CN101081692A - Method for manufacturing semiconductor package structure having micro electro-mechanical system - Google Patents
Method for manufacturing semiconductor package structure having micro electro-mechanical system Download PDFInfo
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- CN101081692A CN101081692A CNA2007101384390A CN200710138439A CN101081692A CN 101081692 A CN101081692 A CN 101081692A CN A2007101384390 A CNA2007101384390 A CN A2007101384390A CN 200710138439 A CN200710138439 A CN 200710138439A CN 101081692 A CN101081692 A CN 101081692A
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- mems
- semiconductor package
- cover plate
- manufacture method
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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Abstract
The process of manufacturing semiconductor package structure with micro electromechanical system includes the following steps: setting several micro electromechanical systems onto base plate units in one base plate, sealing these micro electromechanical systems with several covering bodies of one cover plate, eliminating the main body of the cover plate, and cutting the base plate to form several semiconductor package structures. The process has no need of forming locating markers and is simple. In addition, the cover plate has no need of being made of transparent material and the main body may be eliminated through a simple grinding step, so that the present invention has wide application and low production cost.
Description
Technical field
The invention relates to a kind of manufacture method of semiconductor package, and particularly relevant for a kind of manufacture method with semiconductor package of MEMS.
Background technology
Please refer to Fig. 1 to Fig. 5, it shows existing have MEMS (Micro-Electro-MechanicalSystems, the schematic diagram of the manufacture method of semiconductor package MEMS).Please refer to Fig. 1, at first, provide a substrate 11, this substrate 11 has several base board units 111 (shown in dotted line), and each base board unit 111 has several connection pads 112.
Please refer to Fig. 2, several MEMSs 12 are set on each base board unit 111.Please refer to Fig. 3, a cover plate 13 is provided, this cover plate 13 has several lids 131 and several connecting portions 132, and these connecting portions 132 connect these lids 131, makes these lids 131 distance of being separated by.These lids 131 are in order to sealing corresponding these MEMSs 12, and make these connection pads 112 of this base board unit 111 be positioned at this lid 131 peripheries.In this embodiment, this cover plate 13 is a transparent material, for example a glass material or a silicon material.
Then, cut this cover plate 13, to remove these connecting portions 132 (these connecting portions 132 also can utilize engraving method or photolithographic techniques to remove), as shown in Figure 4.With reference to figure 5, at last, utilize a cutter (not shown) this substrate 11 of edge cuts according to these base board units 111, to form several semiconductor packages 1, each semiconductor package 1 has a base board unit 111, a MEMS 12 and a lid 131.This semiconductor package 1 is existing semiconductor package with MEMS.
In this existing manufacture method, this cover plate 13 and this substrate 11 be patterning in advance, to form the mark of contraposition.This cover plate 13 is necessary for a transparent material, so that these lids 131 are arranged on corresponding these base board units 111 according to these marks.These marks according to this cover plate 13 cut this cover plate 13 again, to remove these connecting portions 132.Then, these marks according to this substrate 11 cut this substrate 11 again, to form several semiconductor packages 1.
Should existing manufacture method must on this cover plate 13 and this substrate 11, form the mark of contraposition, so increase the step of encapsulation.Moreover, if utilize photolithographic techniques to remove these connecting portions 132, then have higher degree of difficulty, and can make production cost increase.
Therefore, be necessary to provide the manufacture method of the semiconductor package with MEMS of a kind of innovation and tool progressive, to address the above problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture method with semiconductor package of MEMS, this method is simple, fast, be widely used, can increase output and reduce production costs.
For reaching above-mentioned purpose or other purpose, the present invention adopts following technical scheme: a kind of manufacture method with semiconductor package of MEMS, it includes: step a provides a substrate, and this substrate has several base board units, and each base board unit has several connection pads; Step b is provided with a MEMS on each base board unit; Step c is provided with a cover plate on this substrate, this cover plate has a body and several lids, its lid is to be arranged on the surface of this body, corresponding this MEMS of each lid sealing, and make these connection pads of this base board unit be positioned at this lid periphery; Steps d is to remove this body; Reaching step e is this substrate of cutting, and to form several semiconductor packages, each semiconductor package has this base board unit, this MEMS and this lid.
For reaching above-mentioned purpose or other purpose, the present invention also adopts following technical scheme: a kind of manufacture method with semiconductor package of MEMS, it includes: step a provides a substrate, and this substrate has several base board units, and each base board unit has several connection pads; Step b is provided with a MEMS on each base board unit; Step c is provided with a cover plate on this substrate, this cover plate has several first grooves and several second grooves, wherein these first grooves seal corresponding this MEMS, these second grooves correspond to these connection pads of this base board unit, wherein this first groove has one first degree of depth, this second groove has one second degree of depth, and this first degree of depth is less than this second degree of depth; Steps d is partly to remove this cover plate, and keeps these MEMSs to be sealed in these first grooves and expose these connection pads of this base board unit; Reaching step e is this substrate of cutting, and to form several semiconductor packages, each semiconductor package has this base board unit, this MEMS and defines this cover plate of part of this first groove.
Compared to prior art, manufacture method of the present invention is to utilize Ginding process to remove this cover plate, to manifest these connection pads of this base board unit, because must be at the mark of this cover plate and this substrate patterning formation in advance contraposition, with basis, so encapsulation step of the present invention is more simplified compared to existing encapsulation step as this cover plate and this substrate cut.In addition, because manufacture method of the present invention must so this cover plate can be transparent material or transparent materials, can not selected different materials for use according to different demands at the cut mark of this cover plate and this substrate patterning formation in advance contraposition, therefore use more extensive.In addition, because this body can utilize simple Ginding process promptly removable,, thereby can increase output and reduce production costs so manufacture method of the present invention comparatively simply and comparatively quick.
Description of drawings
Fig. 1 to Fig. 5 is the schematic diagram of the manufacture method of the semiconductor package that has MEMS in the prior art.
Fig. 6 is the schematic diagram of substrate of the present invention.
Fig. 7 is provided with the schematic diagram of several MEMSs on this substrate for the present invention.
Fig. 8 is provided with the schematic diagram of a cover plate on this substrate for the present invention.
Fig. 9 removes the schematic diagram of the body of this cover plate for the present invention.
Figure 10 has the schematic diagram of the semiconductor package of MEMS for the present invention.
The specific embodiment
To Figure 10, it shows that the present invention has MEMS (Micro-Electro-MechanicalSystems, the schematic diagram of the manufacture method of semiconductor package MEMS) with reference to figure 6.At first with reference to figure 6, provide a substrate 21, this substrate 21 has several base board units 211 (shown in dotted line), and each base board unit 211 has several connection pads 212.This substrate 21 can be a CMOS wafer.
With reference to figure 7, a MEMS 22 is set on each base board unit 211.In this embodiment, this MEMS 22 is an optical element.This MEMS 22 comprises at least one micromirror group 221, and each this micromirror group 221 comprises: a supporting member 222, a hinge 223 and a micromirror 224.This supporting member 222 has one first end 225 and one second end 226, and wherein second end 226 of this supporting member 222 is to be positioned on this base board unit 211.This hinge 223 is located at this first end 225 of this supporting member 222.One end of this micromirror 224 is connected on this hinge 223.This micromirror 224 of each this micromirror group 221 is that the center rotates with this hinge 223.It should be noted that this MEMS 22 is not defined as an optical element, can be other microcomputer electric component.
With reference to figure 8, a cover plate 23 is provided, this cover plate 23 has a body 231 and several lids 232 (defining as dotted line among the figure).These lids 232 are arranged on the surface of this body 231.This lid 232 has one first groove 233, and adjacent these lids 232 define one second groove 234, and the degree of depth of this second groove 234 is the degree of depth greater than this first groove 233.Corresponding this MEMS 22 of each lid 231 sealing, and make these connection pads 212 of this base board unit 211 be positioned at this lid 232 peripheries.In this embodiment, this cover plate 23 is a transparent material, for example a glass material or a silicon material.Yet in other was used, this cover plate 23 also can be a transparent materials.
Then, remove this body 231.With reference to figure 9, in this embodiment, this body 231 is to utilize Ginding process to remove, but the present invention do not limit and utilize Ginding process to remove this body 231, also can utilize other method (as cutting method, engraving method or photolithographic techniques etc.) to remove this body 231.It should be noted that after removing this body 231, can remove this lid 232 of part that is positioned at opposite position on this first groove 233 again according to different demands, to control the height of this lid 232.
It should be noted that this cover plate 23 can divide into this body 231 and these lids 232, also promptly this cover plate 23 can be one-body molded, to have the structure of several first grooves 233 and several second grooves 234.Corresponding this MEMS 22 of these first groove, 233 sealings, these second grooves 234 are the tops that are positioned at these connection pads 212 of corresponding this base board unit 211.Wherein, this first groove 233 has one first degree of depth, and this second groove 234 has one second degree of depth, and this first degree of depth is less than this second degree of depth.In the same manner, also can utilize Ginding process to remove or other method (as cutting method, engraving method or photolithographic techniques etc.) removes partly this cover plate 23, and keep these MEMSs 22 to be sealed in these first grooves 233 and expose these connection pads 212 of this base board unit 211.In addition, after partly removing these cover plate 23 steps, also can further remove this cover plate 23 of part of opposite position on this first groove 233 again, to reduce whole thickness.
With reference to Figure 10, at last, utilize a cutter (not shown) this substrate 21 of edge cuts according to these base board units 211, to form several semiconductor packages 2, each semiconductor package 2 has a base board unit 211, a MEMS 22 and a lid 23.This semiconductor package 2 is the semiconductor package that the present invention has MEMS.This semiconductor package 2 can utilize these connection pads 212 of this base board unit 211, electrically connects with external circuit or outer member.
Because manufacture method of the present invention is to utilize Ginding process to remove this body 231, to separate these lids 232, therefore must be at the mark of this cover plate 23 and this substrate 21 patterning formation in advance contraposition, with the basis as this cover plate 23 and 21 cuttings of this substrate, therefore the more existing encapsulation step of encapsulation step of the present invention is more simplified.In addition, because of manufacture method of the present invention not must this cover plate 23 and this substrate 21 in advance patterning form the cut mark of contraposition, so this cover plate 23 can be transparent material or transparent materials, it can select different materials for use according to different demands, so manufacture method of the present invention application is more extensive.Therefore in addition, this body 231 can utilize simple Ginding process promptly removable, and manufacture method of the present invention comparatively simply and comparatively quick can increase output and reduces production costs.
Claims (15)
1. manufacture method with semiconductor package of MEMS, it includes: step a provides a substrate, and this substrate has several base board units, and each base board unit has several connection pads; Step b is provided with a MEMS on each base board unit; Step c is provided with a cover plate on this substrate, and this cover plate has several lids, corresponding this MEMS of each lid sealing, and make these connection pads of this base board unit be positioned at this lid periphery; It is characterized in that: the cover plate that is provided by step c also includes a body, and its lid is to be arranged on the surface of this body; Steps d is to remove this body; Reaching step e is this substrate of cutting, and to form several semiconductor packages, each semiconductor package has this base board unit, this MEMS and this lid.
2. the manufacture method with semiconductor package of MEMS as claimed in claim 1 is characterized in that: this substrate is a CMOS wafer.
3. the manufacture method with semiconductor package of MEMS as claimed in claim 1 is characterized in that: this lid has one first groove, and adjacent these lids define one second groove, and the degree of depth of this second groove is greater than the degree of depth of this first groove.
4. the manufacture method with semiconductor package of MEMS as claimed in claim 1 is characterized in that: this MEMS is an optical element.
5. the manufacture method with semiconductor package of MEMS as claimed in claim 4, it is characterized in that: this optical element comprises at least one micromirror group, each this micromirror group has included a supporting member, a hinge and a micromirror, wherein this supporting member has one first end and one second end, and this second end is positioned on this substrate; This hinge is arranged at first end of this supporting member; This micromirror reaches this micromirror one end and is connected on this hinge, so that can this hinge be the center rotation.
6. the manufacture method with semiconductor package of MEMS as claimed in claim 1 is characterized in that: this cover plate is a transparent material.
7. the manufacture method with semiconductor package of MEMS as claimed in claim 1 is characterized in that: this steps d is to utilize Ginding process to remove this body.
8. the manufacture method with semiconductor package of MEMS as claimed in claim 3, it is characterized in that: comprise more that after steps d one removes the step of this lid of part that is positioned at the opposite position above this first groove, to control the height of this semiconductor package.
9. manufacture method with semiconductor package of MEMS, it includes: step a provides a substrate, and this substrate has several base board units, and each base board unit has several connection pads; Step b is provided with a MEMS on each base board unit; Step c is provided with a cover plate on this substrate, this cover plate has several first grooves and several second grooves, wherein these first grooves seal corresponding this MEMS, these second grooves correspond to these connection pads of this base board unit, steps d is partly to remove this cover plate, and keeps these MEMSs to be sealed in these first grooves and expose these connection pads of this base board unit; Reaching step e is this substrate of cutting, and to form several semiconductor packages, each semiconductor package has this base board unit, this MEMS and defines this cover plate of part of this first groove; It is characterized in that: this first groove that forms in step c has one first degree of depth, and this second groove has one second degree of depth, and this first degree of depth is less than this second degree of depth.
10. the manufacture method with semiconductor package of MEMS as claimed in claim 9 is characterized in that: this substrate is a CMOS wafer.
11. the manufacture method with semiconductor package of MEMS as claimed in claim 9 is characterized in that: this MEMS is an optical element.
12. the manufacture method with semiconductor package of MEMS as claimed in claim 11, it is characterized in that: this optical element comprises at least one micromirror group, each this micromirror group has included a supporting member, a hinge and a micromirror, wherein this supporting member has one first end and one second end, and this second end is positioned on this substrate; This hinge is arranged at first end of this supporting member; This micromirror reaches this micromirror one end and is connected on this hinge, so that can this hinge be the center rotation.
13. the manufacture method with semiconductor package of MEMS as claimed in claim 9 is characterized in that: this cover plate is a transparent material.
14. the manufacture method with semiconductor package of MEMS as claimed in claim 9 is characterized in that: this steps d is to utilize Ginding process to remove partly this cover plate.
15. the manufacture method with semiconductor package of MEMS as claimed in claim 9, it is characterized in that: comprise more that after steps d one removes the step of this cover plate of part that is positioned at the opposite position above this first groove, to control the height of this semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101384390A CN101081692B (en) | 2007-07-27 | 2007-07-27 | Method for manufacturing semiconductor package structure having micro electro-mechanical system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101384390A CN101081692B (en) | 2007-07-27 | 2007-07-27 | Method for manufacturing semiconductor package structure having micro electro-mechanical system |
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| Publication Number | Publication Date |
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| CN101081692A true CN101081692A (en) | 2007-12-05 |
| CN101081692B CN101081692B (en) | 2010-10-13 |
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| CN2007101384390A Active CN101081692B (en) | 2007-07-27 | 2007-07-27 | Method for manufacturing semiconductor package structure having micro electro-mechanical system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104445045A (en) * | 2013-09-24 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | Crystal oscillator forming method |
| CN107640737A (en) * | 2016-07-20 | 2018-01-30 | 英飞凌科技股份有限公司 | Method for producing semiconductor module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI265579B (en) * | 2005-08-02 | 2006-11-01 | Advanced Semiconductor Eng | Package structure and wafer level package method |
| JP2007139576A (en) * | 2005-11-18 | 2007-06-07 | Denso Corp | Manufacturing method of semiconductor dynamic quantity sensor |
-
2007
- 2007-07-27 CN CN2007101384390A patent/CN101081692B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104445045A (en) * | 2013-09-24 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | Crystal oscillator forming method |
| CN104445045B (en) * | 2013-09-24 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | The formation method of crystal oscillator |
| CN107640737A (en) * | 2016-07-20 | 2018-01-30 | 英飞凌科技股份有限公司 | Method for producing semiconductor module |
| US10435292B2 (en) | 2016-07-20 | 2019-10-08 | Infineon Technologies Ag | Method for producing a semiconductor module |
| CN107640737B (en) * | 2016-07-20 | 2020-03-27 | 英飞凌科技股份有限公司 | Method for producing semiconductor module |
| US11040872B2 (en) | 2016-07-20 | 2021-06-22 | Infineon Technologies Ag | Semiconductor module |
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| Publication number | Publication date |
|---|---|
| CN101081692B (en) | 2010-10-13 |
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