit board (PCB) is provided, the first surface of this printed circuit board (PCB) has first electric terminal, the second surface of this printed circuit board (PCB) forms the layout of second electric terminal, and this first electric terminal is communicated with this second electric terminal; One integrated circuit component is provided, the pin of this integrated circuit component is electrically connected in first electric terminal of this printed circuit board (PCB) first surface; Make the above edge of this printed circuit board (PCB) to this first surface bending, to form the image module semi-manufacture of a contacts side surfaces by this second electric terminal on one side; Make these image module semi-manufacture insert mould; Provide between the integrated circuit component and printed circuit board (PCB) of stuff to this mould, so that embedded image module is discharged and defined and form to the gas between integrated circuit component and printed circuit board (PCB) in this mould; One lens mount is placed on this embedded image module, the embedded image module of this lens mount and this is combined by these stuff; And this mould of removal, to form this embedded type camera lens module.
Preferably, wherein this printed circuit board (PCB) is a flexible substrate.
Preferably, wherein these stuff are viscose.
Preferably, wherein this integrated circuit component can be an image element or image chip.
The present invention also provides a kind of camera lens module making method, comprises at least: a printed circuit board (PCB) is provided; One integrated circuit component is provided, this integrated circuit component is electrically connected in this printed circuit board (PCB), to form image module semi-manufacture; Make these image module semi-manufacture insert a mould; Provide between the integrated circuit component and printed circuit board (PCB) of stuff to this mould, so that an image module is discharged and defined and form to the gas between integrated circuit component and printed circuit board (PCB) in this mould; One lens mount is placed on this image module, this lens mount is combined with this image module by these stuff; And this mould of removal, to form this camera lens module.
Preferably, wherein this printed circuit board (PCB) is a flexible substrate.
Preferably, wherein these stuff are viscose.
Preferably, wherein this integrated circuit component can be an image element or image chip.
What deserves to be mentioned is that the present invention also provides a kind of electronic module making method, comprises at least: provide a printed circuit board (PCB); Provide an integrated circuit component to be electrically connected in this printed circuit board (PCB) and insert mould; Provide stuff to this mould between integrated circuit component and printed circuit board (PCB) and around the body to define integrated circuit module body; And this mould of removal, to form this electronics module.
Preferably, this integrated circuit module manufacture method is in uncured state winding one supporting body of stuff.
Preferably, wherein these stuff are viscose.
Preferably, wherein this integrated circuit component can be an image element or image chip.
What deserves to be mentioned is that the present invention also provides a kind of embedded type camera lens module, comprises: a printed circuit board (PCB); One integrated circuit component is electrically connected on this printed circuit board (PCB); One lens mount has a chamber, and this lens mount is disposed at the top on this integrated circuit component surface relatively; And stuff, connecting this printed circuit board (PCB), this image chip and this lens mount is one.
Preferably, wherein this printed circuit board (PCB) is a flexible substrate.
Preferably, wherein these stuff are viscose.
Preferably, this embedded type camera lens module configuration lens group is in the chamber of this lens mount.
Preferably, wherein this integrated circuit component can be an image element or image chip.
The present invention is significant with respect to the effect of prior art: embedded type camera lens module of the present invention and manufacture method thereof are by improving printed circuit board (PCB) material and manufacturing method thereof, reduce its thickness, also utilize stuff to reduce and replace the height of existing lens mount, for the slimming of camera lens module there being significantly concrete effect.
Description of drawings
Figure 1A is the half-finished stereographic map of image module of the camera lens module of first embodiment of the invention.
Figure 1B is the stereographic map of image module of the camera lens module of first embodiment of the invention.
Fig. 1 C is the sectional view that the image module of the camera lens module of first embodiment of the invention combines with lens mount.
Fig. 1 D is the sectional view of the camera lens module of first embodiment of the invention.
Fig. 1 E is the stereographic map of the camera lens module of first embodiment of the invention.
Fig. 2 A is that the image element of the embedded type camera lens module of second embodiment of the invention combines synoptic diagram with circuit board.
Fig. 2 B is the half-finished stereographic map of image module of the embedded type camera lens module of second embodiment of the invention.
Fig. 2 C is the stereographic map of image module of the embedded type camera lens module of second embodiment of the invention.
Fig. 2 D is the sectional view that the image module of the embedded type camera lens module of second embodiment of the invention combines with lens mount.
Fig. 2 E is the sectional view of the embedded type camera lens module of second embodiment of the invention.
Fig. 2 F is the stereographic map of the embedded type camera lens module of second embodiment of the invention.
Fig. 3 is the stereographic map of half-finished another embodiment of image module of embedded type camera lens module of the present invention.
Fig. 4 is existing camera module diagrammatic cross-section.
The main element symbol description
1----camera lens module 1 '--embedded type camera lens module
10---integrated circuit component 20---printed circuit board (PCB)
21---pin 22---second surface
23---first surface 24---image module semi-manufacture
25---hard printed circuit board 26---viscose
27---image module 28---second electric terminal
30---stuff 40---lens mount
41---has lens mount 50---lens group now
The 60---mould
Embodiment
Though the present invention will consult and contain the appended graphic of preferred embodiment of the present invention and fully describe, before describing, this should be appreciated that the personage who is familiar with one's own profession can be modified in invention described herein, obtains effect of the present invention simultaneously.Therefore, must understand following description to the personage that is familiar with one's own profession skill and Yan Weiyi discloses widely, and its content does not lie in restriction the present invention.
See also Figure 1A to Fig. 1 E, be the synoptic diagram of first embodiment of the invention.Camera lens module 1 of the present invention comprises: a printed circuit board (PCB) 20; One integrated circuit component 10 is electrically connected on this printed circuit board (PCB) 20; One lens mount 40 has a chamber, and this lens mount 40 is disposed at the top on these integrated circuit component 10 surfaces relatively; And stuff 30, be one in order to connect this printed circuit board (PCB) 20, this integrated circuit component 10 and this lens mount 40.
Please continue E referring to figs. 1A to Fig. 1, aforementioned integrated circuit component 10 is electrically connected on this printed circuit board (PCB) 20 by pin 21, become the electronics module semi-manufacture that an integrated circuit is formed, and aforementioned electronic module semi-manufacture are inserted a body through in the mould 60 that designs, then, provide between the integrated circuit and circuit board of stuff 30 to this mould 60, these stuff 30 can be glue, the electronics module body is discharged and defined and form to feasible gas with 20 of integrated circuit components 10 and printed circuit board (PCB)s in this mould 60, at last mould 60 is separated with this electronics module, form this electronics module.In addition, integrated circuit component 10 of the present invention can be an image element or image chip.
Utilize the practiced camera lens module making method of camera lens module of the present invention, comprise: a printed circuit board (PCB) 20 is provided; One integrated circuit component 10 is provided, this integrated circuit component 10 is electrically connected in this printed circuit board (PCB) 20, to form image module semi-manufacture 24; Make these image module semi-manufacture 24 insert a mould 60; Provide between the integrated circuit component 10 and printed circuit board (PCB) 20 of stuff 30 to this mould 60, with the gas discharge of integrated circuit components 10 in this mould 60 and 20 of printed circuit board (PCB)s and define and form an image module 27; One lens mount 40 is placed on this image module 27, this lens mount 40 is combined with this image module 27 by these stuff 30; And this mould 60 of removal, to form this camera lens module 1.
Camera lens module making method of the present invention, the printed circuit board (PCB) 20 of one soft matter material at first is provided, its advantage is thin than the circuit board of hard, with an integrated circuit component 10 is provided, this integrated circuit component 10 is electrically connected on this printed circuit board (PCB) 20 by pin 21, become the image module semi-manufacture 24 that an integrated circuit is formed, and above-mentioned image module semi-manufacture 24 are inserted a body passed through in the mould 60 of design, then, provide between the integrated circuit and circuit board of stuff 30 to this mould 60, these stuff can be glue, image module 27 bodies are discharged and defined and form to feasible gas with 20 of integrated circuit components 10 and printed circuit board (PCB)s in this mould 60, at last mould 60 is separated with this image module 27, form this embedded type camera lens module 1, and lens group 50 devices are gone in the lens mount 40 promptly finish, shown in Fig. 1 D and Fig. 1 E.And Using such method can utilize stuff 30 to replace general extra housing, reaches the body and the function that define, protect this integrated circuit module.In addition, also can utilize stuff still uncured before, further other element of combining with this integrated circuit module is desired in processing as enclose, it is cohered shaping after, reach effect of Combination at these stuff of curing.What deserves to be mentioned is that this viscose has replaced the space between image element and circuit board in the camera lens module, also defined the body of camera lens module in addition, directly reach the effect of dwindling camera lens module height because of it simultaneously in conjunction with image module and lens mount.
See also Fig. 2 A to Fig. 2 F, be the synoptic diagram of second embodiment of the invention.Embedded type camera lens module 1 ' of the present invention comprises: a printed circuit board (PCB) 20; One integrated circuit component 10 is electrically connected on this printed circuit board (PCB) 20; One lens mount 40 has a chamber, and this lens mount 40 is disposed at the top on these integrated circuit component 10 surfaces relatively; And stuff 30, be one in order to connect this printed circuit board (PCB) 20, this integrated circuit component 10 and this lens mount 40.
Please continue F with reference to figure 2A to Fig. 2, aforementioned printed circuit board (PCB) 20 is the printed circuit board (PCB) of a soft materials and is a cruciform, this printed circuit board (PCB) 20 has first surface 23 and second surface 22, and the first surface 23 of aforementioned printed circuit board (PCB) 20 has first electric terminal (figure does not show), the second surface 22 of this printed circuit board (PCB) 20 forms the layout of second electric terminal 28, and this first electric terminal is communicated with this second electric terminal 28, and the pin 21 of aforementioned integrated circuit component 10 is electrically connected in first electric terminal of these printed circuit board (PCB) 20 first surfaces 23, shown in Fig. 2 A, and the above on one side edge of aforementioned printed circuit board (PCB) 20 bends to this first surface 23, to form the image module semi-manufacture 24 of a contacts side surfaces by this second electric terminal 28, be four springs foldings in the present embodiment, shown in Fig. 2 B, aforementioned image module semi-manufacture 24 are inserted a body through in the mould 60 that designs, then, provide between the integrated circuit and circuit board of stuff 30 to this mould 60, these stuff 30 can be glue, image module 27 bodies are discharged and defined and form to feasible gas with 20 of integrated circuit components 10 and printed circuit board (PCB)s in this mould 60, at last mould 60 is separated with this image module 27, form embedded camera lens module 1 '.In addition, integrated circuit component 10 of the present invention can be an image element or image chip.
Utilize embedded type camera lens module 1 ' practiced embedded type camera lens module making method of the present invention, comprise: a printed circuit board (PCB) 20 is provided, the first surface 23 of this printed circuit board (PCB) 20 has first electric terminal, the second surface 22 of this printed circuit board (PCB) 20 forms the layout of second electric terminal 28, and this first electric terminal is communicated with this second electric terminal 28; One integrated circuit component 10 is provided, the pin 21 of this integrated circuit component 10 is electrically connected in first electric terminal of these printed circuit board (PCB) 20 first surfaces 23; Make the above edge of this printed circuit board (PCB) 20 to these first surface 23 bendings on one side, to form the image module semi-manufacture 24 of a contacts side surfaces by this second electric terminal 28; Make these image module semi-manufacture 24 insert mould 60; Provide between the integrated circuit component 10 and printed circuit board (PCB) 20 of stuff 30 to this mould 60, with the gas discharge of integrated circuit components 10 in this mould 60 and 20 of printed circuit board (PCB)s and define and form embedded image module 27; One lens mount 40 is placed on this embedded image module 27, the embedded image module 27 of this lens mount 40 and this is combined by these stuff 30; And this mould 60 of removal, to form this embedded type camera lens module 1 '.
Embedded type camera lens module making method of the present invention, the printed circuit board (PCB) 20 of one soft matter material at first is provided, its advantage is thin and can bend than the circuit board of hard, this printed circuit board (PCB) 20 has first surface 23 and second surface 22, this first surface 23 has first electric terminal 21, the second surface 22 of this printed circuit board (PCB) 20 forms the layout of second electric terminal 28, and this first electric terminal 21 is communicated with this second electric terminal 28.One integrated circuit component 10 then is provided, the pin of this integrated circuit component 10 is electrically connected in first electric terminal 21 of these printed circuit board (PCB) 20 first surfaces 23; The edge that this printed circuit board (PCB) 20 is above on one side is to these first surface 23 bendings, to form the image module semi-manufacture 24 of contacts side surfaces by this second electric terminal 28, above-mentioned image module semi-manufacture 24 are inserted a body through in the mould 60 that designs, then provide a viscose 30 to this mould 60 integrated circuit component 10 and circuit board between 20, embedded image module 27 is discharged and defined and form to feasible gas with 20 of integrated circuit components 10 and printed circuit board (PCB)s in this mould 60, its viscose filling can not be polluted second electric terminal 28 of this contacts side surfaces and be covered, and when viscose 30 is still uncured, lens mount 40 is placed on this embedded image module 27, by this viscose 30 this lens mount 40 is combined into embedded type camera lens module 1 ' with this embedded image module 27, treat at last after viscose solidifies mould 60 to be separated with this embedded type camera lens module 1 ', and lens group 50 devices are gone in the lens mount 40 promptly finish, shown in Fig. 2 E and Fig. 2 F, what deserves to be mentioned is, this viscose has replaced the space between image element and circuit board in the embedded camera lens module, also define the body of embedded camera lens module in addition, reached the effect of the height that dwindles the camera lens module simultaneously.
See also shown in Figure 3, another embodiment for embedded type camera lens module of the present invention, its structure and Figure 1A are roughly the same, and its difference is that the pin 21 that connects is to be gone between to circuit board 20 by integrated circuit component 10 upper surfaces, can reach the effect of its height of further reduction.Because all the other members of this embodiment and Figure 1A are roughly the same, so do not repeat them here.
The above is embodiments of the invention only, is not in order to limit interest field of the present invention; All other do not break away from the equivalence of being finished under the disclosed spirit and changes or modification, all should be included in the claim of the present invention.
Claims (17)
1. an embedded type camera lens module making method is characterized in that, may further comprise the steps at least:
One printed circuit board (PCB) is provided, this printed circuit board (PCB) has first surface and second surface, and the first surface of this printed circuit board (PCB) has first electric terminal, and the second surface of this printed circuit board (PCB) forms the layout of second electric terminal, and this first electric terminal is communicated with this second electric terminal;
One integrated circuit component is provided, the pin of this integrated circuit component is electrically connected in first electric terminal of this printed circuit board (PCB) first surface;
Make the above edge of this printed circuit board (PCB) to this first surface bending, to form the image module semi-manufacture of a contacts side surfaces by this second electric terminal on one side;
Make these image module semi-manufacture insert a mould;
Provide between the image element and printed circuit board (PCB) of stuff to this mould, so that an embedded image module is discharged and defined and form to the gas between integrated circuit component and printed circuit board (PCB) in this mould;
One lens mount is placed on this embedded image module, the embedded image module of this lens mount and this is combined by these stuff; And
This mould of removal is to form this embedded type camera lens module.
2. embedded type camera lens module making method as claimed in claim 1 is characterized in that, this printed circuit board (PCB) is a flexible substrate.
3. embedded type camera lens module making method as claimed in claim 1 is characterized in that, these stuff are viscose.
4. embedded type camera lens module making method as claimed in claim 1 is characterized in that, this integrated circuit component is an image element or image chip.
5. a camera lens module making method is characterized in that, may further comprise the steps at least:
One printed circuit board (PCB) is provided;
One integrated circuit component is provided, this integrated circuit component is electrically connected in this printed circuit board (PCB), to form image module semi-manufacture;
Make these image module semi-manufacture insert a mould;
Provide between the integrated circuit component and printed circuit board (PCB) of stuff to this mould, so that an image module is discharged and defined and form to the gas between image element and printed circuit board (PCB) in this mould;
One lens mount is placed on this image module, this lens mount is combined with this image module by these stuff; And
This mould of removal is to form this camera lens module.
6. camera lens module making method as claimed in claim 5 is characterized in that, this printed circuit board (PCB) is a flexible substrate.
7. camera lens module making method as claimed in claim 5 is characterized in that, these stuff are viscose.
8. camera lens module making method as claimed in claim 5 is characterized in that, this integrated circuit component is an image element or image chip.
9. an electronic module making method is characterized in that, may further comprise the steps at least:
One printed circuit board (PCB) is provided;
Provide an integrated circuit component to be electrically connected in this printed circuit board (PCB) and insert mould;
Provide stuff to this mould between integrated circuit component and printed circuit board (PCB) and around the body to define integrated circuit module body; And
This mould of removal is to form this electronics module.
10. electronic module making method as claimed in claim 9 is characterized in that, in uncured state winding one supporting body of stuff.
11. electronic module making method as claimed in claim 9 is characterized in that, these stuff are viscose.
12. electronic module making method as claimed in claim 9 is characterized in that, this integrated circuit component is an image element or image chip.
13. an embedded type camera lens module is characterized in that, comprises:
One printed circuit board (PCB);
One integrated circuit component is electrically connected on this printed circuit board (PCB);
One lens mount has a chamber, and this lens mount is disposed at the top on this integrated circuit component surface relatively; And
One stuff, connecting this printed circuit board (PCB), this integrated circuit component and this lens mount is one.
14. embedded type camera lens module as claimed in claim 13 is characterized in that, this printed circuit board (PCB) is a flexible substrate.
15. embedded type camera lens module as claimed in claim 13 is characterized in that, these stuff are viscose.
16. embedded type camera lens module as claimed in claim 13 is characterized in that, the configuration lens group is in the chamber of this lens mount.
17. embedded type camera lens module as claimed in claim 13 is characterized in that, this integrated circuit component is an image element or image chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101538106A CN100474023C (en) | 2006-09-12 | 2006-09-12 | Embedded type camera lens module group and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101538106A CN100474023C (en) | 2006-09-12 | 2006-09-12 | Embedded type camera lens module group and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101144887A true CN101144887A (en) | 2008-03-19 |
| CN100474023C CN100474023C (en) | 2009-04-01 |
Family
ID=39207500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101538106A Expired - Fee Related CN100474023C (en) | 2006-09-12 | 2006-09-12 | Embedded type camera lens module group and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100474023C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7990730B2 (en) | 2007-11-20 | 2011-08-02 | Hon Hai Precision Industry Co., Ltd. | Imaging device |
-
2006
- 2006-09-12 CN CNB2006101538106A patent/CN100474023C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7990730B2 (en) | 2007-11-20 | 2011-08-02 | Hon Hai Precision Industry Co., Ltd. | Imaging device |
| CN101442061B (en) * | 2007-11-20 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Camera component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100474023C (en) | 2009-04-01 |
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