CN101093807A - Method for packaging organic luminous display unit with melting stock packing material and reinforced structure - Google Patents

Method for packaging organic luminous display unit with melting stock packing material and reinforced structure Download PDF

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Publication number
CN101093807A
CN101093807A CNA2007100840432A CN200710084043A CN101093807A CN 101093807 A CN101093807 A CN 101093807A CN A2007100840432 A CNA2007100840432 A CN A2007100840432A CN 200710084043 A CN200710084043 A CN 200710084043A CN 101093807 A CN101093807 A CN 101093807A
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China
Prior art keywords
equipment
substrate
oxide
curable materials
seal material
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李在先
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Samsung Display Co Ltd
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Samsung SDI Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Disclosed is a method for packaging an organic light emitting display having a reinforcing member formed between a first substrate and a second substrate by dipping non-pixel regions of unit display panels in a liquid curable material. Organic light emitting pixel arrays are formed at a plurality of pixel regions of a first mother substrate. A frit is formed at a position of the second mother substrate corresponding to non-pixel regions of the first mother substrate. The first and second mother substrates are coalesced to each other and sealed by the frit. The mother substrates are cut into unit display panels. The unit display panels are aligned. Non-pixel regions of the unit display panels are dipped in the liquid curable material and the material is cured to form the reinforcing member.

Description

Method with frit seal material and ruggedized construction encapsulating organic light emitting display
The cross reference of relevant application
The application requires korean patent application 10-2006-0016857 number the rights and interests of on February 21st, 2006 to the submission of Korea S Department of Intellectual Property, here in conjunction with its complete content as a reference.
Technical field
The present invention relates to oganic light-emitting display device, especially, relate to the encapsulation of this equipment.
Background technology
In recent years, used organic light emitting display widely, and these organic light emitting display are simple relatively.Organic light emitting display is meant organic light emitting apparatus, and is to use the transmitter of organic layer as emission layer.Because it is needed backlight that organic light emitting display can need not in the LCD, so can make it thin gentlyer with weight.Therefore, developed organic light emitting display on one's own initiative as display floater such as portable data assistances such as mobile computer, portable phone, portable game device and e-book.
Usually, organic light emitting display has a kind of structure, in this structure, in pair of electrodes, that is, inserts the organic layer of one deck at least with emission layer between first electrode and second electrode.On substrate, form first electrode, and it act as the anode of hole injection.Organic layer is formed at the top at first electrode.Form second electrode in the face of first electrode on organic layer, it act as the negative electrode of electron injection.
When the moisture of surrounding environment and oxygen are introduced equipment, can reduce the life-span of this organic light emitting display, make the emission effciency variation, and owing to oxidation with peel off and change the emission color.Therefore, when making organic light emitting display, equipment is isolated from the outside and seals, in preventing that moisture from infiltrating through.In encapsulating method, stacked after the organic polymer thing such as polyester (PET) on the top of organic light emitting display, or form after lid or the cap by glass or metal with absorbability, nitrogen is filled by portion within it.Then, by carrying out by film phonograph seal (capsule-sealed) such as the edge of sealings such as epoxy resin material to lid or cap.
Yet,, can not 100% prevent to introduce the monkey wrench such as moisture or oxygen from the external world for conventional method.Therefore, the structure of equipment is unfavorable for using aspect the vulnerable active surface-emitting type organic light emitting display of moisture, and it is complicated to implement the process of this method.In order to address the above problem, designed the tunicle encapsulating method, to use melt as sealing the adhesiveness of expecting to strengthen between device substrate and the cap.United States Patent (USP) the 6th, 998 has disclosed for 776 B2 numbers by apply a kind of structure that melt seals organic light emitting display on glass substrate.
Summary of the invention
One aspect of the present invention provides a kind of method that is used to make oganic light-emitting display device, this method comprises: first and second equipment are provided, each equipment comprises: first substrate that comprises first side surface, comprise first side surface and second substrate relative with first substrate, be inserted in the array of the organic light emission pixel between first and second substrates, be inserted in the frit seal material (fritseal) that surrounds array between first substrate and second substrate simultaneously, frit seal material wherein, first substrate and second substrate have defined the confined space that array is set together, the frit seal material package is drawn together first side surface, and comprises first substrate, first side of first side surface of second substrate and frit seal material; Settle first or second substrate of first substrate surface of first and second equipment so that first equipment, and first side of first and second equipment is in fact towards identical direction to second equipment; Make curable materials contact two first sides of first and second equipment, thereby on two first sides of first and second equipment, form curable material; And solidify to form curable materials on first side of first and second equipment, thereby form first structure of first side of contact first equipment and second structure that forms first side of contact second equipment.
In said method, " arrangement " can comprise provides the support that is configured to fix first and second equipment, and first substrate surface of fixing first and second equipment so that first equipment to first or second substrate of second equipment and so that first side of first and second equipment in fact towards equidirectional." contact " can comprise first and second equipment are fixed together, and the whole immersion curable materials of first and second equipment, so that at least a portion first side contacts curable materials of first equipment and at least a portion first side contacts curable materials of second equipment." immersion " can comprise first and second equipment are moved to the curable materials that comprises top surface together, and regulate first and second equipment first side towards, so that before first side surface of first substrate will contact top surface, first side surface of first substrate of first or second equipment was parallel to top surface usually.
Still in said method, the combination of first substrate, second substrate and frit seal material can be in first and second equipment forms clearance space outside the confined space in each, and wherein at least a portion curable materials can enter clearance space.The contact curable materials can comprise makes curable materials enter clearance space.At least a portion curable materials that enters clearance space can move to the frit seal material naturally.Clearance space can have the degree of depth from first side surface of first substrate to first side surface of frit seal material, and wherein this degree of depth can be from about 0.3 to about 0.7mm.Distance between first substrate and second substrate can be from about 2 to about 30 μ m.The combination of first substrate, second substrate and frit seal material can form clearance space outside confined space in each equipment of first and second equipment, wherein at least a portion curable materials enters clearance space by the capillarity phenomenon.
Still in said method, the contact curable materials can comprise at least a portion first side of making curable materials contact first equipment and at least a portion first side of second equipment.The contact curable materials can comprise first side surface that makes curable materials contact the frit seal material in each equipment of first and second equipment.The viscosity of curable materials can be less than about 200cP." arrangement " can be included between first or second substrate of first substrate of first equipment and second equipment and place insert." arrangement " can comprise that first substrate that makes first equipment contacts first or second substrate of second equipment.Can settle first substrate of first equipment to make it to be parallel in fact first or second substrate of second equipment.First side surface of frit seal material can be parallel to first side surface of first substrate in fact.
Still in said method, first structure can contact the frit seal material of first equipment.First structure can contact at least one in first and second substrates.Can after solidifying, first and second structures be become one.This method can also comprise makes first structure and second structure separately.In first and second equipment each can comprise second side of second side surface that comprises first substrate, second substrate and frit seal material, and wherein this method can also comprise second side contacts that makes the curable materials and first and second equipment.The liquid curable material can comprise liquid surface, and wherein when first side of dipping first and second equipment, the angle between one of in the substrate of first and second equipment and the surface is about 5 to about 90 degree.The liquid curable material can comprise liquid surface, and wherein when first side of dipping first and second equipment, the angle between one of in the substrate of first and second equipment and the surface is about 10 to about 89 degree.
Still in said method, this method can also comprise provides at least one supplementary equipment therefore, this equipment comprises: first substrate that comprises first side surface, comprise first side surface and be placed on second substrate on first substrate, be inserted in the array of the organic light emission pixel between first and second substrates, when surrounding array, be inserted in the frit seal material between first substrate and second substrate, frit seal material wherein, first substrate and second substrate can define the confined space that array is set together, the frit seal material package is drawn together first side surface, and comprise first substrate, first side of first side surface of second substrate and frit seal material, wherein settle and to comprise: settle at least one optional equipment with first and second equipment, wherein contact also contacts curable materials at least one optional equipment, wherein solidify and can form at least one additional structure, each of at least one additional structure all contacts each first side of at least one additional structure.Can make it to become reinforcement material by adaptive curable materials.The frit seal material can comprise from comprising magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li 2O), sodium oxide molybdena (Na 2O), potassium oxide (K 2O), boron oxide (B 2O 3), vanadium oxide (V 2O 5), zinc oxide (ZnO), tellurium oxide (TeO 2), aluminium oxide (Al 2O 3), silica (SiO 2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P 2O 5), ruthenium-oxide (Ru 2O), rubidium oxide (Rb 2O), rhodium oxide (Rh 2O), iron oxide (Fe 2O 3), cupric oxide (CuO), titanium oxide (TiO 2), tungsten oxide (WO 3), bismuth oxide (Bi 2O 3), antimony oxide (Sb 2O 3), one or more materials of selecting in the group of lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate.
One aspect of the present invention provides a kind of method of making organic light emitting display, and this method is reinforced the reinforcing key element of filling liquid phase in the key element (reinforcing member) between first substrate and second substrate by the non-pixel region of unit display screen is immersed in.
Another aspect of the present invention provides a kind of method of making organic light emitting display, this method comprises the following steps: that (i) forms organic light emitting apparatus at a plurality of pixel regions place of first female substrate, and first female substrate comprises a plurality of pixel regions and a plurality of non-pixel region; (ii) form melt at second female substrate place corresponding with the non-pixel region of first female substrate; (iii) second female substrate is engaged to a plurality of pixel regions of first female substrate with the frit seal first female substrate of applying; (iv) first and second female substrates of having engaged of cutting separate first and second female substrates and unit display screen; (the v) unit's of aligning display screen; And (vi) the non-pixel region of unit display screen being immersed in the reinforcing key element sentences by capillarity phenomenon filling reinforcing key element between first substrate outside the melt and second substrate.Each non-pixel region is all between first female substrate and second female substrate in the outside that forms melt.This method also is included in to fill between first and second female substrates reinforces the step that key element is solidified the reinforcing key element afterwards.
Description of drawings
Together with accompanying drawing, these and other aspect of the present invention and advantage will become apparent and be easier to understand from the explanation of more following embodiment, wherein:
Fig. 1 a is that the cross-sectional view of making a kind of method of organic light emitting display according to one embodiment of the invention is shown to Fig. 1 f;
Fig. 2 a is a perspective view to a kind of method that Fig. 2 f illustrates one embodiment of the invention manufacturing organic light emitting display;
Fig. 3 A is the schematic, exploded according to the passive matrix oganic light-emitting display device of an embodiment;
Fig. 3 B is the schematic, exploded according to the active matrix type organic light emitting display device of an embodiment;
Fig. 3 C is the schematic top view according to the organic light emitting display of an embodiment;
Fig. 3 D is the cross-sectional view that the organic light emitting display of Fig. 3 C d-d along the line obtains; And
Fig. 3 E is the perspective schematic view of explanation according to the production in enormous quantities of the organic light emitting apparatus of an embodiment.
Embodiment
Hereinafter, some embodiments of the present invention will be described with reference to the drawings.
Organic light emitting display (OLED) is the display device that comprises organic LED array.Organic Light Emitting Diode is a solid state device, and it comprises organic material and is applicable to generation and emission light when applying proper voltage.
According to the configuration of the exciting current that is provided, generally can be divided into two fundamental types to OLED.The exploded view of the simplified structure of the schematically illustrated passive matrix OLED 1000 of Fig. 3 A.The simplified structure of the schematically illustrated active array type OLED 1001 of Fig. 3 B.In two kinds of configurations, OLED 1000,1001 is included in the OLED pixel of structure on the substrate 1002, and the OLED pixel comprises anode 1004, negative electrode 1006 and organic layer 1010.When suitable current was put on anode 1004, electric current flow through pixel, and from the organic layer visible emitting.
With reference to figure 3A, passive matrix OLED (PMOLED) design comprises the prolongation band of anode 1004, generally the prolongation band of anode 1004 is arranged to vertically with the prolongation band of negative electrode 1006, and inserts organic layer between them.The cross section of the band of negative electrode 1006 and anode 1004 has defined when the corresponding band of excitation anode 1004 and negative electrode 1006 suitably and has produced and radiative each OLED pixel.PMOLED provides and manufactures simple relatively advantage.
With reference to figure 3B, active matrix OLED (AMOLED) comprises the local drive circuit 1012 that is placed between substrate 1002 and the OLED pel array.Common cathode 1006 and and an anode 1004 of other anode electric insulation between each pixel of definition AMOLED.Each drive circuit 1012 is coupled with an anode 1004 of OLED pixel, and is coupled with data wire 1016 and scan line 1018.In certain embodiments, scan line 1018 provides the sweep signal of the row of selecting drive circuit, and data wire 1016 is provided for the data-signal of specific drive circuit.Data-signal and sweep signal encourage local drive circuit 1012, local drive circuit 1012 excitation anodes 1004, so that from they corresponding pixel emission light.
Shown in AMOLED in, local drive circuit 1012, data wire 1016 and scan line 1018 are embedded in the plane layer 1014, and plane layer 1014 is inserted between pel array and the substrate 1002.Plane layer 1014 provides smooth top surface, forms array of organic light emitting pixels on smooth top surface.Can form plane layer 1014 with the organic or inorganic material, though shown be individual layer, can form two-layer or multilayer.Generally form local drive circuit 1012, and be placed under the OLED pel array by grid or array with thin-film transistor (TFT).Can make local drive circuit 1012 with organic material to small part, these organic materials comprise organic tft.The advantage of AMOLED is the fast response time, has improved them and has been used for the ideality of display data signal aspect.Equally, AMOLED has the consumed power advantage littler than passive matrix OLED.
With reference to the common trait of PMOLED and AMOLED design, substrate 1002 provides the support structure of OLED pixel and circuit.In each embodiment, substrate 1002 can comprise rigidity or flexible material and opaque or material transparent, such as plastics, glass and/or paper tinsel.As mentioned above, each OLED pixel or diode form anode 1004, negative electrode 1006 and are inserted in organic layer 1010 between them.When suitable current is put on anode 1004, negative electrode 1006 electron injection, and anode 1004 hole injection.In certain embodiments, anode 1004 and negative electrode 1006 are opposite; That is, on substrate 1002, form negative electrode, and anode is on the spot to settle relatively.
Be inserted between negative electrode 1006 and the anode 1004 is one or more layers organic layer.More specifically, between negative electrode 1006 and anode 1004, insert one deck emission or luminescent layer at least.Luminescent layer can comprise one or more luminous organic compounds.Generally, the configuration luminescent layer makes it to launch monochromatic visible light, such as blue, green, red or white.In an illustrated embodiment, form one deck organic layer 1010 between negative electrode 1006 and anode 1004, it acts on as luminescent layer.Other layer that can form between anode 1004 and negative electrode 1006 can comprise hole transmission layer, hole injection layer, electron transfer layer and electronics injecting layer.
Can between luminescent layer 1010 and anode 1004, insert hole transport and/or injecting layer.Can between negative electrode 1006 and luminescent layer 1010, insert electric transmission and/or injecting layer.By reducing the work function from negative electrode 1006 electron injection, the electronics injecting layer promotes from the electronics injection of negative electrode 1006 to luminescent layer 1010.Similarly, the hole injection layer promotes from the hole injection of anode 1004 to luminescent layer 1010.Hole and electron transfer layer promote from the motion to luminescent layer of the charge carrier of each electrode injection.
In certain embodiments, single layer can play the electronics injection and transmit two effects or hole injection and two effects of transmission.In certain embodiments, lack in these layers one or more layers.In certain embodiments, in one or more layers organic layer, mix to the injection of charge carrier and/or transmit helpful one or more materials.Only form between negative electrode and anode among some embodiment of one deck organic layer, organic layer not only can comprise organic luminophor, can also comprise the injection of the charge carrier in this layer or transmits helpful some functional material.
Many organic materials of these layers that are used to comprise luminescent layer have been developed.Equally, developing many other organic materials that are used for these layers.In certain embodiments, these organic materials can be the macromolecular materials that comprises oligomer and polymer.In certain embodiments, the organic material that is used for these layers can be relatively little molecule.In particular design, consider the material of desired function of each layer and adjacent layer, those skilled in the art that can select suitable material for each layer in these layers.
In operation, circuit provides the suitable potential between negative electrode 1006 and the anode 1004.This causes electric current to flow to negative electrode 1006 via the organic layer that is inserted from anode 1004.In one embodiment, negative electrode 1006 offers adjacent organic layer 1010 to electronics.Anode 1004 is gone into organic layer 1010 to hole injection.Hole and electronics are compound in organic layer 1010, and produce the energy particle that is referred to as " exciton ".Exciton is given luminous organic material in the organic layer 1010 their energy delivery, and uses this energy from the luminous organic material visible emitting.The spectral characteristic of 1000,1001 light that produce and launch of OLED depends on the characteristic and the composition of organic molecule in the organic layer.The personnel that are familiar with ordinary skill can select the composition of one or more layers organic layer to adapt to the needs of application-specific.
Can also classify to OLED equipment according to photoemissive direction.In being referred to as a type of " top-emission " type, OLED equipment is by negative electrode or top electrodes 1006 emission light and display images.In these embodiments, use with respect to visible light be material transparent or at least the material of partially transparent make negative electrode 1006.In certain embodiments, can be for fear of loss by any light of anode or bottom electrode 1004, can make anode with the material of reflect visible light in fact.The second class OLED equipment is launched light by anode or bottom electrode 1004, and it is called " bottom emission " type.In bottom emissive type OLED equipment, use with respect to visible light at least the material of partially transparent make anode 1004.Often, in bottom emissive type OLED equipment, the usefulness material of reflect visible light is in fact made negative electrode 1006.The 3rd class OLED equipment is launched light on both direction, for example, by anode 1004 and negative electrode 1006 both.According to photoemissive direction, can be with being that material transparent, opaque or reflection forms substrate to visible light.
In many examples, as on substrate 1002, settling the OLED pel array 1021 that comprises a plurality of organic light emission pixels as shown in Fig. 3 C.In certain embodiments, come the conducting of the pixel in the array of controls 1021 and end by a drive circuit (not shown), and a plurality of pixel display message or image on array 1021 as a whole.In certain embodiments, settle OLED pel array 1021 with respect to other parts (such as driving and the control electronic circuit), with definition viewing area and non-display area.In these embodiments, the viewing area refers to the zone that forms OLED pel array 1021 on the substrate 1002.Non-display area refers to all the other zones on the substrate 1002.In certain embodiments, non-display area can inclusive disjunction/or power circuit.Be appreciated that and settled in the viewing area to small part control/components of drive circuit.For example, in PMOLED, conductive component will extend to the viewing area proper voltage is offered anode and negative electrode.In AMOLED, local drive circuit and will extend to the viewing area to drive and each pixel of control AMOLED with the data/scan line of drive circuit coupling.
Some organic material layer that in the OLED equipment one design and making considers to be OLED equipment can be damaged in being exposed to water, oxygen or other pernicious gas the time or quality is quickened variation.Therefore, generally can understand, seal or encapsulate, to prevent in manufacturing or operating environment, being exposed to moisture and oxygen or other pernicious gas of being found to OLED equipment.Fig. 3 D schematically illustrates cross section layout with Fig. 3 C, that obtain along the line d-d of Fig. 3 C through the OLED equipment 1011 of encapsulation.In this embodiment, the top plate of substantially flat or substrate 1061 link with sealing material 1071, and sealing material 1071 links to surround or to encapsulate OLED pel array 1021 with bottom plate or substrate 1002 again.In other embodiments, forming one or more layers on the top plate 1061 or on the bottom plate 1002, and sealing material 1071 links by this layer and bottom or top substrate 1002,1061.In an illustrated embodiment, sealing material 1071 extends along the periphery of OLED pel array 1021 or bottom or top plate 1002,1061.
In certain embodiments, sealing material 1071 is to be made by the melt material that will be discussed further below.In each embodiment, top and bottom plate 1061,1002 comprise such as materials such as plastics, glass and/or metal formings, these materials can to oxygen and/or water pass through to provide obstruct, thereby protection OLED pel array 1021 unlikely these materials that are exposed to.In certain embodiments, form in top plate 1061 and the bottom plate 1002 at least one with material transparent in fact.
In order to prolong the life-span of OLED equipment 1011, general require sealing material 1071 and top and bottom plate 1061,1002 to provide in fact for the impermeability sealing of oxygen and steam and provide in fact be hedged off from the outer world, confined space 1081.Point out that in some applications the sealing material 1071 of the melt material that combines with top and bottom plate 1061,1002 provides being less than about 10 -3Cc/m 2-day oxygen and be less than about 10 -6G/m 2The obstruct of the water in-sky.Suppose that some oxygen and moisture can be penetrated into confined space 1081, in certain embodiments, in confined space 1081, form the material that can absorb oxygen and/or moisture.
Sealing material 1071 has width W, and width W is the thickness of sealing material on the surface direction that is parallel to top or base substrate 1061,1002, as shown in Fig. 3 D.This width changes in each embodiment, scope from about 300 μ m to about 3000 μ m, selectively, from about 500 μ m to about 1500 μ m.Equally, the width at the diverse location place of sealing material 1071 may change.In certain embodiments, locate one of in sealing material 1071 contact bottoms and the top substrate 1002,1061 or contact the layer place that forms thereon, the width of sealing material 1071 may be a maximum.In sealing material 1071 and other object contact position, width may be minimum.Change width in the single cross section of sealing material 1071 is relevant with other design parameter with the shape of cross section of sealing material 1071.
Sealing material 1071 has height H, and as shown in Fig. 3 D, height H is the sealing material perpendicular to the thickness on the direction on the surface of top or base substrate 1061,1002.The height in each embodiment, change, scope from about 2 μ m to about 30 μ m, selectively, from about 10 μ m to about 15 μ m.Generally, in the not significant variation of the height at the diverse location place that seals material 1071.Yet in certain embodiments, at sealing material 1071 diverse location places, the height of sealing material changes.
In an illustrated embodiment, sealing material 1071 generally has the cross section of rectangle.Yet in other embodiments, sealing material 1071 can have other various shape of cross sections, such as general foursquare cross section, general trapezoidal cross section, the cross section with one or more circular edges or needed other configuration of given application.In order to improve sealing, generally requiring increases interface zone, and at this interface zone place, sealing material 1071 direct contact bottoms are with top substrate 1002,1061 or contact layer formed thereon.In certain embodiments, the shape that seals material can be designed and consequently interface zone can be increased.
Can settle sealing material 1071 to make it near OLED array 1021, in other embodiments, sealing material 1071 separates some distances with OLED array 1021.In certain embodiments, sealing material 1071 generally comprises to link together and surrounds the linear segmented of OLED array 1021.This linear segmented of sealing material 1071 can be extended, and in certain embodiments, generally is parallel to each border of OLED array 1021.In other embodiments, settle one or more linear segmented of sealing material 1071 to make it to have uneven relation with each border of OLED array 1021.In other embodiment again, at least a portion sealing material 1071 is pressed curve mode and is extended between top plate 1061 and bottom plate 1002.
As mentioned above, in certain embodiments, use melt material or simple " melt " or comprise that " melted glass " of thin glass particle forms sealing material 1071.The melt particle comprises magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li 2O), sodium oxide molybdena (Na 2O), potassium oxide (K 2O), boron oxide (B 2O 3), vanadium oxide (V 2O 5), zinc oxide (ZnO), tellurium oxide (TeO 2), aluminium oxide (Al 2O 3), silica (SiO 2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P 2O 5), ruthenium-oxide (Ru 2O), rubidium oxide (Rb 2O), rhodium oxide (Rh 2O), iron oxide (Fe 2O 3), cupric oxide (CuO), titanium oxide (TiO 2), tungsten oxide (WO 3), bismuth oxide (Bi 2O 3), antimony oxide (Sb 2O 3), in lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate etc. one or more.In certain embodiments, the size range of these particles from about 2 μ m to about 30 μ m, selectively, from about 5 μ m to about 10 μ m, though be not limited only to this.Particle can arrive greatly approximately and top and base substrate 1061,1002 between distance equally big, or the same big with distance between form any layer on these substrates of frit seal material 1071 contacts approximately.
The melt material that is used to form sealing material 1071 can also comprise one or more inserts or additive material.Can provide overall thermal expansion characteristics and/or the adjusting of inserts or additive material to seal the absorption characteristic of material 1071 for the selected frequency of incident radiation energy to regulate sealing material 1071.That inserts or additive material can also comprise conversion and/or additive inserts is to regulate the thermal coefficient of expansion of melt.For example, inserts or additive material can comprise transition metal, such as chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu) and/or vanadium.Other material as inserts or additive comprises ZnSiO 4, PbTiO 3, ZrO 2, eucryptite.
In certain embodiments, comprise from the glass particle of about about wt% of 20 to 90 as the melt material of doing component, all the other comprise inserts and/or additive.In certain embodiments, frit paste comprises the inorganic material of organic material He the about 70-90% of about 10-30wt%.In certain embodiments, frit paste comprises the inorganic material of organic material He the about 80wt% of about 20wt%.In certain embodiments, organic material can comprise the binding agent of about 0-30wt% and the solvent of about 70-100wt%.In certain embodiments, about 10wt% is that binding agent and about 90wt% are solvents in the organic material.In certain embodiments, inorganic material can comprise about 0-10wt% additive, about 20-40wt% inserts and about 50-80wt% glass powder.In certain embodiments, about 0-5wt% is that additive, about 25-30wt% are that inserts and about 65-75wt% are glass powders in the inorganic material.
When forming the frit seal material, fluent material is added in the dried melt material to form frit paste.Can use any organic or inorganic solvent that is with or without additive as fluent material.In certain embodiments, solvent comprises one or more organic compounds.For example, adaptable organic compound is ethyl cellulose, NC Nitroncellulose, hydroxypropyl cellulose (hydroxyl propyl cellulose), butyl carbitol acetate (butyl carbitol acetate), terpineol (terpineol), butyl cellosolve (butylcellusolve), acrylates compound (acrylate compounds).Then, can use the frit paste of formation like this on top and/or bottom plate 1061,1002, to form the shape of sealing material 1071.
In an example embodiment, form the shape of sealing material 1071 earlier from frit paste, and it is inserted between top plate 1061 and the bottom plate 1002.In certain embodiments, one of can solidify sealing material 1071 in advance or be sintered in advance in top and the bottom plate 1061,1002 on.Then be assembled with sealing material 1071 intercalary top plate 1061 and bottom plate 1002,, make the melt material partial melting at least that forms sealing material 1071 optionally to 1071 heating of part sealing material.Sealing material 1071 is solidified with firm binding between formation top plate 1061 and the bottom plate 1002 again, thereby prevent that airtight OLED pel array 1021 is exposed in oxygen or the water.
In certain embodiments, by carry out selectivity heating such as the light radiation of laser or directional ir lamp etc. to the frit seal material.As mentioned above, the melt material that forms sealing material 1071 can make up with one or more additives or inserts, and these additives or inserts are such as promoting melt material heating and fusing to seal material 1071 materials of selecting to form for the absorption that improves radiant light.
In certain embodiments, OLED equipment 1011 is produced in enormous quantities.In an embodiment shown in Fig. 3 E, on common floor substrate 1101, form a plurality of discrete OLED arrays 1021.In an illustrated embodiment, the melt of setting surrounds each OLED array 1021 to form sealing material 1071.In certain embodiments, on common floor substrate 1101, place public top substrate (not shown), and form some structures thereon and be inserted between common floor substrate 1101 and the public top substrate with the frit paste that causes OLED array 1021 and setting.OLED array 1021 is encapsulated and seals, such as encapsulation process by former described single OLED display device.The product that is produced comprises a plurality of OLED equipment that keep together by common floor and top substrate.Then, the product that is produced is cut into a plurality of, an OLED equipment 1011 among each piece pie graph 3D.In certain embodiments, the encapsulation operation of further each OLED equipment 1011 being added again, the sealing that forms with further raising frit seal material 1071 and top and base substrate 1061,1002.
Sometimes, encapsulant can not prevent fully that moisture or air from entering the space that is surrounded.Equally, because a variety of causes may produce the crack in the encapsulant or in the interface zone of encapsulant contact substrate.
Fig. 1 a is a cross-sectional view to Fig. 1 f, and the method for making organic light emitting display according to one embodiment of the invention is shown.Fig. 2 a is a perspective view to Fig. 2 f, and the method for making organic light emitting display according to one embodiment of the invention is shown.Fig. 1 a is the explanation embodiments of the invention to Fig. 1 f and Fig. 2 a to Fig. 2 f, but the present invention be not limited to Fig. 1 a to Fig. 1 f and Fig. 2 a to the illustrated embodiment of Fig. 2 f.
Hereinafter, two display screens in a plurality of display screens of settling continuously are called first display screen 120 and second display screen 130.With reference to figure 1a and Fig. 2 a, the mode of settling with first display screen 120 and second display screen, 130 orders on first female substrate 110 forms at least the first display screen 120 and second display screen 130.First display screen 120 comprises the first pixel region 120a and the first non-pixel region 120b.Second display screen 130 comprises the second pixel region 130a and the second non-pixel region 130b.Second female substrate 160 is positioned at the bottom of first female substrate 110, and covers first female substrate 110.Form the line of cut (not shown) on each of first female substrate 110 and second female substrate 120, this line of cut is separated from each other each display screen.For example, the boundary between the second non-pixel region 130b of the first pixel region 120b of first display screen 120 and second display screen 130 forms line of cut.
With reference to figure 1b and 2b, on a surface of second female substrate 160, on the part corresponding, apply melt 140 with each periphery among pixel region 120a and the 130a, it has sealed the pixel region 120a and the 130a of first female substrate 110 at least.That is, along with first female substrate 110 in the pixel region 120a and the corresponding outer peripheral areas of 130a that form apply melt 140.In one embodiment, melt 140 comprises inserts (not shown) and absorbent (not shown).Inserts is regulated the thermal coefficient of expansion of melt 140.Absorbent absorbs laser or infrared ray.Make melt 140 with glass powder form with oxide powder.By the quick reduction temperature of heating glass material, form the melt 140 of glass powder form.Organic substance is added in the melt 140 to make the cream of gelinite state.Then, under predetermined temperature sintering melt 140 to remove organic substance.The frit paste of gelinite state is solidified to form solid-state frit seal material 140.In one embodiment, best, the scope of the temperature of sintering melt 140 is from about 300 ℃ to about 700 ℃.
With reference to figure 1c and Fig. 2 c,, with laser or infrared radiation melt 140, thereby make melt 140 fusings, and then melt is solidified making after first female substrate 110 and second female substrate 160 be bonded with each other.Therefore, first female substrate 110 is bonded with each other with second female substrate 160 and is in the same place.Second female substrate 160 covers first female substrate 110, forms predetermined seal cavity in equipment, and protection organic light emission pixel is not influenced by external oxygen or moisture.
With reference to figure 1d and Fig. 2 d, use cutting machine to carry out cutting process, make first and second female substrates 110 and 160 of joint be separated into each unit display screen then.Carry out cutting process along the line of cut (not shown) that is formed on first and second female substrates 110 and 160.
With reference to figure 1e and Fig. 2 e, in the alignment device (not shown), aim at unit display screen or the uncompleted equipment that has separated.In alignment device, provide slit and separator to make it to have the structure that to accept many units display screen.In one embodiment, in alignment device, aim at the unit display screen and make it close mutually.First substrate of a unit display screen in the unit display screen of having aimed at and face mutually with second substrate in another close unit display screen of having aimed at of unit display screen, and be separated from each other or link mutually.Reinforce key element 150 to reduce the processing time by using alignment device disposable formation in each unit display screen.
Can form groove so that liquid reinforcement material on the downside surface of this external alignment device contacts with a side surface of unit display screen.In alignment device, can use the material that does not have bonding strength with reinforcement material, so that easily separate the unit display screen.
With reference to figure 1f and Fig. 2 f, the liquid basin 180 that comprises liquid reinforcement material is placed or be immersed in to the alignment device that is used for the unit's of aligning display screen.After this, Ye Tai reinforcement material contacts between first substrate 110 and second substrate 160 by the groove that is formed on the alignment device downside and the non-pixel region of the unit display screen that melt 140 is outer.Because the cause of capillarity phenomenon is being filled liquid reinforcement material between first substrate 110 and second substrate 160 He outside the melt 140.In one embodiment, can use the fluent material that has less than the low viscosity characteristics of about 200cp as reinforcement material.Can use acrylate cyanide (Acrylatecyanide), acrylate (acrylate), epoxy resin, acrylate and urethane acrylate (acrylateand urethane acrylate) as reinforcement material.The acrylate cyanide be can spontaneous curing material.Acrylate is can be at the material that is lower than hot curing under about 80 ℃ temperature.Epoxy resin, acrylate and polyurethane are can be by the material of ultraviolet curing.After separately being positioned at the unit display screen of alignment device, carry out ultraviolet curing, spontaneous curing or heat treatment to the reinforcement material that is filled in the liquid state between first female substrate 110 and the second female substrate 160, reinforce key element 150 to form.Therefore, the unit display device or the screen of completion have been formed.
Can understand from top description,, also outside making the bonding mutually melt of first and second substrates, form the reinforcing key element according to the present invention.This can make organic light emitting display be not easy to break because of collision, and has improved the reliability of equipment.In addition, this can protect the organic light emission pixel to make it to isolate with surrounding environment perfectly.Equally, by in the reinforcement material of liquid phase, flooding the non-pixel region of unit display screen simultaneously, between first and second substrates, formed the reinforcing key element.Therefore, this method is compared with the method for the reinforcing key element that forms each unit display screen one by one, and this method can reduce the processing time, and therefore, the present invention has increased the batch process of organic light emitting display widely.
Though illustrated and described several embodiments of the present invention, but those skilled in the art that should be appreciated that, can make amendment in an embodiment and do not depart from principle of the present invention and spirit, scope of the present invention is to be limited by claims and their equivalent.

Claims (25)

1. method that is used to make oganic light-emitting display device, described method comprises:
First and second equipment are provided, and each equipment comprises:
First substrate that comprises first side surface;
Comprise first side surface and second substrate relative with first substrate;
Be inserted in the array of the organic light emission pixel between first and second substrates;
Be inserted in the frit seal material that surrounds array between first substrate and second substrate simultaneously, wherein frit seal material, first substrate and second substrate have defined a confined space placing array together, and the frit seal material package is drawn together first side surface, and
First side that comprises first side surface of first substrate, second substrate and frit seal material;
Settle first or second substrate of first substrate surface of first and second equipment so that first equipment, and first side of first and second equipment is in fact towards identical direction to second equipment;
Make curable materials contact two first sides of first and second equipment, thereby on two first sides of first and second equipment, form curable material; And
Solidify to form the curable materials on first side of first and second equipment, thus first structure of first side of formation contact first equipment and second structure that forms first side of second equipment of contact.
2. the method for claim 1 is characterized in that, described arrangement comprises:
The support that is configured to fixing described first and second equipment is provided; And
First substrate surface of fixing described first and second equipment so that described first equipment to first or second substrate of described second equipment and so that first side of described first and second equipment in fact towards equidirectional.
3. the method for claim 1 is characterized in that, described contact comprises:
Described first and second equipment are fixed together; And
The whole immersion curable materials of described first and second equipment, consequently at least a portion first side contacts curable materials of described first equipment and consequently at least a portion first side contacts curable materials of described second equipment.
4. method as claimed in claim 2 is characterized in that, described immersion comprises:
Described first and second equipment are moved to the curable materials that comprises top surface together, and
Regulate described first and second equipment first side towards so that before first side surface of first substrate will contact top surface, first side surface of first substrate of described first or second equipment is parallel to described top surface usually.
5. the method for claim 1, it is characterized in that, form clearance space in each equipment in described first and second equipment of being combined in of described first substrate, described second substrate and described frit seal material outside confined space, wherein at least a portion curable materials can enter clearance space.
6. method as claimed in claim 5 is characterized in that, contacts described curable materials and comprises and make curable materials enter described clearance space.
7. method as claimed in claim 6 is characterized in that, at least a portion curable materials that enters described clearance space can spontaneously move to the frit seal material.
8. method as claimed in claim 5 is characterized in that, described clearance space has the degree of depth from first side surface of described first substrate to first side surface of described frit seal material, wherein this degree of depth from about 0.3 to about 0.7mm.
9. method as claimed in claim 5 is characterized in that, the distance between first substrate described in the described clearance space and described second substrate is to about 30 μ m from about 2.
10. the method for claim 1, it is characterized in that, form clearance space in each equipment in described first and second equipment of being combined in of described first substrate, described second substrate and described frit seal material outside confined space, wherein at least a portion curable materials enters described clearance space by the capillarity phenomenon.
11. the method for claim 1 is characterized in that, contacts described curable materials and comprises at least a portion first side of making described curable materials contact described first equipment and at least a portion first side of described second equipment.
12. the method for claim 1 is characterized in that, the contact curable materials comprises first side surface that makes the frit seal material in described curable materials contact each equipment in described first and second equipment.
13. the method for claim 1 is characterized in that, the viscosity of described curable materials can be less than about 200cP.
14. the method for claim 1 is characterized in that, described " arrangement " is included between first or second substrate of first substrate of described first equipment and described second equipment and places insert.
15. the method for claim 1 is characterized in that, described " arrangement " comprises that first substrate that makes described first equipment contacts first or second substrate of described second equipment.
16. the method for claim 1 is characterized in that, settles first substrate of described first equipment to make it to be parallel in fact first or second substrate of described second equipment.
17. the method for claim 1 is characterized in that, first side surface of described frit seal material is parallel to first side surface of described first substrate in fact.
18. the method for claim 1 is characterized in that, described first structure contacts the frit seal material of described first equipment.
19. the method for claim 1 is characterized in that, described first structure contacts at least one in described first and second substrates.
20. the method for claim 1 is characterized in that, after solidifying described first and second structures is become one.
21. method as claimed in claim 20 is characterized in that, also comprises making described first structure and described second structure separately.
22. the method for claim 1, it is characterized in that, each equipment in described first and second equipment comprises second side of second side surface that comprises first substrate, second substrate and frit seal material, and wherein said method also comprises second side contacts that makes curable materials and described first and second equipment.
23. the method for claim 1 is characterized in that, also comprising provides at least one optional equipment, and described optional equipment comprises:
First substrate that comprises first side surface;
Comprise first side surface and second substrate relative with first substrate;
Be inserted in the array of the organic light emission pixel between first and second substrates;
Be inserted in the frit seal material that surrounds array between first substrate and second substrate simultaneously, wherein frit seal material, first substrate and second substrate have defined the confined space that array is set together, and the frit seal material package is drawn together first side surface, and
First side that comprises first side surface of first substrate, second substrate and frit seal material;
Wherein " arrangement " also settle at least one optional equipment with first and second equipment;
Wherein " contact " also at least one optional equipment, contact curable materials; And
Wherein " curing " form at least one additional structure, each in the additional structure contacts at least one optional equipment first side of each.
24. the method for claim 1 is characterized in that, adaptive described curable materials makes it to become reinforcement material.
25. the method for claim 1 is characterized in that, described frit seal material package is drawn together from comprising magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li 2O), sodium oxide molybdena (Na 2O), potassium oxide (K 2O), boron oxide (B 2O 3), vanadium oxide (V 2O 5), zinc oxide (ZnO), tellurium oxide (TeO 2), aluminium oxide (Al 2O 3), silica (SiO 2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P 2O 5), ruthenium-oxide (Ru 2O), rubidium oxide (Rb 2O), rhodium oxide (Rh 2O), iron oxide (Fe 2O 3), cupric oxide (CuO), titanium oxide (TiO 2), tungsten oxide (WO 3), bismuth oxide (Bi 2O 3), antimony oxide (Sb 2O 3), one or more materials of selecting in the group of lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate.
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