CN101115350A - Circuit board with electromagnetism isolation function and wiring method - Google Patents

Circuit board with electromagnetism isolation function and wiring method Download PDF

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Publication number
CN101115350A
CN101115350A CNA2006100367529A CN200610036752A CN101115350A CN 101115350 A CN101115350 A CN 101115350A CN A2006100367529 A CNA2006100367529 A CN A2006100367529A CN 200610036752 A CN200610036752 A CN 200610036752A CN 101115350 A CN101115350 A CN 101115350A
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CN
China
Prior art keywords
circuit board
storage card
high speed
speed element
element zone
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Granted
Application number
CNA2006100367529A
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Chinese (zh)
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CN101115350B (en
Inventor
郭书铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac Computer Shunde Ltd
Shunda Computer Factory Co Ltd
Mitac International Corp
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Mitac Computer Shunde Ltd
Mitac International Corp
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Application filed by Mitac Computer Shunde Ltd, Mitac International Corp filed Critical Mitac Computer Shunde Ltd
Priority to CN200610036752A priority Critical patent/CN101115350B/en
Publication of CN101115350A publication Critical patent/CN101115350A/en
Application granted granted Critical
Publication of CN101115350B publication Critical patent/CN101115350B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a circuit with electromagnetic isolation functions, comprising a memory card drive circuit area which is used for driving and saving a memory card. In addition, the neighborhood of the memory card drive circuit area is provided with a high speed components area. Between the memory card drive circuit area and the high speed components area, the invention is also provided with a trench used for isolating the noise generated by the memory card drive circuit area.

Description

Circuit board and its wiring method with electromagnetic isolation function
Technical field
The invention relates to a kind of wire structures of circuit board, and particularly relevant for a kind of wire structures with circuit board of electromagnetic interference isolation.
Background technology
In stressing the modern society of information flow, power consumption is low, light to be easy to carry about with one and easy-to-use storage device is more and more paid attention to.Then first-elected storage card or the device such as portable hard drive with unit of flash memory institute one-tenth of the storage device that meets above-mentioned condition.
And universal day by day along with storage card, storage card has the trend that replaces traditional magnetic disk and CD (CD) gradually.Especially as portable digital products such as digital camera, digital camera, MP3 player, personal digital aid (PDA) (PDA), mobile phones, all be to use storage card to be used as the device of storage.At present, the storage card kind of market comprises small size flash memory (Compact Flash, abbreviation CF) card, intelligent media (SmartMedia, abbreviation SM) card, secure digital (Secure Digital, abbreviation SD) card, little disc player (Micro Drive, abbreviation MD) card, memory bar (Memory Stick is called for short MS) and multimedia card (Multimedia Card is called for short MMC).
Fig. 1 illustrates the wiring schematic diagram into a kind of circuit board of existing digital product.Please refer to Fig. 1, on the general circuit board 100 that uses the digital product that storage card is used as storage device, can dispose Storage Card Drivers circuit region 102, is to be used for driving and reading storage card.In addition, in these digital products, also can dispose some high speed elements usually, for example USB connectivity port (USB) etc.Therefore, on existing circuit board 100, also have high speed element zone 104.
When above-mentioned digital product is driving and during accessing memory card, the Storage Card Drivers circuit region will produce noise and the high speed element zone of disturbing adjacency, and produces noise radiation.Therefore, these digital products can't be authenticated by detecting.
Summary of the invention
Therefore, the invention provides a kind of wire structures of circuit board, can isolate effectively by the noise that drives or accessing memory card caused.
The invention provides a kind of circuit board, comprised the Storage Card Drivers circuit region, be used for driving and access one storage card with electromagnetic isolation function.In addition, near the Storage Card Drivers circuit region, also disposed the high speed element zone.It should be noted that the present invention has also disposed a trench between Storage Card Drivers circuit region and high speed element zone, be used for completely cutting off the noise that the Storage Card Drivers circuit region is caused.
From another viewpoint, the invention provides a kind of wiring method of circuit board, be included in configuration one Storage Card Drivers circuit region on the mainboard, with driving and access one storage card, and dispose a high speed element zone, its contiguous Storage Card Drivers circuit region.In addition, meeting of the present invention cuts out a trench between Storage Card Drivers circuit region and high speed element zone, with the isolated noise that is produced by the Storage Card Drivers circuit region.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 illustrates the wiring schematic diagram into a kind of circuit board of existing digital product
Fig. 2 illustrates the structural representation into a kind of 6 layer printed circuit boards
Fig. 3 illustrates to according to the processing procedure of a kind of circuit board of a preferred embodiment of the present invention and the flow chart of steps of wiring method
Fig. 4 illustrates and is the wire bond composition according to a kind of circuit board of a preferred embodiment of the present invention
Embodiment
To have the knack of this skill person and can understand spirit of the present invention really in order to make, therefore earlier make a simple explanation with regard to the structure of mainboard.Yet have the knack of this skill person when knowing, below disclosed board structure of circuit only be to be used for illustrating spirit of the present invention, but be not to be used for limiting the present invention.That is to say that the present invention can be implemented on the circuit board of other structure.
Fig. 2 illustrates the structural representation into a kind of 6 layer printed circuit boards, and Fig. 3 illustrates to according to the processing procedure of a kind of circuit board of a preferred embodiment of the present invention and the flow chart of steps of wiring method.Please merge with reference to Fig. 2 and Fig. 3, wherein the step S301 of Fig. 3 is the fabrication steps of circuit board to S311, therefore sees that first step S301 is to S311.
In general, printed circuit board (PCB) by which floor resin material is bonded together, and inside is to adopt the Copper Foil cabling.Therefore, when the printed circuit board (PCB) of construction drawing 2, can be earlier as described in the step S301, a lower surface layer 201 is provided.Then, as described in step S303, on undersurface layer, form a line layer 203.
And on line layer 203, can form bus plane 205, and, on bus plane 205, form ground plane 207 as described in the step S307 as described in the step S305.Wherein, bus plane 205 and ground plane 207 by comparison, ground plane 207 has noise attentuation effect preferably.
In addition, as described in step S309, on ground plane 207, can form a line layer 209 again, and on line layer 209, then, form a upper surface layer 211 as described in the step S311.In the board structure of circuit that Fig. 2 disclosed, ground plane 207 and bus plane 205 are placed on the centre, be easily holding wire to be made correction.In addition, undersurface layer 201 and upper surface layer 211 the two one of them are as component side, and the two then is as solder side.
Though in the board structure of circuit in Fig. 2, each level all seems to be close together, yet have the knack of this skill person, between the level of being separated by, also can fill favourable dielectric layer as resin material when knowing.In addition, the dielectric layer between the adjacent level can utilize the dielectric material of low-k to realize.
Fig. 4 illustrates and is the wire bond composition according to a kind of circuit board of a preferred embodiment of the present invention.Wherein, the wiring of the circuit board that present embodiment provided can be implemented on undersurface layer 201 and the upper surface layer 211 of Fig. 2, and the present invention is not limited.
Please merge with reference to Fig. 3 and Fig. 4, on circuit board 400, can dispose Storage Card Drivers circuit region 402 as described in the step S313, it is used for driving and the access storage card of CF card etc. for example.In preferred embodiment, in the Storage Card Drivers circuit region 402, most electronic components and storage card connectivity port (not illustrating) have been comprised.Wherein, the storage card connectivity port is the storage card that is used for taking in insertion.
In addition, on mainboard 400, also disposing high speed element zone 404, for example is global positioning system (GPS) connectivity port, voice connectivity port and/or USB (USB) connectivity port.Then, meeting of the present invention can cut out trench 406 as described in the step S315 between Storage Card Drivers circuit region 402 and high speed element zone 404.Wherein, the degree of depth of the undersurface layer 201 of the degree of depth of trench 406 and Fig. 2 or upper surface layer 211 is identical.
Because the present invention is on the undersurface layer 201 or upper surface layer 211 of circuit board, and between Storage Card Drivers circuit region 402 and high speed element zone 404, cut out trench 406.Therefore, between Storage Card Drivers circuit region 402 and high speed element zone 404, can regard a high resistance regions as.When the radio-frequency current on the high speed element zone 404 flow to the border of trench, can be along with original route return current source with relatively low impedance.Therefore, just can avoid the influence that high speed element zone 404 caused by the noise that Storage Card Drivers circuit region 402 is produced, and reach the radiation of the noise that reduces digital product, so that digital product can be by the detection authentication of electromagnetic interference.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.

Claims (15)

1. the circuit board with electromagnetic isolation function is characterized in that, this circuit board comprises:
One Storage Card Drivers circuit region is in order to drive and access one storage card;
One high speed element zone, contiguous this Storage Card Drivers circuit region; And
One trench is disposed between this Storage Card Drivers circuit region and the high speed element zone.
2. the circuit board with electromagnetic isolation function according to claim 1 is characterized in that, more comprises:
One first surface layer;
One first line layer is formed on this undersurface layer;
One bus plane is formed on this first line layer;
One ground plane is formed on this bus plane;
One second line layer is formed on this ground plane; And
One second surface layer is formed on this second line layer, and disposes this Storage Card Drivers circuit region, this high speed element zone and this trench.
3. the circuit board with electromagnetic isolation function according to claim 2 is characterized in that, the degree of depth of this trench is the degree of depth of this second surface layer.
4. the circuit board with electromagnetic isolation function according to claim 1 is characterized in that, more comprises:
One first surface layer disposes this Storage Card Drivers circuit region, this high speed element zone and this trench;
One first line layer is formed on this undersurface layer;
One bus plane is formed on this first line layer;
One ground plane is formed on this bus plane;
One second line layer is formed on this ground plane; And
One second surface layer is formed on this second line layer.
5. the circuit board with electromagnetic isolation function according to claim 4 is characterized in that, the degree of depth of this trench is the degree of depth of this first surface layer.
6. the circuit board with electromagnetic isolation function according to claim 1 is characterized in that, this high speed element zone comprises the global positioning system connectivity port, or this high speed element zone comprises the voice connectivity port.
7. the circuit board with electromagnetic isolation function according to claim 1 is characterized in that, this high speed element zone comprises USB (USB) connectivity port.
8. the circuit board with electromagnetic isolation function according to claim 1 is characterized in that, this storage card comprises a small size flash memory (CF).
9. the circuit board with electromagnetic isolation function according to claim 1 is characterized in that, this Storage Card Drivers circuit region comprises:
Several electronic components; And
One storage card connectivity port is in order to take in this storage card.
10. the wiring method of a circuit board is characterized in that, this method comprises the following steps:
Configuration one Storage Card Drivers circuit region on this mainboard is in order to drive and access one storage card;
Configuration one high speed element zone on this mainboard, and this Storage Card Drivers circuit region of this high speed element region adjacent; And
Between this Storage Card Drivers circuit region and this high speed element zone, cut out a trench.
11. the wiring method of circuit board according to claim 10 is characterized in that, the fabrication steps of this circuit board comprises the following steps:
One first surface layer is provided;
Form one first line layer on this first surface layer;
Form a bus plane on this first line layer;
Form a ground plane on this bus plane;
Form one second line layer on this ground plane; And
Form a second surface once on this second line layer, and this second surface layer disposes this Storage Card Drivers circuit region, this high speed element zone and this trench.
12. the wiring method of circuit board according to claim 10 is characterized in that, the fabrication steps of this circuit board comprises the following steps:
Provide a first surface layer, and this first surface layer disposes this Storage Card Drivers circuit region, this high speed element zone and this trench;
Form one first line layer on this first surface layer;
Form a bus plane on this first line layer;
Form a ground plane on this bus plane;
Form one second line layer on this ground plane; And
Form a second surface once on this second line layer.
13. the wiring method of circuit board according to claim 10 is characterized in that, this high speed element zone comprises the global positioning system connectivity port, or this high speed element zone comprises the voice connectivity port.
14. the wiring method of circuit board according to claim 10 is characterized in that, this high speed element zone comprises USB (USB) connectivity port.
15. the wiring method of circuit board according to claim 10 is characterized in that, this storage card comprises a small size flash memory (CF).
CN200610036752A 2006-07-28 2006-07-28 Circuit board with electromagnetism isolation function and wiring method Expired - Fee Related CN101115350B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200610036752A CN101115350B (en) 2006-07-28 2006-07-28 Circuit board with electromagnetism isolation function and wiring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200610036752A CN101115350B (en) 2006-07-28 2006-07-28 Circuit board with electromagnetism isolation function and wiring method

Publications (2)

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CN101115350A true CN101115350A (en) 2008-01-30
CN101115350B CN101115350B (en) 2010-05-26

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CN200610036752A Expired - Fee Related CN101115350B (en) 2006-07-28 2006-07-28 Circuit board with electromagnetism isolation function and wiring method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101777249B (en) * 2009-06-08 2012-07-25 北京维盛新仪科技有限公司 Anti-electromagnetic interference isolation terminal
CN111132444A (en) * 2018-11-01 2020-05-08 深圳迈瑞生物医疗电子股份有限公司 Multifunctional integrated circuit board and monitor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219255B1 (en) * 1998-08-20 2001-04-17 Dell Usa, L.P. Method and apparatus for reducing EMI in a computer system
CN2414585Y (en) * 2000-01-07 2001-01-10 神达电脑股份有限公司 Noise silencer for multi-layer printed circuit board
CN2526980Y (en) * 2001-12-25 2002-12-18 神达电脑股份有限公司 Zone electromagnetic interference preventing device for integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101777249B (en) * 2009-06-08 2012-07-25 北京维盛新仪科技有限公司 Anti-electromagnetic interference isolation terminal
CN111132444A (en) * 2018-11-01 2020-05-08 深圳迈瑞生物医疗电子股份有限公司 Multifunctional integrated circuit board and monitor
CN111132444B (en) * 2018-11-01 2022-06-17 深圳迈瑞生物医疗电子股份有限公司 Multifunctional integrated circuit board and monitor

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Publication number Publication date
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