CN101127335A - An encapsulation image compensation method and device for ball array encapsulation welding tray - Google Patents
An encapsulation image compensation method and device for ball array encapsulation welding tray Download PDFInfo
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- CN101127335A CN101127335A CNA2007101546376A CN200710154637A CN101127335A CN 101127335 A CN101127335 A CN 101127335A CN A2007101546376 A CNA2007101546376 A CN A2007101546376A CN 200710154637 A CN200710154637 A CN 200710154637A CN 101127335 A CN101127335 A CN 101127335A
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Abstract
The utility model discloses an package figure compensation method and device of a ball grid array package solder pad; wherein, the sizes of the solder pads in the ball grid array package figure are selected in the preset range of solder pad size; four solder pads arranged in the four corners of the ball grid array package figure edge are expanded on the basis of selected size, and the expanded solder pad size is cannot exceed the preset range of. The utility model has the advantages of compensating for the technical deficiencies of a plurality of printed circuit board factories under the circumstances that lead pitch decreases and grid increases incessantly, and giving attention to capacity of outgoing line and welding reliability of surface mounting by the method of big and small pad distribution permutation in the ball grid array package.
Description
Technical field
The present invention relates to printed circuit board (PCB), particularly the encapsulation image compensation method of BGA Package pad and device.
Background technology
Along with continuous increase, the pin-pitch of packaging pin number are also constantly dwindled, caused very big difficulty for PCB (PrintedCircuit Board, printed circuit board (PCB)) wiring.Select suitable BGA (BallGrid Array Package this moment, BGA Package) encapsulation welding tray (PAD) size just becomes key, can directly have influence on stack-design, the via parameters of PCB, also can produce directly influence to signal quality, while also has an immense impact on to SMT (Surface Mounted Technology, the surface mounting technology) procedure quality of PCB.The BGA pad is too big, PCB outlet difficulty; The BGA pad is too little, and the SMT reliability does not pass a test.So general device data all has the PCB encapsulation welding tray that is fit to this kind device to recommend size.Be encapsulated as example with certain device 0.5mm PITCH BGA, this device of manufacturer's recommended PCB encapsulation PAD be 0.275+/-0.05mm, be converted into the 8.858mil～12.795mil that is made in Great Britain.
The inventor notices in the invention process: PCB producer is because production technology ability limitation, when doing big grid BGA figure, usually because the lateral erosion degree is inhomogeneous, cause that BGA PAD is not of uniform size to be caused, the PAD that relatively more outstanding is in the position, four angles of BGA encapsulation image can be littler than the BGA PAD of other position.After this inconsistent appearance, can cause SMT process tin cream area inconsistent, highly inconsistent, finally cause the PAD failure welding at four angles of BGA.
Summary of the invention
The embodiment of the invention provides a kind of encapsulation image compensation method and device of BGA Package pad, in order to guarantee also to look after the soldering reliability of four jiaos of PAD of BGA under the PCB outlet ability prerequisite.
The embodiment of the invention provides a kind of encapsulation image compensation method of BGA Package pad, comprises the steps:
In pad pre-set dimension scope, choose the size of pad in the BGA Package figure;
The pad that will be positioned at four angles of described BGA Package pattern edge enlarges on the size basis of choosing, and wherein, the pad size after the expansion is no more than described pad pre-set dimension scope.
The embodiment of the invention also provides a kind of encapsulation image compensation arrangement of BGA Package pad, comprises choosing module, compensating module, wherein:
Choose module, be used in pad pre-set dimension scope, choosing the size of each pad of BGA Package figure;
Compensating module, the pad that is used for being positioned at four angles of described BGA Package pattern edge enlarges described choosing on the size basis that module chooses, and wherein, the pad size after the expansion is no more than the scope of described pad pre-set dimension.
Embodiment of the invention beneficial effect is as follows:
The embodiment of the invention is chosen the size of each pad in the BGA encapsulation image in pad pre-set dimension scope after, the pad that will be positioned at four angles, described BGA encapsulation image edge enlarges on the size basis of choosing in proportion, but the pad size after the expansion is no more than the scope of described pad pre-set dimension again.Thereby pin-pitch constantly dwindle with the ever-increasing situation of grid under, can remedy the production technology ability of some PCB producers, mode with the common formation BGA encapsulation arranged evenly of big shallow bid makes it to take into account simultaneously PCBLAYOUT outlet ability and SMT soldering reliability.
Description of drawings
Fig. 1 is the encapsulation image compensation method implementing procedure schematic diagram of BGA pad described in the embodiment of the invention;
Fig. 2 to Fig. 8 is that the big shallow bid in bight described in the embodiment of the invention is arranged schematic diagram;
Fig. 9 is a pad compensated position schematic diagram in the encapsulation of BGA described in the embodiment of the invention;
Figure 10 is the encapsulation image compensation arrangement structural representation of BGA pad described in the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described.
Fig. 1 is the encapsulation image compensation method implementing procedure schematic diagram of BGA pad, as shown in the figure, comprises the steps:
In the enforcement, pad pre-set dimension scope can be the recommendation pre-set dimension of producer to pad.
In the enforcement, the one or more pads that are positioned at four angles, BGA encapsulation image edge can be enlarged on the described size basis of choosing in proportion.The shape of pad can comprise circle, square, rectangle, oval one of them or combination in any in the BGA encapsulation image.
Concrete, can select suitable BGAPAD size by device data recommendation in the enforcement.As being encapsulated as example with certain device 0.5mm PITCH BGA, this device of manufacturer's recommended PCB encapsulation PAD be 0.275+/-0.05mm, be converted into the 8.858mil～12.795mil that is made in Great Britain, in order to guarantee to go out single line between two PAD, BGA PAD diameter can be selected 10mil for use.
Because the lateral erosion when doing the PCB figure of some PCB producer is inhomogeneous, this will cause four angle PAD diameters trend lower limit 8.858mil, and the just possible failure welding of PAD at four angles of such device can appear in such PCB in the SMT process.For remedying this defective workmanship, can be when doing this BGA encapsulation in the enforcement, amplify the diameter of the PAD at four angles, make it bigger than other pin pad, but in manufacturer's recommended encapsulation welding tray upper range, hence one can see that, and its four jiaos pad diameter of amplifying be chosen greater than 10mil in this example, but less than the size of 12.795mil.
With an angle in certain four angle of BGA encapsulation is example, the zone of choosing bight of BGA three rows, three row is as the zone that changes the pad size, Fig. 2 to Fig. 8 is that the big shallow bid in bight is arranged schematic diagram, and illustrated several big shallow bid arrangement modes only are the several frequently seen mode in implementing.
Fig. 9 is a pad compensated position schematic diagram in the BGA encapsulation, as shown is pad design residing position in whole BGA encapsulation in the corner that compensates, and wherein pad arrangement general layout and pin-pitch can change by actual conditions in the encapsulation of BGA.When outer peripheral BGA BALL PAD less than three is arranged, change the also corresponding minimizing of pad size area.
In the enforcement, if select the pad of other shape for use, as rectangle, square, rectangle, ellipse, then big or small PAD's chooses size still with above-mentioned principle.Be that little PAD is placed on the device package main part, in the manufacturer's recommended size range, but can take into account PCB LAYOUT outlet design.And big PAD is placed on four jiaos of the BGA encapsulation, and big PAD obtains for little PAD is amplified on year-on-year basis, and the critical size of big PAD is still in the manufacturer's recommended size range.
From the above, embodiment chooses different big or small PAD at BGA class encapsulation welding tray, places in place as required, so that can take into account PCB LAYOUT outlet ability and SMT soldering reliability simultaneously.
Further, said method embodiment can also comprise step 103: paint film by described BGA encapsulation image making guiding principle net and/or welding resistance light after the pad expansion of position, four angles, edge.
Because PCB goes up not of uniform size the causing of PAD of BGA, is making the guiding principle net, need adjust accordingly when welding resistance light is painted film.
The present invention also provides a kind of encapsulation image compensation arrangement of BGA Package pad, describes below in conjunction with the embodiment of accompanying drawing to this device.
Figure 10 is the encapsulation image compensation arrangement structural representation of BGA pad, as shown in the figure, comprises in the compensation arrangement and chooses module, compensating module, wherein:
Choose the size that module can also be used in producer the recommendation pre-set dimension of pad being chosen each pad in the BGA encapsulation image.
Compensating module, the pad that is used for being positioned at four angles, described BGA encapsulation image edge enlarges on the described size basis of choosing, and wherein, the pad size after the expansion is no more than the scope of described pad pre-set dimension.The pad at four angles, described BGA encapsulation image edge can be for one or more, and described expansion is to enlarge in proportion described choosing on the size basis that module chooses.
The shape of pad comprises circle, square, rectangle, oval one of them or combination in any in the BGA encapsulation image.
Can further include the making module in the compensation arrangement, be used to paint film by described BGA encapsulation image making guiding principle net and/or welding resistance light after the pad expansion of position, four angles, edge.
As can be seen from the above-described embodiment, pin-pitch constantly dwindle with the ever-increasing situation of grid under, in order to remedy the production technology ability of some PCB producers, adopt the common formation BGA encapsulation arranged evenly of big shallow bid among the embodiment, enable to accomplish to take into account simultaneously PCB LAYOUT outlet ability and SMT soldering reliability.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. the encapsulation image compensation method of a BGA Package pad is characterized in that, comprises the steps:
In pad pre-set dimension scope, choose the size of pad in the BGA Package figure;
The pad that will be positioned at four angles of described BGA Package pattern edge enlarges on the size basis of choosing, and wherein, the pad size after the expansion is no more than described pad pre-set dimension scope.
2. the method for claim 1, it is characterized in that, the described pad that will be positioned at four angles of described BGA Package pattern edge enlarges on the described size basis of choosing and is specially, and one or more pads that will be positioned at four angles of described BGA Package pattern edge enlarge on the described size basis of choosing in proportion.
3. the method for claim 1 is characterized in that, the shape of pad comprises circle, square, rectangle, oval one of them or combination in any in the described BGA Package figure.
4. the method for claim 1 is characterized in that, further comprises the steps:
Paint film by described BGA Package graphic making guiding principle net and/or welding resistance light after the pad expansion of position, four angles, edge.
5. as the arbitrary described method of claim 1 to 4, it is characterized in that described pad pre-set dimension scope is the recommendation pre-set dimension scope of producer to pad.
6. the encapsulation image compensation arrangement of a BGA Package pad is characterized in that, comprise choosing module, compensating module, wherein:
Choose module, be used in pad pre-set dimension scope, choosing the size of BGA Package figure pad;
Compensating module, the pad that is used for being positioned at four angles of described BGA Package pattern edge enlarges described choosing on the size basis that module chooses, and wherein, the pad size after the expansion is no more than described pad pre-set dimension scope.
7. device as claimed in claim 6, it is characterized in that, the described pad that will be positioned at four angles of described BGA Package pattern edge described choose to enlarge on the size basis that module chooses be specially the one or more pads that will be positioned at four angles of described BGA Package pattern edge and enlarge in proportion described choosing on the size basis that module chooses.
8. device as claimed in claim 6 is characterized in that, the shape of pad comprises circle, square, rectangle, oval one of them or combination in any in the described BGA Package figure.
9. device as claimed in claim 6 is characterized in that, further comprises the making module, is used to paint film by described BGA Package graphic making guiding principle net, welding resistance light after the pad expansion of position, four angles, edge.
10. as the arbitrary described device of claim 6 to 9, it is characterized in that described pad pre-set dimension scope is the recommendation pre-set dimension scope of producer to pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101546376A CN100483701C (en) | 2007-09-17 | 2007-09-17 | An encapsulation image compensation method and device for ball array encapsulation welding tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101546376A CN100483701C (en) | 2007-09-17 | 2007-09-17 | An encapsulation image compensation method and device for ball array encapsulation welding tray |
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| Publication Number | Publication Date |
|---|---|
| CN101127335A true CN101127335A (en) | 2008-02-20 |
| CN100483701C CN100483701C (en) | 2009-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007101546376A Active CN100483701C (en) | 2007-09-17 | 2007-09-17 | An encapsulation image compensation method and device for ball array encapsulation welding tray |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167736A (en) * | 2011-12-16 | 2013-06-19 | 北大方正集团有限公司 | Printed circuit board (PCB) compensation processing method, equipment and PCB |
| CN109905975A (en) * | 2019-03-21 | 2019-06-18 | 清能德创电气技术（北京）有限公司 | A kind of compatible packaging method of electronic component and system |
| CN112651205A (en) * | 2020-12-15 | 2021-04-13 | 广东机电职业技术学院 | Method, system and device for generating printed circuit board plug-in pad and plug-in package |
-
2007
- 2007-09-17 CN CNB2007101546376A patent/CN100483701C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167736A (en) * | 2011-12-16 | 2013-06-19 | 北大方正集团有限公司 | Printed circuit board (PCB) compensation processing method, equipment and PCB |
| CN103167736B (en) * | 2011-12-16 | 2015-10-14 | 北大方正集团有限公司 | A kind of printed circuit board (PCB) compensation deals method, equipment and PCB |
| CN109905975A (en) * | 2019-03-21 | 2019-06-18 | 清能德创电气技术（北京）有限公司 | A kind of compatible packaging method of electronic component and system |
| CN112651205A (en) * | 2020-12-15 | 2021-04-13 | 广东机电职业技术学院 | Method, system and device for generating printed circuit board plug-in pad and plug-in package |
| CN112651205B (en) * | 2020-12-15 | 2022-10-21 | 广东机电职业技术学院 | Method, system and device for generating printed circuit board plug-in pad and plug-in package |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100483701C (en) | 2009-04-29 |
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Address after: 518129 administrative headquarters of Bantian HUAWEI base, Longgang District, Guangdong, Shenzhen A9-2-A10S Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 administrative headquarters of Bantian HUAWEI base, Longgang District, Guangdong, Shenzhen A9-2-A10S Patentee before: Huawei Device Co.,Ltd. |
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Address after: 518129 A9-2-A10S, Administrative Headquarters of Bantian Huawei Base, Longgang District, Shenzhen City, Guangdong Province Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 A9-2-A10S, Administrative Headquarters of Bantian Huawei Base, Longgang District, Shenzhen City, Guangdong Province Patentee before: HUAWEI DEVICE Co.,Ltd. |
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Effective date of registration: 20181218 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 A9-2-A10S, Administrative Headquarters of Bantian Huawei Base, Longgang District, Shenzhen City, Guangdong Province Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |
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