CN101142444A

CN101142444A - Light guiding plate formed of transparent resin, planar light source, and light guiding plate manufacturing method

Info

Publication number: CN101142444A
Application number: CNA2006800085253A
Authority: CN
Inventors: 田原久志; 黑川晴彦
Original assignee: Mitsubishi Engineering Plastics Corp
Current assignee: Mitsubishi Engineering Plastics Corp; Mitsubishi Gas Chemical Co Inc
Priority date: 2005-03-16
Filing date: 2006-02-27
Publication date: 2008-03-12
Anticipated expiration: 2026-02-27
Also published as: CN100559067C

Abstract

A light guiding plate is formed by transparent thermoplastic resin and has a first surface, a second surface opposing to the first surface, a first side surface, a second side surface, a third side surface opposing to the first side surface, and a fourth side surface opposing to the second side surface. The first surface has a convex portion and/or a concave portion. The length of the light guiding plate in the longitudinal direction which is the distance between the first side surface and the third side surface is not smaller than 40 mm and not greater than 70 mm. The thickness of at least 80% of the light guiding plate is not smaller than 0.1 mm and not greater than 0.55 mm.

Description

The LGP of transparent resin system and surface light source apparatus and manufacturing method of light conducting board

Technical field

The LGP of transparent thermoplastic resin's system that the liquid crystal indicator that the present invention relates to use in personal computer or portable phone, PDA (portable data assistance, personal digital assistant), on-vehicle navigation apparatus, the game machine etc. is used or used in other purposes, and surface light source apparatus and this manufacturing method of light conducting board that described LGP has been installed.

Background technology

Requirement for slim, the light weight of tackling liquid crystal indicator, power saving, high brightness, high-resolution in the liquid crystal indicator that uses in personal computer or portable phone, PDA, on-vehicle navigation apparatus, the game machine etc., is assembled with surface light source apparatus.This LGP have the 1st with relative with the 1st smooth the 2nd, make by transparent material usually.

The LGP 40 of expression schematic sectional view has the 1st 41,2nd 43,1st side 44,2nd side 45 relative with the 1st 41,3rd side 46 relative with the 1st side 44 and 4th side 47 relative with the 2nd side 45 among Fig. 1 (A).The 1st 41 surface element is provided with jog 42.

Backlight type surface light source apparatus in the liquid crystal indicator is shown in the schematic sectional view of Fig. 1 (B), and the 2nd 43 of LGP 40 relative with liquid crystal indicator 60 and dispose.Penetrate, be divided into by the 1st 41 reflection, by the 2nd 43 light that penetrates with see through the 1st 41 light by light source 50 by the light of the 1st side 44 incidents of LGP 40.The light that sees through the 1st 41 is configured in and the 1st 41 relative locational reflection part 51 reflections, and the incident LGP 40 once more, penetrate by the 2nd 43.Be directed in the liquid crystal indicator 60 with the 2nd 43 relative configurations by the 2nd 43 light that penetrates.Usually, prismatic lens 55 and diffusion disk 52 collapsed configuration make the even diffusion of light between liquid crystal indicator 60 and LGP 40 the 2nd 43.

Preceding light formula surface light source apparatus in the liquid crystal indicator shown in the concept map of Fig. 1 (C), the 2nd 43 of LGP 40 with liquid crystal indicator 60 relative configurations.By light source 50 penetrate, by the light of the 1st side 44 incidents of LGP 40 by the 1st 41 reflection, penetrate by the 2nd 43.Light is by being disposed at the liquid crystal indicator 60 with the 2nd 43 relative position, and parts 54 reflections that are reflected are once more by liquid crystal indicator 60.This light is further by phase-contrast film 53 and the antireflection layer (not shown) that forms on the 2nd 43 of LGP 40, penetrated by the 1st 41 of LGP 40, is identified as image.Preceding light formula surface light source apparatus is brighter than backlight type surface light source apparatus, if only rely on outer light and promptly can throw light on daytime, therefore has the advantage that can reduce consumed power.

But prismatic lens 55 costs an arm and a leg, and when using multi-disc, number of assembling steps increases.Therefore, by on the 1st 41 of LGP 40, forming the jog 42 of prism shape, can address this problem (for example with reference to Japanese kokai publication hei 10-55712 communique).Here,, must improve the density of the jog 42 of prism shape as far as possible, improve luminance efficiency in order to realize low consumpting power, high brightness.In addition, for the sandblast embossed surface with light diffusion effect is set on the 2nd 43, also study thereby omit diffusion disk.

In the past, above-mentioned LGP was by the injection moulding manufactured.That is, use the mold assemblies that possesses molten resin injection part (gate part) and die cavity, via the molten resin injection part, transparent molten thermoplastic resin is expelled in the die cavity, thus the formed light conductive plate.Transparent thermoplastic resin uses materials such as PMMA.But the heat that the inside of instruments such as mobile phone, PDA produces has the tendency that increases, and therefore, just is being replaced into the high polycarbonate resin of hear resistance at present and is using.

The thickness of the liquid crystal indicator that uses in mobile phone etc. is about 3mm at present, and what the thickness of LGP was the thinnest is about 0.7mm.In order to satisfy the strong request of wishing the further attenuate of thickness of liquid crystal indicator, the thickness of LGP also requires to be lower than 0.7mm.

Patent documentation 1: Japanese kokai publication hei 10-138275

Patent documentation 2: Japanese kokai publication hei 10-052839

Patent documentation 3: Japanese kokai publication hei 10-055712

Patent documentation 4: Japanese kokai publication hei 11-058406

Patent documentation 5: TOHKEMY 2004-050819

Patent documentation 6: TOHKEMY 2003-014938

Summary of the invention

Disclosing thickness among the Japanese kokai publication hei 10-138275 is LGP and the injection moulding method thereof of 0.1mm-10mm.The difference that discloses thinner wall section among Japanese kokai publication hei 10-052839 and the Japanese kokai publication hei 10-055712 and be 0.1mm-1mm, heavy section and thinner wall section is 0.5mm or above LGP and injection moulding method thereof.And disclosing thickness among the Japanese kokai publication hei 11-058406 is lamellar moulding product and the injection moulding method thereof of 0.1mm-7mm.Formed body and the forming method thereof of 0.1mm-30mm are disclosed among the TOHKEMY 2004-050819.In addition, use the polycarbonate resin of mobile difference, when having the LGP of jog of prism shape by the injection moulding molded surface, for example TOHKEMY 2003-014938 discloses to solve and particularly has been positioned at the method for problem that can't form the jog of prism shape apart from the LGP surface portion of gate part position far away.

But, in these patent disclosure communiques among the disclosed embodiment, the thickness of LGP or moulding product be 0.7mm or more than.LGP or moulding product size be 100mm or more than.LGP or moulding product with above-mentioned thickness or size can form by disclosed method in the above-mentioned patent disclosure communique.But, based on the disclosed technology of these patent disclosure communiques, when trial is lower than the LGP of 0.7mm by injection moulding manufactured thickness, die cavity part corresponding to materials flow end (apart from molten resin injection part (gate part) farthest) can't be melted the thermoplastic resin complete filling, in fact can't make desirable LGP.

Therefore, the object of the present invention is to provide thickness to be lower than 0.7mm, extremely thin LGP, and surface light source apparatus and this manufacturing method of light conducting board of having assembled this LGP.

For achieving the above object, LGP of the present invention is to contain the transparent thermoplastic resin, LGP with the 1st, relative with the 1st the 2nd, the 1st side, the 2nd side, 3rd side relative and 4th side relative with the 2nd side with the 1st side, wherein the 1st surface element is provided with protuberance and/or recess (promptly, protuberance is set, recess perhaps also is set, protuberance and recess perhaps are set); Length as the length direction of the LGP of the length between the 1st side and the 3rd side is 40mm or above, 130mm or following, preferred 45mm or above, 120mm or following; The thickness that accounts for the zone of minimum 8 one-tenth of LGP is 0.1mm or above, 0.55mm or following, preferred 0.15mm or above, 0.50mm or following; Flatness is 200 μ m or following.

For achieving the above object, flat light source of the present invention contains LGP and light source, it is characterized in that: this LGP contains the transparent thermoplastic resin; Have the 1st, relative with the 1st the 2nd, the 1st side, the 2nd side, 3rd side relative and 4th side relative with the 2nd side with the 1st side, the 1st surface element is provided with protuberance and/or recess (promptly, be provided with protuberance, perhaps be provided with recess, perhaps be provided with protuberance and recess); Length between the 1st side and the 3rd side, promptly the length of the length direction of LGP is 40mm or above, 130mm or following, preferred 45mm or above, 120mm or following; The thickness that accounts for the zone of minimum 8 one-tenth of LGP is 0.1mm or above, 0.55mm or following, preferred 0.15mm or above, 0.50mm or following, and flatness is 200 μ m or following; By the 1st side incident light of LGP, penetrate light by the 1st and/or the 2nd.

In the surface light source apparatus, light source for example is configured in the 1st side (incidence surface) as the end of LGP.The light that is penetrated, incided by the 1st side LGP by light source is by the protuberance or the recess scattering that form on the 1st of LGP, by the 1st and/or the 2nd ejaculation.

For achieving the above object, manufacturing method of light conducting board of the present invention is following manufacturing method of light conducting board: this LGP contains transparent thermoplastic resin, have the 1st, relative with the 1st the 2nd, the 1st side, the 2nd side, 3rd side relative and 4th side relative with the 2nd side with the 1st side, the 1st surface element is provided with protuberance and/or recess, length between the 1st side and the 3rd side, the length that is the length direction of LGP be 40mm or more than, 130mm or following, the thickness that accounts for the zone of minimum 8 one-tenth of LGP be 0.1mm or more than, 0.55mm or below, flatness is 200 μ m or following; Wherein use possess die cavity and be used for the molten thermoplastic resin by the part (cavity surface) corresponding to any side of LGP be expelled to molten resin injection part in the die cavity, by the mold assemblies that the 1st mold component and the 2nd mold component constitute, this manufacture method contains following each step:

(A) the 1st mold component and the 2nd mold component are passed through clamp force F ₀Carry out locked mode, form die cavity, then

(B) transparent molten thermoplastic resin is expelled in the die cavity by the molten resin injection part,

(C) through t after second, through behind t second (0 second≤t≤8.0 seconds), making clamp force was 0.5F after perhaps the molten thermoplastic resin was expelled to step in the die cavity and its follow-up pressurize step and finishes after the molten thermoplastic resin was expelled to step in the die cavity and finishes ₀Below,

(D) after the cooling of the thermoplastic resin in the die cavity, the curing, the 1st mold component and the 2nd mold component are decontroled, taken out LGP.

In the manufacturing method of light conducting board of the present invention, when step finishes in the molten thermoplastic resin is expelled to die cavity (being t=0) or until through 8.0 seconds (i.e. 0＜t≤8.0 second), perhaps the molten thermoplastic resin is expelled to injecting step in the die cavity and its follow-up pressurize step (time of pressurize step is t ' second) when finishing (being t=0) or until through 8.0 seconds (i.e. 0＜t≤8.0 second), makes clamp force F ₁Be 0.5F ₀Or below, preferred 0.5 second≤t≤6 seconds, more preferably 1 second≤t≤4 second, more real is the deformation state of the LGP of observation post's moulding, setting-up time t gets final product.The value of t surpasses 8 seconds, and then the contraction that the thermoplastic resin cooling causes in the die cavity usually finishes, and become strain and remain in state in the thermoplastic resin, so LGP is distorted or expands, and flatness may reduce.Preferred satisfied 0≤F ₁/ F ₀≤ 0.5, more preferably 0≤F ₁/ F ₀≤ 0.4, further preferred 0≤F ₁/ F ₀≤ 0.3, more real says, the deformation state of LGP that can observation post's moulding is set F ₀Value, F ₁Value.In addition, if not with clamp force F ₁Be decided to be 0.5F ₀Or below, then the interior inner strain that produces of thermoplastic resin of die cavity is difficult to discharge, and causes LGP distortion or expansion, and flatness may reduce.

When with apply clamp force F ₀The vertical imaginary plane of direction when cutting off LGP the maximum secting area of LGP be S _MAX(cm ²) time, clamp force F ₀Value preferably satisfy:

F ₀≥9.8×10 ³×S _MAX(N)(＝S _MAX×10 ³kgf)。

Clamp force F ₀Higher limit relevant with employed Coinjection molding apparatus, for example can be 2.9 * 10 ⁴* S _MAX(N) (=S _MAX* 3 * 10 ³Kgf).Clamp force F ₀Value when too small, LGP may produce overlap, and is excessive, then can't promote the exhaust of the gas that produces from the air of die parting line or by resin, in the die cavity molten thermoplastic resin's flowability can variation some, LGP is inner may residual strain, therefore must suitably regulate clamp force F ₀Value.

Usually, the thermoplastic resin that carries out weighing, plasticizing, fusion in the injection barrel that Coinjection molding apparatus possessed is penetrated by the injection barrel, import (injection) in die cavity via notes road that is arranged at the mold assemblies that constitutes by cover half member and dynamic model member and molten resin injection part (gate part), pressurize.In the pressurize step, by injection pressure and other pressure that can regulate arbitrarily (biphasic injection pressure) are switched, can prevent that the molten thermoplastic resin from refluxing and prevent that the molten thermoplastic resin of the moulding contraction that thermoplastic resin cooling, curing cause in the die cavity from adding in the die cavity being used to.Molten resin injection part (gate part) then need not pressurize after solidifying.Therefore, be time (dwell time) t ' that object is determined the pressurize step with the time of solidifying usually until molten resin injection part (gate part).In manufacturing method of light conducting board of the present invention, be that injection moulding thickness is 0.1mm-0.55mm LGP so as thin as a wafer, therefore, according to circumstances can make dwell time t ' is 0 second, but is not limited to this, for example can make to apply 1 * 10 ⁸Pa or following pressure are 2 seconds or following (t '≤2) as time (dwell time) t ' of the pressurize step of dwell pressure, more preferably 0.1 second≤t '≤1 second.Pressure in the pressurize step (dwell pressure) is too high, then the dwell time long, become the LGP deformation reason.Through t after second, clamp force was 0.5F after step that the molten thermoplastic resin injects in die cavity finished ₀Or below, and after the step that the molten thermoplastic resin injects in die cavity is finished during through t second, clamp force keeps F ₀, and do not carry out pressurize (promptly can't help to inject the thermoplastic resin of barrel in die cavity exerts pressure).Perhaps finish through t after second in molten thermoplastic resin injecting step and its follow-up pressurize step in die cavity, clamp force is 0.5F ₀Or below, and finishing the back until during through t second in the pressurize step of molten thermoplastic resin in die cavity, the maintenance clamp force is F ₀The pressurize step is finished, and therefore can't help to inject the thermoplastic resin of barrel in die cavity and exerts pressure.

In the manufacturing method of light conducting board of the present invention, can be as required before die sinking to blowing in the die cavity, make LGP by the cavity surface demoulding, reduce ejection resistance, perhaps by being used in combination air blowing in die sinking or before ejecting, the distortion of LGP when the demoulding of transfer printing raising can be suppressed especially, the raising of flatness can be further realized effectively.

In LGP of the present invention, surface light source apparatus or the manufacturing method of light conducting board (following it is summed up is called the present invention), the flatness of LGP is 200 μ m or following, preferred 150 μ m or following, further preferred 100 μ m or following.

The mensuration of flatness can be carried out according to JIS B7513-1992.Therefore the very thin thickness of LGP may be out of shape owing to the contact pressure of probe, can't obtain to be worth accurately, therefore, preferred low low pressure probe or the noncontact color laser probe assay of contact pressure that use.Specifically, there are following three kinds of LGPs usually:

(1) integral body has the LGP of the roughly certain thin sheet form of thickness;

(2) the roughly certain LGP of thickness of, other parts thicker as near the part the 1st side of incidence surface;

(3) be the 3rd side (for example being positioned near the side of molten resin injection part) by the 1st side to the face relative with incidence surface as incidence surface, thickness is the LGP of the wedge shape of attenuate gradually.With mensuration be positioned over the minimum position, three places of the LGP on the platform and the face calibrated as datum level, minimum mensuration 21 places on the sample face, with this as flatness.At this moment, for certain thickness LGP, near four jiaos of necessary mensuration and the central authorities.In near the LGP that the part wall is thicker as the 1st side of incidence surface, preferably avoiding measuring should be than the thickness portion place.In addition, for having only the thicker LGP in the 1st side, preferably avoid the mensuration at this part place.With the sample face as being provided with protuberance and/or recess the 1st.

In LGP of the present invention or the surface light source apparatus, with possessing die cavity and being used for arbitrary side (the 1st side, the 2nd side, the 3rd side or the 4th side by LGP with the molten thermoplastic resin, preferred the 1st side) mold assemblies of the pairing cavity surface molten resin injection part of injecting in die cavity, LGP is preferably by being expelled to this formation of moulding in the die cavity with transparent molten thermoplastic resin via the molten resin injection part.In addition, in this case or in manufacturing method of light conducting board of the present invention, use Q value is 0.60 thermoplastic resin, under the injecting condition of 330 ℃ of resin temperatures, via the molten resin injection part with the molten thermoplastic resin be expelled to moulding in the die cavity for example the length between the 1st side and the 3rd side be that the length of the length direction of LGP is that 52mm, thickness are the LGP of 0.3mm, the resin injection speed of this moment be 1.2m second-1 or more than, preferred 1.5m second ^-1Or more than, more preferably 2.0m second ^-1Or more than.Usually, in the injection moulding of routine, the resin injection speed when being expelled to the molten thermoplastic resin in the die cavity via the molten resin injection part is 0.1m second ^-1-0.3m second ^-1About.In the preferred version among the present invention, compare with injection moulding in the past, resin injection speed is 20 times or above high speed.Like this, the high speed resin injection speed incomparable with technology in the past is expelled to the molten thermoplastic resin in the die cavity via the molten resin injection part, the molten thermoplastic resin can be filled into really and fully in the thin die cavity.By make resin temperature be 360 ℃ or more than, though can be according to 0.1m second ^-1-0.3m second ^-1About injection moulding in the past carry out moulding, but along with the difference of condition of molding, thermoplastic resin is because of the thermal decomposition xanthochromia, produces problems such as the brightness reduction of LGP or quality reduction.

Comprise among the present invention of aforesaid way, preferably the inside of mold assemblies be provided with constitute by zirconia ceramics or electric conductivity zirconia ceramics insert body and for the 1st at LGP on forms protuberance and/or recess and is disposed at the surperficial of the insert body relative and is provided with inserting that the metal level of recess and/or protuberance constitutes that this constitutes with die cavity.

By the body of inserting is made of the material of low heat conductivities such as zirconia ceramics or electric conductivity zirconia ceramics, can prevent the quenching of molten thermoplastic resin in the die cavity, the result, molten thermoplastic resin's flowability is improved, avoid with molten thermoplastic resin that metal level contacts on form cured layer, also can be filled in the die cavity really and fully even the thickness of die cavity is extremely thin with the molten thermoplastic resin.And, recess and/or the protuberance that is arranged on the metal level can be transferred on the LGP with high accuracy really and exactly.

Comprise among the present invention of above-mentioned preferred version,, but be not limited to this, preferably the molten thermoplastic resin is expelled to constituting in the die cavity by the pairing cavity surface in LGP the 3rd side only by the 1st side incident of LGP.

Comprise among the present invention of above-mentioned preferred version, the Q value of thermoplastic resin is 0.5cm ³Second ^-1Or more than, preferred 0.6cm ³Second ^-1Or more than.Here, the Q value of thermoplastic resin is to use high formula flow tester (Shimadzu Corporation's manufacturing), is being heated to imposed load 1.57 * 10 on 280 ℃ the molten thermoplastic resin ⁷Pa (160kgf/cm ²), molten thermoplastic resin's discharge (unit: cm when under this state, flowing out by the nozzle of diameter 1mm, length 10mm ³Second ^-1).Flowability that we can say the high more then molten thermoplastic resin of Q value is good more.In addition, the Q value is too high, the then toughness of thermoplastic resin forfeiture, and LGP breaks easily, and therefore, the higher limit of the Q value of reality can be 1.5cm ³Second ^-1In addition, for example in the aromatic polycarbonate resin in the past, the highest only 0.36-0.40cm of the peak of Q value ³Second ^-1, 0.5cm ³Second ^-1Or above above-mentioned Q value is the very high value that does not have as yet at present.

Comprise among the present invention of various preferred versions of above explanation, thermoplastic resin can exemplify transparent thermoplastic resins such as phenylethylene resin series such as " ZEONOR " cyclic olefin resins of etc.ing that the fluoropolymer resin of aromatic polycarbonate resin, plexiglass, ENB system-Japanese ZEON Co., Ltd. makes, clear polyimides resin, ester ring type acrylic resin, polystyrene, preferably aromatic polycarbonate resin.

The Merlon that is suitable for using in the present invention can prepare according to known method, and for example having with the ring-opening polymerisation method of interfacial polymerization, pyridine method, ester-interchange method, cyclic carbonate compound is the various preparation methods of representative.Specifically, be make aromatic dihydroxy compound or itself and a spot of polyol, be polymer or the copolymer that straight chain that carbonyl based compounds such as carbonic diester, carbon monoxide or the carbon dioxide reaction of representative obtains maybe can have the thermoplastic aromatic polycarbonate of side chain with the phosgene that is known as phosgene usually or with dimethyl carbonate or diphenyl carbonate.

The raw material aromatic dihydroxy compound for example has: 2, two (4-hydroxy phenyl) propane [=bisphenol-A] of 2-, 2, two (the 4-hydroxyls-3 of 2-, the 5-3,5-dimethylphenyl) propane, 2, two (the 4-hydroxyls-3 of 2-, 5-diethyl phenyl) propane, 2, two (the 4-hydroxyls-(3 of 2-, the 5-diphenyl) propane phenyl), 2, two (the 4-hydroxyls-3 of 2-, the 5-dibromo phenyl) propane, 2, two (4-hydroxy phenyl) pentanes of 2-, 2,4 '-dihydroxy-diphenyl methane, two-(4-hydroxy phenyl) methane, two-(4-hydroxyl-5-nitrobenzophenone) methane, 1, two (4-hydroxy phenyl) ethane of 1-, 3, two (4-hydroxy phenyl) pentanes of 3-, 1, the 1-bis(4-hydroxyphenyl)cyclohexane, two (4-hydroxy phenyl) sulfone, 2,4 '-dihydroxy-diphenyl sulfone, two (4-hydroxy phenyl) thioether, 4,4 '-dihydroxydiphenyl ether, 4,4 '-dihydroxy-3,3 '-dichloro diphenyl ether, 4,4 '-dihydroxy-2,5-diethoxy diphenyl ether etc., preferred two (4-hydroxy phenyl) alkanes, preferred especially 2, two (4-hydroxy phenyl) propane [being called bisphenol-A] of 2-.These aromatic dihydroxy compounds can be separately or two kinds or above mixing are used.

In order to obtain the Merlon of branching, can use phloroglucin, 4,6-dimethyl-2,4,6-three (4-hydroxy phenyl) heptene-2,4,6-dimethyl-2,4,6-three (4-hydroxy phenyl) heptane, 2,6-dimethyl-2,4,6-three (4-hydroxy phenyl) teracrylic acid, 1,3,5-three (4-hydroxy phenyl) benzene, 1,1, the polyol shown in 1-three (4-hydroxy phenyl) ethane etc., perhaps 3, two (4-hydroxyaryl) oxindoles (=isatin bis-phenol) of 3-, 5-chlorisatide bis-phenol, 5,7-two chlorisatide bis-phenols, 5-bromoisatin bis-phenols etc. are as the part of above-mentioned aromatic dihydroxy compound, and consumption is 0.01-10mol%, preferred 0.1-2mol%.

In the reaction of interfacial polymerization, be in the presence of organic solvent inert, the aqueous alkali to reaction, with common pH remain 10 or more than, use aromatic dihydroxy compound and suitable molecular weight regulator (end group terminator), be used to prevent the antioxidant of aromatic dihydroxy compound oxidation as required, with phosgene reaction, add polymerization catalysts such as tertiary amine or quaternary ammonium salt then, carry out interfacial polymerization, can obtain Merlon.The interpolation of molecular weight regulator so long as from phosgene form when polymerisation begins during get final product, be not particularly limited.Reaction temperature is 0-35 ℃, and the reaction time is several minutes-a few hours.

Here, can be chlorinated hydrocarbons such as carrene, 1,2-dichloroethanes, chloroform, monochloro-benzene, dichloro-benzenes for reaction for organic solvent inert, aromatic hydrocarbons such as benzene,toluene,xylene etc.Molecular weight regulator or end group terminator can be enumerated the compound with monovalence phenolic hydroxyl, specifically have: m-methyl phenol, p-methyl phenol, a propylphenol, n-propyl phenol, p-t-butyl phenol, phenol that chain alkyl is replaced etc.With respect to the 100mol aromatic dihydroxy compound, the consumption of molecular weight regulator is 50-0.5mol, preferred 30-1mol.Polymerization catalyst can be enumerated tertiary amines such as trimethylamine, triethylamine, tri-n-butylamine, tripropyl amine (TPA), trihexylamine, pyridine; Quaternary ammonium salts such as trimethyl benzyl ammonia chloride, tetramethyl ammonium chloride, triethyl benzyl ammonia chloride etc.

The reaction of ester-interchange method is the ester exchange reaction of carbonic diester and aromatic dihydroxy compound.Usually, the decompression degree the when mixed proportion by regulating carbonic diester and aromatic dihydroxy compound, conditioned reaction can determine the molecular weight and the terminal hydroxyl amount of desirable Merlon.More efficient methods is to add the method that the end group terminator is regulated when reaction in addition, and this is well-known.The end group terminator of this moment can be monobasic phenols, monocarboxylic acid class, carbonic diester class.The terminal hydroxyl amount has a significant impact the heat endurance of Merlon, hydrolytic stability, tone etc., in order to keep practical physical properties, is preferably 1000ppm or following, preferred especially 700ppm or following.In the Merlon by ester-interchange method preparation, the terminal hydroxyl amount crosses at least that molecular weight can't improve, and tone is variation also, therefore preferred 100ppm or more than.Therefore, usually, use equimolar amounts or above carbonic diester, preferably use with the amount of 1.01-1.30mol with respect to the 1mol aromatic dihydroxy compound.

When preparing Merlon, use ester exchange catalyst usually by ester-interchange method.Ester exchange catalyst is not particularly limited, and mainly is to use alkali metal compound and/or alkaline earth metal compound, can be used in combination alkali compounds such as alkaline boron compound, alkaline phosphating compound, alkaline ammonium compound or amine compound complementaryly.In the ester exchange reaction that the use above-mentioned raw materials carries out, preferably under 100-320 ℃ temperature, react, finally 2.7 * 10 ²Under Pa (2mmHg) or the following decompression, while remove the method that accessory substances such as aromatic hydroxy compound carry out melt polycondensation reaction.Melt polycondensation can be that batch (-type) or continous way are carried out, and for the Merlon that is fit to use in the present invention, considers from stable equal angles, preferably carries out with continous way.In the ester-interchange method, deactivator as the catalyst in the Merlon, the preferred compound that uses catalyst neutralisation, for example sulfur-bearing acid compound or the derivative of formation thus, its amount is the scope of 0.5-10 equivalent, preferred 1-5 equivalent with respect to the alkali metal of catalyst, with respect to Merlon, add with the scope of 1-100ppm, preferred 1-20ppm usually.

Comprise that it is 1.0 * 10 that thermoplastic resin is preferably viscosity-average molecular weight (Mv) among the present invention of various preferred versions of above explanation ⁴-1.5 * 10 ⁴, preferred 1.1 * 10 ⁴-1.4 * 10 ⁴Aromatic polycarbonate resin.The viscosity-average molecular weight of aromatic polycarbonate resin is lower than 1.0 * 10 ⁴, then the mechanical strength of LGP reduces, and possibly can't satisfy the desired performance of LGP.And the viscosity-average molecular weight of aromatic polycarbonate resin surpasses 1.5 * 10 ⁴The time, the mobile variation of the aromatic polycarbonate resin of fusion, mouldability goes wrong, and is difficult to obtain desirable LGP.

Viscosity-average molecular weight (Mv) be with carrene as solvent, by Ubbelohde viscometer, measure down at 25 ℃, obtain inherent viscosity [η] by the solution viscosity of gained, use this inherent viscosity, calculate according to following formula.

η＝1.23×10 ^-4×Mv ^0.83

Comprise among the present invention of various preferred versions discussed above, at CIE (International Commission on Illumination) in the xy chromatic diagram of the international label method CIE 1931 XYZ colour systems of formulating in 1931, (the x of LGP, y) value is x≤0.375 and y≤0.335, preferably satisfies x≤0.370 and y≤0.330.LGP (x, value y) breaks away from this scope, and then the color of LGP becomes yellow, and outward appearance is not so good.In addition, (the x of LGP in the xy chromatic diagram, y) value is to use White LED as light source, luminance meter SR3, BM7 or one of them mensuration of BM5A of using トプコ Application company to make are position, the three places (measurement ranges: the mean value of measurement result diameter 10mm) from incidence surface LGP part farthest.

More particularly, comprise (x, the determining and to carry out in accordance with the following methods of value y) in the xy chromatic diagram (being also referred to as CIE system or XYZ chromaticity diagram) of brightness measuring.That is, for example in dark place, can place LGP on the unit of LGP leaded light by the incidence surface of LGP, the light that will be penetrated by lamp is imported in the LGP by the incidence surface of LGP.Measure the brightness of the light that penetrates by LGP with the luminance meter that is arranged on about 35cm place, LGP top.By changing the distance of LGP, can change the size of measurement range to luminance meter.The brightness measuring of LGP etc. is preferably cut apart LGP by the determination part figure place as far as possible equably, and the middle body in the described zone of cutting apart carries out.

Comprise among the present invention of various preferred versions of above explanation, LGP can be that integral body has the roughly certain thin sheet form of thickness, by the 1st side (incidence surface) incident light of LGP, penetrates constituting of light by the 1st and/or the 2nd; It perhaps can be the truncate quadrangular pyramid shape that integral body has wedge-like, two relative sides of truncate quadrangular pyramid shape are equivalent to the 1st and the 2nd of LGP, the bottom surface of truncate quadrangular pyramid shape is equivalent to the 1st side of LGP, the end face of truncate quadrangular pyramid shape is equivalent to the 3rd side of LGP, two relative sides of all the other of truncate quadrangular pyramid shape are equivalent to the 2nd side and the 4th side of LGP, by the 1st side (incidence surface) incident light of LGP, penetrate constituting of light by the 1st and/or the 2nd.Perhaps can be 8 one-tenth of LGP integral body or more than have the roughly certain thin sheet form of thickness, remainder thickness slowly thickens, described part finishes the formation at the 1st side (incidence surface).Have in the LGP of thin sheet form, the thickness integral body of LGP is rendered as " roughly certain ", this phenomenon may be since during this LGP moulding condition of molding inhomogeneous that the thickness of LGP is produced is inhomogeneous, also comprised the situation of the described uneven thickness of LGP.

Among the present invention, " transparent thermoplastic resin " is meant that the directional light transmitance of measuring according to the 5.5.2 item (determination method A) of JIS K7105-1981 is 85% or above thermoplastic resin.In the mensuration, the thickness of resin test film is 3.0mm.

The thickness measurement of LGP uses micrometer to carry out, and measures the position, 9 place of LGP at least, obtains average thickness.Preferably obtain simultaneously thickness difference.Here, when asking thickness difference, the pairing LGP of die cavity part that particularly is positioned near the part (near for example LGP part the 3rd side) of the pairing LGP of part of the die cavity the molten resin injection part and the is equivalent to flow end partly thickness difference between (for example as near the LGP part the 1st side of incidence surface) is easy to maximum, therefore, preferably obtain thickness difference by the thickness of measuring these parts of LGP.For certain thickness LGP, the preferred thickness difference is 80 μ m or following.Surpass 80 μ m then the intrinsic brilliance value of LGP may reduce than brightness value based on optical design, for example, be difficult to be assembled in the liquid crystal display unit cell of thin type, if assembling obstinately, then the liquid crystal indicator body is applied in pressure, and the danger of liquid crystal indicator body breakage is arranged.

In the LGP, the 1st periphery can not form protuberance or recess, and perhaps the 1st periphery can not satisfy the size of protuberance described later or recess or the regulation of surface roughness.That is, in fact to light scattering etc. not the 1st part of effect can not form protuberance or recess, perhaps can not satisfy the size of protuberance or recess or the regulation of surface roughness.

When LGP of the present invention is used for liquid crystal indicator, can be assembled in the marginal ray formula backlight type surface light source apparatus, also can be assembled in the preceding light formula surface light source apparatus of marginal ray formula.That is, these surface light source apparatus are equivalent to surface light source apparatus of the present invention.

In the marginal ray formula backlight type surface light source apparatus, the light source that for example contains fluorescent lamp or light emitting diode (LED) be configured in LGP the 1st side near.The 1st face of reflection part and LGP relatively disposes.The 2nd face of liquid crystal indicator and LGP relatively disposes.The light that is penetrated by light source is incided in the LGP by LGP the 1st side, runs into the 1st protuberance or recess, and scattering takes place, and by the 1st ejaculation, the parts that are reflected reflection is incided in the 1st, by the 2nd ejaculation, irradiating liquid crystal display unit again.For example can dispose diffusion disk between the 2nd of liquid crystal indicator and LGP.

Before the marginal ray formula in the light formula surface light source apparatus, the light source that for example contains fluorescent lamp or light emitting diode be configured in LGP the 1st side near.The 2nd face of liquid crystal indicator and LGP relatively disposes.The light that is penetrated by light source incides LGP by LGP the 1st side, runs into the 1st protuberance or recess, reflects, and by the 2nd ejaculation and by phase-contrast film or polarizing film, passes through liquid crystal indicator again.The light that is penetrated by liquid crystal indicator is configured in the reflection part reflection in the liquid crystal indicator outside, once more by liquid crystal indicator, by phase-contrast film or polarizing film, again by LGP, by the 1st ejaculation of LGP.This light is identified as being presented at image on the liquid crystal indicator etc.Usually, form antireflection layer on the 2nd of LGP the surface.

In the surface light source apparatus of the present invention, the light that is penetrated by light source can directly import in the LGP, also can import LGP indirectly.During for the latter, for example can use optical fiber.According to the formation of surface light source apparatus, structure, use etc., light source can be artificial light sources such as fluorescent lamp, incandescent lamp, light emitting diode, fluorescent tube, also can be natural daylights such as sunshine.

Be located at the height of the protuberance of the 1st of LGP or recess or the degree of depth, spacing, shape can be certain, also can change according to distance with light source.During for the latter, the spacing that for example can make protuberance or recess is along with diminishing with the distance of light source.The spacing of protuberance or the spacing of recess are meant along light and incide the spacing of protuberance of the incident direction in the LGP or the spacing of recess.

Among the present invention, the height of being located at the 1st protuberance is 5 * 10 ^-7M-6 * 10 ^-5M, preferred 1 * 10 ^-6M-5 * 10 ^-5M, more preferably 2 * 10 ^-6M-4 * 10 ^-5M; Spacing is 5 * 10 ^-7M-4 * 10 ^-4M, preferred 5 * 10 ^-6M-3.5 * 10 ^-4M, more preferably 3 * 10 ^-5M-3.0 * 10 ^-4M.The concave depth of perhaps being located at the 1st is 5 * 10 ^-7M-6 * 10 ^-5M, preferred 1 * 10 ^-6M-5 * 10 ^-5M, more preferably 2 * 10 ^-6M-4 * 10 ^-5M; Spacing is 5 * 10 ^-7M-4 * 10 ^-4M, preferred 5 * 10 ^-6M-3.5 * 10 ^-4M, more preferably 3 * 10 ^-5M-3.0 * 10 ^-4M.Perhaps be located at the 1st protuberance and/or recess sum 70% above, preferred 80% or more than satisfy surface roughness 0.3 μ m or following, preferred 0.15 μ m or following, more preferably 0.08 μ m or following.Surface roughness in the par of the 1st of the surface roughness of the par of the 1st of the LGP between protuberance and the protuberance or the LGP between recess and recess is not particularly limited.That is the surface roughness R of the par of the 1st of this LGP, _ZCan be 0.3 μ m or following, also can be the value that surpasses 0.3 μ m, can also be provided with fine concavo-convex.Perhaps in LGP, between protuberance and the protuberance or the part of the 1st of the LGP between recess and the recess do not have the par.That is can be, in the 1st formation that jog is set of LGP.

Be arranged at the protuberance of the 1st of LGP and/or recess and can be and have along the continuous linearity convex of extending with the angled direction of the incident direction of the light that incides LGP and/or the formation of spill.The continuous linearity convex when cutting off LGP with the incident direction that is the light that incides LGP and with the 1st vertical imaginary plane here, and/or the cross sectional shape of spill can be triangles; Comprise square, rectangle, trapezoidal any quadrangle; Polygonal arbitrarily; The curve of various slynesses such as the part of circle, an oval part, a parabolical part, a hyp part.Being meant with light when the incident direction of LGP is 0 ° to the angled direction of the incident direction of LGP with light, is 60 °-120 ° direction.Following " direction that has a certain degree to the incident direction of LGP with light " also used with same implication.

Perhaps, being arranged at each protuberance of the 1st and/or each recess can be to have and become the discontinuous convex that the direction of predetermined angular arranges and/or the formation of spill along light to the incident direction of LGP on imaginary straight line.Here, the shape of discontinuous convex and/or spill has pyramid, circular cone, cylinder, comprises the polygonal column of triangular prism or quadrangular prism; The various smooth curved surfaces such as a part of the part of the part of ball, the part of ellipsoid of revolution, paraboloid of revolution, rotation hyperboloid.

When discontinuous convex or spill were curved surface, its surface roughness was preferably with surface roughness R _tRegulation, discontinuous convex or spill in other cases surface roughness or the surface roughness when continuous convex or spill preferably with surface roughness R _ZRegulation.Surface roughness R _ZWith surface roughness R _tRegulation based on JIS B 0601-2001.

The 2nd of LGP preferably is roughly the plane, and the 2nd face is not limited to above-mentioned shape, also can be minute surface, for example can be fine male and fomale(M﹠F).

For the 2nd of the formed light conductive plate, can be the 2nd formation of inserting that further possesses in the internal configurations of mold assemblies.In this case, when LGP was used as the backlight type surface light source apparatus, 2nd surface of inserting relative with die cavity can be minute surface, also can be sandblast face.On the other hand, when LGP was used as preceding light formula surface light source apparatus, 2nd surface of inserting relative with die cavity must be minute surface.Here, when 2nd surface of inserting relative with die cavity is minute surface, the surface roughness R on 2nd surface of inserting relative with die cavity _ZBe 0.01 μ m-0.1 μ m, preferred 0.01 μ m-0.08 μ m, further preferred 0.01 μ m-0.05 μ m.The 2nd inserts can be made of zirconia ceramics, perhaps is made of zirconia ceramics or electric conductivity zirconia ceramics and metal level.During for the former, the surface roughness R of zirconia ceramics _ZAs long as satisfy above-mentioned value, during for the latter, the surface roughness R of layer on surface of metal _ZSatisfying above-mentioned value gets final product.For convenience, the 2nd of above-mentioned formation can be inserted and be called the 2nd of pottery system and insert.According to circumstances, also can insert and constitute by metal with the 2nd.And, can will insert and the 2nd the inserting and be generically and collectively referred to as of pottery system " insert etc. ".

Below describe inserting etc.

The zirconia ceramics or the electric conductivity zirconia ceramics that constitute the bodies of inserting such as inserting preferably are made of partially stabilizedization zirconia ceramics.When the body of inserting such as insert was made of partially stabilizedization zirconia ceramics, the partially stabilizedization agent in the partially stabilizedization zirconia ceramics preferably contained and is selected from calcium oxide (CaO), yittrium oxide (Y ₂O ₃), magnesia (MgO), silica (SiO ₂) and cerium oxide (CeO ₂) at least a material.When partially stabilizedization agent was calcium oxide, the ratio of the partially stabilizedization agent that contains in zirconia ceramics or the electric conductivity zirconia ceramics was 3mol%-15mol%, preferred 6mol%-10mol%; During for yittrium oxide, be 1mol%-8mol%, preferred 2mol%-5mol%; During for magnesia, be 4mol%-15mol%, preferred 8mol%-10mol%; During for cerium oxide, be 3mol%-18mol%, preferred 6mol%-12mol%.

In inserting etc., the thickness of the body of inserting is 0.1mm-10mm, preferred 0.5mm-10mm, more preferably 1mm-7mm, further preferred 2mm-5mm.When the thickness of body inserted was lower than 0.1mm, the effect of heat insulation of inserting etc. diminished, and causes being expelled to the molten thermoplastic resin's quenching in the die cavity, may be difficult to form on LGP protuberance or recess.In addition, when in the mold assemblies of metal or alloy system, fixedly inserting etc., for example can use that the Thermocurable adhesive will be inserted etc. and be bonded in the inside of mold assemblies, but when the thickness of the body of inserting is lower than 0.1mm, if the membrane thickness unevenness of adhesive, residual uneven stress in then inserting etc., fluctuation appears in the LGP surface, or the pressure that is expelled to the molten thermoplastic resin in the die cavity makes to insert and waits breakage.On the other hand, when the thickness of the body of inserting surpassed 10mm, the effect of heat insulation that waits inserted was excessive, if do not prolong the interior resin of die cavity cool time after taking out LGP LGP can be out of shape.Therefore, produce the problem that molding cycle prolongs.

The surface roughness R of the insert body surface relative with die cavity _ZBe 0.1 μ m-10 μ m, preferred 0.1 μ m-8 μ m, further preferred 0.1 μ m-5 μ m.By making the surface roughness R of the insert body surface relative with die cavity _ZBe 0.1 μ m or more than, when forming metal level on above-mentioned surface, can obtain anchoring effect by electroless plating method, the result can form metal level by electroless plating method on this surface.In addition, the surface roughness R on the surface of the insert body relative with die cavity _ZSurpass 10 μ m, the then surface roughness chap of metal level, the required time of layer on surface of metal polishing increases, or metal level is easy to generate pin hole.Can make the rough surface of the insert body relative by blasting treatment or etch processes with die cavity.

The thermal conductivity that constitutes zirconia ceramics, electric conductivity zirconia ceramics or the partially stabilizedization zirconia ceramics of the body of inserting be 8.5J/ (msK) or following [8.5W/ (mK) or below, perhaps 2 * 10 ^-2Cal/ (cmsK) or following], specifically for about 3.5-6J/ (msK) or below.Use has above the inorganic material of the thermal conductivity of 8.5J/ (msK) to be made when inserting body, molten thermoplastic resin in die cavity quenching owing to insert etc., can only obtain and use the outward appearance that does not possess the LGP same degree of inserting etc. and being obtained by the mold assemblies moulding of common making such as carbon steel, these are also different according to condition of molding.

Constituted a part that is arranged at the die cavity in the mold assemblies by inserting etc., here, a part that constitutes die cavity is meant the part of the cavity surface that constitutes the profile of having stipulated LGP.More particularly, die cavity for example by at the face that constitutes die cavity that forms on the 1st mold component that constitutes mold assemblies or the 2nd mold component (cavity surface of mold component) and the surface (cavity surface of inserting) of the part of the formation die cavity that is forming on according to circumstances inserting constitute.In the following description too.In addition, the metal level that is provided with recess and/or protuberance also constitutes cavity surface.Configuration has the metal level of recess or protuberance on the whole or required position of cavity surface such as inserting.During for the latter, the cavity surface of inserting beyond the desired area is made of smooth metal level sometimes.

In inserting etc., metal level for example can be disposed on the cavity surface of inserting at least, also can be arranged at the whole surface of the body of inserting.

The surperficial required surface roughness that is arranged at the recess of metal level and/or protuberance is that the situation of prism shape of mirror finish is different with the situation of the hole point shape that obtains for etching and processing or machining on the surface, is preferably 0.5 μ m or following.In addition, be arranged at metal level recess sum 80% or above, preferred 90% or above during for hole point shape, the preferred surface roughness satisfies 0.5 μ m or following, during mirror finish, surface roughness satisfies 0.1 μ m or following, preferred 0.05 μ m, more preferably 0.01 μ m or following.When discontinuous convex was curved surface, surface roughness was preferably according to surface roughness R _tStipulate that the surface roughness of surface roughness when discontinuous convex is other situation or continuous convex is preferably according to surface roughness R _ZRegulation.

Here, in inserting etc., metal level contains at least a material that is selected from Cr, Cr compound, Cu, Cu compound, Ni and Ni compound, when being arranged on concave depth on the metal level and being d, and metal layer thickness t (unit: m) satisfy (d+5) * 10 ^-6M≤t≤5 * 10 ^-4M, preferred satisfied (d+10) * 10 ^-6M≤t≤1 * 10 ^-4M.Perhaps, when the height that is arranged on the protuberance on the metal level is h, metal layer thickness t (unit: m) preferably satisfy (h+5) * 10 ^-6M≤t≤5 * 10 ^-4M, preferred satisfied (h+10) * 10 ^-6M≤t≤5 * 10 ^-4M.Thus, can on metal level, form recess or protuberance, maybe can pass through conventional cutting processing machine processing metal layer easily by the whole bag of tricks.And, when the molten thermoplastic resin in being expelled to die cavity contacts with metal level, can prevent molten thermoplastic resin's quenching.And can insert easily to mold component (according to circumstances for insert installation portion or be used to install the core rod of inserting) fine setting.And, can obtain high scratch resistance or case hardness.Here, metal layer thickness t is meant by the concave bottom of recess that is arranged at metal level or protuberance or the protuberance top ends distance to the body surface of inserting (when forming reactive metal film described later, to the interface of reactive metal film and metal level).

In inserting etc., metal level can be made of one deck, also can be made of multilayer.The Cr compound specifically can exemplify nickel-chromium alloy.The Cu compound specifically has copper-zinc alloy, copper-cadmium alloy, copper-ashbury metal.And the Ni compound specifically has nickel-phosphor alloy (Ni-P is an alloy), nickel-ferro alloy, nickel-cobalt alloy, nickel-tin alloy, Ni-Fe-phosphorus alloy (Ni-Fe-P is an alloy), nickel-cobalt-phosphorus alloy (Ni-Co-P is an alloy).During scratch resistance that metal level is had relatively high expectations, for example preferably constitute metal level by chromium (Cr).Metal level does not require so high scratch resistance and during required thickness, for example preferably constitutes metal level by copper (Cu).And, when metal level had not only required scratch resistance to a certain degree but also needed thickness, for example preferably constitute metal level by nickel (Ni).When metal level needed thickness and needs case hardness, metal level can be made of two-layer, and for example preferred lower floor is made of copper (Cu) or nickel (Ni), makes desired thickness, carry out thickness and regulate, and the upper strata is made of thin chromium (Cr).

The recess in the metal level or the formation of protuberance such as insert can be undertaken by physics method or chemical method.Use diamond bit to carry out machining, can on metal level, form recess or protuberance.In addition, when forming recess or protuberance by chemical method, can be at the surperficial painting erosion resistant agent layer of metal level, for example,, on resist layer, form pattern thus to the resist layer irradiation ultraviolet radiation via required mask, perhaps form resist layer by print process, follow the mask of using as etching with this resist layer, etch metal layers can form recess or protuberance thus on metal level.Also the formation and the etching of resist layer repeatedly be can carry out as required, recess or protuberance formed.

In inserting etc., the method that for example forms metal level on the surface of the body of inserting can be the combination of galvanoplastic, electroless plating method, electroless plating method and galvanoplastic in the method for the surface configuration metal level of the body of inserting, specifically.When adopting galvanoplastic, not necessarily form reactive metal film described later, but need implement to carry out electroless plating after the asperitiesization, electroplate then on the surface of the body of inserting that will be relative with die cavity.

In inserting etc., the zirconia ceramics that constitutes the body of inserting be meant do not have electric conductivity, be that the volume intrinsic resistance value surpasses 1 * 10 ⁹The zirconia ceramics of Ω cm.In described insert etc., can be that the body of inserting is constituted, inserted by zirconia ceramic and forms constituting of reactive metal film between body and the metal level.For convenience, above-mentioned formation can be called the 1st constituting of inserting etc.

That inserts etc. the 1st constitutes, and the reactive metal film contains metal (reactive metal) that is selected from Ti, Zr and Be and the eutectic composition that is selected from the metal of Ni, Cu, Ag and Fe, and the thickness of reactive metal film is 1 * 10 ^-6M-5 * 10 ^-5M, preferred 3 * 10 ^-6M-4 * 10 ^-5M.Eutectic composition for example has Ti-Ni, Ti-Cu, Ti-Cu-Ag, Ti-Ni-Ag, Zr-Ni, Zr-Fe, Be-Cu, Be-Ni more specifically.By the thickness that makes the reactive metal film is 1 * 10 ^-6M-5 * 10 ^-5M, the reactive metal film that can obtain having high conductivity promptly, can make dielectric zirconia ceramics have electric conductivity, for example can form metal level by galvanoplastic.

The method that forms the reactive metal film can be a reactive metal weldering method.By adopting reactive metal weldering method, the reactive metal film can obtain high tack with the surface of the body of inserting.Metal level also can obtain high adhesive force with the body of inserting.Here, reactive metal weldering method is meant that the paste that will contain constitutes the metal material of reactive metal film for example is coated on the surface of the body of inserting by silk screen print method, in a vacuum or carry out the method for sintering in the inert gas with about 800 ℃-1000 ℃ high temperature.

Perhaps in inserting etc., the body of inserting can be for being 1 * 10 by the volume intrinsic resistance value ⁹Ω cm or following, preferred 1 * 10 ⁴The formation that Ω cm or following electric conductivity zirconia ceramics constitute.For convenience, described formation is called the 2nd constituting of inserting etc.The volume intrinsic resistance value of electric conductivity zirconia ceramics surpasses 1 * 10 ⁹Ω cm, then zirconia ceramics becomes insulator, is difficult to directly form metal level on the surface of body of inserting.The lower limit of the volume intrinsic resistance value of electric conductivity zirconia ceramics is preferably 1 * 10 ^-4Ω cm.

That inserts etc. the 2nd constitutes, and has electric conductivity in order to make zirconia ceramics, can add the electric conductivity imparting agent in zirconia ceramics.The electric conductivity imparting agent can be Fe ₂O ₃, NiO, Co ₃O ₄, Cr ₂O ₃, TiO ₂, at least a among the TiN, perhaps the electric conductivity imparting agent can be at least a in the carbide of TiC, WC, TaC etc.In the electric conductivity zirconia ceramics content of electric conductivity imparting agent be preferably 10 weight % or more than.Be lower than 10 weight %, be difficult to then realize that the volume intrinsic resistance value is 1 * 10 ⁹Ω cm or following.And if add the electric conductivity imparting agent in a large number, then the volume intrinsic resistance value of zirconia ceramics descends, promptly the insert intensity of body of the sintered body of gained is impaired.So preferred 40 weight % or following.

During the grade in an imperial examination 2 of inserting constitutes, can in the electric conductivity zirconia ceramics, contain the sintering temperature inhibitor with 3 weight % or following scope.The electric conductivity imparting agent uses Fe ₂O ₃, NiO, Co ₃O ₄, Cr ₂O ₃, TiO ₂, during TiN, the sintering temperature inhibitor can be oxides such as Ca, K, Na, Mg, Zn, Sc, when the electric conductivity imparting agent used carbide such as TiC, WC, TaC, the sintering temperature inhibitor can be Al ₂O ₃, TiO ₂If contain these sintering temperature inhibitor at 3 weight % or following scope, then can reduce sintering temperature, suppress the germination of zirconia and electric conductivity imparting agent, improve mechanical properties such as the bending strength of the body of inserting or hardness.

At the 1st constituting of inserting etc., if use reactive metal weldering method in the formation of reactive metal film, then the reactive metal film can obtain high tack with the surface of the body of inserting, and metal level can obtain high adhesive force with the body of inserting.And at the 1st constituting of inserting etc., if the reactive metal film is set, the surface of the body of then inserting has electric conductivity, for example can form metal level by galvanoplastic.Perhaps, also can on the body of inserting, form metal level, and can obtain metal level and the high adhesion force of the body of inserting by electroless plating method by the surface roughness of the regulation body surface of inserting relative with die cavity.And, constitute the body of inserting by the electric conductivity zirconia ceramics at the 2nd constituting of inserting etc., can directly form metal level on the surface of the body of inserting.And, at the most surperficial metal level of inserting etc. that is provided with, therefore can easily form protuberance or recess by various processing methods on the metal level of the body surface of inserting relative with die cavity, also can obtain high scratch resistance or case hardness.In addition, the body of inserting is adding man-hour, if cover the fine crackle that the peripheral part of the body of inserting produces with metal level, then described crackle does not contact with the molten thermoplastic resin, inserts etc. to be not easy breakage.

The microcrack that produces for the edge part of the body that prevents to insert contact with the molten thermoplastic resin and inserting of causing waited damagedly, and the edge part of the body of preferably according to circumstances will inserting uses the diamond emery wheel to polish, and makes its stress concentrated.Perhaps according to circumstances, radius 0.3mm or following curvature surface or the cutting of C face are set preferably, avoid stress concentration at the edge part of the body of inserting.

In inserting etc., the method for metal level is set, can also enumerates the method for the metal level (metal film) that placement can freely be loaded and unloaded on the body of inserting that is made of zirconia ceramics alternatively as surface at the body of inserting.The preparation method of the metal level that can freely load and unload (metal film) can be enumerated on the glass face and use photoresist, uses the master mold that is provided with jog, by the method for electrocasting manufacturing.In addition, in the time of can being positioned on the body of inserting metal level (metal film) with freely unloading, be preferably vacuum suction by inserting the body periphery, thereby be expelled to the mobile formation that is fixed on movably on the body of inserting of the molten thermoplastic resin in the die cavity when making metal level (metal film) not because of moulding, perhaps use the additional metals piece, peripheral part with the body of inserting is pushed down, but is not limited to this, gets final product so long as metal level (metal film) is installed on the body of inserting.

According to circumstances, can make the body of inserting is metal system, forms zirconia ceramic layer on the metal body of inserting.The formation method of zirconia ceramic layer can be a flame spraying.Promptly, use the flame-spraying rifle, the powder that at high temperature will contain above-mentioned zirconia composition is sprayed onto the method on the metal body of inserting, arc flame spraying, plasma flame spraying etc. are arranged, during the flame-spraying zirconia composition, fusing point is higher, and the plasma flame spraying process that therefore can produce high temperature is comparatively effective.The preferred 0.5mm-2mm of the thickness of zirconia ceramic layer, blocked up then zirconia ceramic layer is owing to strain is broken.In order to improve metal tack of inserting between body and the zirconia ceramic layer, behind metals such as flame-spraying Ni-Cr, preferred flame-spraying zirconia composition.During the surface configuration metal level of gained zirconia ceramic layer, can adopt said method.

LGP of the present invention or the LGP that constitutes surface light source apparatus of the present invention be preferably by manufacturing method of light conducting board manufacturing (moulding), according to the specification of LGP etc., also can adopt the injection moulding that adopts usually in the molding thermoplastic resin.Promptly, can be that the 1st mold component and the 2nd mold component that will constitute mold assemblies carries out locked mode, the molten thermoplastic resin is injected in die cavity by the molten resin injection part, make transparent resin cooling, curing in the die cavity then, then, from mold assemblies, take out the method for LGP with the 1st mold component and the 2nd mold component die sinking.Perhaps also can be the structure of mold assemblies being made the variable volume of die cavity, the volume (V of die cavity _C) than the volume (V of the LGP of wanting moulding _M) big, with the 1st mold component and the 2nd mold component locked mode, then to this die cavity (volume: V _C) in the injection molten thermoplastic resin, before the molten thermoplastic resin injects beginning, in the beginning, in the injection or inject finish after, the volume of die cavity is decreased to the volume (volume: V of the LGP of wanting moulding _M) method (injection compression molding method).Can also be to make the volume of die cavity reach the volume (V of the LGP of wanting moulding _M) the moment be during the molten thermoplastic resin injects or back (comprise inject finish time) is finished in injection.The structure of described mold assemblies can be enumerated the structure that forms sleeve structure by the 1st mold component and the 2nd mold component, assembles perhaps that mould possesses further in die cavity that the volume that can make die cavity changes and the structure of movable core rod.The control example that moves of core rod is as being undertaken by oil hydraulic cylinder.

The molten resin injection part for example can be side gate structure or ear shape pouring gate structure, film gate structure.The molten resin injection part is so long as get final product to the die cavity opening at pairing cavity surface place, any one side of LGP, also can be as the 1st side of incidence surface or with as relative pairing cavity surface place, the 3rd side, the 1st side of incidence surface to the die cavity opening, according to circumstances also can be in the 2nd side or the pairing cavity surface in the 4th side place to the die cavity opening.

The invention effect

In LGP of the present invention or the surface light source apparatus, the 1st surface element of LGP is provided with protuberance and/or recess, length between the 1st side and the 3rd side is that the length of the length direction of LGP is 40mm or above, 130mm or following, the thickness that accounts for minimum 8 one-tenth zone of LGP is 0.1mm or above, 0.55mm or following, therefore, even for example the further attenuate of the thickness of liquid crystal indicator also can positively be assembled into LGP in the liquid crystal indicator.And, be defined as 200 μ m or following by flatness with LGP, can positively avoid LGP to look has the generation of the problem of the average brightness value of big fluctuating, LGP, the reduction of luminance uniformity value.

In the manufacturing method of light conducting board of the present invention, after injection molten thermoplastic resin's step finishes in die cavity through t after second, after second (0 second≤t≤8.0 seconds), be 0.5F through t after perhaps injection molten thermoplastic resin's step and its follow-up pressurize step finish in die cavity by making clamp force ₀Or below, the strain that produces in the time of can reducing thermoplastic resin cooling in the die cavity or owing to shrink the strain that causes, so the strain of LGP inside minimizing, LGP can not be distorted or expand, and can form the LGP with high flatness.Method for manufacturing light guide plate of the present invention can be by realizing the software transformation of control Coinjection molding apparatus action.

The accompanying drawing summary

Fig. 1 (A) is the schematic sectional view of LGP and surface light source apparatus, Fig. 1 (B) and (C) be respectively the concept map of backlight type surface light source apparatus in the past and the concept map of preceding light formula surface light source apparatus.

Fig. 2 (A) be along with the meet at right angles schematic end view drawing of mold assemblies of direction of the flow direction that is expelled to the molten thermoplastic resin in the die cavity, Fig. 2 (B) is the schematic end view drawing along the mold assemblies of the flow direction that is expelled to the molten thermoplastic resin in the die cavity.

Fig. 3 (A) is the schematic oblique view of inserting, and Fig. 3 (B) is the schematic oblique view of the LGP among the embodiment 1.

Fig. 4 (A)-(E) is the schematic sectional view of the variation of LGP.

Fig. 5 (A) and (B) be respectively Fig. 4 (B) and (C) shown in the schematic oblique view of LGP variation.

Fig. 6 (A) and (B) be respectively Fig. 4 (D) and (E) shown in the schematic oblique view of variation of LGP.

Fig. 7 (A)-(D) is the schematic sectional view of another variation of LGP.

Fig. 8 (A) and (B) be respectively Fig. 7 (A) and (B) shown in the schematic oblique view of variation of LGP.

Fig. 9 (A), (B) and (C) be respectively schematic sectional view, the schematic partial cross section figure of the variation of inserting and the schematic sectional view of the body distortion example of inserting of the mode-lock status of expression mold assemblies variation.

Figure 10 (A) and (B) be respectively the schematic sectional view and the schematic amplification sectional view of variation of inserting of the die opening state of expression mold assemblies variation shown in Figure 9.

Figure 11 is that expression uses same aromatic polycarbonate resin to carry out various experiments, the curve map of the relation of the length of the thickness of gained LGP and the length direction of LGP with embodiment 3.

Figure 12 is the concept map of Coinjection molding apparatus that is fit to the enforcement of embodiment 1-embodiment 5.

Symbol description

10,110... the 1st mold component (dynamic model portion), the installing component 11... insert, 12,15... attachment, 13,113... the 2nd mold component (cover half portion), 14... the 2nd installing component of inserting, 16,17,116,117... bolt, 18,118... die cavity, 19... molten resin injection part, 111... cover plate, 114... second cover plate, 20,120... insert, 20A, 120A... the cavity surface of inserting, 21, the body 121... insert, 22,122... metal level, 23, the 123... groove, 30,130... the 2nd inserts, 40,40A, 40B, 40C, 40D, 40E, 140A, 140B, 140C, 140D... LGP, 41,141... the 1st, 42,42A, 42B, 42C, 42D, 42E, 142A, 142B, 142C, the 142D... jog, protuberance or recess, 43, the 2nd of 143..., 44,144... the 1st side, 45,145... the 2nd side, 46,146... the 3rd side, 47,147... the 4th side, 50... light source, 51... reflection part, 52... diffusion disk, 53... phase-contrast film, 54... reflection part, 55... prismatic lens, 60... liquid crystal indicator, 200... injection barrel, 201... screw rod, 210... fixation clip, but 211... dynamic pressure plate, 212... pull bar, 213... locked mode oil hydraulic cylinder, 214... hydraulic piston

The best mode that carries out an invention

Below, with reference to accompanying drawing, the present invention is described according to embodiment.

Embodiment 1

Embodiment 1 relates to LGP of the present invention and surface light source apparatus.The LGP 40 of embodiment 1 and the schematic sectional view of surface light source apparatus are shown in Fig. 1 (A).The schematic oblique view of the LGP 40 of embodiment 1 is shown in Fig. 3 (B).

The LGP 40 of the embodiment 1 that nominal is 2.3 inches is made of transparent thermoplastic resin, has the 1st 41,2nd 43,1st side 44,2nd side 45 relative with the 1st 41,3rd side 46 relative with the 1st side 44 and 4th side 47 relative with the 2nd side 45.The 1st 41 surface element is provided with jog 42.This LGP 40 has the roughly certain thin sheet form of thickness on the whole, by the 1st side 44 incident lights of LGP 40, penetrates light by the 1st 41 and the 2nd 43.

Among the embodiment 1, the 1st 41 surface element is provided with the jog 42 of high 10 μ m, spacing 50 μ m.The jog 42 of being located at the 1st 41 surface elements has along the continuous linearity concaveconvex shape that becomes the direction (direction specifically roughly meets at right angles) of predetermined angular to extend to the incident direction (representing with hollow arrow sometimes in the accompanying drawing) of LGP 40 with light.That is, with being light when the incident direction of LGP 40 and the imaginary plane vertical with the 1st 41 cut off LGP 40, the cross sectional shape of jog 42 is a zigzag fashion (cross sectional shape: triangle).In other words, in the LGP 40 of embodiment 1, there is not the par in the 1st 41 of LGP 40 in the part between jog 42 and jog 42.

In the backlight type surface light source apparatus in the liquid crystal indicator, same with the schematic sectional view of expression among Fig. 1 (B), the 2nd 43 of LGP 40 with liquid crystal indicator 60 relative configurations.By light source 50 penetrate, by the light of the 1st side 44 incidents of LGP 40 by the 1st 41 reflection, be divided into by the 2nd 43 light that penetrates and see through the 1st 41 light.See through the 1st 41 light and be configured in reflection part 51 reflections with the 1st 41 relative position, the incident LGP 40 once more, penetrate by the 2nd 43.Be directed in the liquid crystal indicator 60 with the 2nd 43 relative configurations by the 2nd 43 light that penetrates.Configuration a slice diffusion disk 52 and prismatic lens 55 make the even diffusion of light between the 2nd 43 of liquid crystal indicator 60 and the LGP 40.In addition, the protuberance (not shown) that be located at prismatic lens 55 surfaces, has a continuous convex is along extending to the direction of the incident direction almost parallel of LGP 40 with light.

In the preceding light formula surface light source apparatus in the liquid crystal indicator, same with the concept map shown in Fig. 1 (C), the 2nd 43 of LGP 40 with liquid crystal indicator 60 relative configurations.By light source 50 penetrate, by the light of LGP 40 the 1st side 44 incidents by the 1st 41 reflection, penetrate by the 2nd 43.And by being disposed at the liquid crystal indicator 60 with the 2nd 43 relative position, parts 54 reflections that are reflected are once more by liquid crystal indicator 60.Further by the antireflection layer (not shown) of phase-contrast film 53 and formation on the 2nd 43 of LGP 40, the 1st 41 ejaculation by LGP 40 is identified as image this light.

Among embodiment 1 or the embodiment 2-embodiment 5 described later, shown in Fig. 2 (A) and schematic diagram (B), use the mold assemblies that possesses die cavity 18 and molten resin injection part 19 (having the side gate structure) to make LGP.Wherein said molten resin injection part 19 is used for the molten thermoplastic resin is expelled in the die cavity by the 3rd side 46 pairing cavity surface of LGP 40.More particularly, this mold assemblies possesses the 1st mold component 10 (dynamic model portion) and the 2nd mold component 13 (cover half portion), by with the 1st mold component 10 and the 2nd mold component 13 locked modes, forms die cavity 18.Fig. 2 (B) is the signal end view drawing along the flow direction that is expelled to the molten thermoplastic resin in the die cavity 18, among Fig. 2 (B), left hand one side of die cavity 18 is equivalent to form the part of LGP 40 the 3rd side 46, and the right hand one side of die cavity 18 is equivalent to form the part of LGP 40 the 1st side 44.Fig. 2 (A) be along with the meet at right angles signal end view drawing of direction of the flow direction that is expelled to the molten thermoplastic resin in the die cavity 18.Among Fig. 2 (A), left hand one side of die cavity 18 is equivalent to form the part of LGP 40 the 4th side 47, and the right hand one side of die cavity 18 is equivalent to form the part of LGP 40 the 2nd side 45.

Shown in the concept map of Figure 12, but Coinjection molding apparatus possesses injection barrel 200 that inside has the screw rod 201 that is used to supply with the molten thermoplastic resin, fixation clip 210 dynamic pressure plates 211, pull bar 212, locked mode with oil hydraulic cylinder 213 and hydraulic piston 214.But dynamic pressure plate 211 can be by the action of locked mode with the hydraulic piston 214 in the oil hydraulic cylinder 213, parallel moving on pull bar 212.The 2nd mold component (cover half portion) 13 is installed on the fixation clip 210, the 1st mold component (dynamic model portion) but 10 be installed on the dynamic pressure plate 211.Movable platen 211 moves to arrow " A " direction of Figure 12, and the 1st mold component (dynamic model portion) 10 engages with the 2nd mold component (cover half portion) 13, and the 2nd mold component (cover half portion) the 13 and the 1st mold component (dynamic model portion) 10 is by clamp force F ₀Locked mode forms die cavity 18.Clamp force F ₀Control with oil hydraulic cylinder 213 by locked mode.In addition, for example in manufacturing method of light conducting board of the present invention, by the control of locked mode with oil hydraulic cylinder 213, clamp force is by F ₀Be reduced to F ₁And the 1st mold component (dynamic model portion) 10 arrows to Figure 12 " B " direction moves, the relieving that engages of the 1st mold component (dynamic model portion) 10 and the 2nd mold component (cover half portion) 13, the 1st mold component (dynamic model portion) the 10 and the 2nd mold component (cover half portion) 13 die sinkings.

In the mold assemblies of embodiment 1, the inside of mold assemblies is provided with and comprises the body 21 of inserting that is made of zirconia ceramics, and be configured in the surface of the insert body 21 relative with die cavity 18 in order on the 1st 41 of LGP 40, to form jog 42 and be provided with jog metal level 22 insert 20.Insert 20 schematic oblique view shown in Fig. 3 (A).And, 20 have the 2nd of same structure 30 inside that are arranged on mold assemblies of inserting with inserting.Specifically, the 2nd insert and 30 comprise the metal level 32 (but not being provided with jog) that the body 31 of inserting that is made of zirconia ceramics that is used for the 2nd 43 of formed light conductive plate 40 forms on the surface of the insert body 31 relative with die cavity 18 with being used to form the 2nd 43 of LGP 40.Insert and the 20 and the 2nd insert and 30 constitute the part be arranged on the die cavity 18 on the mold assemblies.Inserting 20 is installed on the installing component 11 of inserting, and the installing component 11 of inserting is fixed on the 1st mold component 10 by bolt 16.The 2nd inserts 30 is installed in the 2nd and inserts on the installing component 14, and the 2nd installing component 14 of inserting is fixed on the 2nd mold component 13 by bolt 17.

Insert and 20 can enumerate at the concrete installation method on the installing component 11 of inserting and to form groove 23 on 20 two the relative sides of inserting, on the part of the insert installing component 11 relative, also form groove, in these grooves, dispose the method for the attachment 12 that flexible materials such as copper, brass, rubber constitute with this groove 23.The 2nd inserts 30 also can enumerate in the 2nd insert two relative sides of 30 and form grooves at the 2nd insert concrete installation method on the installing component 14, inserting the relative with this groove the 2nd also forms groove on the part of installing component 14, disposes the method for the attachment 15 that flexible materials such as copper, brass, rubber constitute in these grooves.By adopting above-mentioned installation method, the 20 or the 2nd insert 30 the marginal portion that can positively prevent to insert is damaged.

20 insert body 21 and the metal levels 22 that comprise thickness 5.0mm of inserting, the body 21 of inserting is used for the 1st 41 of formed light conductive plate 40, by containing yittrium oxide (Y ₂O ₃) as partially stabilizedization zirconia ceramics (partially stabilizedization zirconia, the ZrO of partially stabilizedization agent ₂) constitute, metal level 22 is used to form the jog 42 of LGP 40, forms on the surface of the body 21 of inserting relative with die cavity 18.Has ZrO ₂-Y ₂O ₃The ratio of contained partially stabilizedization agent is 3mol% in the partially stabilizedization zirconia ceramics of forming.The thermal conductivity of partially stabilizedization zirconia ceramics is about 3.8J/ (msK).The depth d of jog that is arranged at sawtooth (prism) shape of metal level 22 is 10 μ m, and spacing P is 50 μ m, has zigzag fashion (cross sectional shape: triangle).Be arranged on the concaveconvex shape that jog on the metal level 22 has the continuous linearity that extends along the direction (being specially the direction that roughly meets at right angles) that becomes predetermined angular with the incident direction of light on LGP, and have the shape with jog 42 complementations of formation on the 1st 41 of LGP 40.The part that forms this jog is equivalent to 20 the cavity surface 20A that inserts.Be arranged at the surface roughness R on the surface (the jog general surface of saying so more specifically) of the jog of metal level 22 _ZBe 0.2 μ m or following (mean value R specifically, _Z=0.01 μ m).

Metal level 22 is the two-layer formation of Ni compound layer (the Ni-P layer that forms by electroless plating) of 100 μ m by the Ni layer of the thickness 5 μ m that form by galvanoplastic and the thickness that forms thereon.That is, the thickness t of metal level 22 is 105 μ m.In the accompanying drawing, metal level 22 is represented with one deck.The surface roughness R on insert body 21 surfaces relative with die cavity 18 _ZBe 0.5 μ m.Insert between body 21 and the metal level 22 and to form the reactive metal film (not shown) that constitutes by the Ti-Cu-Ag eutectic composition of thickness 10 μ m.This reactive metal film forms by reactive metal weldering method.

Specifically, with zirconia (ZrO ₂) powder and Y ₂O ₃The mixture extrusion forming of powder, sintering prepares the body 21 of inserting then.Then, use the surface of the relative body 21 of inserting of skive pair and die cavity 18 to grind and polish, make the surface roughness R on described surface _ZBe 0.5 μ m.Then, on whole of the body 21 of inserting, form the reactive metal film by reactive metal weldering method.Specifically, the paste that will contain the Ti-Cu-Ag eutectic composition is coated on whole of the body 21 of inserting, carries out sintering with about 800 ℃ high temperature in a vacuum, forms the reactive metal film.Then, on the reactive metal film, form nickel dam, form the Ni-P layer by electroless plating method thereon again by galvanoplastic.Use the diamond bit of the jog that has formed sawtooth (prism) shape then, on the Ni-P layer, carry out machining, on metal level 22, form jog.

The 2nd inserts 30 except that not forming the jog on the metal level 32, the 20 same method preparations of can adopting and insert.In addition, the surface roughness R of metal level 32 _ZBe 0.01 μ m.

On the other hand, make the 1st mold component (dynamic model portion) the 10 and the 2nd mold component (cover half portion) 13, carry out machining, the installation portion of inserting is set by carbon steel S55C.According to the method for explanation before, installing on the installation portion of inserting inserts the 20 and the 2nd inserts 30.

With the 1st mold component (dynamic model portion) the 10 and the 2nd mold component (cover half portion) 13 assemblings of above-mentioned preparation, obtain the mold assemblies of embodiment 1.The mold assemblies of finishing is installed on the shaped device, use mold temperature regulation and control machine that mold assemblies is heated to 130 ℃ then after, even quenching to 40 ℃, the 20 or the 2nd 30 equivalent damages that also do not break of inserting of

inserting.Metal level

22,32 is not damage also.

The TR100EH2 injection (mo(u)lding) machine that shaped device uses the ゾデイ of Co., Ltd. Star Network プラスチ Star Network to make.Transparent resin uses the viscosity-average molecular weight as shown in table 1 and the aromatic polycarbonate resin of Q value, carries out injection moulding.Conditions of molding such as resin temperature, mold temperature, resin injection speed are as shown in table 1.With the 1st mold component 10 and the 2nd mold component 13 locked modes, form Fig. 2 (A) and (B) shown in state, the transparent molten thermoplastic resin that will carry out weighing and fusion then in injecting barrel 200 is expelled in the die cavity 18 via molten resin injection part 19 (having the side gate structure).The melt polycarbonate resin of ormal weight (amount of complete filling die cavity 18) is expelled in the die cavity 18 via molten resin injection part 19, make polycarbonate resin cooling, curing in the die cavity 18 then, carry out the die sinking of mold assemblies after 30 seconds, from mold assemblies, take out LGP 40.In addition, in embodiment 1-embodiment 4 or the comparative example 1-comparative example 3 be basis injection moulding manufactured LGP in the past.That is, during die sinking, clamp force continues the value of remaining F from the 1st mold component 10 and the 2nd mold component 13 locked modes ₀Here,

F ₀＝4.9×10 ⁵(N)

(=50 tons of f).

Dwell pressure and time are as follows.

Dwell pressure=70 * 10 ⁶Pa

Dwell time=1.5 second

Length between gained LGP 40 the 1st side 44 and the 3rd side 46 is the length L of the length direction of LGP 40 _L, with the meet at right angles length L of direction of length direction _S, average thickness, thickness difference, flatness, (x, y) value, average brightness are as shown in table 1.

The BM5A that brightness measuring is to use トプコ Application company to make carries out brightness measuring to 9 places in the measurement range of diameter 10mm.The measurement range of diameter 10mm is: near part 3 places of the pairing LGP 40 of molten resin injection part, LGP middle body 3 places, near 3 places, LGP end are totally 9 places.

Re-use surface roughness measuring shape meter Off オ one system リサ one Off, measure the surface roughness R on jog 42 surfaces (all surfaces of jog of more specifically saying so) of the surface element that is arranged at the 1st 41 _Z, jog 42 (all surfaces of jog of more specifically saying so) is R _Z0.3 μ m or following.Specifically, be positioned near the 1st side 44 R, that be arranged at the jog 42 of the 1st 41 surface elements _ZBe about 0.01 μ m, be positioned near the 3rd side 45 R, that be arranged at the jog 42 of the 1st 41 surface elements _ZBe about 0.02 μ m.

Although the thickness of die cavity is 0.27mm, and is extremely thin, the length L of the length direction of LGP 40 _LBe 52mm, owing to be to use have the regulation rerum natura aromatic polycarbonate resin of (viscosity-average molecular weight and Q value), and condition of molding (resin temperature, mold temperature, the resin injection speed) compacted under of stipulating, therefore, die cavity 18 can be formed the LGP 40 with required form by the thermoplastic resin complete filling.In addition, the average thickness of LGP, thickness difference, flatness, (x, y) value, average brightness are all within the required range.

Embodiment 2

Embodiment 2 is distortion of embodiment 1.Among the embodiment 2, (size difference), shaped device such as use the mold assemblies identical, insert with embodiment 1.Embodiment 2 is following 4 points with the difference of embodiment 1:

(1) uses the aromatic polycarbonate resin that aromatic polycarbonate resin low, Q value high of viscosity-average molecular weight than embodiment 1

(2) resin temperature improves 10 ℃, is 340 ℃

(3) the slow 300mm of resin injection speed second ^-1, be 1200mm second ^-1And injection rate difference

(4) nominal dimension of LGP 40 is 2.6 inches.

The length L of the length direction of gained LGP 40 _L, with the meet at right angles length L of direction of length direction _S, average thickness, thickness difference, flatness, (x, y) value, average brightness are as shown in table 1.

Among the embodiment 2, extremely thin although the thickness of die cavity is 0.27mm, the length L of the length direction of LGP 40 _LBe 58mm, longer, owing to be to use have the regulation rerum natura aromatic polycarbonate resin of (viscosity-average molecular weight and Q value), and condition of molding (resin temperature, mold temperature, the resin injection speed) compacted under of stipulating, therefore, die cavity 18 can be formed the LGP 40 with required form by the thermoplastic resin complete filling.In addition, the average thickness of LGP, thickness difference, flatness, (x, y) value, average brightness are all within the required range.

Embodiment 3

Embodiment 3 also is the distortion of embodiment 1.Among the embodiment 3, use with embodiment 1 to have the mold assemblies of same structure, (size is different), shaped device such as insert.Embodiment 3 is following 5 points with the difference of embodiment 1:

(2) resin temperature improves 10 ℃, is 340 ℃

(3) the slow 1200mm of resin injection speed second ^-1, be 300mm second ^-1And injection rate difference

(4) nominal dimension of LGP 40 is 3.0 inches

(5) thickness of die cavity 18 is 0.37mm.

Among the embodiment 3, extremely thin although the thickness of die cavity is 0.37mm, the length L of the length direction of LGP 40 _LBe 64mm, further increase, owing to be to use have the regulation rerum natura aromatic polycarbonate resin of (viscosity-average molecular weight and Q value), and condition of molding (resin temperature, mold temperature, the resin injection speed) compacted under of stipulating, therefore, die cavity 18 can be formed the LGP 40 with required form by the thermoplastic resin complete filling.In addition, the average thickness of LGP, thickness difference, flatness, (x, y) value, average brightness are all within the required range.

Embodiment 4

Embodiment 4 also is the distortion of embodiment 1.Among the embodiment 4, use the mold assemblies, the shaped device that have same structure with embodiment 1.Embodiment 4 is following 4 points with the difference of embodiment 1:

(1) inserts and the 2nd insert by the steel manufacturing

(2) resin temperature improves 20 ℃, is 350 ℃

(3) the slow 800mm of resin injection speed second ^-1, be 700mm second ^-1And injection rate difference

(4) nominal dimension of LGP 40 is 2.0 inches.

Among the embodiment 4, although the thickness of die cavity is 0.27mm, extremely thin, and insert and the 2nd insert by the steel manufacturing, owing to be to use have the regulation rerum natura aromatic polycarbonate resin of (viscosity-average molecular weight and Q value), and at condition of molding (resin temperature, mold temperature, the resin injection speed) compacted under of stipulating, therefore, die cavity 18 can be formed the LGP 40 with required form by the thermoplastic resin complete filling.In addition, the average thickness of LGP, thickness difference, flatness, (x, y) value, average brightness are all within the required range.

In order to compare, implemented the comparative example 1-comparative example 3 shown in the table 2.

Here, in the comparative example 1, use the mold assemblies, the shaped device that have same structure with embodiment 1.Comparative example 1 is following 3 points with the difference of embodiment 1:

(1) inserts and the 2nd insert by the steel manufacturing

(2) use viscosity-average molecular weight than the aromatic polycarbonate resin height of embodiment 1, the aromatic polycarbonate resin that the Q value is low

(3) resin temperature improves 20 ℃, is 350 ℃.

In the comparative example 2, use the mold assemblies, the shaped device that have same structure with embodiment 1.Comparative example 2 is following 4 points with the difference of embodiment 1:

(1) inserts and the 2nd insert by the steel manufacturing

(3) resin temperature improves 40 ℃, is 370 ℃

(4) the slow 300mm of resin injection speed second ^-1, be 1200mm second ^-1And injection rate difference.

In the comparative example 3, use the mold assemblies, the shaped device that have same structure with embodiment 1.Comparative example 3 is following 3 points with the difference of embodiment 1:

(1) use viscosity-average molecular weight than the aromatic polycarbonate resin height of embodiment 1, the aromatic polycarbonate resin that the Q value is low

(2) resin temperature improves 20 ℃, is 350 ℃

(3) the slow 800mm of resin injection speed second ^-1, be 700mm second ^-1And injection rate difference.

The length L of the length direction of the LGP 40 that obtains by comparative example 1-comparative example 3 _L, with the meet at right angles length L of direction of length direction _S, average thickness, thickness difference, flatness, (x, y) value, average brightness are as shown in table 2.

In the comparative example 1, the Q value of thermoplastic resin low (being molten thermoplastic resin's viscosity height), by inserting and the 2nd combination of inserting of steel system, the molten thermoplastic resin can't be filled in the die cavity.

And in the comparative example 2, though thermoplastic resin Q value low (that is, though molten thermoplastic resin's viscosity height), resin temperature is 370 ℃, therefore can be filled in the die cavity with the molten thermoplastic resin.But, the value difference of the flatness of gained LGP, and average brightness is also low.

In the comparative example 3, though the Q value of thermoplastic resin low (that is, though molten thermoplastic resin's viscosity height) is inserted and the 2nd is inserted similarly to Example 1, make by partially stabilizedization zirconia ceramics, even so resin temperature also the molten thermoplastic resin can be filled in the die cavity for 350 ℃.But the flatness value difference of gained LGP.

[table 1]

	Unit	Embodiment 1	Embodiment 2	Embodiment 3	Embodiment 4
	Unit	Embodiment 1	Embodiment 2	Embodiment 3	Embodiment 4	The LGP nominal dimension	Inch	2.3	2.6	3.0	2.0
Die cavity thickness	mm	0.27	0.27	0.37	0.27	The LGP nominal dimension	Inch	2.3	2.6	3.0	2.0
Die cavity thickness	mm	0.27	0.27	0.37	0.27	Insert and the 2nd insert		Zirconia system			Steel system
Thermoplastic resin		Merlon				Insert and the 2nd insert		Zirconia system			Steel system
Thermoplastic resin		Merlon				Viscosity-average molecular weight	×10 ⁴	1.4	1.35	1.2	1.4
The Q value	×10 ^-2cm ³Second ^-1	65	100	120	65	Viscosity-average molecular weight	×10 ⁴	1.4	1.35	1.2	1.4
The Q value	×10 ^-2cm ³Second ^-1	65	100	120	65	Condition of molding
Resin temperature	℃	330	340	340	350	Condition of molding
Resin temperature	℃	330	340	340	350	Mold temperature	℃		120	With a left side	With a left side	With a left side
Resin injection speed	Mm second ^-1	1500	1200	300	700	Mold temperature	℃		120	With a left side	With a left side	With a left side
Resin injection speed	Mm second ^-1	1500	1200	300	700	Injection rate	Cc second ^-1	923	739	185	431
LGP						Injection rate	Cc second ^-1	923	739	185	431
LGP						Length L _L	mm	52	58	64	44
Length L _S	mm	32	42	52	30	Length L _L	mm	52	58	64	44
Length L _S	mm	32	42	52	30	Average thickness	mm	0.298	0.301	0.403	0.308
Thickness difference	μm	29	38	67	48	Average thickness	mm	0.298	0.301	0.403	0.308
Thickness difference	μm	29	38	67	48	Flatness	μm	104	85	115	134
(x, y) value		(0.345，0.295)	(0.352，0.304)	(0.358，0.312)	(0.368，0.325)	Flatness	μm	104	85	115	134
(x, y) value		(0.345，0.295)	(0.352，0.304)	(0.358，0.312)	(0.368，0.325)	Brightness is average	cd/m ²	4528	4271	3977	4368

[table 2]

	Unit	Comparative example 1	Comparative example 2	Comparative example 3
	Unit	Comparative example 1	Comparative example 2	Comparative example 3	The LGP nominal dimension	Inch	2.3	With a left side	With a left side
Die cavity thickness	mm	0.27	With a left side	With a left side	The LGP nominal dimension	Inch	2.3	With a left side	With a left side
Die cavity thickness	mm	0.27	With a left side	With a left side	Insert and the 2nd insert		Steel system	With a left side	Zirconia system
Thermoplastic resin		Merlon			Insert and the 2nd insert		Steel system	With a left side	Zirconia system
Thermoplastic resin		Merlon			Viscosity-average molecular weight	×10 ⁴	1.6	With a left side	With a left side
The Q value	×10 ^-2cm ³Second ^-1	36	With a left side	With a left side	Viscosity-average molecular weight	×10 ⁴	1.6	With a left side	With a left side
The Q value	×10 ^-2cm ³Second ^-1	36	With a left side	With a left side	Condition of molding
Resin temperature	℃	350	370	350	Condition of molding
Resin temperature	℃	350	370	350	Mold temperature	℃		120	With a left side	With a left side
Resin injection speed	Mm second ^-1	1500	1200	700	Mold temperature	℃		120	With a left side	With a left side
Resin injection speed	Mm second ^-1	1500	1200	700	Injection rate	Cc second ^-1	923	739	431
LGP					Injection rate	Cc second ^-1	923	739	431
LGP					Length L _L	mm	52	With a left side	With a left side
Length L _S	mm	32	With a left side	With a left side	Length L _L	mm	52	With a left side	With a left side
Length L _S	mm	32	With a left side	With a left side	Average thickness	mm	0.425	0.325	0.301
Thickness difference	μm	125	85	50	Average thickness	mm	0.425	0.325	0.301
Thickness difference	μm	125	85	50	Flatness	μm	520	230	210
(x, y) value		Do not fill	(0.395，0.359)	(0.383，0.342)	Flatness	μm	520	230	210
(x, y) value		Do not fill	(0.395，0.359)	(0.383，0.342)	Brightness is average	cd/m ²	Do not fill	2750	4432

Embodiment 5

Embodiment 5 relates to manufacturing method of light conducting board of the present invention.Among the embodiment 5, use the injection (mo(u)lding) machine identical with embodiment 1.Transparent resin uses the aromatic polycarbonate resin of viscosity-average molecular weight shown in the table 3 and Q value, carries out injection moulding.The resin temperature of embodiment 5, mold temperature, resin injection speed, clamp force F ₀, clamp force F ₁, time t conditions of molding such as value as shown in table 3.And the length between gained LGP 40 the 1st side 44 and the 3rd side 46 is the length L of the length direction of LGP 40 _L, with the meet at right angles length L of direction of length direction _S, average thickness, thickness difference, flatness, (x, y) value, average brightness are as shown in table 3.

Among the embodiment 5, the 2nd mold component (cover half portion) the 13 and the 1st mold component (dynamic model portion) 10 is by clamp force F ₀Locked mode, form Fig. 2 (A) and (B) shown in state, then will weighing in injection barrel 200, the molten thermoplastic resin of plasticizing, fusion is expelled in the die cavity 18 via notes road 215 and molten resin injection part 19 (having the side gate structure).After the step that the molten thermoplastic resin is expelled in the die cavity 18 via molten resin injection part 19, the molten thermoplastic resin injects in die cavity 18 of ormal weight (amount of complete filling die cavity 18) is finished through t after second, perhaps after step that the molten thermoplastic resin injects in die cavity 18 and its follow-up pressurize step are finished through t after second, making clamp force is 0.5F ₀Or below, the thermoplastic resin cooling in the die cavity 18, curing then with the 2nd mold component (cover half portion) the 13 and the 1st mold component (dynamic model portion) 10 die sinkings, are taken out LGP.

[table 3]

	Unit	Embodiment 5-1	Embodiment 5-2	Embodiment 5-3	Embodiment 5-4
	Unit	Embodiment 5-1	Embodiment 5-2	Embodiment 5-3	Embodiment 5-4	The LGP nominal dimension	Inch	2.3	2.6	3.0	2.0
Die cavity thickness	mm	0.27	0.27	0.37	0.27	The LGP nominal dimension	Inch	2.3	2.6	3.0	2.0
Die cavity thickness	mm	0.27	0.27	0.37	0.27	Insert and the 2nd insert		Zirconia system			Steel system
Thermoplastic resin		Merlon				Insert and the 2nd insert		Zirconia system			Steel system
Thermoplastic resin		Merlon				Viscosity-average molecular weight	×10 ⁴	1.4	1.35	1.2	1.4
The Q value	×10 ^-2cm ³Second ^-1	65	100	120	65	Viscosity-average molecular weight	×10 ⁴	1.4	1.35	1.2	1.4
The Q value	×10 ^-2cm ³Second ^-1	65	100	120	65	Condition of molding
Resin temperature	℃	330	340	340	350	Condition of molding
Resin temperature	℃	330	340	340	350	Mold temperature	℃	120	With a left side	With a left side	With a left side
Resin injection speed	Mm second ^-1	1500	1200	300	700	Mold temperature	℃	120	With a left side	With a left side	With a left side
Resin injection speed	Mm second ^-1	1500	1200	300	700	Injection rate	Cc second ^-1	923	739	185	431
Dwell pressure	×10 ⁶Pa	70	With a left side	With a left side	With a left side	Injection rate	Cc second ^-1	923	739	185	431
Dwell pressure	×10 ⁶Pa	70	With a left side	With a left side	With a left side	Dwell time (t)	Second	15	With a left side	With a left side	With a left side
Clamp force F ₀	×10 ⁵N (ton f)	4.9(50)	With a left side	With a left side	With a left side	Dwell time (t)	Second	15	With a left side	With a left side	With a left side
Clamp force F ₀	×10 ⁵N (ton f)	4.9(50)	With a left side	With a left side	With a left side	Clamp force F ₁	×10 ⁵N (ton f)	0	2.0(20)	0.98(10)	0
F ₁/F ₀		0	0.4	0.2	0	Clamp force F ₁	×10 ⁵N (ton f)	0	2.0(20)	0.98(10)	0
F ₁/F ₀		0	0.4	0.2	0	Time t	Second	0.5	2	4	0
LGP						Time t	Second	0.5	2	4	0
LGP						Length L _L	mm	52	58	64	44
Length L _S	mm	32	42	52	30	Length L _L	mm	52	58	64	44
Length L _S	mm	32	42	52	30	Average thickness	mm	0.295	0.298	0.398	0.303
Thickness difference	μm	27	35	63	44	Average thickness	mm	0.295	0.298	0.398	0.303
Thickness difference	μm	27	35	63	44	Flatness	μm	40	25	63	68
(x, y) value		(0.343，0.293)	(0.352，0.303)	(0.357，0.312)	(0.368，0.323)	Flatness	μm	40	25	63	68
(x, y) value		(0.343，0.293)	(0.352，0.303)	(0.357，0.312)	(0.368，0.323)	Brightness is average	cd/m ²	4532	4302	4005	4379

As shown in Table 3, by adopting the manufacturing method of light conducting board of embodiment 5, the value of the flatness of LGP can obtain more excellent value.

Abovely the present invention has been described, but the present invention is not limited to this according to preferred embodiment.The structure of the mold assemblies among the embodiment, employed transparent thermoplastic resin, injection moulding condition, insert or the 2nd formation of inserting, structure, the formation of LGP, structure all are for example, can suitably change.

Use aromatic polycarbonate resin to carry out various experiments, the result as shown in figure 11.Among Figure 11, " thickness " value of transverse axis (unit: mm) be meant the thickness of LGP, " length of flow " value of the longitudinal axis (unit: mm) be meant that the length between the 1st side and the 3rd side is the length of the length direction of LGP.The following explanation of implication of " high-energy-rate forming machine (heat insulation) ", " high-energy-rate forming machine (steel) ", " general make-up machine (heat insulation) ", " general make-up machine (steel) ", " high-temperature molding ", " general temperature moulding ", " material ", " general material ".

" high-energy-rate forming machine (heat insulation) "

... use with embodiment 1 in same the inserting of explanation, with resin injection speed 2000mm second ^-1Moulding.

" high-energy-rate forming machine (steel) "

... use by inserting that steel are made, with resin injection speed 2000mm second ^-1Moulding.

" general make-up machine (heat insulation) "

... use with embodiment 1 in same the inserting of explanation, with resin injection speed 100mm second ^-1Moulding.

" general make-up machine (steel) "

... use by inserting that steel are made, with resin injection speed 100mm second ^-1Moulding.

" high-temperature molding "

... at 350 ℃ of resin temperatures, 120 ℃ of compacted unders of mold temperature.

" general temperature moulding "

... at 290 ℃ of resin temperatures, 80 ℃ of compacted unders of mold temperature.

" material "

... viscosity-average molecular weight is 1.2 * 10 ⁴, the Q value is 1.20 aromatic polycarbonate resin.

" general material "

... viscosity-average molecular weight is 1.6 * 10 ⁴, the Q value is 0.36 aromatic polycarbonate resin.

As shown in Figure 11, by using by inserting that zirconia ceramics is made, can form the longer LGP of length of length direction, the thermoplastic resin that has high Q value by use, can form the longer LGP of length of length direction, even carry out high-temperature molding, also can the longer LGP of moulding length direction.

Alternatively, insert and 20 also can adopt the method for following explanation to make.The 2nd inserts 30 also can be according to making with quadrat method.

At first, with the extrusion forming of partially stabilizedization zirconia, sintering then, body 21 obtains inserting.Then, use alumina particles to carry out blasting treatment, make the surface roughness R on described surface on body 21 surfaces of inserting relative with die cavity 18 _ZBe 2 μ m.Then,, form the Ni-P layer of thickness 2 μ m on the above-mentioned surface of the body 21 of inserting, form the Ni layer of thickness 5 μ m then by galvanoplastic thereon, form the Ni-P layer of thickness 100 μ m again by electroless plating method thereon by electroless plating method.Then, use the diamond bit of the jog that is formed with sawtooth (prism) shape that the Ni-P layer is implemented machining, on metal level 22, form jog.

Perhaps, the body 21 of inserting also can be made of partially stabilizedization electric conductivity zirconia ceramics.Surface at the insert body 21 relative with die cavity forms metal level 22.That is, specifically, the body 21 of inserting is by partially stabilizedization zirconia (ZrO ₂-Y ₂O ₃) the pottery formation, contain 8 weight %Fe ₂O ₃As the electric conductivity imparting agent.In addition, the partially stabilizedization agent Y that contains in the partially stabilizedization zirconia ceramics ₂O ₃Ratio be 3mol%.The thermal conductivity of described electric conductivity zirconia ceramics is about 3.8J/ (msK), and the volume intrinsic resistance value is 1 * 10 ⁸Ω cm.Metal level 22 is made of chromium (Cr).By galvanoplastic, go up for whole of the body 21 of inserting and form metal level 22.

Fig. 4 (A)-(E), Fig. 5 (A)-(B), Fig. 6 (A)-(B), Fig. 7 (A)-(D), Fig. 8 (A)-(B) have provided the various variation of LGP.

LGP 40A-LGP 40E shown in the schematic sectional view of Fig. 4 (A)-(E) and Fig. 7 (A)-(D), LGP 140A-LGP 140D integral body has the truncate quadrangular pyramid shape of wedge-like, two relative sides of truncate quadrangular pyramid are equivalent to the 1st 41 of LGP, 141 and the 2nd 43,143, the bottom surface of truncate quadrangular pyramid is equivalent to the 1st side 44 of LGP, 144 (heavy wall ends), the end face of truncate quadrangular pyramid is equivalent to the 3rd side 46 of LGP, 146, two relative sides of all the other of truncate quadrangular pyramid are equivalent to the 2nd side 45 of LGP, the 145 and the 4th side 47,147.Light is penetrated by the 1st 41,141 and/or the 2nd 43,143 by the 1st side 44,144 incidents of LGP.The thickness of the 1st side (incidence surface) 44,144 of bottom surface that is equivalent to truncate quadrangular pyramid is for example for 0.5mm, and the thickness of the 3rd side 46,146 that is equivalent to the end face of truncate quadrangular pyramid for example is 0.2mm.In addition, the width of LGP for example is 42mm, and length for example is 58mm.Here, the width of LGP is meant that the length of LGP is meant the length of the LGP of the left and right directions that is parallel to Fig. 4 and Fig. 7 paper perpendicular to the length of the LGP of Fig. 4 and Fig. 7 paper direction.

Among the LGP 40A shown in the schematic sectional view of Fig. 4 (A), the jog 42A that is arranged at the 1st 41 surface elements has along the continuous linearity concaveconvex shape that becomes the direction (direction specifically roughly meets at right angles) of predetermined angular to extend to the incident direction of LGP 40A with light, and the cross sectional shape of the continuous concaveconvex shape when being light and to the incident direction of LGP 40A and with the 1st 41 vertical imaginary plane LGP 40A being cut off is a zigzag fashion (cross sectional shape: triangle).In the Reference numeral among the figure, be meant identical inscape with Reference numeral identical shown in Fig. 1 (A).

Represented schematic section among Fig. 4 (B), in Fig. 5 (A), represented among the LGP 40B of signal oblique view, the protuberance 42B that is arranged at the 1st 41 surface elements has along the continuous linearity convex that becomes the direction (direction specifically roughly meets at right angles) of predetermined angular to extend to the incident direction of LGP 40B with light, is trapezoidal with the cross sectional shape that is the continuous convex of light when the incident direction of LGP 40B and the imaginary plane vertical with the 1st 41 cut off LGP 40B.

Fig. 4 (C) has provided schematic section, in Fig. 5 (B), represented among the LGP 40C of signal oblique view, the protuberance 42C that is arranged at the 1st 41 surface elements has along becoming the direction (direction specifically roughly meets at right angles) of predetermined angular to be arranged in the discontinuous convex on the imaginary straight line with light to the incident direction of LGP 40C, and discontinuous convex shape is pyramid or pyramid-shaped.

Fig. 4 (D) has provided schematic section, represented among Fig. 6 (A) among the LGP 40D of signal oblique view, the protuberance 42D that is arranged at the 1st surface element has along becoming the direction (direction specifically roughly meets at right angles) of predetermined angular and be arranged in discontinuous convex on the imaginary straight line to the incident direction of LGP with light, and the shaped slightly of discontinuous convex becomes hemispherical.

Fig. 4 (E) provides schematic section, represented among Fig. 6 (B) among the LGP 40E of signal oblique view, the protuberance 42E that is arranged at the 1st surface element has along becoming the direction (direction specifically roughly meets at right angles) of predetermined angular and be arranged in discontinuous convex on the imaginary straight line to the incident direction of LGP with light, and discontinuous convex shape is a cylinder.

Fig. 7 (A) provides among the LGP 140A that has represented the signal oblique view among schematic section, Fig. 8 (A), the recess 142A that is arranged at the 1st 41 surface elements has along becoming the spill of the continuous linearity that the direction (direction specifically roughly meets at right angles) of predetermined angular arranges with light to the incident direction of LGP 140A, is trapezoidal with being the continuous spill of light when the incident direction of LGP 140A and the imaginary plane vertical with the 1st 141 cut off LGP 140A.

Fig. 7 (B) provides among the LGP 140B that has represented the signal oblique view among schematic section, Fig. 8 (B), the recess 142B that is arranged at the 1st 41 surface element has along the continuous linearity spill that becomes the direction (direction specifically roughly meets at right angles) of predetermined angular to arrange to the incident direction of LGP 140B with light, is triangle with being the continuous spill of light when the incident direction of LGP 140B and the imaginary plane vertical with the 1st 141 cut off LGP 140A.

In the LGP 140C of the schematic section shown in Fig. 7 (C), the recess 142C that is arranged at the 1st 141 surface elements has along becoming the direction (direction specifically roughly meets at right angles) of predetermined angular to be arranged in the discontinuous spill on the imaginary straight line with light to the incident direction of LGP 140C, and discontinuous female shapes is hemispherical roughly.

In the LGP 140D of the schematic section shown in Fig. 7 (D), the recess 142D that is arranged at the 1st 141 surface elements has the discontinuous spill that becomes the direction (direction specifically roughly meets at right angles) of predetermined angular to arrange along the incident direction with signal LGP 140D on imaginary straight line, discontinuous female shapes is a cylinder.

The fixing means that the 20 or the 2nd fixing means of inserting the 30 and the 1st mold component 10 (dynamic model portion) and the 2nd mold component (cover half portion) 13 of inserting illustrates, for example also has the method for following explanation in embodiment 1.That is, Fig. 9 (A) represents that with the state behind the mold assemblies locked mode Figure 10 (A) represents that with the state after the mold assemblies die sinking, the mold assemblies shown in the schematic section of this Fig. 9 (A) and Figure 10 (A) possesses:

Form the mold assemblies of the LGP of die cavity 118, moulding transparent resin system when (A) containing the 1st mold component (dynamic model portion) the 110 and the 2nd mold component (cover half portion) 113, locked mode;

(B) be used in die cavity 118 importing the molten resin injection part (not shown) of the side gate mode of fusion transparent resin;

(C) be provided on the 1st mold component 110 and constitute die cavity 118 a part insert 120; With

(D) be provided on the 2nd mold component 113 and constitute die cavity 118 a part the 2nd insert 130.

Further possess in the mold assemblies by bolt 116 and be installed on the 1st mold component 110, constitute the part of die cavity 118 and cover the cover plate 111 of 120 end faces of inserting.Cover plate 111 covers 120 the whole end face of inserting.And possess by bolt 117 and be installed on the 2nd mold component 113, constitute an one of die cavity 118 and cover the 2nd the 2nd cover plate 114 of inserting 130 end faces.The 2nd cover plate 114 covers the 2nd 130 the whole end face of inserting.On cover plate 111 and the 2nd cover plate 114 molten resin injection part (not shown) is set.

Represented the signal amplification sectional view at Figure 10 (B), represented that in Fig. 9 (B) 120 (the thickness 3.0mm) that insert of signal amplifier section sectional view are formed by insert body 121 and metal level 122, the wherein said body 121 of inserting is used for the 1st of the formed light conductive plate, by containing yittrium oxide (Y ₂O ₃) as partially stabilizedization zirconia ceramics (partially stabilizedization zirconia ceramics, the ZrO of partially stabilizedization agent ₂) constitute; Described metal level 122 is used to form the 1st of LGP, be disposed at the insert body 121 relative with die cavity 118 the surface, be provided with the jog 123 of tool sawtooth (prism) shape.Insert the schematic section of body 121 shown in Fig. 9 (C).Be arranged at jog 123 on the metal level 122 and have, and have shape with the jog complementation of formation on the 1st 41 of LGP 40 along the continuous spill that becomes the direction (direction specifically roughly meets at right angles) of predetermined angular to extend to the incident direction of LGP with light.The part that forms this jog 123 is equivalent to 120 the cavity surface 120A that inserts.

Metal level 122 is the two-layer formation of Ni compound layer (the Ni-P layer that is formed by electroless plating method) of 100 μ m by Ni layer by electroplating the thickness 5 μ m form and the thickness that forms thereon.That is, the thickness t of metal level 122 is 105 μ m.In the accompanying drawing, metal level 122 is with 1 layer of expression.The surface roughness R on insert body 121 surfaces relative with die cavity 118 _ZBe 0.5 μ m.Insert between body 121 and the metal level 122 and to form the reactive metal film 124 that constitutes by the Ti-Cu-Ag eutectic composition that thickness is 10 μ m.This reactive metal film 124 is formed by reactive metal weldering method.

Under state, form the metal level 122B (with reference to Figure 10 (B)) that has an even surface at the part surface of the body 121 of inserting relative with cover plate 111 with the 1st mold component 110 and the 2nd mold component 113 locked modes.This metal level 122B and metal level 122 form simultaneously, form reactive metal film 124 under metal level 122B.

Specifically, with zirconia (ZrO ₂) powder and Y ₂O ₃The mixture extrusion forming of powder is carried out sintering then and is made the body 121 (with reference to the schematic section of Fig. 9 (C)) of inserting.Then, surface (being called surperficial 121B) to the surface (being called surperficial 121A) of the insert body 121 relative with die cavity 118 and the insert body 121 relative with cover plate 111 is ground and is polished with skive, makes the surface roughness R of described surperficial 121A, 121B _ZBe 0.5 μ m.Then, according to reactive metal weldering method, form reactive metal film 124 at this surface of the body 121 of inserting 121A, 121B.Specifically, the paste that will contain the Ti-Cu-Ag eutectic composition is coated on this surface 121A, the 121B of the body 121 of inserting, and carries out sintering with about 800 ℃ high temperature in a vacuum, forms reactive metal film 124.Then, the part that forms the part body 121 of inserting in addition of reactive metal film 124 is hidden, form nickel dam, form the Ni-P layer thereon by electroless plating method again by galvanoplastic.Then, use the diamond bit of the jog that has formed sawtooth (prism) shape that the Ni-P layer is carried out machining, on metal level 122, form jog 123.

Except that (cavity surface) the smooth this point of surface, the 2nd inserts 130 has in fact and 120 same formation, the structures of inserting.The surface roughness R of metal level 132 _ZBe 0.01 μ m.

The 1st mold component (dynamic model portion) 110 made by carbon steel S55C, carries out machining, and the installation portion of inserting is set.Use the flush cut machine of metal processing usefulness that the metal level 122B that forms on surperficial 121B is cut.Install at the installation portion of inserting then and insert 120,120 the end face inserted is covered with cover plate 111, cover plate 111 usefulness bolts 116 are fixed on the 1st mold component 110.

The 2nd mold component (cover half portion) 113 usefulness carbon steel S55C make, and carry out machining, and the installation portion of inserting is set.On the installation portion of inserting, install the 2nd then and insert 130, insert 130 end face with 114 coverings of the 2nd cover plate with the 2nd, the 2nd cover plate 114 usefulness bolts 117 are fixed on the 2nd mold component 113.

Use the mold assemblies obtain like this, according to the same method injection moldable LGP of embodiment 1-embodiment 5 explanations.

Claims

1. LGP, this LGP contains the transparent thermoplastic resin, have the 1st, relative with the 1st the 2nd, the 1st side, the 2nd side, 3rd side relative and 4th side relative with the 2nd side with the 1st side, wherein the 1st surface element is provided with protuberance and/or recess, length between the 1st side and the 3rd side is that the length of the length direction of LGP is 40mm or above and 130mm or following, the thickness that accounts for the zone of minimum 8 one-tenth of LGP is 0.1mm or above and 0.55mm or following, and flatness is 200 μ m or following.

2. the LGP of claim 1 has used the mould that possesses die cavity and be used for the molten thermoplastic resin is expelled to by the pairing cavity surface in any one side of LGP the molten resin injection part in the die cavity; LGP is transparent molten thermoplastic resin to be expelled in the die cavity via the molten resin injection part form.

3. the LGP of claim 2, it is characterized in that: be provided with in the inside of mould and comprise the body of inserting that contains zirconia ceramics or electric conductivity zirconia ceramics, and in order to form protuberance and/or recess on the 1st of big gun plate and in the surface configuration of the insert body relative with die cavity and be provided with recess and/or the inserting of the metal level of protuberance leading.

4. claim 2 or 3 LGP is characterized in that: by the 1st side incident light of this LGP, the molten thermoplastic resin is injected in die cavity by the pairing cavity surface in LGP the 3rd side.

5. each LGP among claims 1-4 is characterized in that: the Q value of thermoplastic resin is 0.5cm ³Second ^-1Or more than.

6. each LGP among the claim 1-5, it is characterized in that: thermoplastic resin is that viscosity-average molecular weight is 1.0 * 10 ⁴-1.5 * 10 ⁴Aromatic polycarbonate resin.

7. each LGP among the claim 1-6 is characterized in that: LGP in the xy chromatic diagram of CIE 1931XYZ colour system (x, y) value satisfies x≤0.375 and y≤0.335.

8. each LGP among the claim 1-7, it is characterized in that: LGP has the roughly certain thin sheet form of thickness on the whole, by LGP the 1st side incident light, penetrates light by the 1st and/or the 2nd.

9. each LGP among the claim 1-7, it is characterized in that: the truncate quadrangular pyramid shape that has wedge-like generally, two relative sides of truncate quadrangular pyramid are equivalent to the 1st and the 2nd of LGP, the bottom surface of truncate quadrangular pyramid is equivalent to the 1st side of LGP, the end face of truncate quadrangular pyramid is equivalent to the 3rd side of LGP, two relative sides of all the other of truncate quadrangular pyramid are equivalent to the 2nd side and the 4th side of LGP, by the 1st side incident light of LGP, penetrate light by the 1st and/or the 2nd.

10. surface light source apparatus, this surface light source apparatus contains LGP and light source, it is characterized in that: this LGP contains the transparent thermoplastic resin, have the 1st, relative with the 1st the 2nd, the 1st side, the 2nd side, 3rd side relative with the 1st side, and 4th side relative with the 2nd side, the 1st surface element is provided with protuberance and/or recess, length between the 1st side and the 3rd side is that the length of the length direction of LGP is 40mm or above and 130mm or following, the thickness that accounts for the zone of minimum 8 one-tenth of LGP is 0.1mm or above and 0.55mm or following, flatness is 200 μ m or following, by the 1st side incident light of LGP, penetrate light by the 1st and/or the 2nd.

11. manufacturing method of light conducting board, wherein said LGP contains the transparent thermoplastic resin, have the 1st, relative with the 1st the 2nd, the 1st side, the 2nd side, 3rd side relative with the 1st side, and 4th side relative with the 2nd side, the 1st surface element is provided with protuberance and/or recess, length between the 1st side and the 3rd side is that the length of the length direction of LGP is 40mm or above and 130mm or following, the thickness that accounts for the zone of minimum 8 one-tenth of LGP is 0.1mm or above and 0.55mm or following, flatness is 200 μ m or following, this manufacture method is used possesses die cavity, and be used for the molten thermoplastic resin is expelled to molten resin injection part in the die cavity by the pairing part in any one side of LGP, and the mold assemblies that constitutes by the 1st mold component and the 2nd mold component, this manufacture method comprises following steps:

(A) the 1st mold component and the 2nd mold component are passed through clamp force F ₀Carry out locked mode, form die cavity;

(B) in die cavity, inject transparent molten thermoplastic resin by the molten resin injection part then;

(C) through t after second, through t after second (wherein 0 second≤t≤8.0 second), making clamp force was 0.5F after perhaps injection molten thermoplastic resin's step and its follow-up pressurize step finished in die cavity after injection molten thermoplastic resin's step finished in die cavity ₀Or below; With

(D) make the thermoplastic resin in the die cavity cool off, solidify,, take out LGP then with the 1st mold component and the 2nd mold component die sinking.