CN101119081A - Semiconductor refrigeration temperature control type ultra- magnetostriction microdisplacement actuator - Google Patents

Semiconductor refrigeration temperature control type ultra- magnetostriction microdisplacement actuator Download PDF

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Publication number
CN101119081A
CN101119081A CNA2007100694258A CN200710069425A CN101119081A CN 101119081 A CN101119081 A CN 101119081A CN A2007100694258 A CNA2007100694258 A CN A2007100694258A CN 200710069425 A CN200710069425 A CN 200710069425A CN 101119081 A CN101119081 A CN 101119081A
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China
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cooling water
resistance
water chamber
end cap
semiconductor cooler
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CNA2007100694258A
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CN101119081B (en
Inventor
邬义杰
徐君
葛荣杰
赵章荣
周刚
冷洪滨
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Zhejiang University ZJU
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Zhejiang University ZJU
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Publication of CN101119081B publication Critical patent/CN101119081B/en
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  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The invention discloses a semiconductor-cooling-and-temperature-control-type giant magnetostrictive micro displacement actuator. The current is used for controlling the drive device to output the displacement and the semiconductor cooler at the both ends of the coil skeleton is used for the temperature control, and moreover a cooling water recycling device is used for provideng heat emission for the heat end of the semiconductor cooler to suppress the temperature increasing of the drive and heat output error to improve the control precision of the displacement output. The actuator of the invention has the advantages of simple structure, relatively small drive current, stable operation and good frequency response. The semiconductor cooling and temperature control technique is adopted to perform rapid cooling and long-time temperature control. The simple structure of the electrical loop, reliable performance and quick response to the temperature change inside the actuator can suppress the heat output error effectively, so the control precision of the displacement output of the actuator can reach the micron grade or higher and can adapt to various poor working conditions. At the same time, the actuator has the advantages of small volume, light weight, large output force and highly precise displacement, can suppress the influence of the thermal deformation on the output displacement of the drive and can be used in the fields of ultraprecise machining and vibration control.

Description

Semiconductor refrigeration temperature control type ultra-magnetostriction microdisplacement actuator
Technical field
The present invention relates to drive unit, especially relate to a kind of semiconductor refrigeration temperature control type ultra-magnetostriction microdisplacement and hold device.
Background technology
Microdisplacement actuator has obtained in fields such as ultraprecise processing, robot, fluid machinery, vibration control, sonar systems to use widely, uses more type at present and mainly contains mechanical type, fluid pressure type and piezoelectric type etc.Mechanical type and the frequency response of fluid pressure type actuator are lower, and power output is less, and the output displacement is difficult to satisfy high-precision requirement; Though piezo actuator displacement resolution and frequency response are all than higher, it is less to exert oneself, and easily produces electrical breakdown, and can produce drift phenomenon.Ultra-magnetostriction microdisplacement actuator has advantages such as big displacement, brute force, fast-response, high reliability, low-voltage driving; But as a kind of electricity (magnetic) machine transducer, the ultra-magnetostriction microdisplacement actuator capacity usage ratio is lower, and except a part was converted into mechanical energy output, most of energy dissipated in the heat energy mode.Because the sealing of actuator inner space, heat dispersion is poor, and particularly under the big current work state of high frequency, temperature is with fast rise, and hot error is remarkable, but prior art is too complicated to the actuator heat error compensation, realizes difficulty.
Summary of the invention
The purpose of this invention is to provide a kind of semiconductor refrigeration temperature control type ultra-magnetostriction microdisplacement actuator, control the final controlling element of output displacement by electric current, semiconductor cooler by the coil rack two ends is implemented temperature control, and dispel the heat for the semiconductor cooler hot junction with cooling water circulating device, realize suppressing actuator temperature rise and thermal deformation errors output, improve output displacement control precision.
In order to achieve the above object, the technical solution adopted in the present invention is made up of mechanical structure and temperature control electric loop two parts, wherein:
Comprise mechanical structure and temperature control electric loop two parts composition, wherein:
1) mechanical structure: comprise down the cooling water chamber base, down cooling water chamber end cap, coil rack, efferent duct, giant magnetostrictive rod, drive coil, shell, go up the cooling water chamber base, go up the cooling water chamber end cap, upper end cover, cross output push rod, precompressed nut, pre-compressed spring, efferent duct, water pump and water tank; The cooling water chamber end cap and first semiconductor cooler down are housed on the following cooling water chamber base shoulder of boss shape, form circular passage down between following cooling water chamber base and following cooling water chamber end cap, following cooling water chamber base central boss is equipped with giant magnetostrictive rod and cross output push rod from bottom to up successively, the vertical midpoint of coil rack that drive coil is housed is equipped with platinum resistance, and be enclosed within down cooling water chamber base shoulder, outside the following straight-bar of giant magnetostrictive rod and cross output push rod, it is outer and be contained in the coil rack upper surface that second semiconductor cooler is contained in the following straight-bar of cross output push rod, first semiconductor cooler, the coil rack and second semiconductor cooler are all cased, the shell lower surface is pressed in down on the cooling water chamber end cap, the following straight-bar that is contained in cross output push rod is outward according to cooling water chamber base and last cooling water chamber end cap on the boss shape are housed, last cooling water chamber end cap also is contained in the shell upper surface, form between cooling water chamber base and last cooling water chamber end cap on the boss shape and go up the circular passage, cross output push rod is equipped with upper end cover outward, on the cross output push rod pre-compressed spring and precompressed nut is arranged; The water tank water pipe is divided into two the tunnel, the one tunnel and connects down the circular passage through first efferent duct behind water pump, the one tunnel connects the circular passage through first efferent duct, and the 3rd efferent duct is communicated with access water tank afterwards with last circular passage and following circular passage.
2) temperature control electric loop: comprise electrical control and main circuit two parts, electric control system is by platinum resistance, first resistance, first adjustable resistance, second resistance, second adjustable resistance, second source, voltage amplifier and direct current relay are formed, platinum resistance is contained in the vertical midpoint of coil rack, be sandwiched between giant magnetostrictive rod and the coil rack, platinum resistance, first resistance, the Gordon Adams Bridge circuit that first adjustable resistance and second resistance are formed, between first resistance and first adjustable resistance, connect second adjustable resistance, second adjustable resistance connects second source, second source is connected between the platinum resistance and second resistance, between the platinum resistance and first resistance, connect the positive terminal of voltage amplifier, between first adjustable resistance and second resistance, connect the negative terminal of voltage amplifier, voltage amplifier output termination direct current relay; Contact, first semiconductor cooler and second semiconductor cooler of the first power-termination the 3rd adjustable resistance, direct current relay, second semiconductor cooler joins with first power positive end again, forms the main circuit part.
The present invention compares the beneficial effect that has with background technology: actuator structure is simple, drive current less (2~4A), working stability, good frequency response (can reach 2000Hz); Adopt the semiconductor refrigeration temperature control technology, refrigeration is rapid and can implement long-time temperature control, and the temperature control electric loop is simple in structure, the fixed and variation of respective actuators internal temperature in time of performance temperature, can effectively suppress hot error output, displacement output control precision can reach submicron order even higher.Volume of the present invention is little, in light weight, power output is big, displacement accuracy is high, can suppress the influence of thermal deformation to actuator output displacement, can be used for fields such as ultraprecise processing, vibration control.
Description of drawings
Accompanying drawing is a structural principle schematic diagram of the present invention.
Among the figure: 1. descend the cooling water chamber base, 2. descend the cooling water chamber end cap, 3. semiconductor cooler, 4. coil rack, 5. efferent duct, 6. giant magnetostrictive rod, 7. drive coil, 8. shell is 9. gone up the cooling water chamber base, 10. goes up the cooling water chamber end cap, 11. upper end cover, 12. crosss output push rod, 13. precompressed nuts, 14. pre-compressed spring, 15. voltage amplifiers, 16. efferent ducts, 17. water pump, 18. water tanks, 19. cooling waters.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
As shown in drawings, the present invention includes and comprise that mechanical structure and temperature control electric loop two parts form, wherein:
1) mechanical structure: comprise down cooling water chamber base 1, down cooling water chamber end cap 2, coil rack 4, efferent duct 5, giant magnetostrictive rod 6, drive coil 7, shell 8, go up cooling water chamber base 9, go up cooling water chamber end cap 10, upper end cover 11, cross output push rod 12, precompressed nut 13, pre-compressed spring, efferent duct 16, water pump 17 and water tank 18; The cooling water chamber end cap 2 and first semiconductor cooler 3 down are housed on following cooling water chamber base 1 shoulder of boss shape, circular passage under following cooling water chamber base 1 and 2 formation of following cooling water chamber end cap, following cooling water chamber base 1 central boss is equipped with giant magnetostrictive rod 6 and cross output push rod 12 from bottom to up successively, coil rack 4 vertical midpoint that drive coil 7 is housed are equipped with platinum resistance Rf, and be enclosed within down cooling water chamber base 1 shoulder, outside the following straight-bar of giant magnetostrictive rod 6 and cross output push rod 12, it is outer and be contained in coil rack 4 upper surfaces that second semiconductor cooler 3 is contained in the following straight-bar of cross output push rod 12, first semiconductor cooler 3, the coil rack 4 and second semiconductor cooler 3 all are contained in the shell 8, shell 8 lower surfaces are pressed in down on the cooling water chamber end cap 2, the following straight-bar that is contained in cross output push rod 12 is outward according to cooling water chamber base 9 and last cooling water chamber end cap 10 on the boss shape are housed, last cooling water chamber end cap 10 also is contained in shell 8 upper surfaces, circular passage in cooling water chamber base 9 and 10 formation of last cooling water chamber end cap on the boss shape, the cross output push rod 12 outer upper end covers 11 that are equipped with have pre-compressed spring 14 and precompressed nut 13 on the cross output push rod 12; Water tank 18 water pipes are divided into two the tunnel, the one tunnel and connect down the circular passage through first efferent duct 16 behind water pump 17, the one tunnel connects the circular passage through first efferent duct 16, and the 3rd efferent duct 5 is communicated with access water tank 18 afterwards with last circular passage and following circular passage.
2) temperature control electric loop: comprise electrical control and main circuit two parts, electric control system is by platinum resistance Rf, first resistance R 1, the first adjustable resistance R2, second resistance R 3, the second adjustable resistance R4, second source U2, voltage amplifier 15 and direct current relay P form, platinum resistance Rf is contained in coil rack 4 vertical midpoint, be sandwiched between giant magnetostrictive rod 6 and the coil rack 4, platinum resistance Rf, first resistance R 1, the Gordon Adams Bridge circuit that the first adjustable resistance R2 and second resistance R 3 are formed, between first resistance R 1 and the first adjustable resistance R2, meet the second adjustable resistance R4, the second adjustable resistance R4 meets second source U2, second source U2 is connected between the platinum resistance Rf and second resistance R 3, between the platinum resistance Rf and first resistance R 1, connect the positive terminal of voltage amplifier 15, between the first adjustable resistance R2 and second resistance R 3, connect the negative terminal of voltage amplifier 15, voltage amplifier 15 output termination direct current relay P; Contact, first semiconductor cooler 3 and second semiconductor cooler, 3, the second semiconductor coolers 3 that the first power supply U1 negative terminal meets the 3rd adjustable resistance R5, direct current relay P join with the first power supply U1 anode again, form the main circuit part.
Described pre-compressed spring is helical spring 14 or disk spring.
By regulating the combination prepressing device that constitutes by output push rod 12, pre-compressed spring 14, upper end cover 11 and precompressed nut 13, can apply different precompressions to giant magnetostrictive rod 6, make giant magnetostrictive rod 6 be in preferable operating state.Under the effect of input current, drive coil 7 will produce driving magnetic field, and giant magnetostrictive rod 6 length are changed.Because 1 pair of giant magnetostrictive rod 6 of cooling water chamber base has supporting role down,, show as the displacement output of ultra-magnetostriction microdisplacement actuator so the length variations amount of giant magnetostrictive rod 6 will externally be exported by output push rod 13.
Under the exciting current effect, the ultra-magnetostriction microdisplacement actuator temperature inside will rise rapidly, and hot error is remarkable.Because influence the main cause of the hot error of ultra-magnetostriction microdisplacement actuator output is the thermal deformation of giant magnetostrictive rod 6, is contained in giant magnetostrictive rod 6 and is used for monitoring giant magnetostrictive rod 6 temperature on every side with platinum resistance Rf in the middle of the coil rack 4; If temperature raises, then the Gordon Adams Bridge circuit of being made up of platinum resistance Rf, resistance R 1, adjustable resistance R2 and resistance R 3 will produce a voltage signal, this signal amplifies and drives direct current relay P through voltage amplifier 15 works, and then the connecting and disconnecting of control temperature control main circuit, realize the semiconductor cooler discontinuous refrigeration.During semiconductor cooler 3 work, its end face can be divided into cold junction and hot junction by refrigeration principle, wherein cold junction and coil rack 4 stick together, and hot junction and upper and lower cooling water chamber stick together; When the temperature control main circuit was connected, semiconductor cooler 3 was started working, and heat is transferred to the hot junction from cold junction, made coil rack 4 temperature reduce; Under the effect of the temperature difference, the heat coils skeleton 4 that drive coil 7 and giant magnetostrictive rod 6 distribute is delivered to the cold junction of semiconductor cooler 3, and takes it to hot junction by semiconductor cooler 3; Cooling water 19 is under the drive of water pump 17, enter cooling water chamber through efferent duct 16, carry out heat exchange by the hot junction of locular wall and semiconductor cooler 3, the heat of exchange is transferred to external environment by current, keep semiconductor cooler 3 hot-side temperatures stable simultaneously, have higher refrigerating efficiency; These steps above repeating can keep the temperature of ultra-magnetostriction microdisplacement actuator constant substantially effectively, realize suppressing actuator temperature rise and thermal deformation errors output, improve output displacement control precision.
Above-mentioned embodiment is used for the present invention that explains, rather than limits the invention, and in the protection range of spirit of the present invention and claim, any modification and change to the present invention makes all fall into protection scope of the present invention.

Claims (2)

1. semiconductor refrigeration temperature control type ultra-magnetostriction microdisplacement actuator is characterized in that comprising mechanical structure and temperature control electric loop two parts composition, wherein:
1) mechanical structure: comprise down cooling water chamber base (1), down cooling water chamber end cap (2), coil rack (4), efferent duct (5), giant magnetostrictive rod (6), drive coil (7), shell (8), go up cooling water chamber base (9), go up cooling water chamber end cap (10), upper end cover (11), cross output push rod (12), precompressed nut (13), pre-compressed spring, efferent duct (16), water pump (17) and water tank (18).Cooling water chamber end cap (2) and first semiconductor cooler (3) down are housed on following cooling water chamber base (1) shoulder of boss shape, form circular passage down between following cooling water chamber base (1) and following cooling water chamber end cap (2), following cooling water chamber base (1) central boss is equipped with giant magnetostrictive rod (6) and cross output push rod (12) from bottom to up successively, the vertical midpoint of coil rack (4) that drive coil (7) are housed is equipped with platinum resistance (Rf), and be enclosed within down cooling water chamber base (1) shoulder, outside the following straight-bar of giant magnetostrictive rod (6) and cross output push rod (12), it is outer and be contained in coil rack (4) upper surface that second semiconductor cooler (3) is contained in the following straight-bar of cross output push rod (12), first semiconductor cooler (3), coil rack (4) and second semiconductor cooler (3) all are contained in the shell (8), shell (8) lower surface is pressed in down on the cooling water chamber end cap (2), the following straight-bar that is contained in cross output push rod (12) is outward according to cooling water chamber base (9) and last cooling water chamber end cap (10) on the boss shape are housed, last cooling water chamber end cap (10) also is contained in shell (8) upper surface, form between cooling water chamber base (9) and last cooling water chamber end cap (10) on the boss shape and go up the circular passage, the outer upper end cover (11) that is equipped with of cross output push rod (12) has pre-compressed spring (14) and precompressed nut (13) on the cross output push rod (12); Water tank (18) water pipe is divided into two the tunnel behind water pump (17), one the tunnel connects down the circular passage through first efferent duct (16), one the tunnel connects the circular passage through first efferent duct (16), and the 3rd efferent duct (5) is communicated with access water tank (18) afterwards with last circular passage and following circular passage.
2) temperature control electric loop: comprise electrical control and main circuit two parts, electric control system is by platinum resistance (Rf), first resistance (R1), first adjustable resistance (R2), second resistance (R3), second adjustable resistance (R4), second source (U2), voltage amplifier (15) and direct current relay (P) are formed, platinum resistance (Rf) is contained in vertically midpoint of coil rack (4), be sandwiched between giant magnetostrictive rod (6) and the coil rack (4), platinum resistance (Rf), first resistance (R1), the Gordon Adams Bridge circuit that first adjustable resistance (R2) and second resistance (R3) are formed, between first resistance (R1) and first adjustable resistance (R2), connect second adjustable resistance (R4), second adjustable resistance (R4) connects second source (U2), second source (U2) is connected between platinum resistance (Rf) and second resistance (R3), between platinum resistance (Rf) and first resistance (R1), connect the positive terminal of voltage amplifier (15), between first adjustable resistance (R2) and second resistance (R3), connect the negative terminal of voltage amplifier (15), voltage amplifier (15) output termination direct current relay (P); First power supply (U1) negative terminal connects contact, first semiconductor cooler (3) and second semiconductor cooler (3) of the 3rd adjustable resistance (R5), direct current relay (P), second semiconductor cooler (3) joins with first power supply (U1) anode again, forms the main circuit part.
2. semiconductor refrigeration temperature control type ultra-magnetostriction microdisplacement actuator according to claim 1 is characterized in that: described pre-compressed spring is helical spring (14) or disk spring.
CN2007100694258A 2007-06-19 2007-06-19 Semiconductor refrigeration temperature control type ultra- magnetostriction microdisplacement actuator Expired - Fee Related CN101119081B (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102519355A (en) * 2011-11-25 2012-06-27 中国科学院光电技术研究所 One-dimensional micro-translation mechanism
CN103049005A (en) * 2012-12-19 2013-04-17 哈尔滨工业大学 Giant magnetostrictive micro-displacement self-sensing driving method and actuator
CN105044872A (en) * 2015-07-31 2015-11-11 上海卫星工程研究所 A satellite optical load mirror surface pose adjusting assembly and method based on precision actuator
CN105840905A (en) * 2016-06-08 2016-08-10 董超超 Hydraulic control butterfly valve system with favorable heating radiating performance
CN107470117A (en) * 2017-08-04 2017-12-15 北京交通大学 A kind of ultra-magnetic telescopic ultrasonic driver with heat-pipe radiator
CN111579141A (en) * 2020-04-10 2020-08-25 一汽解放汽车有限公司 Piezoelectric actuator part packaging pretightening force detection device

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CN102163937A (en) * 2010-12-31 2011-08-24 航天时代电子技术股份有限公司 Driving mechanism for giant magnetostrictive materials

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CN201118468Y (en) * 2007-06-19 2008-09-17 浙江大学 Semiconductor refrigeration temperature control ultra-magnetic flexing micro-shift driver

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102519355A (en) * 2011-11-25 2012-06-27 中国科学院光电技术研究所 One-dimensional micro-translation mechanism
CN102519355B (en) * 2011-11-25 2014-07-09 中国科学院光电技术研究所 One-dimensional micro-translation mechanism
CN103049005A (en) * 2012-12-19 2013-04-17 哈尔滨工业大学 Giant magnetostrictive micro-displacement self-sensing driving method and actuator
CN105044872A (en) * 2015-07-31 2015-11-11 上海卫星工程研究所 A satellite optical load mirror surface pose adjusting assembly and method based on precision actuator
CN105840905A (en) * 2016-06-08 2016-08-10 董超超 Hydraulic control butterfly valve system with favorable heating radiating performance
CN105840905B (en) * 2016-06-08 2018-01-05 曹学者 A kind of hydraulic butterfly valve system with excellent heat dispersion performance
CN107470117A (en) * 2017-08-04 2017-12-15 北京交通大学 A kind of ultra-magnetic telescopic ultrasonic driver with heat-pipe radiator
CN107470117B (en) * 2017-08-04 2023-07-25 北京交通大学 Super magnetostriction ultrasonic actuator with heat pipe radiator
CN111579141A (en) * 2020-04-10 2020-08-25 一汽解放汽车有限公司 Piezoelectric actuator part packaging pretightening force detection device

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