CN101082405A - LED light-emitting component - Google Patents
LED light-emitting component Download PDFInfo
- Publication number
- CN101082405A CN101082405A CNA2007100750262A CN200710075026A CN101082405A CN 101082405 A CN101082405 A CN 101082405A CN A2007100750262 A CNA2007100750262 A CN A2007100750262A CN 200710075026 A CN200710075026 A CN 200710075026A CN 101082405 A CN101082405 A CN 101082405A
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- Prior art keywords
- led
- liquid
- fluorescent material
- working fluid
- flaring
- Prior art date
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Links
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 38
- 239000012530 fluid Substances 0.000 claims description 21
- 230000008676 import Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010023126 Jaundice Diseases 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
This invention discloses a sort of LED flaring element which adopt the complex flaring technique of fluorescent powder, it makes the LED flaring wafer of metal base plate embark locate in a transparent cover, the transparent cover is full of liquid in order that the liquid can submerge the whole surface of LED flaring wafer and it accession fluorescent powder in the liquid, so the fluorescent powder equably disperse in the liquid of the surface of LED flaring wafer. This invention ameliorates the method of the distribution of the external fluorescent powder, it effectively avoids the phenomenon that the fluorescent powder in the surface of LED flaring wafer heat up in the high temperature and reduces the aging of the fluorescent powder and reduce the light attenuation greatly.
Description
Technical field
The present invention relates to a kind of LED light-emitting component that adopts fluorescent material recombination luminescence technology.
Background technology
Japanese Ri Ya chemical company (Nichia Chemical) in 1996 discovery cooperates blue LED with yttrium-aluminium-garnet (YAG) fluorescent material of jaundice spectrum row, can make white light source.Utilize blue led to be basic light source, a part of blue light that blue led is sent is used for excitated fluorescent powder, make fluorescent material send green-yellow light or ruddiness and green glow, another part blue light transmits, and forms white light by the yellow-green light of fluorescent material or the blue light of ruddiness and green glow and transmission.
At present, also in the special phosphor of exploitation purple light and ultraviolet light series, the emission wavelength of this class fluorescent material is 370～420nm to people, utilizes the method for coating, and this class fluorescent material cooperates the LED of purple light or ultraviolet light also can produce white light LEDs.Same principle, the different light that can produce other colors, the principles of LED fluorescent material recombination luminescence technology that Here it is of cooperating of base light and fluorescent material.
For convenience of description, all add that with blue-light LED chip corresponding fluorescent material produces white light the present invention is described below.
Generally using at present blue-ray LED to add the technology that the fluorescent material recombination luminescence produces white light all adopts coating method to realize, common technology is to be coated in the surface of LED wafer after fluorescent material and the glue mixing, therefore the size of fluorescent powder grain, the uniformity of coating, the thickness of fluorescence coating etc. all are difficult to controlled, not only light efficiency can be influenced, and color parameter and spatial light intensity distribution and colour temperature Ra value can be changed.Because the LED wafer is cuboid, light intensity changes decay rapidly with angle, the spectral space skewness, and superimposed with the uncontrollability effect that the coating technology of fluorescent material produces, can there be problems such as serious colour cast in the edge.
In addition, the method for packing of existing fluorescent material recombination luminescence LED is behind the coating fluorescent powder layer phosphor powder layer to be solidified, and the fluorescent material of LED wafer surface is solid-state form, and seals with transparent resin.When LED works, because of the current density of PN junction of the wafer of flowing through bigger, the temperature of wafer surface is very high, and about 300～400 degree make the solid phosphor of LED wafer surface be in the high temperature heated condition for a long time like this, quickened the aging of fluorescent material, reduce its luminous efficiency, make its optical attenuation very fast, thereby white light LEDs is shortened service life greatly, high-power LED particularly, this phenomenon is more outstanding.Simultaneously, white light LEDs is owing to be coated with phosphor powder layer (the part blue light is converted to white light), a bright dipping part directly sees through epoxy resin and penetrates, and another part is by the fluorescent material scattering, near shortwave radiation and the heat high concentration bisque thus, epoxy resin " xanthochromia " around causing being filled in has greatly influenced light output efficiency.
Patent applicant of the present invention has submitted a Chinese invention patent application on June 4th, 2007, and its application number is 200710074813.5, and its can effectively dissipate heat of LED element surface can solve because heat deposition causes fluorescent material character problem of unstable.But for using coating method to generate the harmful effect that the solid state fluorescence bisque produces in the LED wafer surface, for example cause light efficiency to reduce, change color parameter, change spatial light intensity and distribute and colour temperature Ra value, problems such as the serious colour cast of marginal existence do not propose solution.
Summary of the invention
The objective of the invention is to propose the LED light-emitting component of the method that a kind of LED of improvement surface fluorescence powder distributes, solve owing to using coating method to cause influencing light efficiency, change color parameter, change spatial light intensity and distribute and colour temperature Ra value problems such as the serious colour cast of marginal existence.
In order to achieve the above object, the present invention is realized by following technical scheme.
The LED luminescent wafer that metal substrate loads is located in the translucent cover, and filled with fluid in translucent cover can flood liquid and covers whole LED luminescent wafer surface; And in liquid, be added with fluorescent material, fluorescent material is dispersed in the liquid on LED luminescent wafer surface.
Described liquid is working fluid, and the working fluid that wherein contains fluorescent material is any one exiting surface that is coated on the LED luminescent wafer.
Described translucent cover is provided with the working fluid circulation import and export that contains fluorescent material, connects a liquid cooling circulation heat abstractor at the working fluid circulation import and export place that contains fluorescent material.
The present invention compares with prior art, has adopted the radiator structure that utilizes the working fluid circulation to absorb heat on LED luminescent wafer surface, and its can dissipate heat of LED wafer surface is controlled the integral heat sink performance preferably.The present invention improves the method that LED surface fluorescence powder distributes, the solid-state form fluorescent material that tradition is coated on LED luminescent wafer surface adds in the working fluid of heat radiation, effectively avoided fluorescent material in LED luminescent wafer surface high temperature heating phenomena, reduced the aging of fluorescent material, optical attenuation is reduced greatly.Utilize the working fluid fluorescent material that distributes, make fluorescent material be evenly distributed on any one light-emitting area of LED luminescent wafer, moreover the intrinsic refractive nature of liquid can allow the fluorescent material that is dispersed in LED luminescent wafer upper space fully excite, make LED light-emitting component light colour developing of the present invention evenly, the stability of light improves greatly.Solved the use coating method and caused influencing light efficiency, changed color parameter, changed spatial light intensity and distribute and colour temperature Ra value problems such as the serious colour cast of marginal existence.
Description of drawings
Fig. 1 is a kind of LED light-emitting component of the present invention embodiment 1 structural representation
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is done to describe in further detail.
Embodiment 1
A kind of LED light-emitting component as shown in Figure 1 is located at the LED luminescent wafer 10 that metal substrate loads in the translucent cover 11.Translucent cover 11 preferential employings have the optical signature outline.On translucent cover 11, be provided with working fluid circulation import and export 12,13, pay the utmost attention to the working fluid import and export 12,13 that circulates is located at the bottom surface of translucent cover 11, make it form a sealed space.Connect a liquid cooling circulation heat abstractor 14 at working fluid circulation import and export 12,13 places,, liquid is flooded cover on LED luminescent wafer 10 surfaces by liquid cooling circulation heat abstractor 14 filled with fluid in translucent cover 11.And in liquid, be added with fluorescent material, and fluorescent material is dispersed in the liquid on LED luminescent wafer 10 surfaces, the working fluid that wherein contains fluorescent material is any one light-emitting area that is coated on LED luminescent wafer 10.Liquid of the present invention be transparent, non-conductive, do not corrode cooling medium, preferentially select the more excellent silicone oil of heat-conductive characteristic for use.Filled arrows in the accompanying drawing is oriented to the working fluid loop direction, but also can adopt circulation in the other direction.
Liquid cooling circulation heat abstractor 14 wherein can adopt multiple suitable structures, and the textural association that this demonstration example provides comprises:
One liquid circulation coil pipe 20, coil pipe 20 adopts snakelike copper pipe, also can adopt other material that is suitable for to make; Coil pipe 20 two ends connect the working fluid circulation import and export 12,13 on the translucent cover 11.
One driving pump 30, driving pump 30 are connected on the liquid circulation coil pipe 20, are used to drive flowing of liquid.
One row's fin 40, fin 40 is located on the liquid circulation coil pipe 20, is used for the heat of liquid is discharged outside air rapidly.
Claims (5)
1 one kinds of LED light-emitting components, the LED luminescent wafer that metal substrate loads is located in the translucent cover, filled with fluid in translucent cover, liquid can be flooded cover whole LED luminescent wafer surface, it is characterized in that: in liquid, be added with fluorescent material, fluorescent material is dispersed in the liquid on LED luminescent wafer surface.
2 LED light-emitting components according to claim 1 is characterized in that: described liquid is working fluid.
3 LED light-emitting components according to claim 1 is characterized in that: described working fluid is transparent, and refraction coefficient is suitable, the characteristic of fluorescent material is not had the liquid of influence.
4 LED light-emitting components according to claim 1 is characterized in that: the working fluid that contains fluorescent material is any one exiting surface that is coated on the LED luminescent wafer.
5 LED light-emitting components according to claim 1 is characterized in that: translucent cover is provided with the working fluid circulation that contains fluorescent material and imports and exports, and connects a liquid cooling circulation heat abstractor at the working fluid circulation import and export that contains fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100750262A CN101082405B (en) | 2007-06-13 | 2007-06-13 | LED light-emitting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100750262A CN101082405B (en) | 2007-06-13 | 2007-06-13 | LED light-emitting component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101082405A true CN101082405A (en) | 2007-12-05 |
| CN101082405B CN101082405B (en) | 2012-04-18 |
Family
ID=38912113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100750262A Expired - Fee Related CN101082405B (en) | 2007-06-13 | 2007-06-13 | LED light-emitting component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101082405B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810625A (en) * | 2011-06-01 | 2012-12-05 | 乐利士实业股份有限公司 | Liquid-cooled light-emitting device |
| CN102927475A (en) * | 2012-11-08 | 2013-02-13 | 浙江阳光照明电器集团股份有限公司 | Light-emitting diode (LED) light source module |
| CN103104869A (en) * | 2013-01-16 | 2013-05-15 | 北京京东方光电科技有限公司 | Luminous element, backlight module, liquid crystal display device and lighting equipment |
| CN105674073A (en) * | 2016-01-29 | 2016-06-15 | 东莞市闻誉实业有限公司 | Circulating heat dissipation-type lighting device |
| KR20180010670A (en) * | 2016-07-22 | 2018-01-31 | 엘지전자 주식회사 | Lamp for vehicle |
| CN108533969A (en) * | 2018-04-19 | 2018-09-14 | 珠海科明智能科技有限公司 | A kind of object luminescence technology and product based on ultraviolet light and fluorescent powder |
| WO2019037328A1 (en) * | 2017-08-21 | 2019-02-28 | 深圳光峰科技股份有限公司 | Heat dissipation device employing circulating cooling liquid, heat dissipation system employing circulating cooling liquid, and optical projection system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6924596B2 (en) * | 2001-11-01 | 2005-08-02 | Nichia Corporation | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
| CN1845348A (en) * | 2006-04-30 | 2006-10-11 | 吕大明 | High brightness white light LED luminescent device and its manufacturing process |
-
2007
- 2007-06-13 CN CN2007100750262A patent/CN101082405B/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810625A (en) * | 2011-06-01 | 2012-12-05 | 乐利士实业股份有限公司 | Liquid-cooled light-emitting device |
| CN102927475A (en) * | 2012-11-08 | 2013-02-13 | 浙江阳光照明电器集团股份有限公司 | Light-emitting diode (LED) light source module |
| CN103104869A (en) * | 2013-01-16 | 2013-05-15 | 北京京东方光电科技有限公司 | Luminous element, backlight module, liquid crystal display device and lighting equipment |
| US9166134B2 (en) | 2013-01-16 | 2015-10-20 | Beijing Boe Optoelectronics Technology Co., Ltd. | Light emitting element, backlight module, liquid crystal display device |
| CN105674073A (en) * | 2016-01-29 | 2016-06-15 | 东莞市闻誉实业有限公司 | Circulating heat dissipation-type lighting device |
| CN105674073B (en) * | 2016-01-29 | 2019-04-16 | 东莞市闻誉实业有限公司 | Circulation radiating type lighting device |
| KR20180010670A (en) * | 2016-07-22 | 2018-01-31 | 엘지전자 주식회사 | Lamp for vehicle |
| KR102553434B1 (en) * | 2016-07-22 | 2023-07-12 | 제트카베 그룹 게엠베하 | Lamp for vehicle |
| WO2019037328A1 (en) * | 2017-08-21 | 2019-02-28 | 深圳光峰科技股份有限公司 | Heat dissipation device employing circulating cooling liquid, heat dissipation system employing circulating cooling liquid, and optical projection system |
| CN109426049A (en) * | 2017-08-21 | 2019-03-05 | 深圳光峰科技股份有限公司 | Liquid cooling circulation heat radiator, liquid cooling cycle cooling system and optical projection system |
| CN109426049B (en) * | 2017-08-21 | 2021-03-05 | 深圳光峰科技股份有限公司 | Liquid cooling circulation heat abstractor, liquid cooling circulation heat dissipation system and optical projection system |
| CN108533969A (en) * | 2018-04-19 | 2018-09-14 | 珠海科明智能科技有限公司 | A kind of object luminescence technology and product based on ultraviolet light and fluorescent powder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101082405B (en) | 2012-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: DAJIN VARITRONIX ENERGY MANAGEMENT (SHENZHEN) CO., Free format text: FORMER OWNER: ZHU JIANQIN Effective date: 20100611 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 18E, BUILDING 2, DUSHI YANGGUANG MINGYUAN, NO.6017, SHENNAN STREET, FUTIAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 ROOM 803, BUILDING 2, BUILDING JIANXING, CHAGUANG INDUSTRY DISTRICT, SHAHE WEST ROAD, NANSHAN DISTRICT, SHENZHEN CITY |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20100611 Address after: 518000 building two, Jian Xing building, Cha Guang Industrial Zone, Shahe West Road, Shenzhen, Nanshan District 803, China Applicant after: Dajin Jingdian Energy Management (Shenzhen) Co.,Ltd. Address before: Sunshine City Gardens Futian District No. 6017 Shennan Road Shenzhen city Guangdong province 518000 2 18E Applicant before: Zhu Jianqin |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: TCORIENT EASTERN LIGHTING (SHENZHEN) CO., LTD. Free format text: FORMER NAME: TC INTERCONNECT ENERGY MANAGEMENT (SHENZHEN) CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 5, building 2, 518000 Industrial Zone, tea garden, Shahe West Road, Shenzhen, Nanshan District, Guangdong Patentee after: TC Oriental Lighting (Shenzhen) Co.,Ltd. Address before: 518000 building two, Jian Xing building, Cha Guang Industrial Zone, Shahe West Road, Shenzhen, Guangdong, Nanshan District 803, China Patentee before: Dajin Jingdian Energy Management (Shenzhen) Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 |