CN101102622B - Making method for vibration film assembly and capacitance microphone - Google Patents
Making method for vibration film assembly and capacitance microphone Download PDFInfo
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- CN101102622B CN101102622B CN2006101054911A CN200610105491A CN101102622B CN 101102622 B CN101102622 B CN 101102622B CN 2006101054911 A CN2006101054911 A CN 2006101054911A CN 200610105491 A CN200610105491 A CN 200610105491A CN 101102622 B CN101102622 B CN 101102622B
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Abstract
By the invention, in the condenser microphone, a vibrating diaphragm assembly whose vibrating diaphragm can't touch the fixed electrode even in case of boosting the bias can be obtained. It comprises: 1) on a surface, for a resin membrane coated with extensible metal material, in case of not applying a tension for the membrane, the binding material is used to bind a ring fixture; 2) using a temperature above the glass transition temperature of the membrane to heat the resin membrane binging with the ring fixture to make it shrink; 3) in case of applying a defined tension on the resin membrane, using a binding material to bind a supporting ring on the resin membrane, and until the bind material is solidified, cutting off the vibrating diagraph from the resin membrane.
Description
Technical field
The present invention relates to the manufacture method of employed vibration film assembly in the condenser microphone, more specifically, even relate to a kind of manufacture method of the vibration film assembly that bias voltage also can operate as normal and condenser microphone of increasing for the sensitivity that improves condenser microphone with this vibration film assembly.
Background technology
In condenser microphone, to be erected on the support ring (diaphragm ring) at the resin film system vibrating membrane that has the metal evaporation film on the face, make vibration film assembly, make this vibration film assembly and fixed electrode via distance piece arranged opposite, form capacitor, the caused electrostatic capacitance change of displacement of the vibrating membrane that utilization is vibrated by sound wave is transformed to the signal of telecommunication with sound wave.
This converter is applied Dc bias (still, except the microphone of vibration detection mode).Bias voltage is depended in the sensitivity of condenser microphone, can improve sensitivity by increasing bias voltage.
But, owing between vibrating membrane and fixed electrode, on vibrating membrane, act on electrostatic attraction, so if apply the above bias voltage of margin of stability, then vibrating membrane attracted to the fixed electrode side, finally contacts with fixed electrode, causes microphone to work.In this case, at first be that the middle body of vibrating membrane contacts with fixed electrode, if further raise bias voltage, then its contact range can be extended to the marginal portion of vibrating membrane.
Summary of the invention
Therefore, problem of the present invention is that in condenser microphone, even obtain a kind of rising bias voltage, vibrating membrane can not contact (absorption) vibration film assembly to the fixed electrode side yet.And provide a kind of and can apply high bias condenser microphone to converter in order to obtain good sensitivity.
In order to solve above-mentioned problem, the invention provides a kind of manufacture method of vibration film assembly, described vibration film assembly is used for condenser microphone, be that the resin film system vibrating membrane that will have the metal evaporation film on a face is installed on the support ring and forms, it is characterized in that, the manufacture method of this vibration film assembly comprises: first operation, on resin film, via the bonding diameter of the bonding agent annular clip bigger than above-mentioned support ring, described resin film has the metal evaporation film that is made of the extensibility metal material on a face under the situation that this resin film is not applied tension force; Second operation to being bonded in the above-mentioned resin film on the above-mentioned annular clip, is heating with the temperature more than the vitrification point of this thin-film material under the situation that does not apply tension force, makes its contraction; With the 3rd operation, above-mentioned resin film is being applied under the state of regulation tension force, via bonding agent bonding above-mentioned support ring on this resin film, by the time after this bonding agent curing, cut out above-mentioned vibration film assembly from above-mentioned resin film.
Thus; in first operation; have on the face on the resin film of the metal evaporation film that constitutes by the extensibility metal material; under the situation that this resin film is not applied tension force via the bonding diameter of bonding agent than the big annular clip of support ring (diaphragm ring); afterwards; in second operation; to being bonded in the resin film on the annular clip; heating with the temperature more than the vitrification point of this thin-film material under the situation that does not apply tension force; make its contraction; thus, remove the internal stress of resin film, in the 3rd operation; under the state that resin film has been applied regulation tension force; via bonding agent bonding support ring on this resin film, after this bonding agent solidifies by the time, cut out vibration film assembly from resin film.In this vibration film assembly, the metal evaporation film is because of its extensibility, produced plastic deformation along the direction extension that applies tension force, and with respect to this, residual in the resin film have an internal stress that is caused by tension force, so on support ring, described tension force makes metal evaporation film side projection to vibrating membrane with the state support that has been applied in tension force.Therefore, by with the metal evaporation film as a side opposite with fixed electrode, and make vibration film assembly and fixed electrode opposed, can utilize remaining internal stress in the resin film, the caused electrostatic attraction of bias voltage that produces between antagonism vibration film assembly and the fixed electrode.When support ring cut off, because remaining internal stress in the resin film will be out of shape in the following manner: with metal evaporation face served as that the outside becomes circle at vibrating membrane that will be by this manufacture method manufacturing.
As preferred scheme, it is characterized in that, in above-mentioned the 3rd operation, heat above-mentioned resin film with the temperature of stipulating.Thus, can be residual in the resin film very big internal stress that causes by tension force.
The present invention also comprises the condenser microphone that possesses the vibration film assembly of making by above-mentioned manufacture method.Promptly, condenser microphone of the present invention comprises converter, this converter is by disposing vibration film assembly opposed to each other via distance piece and fixed electrode constitutes, described vibration film assembly is erected at vibrating membrane and forms on the support ring, it is characterized in that, as above-mentioned vibration film assembly, possesses the vibration film assembly of making by above-mentioned manufacture method.
Thus, by with the metal evaporation film as a side opposite with fixed electrode, and make vibration film assembly and fixed electrode opposed, can utilize the internal stress that remains in the resin film, the caused electrostatic attraction of bias voltage that produces between antagonism vibration film assembly and the fixed electrode, thus, even a kind of higher bias voltage that applies can be provided, vibrating membrane also can operate as normal, highly sensitive condenser microphone.
Description of drawings
Figure 1A～J is the schematic diagram that is used to illustrate each operation that manufacture method comprised of vibration film assembly of the present invention.
Fig. 2 A～C is the local amplification view that is used for illustrating the transition stage of above-mentioned each operation resin film.
Fig. 3 is the view sub-anatomy of an example of the expression converter that condenser microphone of the present invention possessed.
Embodiment
Then, with reference to Fig. 1～Fig. 3 embodiments of the present invention are described, still, the present invention is not limited to this execution mode.Figure 1A～J is the schematic diagram that is used to illustrate each operation that manufacture method comprised of vibration film assembly of the present invention, Fig. 2 A～C is the local amplification view that is used for illustrating the transition stage of each operation resin film, and Fig. 3 is the view sub-anatomy of an example of the expression converter that condenser microphone of the present invention possessed.
In the manufacture method of vibration film assembly of the present invention, at first, prepare the base material of resin film 11 as the vibrating membrane 10 of the condenser microphone shown in Figure 1A.This resin film 11 is the resin film that has metal evaporation film 12 on a face shown in Fig. 2 A, is to comprise at least one piece, female film of the size of the preferred many pieces of vibrating membranes 10 that constitute vibration film assemblies.
The thickness of resin film 11 is chosen as good in the scope of 1～10 μ m, and in addition, the thickness of metal evaporation film 12 is preferably below 1000 dusts more than tens dusts.Vapour deposition method generally adopts vacuum evaporation, but also can adopt other vapour deposition methods.
Then, shown in Figure 1B, resin film 11 is placed on the smooth workbench 21.At this moment, preferably undertaken by Electrostatic Absorption or negative-pressure adsorption etc. temporary fixed, not apply tension force to resin film 11.
Then, shown in Fig. 1 C, D, annular clip 31 is bonded on the resin film 11 by bonding agent 32.At this moment, resin film 11 is not applied tension force yet.Annular clip 31 ring bigger than the support ring 41 of the vibrating membrane shown in Fig. 1 H that for example be diameter, it will be cut off from resin film 11 in final operation.In addition, as bonding agent 32, preferably use silicone encapsulant (RTB rubber).
Shown in Fig. 1 E, after the unnecessary film excision that will stretch out from annular clip 31,, and do not apply tension force so that the temperature that film fully shrinks heats, shown in Fig. 1 F, resin film 11 is shunk.The heating-up temperature of this moment is more than the vitrification point of thin-film material.Preferably in about heating of carrying out more than 120 ℃ more than two hours.In this heating process, resin film 11 shrinks, and its internal stress is removed.
Then, describe the tension force shown in Fig. 1 G～Fig. 1 I and give operation.In this operation, shown in Fig. 1 G, prepare diameter is 31 littler than annular clip, have an even surface workbench 22 and heavy body 23, shown in Fig. 1 H, resin film 11 is placed on the workbench 22, heavy body 23 is added on the annular clip 31.
Thus, on the direction of arrow shown in Fig. 2 B, resin film 11 is applied tension force, and metal evaporation film 12 extends.Under this state, by after for example two component epoxy bonding agent 42 bonds to support ring 41 on the resin film 11,, bonding agent 42 is solidified with 70 ℃ of heating for example about two hours.After bonding agent 42 solidified, the external diameter cut-out film along support ring 41 took out the vibration film assembly 110 shown in Fig. 1 J.
This vibration film assembly 110, tension force is formerly given in the operation, metal evaporation film 12 extends the generation plastic deformation owing to its extensibility along the direction that applies tension force, relative with it, then residual in resin film 11 have an internal stress that is caused by tension force, so, as Fig. 2 C exaggeration expression, vibrating membrane 10 be with the state support that has been applied in tension force on support ring 41, described tension force makes metal evaporation film 12 side projectioies., owing to remain in internal stress in the resin film 11, will be out of shape in the following manner when support ring 41 cuts off at vibrating membrane 10: with metal evaporation film 12 be that the outside becomes and justifies.
In addition, when using ultraviolet hardening bonding agent for example as the bonding agent of support ring 41, do not need to carry out to be used in the operation of Fig. 1 I heating that bonding agent is solidified, but, because residual in resin film 11 have a stronger internal stress that is caused by tension force, so, even when the bonding agent that uses ultraviolet hardening bonding agent etc. not need to heat, also preferred same with above-mentioned example, with 70 ℃ of heating for example about two hours.
In addition, by using annular clip than support ring 41 big several times, can obtain a plurality of vibration film assemblies 110 simultaneously by the elite stand membrane of lipoprotein 11 of a big size as annular clip 31.
Then, according to Fig. 3, the converter 100 that condenser microphone of the present invention possessed is described.In this converter 100, used the vibration film assembly of making by above-mentioned manufacture method 110.
Under this situation, the vibrating membrane 10 of vibration film assembly 110, formerly illustrate, as Fig. 3 exaggerates expression, because of the internal stress that puts on resin film 11 makes metal evaporation film 12 side projectioies, with this state support on support ring 41, so, these metal evaporation film 12 sides are as a side opposite with fixed electrode, and opposed with fixed electrode 120.
Owing to be applied to the Dc bias on the converter 100, between vibrating membrane 10 and fixed electrode 120, produce electrostatic attraction, but, according to the present invention, the internal stress of resin film 11 acts on the direction of leaving from fixed electrode 120, so,, also can alleviate the unfavorable condition that the absorption owing to vibrating membrane causes even increase this bias voltage.Therefore, can realize the condenser microphone that sensitivity and stability are all high.
In addition, the converter 100 of Fig. 3 is expressed as the one-way assembly with rear portion acoustic terminal 122, but its directivity also can be any.And the present invention also can be applied to electret build condenser microphone.
Claims (3)
1. the manufacture method of a vibration film assembly, described vibration film assembly is used for condenser microphone, be that the resin film system vibrating membrane that will have the metal evaporation film on a face is installed on the support ring and forms, it is characterized in that the manufacture method of this vibration film assembly comprises:
First operation, on resin film, via the bonding diameter of the bonding agent annular clip bigger than above-mentioned support ring, described resin film has the metal evaporation film that is made of the extensibility metal material on a face under the situation that this resin film is not applied tension force;
Second operation to being bonded in the above-mentioned resin film on the above-mentioned annular clip, is heating with the temperature more than the vitrification point of this thin-film material under the situation that does not apply tension force, makes its contraction; With
The 3rd operation is applying above-mentioned resin film under the state of regulation tension force, via bonding agent bonding above-mentioned support ring on this resin film, by the time after this bonding agent curing, cut out above-mentioned vibration film assembly from above-mentioned resin film.
2. the manufacture method of vibration film assembly according to claim 1, it is characterized in that, in above-mentioned the 3rd operation, before on above-mentioned resin film after the bonding above-mentioned support ring, from above-mentioned resin film, cutting out above-mentioned vibration film assembly, heat above-mentioned resin film with the temperature of regulation via bonding agent.
3. a condenser microphone comprises converter, and this converter is by disposing vibration film assembly opposed to each other via distance piece and fixed electrode constitutes, and described vibration film assembly is erected at vibrating membrane on the support ring and forms, it is characterized in that,
As above-mentioned vibration film assembly, possesses the vibration film assembly of making by aforesaid right requirement 1 or the described method of claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101054911A CN101102622B (en) | 2006-07-07 | 2006-07-07 | Making method for vibration film assembly and capacitance microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101054911A CN101102622B (en) | 2006-07-07 | 2006-07-07 | Making method for vibration film assembly and capacitance microphone |
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| Publication Number | Publication Date |
|---|---|
| CN101102622A CN101102622A (en) | 2008-01-09 |
| CN101102622B true CN101102622B (en) | 2011-12-14 |
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| CN2006101054911A Expired - Fee Related CN101102622B (en) | 2006-07-07 | 2006-07-07 | Making method for vibration film assembly and capacitance microphone |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5759032B2 (en) * | 2013-02-15 | 2015-08-05 | 興研株式会社 | Loudspeaker |
| JP6618619B2 (en) * | 2016-06-09 | 2019-12-11 | アルプスアルパイン株式会社 | Production method of sound generator |
| CN108489577B (en) * | 2018-03-26 | 2020-02-07 | 温州大学 | Micro-mass sensor |
| CN109379684B (en) * | 2018-10-09 | 2020-05-29 | 歌尔股份有限公司 | Microphone and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5038459A (en) * | 1987-03-04 | 1991-08-13 | Hosiden Electronics Co., Ltd. | Method of fabricating the diaphragm unit of a condenser microphone by electron beam welding |
| CN1655650A (en) * | 2004-02-11 | 2005-08-17 | 瑞声声学科技(深圳)有限公司 | Process for making backing electrode electret condenser type microphones |
| CN1784084A (en) * | 2004-12-03 | 2006-06-07 | 佳乐电子股份有限公司 | Microphone and its producing method |
-
2006
- 2006-07-07 CN CN2006101054911A patent/CN101102622B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5038459A (en) * | 1987-03-04 | 1991-08-13 | Hosiden Electronics Co., Ltd. | Method of fabricating the diaphragm unit of a condenser microphone by electron beam welding |
| CN1655650A (en) * | 2004-02-11 | 2005-08-17 | 瑞声声学科技(深圳)有限公司 | Process for making backing electrode electret condenser type microphones |
| CN1784084A (en) * | 2004-12-03 | 2006-06-07 | 佳乐电子股份有限公司 | Microphone and its producing method |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2002-345089A 2002.11.29 |
| JP特开2005-86273A 2005.03.31 |
| JP特开2006-140861A 2006.06.01 |
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| CN101102622A (en) | 2008-01-09 |
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