CN101097986A - Thermoelectric conversion device and manufacture method of the same - Google Patents
Thermoelectric conversion device and manufacture method of the same Download PDFInfo
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- CN101097986A CN101097986A CNA2007101270991A CN200710127099A CN101097986A CN 101097986 A CN101097986 A CN 101097986A CN A2007101270991 A CNA2007101270991 A CN A2007101270991A CN 200710127099 A CN200710127099 A CN 200710127099A CN 101097986 A CN101097986 A CN 101097986A
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Abstract
A thermoelectric conversion device and a manufacture method for the thermoelectric conversion device are provided. The manufacture method includes a joining process for respectively joining heat exchanging members to thermoelectric-element pairs of an thermoelectric element module, an immersion process for immersing the thermoelectric element module and the heat exchanging members in an immersion sink where an melted insulating material is provided, and a baking process for baking an assembly of the thermoelectric element module and the heat exchanging members where the insulating material has been applied in the immersion process so that an insulating film is formed. Thus, an electrical insulation can be provided while a heat-exchanging capacity and an air-blowing capacity are maintained.
Description
Technical field
The present invention relates to the manufacture method of a kind of thermoelectric conversion device and a kind of thermoelectric conversion device.
Background technology
Usually, with reference to JP-2006-114840A, thermoelectric conversion device is provided with thermoelectric element substrate and a plurality of heat-exchanging part.A plurality of thermoelectric elements are to being arranged on the thermoelectric element substrate, and each of described a plurality of thermoelectric element centerings is to comprising P type thermoelectric element and N type thermoelectric element.All thermoelectric elements are electrically connected to each other.It is right that described heat-exchanging part is provided for thermoelectric element respectively, so that carry out heat exchange with thermoelectric element.
That is, in the case, the face side of thermoelectric element substrate and rear side are divided into heat absorbing side and heat radiation side respectively, and each side in heat absorbing side and the heat radiation side is provided with a plurality of heat-exchanging parts at Qi Chu.Thus, the thermal resistance of heat-exchanging part and thermoelectric element is minimized, thereby conversion efficiency of thermoelectric is improved, and manufacturing cost is reduced.
Yet, in the case because the condensed water that produces at the heat-exchanging part place of heat absorbing side, at the thermoelectric element place and the connecting portion office between thermoelectric element and heat-exchanging part can cause migration.
And all thermoelectric elements are electrically connected in series by the heat-exchanging part of heat absorbing side and the heat-exchanging part of heat radiation side.Thus, voltage is applied on thermoelectric element and the heat-exchanging part when being provided with power supply, and is insulated from each other thereby section construction located adjacent one another becomes.
Do not describe seal among the JP-2006-114840A in detail.Usually, insulating coating or can be used to provide electric insulation by the dielectric film that gas deposition forms.Yet in insulating coating or gas deposition, insulating material sprays from the outside of thermoelectric element substrate.Thus, the dielectric film in the outside can be very thick, and can be very thin at the dielectric film of inboard.That is the variation of thickness, can appear.
Therefore, set according to the film thickness of inboard for the minimum film thickness of electric insulation.Thus, the very thick necessary degree that exceeds thereby the film thickness in the outside will become.Therefore, because the increase of the thermal resistance that thick film causes, heat-exchange capacity will worsen.And, can film occur at narrow gap location and stretch, thereby the air blast resistance of the blast channel of blower system will increase, and the blowability of blower system will worsen.
And the variation of film thickness appears on the direction of channel width of blast channel easily.Therefore, can cause change of wind velocity and variation of temperature, thereby heat-exchange capacity worsens.
And, in the case, because the thermoelectric element substrate of the above-mentioned type is used for small size cooling device or heater, so a plurality of structure elements of for example small thermoelectric element and heat-exchanging part are arranged with many rows with respect to the flow direction of heat transmission medium.Thus, in the case, be difficult to form dielectric film at the thermoelectric element and the heat-exchanging part place that are arranged in inboard row place.
Summary of the invention
Consider above-mentioned shortcoming, the purpose of this invention is to provide a kind of thermoelectric conversion device, wherein in maintaining heat exchange capacity and blowability, provide electric insulation, and a kind of manufacture method of thermoelectric conversion device.
According to a first aspect of the invention, thermoelectric conversion device has the thermoelectric element module, and described thermoelectric element module comprises that a plurality of thermoelectric elements are right, and each of described a plurality of thermoelectric element centerings is to having P type thermoelectric element and the N type thermoelectric element that is one another in series and is electrically connected; With a plurality of heat-exchanging parts, described a plurality of heat-exchanging parts are electrically connected to thermoelectric element.Heat can transmit between thermoelectric element and heat transmission medium by described a plurality of heat-exchanging parts.Described heat-exchanging part is arranged on three rows with respect to the flow direction of heat transmission medium at least.Dielectric film is arranged on by electrodeposition coating on the whole substantially surface of assembly of thermoelectric element module and heat-exchanging part.
Because dielectric film forms by will the thermoelectric element module immersing in the galvanic deposition cell, so can on the whole substantially surface of the assembly of thermoelectric element module and heat-exchanging part, provide dielectric film with uniform thickness.In the case, thermoelectric element and heat-exchanging part are arranged in many rows with respect to the flow direction of heat transmission medium.Thus, dielectric film can be formed uniformly on the thermoelectric element and heat-exchanging part that are arranged on the inboard row.
Because can form dielectric film with predetermined thickness, thus since the deterioration of the blowability of the blower system that causes of thick film and the deterioration of heat-exchange capacity can be reduced.
And, because electrodeposition coating is to be used for applying the method for insulating material by applying voltage on the part that will form dielectric film, can be formed on the current carrying part of thermoelectric element substrate unit so have the dielectric film of uniform thickness.And, because the film that has greater than the thickness of essential value reduces, may be limited to narrow gap location film stretch (stretching) appears.
In addition, because dielectric film is easy to be formed on the coupling part between thermoelectric element and the heat-exchanging part, so can restricted migration (migration).
According to a second aspect of the invention, proposed a kind of manufacture method of making thermoelectric conversion device, described thermoelectric conversion device comprises thermoelectric element module and a plurality of heat-exchanging part.Described thermoelectric element module comprises that a plurality of thermoelectric elements are right, and each of described thermoelectric element centering is to having P type thermoelectric element and the N type thermoelectric element that is one another in series and is electrically connected.Described manufacture method may further comprise the steps: it is right that connection procedure, described connection procedure are used for that heat-exchanging part is connected respectively to thermoelectric element; Dipping process and cure process.Heat can transmit between heat transmission medium and thermoelectric element by heat-exchanging part.Described heat-exchanging part is electrically connected with thermoelectric element, and is arranged at least three rows place with respect to the flow direction of heat transmission medium.In described dipping process, the assembly of thermoelectric element module and heat-exchanging part is dipped in the dipping tank that the insulating material of fusing sets within it, so that by predetermined voltage being applied on the whole substantially surface that on the assembly insulating material is applied to assembly.After connection procedure, carry out dipping process.Cure in the process described, cure in dipping process insulating material and be applied to the thermoelectric element module on it and the assembly of heat-exchanging part, thereby form dielectric film.
Because electrodeposition coating is included in the process of curing and dipping process after the connection procedure that is used to connect thermoelectric element pair and heat-exchanging part, so dielectric film can form by will the thermoelectric element module immersing in the galvanic deposition cell.Therefore, the insulation film with uniform thickness can be arranged on the whole substantially surface of assembly of thermoelectric element module and heat-exchanging part.
In the case, be arranged in many rows' thermoelectric element modules for thermoelectric element and heat-exchanging part with respect to the flow direction of heat transmission medium, dielectric film can be formed uniformly at the thermoelectric element and the heat-exchanging part place that are being arranged in inboard row place.Thus, since the deterioration of the blowability of the blower system that causes of thick film and the deterioration of heat-exchange capacity can be reduced.
And in dipping process, insulating material applies to the assembly of thermoelectric element module and heat-exchanging part by applying voltage, thereby can form the dielectric film with uniform thickness at the current carrying part place of thermoelectric element module.And, because the film that has greater than the thickness of essential value reduces, may be limited to narrow gap location and film occurs and stretch.
In addition, because dielectric film is easy to be formed on the coupling part between thermoelectric element and the heat-exchanging part, so can restricted migration.
Description of drawings
By the detailed description made from reference to the accompanying drawings, other purposes of the present invention, feature and advantage will become more obvious, and accompanying drawing is as follows:
Fig. 1 is the schematic diagram that shows according to the outward appearance of thermoelectric conversion device before fixed part is installed of first embodiment of the invention;
Fig. 2 is the schematic sectional view of making along the line II-II among Fig. 1;
Fig. 3 is schematic sectional view major part, that disassemble that shows according to the thermoelectric conversion device of first embodiment;
Fig. 4 is the schematic diagram of the layout of the P type thermoelectric element of the direction that shows the arrow IV in Fig. 2 thermoelectric element base board unit when seeing and N type thermoelectric element;
Fig. 5 is the schematic sectional view of making along the line V-V among Fig. 2;
Fig. 6 A is the partial section that shows according to the dipping process of first embodiment, and Fig. 6 B is the partial section that shows according to the process of curing of first embodiment;
Fig. 7 A is the schematic diagram that shows heat-exchanging part, Fig. 7 B is the schematic diagram that shows the heat-exchanging part when direction VIIB from Fig. 7 A sees, Fig. 7 C is the schematic sectional view of making along the line VIIC-VIIC among Fig. 7 A, Fig. 7 D is the zoomed-in view of the VIID part among the displayed map 7C, and Fig. 7 E is the zoomed-in view of the VIIE part among the displayed map 7D;
Fig. 8 shows according to the chart that pass through electrodeposition coating (electrodepositioncoating) formation dielectric film of first embodiment and according to the chart of comparative example;
Fig. 9 is the schematic diagram that shows according to the thermoelectric conversion device of second embodiment of the invention;
Figure 10 is the schematic sectional view of making along the line X-X among Fig. 9;
Figure 11 is schematic sectional view major part, that disassemble that shows according to the thermoelectric conversion device of second embodiment;
Figure 12 is the schematic diagram that shows the thermoelectric conversion device of a third embodiment in accordance with the invention;
Figure 13 is the schematic diagram of the layout of the P type thermoelectric element of the direction that shows the arrow XIII in Figure 12 thermoelectric element base board unit when seeing and N type thermoelectric element;
Figure 14 is the schematic sectional view that disassemble of demonstration according to the major part of the thermoelectric conversion device of the 3rd embodiment;
Figure 15 is the schematic sectional view of making along the line XV-XV among Figure 12;
Figure 16 is the zoomed-in view that shows the XVI part among Figure 15;
Figure 17 is the schematic diagram that shows according to the electrodeposition coating method of the 3rd embodiment;
Figure 18 is the schematic sectional view of demonstration according to the major part of the thermoelectric conversion device of fourth embodiment of the invention;
Figure 19 is the zoomed-in view that shows the XIX part among Figure 18;
Figure 20 is the schematic diagram of major part that shows the thermoelectric conversion device of fifth embodiment of the invention; With
Figure 21 is the schematic diagram of major part that shows the thermoelectric conversion device of sixth embodiment of the invention.
Embodiment
First embodiment
Below with reference to the thermoelectric conversion device 100 of Fig. 1-8 description according to the first embodiment of the present invention.Thermoelectric conversion device 100 can be suitable for cooling device or heater.For example, thermoelectric conversion device 100 can be suitable for being installed in the seat air conditioner device on the vehicle.In the case, the seat of vehicle take a seat in part and the back portion each can be provided with thermoelectric conversion device 100, thereby can outwards blow from the surface at seat by the cold air that thermoelectric conversion device cools off.It is desirable to, thermoelectric conversion device 100 is miniaturized so that be installed in the narrow and small vehicle seat of installing space.
As shown in Fig. 1-5, thermoelectric conversion device 100 is provided with thermoelectric element base board unit 10 (thermoelectric element module), and first fin of heat absorbing side (fin: or be called fin) plate unit 20, the second fin plate unit 30 of heat radiation side, and two housing parts 28.
With reference to Fig. 2-5, thermoelectric element substrate 10 comprises P type thermoelectric element 12, N type thermoelectric element 13, electrod assembly 16 and is used to keep the insulated substrate 11 of thermoelectric element 12 and thermoelectric element 13.Thermoelectric element 12, thermoelectric element 13, electrod assembly 16 and form as one each other with insulated substrate 11.
Particularly, insulated substrate 11 substantially the insulating material (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin) of upper plate shape make.Insulated substrate 11 is provided with a plurality of thermoelectric element groups, and described a plurality of thermoelectric element groups are arranged to the pattern of the grid substantially of identical square.Each group in the thermoelectric element group comprises a P type thermoelectric element 12 and a N type thermoelectric element 13.That is, P type thermoelectric element 12 and N type thermoelectric element 13 alternately are arranged on the insulated substrate 11.The end face of thermoelectric element 12 located adjacent one another is connected on the electrod assembly 16 with the end face of thermoelectric element 13 (end face of thermoelectric element 13 is positioned on the side identical with this end face of thermoelectric element 12 with respect to thermoelectric element base board unit 10).
Thermoelectric element 12 (for example being micro component) can be made of P type semiconductor, and described P type semiconductor is made up of Bi-Te compound (bismuth telluride compound).Thermoelectric element 13 (for example being the microminiaturization compound) can be made of N type semiconductor, and described N type semiconductor is made up of Bi-Te compound (bismuth telluride compound).Two end faces of each in the thermoelectric element 12 and 13 (for example, upper surface and lower surface) are outstanding from insulated substrate 11.
As shown in Fig. 2 and 3, the electrod assembly 16 that is arranged in a side (for example upside) of insulated substrate 11 is that electric current flows to the electrode of thermoelectric element 12 (contiguous this thermoelectric element 13) by it from thermoelectric element 13.The electrod assembly 16 that is arranged in the opposite side (for example downside) of insulated substrate 11 is that electric current flows to the electrode of thermoelectric element 13 (contiguous this thermoelectric element 12) by it from thermoelectric element 12.
In the case, by welding (solder) etc., for example apply the pasty state scolder in advance thinly by the mode with silk screen printing (screenprinting) to wait until on the end face, electrod assembly 16 can be connected to the end face of thermoelectric element 12 and thermoelectric element 13.
The first fin plate unit 20 comprises heat-exchanging part 22 (being used for heat absorption) and the insulation board 21 (first holding member) that forms as one each other.Insulation board 21 (holding member) can be made by the insulating material (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin) of cardinal principle upper plate shape.The second fin plate unit 30 comprises heat-exchanging part 32 (being used for heat radiation) and the 3rd insulation board 31 (first holding member) that forms as one each other.Insulation board 31 (holding member) can be made by the insulating material (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin) of cardinal principle upper plate shape.
In heat-exchanging part 22 and the heat-exchanging part 32 each can by conducting metal for example the light sheet material of copper etc. constitute, and have the shape of U-shaped substantially.As shown in Figure 5, heat-exchanging part 22 comprises heat absorption electrode part 25, and described heat absorption electrode part 25 is made of the bottom of the heat-exchanging part 22 with U-shaped shape; With heat exchange section 26, described heat exchange section 26 is from 25 extensions of heat absorption electrode part and have the shape of shutter.Heat-exchanging part 32 comprises heat sink electrodes part 35, and described heat sink electrodes part 35 is made of the bottom of the heat-exchanging part 32 with U-shaped shape; With heat exchange section 36, described heat exchange section 36 is from 35 extensions of heat sink electrodes part and have the shape of shutter.
The heat exchange section 26 that forms as one with heat absorption electrode part 25 is the fin members that are used to absorb the heat that transmits by heat absorption electrode part 25, and can be by cutting formation such as (lancing).The heat exchange section 36 that forms as one with heat sink electrodes part 35 is the fin members that are used to distribute the heat that transmits by heat sink electrodes part 35, and can be by formation such as cuttings.
Heat absorption electrode part 25 and heat sink electrodes part 35 are fixed to insulation board 21 and the 3rd insulation board 31 respectively integratedly in the mode that the end face of heat absorption electrode part 25 and heat sink electrodes part 35 is connected on the electrod assembly 16.
The electrode part 25 of heat-exchanging part 22 is constructed from the outstanding a little mode in the surface of insulation board 21 with the end of heat absorption electrode part 25, and the electrode part 35 of heat-exchanging part 32 is constructed from the outstanding a little mode in the surface of the 3rd insulation board 31 with the end of heat sink electrodes part 35.
That is, electrode part 25 (35) is configured to not be projected into the side of thermoelectric element 12,13 from insulation board 21 (31) when heat absorption electrode part 25 contacts the electrod assembly 16 that is arranged on the thermoelectric element base board unit 10 with heat sink electrodes part 35.
Heat-exchanging part 22 with the patterned arrangement of the grid substantially of identical square on insulation board 21, and the preset distance that is spaced apart from each other, thus heat-exchanging part 22 is insulated from each other.Heat-exchanging part 32 with the patterned arrangement of the grid substantially of identical square on the 3rd insulation board 31, and the preset distance that is spaced apart from each other, thus heat-exchanging part 32 is insulated from each other.
Described electrod assembly 16 is arranged and be connected to the heat absorption electrode part 25 of heat-exchanging part 22 corresponding to the electrod assembly 16 of upside.Described electrod assembly 16 is arranged and be connected to the heat sink electrodes part 35 of heat-exchanging part 32 corresponding to the electrod assembly 16 of downside.
As shown in Fig. 2 and 3, it is distolateral (for example that fixed part 23 and fixed part 33 (each in the fixed part 23 and 33 constitutes second holding member and is insulation board) are arranged in two of the space that is limited in the housing parts 28, top side and lower side), with the end (for example lower end) of the end that keeps heat-exchanging part 22 respectively (for example upper end) and heat-exchanging part 32.Thus, adjacent heat-exchanging part 22 (32) preset distance that can be spaced apart from each other, and be electrically insulated from each other.
In fixed part 23 and the fixed part 33 each can be by the insulating material of cardinal principle upper plate shape (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin) make, and be provided with a plurality of fixing hole (not shown)s, the end of heat-exchanging part 22 (32) is inserted through described a plurality of fixing hole.
As shown in fig. 1, be connected with thermoelectric element 13 with the thermoelectric element 12 of the two ends that are in insulation board 11 respectively (for example, left end and right-hand member) respectively as splicing ear 24a, the 24b of power supply terminal.Splicing ear 24a can further be connected with the positive terminal of DC power supply (not shown), and splicing ear 24b can further be connected with the negative terminal of DC power supply.
Thus, being arranged in a plurality of electrod assemblies 16 of upside and a plurality of heat-exchanging part 22 is electrically connected with the first end (for example upper end) of P type thermoelectric element 12 and the first end (for example) of N type thermoelectric element 13.The a plurality of electrod assemblies 16 and a plurality of heat-exchanging part 32 that are arranged in downside are electrically connected with the second end (for example lower end) of P type thermoelectric element 12 and the second end (for example lower end) of N type thermoelectric element 13.
When voltage is applied on the splicing ear 24a, direct current will be by being arranged in downside thermoelectric element 12 series connection in electrod assembly 16 left side from Fig. 2 flow to thermoelectric element 13, flow to thermoelectric element 12 by electrod assembly 16 thermoelectric element 13 series connection from then on that are arranged in upside then.
In the case, the electrod assembly 16 of downside that is arranged in the PN coupling part is because peltier effect (Peltier effect) has very high state of temperature, and the electrod assembly 16 that is arranged in the upside of PN coupling part has very low state of temperature.That is, the heat exchange section 26 that is arranged in upside is configured for absorbing from the heat transmission medium (contact heat exchange section 26) that will be cooled the heat exchange section of heat.The heat exchange section 36 that is arranged in downside is configured for heat is dispersed into the heat exchange section of the heat transmission medium (contact heat exchange section 36) that is used to cool off.
As shown in Figure 2, housing parts 28 can be formed in the air duct (described air duct is separated from each other by thermoelectric element base board unit 10) of the both sides (for example above-below direction) of thermoelectric element base board unit 10 respectively.For example the heat transmission medium of air flows through air duct so that carry out heat exchange with heat exchange section 26 and heat exchange section 36.Therefore, under the situation of thermoelectric element base board unit 10 as partition wall, air can be cooled at heat exchange section 26 places of upside, and is heated at heat exchange section 36 places of downside.
In this embodiment, the positive terminal of DC power supply is connected with splicing ear 24a, and the negative terminal of DC power supply is connected with splicing ear 24b, thereby direct current is imported into splicing ear 24a.Alternatively, the positive terminal of DC power supply can be connected with splicing ear 24b, and the negative terminal of DC power supply can be connected with splicing ear 24a, thereby direct current is imported into splicing ear 24b.In the case, the heat exchange section that upside heat-exchanging part 22 is configured for dispelling the heat, and the heat exchange section that the heat-exchanging part 32 of downside is configured for absorbing heat.
According to this embodiment, dielectric film is arranged on the whole substantially surface of assembly of thermoelectric element module 10 and heat-exchanging part 22,32.
The manufacture method of thermoelectric conversion device 100 will be described below.
As shown in Fig. 3 and 4, a plurality of P type thermoelectric elements 12 and a plurality of N type thermoelectric element 13 alternately are arranged in the place, hole that is arranged on the insulated substrate 11 with the pattern of the grid substantially of identical square, so that constitute integratedly with insulated substrate 11.Thus, adjacent one another are and be arranged in the thermoelectric element 12 at insulated substrate 11 places and each two end faces in the thermoelectric element 13, wait by welding to be connected to electrod assembly 16 respectively, thereby thermoelectric element 12 and electrod assembly 16 are connected in series.
Thus, thermoelectric element 12, thermoelectric element 13 and electrod assembly 16 form as one with insulated substrate 11, thereby constitute thermoelectric element base board unit 10.The NP coupling part is made of the electrod assembly 16 that is arranged in upside, and the PN coupling part is made of the electrod assembly 16 that is arranged in downside.The electrical connection that is one another in series of thermoelectric element 12 and thermoelectric element 13.
Alternatively, thermoelectric element 12, thermoelectric element 13 and electrod assembly 16 also can be assembled by using erector, and described erector is to be used for semiconductor or electronic component are connected to manufacturing installation on the control basal plate.In the case, when the size of thermoelectric element 12,13 during greater than 1.5mm * 1.5mm, thermoelectric element 12,13 can be easy to picked so that assembled, and has improved productivity ratio.
Then, heat absorption electrode part 25 is inserted in the conjugate foramen that is arranged on the insulation board 21, and heat-exchanging part 22 is picked and be arranged on the insulation board 21.Thus, constitute the first fin plate unit 20.Heat sink electrodes part 35 is inserted in the conjugate foramen that is arranged on the insulation board 31, and heat-exchanging part 32 is picked and be arranged on the insulation board 31.Thus, constitute the second fin plate unit 30.
After this, carry out connection procedure.In the case, thermoelectric element base board unit 10 is sandwiched between the first fin plate unit 20 and the second fin plate unit 30 so that assembled, and electrode part 25 contact with electrod assembly 16 respectively with 35, so that be connected to each other together by welding grade.
Alternatively, in connection procedure, the first fin plate unit 20 also can be superimposed upon on the thermoelectric element base board unit 10, thereby electrod assembly 16 and heat absorption electrode part 25 contact with each other and only be connected to each other on single side surface.After this, thermoelectric element base board unit 10 is reversed to be superimposed upon on the second fin plate unit 30, and electrod assembly 16 and heat sink electrodes part 35 are connected to each other then.
Then, in the fixed part assembling process, the end of heat-exchanging part 22 (described end heat-exchanging part 22 with relative side heat absorption electrode part 25) is arranged in the fixing hole of fixed part 23 so that be fixed.The end of heat-exchanging part 32 (described end heat-exchanging part 32 with relative side heat sink electrodes part 35) is arranged in the fixing hole of fixed part 33 so that be fixed.Thus, heat-exchanging part 22 (32) the located adjacent one another preset distance that can be spaced apart from each other is so that electric insulation.
Next, carry out electrodeposition coating (electrodeposition coating: or be called electrophoretic painting) so that the first fin plate unit 20, the second fin plate unit 30, fixed part 23 and fixed part 33 are assembled on the thermoelectric element base board unit 10.Electrodeposition coating comprises the process of curing shown in the dipping process shown in Fig. 6 A and Fig. 6 B.
In dipping process, with reference to Fig. 6 A, the thermoelectric element base board unit 10 that the heat-exchanging part 32 of the heat-exchanging part 22 of the first fin plate unit 20 and the second fin plate unit 30 is connected thereto immerses in the galvanic deposition cell 60, in galvanic deposition cell 60, for example the insulating material of the electrocoating paint of electrolytic types is melted, thereby insulating material is applied on the whole substantially surface of assembly.In the case, bringing device (applying device) is electrically connected with the splicing ear 24a and the splicing ear 24b of the first fin plate unit 20, thereby predetermined voltage is applied in.Thus, predetermined dip time section can be set.
In the process of curing, with reference to Fig. 6 B, the insulating material that (in dipping process) is applied on the outer surface of assembly (the thermoelectric element base board unit 10 and the heat-exchanging part 22 and 32 that comprise assembling) is cured, thereby produces dielectric film.In the case, the thermoelectric element base board unit 10 that has carried out dipping process is arranged in the constant temperature bath (or temperature bath) 70, in constant temperature bath 70, set predetermined stoving temperature, thereby insulating material is cured.
So, be applied to thermoelectric element base board unit 10, heat-exchanging part 22 and fixed part 23 connected lip-deep liquid insulating materials are hardened in the atmosphere of high temperature.Thus, produce dielectric film with predetermined thickness.In the case, for example stoving temperature, the condition of curing of curing the time period and curing number of times etc. can be changed, thereby firm time section, film thickness and the film density etc. of dielectric film can obtain adjusting.
For example, cure and to be performed repeatedly (for example, the process of curing to comprise partly in proper order cure (half baking), centre cure (intermediate baking) and finish and cure (finishingbaking)).In the case, stoving temperature and cure the time period and can correspondingly set.
According to above-mentioned electrodeposition coating, insulating material can be applied on the whole substantially surface of thermoelectric element substrate 10, heat-exchanging part 22 and heat-exchanging part 32.In the case, voltage is applied to splicing ear 24a and splicing ear 24b.Thus, predetermined voltage can be applied to the current carrying part of thermoelectric element base board unit 10, i.e. all in thermoelectric element 12 and thermoelectric element 13 and electrod assembly 16 and heat-exchanging part 22 and 23.
Thus, insulating material can be applied to the part that has applied voltage.And dielectric film can be applied equably, because the thickness of dielectric film is determined in response to the voltage that applies.In the case, insulating material is not applied to the part that does not apply voltage.That is, dielectric film is not formed on insulated substrate 11, insulation half the 21, the 3rd insulation board 31 etc.That is, the spray method that sprays compared to insulating material from the outside, the stretching of film can obtain restriction.
In this embodiment, the active type electrocoating paint of electrolysis (electrolytic active typeelectrodeposition paint) waits and can be used as the insulating material that is melted in the galvanic deposition cell.The material that the active type electrocoating paint of electrolysis can be increased by the ratio of the resin material on the covering limit in the base resin material of wherein being made by denaturation loop epoxy resins (denatured epoxy) is made, thereby dielectric film can be formed uniformly.The resin material that covers the limit is the resin material that has high viscosity in the insulating material in being melted in galvanic deposition cell the time.
In the case, the resin material on base resin material and covering limit is an insulating material.When the resin material on base resin material and covering limit was melted in the galvanic deposition cell, the viscosity of base resin material can increase.That is,, can confined liquid when applying the active type electrocoating paint of electrolysis sagging because the resin material on the covering limit in the base resin material increases.That is, when product takes out, can obtain restriction from galvanic deposition cell at the liquid that is applied to the electrocoating paint place on the edge surface sagging (causing) by surface tension.
In this embodiment, thermoelectric element 12, thermoelectric element 13, electrod assembly 16, heat-exchanging part 22 and heat-exchanging part 32 can be micro components, and are arranged in many rows (or row) with respect to the flow direction of heat transmission medium.In the case, dielectric film can form substantially by using the active type electrocoating paint of electrolysis.This obtains describing with reference to Fig. 7 A-8.
Fig. 7 A and 7B have shown heat-exchanging part 22 and fixed part 23, and wherein heat exchange section 26 and heat exchange section 36 (described heat exchange section 26 and heat exchange section 36 have the shape of shutter) are protruding from heat absorption electrode part 25 and heat sink electrodes part 35 respectively.
Fig. 7 C is the sectional view of making along the line VIIC-VIIC among Fig. 7 B, is used to show the heat exchange section 26 with shutter shape and the shape of heat exchange section 36.Zoomed-in view when Fig. 7 D is the passing through microscope and watch of VIID part among Fig. 7 C is used to show the top ends of heat exchange section 26,36 formed outwards outstanding edge surface at described top ends place.
Fig. 7 E is the zoomed-in view of the VIIE part among Fig. 7 D when seeing by microscope, is used to show the top ends of heat exchange section 26,36, and the place has formed acute angle shape in described top ends.And in the case, each in heat exchange section 26 and the heat exchange section 36 is provided with wherein that each comprises a plurality of parts of the edge surface that for example has acute angle shape.
Fig. 8 has shown the insulating material of this embodiment and according to the insulating material of the common base resin material of the use of comparative example.
According to comparative example, as shown in Figure 8, insulating resin is formed uniformly around base resin in dipping process.Yet, in the molten state of the process of curing, liquid sagging (being caused by surface tension) can appear at the insulating resin place that applies.That is, at edge surface, insulating resin is because liquid is sagging with attenuation.Thus, when providing under this state when curing, edge surface will expose and not be insulated film and cover.
According to this embodiment of the invention, in the molten state of the process of curing because cover the viscosity of increase of the resin material on limit, can confined liquid sagging, thereby may be limited to the dielectric film attenuation at edge surface place.When process is cured in execution under this state, can form dielectric film (being included in the dielectric film at edge surface place) with predetermined thickness.Thus, can be formed uniformly dielectric film substantially.Therefore, can provide dielectric film with predetermined thickness.
Therefore, thermoelectric element 12,13, electrod assembly 16, heat exchange section 22 and heat exchange section 32 can be electrically insulated from each other.And, be arranged in thermoelectric element 12,13, electrod assembly 16, the gap between the adjacent part of heat exchange section 22 and heat exchange section 32 can reduce.
And in this embodiment, a plurality of heat-exchanging parts 22 (32) are arranged to many rows on the flow direction of heat transmission medium.When carrying out dipping process and curing process, can form dielectric film in the inside of the thermoelectric element on the inboard that is arranged in thermoelectric element base board unit 10 12, thermoelectric element 13, electrod assembly 16, heat exchange section 22 and heat exchange section 32 with uniform thickness.Especially, be arranged under three rows or more rows' the situation at thermoelectric element 12 and 13, electrod assembly 16, heat exchange section 22 and heat exchange section 32 flow direction with respect to heat transmission medium, the improvement that forms dielectric film is very obvious.
In dipping process, the immersion condition that comprises the voltage that applies, dip time section, dipping number of times etc. can be changed with the thickness of adjusting dielectric film, density etc.For example, in dipping process, product can be dipped into for several times, thereby dielectric film can be applied to the part that dielectric film did not apply in last time.And, the thickness that voltage that applies by change and dip time can be adjusted dielectric film.
After electrodeposition coating is finished, thereby the side surface of the housing parts 28 of the upper surface of execution assembling insulation board 21 and upside is within it around the space that limits an air duct.Similarly, the side surface of the housing parts 28 of the lower surface of the 3rd insulation board 31 and downside is within it around the space that limits another air duct.
Thus, be used to upside and the downside that heat exchange section that absorbs heat and the heat exchange section that is used to dispel the heat are respectively formed at thermoelectric element base board unit 10.In the case, can provide air flowing through heat exchange section, thereby can obtain cold air and hot-air.
According to this embodiment, the gap location between heat-exchanging part 22 and heat-exchanging part 32 can limit and the film stretching occur.And dielectric film can be formed uniformly by electrodeposition coating at heat-exchanging part 22 and heat-exchanging part 32 places, and is even thereby the wind speed profile of the air duct of heat exchange section and Temperature Distribution can become.And the air blast performance of the blower system of seat air conditioner device etc. can be improved.Except the seat air conditioner device, thermoelectric conversion device 100 also can be used to cool off the element that produces heat, for example heat in semiconductor or electronic component and the cooling/heating apparatus.
According to this embodiment, dielectric film is formed on thermoelectric element base board unit 10 places (wherein heat-exchanging part 22 is connected with 32) by the electrodeposition coating with dipping process and the process of curing.In the case, thermoelectric element base board unit 10 can be immersed in the galvanic deposition cell, thereby forms dielectric film.Therefore, the thermoelectric element base board unit 10 that is connected thereto of heat-exchanging part 22 and heat-exchanging part 32 can be provided with the dielectric film with substantially uniform thickness.
Especially, thermoelectric element base board unit 10 is provided with a plurality of thermoelectric elements 12 (13), and described a plurality of thermoelectric elements 12 (13) are arranged in many rows on the flow direction of heat transmission medium.And thermoelectric element base board unit 10 is provided with a plurality of heat-exchanging parts 22 (32), and described a plurality of heat-exchanging parts 22 (32) are arranged in many rows on the flow direction of heat transmission medium.In the case, dielectric film can be formed uniformly the inside at the thermoelectric element 12, thermoelectric element 13, electrod assembly 16, heat-exchanging part 22 and the heat-exchanging part 32 that are arranged in inboard row place.Thus, can form dielectric film with predetermined thickness, and since the deterioration of the blowability of the blower system that causes of thick film and the deterioration of heat-exchange capacity can be reduced.
And, because electrodeposition coating is a kind ofly to apply the method for insulating material by applying voltage to the part that will form dielectric film, locate to form dielectric film with uniform thickness at the current carrying part (being thermoelectric element 12, thermoelectric element 13, electrod assembly 16, heat-exchanging part 22 and heat-exchanging part 32) of thermoelectric element base board unit 10.
And because the film greater than the thickness of essential value appears having in restriction, the film that may be limited to narrow gap location stretches.Because dielectric film is not formed on the part (being insulated substrate, insulation board 21 and the 3rd insulation board 31) that voltage does not apply, can limit the increase of the pressure loss of blower system.Thus, the blowability of blower system is improved.
And, because dielectric film can be easy to be formed on and be arranged in inboard thermoelectric element 12 (13) and locate, and being easy to be formed on connecting portion office between heat-exchanging part 22 (23) and the thermoelectric element 12 (13), migration can obtain limiting.
In the case, each in the heat-exchanging part 22 and 32 is made of thin plate and is provided with a plurality of edge surfaces with acute angle, to play the effect of heat absorbing part or radiator portion.Insulating material comprises the resin material that covers the limit, and the resin material on described covering limit is to have the very resin material of high viscosity in the insulating material in being melted in galvanic deposition cell the time.Thus, when thermoelectric element base board unit 10 (under insulating material has been applied to situation in the galvanic deposition cell) takes out from galvanic deposition cell so that when curing, it is sagging from edge surface to reduce liquid.Therefore, can form dielectric film with predetermined thickness.
According to this embodiment, thereby after dipping process execution several insulating material can be applied to the part that did not apply insulating material last time, carry out the process of curing.Therefore, can provide dielectric film fully with predetermined thickness.
As mentioned above, the immersion condition in the dipping process comprises voltage, dip time section and the dipping number of times etc. that apply.In carrying out dipping process for several times, can change immersion condition with respect to different number of times, thereby can be formed uniformly dielectric film with predetermined thickness.
The condition of curing of curing in the process comprises stoving temperature, cures the time period and cures number of times.The process of curing can repeat for several times, and the condition of curing can change with respect to different number of times.Therefore, can be formed uniformly dielectric film with predetermined thickness.
According to this embodiment, thermoelectric conversion device 100 can be suitable for the seat air conditioner device.Yet thermoelectric conversion device 100 is not limited to be used for vehicle.For example, thermoelectric conversion device 100 also can be used for cooling device or heater that the air that blows from amber ear card (Peltier) element is cooled off or heats.
(second embodiment)
Below with reference to Fig. 9-11 second embodiment of the present invention is described.In this embodiment, omitted electrod assembly 16 in the thermoelectric conversion device 100.
According to second embodiment, the heat absorption electrode part 25 of heat-exchanging part 22 and the heat sink electrodes part of heat-exchanging part 32 35 are held concurrently and are electrod assembly.In the case, electrode part 25 (35) direct contact heat electric devices 12 and 13 a pair of so that be electrically connected in series with thermoelectric element 12 and 13, described thermoelectric element 12 and 13 is arranged on the insulated substrate 11 and is located adjacent one another.
Particularly, the heat absorption electrode part 25 that is arranged in upside constitutes electric currents and flows to the electrode of thermoelectric element 12 (contiguous this thermoelectric element 13) by it from thermoelectric element 13, and the heat sink electrodes part 35 that is arranged in downside constitutes electric currents and flows to the electrode of thermoelectric element 13 (contiguous this thermoelectric element 12) from thermoelectric element 12 by it.
In the case, become by very thin and apply equably by silk screen printing (screen printing), the pasty state scolder can be applied on the end face of thermoelectric element 12,13 in advance.Thus, heat absorption electrode part 25 and heat sink electrodes part 35 are connected on the end face of thermoelectric element 12,13 by welding (soldering).
Owing to omitted electrod assembly 16, therefore can reduce element cost and assembly cost.
By welding (solder) etc., for example by with mode apply the pasty state scolder in advance thinly and wait until on the end face that electrod assembly 16 can be connected to the end face of thermoelectric element 12 and thermoelectric element 13.
For the thermoelectric conversion device 100 and the manufacture method thereof that do not have in a second embodiment to describe, can with first embodiment in identical.
The 3rd embodiment
Below with reference to Figure 12-17 third embodiment of the present invention is described.
As shown in Figure 12, thermoelectric conversion device 100 comprises thermo-electric conversion module 200, and described thermo-electric conversion module 200 is provided with thermoelectric element base board unit 10; The first fin plate unit 20 and the second fin plate unit 30; With housing parts 28,38, thermo-electric conversion module 200 is contained in the described housing parts 28,38.
With reference to Figure 12-15, thermoelectric element base board unit 10 has a plurality of P type thermoelectric elements 12 and a plurality of N type thermoelectric element 13 and the insulated substrate 11 (holding member) that forms as one each other.Particularly, a plurality of conjugate foramens with the patterned arrangement of the grid substantially of identical square on insulated substrate 11, described insulated substrate 11 is made by the insulating material with plate shape shape (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin).A plurality of thermoelectric elements 12 and 13 are arranged in the conjugate foramen place, and alternately are arranged on the insulated substrate 11.
Two end faces of each in the thermoelectric element 12,13 (for example, upper surface and lower surface) are outstanding from insulated substrate 11.In this embodiment, the thermoelectric element 12,13 with about 1.5 square millimeters size remains on the insulated substrate 11.
As shown in Figure 12,14 and 15, the first fin plate unit 20 comprises a plurality of heat-exchanging parts 22 (being used for heat absorption), insulation board 21 (first holding member) and the fixed part 23 (second holding member) that forms as one each other.Insulation board 21 can be made by the insulating material (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin) of cardinal principle upper plate shape shape.
The second fin plate unit 30 comprises a plurality of heat-exchanging parts 32 (being used for heat radiation), fixed part 33 (second holding member) and the 3rd insulation board 31 (first holding member) that forms as one each other.The 3rd insulation board 31 can be made by the insulating material (for example, glass-epoxy, phenolic resins, PPS resin, LCP resin or PET resin) of cardinal principle upper plate shape shape.
Particularly, each in insulation board 21, fixed part 23, the 3rd insulation board 31 and the fixed part 33 is provided with a plurality of conjugate foramens thereon, and described a plurality of conjugate foramens are arranged in the pattern of the grid substantially of identical square.Heat-exchanging part 22 remains on the conjugate foramen place of insulation board 21 and fixed part 23, and heat-exchanging part 32 remains on the conjugate foramen place of the 3rd insulation board 31 and fixed part 33.Thus, can be spaced apart from each other preset distance and being electrically insulated from each other of heat-exchanging part 22 located adjacent one another, and can be spaced apart from each other preset distance and being electrically insulated from each other of heat-exchanging part 32 located adjacent one another.
And electrod assembly 22 and 32 is respectively arranged with heat exchange section 26 (heat absorbing part) and heat exchange section 36 (radiator portion). Heat exchange section 26,36 is outwards outstanding from electrode part 25,35, and has the shutter shape.For example, electrod assembly 22,32 can be that the flat-form material of about 0.2mm-0.3mm constitutes by thickness, so that have the manufacturing property of wanting.
The electrode part 25 of heat-exchanging part 22 is connected (for example by welding) thermoelectric element 12 and thermoelectric element 13 to thermoelectric element base board unit 10 respectively with the electrode part 35 of heat-exchanging part 32.Particularly, as shown in Figure 12,14 and 15, heat-exchanging part 22 is connected to first end face (for example upper surface) of thermoelectric element 12 and thermoelectric element 13, and heat-exchanging part 32 is connected to second end face (for example lower surface) of thermoelectric element 12 and thermoelectric element 13.
The electrode part 25 of heat-exchanging part 22 is configured to be projected into a little from insulation board 21 side of thermoelectric element 12, and heat exchange section 26 does not reveal the side of thermoelectric element 12.Similarly, the electrode part 35 of heat-exchanging part 32 is configured to be projected into a little from insulation board 31 side of thermoelectric element 13, and heat exchange section 36 does not reveal the side of thermoelectric element 13.
Be arranged in the thermoelectric element 12 and the thermoelectric element 13 (in Figure 12 and 14, illustrating by 12a and 13a respectively) at the two ends (on electrod assembly 22 and 32 directions of arranging) of series circuit 50, be respectively arranged with splicing ear 24a and 24b.Series circuit 50 comprises electrode part 25 connected to one another and 35.
According to the thermo-electric conversion module of describing in this embodiment 200, when voltage was applied to splicing ear 24a, direct current will be between thermoelectric element 12a and thermoelectric element 13a, flow to thermoelectric element 13a (described thermoelectric element 13a proximity thermal electric device 12a) and and then by electrode part 25 from thermoelectric element 13 flow to the mode of thermoelectric element 12 series circuit 50 in mobile by electrode part 35 from thermoelectric element 12a with direct current.
In the case, be arranged in the electrode part 35 of PN connecting portion office, and the electrode part 25 that is arranged in PN connecting portion office has very low state of temperature because peltier effect (Peltier effect) has very high state of temperature.Thus, heat is delivered to the heat exchange section 36 of heat-exchanging part 32 from electrode part 35, and is dispersed into the cooling fluid (heat transmission medium is air for example) of contact heat exchange section 36.The heat that absorbs from electrode part 25 is passed to the heat exchange section 26 of heat-exchanging part 22, and is touched the absorption of 26 fens cooling fluids (heat transmission medium is air for example) of heat exchange section.
Thus, as shown in Figure 12, housing parts 28 and 38 is in the both sides of thermoelectric element base board unit 10, and promptly the side of the side of heat-exchanging part 22 and heat-exchanging part 32 constitutes air duct (described air duct separates each other by thermoelectric element base board unit 10) respectively.Air (heat transmission medium) flows through air duct so that carry out heat exchange with heat exchange section 26 and heat exchange section 36.Therefore, the air of air duct that flows through the side of heat-exchanging part 22 is cooled, and the air of air duct that flows through the side of heat-exchanging part 32 is heated.
In the case, the heat exchange section 26 of thermoelectric conversion device 100 is connected respectively with 35 with electrode part 25 with 36, and not and electrode part 25 and 35 insulation.Electrode part 25 constitutes the heat absorbing part of series circuit 50, and electrode part 35 constitutes the radiator portion of series circuit 50.Therefore, can improve heat exchanger effectiveness.Yet when voltage was applied to splicing ear 24a and splicing ear 24b, electromotive force was applied to the whole current-carrying part (heat exchange section 26, heat exchange section 36 etc.) that is not connected with series circuit 50 to insulation.That is, electromotive force is not only to be applied to the series circuit 50 that comprises thermoelectric element 12 and 13.
As shown in Figure 16, in thermoelectric conversion device 100, be used to prevent that the dielectric film 40 (insulating barrier) of short circuit is arranged in the whole substantially surface of current-carrying part, when voltage was applied to the splicing ear 24a of thermo-electric conversion module 200 and splicing ear 24b, electromotive force was applied on the described current-carrying part.
Figure 16 has shown the contact portion 42 between the heat-exchanging part 22 of insulation board 21 and battery lead plate unit 20.In the case, the contact portion between the heat exchange section 32 of insulation board 31 and battery lead plate unit 30 can be provided with and the identical construction substantially of the structure shown in Figure 16.
And as shown in Figure 12 and 14-16, first sealant 27 (seal member) and second sealant 37 (seal member) are respectively formed on the surface (described surface is at the opposite side of thermoelectric element base board unit 10) of insulation board 21 and the 3rd insulation board 31.As shown in Figure 15, sealant 27 is formed on whole substantially (heat exchange section 26 sides) surface of insulation board 21, so that arrive the inboard (being the dorsal part of electrode part 25) of the bonding part of heat-exchanging part 22 and insulation board 21.Sealant 37 is formed on whole substantially (being heat exchange section 36 sides) surface of insulation board 31, so that arrive the inboard (being the dorsal part of electrode part 35) of heat-exchanging part 32 and the bonding part of insulation board 31.In this embodiment, sealant 27,37 can be made of epoxy sealing material etc., and for example is provided with the approximately thickness of 2mm-3mm.
As shown in Figure 16, sealant 27 forms contact site office between the root of insulation board 21 and heat-exchanging part 22 from outer side covers dielectric film 40.Similarly, sealant 37 forms contact portion 42 places between the root of insulation board 31 and fixed part 33 from outer side covers dielectric film 40.
Thus because sealant 27 and 37 are provided, near insulated substrate 21 and 31, dielectric film 40 is difficult to can be enhanced by the insulation that electrodeposition coating forms at heat exchange section 26 and 36 places.And sealant 27,37 can limit the side of intrusion thermoelectric element base board units 10 such as water.
Next the manufacture method of thermoelectric conversion device 100 will be described.Described manufacture method can comprise connection procedure (with reference to Figure 14), electrodeposition coating process (it is corresponding to the dipping process among first embodiment and cure process, and shown in Figure 17) and seal process.
In connection procedure, at first, a plurality of conjugate foramens place is alternately arranged and be fixed on to thermoelectric element 12,13 by adhesive etc., described a plurality of conjugate foramens with the arranged in patterns of the grid substantially of identical square on insulated substrate 11.Thus, constitute thermoelectric element base board unit 10.In the case, thermoelectric element 12 and 13 is connected on the insulated substrate 11 and can be carried out by for example using the erector device.
On the other hand, the root of electrod assembly 22 engages with a plurality of holes so that remain in the hole, and described a plurality of holes are formed on the insulation board 21 and with the patterned arrangement of the grid substantially of identical square.And the end of electrod assembly 22 engages with conjugate foramen on being formed on fixed part 23.Thus, produce the fin plate unit 20 of heat absorbing side.
Similarly, the root of electrod assembly 32 engages with a plurality of holes so that remain in the hole, and described a plurality of holes are formed on the insulation board 31 and with the patterned arrangement of the grid substantially of identical square.And the top ends of electrod assembly 32 engages with conjugate foramen on being formed on fixed part 33.Thus, produce the fin plate unit 30 of heat radiation side.
Heat-exchanging part 22 is arranged from the outstanding a little mode of insulation board 21 with the electrode part 25 of heat-exchanging part 22.Heat-exchanging part 32 is arranged from the outstanding a little mode of insulation board 31 with the electrode part 35 of heat-exchanging part 32.
And electrod assembly 22 and 32 top ends remain on respectively in the conjugate foramen of the conjugate foramen of fixed part 23 and fixed part 33.In the case, the top ends of heat-exchanging part 22 is outstanding a little from the upper surface of fixed part 23 (side relative with thermoelectric element base board unit 10 of fixed part 23), and the top ends of heat-exchanging part 32 is outstanding a little from the lower surface of fixed part 33 (side relative with thermoelectric element base board unit 10 of fixed part 33).
Then, as shown in Figure 14, thermoelectric element base board unit 10 inserts between heat absorbing side fin plate unit 20 and the heat radiation side fin plate unit 30 with assembled, thus formation thermo-electric conversion module 200.Particularly, the electrode part 25 of heat-exchanging part 22 waits the upper end face that is connected to thermoelectric element 12 by welding, and the electrode part 35 of heat-exchanging part 32 is connected to the rear surface of thermoelectric element 13 by welding etc., thereby thermoelectric element 12 and 13 is connected respectively to electrod assembly 22 and 32.In the case, pasty state scolder etc. can be thinly by silk screen printing and are applied on the upper surface of thermoelectric element 12 equably and on the lower surface of thermoelectric element 13, and electrode part 25 and 35 is connected on thermoelectric element 12 and 13 by welding etc.
For the thermo-electric conversion module 200 of as above constructing, in the electrodeposition coating process, dielectric film 40 (passing through electrodeposition coating) is formed on the whole substantially surface of current-carrying part, and electromotive force will be applied on the described current-carrying part when voltage is applied to splicing ear 24a and 24b.Particularly, as shown in Figure 17, thermo-electric conversion module 200 is immersed in the groove of the solution that epoxy coating is provided, and voltage is applied on (as the negative pole) among splicing ear 24a and the splicing ear 24b.After coating was applied to thermo-electric conversion module 200, thermo-electric conversion module 200 for example had been heated at about 180 ℃-190 ℃ temperature place, thereby coat 40 (dielectric film) forms by curing coating.
Thus, as shown in Figure 16, when voltage was applied to splicing ear 24a and 24b, coating optionally was applied to the surface (for example, electrod assembly 22 and 32 surface, thermoelectric element 12 and 13 side are welded to connect the side surface of part 45 etc.) of current-carrying part.As a result, dielectric film 40 (wherein aperture (pin holes) can obtain restriction) is formed uniformly on the whole substantially surface of this current-carrying part.In this embodiment, for example can provide about 10 μ m-20 μ m thick dielectric film 40.
In this embodiment, when carrying out electrodeposition coating, voltage can be applied to the splicing ear 24a of thermo-electric conversion module 200 and (as negative pole) among the splicing ear 24b.Alternatively, electrodeposition coating can be applied under the situation of any position at voltage and similarly carry out, and is applied in the current-carrying part on it if this position is in when voltage is applied to splicing ear 24a, the 24b of thermoelectric conversion device 200 electromotive force.
And in this embodiment, electrodeposition coating is performed under voltage is applied to situation as the thermo-electric conversion module 200 of negative pole.Alternatively, adapt to employed coating, voltage also can be applied to as on the anodal thermo-electric conversion module 200.
Next, as shown in Figure 12,15 and 16, in seal process, sealant 27 and sealant 37 are respectively formed on the surface (side relative with thermoelectric element base board unit 10) of insulation board 21 and insulation board 31.Particularly, encapsulant for example epoxy resin etc. is injected on insulated substrate 21 and 31 by distributor, and then, encapsulant is hardened in the high temperature groove thereby insulated substrate 21 and 31 is placed on.Thus, sealant 27 and sealant 37 for example can be provided with the approximately thickness of 2mm-3mm.
And, as shown in Figure 12 and 15, encapsulant also can be applied on the gap 17 (peripheral parts in insulated substrate 21 and 31) between thermoelectric element base board unit 10 and the insulation board 21,31, thereby can be provided for limiting the sealing that water etc. invades the side of thermoelectric element base board unit 10.
After this, housing parts 28 and housing parts 38 are arranged to cover thermo-electric conversion module 200, and two opposite sides that are positioned at thermo-electric conversion module 200 respectively (for example, upside among Fig. 1 and downside), thus the heat exchange section formation that air flows through the heat exchange section that is used to absorb heat wherein and is used to dispel the heat.In the case, the filler (not shown) is filled in the top ends (fixed part 23) and the gap between the housing parts 28 of heat-exchanging part 22, and in the gap between top ends of heat-exchanging part 32 (fixed part 33) and the housing parts 38, thereby the position of thermo-electric conversion module 200 in housing parts 28 and housing parts 38 is fixed.
Thus, in thermoelectric conversion device 100, when voltage be applied to splicing ear 24a, when 24b is last, dielectric film 40 is formed on the whole substantially surface that electromotive force applies current-carrying part thereon by electrodeposition coating.In the case, thermo-electric conversion module 200 is at first constituted, and then, carries out electrodeposition coating at thermo-electric conversion module 200 places, thereby dielectric film 40 can optionally be formed on and is necessary the conductive part office of insulating.And, in the identical stage, be necessary that the whole substantially surface of the current-carrying part that insulate can be provided with dielectric film 40.Because electrodeposition coating is provided, wherein the dielectric film 40 that reduced of aperture can be formed on heat exchange section 26 with complicated shape or the heat exchange section 36 etc. substantially, thus, has limited the ion migration and the short circuit of conductor portion office.
And, in thermoelectric conversion device 100 according to this embodiment, sealant 27,37 is formed near the insulation board 21 and the contact portion between the contact portion 42 between the heat-exchanging part 22 and the 3rd insulation board 31 and the heat-exchanging part 32 that wherein is difficult to by electrodeposition coating formation dielectric film 40 in the mode of sealant 27,37 from the outer side covers contact portion 42 of dielectric film 40.Thus, dielectric film 40 is reinforced, thereby the insulation that is necessary the current-carrying part (in thermoelectric conversion device 100) that insulate can become quite complete.Therefore, the ion that can limit substantially in the thermoelectric conversion device 100 moves and short circuit.
In the case, sealant 27,37 is formed on the outstanding side of heat-exchanging part 22,32 so that cover the whole substantially surface of insulation board 21,31, thus, restriction is because the water droplet on the heat exchange section 26,36 of adhering to that condenses and cause at the water of heat absorbing side, be included in the airborne water vapour that flows through heat exchange section 26,36, medicine, dust, impurity etc., invade the side of thermoelectric element 12,13 from the slit of bonding part between insulation board 21 and the heat-exchanging part 22 and the bonding part between the 3rd insulation board 31 and the heat-exchanging part 32 etc.Thus, may be limited to thermoelectric element 12,13 and heat absorption electrode part 25 and heat sink electrodes 35 places and burn into damage, ion migration and short circuit occur.
Relevant thermoelectric conversion device 100 and the manufacture method thereof do not described in the 3rd embodiment can be identical with first embodiment.
The 4th embodiment
Below with reference to Figure 18 and 19 fourth embodiment of the present invention is described.In above-mentioned the 3rd embodiment, sealant 27 and 37 is arranged on the surface of insulated substrate 21 that the root of electrod assembly 22 wherein and 32 kept respectively and 31.As shown in figure 18, according to second embodiment, except sealant 27 and 37, the 3rd sealant 29 and the 4th sealant 39 are arranged on the surface of the maintained fixed part 23 of top ends of electrod assembly 22 wherein and 32 and fixed part 33.
The 3rd sealant 29 is formed on the whole substantially surface (heat exchange section 26 sides) of fixed part 23, and the 4th sealant 39 is formed on (whole substantially surface heat switching part 36 sides of fixed part 33).In this embodiment, sealant 29,39 can be provided with for example thickness of 2mm-3mm.
With reference to Figure 18 to 19, the 3rd sealant 29 is arranged on the top ends and the contact portion 43 between the fixed part 23 of heat exchange section 26 in the mode of the 3rd sealant 29 from outer side covers dielectric film 40.Thus, the insulation that is difficult to form by electrodeposition coating the part of velum 40 on heat exchange section 26 can be strengthened to become quite complete.
Heat-exchanging part 22 and contact portion 43 (shown in Figure 19) between the fixed part 23 have to heat-exchanging part 32 and fixed part 33 between the similar structure of contact portion 43.The 4th sealant 39 can be provided with the structure similar to the 3rd sealant 29.
To the adhesive layer forming process of the similar execution of the 3rd embodiment in, the 3rd sealant 29 and the 4th sealant 39 can form with first sealant 27 and second sealant 37.Particularly, apply the surface of epoxy sealing material to fixed part 23 and 33, fixed part 23 and 33 is hardened then, thereby forms the 3rd sealant 29 and the 4th sealant 39.
According to this embodiment, the 3rd sealant 29 and the 4th sealant 39 are separately positioned on the whole substantially surface (heat-exchanging part 22 and 32 sides) of the maintained fixed part 23 of top ends of wherein electrod assembly 22 and electrod assembly 32 and fixed part 33, have strengthened thus to be difficult to form near the exposed portions serve 43 (on the fixed part 23,33 at the top ends place that is positioned at electrod assembly 22,32) of dielectric film 40 insulation by electrodeposition coating.Therefore, the insulation of the top ends side of electrod assembly 22,32 can become complete substantially.Thereby, can be limited in the short circuit in the thermoelectric conversion device 100 substantially, and the ion migration.
Relevant thermoelectric conversion device 100 and the manufacture method thereof do not described in the 4th embodiment can be identical with first embodiment.
The 5th embodiment
Below with reference to Figure 20 the fifth embodiment of the present invention is described.According to this embodiment, temperature sensor 70 (for example, thermistor) is arranged on the surface of fixed part 23 (opposite side of electrod assembly 22) in addition.
In the connection procedure similar to the 3rd embodiment, thermistor 70 can be fixed on the fixed part 23 by adhesive etc., and goes between and 71 can be connected on the fixed part 23 by welding etc.
Thus, in the electrodeposition coating process similar to the 3rd embodiment, when dielectric film 40 is formed on the thermo-electric conversion module 200, voltage not only is applied to a splicing ear (it is used as negative pole and does not illustrate) of thermo-electric conversion module 200, and is applied to the lead-in wire 71 (it is as negative pole) of thermistor 70.Thereby owing to carried out electrodeposition coating, when dielectric film 40 was formed on the current-carrying part of thermo-electric conversion module 200, dielectric film 48 also can be formed on the lead-in wire 71 of thermistor 70.
In this embodiment, thermistor 70 can be arranged to contact electrode parts 22.Yet the position of thermistor 70 without limits.For example, as required, thermistor 70 also can be positioned at electrod assembly 22 near, or be positioned at the side of electrod assembly 32.
Thus, be provided with at thermo-electric conversion module 200 under the situation of thermistor 70 and lead-in wire 71, when dielectric film 40 was formed on the surface of current-carrying part of thermo-electric conversion module 200 by electrodeposition coating, dielectric film 48 can be formed on the lead-in wire 71 of the thermistor 70 that is arranged on the thermo-electric conversion module 200 simultaneously.Therefore, even go between 71 the time when water intrusion, also can be limited in ion migration and short circuit in the thermoelectric conversion device 100 substantially.
Relevant thermoelectric conversion device 100 and the manufacture method thereof do not described in the 5th embodiment can be identical with first embodiment.
The 6th embodiment
Below with reference to Figure 21 the sixth embodiment of the present invention is described.In the above-described embodiments, thermoelectric element 12 and thermoelectric element 13 are connected to each other directly by the electrode part 25 of electrod assembly 22 and the electrode part 35 of heat-exchanging part 32.As shown in Figure 21, according to the 6th embodiment, be different from heat-exchanging part 22 and 32, electrode part 16 can be arranged and is used to connect electrod assembly located adjacent one another 12 and thermoelectric element 13.
In the case, each in the electrode part 35 of the electrode part 25 of heat-exchanging part 22 and heat-exchanging part 32 is connected to electrode part 16.Particularly, to similar connection procedure described in the 3rd embodiment in, after thermoelectric element 12 and thermoelectric element 13 were connected to insulated substrate 11, electrode part 16 was connected respectively to the upper surface of thermoelectric element 12 and the upper surface and the lower surface of lower surface and thermoelectric element 13 by welding.
Thus, finish the manufacturing of thermoelectric element base board unit 10.Then, when the fin plate unit 30 of the fin plate unit 20 of heat absorbing side and heat radiation side is connected to thermoelectric element base board unit 10 so that when constituting thermo-electric conversion module 200, the electrode part 25 of heat-exchanging part 22 and the electrode part 35 of heat-exchanging part 32 are connected to electrode part 16.Electrode part 16 can be by the conducting metal structure of for example copper etc., and for example has the shape of upper plate shape substantially.
Then, with the electrodeposition coating similar process among the 3rd embodiment, thermo-electric conversion module 200 can be provided with electrodeposited coating.Thus, dielectric film 40 is formed on the surface of heat exchange section 26 and 36 and on the side surface of thermoelectric element 12 and 13.In addition, dielectric film 40 also is formed on being welded to connect on the side surface partly on the side surface partly and between electrode part 16 and the thermoelectric element 13 that be welded to connect between electrode part 16 and the thermoelectric element 12, on the side surface of electrode part 16, on the side surface that is welded to connect part between the electrode part 25 of electrode part 16 and heat-exchanging part 22 and on the side surface that is welded to connect part between the electrode part 35 of electrode part 16 and heat-exchanging part 32.
According to this embodiment, except heat-exchanging part 22 and heat-exchanging part 32, be provided with electrode part 16.Because when the manufacturing of thermoelectric element base board unit 10 is finished, thermoelectric element 12 is connected with thermoelectric element 13 by electrode part 16, thereby constituted series circuit 50, so before thermo-electric conversion module 200 assemblings, because thermoelectric element base board unit 10, the conduction fault between the electrical inspection of series circuit 50 and electrode part 16 and the thermoelectric element 12,13 etc. can easily be carried out.
Relevant thermoelectric conversion device 100 and the manufacture method thereof do not described in the 6th embodiment can be identical with first embodiment.
Other embodiment
With reference to accompanying drawing,, be noted that variations and modifications will become obvious for a person skilled in the art although in conjunction with preferred embodiment of the present invention the present invention has been carried out abundant description with reference to accompanying drawing.
In first embodiment, two ends (root and top ends) of heat-exchanging part 22 are respectively fixed to insulation board 21 and fixed part 23, and two ends (root and top ends) of heat-exchanging part 32 are respectively fixed to insulation board 31 and fixed part 33.Yet, also can omit fixed part 23 and fixed part 33.In the case, heat-exchanging part 22 and heat-exchanging part 32 are only kept by insulation board 21 and insulation board 31 respectively at its root, and the root of described heat-exchanging part 22 and heat-exchanging part 32 is fixed on insulated substrate 21 and 31.Alternatively, also can omit insulated substrate 21 and 31.In the case, heat-exchanging part 22 and heat-exchanging part 32 are only kept by fixed part 23 and fixed part 33 respectively in its top ends, and the top ends of described heat-exchanging part 22 and heat-exchanging part 32 is fixed on fixed part 23 and the fixed part 33.
In the above-described embodiments, thermoelectric element 12 and 13 is maintained at insulated substrate 11 (holding member) upward so that constitute thermoelectric element base board unit 10.Alternatively, also can omit insulated substrate 11.In the case, for example, thermoelectric element 12,13 can be connected to any one in the electrode part 35 of the electrode part 25 of heat-exchanging part 22 and heat-exchanging part 32.
In the above-described embodiments, the heat exchange section 36 of the heat exchange section 26 of heat-exchanging part 22 and heat-exchanging part 32 forms (louver) shape that has shutter.Yet heat exchange section 26 and heat exchange section 36 also can have biasing (offset shape) shape.Alternatively, can be arranged in heat-exchanging part 22 with broach shape and in the heat-exchanging part 32 each, by the isostructure wavy fin of corrugated metal plate so that structure heat exchange section 26 and heat exchange section 36.
In the above-described embodiments, the positive terminal of DC power supply is connected with splicing ear 24a, and its negative terminal is connected with splicing ear 24b.Alternatively, the positive terminal of DC power supply also can be connected with splicing ear 24b, and its negative terminal also can be connected with splicing ear 24a.In the case, the heat-exchanging part 22 of upside is configured to radiator portion, and the heat-exchanging part 32 of downside is configured to heat absorbing part.
That is,, can switch heat absorbing side and heat radiation side by switching in the flow direction of the electric current that flows in the series circuit 50 by thermoelectric element 12 and 13 structures.Thus, thermoelectric conversion device can be used to cool off the heater element of for example semiconductor or electronic component etc. and be used for cooling in conditioner.
In addition, in the above-described embodiments, be set to dielectric film by the dielectric film 40 (electrodeposited coating) of electrodeposition coating formation or the dielectric film 41 (gas deposition layer) that forms by gas deposition.Alternatively, thermo-electric conversion module also can immerse in the coatings, heats then and dry thermo-electric conversion module, thereby forms dielectric film (dope layer) on the surface of heat exchange section 26 and heat exchange section 36.
In addition, also can construct adhesive layer 27 and adhesive layer 37 by silicon adhesive.
And in the above-described embodiments, adhesive layer 27 and 37 forms so that cover the whole substantially surface of insulation board 21 and the whole substantially surface of insulation board 31 respectively.Yet adhesive layer 27 and 37 also can be respectively accurately to be formed on to the location near the exposed portions serve 42 of the exposed portions serve 42 of heat exchange section 26 and heat exchange section 36.
These variations and modification are understood to be in protection scope of the present invention, and protection scope of the present invention is defined by the claims.
Claims (21)
1, a kind of thermoelectric conversion device, described thermoelectric conversion device comprises:
Thermoelectric element module (10), described thermoelectric element module (10) comprises that a plurality of thermoelectric elements are right, each of described a plurality of thermoelectric element centerings is to having P type thermoelectric element and the N type thermoelectric element that is one another in series and is electrically connected; With
A plurality of heat-exchanging parts (22,32), described a plurality of heat-exchanging part (22,32) is electrically connected to thermoelectric element (12,13), and heat can transmit between thermoelectric element (12,13) and heat transmission medium by described a plurality of heat-exchanging parts (22,32), wherein:
Described heat-exchanging part (22,32) is arranged on three rows with respect to the flow direction of heat transmission medium at least, and it is right to be connected respectively to thermoelectric element; And
Dielectric film (40) is arranged on by electrodeposition coating on the whole substantially surface of assembly of thermoelectric element module (10) and heat-exchanging part (22,32).
2, thermoelectric conversion device according to claim 1, wherein
Described dielectric film (40) is by the material structure that comprises the resin material that covers the limit.
3, thermoelectric conversion device according to claim 1 and 2 further comprises:
Insulation board (21,31); With
Seal member (27,37), wherein:
Described heat-exchanging part (22,32) has and the electrode part (25,35) of thermoelectric element to being connected, with the heat exchange section (26,36) that directly is connected with described electrode part (25,35);
Described heat exchange section (26,36) is outstanding so that be held from insulation board (21,31) in the outstanding side of insulation board (21,31), and described heat exchange section (26,36) is electrically insulated from each other by insulation board (21,31); And
Outstanding side in insulation board (21,31), seal member (27,37) are arranged to from the outer side covers heat exchange section (26,36) of dielectric film (40) and the contact portion (42) between the insulation board (21,31).
4, thermoelectric conversion device according to claim 3, wherein
Described seal member (27,37) covers the whole substantially surface of insulation board (21,31), and described surface is in the outstanding side of heat exchange section (26,36).
5, thermoelectric conversion device according to claim 4, wherein
Described insulation board (21,31) constitutes first holding member, and described first holding member is used for heat exchange section (26,36) is remained on the connection side that heat exchange section (26,36) is connected with electrode part (25,35).
6, according to claim 4 or 5 described thermoelectric conversion devices, further comprise
Second holding member (23,33), described second holding member (23,33) electric insulation also remains on heat exchange section (26,36) on the opposite side of the connection side that heat exchange section (26,36) and electrode part (25,35) is connected.
7, according to claim 4 or 5 described thermoelectric conversion devices, further comprise
Temperature sensor (70), described temperature sensor (70) are arranged in the position of temperature sensor (70) contact heat exchange section (26,36) and a position near the position heat exchange section (26,36);
Distribution (71), described distribution (71) is connected with temperature sensor (70); With
Distribution dielectric film (48), described distribution dielectric film (48) electric insulation and being arranged in by electrodeposition coating on the whole substantially surface of distribution.
8, according to claim 4 or 5 described thermoelectric conversion devices, wherein
Described a plurality of electrode parts (25,35) form as one with a plurality of heat exchange sections (26,36) respectively.
9, a kind of manufacture method of thermoelectric conversion device, described thermoelectric conversion device comprises thermoelectric element module (10) and a plurality of heat-exchanging part (22,32), heat can transmit between thermoelectric element module (10) and heat transmission medium by described a plurality of heat-exchanging parts (22,32), it is right that described thermoelectric element module (10) has a plurality of thermoelectric elements, each of described thermoelectric element centering is to having P type thermoelectric element (12) and the N type thermoelectric element (13) that is one another in series and is electrically connected, and described manufacture method may further comprise the steps:
It is right that connection procedure, described connection procedure are used for that heat-exchanging part (22,32) is electrically connected to thermoelectric element respectively, and described heat-exchanging part (22,32) is arranged on three rows with respect to the flow direction of heat transmission medium at least;
Dipping process, described dipping process is used for the assembly of thermoelectric element module (10) and heat-exchanging part (22,32) is immersed dipping tank, the insulating material of fusing is arranged in the described dipping tank, and predetermined voltage is applied on the assembly, thereby insulating material is applied on the whole substantially surface of assembly, and after connection procedure, carries out described dipping process; With
Cure process, the described process of curing is used for curing at the dipping process insulating material and has been applied to the thermoelectric element module (10) on it and the assembly of heat-exchanging part (22,32), thereby forms dielectric film (40).
10, manufacture method according to claim 9, wherein
In described dipping process, use the insulating material that comprises the resin material that covers the limit.
11, according to claim 9 or 10 described manufacture methods, wherein
After dipping process repeats for several times, carry out the described process of curing.
12, manufacture method according to claim 11, wherein
Described dipping process in commission is provided with the various immersion conditions that are used for different number of times.
13, according to claim 9 or 10 described manufacture methods, wherein
The described process of curing is repeated to carry out for several times, and is provided with the various conditions of curing that are used for different number of times.
14, according to each described manufacture method in the claim 9,10 and 12, further comprise
Seal process, described seal process are used for forming seal member (27,37) on the outstanding side of insulation board (21,31), so that from the outer side covers contact portion (42) of dielectric film (40), and carry out described seal process after the process of curing, wherein:
Described heat-exchanging part (22,32) has and the electrode part (25,35) of thermoelectric element to being electrically connected, with the heat exchange section (26,36) that directly is connected with described electrode part (25,35); Described contact portion (42) is between heat exchange section (26,36) and the insulation board (21,31); And
Described heat exchange section (26,36) is outstanding so that be held from insulation board (21,31) in the outstanding side of insulation board (21,31), and described heat exchange section (26,36) is electrically insulated from each other by insulation board (21,31).
15, manufacture method according to claim 14, wherein
In described seal process, form seal member (27,37) so that cover the whole substantially surface of insulation board (21,31), and described surface is on the outstanding side of heat exchange section (26,36).
16, manufacture method according to claim 15, wherein
In described connection procedure, insulation board (21,31) is arranged as first holding member, and described first holding member is used for heat exchange section (26,36) is remained on the connection side that heat exchange section (26,36) is connected with electrode part (25,35).
17, manufacture method according to claim 15, wherein
In described connection procedure, the holding member of electric insulation (23,33) is arranged to heat exchange section (26,36) is remained on the opposite side of the connection side that heat exchange section (26,36) and electrode part (25,35) is connected.
18, manufacture method according to claim 17, wherein
In described connection procedure, described temperature sensor (70) is arranged in the position of temperature sensor (70) contact heat exchange section (26,36) and a position near the position heat exchange section (26,36), and distribution (71) is connected with temperature sensor (70); And
In described dipping process, distribution (71) as negative pole and one of anodal situation under, by voltage being applied on the distribution (71), the distribution dielectric film (48) of electric insulation is formed on the whole substantially surface of distribution (71).
19, manufacture method according to claim 18, wherein
Described a plurality of electrode parts (25,35) form as one with a plurality of heat exchange sections (26,36) respectively.
20, according to claim 9 or 10 described manufacture methods, wherein
Predetermined voltage is applied to the terminal (24a, 24b) that is arranged on the thermoelectric element module (10).
21, manufacture method according to claim 16, wherein
In described connection procedure, second holding member of electric insulation (23,33) is arranged to heat exchange section (26,36) is remained on the opposite side of the connection side that heat exchange section (26,36) and electrode part (25,35) is connected.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP2006178307 | 2006-06-28 | ||
| JP2006178307 | 2006-06-28 | ||
| JP2006181101 | 2006-06-30 | ||
| JP2007019951 | 2007-01-30 |
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| CN101097986A true CN101097986A (en) | 2008-01-02 |
| CN100524866C CN100524866C (en) | 2009-08-05 |
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| CNB2007101270991A Expired - Fee Related CN100524866C (en) | 2006-06-28 | 2007-06-28 | Thermoelectric conversion device and manufacture method of the same |
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