CN101093743B - Method for producing electrolytic copper foil in use for fabricating thermistor made from polymer - Google Patents
Method for producing electrolytic copper foil in use for fabricating thermistor made from polymer Download PDFInfo
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- CN101093743B CN101093743B CN200710022677A CN200710022677A CN101093743B CN 101093743 B CN101093743 B CN 101093743B CN 200710022677 A CN200710022677 A CN 200710022677A CN 200710022677 A CN200710022677 A CN 200710022677A CN 101093743 B CN101093743 B CN 101093743B
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Abstract
The invention includes following working procedures: acid washing; coursing and solidifying single side; coursing two sides; coursing and solidifying two sides again; nickel plating solidified two sided layers, and coupling procedure for nickel plated two sided layers. Compared with prior art, the invention possesses features of simple technique, even quality, low production cost, and possible to produce copper foil in large-scale continuously.
Description
Technical field:
The invention belongs to this technical field of manufacture method of electrolytic copper foil, be specially adapted to this technical field of manufacture method of bilayer, multiple layer polymer thermistor (PPTC).
Background technology:
PPTC is mainly made by polyethylene (Polyethylene) core, the electrode of filling conductor, and its filling conductor main component is a carbon black.According to the number of plies of core, PPTC can be divided into individual layer, bilayer, sandwich construction pattern.The electrode number of plies=core the number of plies+1 of bilayer, multilayer PPTC, it is consistent with individual layer that electrode double-deck, multilayer PPTC is drawn principle, its multi-electrode finally is combined into bipolar electrode and draws (seeing JP249515), the combination of kind electrode is the current limiting capacity of amplifier element unit are at double, and then satisfies the requirement of IC high integration.
The electrode of PPTC is generally handled nickel foil, the manufacturing of nickel plating Copper Foil by surface coarsening, surface coarsening is handled nickel foil can satisfy the requirement of individual layer PPTC outer electrode workmanship, but when being used for the internal layer electrode of bilayer, multilayer PPTC, the adhesion strength of nickel foil and core can not satisfy high-power repetition thermal shock requirement, be easy to generate core and electrode separation, can not satisfy the quality requirement of bilayer, multilayer PPTC.CN1447351A has introduced a kind of mode of production of batch production PPTC electrode special material, but the Ry value of the non-treated side of this nickel plating Copper Foil is usually less than 1.5 μ m, be equivalent to 15～20% of roughening treatment surface roughness, after itself and core pressing, peel strength has only 0.2～0.3kg/cm, be lower than the standard-required of adhesion strength greater than 1.0kg/cm, the Copper Foil that causes this kind method to be produced can not satisfy the requirement of bilayer, the manufacturing of multilayer PPTC internal layer electrode, and its market meaning meaning is also little.
Summary of the invention:
The invention provides the method for producing electrolytic copper foil of a kind of suitable bilayer, multilayer PPTC.
The technical scheme of technical solution problem of the present invention is: a kind of method for producing electrolytic copper foil that is used for the polymer thermistor manufacturing comprises: pickling process, single face alligatoring curing process, single face curing process, double-sided coarsening operation, double-sided coarsening layer be curing process, two-sided cured layer nickel plating process, two-sided nickel coating coupling operation again, and these operations are to finish continuously on a production line.
The condition of work of described single face alligatoring curing process is contained among the double-sided coarsening curing process.
The condition of work of described single face curing process is:
Current density: 20～40A/dm
2
Temperature: 30～60 ℃;
Cu
2+：50～90g/L；
H
2SO
4：70～110g/L；
The condition of work of described double-sided coarsening operation is:
Current density: 12～30A/dm
2
Temperature: 21～35 ℃;
Cu
2+：10～22g/L；
H
2SO
4：50～90g/L；
Lauryl sodium sulfate: 0.5～15mg/L;
The described double-sided coarsening layer condition of work of curing process again is:
Current density: 20～40A/dm
2
Temperature: 30～60 ℃;
Cu
2+：50～90g/L；
H
2SO
4：70～110g/L；
The condition of work of described two-sided cured layer nickel plating process is:
Current density: 10～30A/dm
2
Temperature: 30～60 ℃;
Ni
2+：20～90g/L；
The condition of work of described two-sided nickel coating coupling operation is:
A-187：0.1～1.0％；
Temperature: 15～50 ℃.
The condition of work of preferred single face curing process is:
Current density: 25～30A/dm
2
Temperature: 40～50 ℃;
Cu
2+：60～70g/L；
H
2SO
4：80～90g/L；
The condition of work of preferred double-sided coarsening operation is:
Current density: 18～24A/dm
2
Electrolyte temperature: 24～28 ℃;
Cu
2+：12～16g/L；
H
2SO
4：60～70g/L；
Lauryl sodium sulfate: 2～5mg/L;
The preferred double-sided coarsening layer condition of work of curing process again is:
Current density: 25～30A/dm
2
Temperature: 40～50 ℃;
Cu
2+：60～70g/L；
H
2SO
4：80～90g/L；
The condition of work of preferred two-sided cured layer nickel plating process is:
Current density: 15～20A/dm
2
Temperature: 40～50 ℃;
Ni
2+：40～60g/L；
The condition of work of preferred two-sided nickel coating coupling operation is:
A-187：0.3～0.5％；
Temperature: 20～35 ℃.
For improving double-sided coarsening nickel plating Copper Foil light surface roughness, preferably the light face is implemented 2～3 times cured, implement the roughening treatment of light face again.
The light face cured layer thickness range of double-sided coarsening nickel plating Copper Foil is 1～5 μ m, and optimum range is 2～4 μ m.
The light face roughened layer thickness range of double-sided coarsening nickel plating Copper Foil is 2～6 μ m, and optimum range is 3～4 μ m.
The present invention compared with prior art has that technology is simple, quality is even, production cost is low, characteristics that can large-scale production.
Description of drawings:
Fig. 1 is a structural representation of the present invention;
1 paper tinsel of making a living, 2 is roughened layer, and 3 is cured layer, and 4 is nickel coating, and 5 is coupling agent layer.
Embodiment:
Below in conjunction with embodiment the present invention is described in detail.
Roughness of the present invention, peel strength, high temperature resistance thermo-color ability are pressed the ICP-MF-650 standard detection.
Embodiment 1:
1, pickling process: the 30 μ m of M face Ry7.8 μ m are given birth to paper tinsel, after cleaning with the sulfuric acid acid of 100g/L,
2, the condition of work of single face alligatoring curing process is identical with the condition of double-sided coarsening curing process.
3, single face curing process:
With the Copper Foil that solidified at current density: 20A/dm
2, temperature: 30 ℃, Cu
2+: 50g/L, H
2SO
4: electroplate under the condition of 70g/L.
4, double-sided coarsening operation
The Copper Foil that the light face is cured is at current density: 12A/dm
2, temperature: 21 ℃, Cu
2+: 10g/L, H
2SO
4: electroplate under the condition of 50g/L, lauryl sodium sulfate: 0.5mg/L.
5, double-sided coarsening layer curing process again:
The Copper Foil that double-sided coarsening is good is at current density: 20A/dm
2, temperature: 30 ℃, Cu
2+: 50g/L, H
2SO
4: electroplate under the condition of 70g/L.
6, two-sided cured layer nickel plating process:
With the two-sided Copper Foil that is cured at current density: 10A/dm
2, temperature: 30 ℃, Ni
2+: electroplate under the condition of 20g/L.
7, the condition of work of described two-sided nickel coating coupling operation is:
With the two-sided Copper Foil that is cured in A-187:0.1%, temperature: carry out coupling under 15 ℃ the condition.
Embodiment 2:
1, pickling process: the 30 μ m of M face Ry7.8 μ m are given birth to paper tinsel, after cleaning with the sulfuric acid acid of 100g/L,
2, the condition of work of single face alligatoring curing process is identical with the condition of double-sided coarsening curing process.
3, single face curing process:
With the Copper Foil that solidified at current density: 25A/dm
2, temperature: 40 ℃, Cu
2+: 60g/L, H
2SO
4: electroplate under the condition of 80g/L.
4, double-sided coarsening operation
The Copper Foil that the light face is cured is at current density: 18A/dm
2, temperature: 24 ℃, Cu
2+: 12g/L, H
2SO
4: electroplate under the condition of 60g/L, lauryl sodium sulfate: 2mg/L.
5, double-sided coarsening layer curing process again:
The Copper Foil that double-sided coarsening is good is at current density: 25A/dm
2, temperature: 40 ℃, Cu
2+: 60g/L, H
2SO
4: electroplate under the condition of 80g/L.
6, two-sided cured layer nickel plating process:
With the two-sided Copper Foil that is cured at current density: 15A/dm
2, temperature: 40 ℃, Ni
2+: electroplate under the condition of 40g/L.
7, the condition of work of described two-sided nickel coating coupling operation is:
With the two-sided Copper Foil that is cured in A-187:0.3%, temperature: carry out coupling under 20 ℃ the condition.
Embodiment 3:
1, pickling process: the 30 μ m of M face Ry7.8 μ m are given birth to paper tinsel, after cleaning with the sulfuric acid acid of 100g/L,
2, the condition of work of single face alligatoring curing process is identical with the condition of double-sided coarsening curing process.
3, single face curing process:
With the Copper Foil that solidified at current density: 30A/dm
2, temperature: 50 ℃, Cu
2+: 70g/L, H
2SO
4: electroplate under the condition of 90g/L.
4, double-sided coarsening operation
The Copper Foil that the light face is cured is at current density: 24A/dm
2, temperature: 28 ℃, Cu
2+: 16g/L, H
2SO
4: electroplate under the condition of 70g/L, lauryl sodium sulfate: 5mg/L.
5, double-sided coarsening layer curing process again:
The Copper Foil that double-sided coarsening is good is at current density: 30A/dm
2, temperature: 50 ℃, Cu
2+: 70g/L, H
2SO
4: electroplate under the condition of 90g/L.
6, two-sided cured layer nickel plating process:
With the two-sided Copper Foil that is cured at current density: 20A/dm
2, temperature: 50 ℃, Ni
2+: electroplate under the condition of 60g/L.
7, the condition of work of described two-sided nickel coating coupling operation is:
With the two-sided Copper Foil that is cured in A-187:0.5%, temperature: carry out coupling under 35 ℃ the condition.
Embodiment 4:
1, pickling process: the 30 μ m of M face Ry7.8 μ m are given birth to paper tinsel, after cleaning with the sulfuric acid acid of 100g/L,
2, the condition of work of single face alligatoring curing process is identical with the condition of double-sided coarsening curing process.
3, single face curing process:
With the Copper Foil that solidified at current density: 40A/dm
2, temperature: 60 ℃, Cu
2+: 90g/L, H
2SO
4: electroplate under the condition of 110g/L.
4, double-sided coarsening operation
The Copper Foil that the light face is cured is at current density: 30A/dm
2, temperature: 35 ℃, Cu
2+: 22g/L, H
2SO
4: electroplate under the condition of 90g/L, lauryl sodium sulfate: 15mg/L.
5, double-sided coarsening layer curing process again:
The Copper Foil that double-sided coarsening is good is at current density: 40A/dm
2, temperature: 60 ℃, Cu
2+: 90g/L, H
2SO
4: electroplate under the condition of 110g/L.
6, two-sided cured layer nickel plating process:
With the two-sided Copper Foil that is cured at current density: 30A/dm
2, temperature: 60 ℃, Ni
2+: electroplate under the condition of 90g/L.
7, the condition of work of described two-sided nickel coating coupling operation is:
With the two-sided Copper Foil that is cured in A-187:1.0%, temperature: carry out coupling under 50 ℃ the condition.
Embodiment 5, and except that the light face carried out solidifying for three times, all the other were identical with embodiment 3.
| M face Ry value | S face Ry value | M face peel strength | S face peel strength | |
| Embodiment 1 | 11 | 4.5 | 1.2 | 1.05 |
| Embodiment 2 | 11 | 4.5 | 1.2 | 1.05 |
| Embodiment 3 | 11 | 4.6 | 1.2 | 1.05 |
| |
11 | 4.5 | 1.2 | 1.05 |
| Embodiment 5 | 11 | 4.5 | 1.2 | 1.05 |
The Copper Foil that embodiment 1-5 is prepared is being heated under 250 ℃ of conditions the equal nondiscolouring of 30min.
Copper Foil of the present invention is not limited to the electrode range of application of PPTC, and Copper Foil of the present invention can be used for the high-end copper-clad plate production that heat resistanceheat resistant becomes Capability Requirement height, special base material (as the tetrafluoro base material).
Claims (6)
1. one kind is used for the method for producing electrolytic copper foil that polymer thermistor is made, comprise: pickling process, single face alligatoring curing process, single face curing process, double-sided coarsening operation, double-sided coarsening layer be curing process, two-sided cured layer nickel plating process, two-sided nickel coating coupling operation again, it is characterized in that:
The condition of work of described single face curing process is:
Current density: 20～40A/dm
2
Temperature: 30～60 ℃;
Cu
2+：50～90g/L；
H
2SO
4：70～110g/L；
The condition of work of described double-sided coarsening operation is:
Current density: 12～30A/dm
2
Temperature: 21～35 ℃;
Cu
2+：10～22g/L；
H
2SO
4：50～90g/L；
Lauryl sodium sulfate: 0.5～15mg/L;
The described double-sided coarsening layer condition of work of curing process again is:
Current density: 20～40A/dm
2
Temperature: 30～60 ℃;
Cu
2+：50～90g/L；
H
2SO
4：70～110g/L；
The condition of work of described two-sided cured layer nickel plating process is:
Current density: 10～30A/dm
2
Temperature: 30～60 ℃;
Ni
2+：20～90g/L；
The condition of work of described two-sided nickel coating coupling operation is:
A-187：0.1～1.0％；
Temperature: 15～50 ℃;
The condition of work of described single face alligatoring curing process is identical with the condition of double-sided coarsening curing process.
2. a kind of method for producing electrolytic copper foil that polymer thermistor is made that is used for according to claim 1 is characterized in that:
The condition of work of described single face curing process is:
Current density: 25～30A/dm
2
Temperature: 40～50 ℃;
Cu
2+：60～70g/L；
H
2SO
4：80～90g/L；
The condition of work of described double-sided coarsening operation is:
Current density: 18～24A/dm
2
Electrolyte temperature: 24～28 ℃;
Cu
2+：12～16g/L；
H
2SO
4：60～70g/L；
Lauryl sodium sulfate: 2～5mg/L;
The described double-sided coarsening layer condition of work of curing process again is:
Current density: 25～30A/dm
2
Temperature: 40～50 ℃;
Gu
2+：60～70g/L；
H
2SO
4：80～90g/L；
The condition of work of described two-sided cured layer nickel plating process is:
Current density: 15～20A/dm
2
Temperature: 40～50 ℃;
Ni
2+：40～60g/L；
The condition of work of described two-sided nickel coating coupling operation is:
A-187：0.3～0.5％；
Temperature: 20～35 ℃.
3. a kind of method for producing electrolytic copper foil that polymer thermistor is made that is used for according to claim 1 and 2, it is characterized in that: the light face cured layer thickness range of double-sided coarsening nickel plating Copper Foil is 1～5 μ m.
4. a kind of method for producing electrolytic copper foil that polymer thermistor is made that is used for according to claim 3, it is characterized in that: the light face cured layer thickness range of double-sided coarsening nickel plating Copper Foil is 2～4 μ m.
5. a kind of method for producing electrolytic copper foil that polymer thermistor is made that is used for according to claim 1 and 2, it is characterized in that: the light face roughened layer thickness range of double-sided coarsening nickel plating Copper Foil is 2～6 μ m.
6. a kind of method for producing electrolytic copper foil that polymer thermistor is made that is used for according to claim 5, it is characterized in that: the light face roughened layer thickness range of double-sided coarsening nickel plating Copper Foil is 3～4 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710022677A CN101093743B (en) | 2007-05-25 | 2007-05-25 | Method for producing electrolytic copper foil in use for fabricating thermistor made from polymer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710022677A CN101093743B (en) | 2007-05-25 | 2007-05-25 | Method for producing electrolytic copper foil in use for fabricating thermistor made from polymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101093743A CN101093743A (en) | 2007-12-26 |
| CN101093743B true CN101093743B (en) | 2010-05-19 |
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|---|---|---|---|
| CN200710022677A Expired - Fee Related CN101093743B (en) | 2007-05-25 | 2007-05-25 | Method for producing electrolytic copper foil in use for fabricating thermistor made from polymer |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054547B (en) * | 2009-10-29 | 2012-11-21 | 比亚迪股份有限公司 | Positive temperature coefficient thermistor and preparation method thereof |
| CN102054548B (en) * | 2009-10-31 | 2012-12-19 | 比亚迪股份有限公司 | Negative temperature coefficient thermistor and preparation method thereof |
| CN102409322B (en) * | 2011-11-16 | 2013-12-25 | 鞍山市中普仪表电子设备有限公司 | Manufacturing process for chemically plating NiP-Cu electrode on partial surface of ceramic element |
| CN106868510A (en) * | 2017-03-01 | 2017-06-20 | 东莞市航晨纳米材料有限公司 | A kind of low-resistance preparation method of two-sided composite membrane of software ion |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6525921B1 (en) * | 1999-11-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| CN1447351A (en) * | 2003-01-07 | 2003-10-08 | 上海维安热电材料股份有限公司 | PTC Method for manufacturing electrode material of lamella type macromolecule PTC thermistor |
-
2007
- 2007-05-25 CN CN200710022677A patent/CN101093743B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6525921B1 (en) * | 1999-11-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| CN1447351A (en) * | 2003-01-07 | 2003-10-08 | 上海维安热电材料股份有限公司 | PTC Method for manufacturing electrode material of lamella type macromolecule PTC thermistor |
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|---|---|
| CN101093743A (en) | 2007-12-26 |
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Owner name: NANLING HENGCHANG CUPRUM FOIL MANUFACTURING CO., L Free format text: FORMER OWNER: GAN YUE Effective date: 20110704 |
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Effective date of registration: 20110704 Address after: 241300 Nanling Economic Development Zone, Wuhu, Anhui Patentee after: Nanling Hengchang Cuprum Foil Manufacturing Co.,Ltd. Address before: 241300 No. 192 fan Tong Village, Jinghu District, Anhui, Wuhu Patentee before: Gan Yue |
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