CN101080138A - Printed wiring board, method for forming the printed wiring board, and board interconnection structure - Google Patents
Printed wiring board, method for forming the printed wiring board, and board interconnection structure Download PDFInfo
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- CN101080138A CN101080138A CN 200710104529 CN200710104529A CN101080138A CN 101080138 A CN101080138 A CN 101080138A CN 200710104529 CN200710104529 CN 200710104529 CN 200710104529 A CN200710104529 A CN 200710104529A CN 101080138 A CN101080138 A CN 101080138A
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- connecting terminal
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- bossing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.
Description
The application requires the Japanese patent application 2006-145389 of submission on May 25th, 2006 and the priority of 2006-145390, and its full content is quoted at this as a reference.
Technical field
The application relates to the technology of the printed panel that is used to interconnect.Particularly, the present invention relates to printed substrate, be used to form the method for printed substrate, and the board interconnection structure of interconnect strength that can reinforcement plate.
Background technology
Since need electronic equipment littler on the volume, lighter on the weight, more senior on function, therefore more be necessary three-dimensional in the small space of product a plurality of plates to be installed.For this reason, must be reduced in the space that is used to connect the signal of telecommunication between plate.But more senior if the function of electronic equipment becomes, then the type of the signal of telecommunication between plate also can increase, and above-mentioned connection space also can increase, and this can restrict the minimizing of this miniaturization and weight.For the interconnection of plate, use connector component usually.But, be difficult to feasible connector component miniaturization with assemble mechanism.And, in connector component, by pressure ground terminal is engaged with each other and carries out electrical engagement together, so connector part is very poor on joint reliability.In addition, connector component itself also can produce cost, and therefore in the situation that many signals connect, the expense of connector component also will be added in the total cost.
In recent years, in this connection, in the situation of electrical interconnection printed substrate (such as rigid plate and flexible board), particularly in the situation of the thin space (narrow-pitch) of these plates of electrical interconnection wiring, use the method for attachment of welding, as the method for not using connector component.Particularly, weld the connecting terminal part of a pair of printed substrate mutually.Below use Figure 1A and 1B to describe this method of attachment in detail by welding.
Figure 1A and Figure 1B have shown the structure when the coupling part of rigidity wiring board 101 and flexible circuit board 102 during by welding wiring (solder wiring) interconnection.Figure 1A has shown the lateral cross section of coupling part, and Figure 1B has shown the longitudinal cross-section (along the cross section of the line 1B-1B of Figure 1A) of coupling part.Flexible circuit board 102 comprises flexible insulating layer 103; Be provided at the conducting channel 104 on the flexible insulating layer 103; Connecting terminal 104a as the position of standing to weld (spot) of conducting channel 104; And the flexible insulation protective layer 105 of protection conducting channel 104.Rigidity wiring board 101 comprises insulating barrier 106, be provided at conducting channel 107 on the insulating barrier 106, as the connecting terminal 107a at the position of standing to weld of conducting channel 107; And the flexible insulation protective layer 108 of protection conducting channel 107.
According to the method that scolder 109 is provided between connecting terminal 104a and 107a, to the surface of connecting terminal 104a and 107a or to the wherein surface execution scolder plating (solderplating) of any, or replaceability ground, on the surface of connecting terminal 107a, print welding paste (creamsolder).After being provided at scolder 109 between connecting terminal 104a and the 107a, connecting terminal 104a and 107a face with each other, and rigidity wiring board 101 and flexible circuit board 102 be in alignment with each other on the position and pile up.When keeping this state, entire connection portion is heated until scolder 109 fusings by heater such as heating plate etc.Then, shown in Figure 1B, connecting terminal 104a and 107a interconnection.As a result, the conduction 102 of rigidity wiring board 101 and flexible circuit board is possible.
But, in recent years,, therefore in above-mentioned method of attachment, will have problems because the microminiaturization manufacturing and the spacing final minification (pitch fining) of the conducting channel of printed substrate are developed.Particularly, in the syndeton shown in Figure 1A and Figure 1B, if scolder 109 excessively is provided between connecting terminal 104a and 107a, then when connecting terminal 104a and 107a carried out the hot pressing solder interconnections by using scolder 109, the scolder 109 of fusing can be extruded.Therefore, have following secret worry, the scolder of extruding may touch the scolder on adjacent end, and may form the scolder bridge joint (solder bridge) of unanticipated between connecting terminal.
Therefore, as the proposal that addresses this problem, the open text No.H8-23147 of Japan Patent has shown the connecting terminal on flexible circuit board, and it forms narrower than the connecting terminal on the opposed circuit boards on the width.In view of the above, the connecting terminal on flexible circuit board is disposed in the width of connecting terminal of circuit board, forms scolder leg (solder fillet) on the connecting terminal of circuit board along the longitudinal direction.As a result, prevented that scolder from flowing out to adjacent connecting terminal zone.But, in above-mentioned proposal, be a problem at the bonding strength of connecting terminal and flexible insulation interlayer.Bonding strength when bonded to each other is with under the situation that the bonding strength of connecting terminal and flexible insulation interlayer is made comparisons with connecting terminal will be by scolder, because metal solder is formed in previous, so the former bonding strength will be higher than the latter.Therefore, under the situation of considering bonding strength, just become very important in being connected of connecting terminal and flexible insulation interlayer.In this case, connecting terminal is wide more favourable more.But because the connecting terminal attenuation on the side in above-mentioned proposal, therefore the bonding strength of anti-stress is very fragile on draw direction or direction of delaminate.
And, have harmful effect in the above-mentioned miniature manufacturing that is proposed in the coupling part.In printed substrate, force the minimum value of accessible conductor width of restriction and spacing therebetween.In above-mentioned proposal, must make the width of the connecting terminal at least one side be wider than the minimum widith that to handle lead.This has restricted the realization of miniature coupling part.
In this connection, the open text No.H9-46031 of Japan Patent has proposed to form slit to increase above-mentioned bonding strength on the connecting terminal of flexible circuit board, that is, and and hot strength between plate or peel strength.According to this open text, excessive scolder is stored in the slit.Therefore, prevented because the short circuit that excess solder causes in addition, has strengthened bonding strength by the leg that is formed on the slit both sides.
Consider to use etch processes as the mode that forms slit on the connecting terminal.But because the width and the slit (that is, the circuit gap) that can be formed by etch processes, the miniature manufacturing of circuit is restricted.For example, when in each the connecting terminal 104a shown in Figure 1B, forming a slit in the heart, and during with each connecting terminal 104a separated into two parts, the necessary circuit width in coupling part must be set at and be equal to or greater than the width that width obtained that joins the twice at least that can form circuit by the width that can form slit.That is, must thicken the width of circuit.It is littler that this has restricted the spacing that makes between circuit.And, when forming slit on the connecting terminal on the conducting channel of a side, reduced the zone of connecting terminal process on insulating barrier.Therefore, when it being applied with flexible circuit board, on the contact-making surface between connecting terminal and insulating barrier, be easy to peel off, thereby cause the reduction of whole bonding strength from stress that the rigidity wiring board is peeled off.
Summary of the invention
One aspect of the present invention provides a kind of printed substrate, be used to form the method and the board interconnection structure of printed substrate, it can prevent the reduction of the peel strength between connecting terminal and insulating barrier, and can prevent short circuit by the storage excess solder, and the spacing that can restrict between circuit does not further reduce, thereby strengthens the bonding strength between connecting terminal.
A first aspect of the present invention is a kind of printed substrate, comprising: insulating barrier; Be arranged in the conducting channel on the insulating barrier, this conducting channel has connecting terminal in its end, and the upper surface width in the connecting terminal is narrower than bottom width.
Here, connecting terminal can be by providing projection to form on the conducting channel bearing of trend.
A second aspect of the present invention is a kind of board interconnection structure, comprise: first printed substrate, wherein be furnished with first conducting channel on first insulating barrier, this first conducting channel has first connecting terminal in its end, and the upper surface width of this first connecting terminal is narrower than bottom width; Second printed substrate wherein arranges to have second conducting channel of second connecting terminal on second insulating barrier; And articulamentum, its vertical side along first connecting terminal forms leg, and with first connecting terminal and the interconnection of second connecting terminal.
Here, in above-mentioned interconnection structure, bossing can be provided on first connecting terminal of first conducting channel along the first conducting channel bearing of trend.
A third aspect of the present invention is a kind of method that is used to form printed substrate, comprising: prepare insulating barrier on the surface of having arranged the conducting channel with connecting terminal; On insulating barrier and conducting channel, apply etchant resist (resist); Etchant resist is formed required pattern; By using the etchant resist of patterning, the direction of extending along conducting channel forms bossing on conducting channel; And remove the etchant resist of patterning.
According to the present invention, can prevent reduction at connecting terminal and insulation interlaminar strength, and the scolder bridge joint (short circuit) between connecting terminal that causes owing to excessive scolder, and the spacing that can not restrict between circuit is further reduced.Therefore, provide the printed substrate that can strengthen the bonding strength between connecting terminal, the method that is used to form such printed substrate, and board connecting structure.
Description of drawings
Figure 1A is the sectional view of the coupling part of traditional board interconnection structure.
Figure 1B is the sectional view when seeing the board interconnection structure of Figure 1A from the line 1B-1B direction of Figure 1A.
Fig. 2 is the plane graph according to the printed substrate of first non-limiting example of the present invention.
Fig. 3 is the sectional view when seeing the printed substrate of Fig. 2 from the line 3-3 direction of Fig. 2.
Fig. 4 is the sectional view according to the board interconnection structure of first non-limiting example.
Fig. 5 is the sectional view according to the board interconnection structure of second non-limiting example.
Fig. 6 is the plane graph according to the printed substrate of the 3rd non-limiting example.
Fig. 7 is the sectional view when the line 7-7 direction from Fig. 6 is seen the printed substrate of Fig. 6.
Fig. 8 A to Fig. 8 E is the sectional view of manufacturing step, and it has shown the method that is used to form according to the printed substrate of the 3rd non-limiting example.
Fig. 9 is the sectional view according to the board interconnection structure of the 3rd non-limiting example.
Figure 10 A to Figure 10 B is the sectional view of manufacturing step, and it has shown the method for attachment according to the board interconnection structure of the 3rd non-limiting example.
Figure 11 A to 11E is the sectional view of manufacturing step, and it has shown the method that is used to form according to the printed substrate of the 4th non-limiting example.
Figure 12 A is the sectional view according to the printed substrate of the 5th non-limiting example.
Figure 12 B is the sectional view according to the board interconnection structure of the 5th non-limiting example.
Figure 13 is the plane graph according to the printed substrate of other non-limiting example.
Embodiment
Below with reference to accompanying drawing non-limiting example of the present invention is described.In the following description, the same or analogous part of accompanying drawing is identified by same or analogous reference number.Be noted that accompanying drawing only is schematically, the ratio of the relation between thickness and planar dimension, the thickness of each layer etc. are different with reality all.Therefore, concrete thickness and size are determined by the following description of reference.And, in the accompanying drawings, comprised that the mutual different part of size relationship and ratio also is inevitable.
(first non-limiting example)
(printed substrate)
As shown in FIG. 2, comprise the conducting channel 11 that has connecting terminal 11a on insulating barrier 10, its end according to the printed substrate of first embodiment of the invention, in each connecting terminal 11a, the width W of upper surface
1Be narrower than the width W of bottom surface
2Fig. 3 is the sectional view of the printed substrate that looks up of the line 3-3 side from Fig. 2.
As insulating barrier 10, can use flexible board such as polyimide plate, polyethylene (PET) plate and poly-naphthalene second rare (PEN) plate etc.Alternatively, as insulating barrier 10, also can use hard rigid plate such as glass epoxy board, glass hard board and papery epoxy plate etc.Preferably, insulating barrier 10 has the thermal endurance to scolder melting temperature or higher temperature.In using the situation of rigid plate, can use the thickness of 2.4mm, 2.0mm, 1.6mm, 1.2mm, 1.0mm, 0.8mm, 0.6mm, 0.4mm, 0.2mm etc. as insulating barrier 10.In addition, in using the situation of flexible board as insulating barrier 10, can use 25 μ m, 12.5 μ m, 8 μ m, 6 μ m, etc. thickness.
Conducting channel 11 forms the circuit pattern of lead, and it designs on insulating barrier 10.On insulating barrier 10, conducting channel 11 is handled by pattern and is formed by rolled copper foil, electrolytic copper foil etc.In conducting channel 11, the metal forming that also can use other except Copper Foil is as lead.Spacing between the lead in conducting channel 11 is set at 10 to 500 μ m, and the width of lead is set at 10 to 500 μ m.For the thickness of conducting channel 11, can use 35 μ m, 18 μ m, 12 μ m, 9 μ m etc.On conducting channel 11, layout coverlay etc. are as the cover layer (not shown), and described coverlay uses still has fabulous flexible dielectric polyimide film as base material after adhesion.
Connecting terminal 11a is formed by "flop-out" method (subtractive method), thereby can form the upper surface width W
1Be set to less than bottom width W
2When insulating barrier 10 is flexible board, can arrange connecting terminal 11a so that it extends to the end of insulating barrier 10.Simultaneously, when insulating barrier 10 is rigid plate, preferably, arrange connecting terminal 11a so that itself and the end maintenance point space of insulating barrier 10.Connecting terminal 11a carries out surface treatment by prefluxing processing, hot-air adjustment (HAL), the plating of electrolysis scolder, the plating of non-electrolysis scolder etc.
According to above-mentioned printed substrate, the join domain between insulating barrier 10 and connecting terminal 11a can not reduce, and therefore the bonding strength between insulating barrier 10 and connecting terminal 11a can not reduce yet.And, the upper surface width W of each connecting terminal 11a
1All than bottom width W
2Narrow, can form leg 23 (shown in Fig. 4) along vertical side of connecting terminal 11a like this.Therefore, can prevent the formation and the connection fault in articulamentum 19 (shown in Fig. 4) of scolder bridge joint.
And, according to above-mentioned printed substrate, can form connecting terminal 11a so that on connecting terminal 11a that can be processed, have minimum width.Therefore, can realize small coupling part.
Therefore in addition, connecting terminal 11a can form by "flop-out" method, when conducting channel 11 is handled by "flop-out" method, can form conducting channel 11 and can not increase the quantity of manufacturing step.
(board interconnection structure)
As shown in Figure 4, board interconnection structure according to the first embodiment of the present invention comprises: first printed substrate 1, wherein arrange first conducting channel on first insulating barrier 10, this first conducting channel has the first connecting terminal 11a, the width W of upper surface therein on its end
1Be narrower than the width W of bottom surface
2Second printed substrate 2 wherein arranges to have second conducting channel of the second connecting terminal 13a on second insulating barrier 12; With articulamentum 19, wherein the vertical side along the first connecting terminal 11a forms leg 23.Articulamentum 19 is with the first connecting terminal 11a and second connecting terminal 13a interconnection.
As second insulating barrier 12, can use hard rigid plate such as glass epoxy board, glass hard board and papery epoxy plate etc.And, also can use flexible board as second insulating barrier 12.Preferably, second insulating barrier 12 has the thermal endurance to the melting temperature or the higher temperature of scolder.In the situation of using rigid plate, can use the thickness of 2.4mm, 2.0mm, 1.6mm, 1.2mm, 1.0mm, 0.8mm, 0.6mm, 0.4mm, 0.2mm etc.In addition, in the situation of using flexible board, can use the thickness of 25 μ m, 12.5 μ m, 8 μ m, 6 μ m etc.
Second conducting channel forms the circuit pattern of lead, and it designs on second insulating barrier 12.Second conducting channel forms by on second insulating barrier 12 rolled copper foil, electrolytic copper foil being carried out the pattern processing.For second conducting channel, except Copper Foil, also can use other metal forming.Spacing between the lead in second conducting channel is set at 10 to 500 μ m, and the width of lead is set at 10 to 500 μ m.For the thickness of second conducting channel, can use 35 μ m, 18 μ m, 12 μ m, 9 μ m etc.On second conducting channel, can arrange that coverlay etc. is as the cover layer (not shown).In using the situation of rigid substrates, coverlay uses soldering-resistance layer (solderresist) as base material, and in the situation of using flexible board, uses still to have fabulous flexible dielectric polyimide film etc. as base material after adhesion.
The width of the second connecting terminal 13a is set to the bottom width W that is substantially equal to the first connecting terminal 11a
2For example, the thickness of the second connecting terminal 13a can be set in 15 μ m.When second insulating barrier 12 is flexible board, arrange the second connecting terminal 13a so that it extends to the end of second insulating barrier 12.Simultaneously, when second insulating barrier 12 is rigid plate, preferably, arrange connecting terminal 13a so that itself and the end maintenance point space of second insulating barrier 12.The second connecting terminal 13a carries out surface treatment by prefluxing processing, hot-air adjustment (HAL), the plating of electrolysis scolder, the plating of non-electrolysis scolder etc.
Method of attachment according to the board interconnection structure of the first embodiment of the present invention now will be described.
At first, among the first connecting terminal 11a and the second connecting terminal 13a at least one applied soldering paste or it carried out scolder electroplate, thereby arrange scolder thereon with about 3 μ m thickness.Then, arrange the first connecting terminal 11a and the second connecting terminal 13a so that its toward each other.And, by heater these plates are heated to 200 ℃ or higher, thereby form articulamentum 19 betwixt such as heating plate etc.As a result, the first connecting terminal 11a and the second connecting terminal 13a are bonded to each other.When solder fusing when forming articulamentum 19, scolder is along vertical side surface direction storage of the first connecting terminal 11a, it is the gap between the first connecting terminal 11a and the second connecting terminal 13a, thereby forms leg 23.By using capillarity epoxy bottom potting resin (not shown) such as (epoxy underfill resin) to be filled into the periphery of articulamentum 19.The bottom potting resin is filled in that, can increases the bonding strength of articulamentum 19 like this, and prevent that scolder from flowing into adjacent connecting terminal.By above-mentioned manufacturing step, form board interconnection structure shown in Figure 3.Be noted that as employed jointing material in articulamentum 19, can use leaded soldering paste, lead-free solder paste, scolder plating, tin plating etc.
According to above-mentioned board interconnection structure, the join domain between first insulating barrier 10 and the first connecting terminal 11a can't reduce, and therefore, the bonding strength between first insulating barrier 10 and the first connecting terminal 11a can not reduce.And, the upper surface width W of each first connecting terminal 11a
1All be narrower than its bottom width W
2Thereby, can form leg along vertical side of the first connecting terminal 11a.Therefore, can prevent the formation of scolder bridge joint and the connection fault in articulamentum 19.
And according to above-mentioned board interconnection structure, the first connecting terminal 11a and the second connecting terminal 13a can form has the minimum widith that both can both be processed.Therefore, can realize small coupling part.
In addition, the bottom width W of the first connecting terminal 11a
2With the width of the second connecting terminal 13a can be set to mutually the same basically, thereby two connecting terminal 11a and 13a can not be reduced in the bonding strength of 12 of first insulating barrier 10 and second insulating barriers.
(second non-limiting example)
As shown in Figure 5, comparing among board interconnection structure according to a second embodiment of the present invention and Fig. 4, difference is, the upper surface width W of connecting terminal 13b
3The bottom width W of the connecting terminal 13b of the ratio second printed substrate 2a
4Want much narrow.Other elements in Fig. 5 are similar in the board interconnection structure shown in Fig. 4 basically, therefore omits being repeated in this description it.
According to the board interconnection structure of second embodiment, between first insulating barrier 10 and the first connecting terminal 11a and the join domain between second insulating barrier 12 and the second connecting terminal 13b all do not have to reduce.Therefore, all do not have to reduce at first insulating barrier 10 and the first connecting terminal 11a and the bonding strength between second insulating barrier 12 and the second connecting terminal 13b yet.And, the upper surface width W of the first connecting terminal 11a
1Than its bottom width W
2Narrow, thus can form leg in vertical side along the first connecting terminal 11a.Therefore, can prevent the formation of scolder bridge joint and the fault that is connected in articulamentum 19a.In a similar fashion, the upper surface width W of the second connecting terminal 13b
3Than its bottom width W
4Narrow, thus can form leg in vertical side along the second connecting terminal 13b.Therefore, can prevent the formation of scolder bridge joint and the fault that is connected in articulamentum 19a.
And according to the board interconnection structure of second embodiment, the first connecting terminal 11a and the second connecting terminal 13b can form has the minimum widith that both can both be processed.Therefore, can realize small coupling part.
In addition, the bottom width W of the first connecting terminal 11a
3Bottom width W with the second connecting terminal 13b
4Can be set ground basic identical each other, thereby connecting terminal 11a and 13b can not be reduced in the bonding strength of 12 of first insulating barrier 10 and second insulating barriers.
Be noted that in first and second embodiment it is linear trapezoidal shape that each of the cross section of the first connecting terminal 11a and the second connecting terminal 13b all forms its side; But the side also can bend to arc.If the side embowment, then the surface area of the side of the first connecting terminal 11a and the second connecting terminal 13b has just increased, and these connecting terminals have also just increased the join domain of scolder so, thereby can strengthen bonding strength therebetween.
(the 3rd non-limiting example)
(printed substrate)
As shown in Figure 6, the printed substrate according to third embodiment of the invention comprises insulating barrier 10, is arranged on the insulating barrier 10 and has the conducting channel 14 of connecting terminal 15 in its end and be provided at bossing 16 on the direction that conducting channel 14 extends.Fig. 7 is the sectional view of the printed substrate that looks up of the line 7-7 side from Fig. 6.
Insulating barrier 10 is similar to first embodiment's.
Conducting channel 14 forms the circuit pattern of lead, and it designs on insulating barrier 10.In the situation that the pattern that uses "flop-out" method forms, form conducting channel 14 by etching rolled copper foil, electrolytic copper foil etc. on insulating barrier 10.Also can use other metal formings except that Copper Foil as lead.For the thickness of conducting channel 14, can use 35 μ m, 18 μ m, 12 μ m, 9 μ m, 5 μ m etc.When conducting channel 14 was formed by "flop-out" method, the width minimum of considering circuit was 15 μ m, and the space width minimum between circuit is 20 μ m, and therefore the minimum spacing 14 of conducting channels is 35 μ m.Becoming in the situation of (semi-additive) method by electroplating the false add that on insulating barrier 10, forms conducting channel 14, the width minimum of considering circuit is 10 μ m, and the space width minimum between circuit is 10 μ m, and therefore the minimum spacing between circuit is 20 μ m.Particularly, semi-additive process can be microminiaturized more than "flop-out" method.On conducting channel 14, as the cover layer (not shown), be furnished with coverlay etc., it uses still has fabulous flexible dielectric polyimide film etc. as base material after adhesion.
For example, can be 15 μ m and 8 μ m with the thickness setting of connecting terminal 15.When insulating barrier 10 is flexible board, can arrange connecting terminal 15 so that it extends to the end of insulating barrier 10.Simultaneously, when insulating barrier 10 is rigid plate, preferably, arrange connecting terminal 15 so that itself and the end maintenance point space of insulating barrier 10.
As shown in Figure 7, bossing 16 is provided on the connecting terminal 15.The width of bossing 16, that is, perpendicular to the width on conducting channel 14 bearing of trends, can be set at for example be connecting terminal 15 width 75%.When the width of connecting terminal 15 was 20 μ m, the width of bossing 16 was 15 μ m (=20 μ m * 0.75).For the thickness of bossing 16, preferably, the summation of the thickness of related thickness and connecting terminal 15 equals the thickness of the connecting terminal of traditional printed substrate.For example, the thickness of bossing 16 can be set at 10 μ m.The material of bossing 16 can be and conducting channel 14 identical materials, or alternatively, can be different with the material of conducting channel 14, as long as the fusing point of material has been higher than the fusing point of scolder.As the material of bossing, can use copper facing (Cu), nickel plating (Ni), gold-plated (Au), on plating Ni, further form the plating Ni/Au of plating Au etc.For example, the thickness of plating Ni/Au is approximately thickness (the 0.03 μ m) sum of thickness (2 to 8 μ m) and the plating Au of plating Ni.When selecting the material of bossing 16, it is all very important that electrical characteristic (conductive resistance, migrate attribute), mechanical strength and being used to electroplated the controllability of shape.
According to the printed substrate of the 3rd embodiment, can not reduce at the join domain of 15 of insulating barrier 10 and connecting terminals.Therefore, the peel strength 15 of insulating barrier 10 and connecting terminals can not reduce yet.And, bossing 16 is provided, thereby has increased the surface area of each connecting terminal 15.Therefore, can strengthen bonding strength.
(being used to form the method for printed substrate)
The non-limiting method that is used to form according to the printed substrate of the 3rd non-limiting example is described below with reference to Fig. 8.
(I) at first, prepare insulating barrier 10, arrange to have the conducting channel of connecting terminal 15 thereon.Then, on insulating barrier 10 and connecting terminal 15, form etchant resist 30 (with reference to figure 8A).As etchant resist 30, for example can use the photocuring photoresist.
(II) then, irradiation light and exposure on the position that does not form bossing 16, thus make etchant resist 30 sex change to solidify and to form the etchant resist 32 (with reference to figure 8B) that solidifies.Then, the etchant resist 30 that does not also change into the etchant resist 32 of curing is removed (with reference to figure 8C) by alkaline solution etc.By this way, make etchant resist 30 form required pattern.
(III) then, carry out plating, thereby can on the direction that conducting channel is extended, on connecting terminal 15, form bossing 16 (with reference to figure 8D) by using the curing etchant resist 32 that forms pattern thus.
(IV) then, remove the etchant resist 32 (with reference to figure 8E) of the curing that forms pattern thus.
By above-mentioned manufacturing step, form printed substrate according to the 3rd embodiment.
According to the method that forms according to the printed substrate of the 3rd embodiment, form bossing 16 by electroplating, thus can miniature manufacturing bossing 16.And, owing to, therefore be easy to select and use suitable plated material by using the curing etchant resist 32 that forms pattern to carry out plating.
(board interconnection structure)
As shown in Figure 9, board interconnection structure according to third embodiment of the invention comprises: first printed substrate 1, wherein on first insulating barrier 10, be arranged in first conducting channel that has first connecting terminal 15 on its end, and on the direction that first conducting channel is extended, on first connecting terminal 15, provide bossing 16; Second printed substrate 2 wherein arranges to have second conducting channel of second connecting terminal 22 on second insulating barrier 20; With articulamentum 42, it forms leg and first connecting terminal 15 and second connecting terminal 22 is interconnected on the lateral parts of bossing 16.
As second insulating barrier 20, can use hard rigid plate such as glass epoxy board, glass hard board and papery epoxy plate etc.And, also can use flexible board as second insulating barrier 20.In the situation of using rigid plate, can use the thickness of 2.4mm, 2.0mm, 1.6mm, 1.2mm, 1.0mm, 0.8mm, 0.6mm etc.In addition, in using the situation of flexible board, can use 25 μ m, 12.5 μ m, 8 μ m, 6 μ m, etc. thickness.
Second conducting channel forms the circuit pattern of lead, and it designs on second insulating barrier 20.Second conducting channel forms by on second insulating barrier 20 rolled copper foil, electrolytic copper foil being carried out the pattern processing.For second conducting channel, except Copper Foil, also can use other metal forming.For the thickness of second conducting channel, can use 35 μ m, 18 μ m, 12 μ m, 9 μ m etc.When second conducting channel was formed by "flop-out" method, the width minimum of considering circuit was 15 μ m and space width minimum between circuit is 20 μ m, and therefore the minimum spacing between second conducting channel is 35 μ m.Simultaneously, when when forming second conducting channel by semi-additive process, the width minimum of considering circuit is 10 μ m and space width minimum between circuit is 10 μ m, and therefore the minimum spacing between second circuit is 20 μ m.On second conducting channel, layout coverlay etc. are as the cover layer (not shown).In using the situation of rigid plate, coverlay uses soldering-resistance layer as base material, and in the situation of using flexible board, and coverlay uses still has fabulous flexible dielectric polyimide film etc. as base material after adhesion.
Can be with the thickness setting of second connecting terminal 22 for for example being 15 μ m and 8 μ m.When insulating barrier 20 is flexible board, can arrange second connecting terminal 22 so that it extends to the end of second insulating barrier 20.Simultaneously, when second insulating barrier 20 is rigid plate, preferably, arrange second connecting terminal 22 so that the end of itself and second insulating barrier 20 keeps point space.Second connecting terminal 22 carries out surface treatment by prefluxing processing, hot-air adjustment (HAL), the plating of electrolysis scolder, the plating of non-electrolysis scolder etc.
Below with reference to Figure 10 A and Figure 10 B the non-limiting method that forms according to the board interconnection structure of the 3rd non-limiting example is described.
(I) at first, be first connecting terminal 15 and bossing 16 formation scolders plating 40 (referring to Figure 10 A) of first printed substrate 1.
(II) next, arrange that first connecting terminal 15 and second connecting terminal 22 are so that it faces with each other (referring to Figure 10 B).
(III) then, by the coupling part of heater heats between first connecting terminal 15 and second connecting terminal 22 such as heating plate etc., thereby melting solder electroplates 40, forms articulamentum 42 as shown in Figure 9.Form articulamentum 42, thereby interconnect first connecting terminal 15 and second connecting terminal 22.When scolder was electroplated 40 fusings with formation articulamentum 42, excessive scolder was stored in the lateral parts of bossing 16, and it is the gap between first connecting terminal 15 and second connecting terminal 22, thereby forms leg.
By above-mentioned manufacturing step, form the board interconnection structure shown in Fig. 9 according to the 3rd embodiment.
According to the board interconnection structure of the 3rd embodiment, excessive scolder is stored in the lateral parts of bossing 16, and it is the gap between first connecting terminal 15 and second connecting terminal 22.Therefore, can prevent because the short circuit that scolder causes.And, because leg is formed on the lateral parts of bossing 16, therefore strengthened the bonding strength between first connecting terminal 15 and second connecting terminal 22.Particularly, for the surface area that has been increased related zone by three surperficial each zones that surrounds, wherein these three surfaces are: the surface of first connecting terminal 15; The surface of second connecting terminal 22; The side of bossing 16 has increased the contact area in the zone with scolder thus.Therefore, can strengthen related bonding strength.
(the 4th non-limiting example)
As shown in Figure 11 A to 11E, different according among the method that is used to form printed substrate of fourth embodiment of the invention and Fig. 8 A to 8E, to it relatively, difference is that bossing 16a forms by etching partially.Identical with in Fig. 8 A to 8E basically all of other features shown in Figure 11 A to 11E, therefore, omit being repeated in this description to it.
The method that is used to form according to the printed substrate of the 4th embodiment is described below with reference to Figure 11 A to 11E.
(I) at first, prepare insulating barrier 10, arrange to have the conducting channel of connecting terminal 15 in its surface.Then, on insulating barrier 10 and connecting terminal 15, be coated with etchant resist 50 (with reference to figure 11A).As etchant resist 50, for example can use the photocuring photoresist.
(II) then, irradiation light and exposure on the position that forms bossing 16a, thus make etchant resist 50 sex change to solidify and to form the etchant resist 52 (with reference to figure 11B) that solidifies.Then, the etchant resist 50 that does not also change into the etchant resist 52 of curing is removed (with reference to figure 11C) by alkaline solution etc.By this way, make etchant resist 50 form required pattern.
(III) then, etch partially by using the curing etchant resist 52 that forms pattern thus to carry out, thus the not position attenuation of the connecting terminal 15 of the etchant resist 52 of deposition curing and transfer thin connecting terminal 15a (referring to Figure 11 D) to thereon.Simultaneously, the position of the connecting terminal 15 of the etchant resist 52 of deposition curing does not thereon change on thickness, therefore transfers bossing 16a to.
(IV) then, remove the etchant resist 52 (with reference to figure 11E) of the curing that forms pattern thus.
By above-mentioned manufacturing step, form printed substrate according to the 4th embodiment.
According to the method that forms according to the printed substrate of the 4th embodiment, form bossing 16a by etching partially, thereby make thin connecting terminal 15a and the constant height of bossing 16a.
(the 5th non-limiting example)
As shown in Figure 12 A, according to the printed substrate of fifth embodiment of the invention be that the different of the printed substrate shown in Fig. 6 two bossings 16 are provided on each connecting terminal 15.And, as as shown in Figure 12 B, according to the use of the 5th embodiment the board interconnection structure of the printed substrate shown in Figure 12 be that in the difference shown in Fig. 9 gap 60 is provided between every pair of bossing 16 according to the board interconnection structure of the 3rd embodiment.In other features shown in Figure 12 A and Figure 12 B and at the printed substrate shown in Fig. 7 and similar substantially, therefore omit the description that repeats in the feature of the method that is used to form printed substrate shown in Fig. 8 A to 8E.
Figure 12 A and 12B have shown two bossings 16 that are provided on each connecting terminal 15; But the quantity that is provided at the bossing 16 on each connecting terminal 15 can be more than two.Bossing 16 can be by electroplating or etch partially formation.A plurality of bossings 16 can be formed by the material that differs from one another.
Board interconnection structure according to using according to the printed substrate of the 5th embodiment provides gap 60, thereby can store excessive scolder in gap 60.Therefore, can prevent because the short circuit that scolder causes.And leg forms by using gap 60, thereby can strengthen the bonding strength between first insulating barrier 10 and second insulating barrier 20.Particularly, increased the surface area in each gap 60 that is surrounded by four surfaces, these four surfaces are: the surface of first connecting terminal 15; The surface of second connecting terminal 22; With two sides of bossing 16, thereby can strengthen bonding strength.
(other non-limiting example)
More than based on non-limiting example the present invention has been described.But, should be understood that the specification and the accompanying drawing that form a disclosure text part all do not limit the present invention.From disclosure text, those skilled in the art can make the embodiment and the application technology of various replacements obviously.
For example, in first and second non-limiting examples, it is linear trapezoidal shape that each cross section of the first connecting terminal 11a and the second connecting terminal 13b has formed the side; But the side also can bend to arc.If the side has been bent to arc, then increased the surface area of the side of the first connecting terminal 11a and the second connecting terminal 13b, these connecting terminals have just increased the join domain of scolder so, thereby can strengthen bonding strength therebetween.
In addition, in third and fourth non-limiting example, bossing 16 only is formed on first printed substrate 1; But bossing 16 also can be provided on second printed substrate 2.In this case, alternately the bossing 16 of the bossing 16 of property layout first printed substrate 1 and second printed substrate 2 so that its do not contact each other, thereby increase the surface area of the side of the surface of surface, second connecting terminal 22 of first connecting terminal 15 and bossing 16.Therefore, in mode similar to the above, can strengthen bonding strength.
And, to make and describing so that as shown in Figure 6, each bossing 16 in the 3rd embodiment is crossed over the whole width of connecting terminal 15 and is formed on the direction that conducting channel 14 is extended; But as shown in Figure 13, each bossing 16 also can form shorter than the whole width of connecting terminal 15 on conducting channel 14 bearing of trends.Each bossing 16 forms shorter than the whole width of connecting terminal 15 on conducting channel 14 bearing of trends, thereby can prevent short circuit by on the end surface of each bossing 16, forming leg, even if the scolder of fusing is arranged at circuit 14 bearing of trend upper reaches.In addition, leg is formed on the end surface of each bossing 16, so also can strengthen the bonding strength 10 of connecting terminal 15 and insulating barriers.
As mentioned above, should be understood that the present invention has merged the various embodiment that do not describe at this.Therefore, the present invention is only by specifying every being limited to from the scope of the claim of the reasonable gained of disclosure text of the present invention.
Claims (17)
1. printed substrate comprises:
Insulating barrier; With
Be arranged in the conducting channel on the described insulating barrier, described conducting channel comprises connecting terminal on its end, and described connecting terminal has the upper surface width narrower than its bottom width.
2. according to the printed substrate of claim 1,
Wherein said connecting terminal has the bossing that forms thereon, and described bossing extends on the direction that described conducting channel is extended.
3. according to the printed substrate of claim 2,
Wherein said bossing is formed by in the combination of copper facing, nickel plating, gold-plated and nickel plating and gold any one.
4. according to the printed substrate of claim 2,
The width of wherein said bossing be described connecting terminal width 75%.
5. board interconnection structure comprises:
First printed substrate is wherein arranged first conducting channel on first insulating barrier, described first conducting channel comprises first connecting terminal on its end, and described first connecting terminal has the upper surface width narrower than its bottom width;
Second printed substrate is wherein arranged second conducting channel that has comprised second connecting terminal on second insulating barrier; With
Articulamentum, its vertical side along described first connecting terminal forms leg, and with described first connecting terminal and the interconnection of described second connecting terminal.
6. according to the board interconnection structure of claim 5,
The upper surface width of wherein said second connecting terminal is narrower than its bottom width.
7. according to the board interconnection structure of claim 5,
Wherein said first connecting terminal and described second connecting terminal are formed by "flop-out" method.
8. according to the board interconnection structure of claim 5,
The bottom width of wherein said first connecting terminal is substantially equal to the width of described second connecting terminal.
9. according to the board interconnection structure of claim 5,
Wherein underfill is provided at the periphery of described articulamentum.
10. according to the board interconnection structure of claim 5,
Wherein said first connecting terminal has the bossing that forms thereon, and described bossing extends on the direction that described first conducting channel is extended.
11. according to the board interconnection structure of claim 10,
Wherein said second connecting terminal has the bossing that forms thereon, and described bossing extends on the direction that described second conducting channel is extended.
12. a method that is used to form printed substrate comprises:
The preparation insulating barrier;
Provide conducting channel on the surface of described insulating barrier, described conducting channel has connecting terminal;
On described insulating barrier and described conducting channel, apply etchant resist;
Etchant resist is formed required pattern;
By using the etchant resist that forms pattern, on described conducting channel, form bossing, described bossing extends on the direction that described conducting channel is extended; With
Remove the etchant resist of described formation pattern.
13. according to the method that is used to form printed substrate of claim 12,
Wherein said bossing forms by electroplating.
14. according to the method that is used to form printed substrate of claim 12,
Wherein said bossing forms by etching partially.
15. according to the board interconnection structure of claim 5, wherein said first connecting terminal has at least two bossings that form thereon, described at least two bossings extend on the direction that described first conducting channel is extended.
16. according to the board interconnection structure of claim 15, each of wherein said at least two bossings formed by different materials.
17. according to the board interconnection structure of claim 15, wherein between described at least two bossings, form the gap,
The excess solder of wherein said articulamentum is stored in the described gap.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006145389A JP2007317851A (en) | 2006-05-25 | 2006-05-25 | Printed circuit board, forming method therefor, and inter-board connecting structure |
| JP2006145389 | 2006-05-25 | ||
| JP2006-145390 | 2006-05-25 | ||
| JP2006145390 | 2006-05-25 | ||
| JP2006145390A JP2007317852A (en) | 2006-05-25 | 2006-05-25 | Printed circuit board and inter-board connecting structure |
| JP2006-145389 | 2006-05-25 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910171771 Division CN101657070B (en) | 2006-05-25 | 2007-05-25 | Method for forming the printed wiring board |
| CN2010102398462A Division CN101909406B (en) | 2006-05-25 | 2007-05-25 | Board interconnection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101080138A true CN101080138A (en) | 2007-11-28 |
| CN101080138B CN101080138B (en) | 2012-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910171771 Expired - Fee Related CN101657070B (en) | 2006-05-25 | 2007-05-25 | Method for forming the printed wiring board |
| CN 200710104529 Expired - Fee Related CN101080138B (en) | 2006-05-25 | 2007-05-25 | Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910171771 Expired - Fee Related CN101657070B (en) | 2006-05-25 | 2007-05-25 | Method for forming the printed wiring board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007317851A (en) |
| CN (2) | CN101657070B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102111952A (en) * | 2009-12-28 | 2011-06-29 | 日本特殊陶业株式会社 | Multilayer wiring substrate |
| CN102254871A (en) * | 2010-05-20 | 2011-11-23 | 台湾积体电路制造股份有限公司 | Semiconductor eevice and manufacturing method thereof |
| US9299674B2 (en) | 2012-04-18 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump-on-trace interconnect |
| US9508668B2 (en) | 2012-09-18 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive contacts having varying widths and method of manufacturing same |
| US9646923B2 (en) | 2012-04-17 | 2017-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices |
| US10056345B2 (en) | 2012-04-17 | 2018-08-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conical-shaped or tier-shaped pillar connections |
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| CN102593626A (en) * | 2011-01-14 | 2012-07-18 | 富士康(昆山)电脑接插件有限公司 | Flexible flat cable assembly and assembling method thereof |
| JP2014072241A (en) * | 2012-09-27 | 2014-04-21 | Rohm Co Ltd | Chip component |
| US9723725B2 (en) * | 2013-05-29 | 2017-08-01 | Finisar Corporation | Rigid-flexible circuit interconnects |
| JP7223525B2 (en) | 2018-08-09 | 2023-02-16 | 新光電気工業株式会社 | Inductor and inductor manufacturing method |
| TW202314984A (en) * | 2021-09-24 | 2023-04-01 | 頎邦科技股份有限公司 | Semiconductor package structure and flexible printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6335571B1 (en) * | 1997-07-21 | 2002-01-01 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
| JP2001274537A (en) * | 2000-03-28 | 2001-10-05 | Ngk Spark Plug Co Ltd | Wiring board and method for manufacturing wiring board |
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2006
- 2006-05-25 JP JP2006145389A patent/JP2007317851A/en active Pending
-
2007
- 2007-05-25 CN CN 200910171771 patent/CN101657070B/en not_active Expired - Fee Related
- 2007-05-25 CN CN 200710104529 patent/CN101080138B/en not_active Expired - Fee Related
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| CN102111952B (en) * | 2009-12-28 | 2014-06-04 | 日本特殊陶业株式会社 | Multilayer wiring substrate |
| CN102111952A (en) * | 2009-12-28 | 2011-06-29 | 日本特殊陶业株式会社 | Multilayer wiring substrate |
| CN105590900B (en) * | 2010-05-20 | 2019-01-22 | 台湾积体电路制造股份有限公司 | Semiconductor device and its manufacturing method |
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| CN102254871A (en) * | 2010-05-20 | 2011-11-23 | 台湾积体电路制造股份有限公司 | Semiconductor eevice and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101657070A (en) | 2010-02-24 |
| CN101080138B (en) | 2012-10-24 |
| CN101657070B (en) | 2011-10-05 |
| JP2007317851A (en) | 2007-12-06 |
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