CN101132689A - Production line managing method and system of production line - Google Patents
Production line managing method and system of production line Download PDFInfo
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- CN101132689A CN101132689A CNA2007101420772A CN200710142077A CN101132689A CN 101132689 A CN101132689 A CN 101132689A CN A2007101420772 A CNA2007101420772 A CN A2007101420772A CN 200710142077 A CN200710142077 A CN 200710142077A CN 101132689 A CN101132689 A CN 101132689A
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Abstract
The invention for production lines which process mounting components on the substrate is capable of evaluating the validity from both the CPH and the aspect of funds. The actual production data containing the number of components loaded on the substrate and the information related to the funds needed for production in each apparatus is collected in order on line when producing. In addition, information generated from processing the data of actual production is provided to operator according to the input of the operator.
Description
Technical field
The present invention relates to a kind of Production Line spool reason method and system with the multiple arrangement that comprises electronic component mounting apparatus at least, this electronic component mounting apparatus will be supplied with the parts of position absorption at parts, be installed on the associated components loading position on the substrate of being moved into.
Background technology
In patent documentation 1, in the parts mounting production line that links each component mounter, master computer is via network, in management devices, collect the facility informations such as running rate, dwell time, kind switching time of each component mounter, and as productive temp temporal informations such as installation productive temp time (tact-time) of the time that a circuit substrate is installed or productive temp losses of time, and have or not quality information such as the bad or harmful content of quality.
The above-mentioned installation productive temp time is with time of taking out of (loadingtime) of moving into of substrate and time of cooperating with required time of the action of this device.In addition, in each device, will be in the standard value of not having the installation productive temp time under the situation that productive temp loss of time, ground moved according to standard as " standard to be installed the productive temp time ", the actual value that the productive temp time will be installed is as " installation productive temp time actual value ".When " productive temp time actual value is installed " surpassed " standard is installed the productive temp time ", the overage of this productive temp time was called " the productive temp loss of time ".
In addition, in patent documentation 1, as the device of management object, except component mounter, also can be with paste solder printing machine, binding agent coating machine, high-speed set installation, multi-functional kludge, assembling parts inspection machine, reflux, appearance inspection machine etc. as object.In addition, for said apparatus, will with above-mentioned " install productive temp time " corresponding required time, suitably be referred to as " coating productive temp time " " to assemble productive temp time " etc.
In patent documentation 1, its purpose is, calculates above-mentioned " the productive temp loss of time ", analyzes the reason of the actual efficiency reduction that the productive temp time is installed the loss of time according to productive temp.
Patent documentation 1: No. 3583121 communiques of patent
Summary of the invention
From the angle that directs a factory, important project is the funds such as the parts amount of money that use in the amount of money, substrate production of the air that uses in order to make fitting machine work, electric energy etc.
But, in prior aries such as patent documentation 1, only the decrease reason of the productivity ratio that produces owing to the production line productive temp time is analyzed, can't be unit or be the required expense of substrate production in the related production lines such as expense of the occupied area of related funds of the parts of funds such as the air use amount of unit or electric power consumption, lift-launch and fitting machine production line etc. with the device by calculating in the production line, estimate the adequacy of production line with the substrate.
The problem to be solved in the present invention is that the production line at producing at the substrate upper mounting component provides a kind of method of management of production line and system, and it can also estimate adequacy from the funds aspect not only from productive temp time (Chip per Hour).
The present invention addresses the above problem by the following technical programs, promptly, a kind of Production Line spool reason method, this production line has the multiple arrangement that comprises electronic component mounting apparatus at least, this electronic component mounting apparatus will be supplied with the parts of position absorption at parts, be installed on the associated components loading position on the substrate of being moved into, wherein, master computer is in the substrate production process, install the production actual job data of collecting the fund information that comprises that production is required in order, according to operator's operation input, master computer is processed this production actual job data at each, the fund information that generation provides to the operator, and show.
In above-mentioned method of management of production line and system, the information relevant with above-mentioned funds comprises air use amount, consumed power, the parts amount of money, the substrate amount of money, the loss parts amount of money, device occupied area at least 1.
In addition, in above-mentioned method of management of production line and system, have based on above-mentioned fund information generation evaluation of estimate, and carry out device shown.
The effect of invention
According to the present invention, can hold project important from the angle that directs a factory, i.e. the funds such as the parts amount of money that use in the amount of money of the air that uses in order to make fitting machine work, electric energy etc., the substrate production.In addition, not only analyze the reason of the productivity ratio reduction that causes owing to the production line productive temp time, also be unit or be the required expense of substrate production in the production lines such as occupied area of expense, number of components and variety of components, fitting machine production line of air use amount, the electric power consumption of unit with the device, can estimate the adequacy of production line by calculating in the production line with the substrate.
Description of drawings
Fig. 1 is the oblique view that electronic component mounting apparatus 1 overall appearance of using in the embodiments of the present invention is used in expression.
Fig. 2 is the oblique view of major part that is positioned at the above-mentioned electronic component mounting apparatus of enclosure interior.
Fig. 3 is the block diagram of the formation of the control relation in the above-mentioned execution mode of expression.
Fig. 4 is the structure chart of the network in the above-mentioned execution mode.
Fig. 5 is the block diagram that the hardware that uses constitutes in the host computer apparatus of the above-mentioned execution mode of expression.
Fig. 6 is the display frame figure that represents the CPH picture that shows in the above-described embodiment.
Fig. 7 is the display frame figure of operation conditions picture of the electronic component mounting apparatus of the above-mentioned execution mode of expression.
Fig. 8 is the display frame figure that represents the wrong detailed picture that shows in the above-described embodiment.
Fig. 9 is the display frame figure of the operation conditions picture of each electronic component mounting apparatus in the above-mentioned execution mode of expression.
Figure 10 is the display frame figure that represents the parts amount of money picture of each substrate of producing in the above-described embodiment.
Figure 11 is the display frame figure that the parts of the electronic component mounting apparatus of the above-mentioned execution mode of expression lose picture.
Figure 12 is the display frame figure that represents to follow in the above-described embodiment the expense picture that the device base area of electronic component mounting apparatus produces.
Embodiment
Below, use accompanying drawing to describe embodiments of the present invention in detail.
Fig. 1 is the oblique view of expression electronic component mounting apparatus 1 overall appearance.
Electronic component mounting apparatus 1 is covered by housing 3.Front at this housing 3 is provided with: keyboard 5, and it is used for carrying out input operation by the operator; And LCD 6, it is used to carry out display frame.Be provided as the display lamp 7 of notification unit at the rear, top of this housing 3.
Fig. 2 is the oblique view of major part 1a that is positioned at the electronic component mounting apparatus 1 of housing 3 inside.
In Fig. 2, label 12 is substrate transfer apparatus of carrying substrate 10, and this substrate transfer apparatus 12 will position fixing in part carrying device 13 along the substrate 10 of the carrying of the X arrow among Fig. 2 as known in the art.In addition, dispose a plurality of assembly supply devices 18 respectively in the front and back of electronic component mounting apparatus 1.
On the top of above-mentioned substrate transfer apparatus 12 head unit 16 is set, its removably support can the vacuum suction electronic unit adsorption mouth, utilize motor 11Z to make it, have and utilize a plurality of head shaft 20 of motor 11 θ along the action of θ direction of rotation along Z direction (above-below direction among the figure) action.Adsorption mouth from adsorption nozzle replacing station 23 removably is installed respectively on these head shaft 20.In addition, for each head shaft 20, the θ direction of rotation is the direction of principal axis around the axis rotation of Z direction.
This head unit 16 can utilize the XY travel mechanism 17 that is driven by motor 11X and 11Y, freely move in upper edge, XY plane X-Y direction, the component mounting position 13 of supplying with position and substrate 10 from the parts of the assembly supply device 18 attract electrons parts of supplying with electronic unit is run through on this XY plane.In addition, the scope on the XY plane that this head unit 16 can move except above-mentioned parts are supplied with position and above-mentioned loading position 13, also comprises the position by component recognition apparatus 30 identification electronic units.
Component recognition apparatus 30 in the scope on the XY plane that head unit 16 can move, is arranged on not on the position of interfering with substrate 10 as shown in Figure 2.In addition, not shown camera unit is installed in head unit 16, is moved along the X-Y direction integratedly with this head unit 16.
For the electronic unit with absorption correctly carries on substrate 10, the electronic unit and the position between the adsorption mouth that need identification correctly to be adsorbed concern, need to discern the tram of the substrate of moving into to component mounting position 13 10 simultaneously.The former identification is performed such: under the state that electronic unit is adsorbed on the adsorption mouth, make head unit 16 move to the top of component recognition apparatus 30, in this component recognition apparatus 30, take pictures from the below to this adsorption element, discern based on this image of taking pictures.The latter's identification is performed such: in camera unit, from the top base plate mark on the substrate 10 is taken pictures, discern based on this image of taking pictures.
, the action summary that electronic unit is installed is described here, at first, head unit 16 moves on the associated components absorption position in the assembly supply device 18, adsorption mouth is descended, at the front end vacuum suction electronic unit of adsorption mouth.Then, head unit 16 is moved on the relevant loading position on the substrate 10, adsorption mouth is descended, on one side electronic unit is removed this vacuum suction on one side by being pressed on the substrate 10, this electronic unit is installed on the substrate 10.
Above-mentioned component mounting action is carried out when carrying each electronic unit.In addition, electronic unit is installed on the substrate and necessary lift-launch program when producing substrate, by substrate data, carry data, parts data, adsorpting data etc. and constitute, each can export these inscapes.
Fig. 3 is the formation block diagram of the control relation in the expression present embodiment.
The control device 19 that carries out the integral body control of electronic component mounting apparatus has: CPU (Central Processing Unit) 151, and it carries out various programs; As the RAM (Random Access Memory) 152 of primary storage portion, the program that its storage is carried out etc.; Jumbo external memory 153, it is made of hard disk unit etc.; I/O (Input Output) device 157, it connects each device; And network I/F (InterFace) device 159.In addition, said apparatus can utilize bus 160 visits by CPU151.
This I/O device 157 connects the substrate transfer apparatus control part that is built in the substrate transfer apparatus shown in Figure 2 12, is built in the adsorption mouth control device in the head unit 16, the XY travel mechanism control part of XY travel mechanism 17, the assembly supply device control part of assembly supply device 18, the component recognition apparatus control part of component recognition apparatus 30 etc.These substrate transfer apparatus control parts, XY travel mechanism control part, assembly supply device control part, component recognition apparatus control part, be be used for realizing respectively built-in they the action of unit or each relevant equipment of control of function.For example, the adsorption mouth control device is relevant with each adsorption mouth, carries out along the rotation of the θ direction of head shaft 20 or along rising/decline and other control of Z direction.
As the RAM152 and the external memory 153 of the memory cell of present embodiment, preserve accessed each file and data in the program carried out by CPU151 and the present embodiment, so that can carry out electronic access.Be used to carry out application program or OS (OperatingSystem) supervisor for the control of the action that realizes the electronic component mounting apparatus that present embodiment is related or function, be stored in the external memory 153, when carrying out, read by RAM152, carry out by CPU151.
Fig. 4 is the network structure in the present embodiment.
Be built in the control device 19 in each electronic component mounting apparatus 1, utilize above-mentioned network I/F device 159 to be connected with network 173.In addition, host computer apparatus 170 also utilizes its built-in network I/F device to be connected with network 173.In addition, process units that have on the production line for present embodiment, outside the electronic component mounting apparatus 1 also utilizes identical network I/F device to be connected with network 173.This network 173 is not particularly limited, and can be common LAN (Local Area Network), also can be cable network or wireless network.
Fig. 5 is the block diagram that the hardware that uses in the host computer apparatus 170 of expression present embodiment constitutes.
In this figure, represent the example that hardware that use, computer installation constitutes in the above-mentioned host computer apparatus 170.In addition, in this figure, for convenience of explanation, the part that hardware constitutes is by abstract.
In this figure, computer installation has: CPU310, RAM311, ROM (ReadOnly Memory) 312, LAN-I/F 313, MODEM (modulator-demodulator) 314, parallel I/F 315, various I/F 320～322.These parts interconnect by bus 301.
In addition, bus 301 is connected with HDD (Hard Disc Drive) device 340, CD (Compact Disc) drive unit 341, FDD (disk drive) device 342 via I/F 322.They interconnect via bus 302.
In hardware as implied above constituted, memory cell or storage device were RAM311, ROM312, HDD device 340, CD drive unit 341, FDD device 342 etc.In above-mentioned memory cell or storage device, preserve accessed database, each file and data in the various programs carried out by CPU310 and the present embodiment, make it can carry out electronic access.For example, OS etc. are used for providing related application program of program, the present embodiment of the environment that utilizes software resource or network browser program to be stored in HDD device 340, when carrying out, read among the RAM311, utilize CPU (arithmetic element) 310 to carry out.In addition, LAN-I/F 313 uses when being connected with network 173.
In addition, when carrying out OS or application program or other programs, the operator with reference to show the information of output in picture display device 330, imports and various operation Yi Bian utilize keyboard 331 to carry out literal on one side, or utilizes mouse 332 to carry out the input of coordinate input and various operations.In addition, can be suitably from the information of print apparatus 333 printout necessity.Certainly, above-mentioned various outputs or the program of input by being carried out by CPU310 are undertaken by electron process.
In addition, CD drive unit 341 and FDD device 342 are used for installation or other information exchange of device under off-line state of application program when of the present invention using and implement.
Below, the effect of present embodiment is described.
Fig. 6 is illustrated in the CPH picture that shows in the above-mentioned picture display device 330.
CPH (chip per hour) is that electronic component mounting apparatus 1 electronic unit hourly (chip part) carries quantity.In the host computer apparatus 170 that a plurality of electronic component mounting apparatus 1 are managed as production line, be connected with the control device 19 of electronic component mounting apparatus 1 by utilizing network 173, can be at production line in service, the various information of online collection.Host computer apparatus 170 is used above-mentioned information on one side, Yi Bian the CPH (actual CPH) when showing actual production in the production line as shown in Figure 6 in addition, can be presented at the CPH (inferring CPH) that obtains by simulation in the host computer apparatus 170.In addition, in Fig. 6, device name is the title of each electronic component mounting apparatus 1.
The operator is by more above-mentioned actual CPH and infer CPH, can hold the Production Line rate.This productivity ratio is as shown in the formula defining.This productivity ratio can be obtained each electronic component mounting apparatus 1, also can be that unit obtains with the production line.
Productivity ratio=actual CPH/ infers CPH ... (1)
Fig. 7 is illustrated in the operation conditions picture of the electronic component mounting apparatus that shows in the above-mentioned picture display device 330.Fig. 8 is illustrated in the wrong detailed picture that shows in the above-mentioned picture display device 330.
In service at production line, host computer apparatus 170 monitors whether the productivity ratio of each electronic component mounting apparatus 1 is lower than predefined benchmark productivity ratio separately.Under the situation that is lower than benchmark productivity ratio, show that on picture productivity ratio reduces, perhaps show the title of the electronic component mounting apparatus 1 of this reduction.And, by operations of operators, can on picture, show the operation conditions picture of each electronic component mounting apparatus 1 as shown in Figure 7, perhaps show the wrong detailed content of this assembly supply device 18 of electronic component mounting apparatus 1 as shown in Figure 8.The operator can be with reference to above-mentioned picture etc., the main cause that productivity analysis reduces.
In Fig. 7, " station ID " is the ID that gives each electronic component mounting apparatus 1." parts supply position " is the title of supplying with the assembly supply device 18 of the electronic unit that carries to substrate 10.Usually supply with a kind of electronic unit from each assembly supply device 18, in electronic component mounting apparatus 1, have a plurality of assembly supply devices 18.
In addition, Fig. 8 is as an example, at the wrong detailed picture of the assembly supply device 18 of " F35 " that show in Fig. 7.In this picture, enumerate wrong content, show frequency separately.
Fig. 9 is illustrated in the operation conditions picture of each electronic component mounting apparatus 1 that shows in the above-mentioned picture display device 330.
, the adsorption mouth of a plurality of vacuum suction electronic units is installed here in head unit 16, this vacuum suction is used the air pressure of supplying with from the outside of electronic component mounting apparatus 1.In addition, the action of this electronic component mounting apparatus 1 needs electric power.
In host computer apparatus 170, based on the information of utilizing network 173 to collect, suitably carry out various calculating from electronic component mounting apparatus 1, the operation inputs such as picture and selecting according to from the operator can show operation conditions picture as shown in Figure 9.In this picture, can represent operating running time (accumulated running time), the air use amount (unit: m of each electronic component mounting apparatus 1
3) and consumed power (unit: W).
Figure 10 is illustrated in the parts amount of money picture of each substrate of being produced 10 that shows in the above-mentioned picture display device 330.
In the production of substrate 10, for the electronic unit that is equipped on the substrate 10, host computer apparatus 170 is collected the information of the lift-launch quantity of expression parts kind or parts kind quantity, each parts kind from each electronic component mounting apparatus 1, is stored among the RAM311.In addition, in the ROM312 or RAM311 of host computer apparatus 170, login the unit price of each parts kind in advance.In this host computer apparatus 170, based on the information of above-mentioned collection or login, can show display frame as shown in figure 10, its relate to electronic component mounting apparatus 1 in the suitable parts expense of each piece of the substrate 10 produced.
In this display frame, in " name of parts " hurdle, enumerate the title that is equipped on the electronic unit on this substrate 10.And,, show " usage quantity " on this substrate 10, its " parts unit price " and multiply each other to calculate " total volume " by these usage quantities and parts unit price to each above-mentioned electronic unit.And the foot showing shows total total that " usage quantity " on this substrate 10 reaches " total volume ".Total total that should " total volume " becomes the production unit price of this substrate 10 in the electronic component mounting apparatus 1 in this production line.
Figure 11 is illustrated in the parts loss picture of the electronic component mounting apparatus that shows in the above-mentioned image display device 330.
In service at production line, in each electronic component mounting apparatus 1, can be because absorption failure grade be lost electronic unit (parts loss).This absorption failure is meant that the electronic unit that is adsorbed on the adsorption mouth falls and loses.Host computer apparatus 170 is also collected the information relevant with parts losses in each electronic component mounting apparatus 1, is stored among the RAM311.And, as shown in figure 11, can show the relevant information of parts loss with each assembly supply device 18 of electronic component mounting apparatus 1.The operator can be with reference to above-mentioned picture etc., resolves the main cause that productivity ratio reduces.
In this display frame, in " name of parts " hurdle, enumerate the title that is equipped on the electronic unit in this substrate 10.And,, show " adsorption number ", " adsorbing wrong number " in this substrate 10, its " parts unit price " and multiply each other to calculate " mistake parts total value " by these absorption failure numbers and parts unit price for each above-mentioned electronic unit.In addition, in the foot that shows, show total total that " the adsorbing wrong number " in this substrate 10 reaches " mistake parts total value ".Total total that should " mistake parts total value " is to lose in the electronic component mounting apparatus 1 in this production line and the Amount in Total of the electronic unit that loses.
Figure 12 is illustrated in the expense picture that device base area that show, that follow electronic component mounting apparatus 1 produces in the above-mentioned image display device 330.
In production line, if set up electronic component mounting apparatus 1, then production capacity can increase, and big but occupied area becomes, consequent expense increases.Thus, need be based on the average cost of use of regulation, hold the related expense (the related expense of device base area) of electronic component mounting apparatus 1 that is provided with.In this device base area expense picture, " device name " is the title of giving each electronic component mounting apparatus 1.In addition, respectively separately electronic component mounting apparatus 1 is shown " occupied area ", and show and should " occupied area " be input to " the area cost of use " obtained after regulation unit are cost of use in the host computer apparatus 170 multiplies each other with login in advance.
For example, in Figure 12, as the area unit price of each station on 1 production line, show “ $500 ", the occupied area as 1 production line is made as " 400 " (omission unit), then, be shown as “ $200000 " as the area cost of use of the value that multiplies each other of both values.
As implied above, the operator utilizes present embodiment, can automatically obtain the required funds of substrate production in the production line.In addition, the expense of obtaining like this compares with production line productive temp time or production piece number easily, can estimate the adequacy of production lines from comprising the various viewpoints of funds aspect.In addition, for above-mentioned expense, can comprise expense, the related various expenses such as expense of device base area of air use amount, consumed power, loss parts.
Based on the evaluation of CPH, become the productivity evaluation of observing from machine, substrate two aspects here.Based on the evaluation of air use amount, consumed power, become the productivity amount of money evaluation of observing from machine context.Evaluation based on the parts amount of money, the substrate amount of money, loss parts volume, production substrate block number becomes the productivity amount of money evaluation of observing from the substrate aspect.Based on the evaluation of occupied area, area unit price, become the productivity amount of money evaluation of observing from machine context.
And then, in the present embodiment, in the CPU310 of host computer apparatus 170, calculate the evaluation of estimate V of comprehensive these evaluations by following formula.In this host computer apparatus 170, the operation inputs such as picture and selecting according to the operator utilizes keyboard 331 to carry out can show this evaluation of estimate V in above-mentioned picture display device 330.
Thus, according to this evaluation of estimate V, the operator can relatively easily estimate the adequacy of production line based on various viewpoints to every production line.
Evaluation of estimate V=CPH/ ((air cost of use+consumption electricity expense is used)+((the parts amount of money+substrate amount of money+loss parts amount of money)/production piece number)+(occupied area * area unit price)) ... (2)
In addition, above-mentioned fund information also can specify or select any unit in substrate unit, device unit or the production line unit to generate, and shows.In addition, evaluation of estimate also can specify or select any unit of substrate unit, device unit or production line unit to generate in the same manner, shows.
Claims (6)
1. Production Line spool reason method, this production line has the multiple arrangement that comprises electronic component mounting apparatus at least, this electronic component mounting apparatus will be supplied with the parts of position absorption at parts, be installed on the associated components loading position on the substrate of being moved into
It is characterized in that,
Master computer installs the production actual job data of collecting the fund information that comprises that production is required in order at each in the substrate production process,
According to operator's operation input, master computer is processed this production actual job data, the fund information that provides to the operator is provided, and shows.
2. Production Line spool reason method according to claim 1 is characterized in that,
The information relevant with above-mentioned funds comprises air use amount, consumed power, the parts amount of money, the substrate amount of money, the loss parts amount of money, device occupied area at least 1.
3. Production Line spool reason method according to claim 1 is characterized in that,
Generate evaluation of estimate based on above-mentioned fund information, and show.
4. a Production Line spool is managed system, this production line has the multiple arrangement that comprises electronic component mounting apparatus at least, this electronic component mounting apparatus will be supplied with the parts of position absorption at parts, be installed on the associated components loading position on the substrate of being moved into
It is characterized in that having:
In the substrate production process, collect the unit that comprises the production actual job data of producing required fund information in order at each device;
According to operator's operation input, process this production actual job data, the unit of the fund information that provides to the operator is provided; And
The unit that shows the fund information of above-mentioned generation.
5. Production Line spool according to claim 4 is managed system, it is characterized in that,
The information relevant with above-mentioned funds comprises air use amount, consumed power, the parts amount of money, the substrate amount of money, the loss parts amount of money, device occupied area at least 1.
6. Production Line spool according to claim 4 is managed system, it is characterized in that having:
Generate the unit of evaluation of estimate based on above-mentioned fund information; And
The unit that shows above-mentioned evaluation of estimate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006225045 | 2006-08-22 | ||
| JP2006225045 | 2006-08-22 |
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| CN101132689A true CN101132689A (en) | 2008-02-27 |
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| CNA2007101420772A Pending CN101132689A (en) | 2006-08-22 | 2007-08-22 | Production line managing method and system of production line |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686096A (en) * | 2011-03-17 | 2012-09-19 | 富士机械制造株式会社 | Production quantity management device of electric circuit production system |
| CN104335691A (en) * | 2012-05-21 | 2015-02-04 | 松下知识产权经营株式会社 | Electronic component mounting system and equipment unit management method for electronic component mounting system |
| CN106961828A (en) * | 2015-10-30 | 2017-07-18 | Juki株式会社 | Managing device |
| CN107741422A (en) * | 2016-09-28 | 2018-02-27 | 研祥智能科技股份有限公司 | distributed detection system |
-
2007
- 2007-08-22 CN CNA2007101420772A patent/CN101132689A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686096A (en) * | 2011-03-17 | 2012-09-19 | 富士机械制造株式会社 | Production quantity management device of electric circuit production system |
| CN102686096B (en) * | 2011-03-17 | 2016-06-29 | 富士机械制造株式会社 | Production quantity management device of electric circuit production system |
| CN104335691A (en) * | 2012-05-21 | 2015-02-04 | 松下知识产权经营株式会社 | Electronic component mounting system and equipment unit management method for electronic component mounting system |
| CN104335691B (en) * | 2012-05-21 | 2016-12-14 | 松下知识产权经营株式会社 | Electronic component mounting system and the unit management method for electronic component mounting system |
| US9836042B2 (en) | 2012-05-21 | 2017-12-05 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component mounting system and equipment unit management method for electronic component mounting system |
| CN106961828A (en) * | 2015-10-30 | 2017-07-18 | Juki株式会社 | Managing device |
| CN107741422A (en) * | 2016-09-28 | 2018-02-27 | 研祥智能科技股份有限公司 | distributed detection system |
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Open date: 20080227 |