CN106815048A - The preparation method of driver element and the display device comprising the driver element - Google Patents
The preparation method of driver element and the display device comprising the driver element Download PDFInfo
- Publication number
- CN106815048A CN106815048A CN201611243194.3A CN201611243194A CN106815048A CN 106815048 A CN106815048 A CN 106815048A CN 201611243194 A CN201611243194 A CN 201611243194A CN 106815048 A CN106815048 A CN 106815048A
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- China
- Prior art keywords
- burning
- flexible pcb
- display device
- driver element
- storage chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/65—Updates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/78—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure storage of data
- G06F21/79—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure storage of data in semiconductor storage media, e.g. directly-addressable memories
Abstract
This application discloses a kind of display device and a kind of preparation method for preparing driver element in display device.The display device includes display panel and driver element；The driver element includes：Flexible PCB；Storage chip, on the flexible PCB, and electrically connects with the flexible PCB；Burning contact, on the flexible PCB, and electrically connects with the storage chip；Burning lead, on the flexible PCB and connects the storage chip and the burning contact；Line of cut, between the storage chip and the burning contact.It is described to include for preparing the preparation method of driver element in display device：There is provided one has the burning device of burning probe；Along line of cut excision burning contact after burning completion.So, the interface for reading data is on the one hand eliminated, the risk that data leak is reduced；On the other hand without doing extra insulation processing to burning contact, processing step is reduced, improves production efficiency.
Description
Technical field
The disclosure relates generally to display technology field, more particularly to a kind of driver element preparation method and comprising the driving
The display device of unit.
Background technology
With the development of Display Technique, in order to lift display effect, the demand of more New functions to showing, hair are met
The technology that addition storage chip realizes these functions is opened up.For example：In order to solve organic electroluminescence display panel luminous efficiency and hair
The problem of light homogeneity, can add the storage chip with compensation function.Flexible PCB 1 is tied in storage chip 11
(FPC) after on, in order to realize that such function just must be to storage chip burning data.Referring to Fig. 1, current way be by
The burning stitch of storage chip is connected to the position of flexible circuit board connector 14 by lead 12, by the burning number of connector 14
According to.The stitch quantity that connector 14 writes interface is which increased, the size of connector will become big, associated lighting jig
Also change is made, it is impossible to meet the demand of client.Consider from Information Security, data are stored in storage chip using connector
In after, after other people take this FPC, can be easy to by connector read storage chip in store information, be unfavorable for
The safety of information.
The content of the invention
In view of drawbacks described above of the prior art or deficiency, expect to provide a kind of display device and a kind of display device institute
Including driver element preparation method, to solve technical problem present in prior art.
On the one hand, this application discloses a kind of display device, the display device includes driver element；The driver element bag
Include：Flexible PCB；Storage chip, on the flexible PCB, and electrically connects with the flexible PCB；Burning is touched
Point, on the flexible PCB, and electrically connects with the storage chip；Burning lead, on the flexible PCB
And connect the storage chip and the burning contact；Line of cut, between the storage chip and the burning contact.
On the other hand, the embodiment of the present application provides the preparation method of the driver element in above-mentioned display device, including：
There is provided one has the burning device of burning probe；
By the burning probe and the burning contact；
Burning program is carried out, completes to withdraw from the burning probe after the burning program；
Along the cutting wire cutting.
According to the scheme of the embodiment of the present application, storage chip is set on flexible PCB, and is set by by burning contact
Put beyond line of cut, cut off after the completion of burning, realizing strengthening existing display function or the realization of display device
The security of information in storage chip can be ensured while display New function.
Brief description of the drawings
By the detailed description made to non-limiting example made with reference to the following drawings of reading, the application other
Feature, objects and advantages will become more apparent upon：
Fig. 1 shows a kind of driver element schematic diagram of the prior art；
Fig. 2A shows the driver element schematic diagram of the application one embodiment；
Fig. 2 B show the schematic diagram after the driver element burning of Fig. 2A；
Fig. 3 A show another driver element schematic diagram of the embodiment of the present application；
Fig. 3 B show the schematic diagram after the driver element burning of Fig. 3 A；
Fig. 4 shows the connection diagram of the driver element and display panel in the application one embodiment；
The step of Fig. 5 A show a kind of driver element preparation method of the embodiment of the present application is schemed；
Fig. 5 B show driver element preparation process schematic diagram in Fig. 5 A embodiments；
Fig. 6 shows a schematic diagram for display device of the application.
Specific embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that, in order to
It is easy to description, the part related to invention is illustrate only in accompanying drawing.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Referring to Fig. 2A, be the application one embodiment in driver element schematic diagram.The display of the application
Device includes display panel and driver element.Wherein, driver element includes：Flexible PCB 1；Storage chip 11, positioned at flexibility
On circuit board 1, and it is connected with flexible PCB electricity 1；Burning contact 120, it is on flexible PCB 1 and electric with storage chip
Connection；Burning lead 12, on flexible PCB 1 and connects storage chip 11 and burning contact 120；Line of cut 13, is located at
Between storage chip 11 and the burning contact 120.Specifically, the information of burning device is drawn by burning contact 120 and burning
Line 12 is transmitted into storage chip 11.Burning lead 12 is set and burning contact 120 is located on flexible PCB 1, can avoid existing
There is burning contact in technology to be arranged on the position of connector 14 so that connector size 14 becomes big, corresponding lighting jig
Corresponding change will be made so that cost increases.In addition, in existing situation, rival after display device is bought very
Data are read easily by connector 14, and be arranged at outside line of cut for burning contact by the application, is cut off after burning completion
Burning contact so that rival cannot read data, so as to protect the safety of information.
Above-mentioned storage chip 11 is different from driving chip of the prior art and touch chip, and it can realize strengthening display
The effect of the existing capability of device, such as：When display data amount is too big, driving chip is insufficient for the treatment of data, now deposits
Storage chip 11 can help driving chip processing data to show more preferably display effect；Its New function that can also realize display,
Such as：In order to solve the problems, such as the luminous efficiency and homogeneity of organic electroluminescence display panel, storage chip 11 can be realized compensating work(
Energy.And realize that the emphasis of function above is exactly the data in storage chip 11, in order to above-mentioned work(is realized in burning in storage chip
Can data just must be provided with burning contact 120, by default program by the data recording in burning device to storage chip
Realizing above-mentioned functions in 11.It is of course also possible to by the data inside the data inside default modification of program or reading,
This just brings the hidden danger of data safety.Therefore, the safety that data are protected while realizing the function of storage chip 11 is this Shen
Core concept please.The application is arranged on outside line of cut by by burning contact so that burning contact is cut off after burning data,
Storage chip 11 is realized having prevented hidden danger of the data by burning contact wrong path while function.
Optionally, driver element is divided into reserved area and cutting area by line of cut 13.Wherein, storage chip 11, flexible circuit
Connector for substrate 14, part burning lead 12 and most of flexible PCB are located at reserved area；Fraction flexible PCB, burning is touched
Point 120 and small part burning lead 12 are located at cutting area.Cutting area is cut by line of cut 13 after burning is completed, referring to figure
2B.In some existing ways, positioned at the burning contact of flexible circuit plate surface need attach insulating tape, increase material into
Sheet and process costs.Material and process costs can be reduced, while also can without insulating tape along cutting area excision burning contact
Enough avoid burning contact is exposed, it is to avoid rival reads the risk that data cause data to leak from burning contact.
In some optional implementation methods of the present embodiment, cutting area is shaped as triangle, and cutting area is located at flexibility
Two angles on neck side of circuit board, it is right that setting cutting area can be reduced to greatest extent positioned at the angle of flexible PCB 1
The change of existing flexible PCB, the area without increasing existing flexible PCB, advantageously reduces cost.As shown in Figure 2 A.
As shown in Figure 2 B, cutting area is removed driver element after cutting, leaves reserved area.Optionally, cutting area has the first area
S1, reserved area has second area S2, the first area S1 less than the 10% of second area S2, i.e. S1<0.1*S2.Flexible circuit
The reserved area of plate 1 will design circuit, if the area of cutting area is larger to be accomplished by doing the design of flexible PCB circuit
Larger adjustment, and the smaller adjustment for needing to make of the area of cutting area is smaller.And cutting area area is small to advantageously reduce thing
Material cost.
It is the schematic diagram of driver element in the present embodiment other optional implementation methods, Fig. 3 B referring to Fig. 3 A
It is the signal type structure chart after the cutting of Fig. 3 A driver elements.Rectangle or pros are shaped as from cutting area unlike Fig. 2A
Shape, cutting area is located at flexible PCB edge 15, where the straight line and flexible PCB edge 15 where the line of cut 13
Straight line parallel or coincidence.Optionally, the straight line where line of cut 13 overlaps with the straight line where flexible PCB edge 15, such as schemes
Shown in 3A.As shown in Figure 3 B, cutting area is removed driver element after cutting, leaves reserved area.The flexible circuit for so setting
Plate 1 increased a cutting area relative to existing flexible PCB, and its flexible PCB circuit trace is designed relative to existing
Flexible PCB without adjustment, the influence very little to flexible PCB cabling reduces flexible PCB circuit design cost.
Optionally, cutting area has the first area S1, and there is second area S2, the first area S1 to be less than second area S2's for reserved area
10%, i.e. S1<0.1*S2.The too conference of cutting area area causes the waste of material and the rising of Material Cost, and cutting area area is small
Advantageously reduce Material Cost.
Fig. 4 is the annexation schematic diagram of driver element and display panel in another embodiment of the application.This implementation
The display device of example includes display panel and driver element.Driver element includes：Flexible PCB；Storage chip 11, positioned at soft
On property circuit board, and electrically connected with flexible PCB；Burning contact 120, on flexible PCB, and is electrically connected with storage chip
Connect；Burning lead 12, on flexible PCB and connects storage chip 11 and burning contact 120；Line of cut 13, positioned at storage
Between chip 11 and the burning contact 120.Specifically, the information of burning device passes through burning contact 120 and burning lead 12
Transmit into storage chip 11.Setting burning lead 12 and burning contact 120 will not increase connector 14 positioned at flexible PCB
Width, it is to avoid change tool, reduces cost.
In some optional embodiments of the application, the display device of the application includes display panel and driver element,
Display panel includes viewing area 100, and around the non-display area 101 of viewing area.Driver element also includes crimping mouth 16, crimps mouth
16 non-display areas 101 for being located at display panel, for communication data between display panel and flexible PCB.
Optionally, storage chip 11 is communicated by flexible PCB, crimping mouth 15 and display panel, and storage chip 11 passes through
Flexible PCB, connector 14 and display device communication data.I.e., it is possible to by the information of display device by storage chip 11
Transmitted after reason to display panel, or the information of display panel is transmitted to display device by after the treatment of storage chip 11, or
The information of display panel after treatment by being back to display panel.Storage chip described here is deposited by default program to it
Storage data, it is also possible to by the data inside default modification of program.Optionally, storage chip here can be code-shaped fast
Dodge memory body (Flash IC), random access memory (RAM), Double Data Rate synchronous DRAM (DDR) or same
Step dynamic RAM (SDRAM) any of which.Preferably, storage chip here is code-shaped fast flash memory bank
(Flash IC).Setting storage chip can help display panel to strengthen the related function of existing display or realize what is added
New function.
Optionally, the display device of the present embodiment includes display panel and driver element, and driver element can also include driving
Dynamic chip 17.As shown in figure 4, driving chip 17 is located on flexible PCB, and electrically connected with flexible PCB.Drive signal by
Display device is transmitted to driving chip 17 from flexible circuit board connector 14, flexible PCB and processed, and the driving that will have been processed
Signal is transferred to display panel by crimping mouth 16, drives the display of display panel.It should be noted that the driving in the application
Chip 17 can also be located at display panel non-display area 101, or those skilled in the art it is conceivable that other positions,
The application is not limited the position of driving chip.
Optionally, the display device of the present embodiment includes display panel and driver element, and driver element can also include touching
Control chip 18, as shown in figure 4, touch chip 18 is located on flexible PCB, and electrically connects with flexible PCB.In display panel
Touching signals transmitted to touch chip 18 by crimping mouth 16 and process touch information, and the information that will process by flexible electrical
Road plate, flexible circuit board connector 14 are transmitted to display device, realize the touch controllable function of display device.It should be noted that this
Touch chip 18 in application can also be located at the non-display area 101 of display panel, or those skilled in the art can think
The other positions for arriving, the application is not limited the position of touch chip.
In addition it is also possible to driving chip and touch chip are merged into same chip, realize driving with chip piece and
The function of touch-control.
The another aspect of the embodiment of the present application provides a kind of preparation method of driver element, for preparing any of the above-described implementation
The driver element of example description, the driver element preparation method of the present embodiment includes：
There is provided one has the burning device of burning probe；
By burning probe and burning contact；
Burning program is carried out, completes to withdraw from the burning probe after the burning program；
Along the cutting wire cutting.
Fig. 5 A for the application a kind of embodiment in driver element preparation method the step of scheme.Fig. 5 B are in Fig. 5 A embodiments
Driver element preparation process schematic diagram.The preparation method of the present embodiment driver element is said with reference to Fig. 5 A and Fig. 5 B
It is bright.It should be noted that driver element preparation method one kind therein of the simply the application shown in Fig. 5 A, the driving of the application
The preparation method not limited to this of unit.
S10：：Burning probe is aligned and contacted by alignment device with the burning contact；Preferably, it is right referring to Fig. 5 A
Burning probe is aligned and contacted by position device by alignment mark 16 with burning contact 120.
S20：：Burning program is carried out, completes to withdraw from the burning probe after burning；By burning device to storage chip
Burning information, more preferably display effect is realized with the New function for realizing display or the disposal ability for improving existing capability.
S30：：Along cutting wire cutting, removal burning contact；Here cutter sweep can be cut using mechanical force can also
It is laser cutting.Optionally, the edge of a knife and line of cut of cutter sweep are carried out contraposition cutting by cutter sweep using alignment mark 16.
Be arranged at outside line of cut 13 for burning contact 120 by the application, and burning contact 120 is cut off after burning completion,
So that rival cannot read data while realizing 11 function of storage chip, the safety of information is protected.
Fig. 6 shows a schematic diagram for display device of the application.In a kind of display device disclosed in the present application such as Fig. 6
It is shown.The display device of the application includes foregoing driver element.Additionally, display device includes viewing area and non-display area.Its
The driver element of middle the application is located at non-display area.So can both strengthen display panel existing capability or complete display with
And other additional functions do not influence the display effect of display panel again.It will be appreciated by those skilled in the art that display device is removed
Include outside flexible PCB as described above, some other known structures can also be included.
In driver element included by the display device of the application, storage chip is set, showing for display panel can be strengthened
The other additional functions of functional or realization；Line of cut is set, burning contact is cut off from line of cut after the completion of burning, can keep away
Exempt to attach the raising of process costs that insulating tape is caused on burning contact, it is also possible to avoid that burning contact is exposed to cause data
The risk for leaking.
The display device of the application can be any device comprising driver element as described above, including but not limited to such as
Cellular mobile phone 1000, panel computer, the display of computer shown in Fig. 6, be applied to it is aobvious in Intelligent worn device
Display device for show device, being applied on the vehicles such as automobile etc..As long as display device contains display disclosed in the present application
The structure of the driver element included by device, has just been contemplated as falling within the protection domain of the application.
It will be appreciated by those skilled in the art that invention scope involved in the application, however it is not limited to above-mentioned technical characteristic
Particular combination technical scheme, while should also cover in the case where the inventive concept is not departed from, by above-mentioned technology
Other technical schemes that feature or its equivalent feature are combined and are formed.Such as features described above with it is disclosed herein
(but not limited to) has the technical scheme that the technical characteristic of similar functions is replaced mutually and formed.
Claims (11)
1. a kind of display device, it is characterised in that including display panel and driver element；
The driver element includes：
Flexible PCB；
Storage chip, on the flexible PCB, and electrically connects with the flexible PCB；
Burning contact, on the flexible PCB, and electrically connects with the storage chip；
Burning lead, on the flexible PCB and connects the storage chip and the burning contact；
Line of cut, between touching positioned at the storage chip and the burning.
2. display device according to claim 1, it is characterised in that：
Flexible PCB is divided into cutting area and reserved area by the line of cut；
The burning contact, the part burning lead and the part flexible PCB are located at the cutting area；
After burning is completed the cutting area is cut off along the line of cut.
3. display device according to claim 2, it is characterised in that the cutting area is shaped as triangle；It is described to cut
Area is cut positioned at two angles of adjacent side of the flexible PCB.
4. display device according to claim 2, it is characterised in that the cutting area is shaped as rectangular or square；
The cutting area is located at the flexible PCB edge, straight line where the line of cut with it is straight where flexible PCB edge
Line is parallel or overlaps, and the cutting area is located at the heteropleural of line of cut with the reserved area.
5. the display device according to claim 3 or 4, it is characterised in that the cutting area has the first area S1, described
Reserved area has second area S2, S1<0.1*S2.
6. display device according to claim 1, it is characterised in that：
By default program to the storage chip data storage, and/or by the data inside default modification of program.
7. display device according to claim 6, it is characterised in that：
The storage chip is code-shaped fast flash memory bank, random access memory, Double Data Rate synchronous DRAM
Or synchronous DRAM it is therein any one.
8. display device according to claim 1, it is characterised in that：
The driver element also include driving chip, the driving chip be located at the flexible PCB on, and with the flexibility
Circuit board is electrically connected, for the driving of the display panel.
9. display device according to claim 1, it is characterised in that：
The driver element also include touch chip, the touch chip be located at the flexible PCB on, and with the flexibility
Circuit board is electrically connected, for the touch controllable function of shown display panel.
10. a kind of preparation method of driver element, for preparing the driving list in claim 1-9 in any display device
Unit, it is characterised in that including：
There is provided one has the burning device of burning probe；
By the burning probe and the burning contact；
Burning program is carried out, completes to withdraw from the burning probe after the burning program；
Along the cutting wire cutting.
The preparation method of 11. driver elements according to claim 10, it is characterised in that：
Alignment mark is set on the flexible PCB；The burning process also includes that the burning probe is touched with the burning
The contraposition process of point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611243194.3A CN106815048B (en) | 2016-12-29 | 2016-12-29 | Manufacturing method of driving unit and display device comprising driving unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611243194.3A CN106815048B (en) | 2016-12-29 | 2016-12-29 | Manufacturing method of driving unit and display device comprising driving unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106815048A true CN106815048A (en) | 2017-06-09 |
| CN106815048B CN106815048B (en) | 2020-10-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611243194.3A Active CN106815048B (en) | 2016-12-29 | 2016-12-29 | Manufacturing method of driving unit and display device comprising driving unit |
Country Status (1)
| Country | Link |
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| CN (1) | CN106815048B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107819A1 (en) * | 2018-11-28 | 2020-06-04 | 武汉华星光电技术有限公司 | Display device and manufacturing method therefor |
| CN114582276A (en) * | 2022-04-08 | 2022-06-03 | 武汉天马微电子有限公司 | Demura burning device, method, equipment and storage medium |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030175471A1 (en) * | 2002-03-18 | 2003-09-18 | Asahi Glass Company, Limited | Method for preparing a glass spacer ring for a magnetic disk and spacer ring |
| CN103049540A (en) * | 2012-12-26 | 2013-04-17 | 深圳瑞高信息技术有限公司 | Method and device for burning large files |
| CN203490437U (en) * | 2013-09-30 | 2014-03-19 | 成都天马微电子有限公司 | Flexible printed circuit board and OTP recording device |
| CN105448337A (en) * | 2014-08-06 | 2016-03-30 | 扬智科技股份有限公司 | Data burning system and data burning method |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
-
2016
- 2016-12-29 CN CN201611243194.3A patent/CN106815048B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030175471A1 (en) * | 2002-03-18 | 2003-09-18 | Asahi Glass Company, Limited | Method for preparing a glass spacer ring for a magnetic disk and spacer ring |
| CN103049540A (en) * | 2012-12-26 | 2013-04-17 | 深圳瑞高信息技术有限公司 | Method and device for burning large files |
| CN203490437U (en) * | 2013-09-30 | 2014-03-19 | 成都天马微电子有限公司 | Flexible printed circuit board and OTP recording device |
| CN105448337A (en) * | 2014-08-06 | 2016-03-30 | 扬智科技股份有限公司 | Data burning system and data burning method |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
Non-Patent Citations (1)
| Title |
|---|
| 张博: ""通过串口给AVR芯片烧录程序"", 《电子制作》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107819A1 (en) * | 2018-11-28 | 2020-06-04 | 武汉华星光电技术有限公司 | Display device and manufacturing method therefor |
| CN114582276A (en) * | 2022-04-08 | 2022-06-03 | 武汉天马微电子有限公司 | Demura burning device, method, equipment and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106815048B (en) | 2020-10-23 |
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Effective date of registration: 20211029 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICRO-ELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Patentee after: Tianma Micro-Electronics Co.,Ltd. Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 200120 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. Patentee before: Tianma Micro-Electronics Co.,Ltd. |