CN101080138A - Printed wiring board, method for forming the printed wiring board, and board interconnection structure - Google Patents

Printed wiring board, method for forming the printed wiring board, and board interconnection structure Download PDF

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CN101080138A
CN101080138A CN 200710104529 CN200710104529A CN101080138A CN 101080138 A CN101080138 A CN 101080138A CN 200710104529 CN200710104529 CN 200710104529 CN 200710104529 A CN200710104529 A CN 200710104529A CN 101080138 A CN101080138 A CN 101080138A
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terminal
connection
printed wiring
wiring board
formed
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CN 200710104529
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Chinese (zh)
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CN101080138B (en )
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北田智史
圆尾弘树
高见良
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株式会社藤仓
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种板互连结构,具有:第一印刷线路板,其中在第一绝缘层上布置第一导电电路,第一导电电路在其端部上具有第一连接终端,第一连接终端具有比其底面宽度要窄的上表面宽度;第二印刷线路板,其中在第二绝缘层上布置具有第二连接终端的第二导电电路;和连接层,其沿第一连接终端的纵向侧面形成焊角,并将第一连接终端和第二连接终端互连。 A board-interconnect structure, comprising: a first printed wiring board, wherein a first insulating layer disposed on the first conductive circuit, a first electrically conductive circuit having a first connecting terminal on its end portion, having a first connecting terminal than the width of the bottom surface of the upper surface of narrower width; second printed wiring board, wherein the second electrically conductive circuit having a second connecting terminal is disposed on the second insulating layer; and a connection layer which is formed along a longitudinal side of the first fillet connecting terminal and interconnecting the first connecting terminal and second connecting terminal. 第一连接终端可以具有凸起部分。 The first connection terminal may have a raised portion.

Description

印刷线路板、用于形成印刷线路板的方法及板互连结构 The method of printed wiring board and a printed wiring board for forming an interconnect structure

本申请要求2006年5月25日提交的日本专利申请2006-145389和2006-145390的优先权,其全部内容引用在此作为参考。 This application claims priority from Japanese Patent May 25, 2006 filed 2006-145389 and 2006-145390, the entire contents of which are hereby incorporated by reference.

技术领域 FIELD

本申请涉及用于互连印刷板的技术。 The present application relates to a technique for interconnecting a printed board. 具体地,本发明涉及印刷线路板、用于形成印刷线路板的方法,以及能增强板的互连强度的板互连结构。 In particular, the present invention relates to a printed wiring board, a method for forming a printed wiring board, and can enhance the strength of the panel interconnection board interconnect structure.

背景技术 Background technique

由于需要电子设备在体积上更小、在重量上更轻、在功能上更高级,因此更有必要在产品的狭小空间中三维安装多个板。 Since the electronic apparatus needs to be smaller in size, lighter in weight, and more advanced in function, and therefore all the more necessary in the narrow space in three-dimensional mounting a plurality of product plates. 为此,必须降低在板间用于连接电信号的空间。 Therefore, it must reduce the space for the electrical connection between the plates. 但,如果电子设备的功能变得更高级,则在板间的电信号的类型也会增加,上述的连接空间也会增加,这会制约这种小型化及重量的减少。 However, if the function of the electronic device becomes more advanced, it will increase in the type of electrical signals between the plates, said connecting space will increase, which will restrict and reduce the weight of such miniaturization. 对于板的互连,通常使用连接器部件。 For the interconnection board, the connector member is generally used. 但,很难使得具有装配机构的连接器部件小型化。 However, it is difficult that the size of the connector member having a mounting mechanism. 而且,在连接器部件中,通过压力性地将终端彼此接合在一起而进行电气接合,因此连接器部分在接合可靠性上很差。 Further, in the connector member by the pressure of the terminal engaged with each other electrically joined together, so that the connection portion is poor in bonding reliability. 此外,连接器部件本身也会产生成本,因此在多信号连接的情况中,连接器部件的费用也要加到总成本中。 Further, the connector member itself will incur costs, so multi-signal connections, the cost of the connector member should be added to the total cost.

近年来,在这种连接中,在电互连印刷线路板(诸如刚性板和柔性板)的情况中,特别是在电互连这些板的窄间距(narrow-pitch)布线的情况中,使用焊接的连接方法,作为不使用连接器部件的方法。 In recent years, in this connection, in the case where the electrical interconnect printed wiring board (such as a rigid board and the flexible board), in particular in the case of a narrow pitch electrical interconnection of the plates (narrow-pitch) wiring, a welding connection method, as a method without using the connector member. 具体地,互相焊接一对印刷线路板的连接终端部分。 In particular, each solder connection terminal parts of the pair of printed wiring board. 以下使用图1A和1B详细描述这种通过焊接的连接方法。 Use the following detailed description of FIGS. 1A and 1B which is connected by a welding method.

图1A和图1B显示了当刚性线路板101和柔性线路板102通过焊接接线(solder wiring)互连时的连接部分的结构。 1A and 1B show the structure of the connecting portion of the time when the interconnected rigid wiring board 101 and the flexible wiring board 102 by soldering (solder wiring). 图1A显示了连接部分的横向截面,图1B显示了连接部分的纵向截面(沿图1A的线1B-1B的截面)。 1A shows a transverse cross section of the connector, FIG. 1B shows a (FIG. 1A along section line 1B-1B ') is a longitudinal cross section of the connector. 柔性线路板102包括柔性绝缘层103;提供在柔性绝缘层103上的导电电路104;作为导电电路104的经受焊接的部位(spot)的连接终端104a;以及保护导电电路104的柔性绝缘保护层105。 The flexible wiring board 102 includes a flexible insulating layer 103; providing a conductive circuit 104 on the flexible insulating layer 103; a connection terminal as a portion (SPOT) subjected to soldering the conductive circuit 104 104a; and a flexible insulating protective layer for protecting the conductive circuit 104 105 . 刚性线路板101包括绝缘层106、提供在绝缘层106上的导电电路107、作为导电电路107的经受焊接的部位的连接终端107a;以及保护导电电路107的柔性绝缘保护层108。 Rigid wiring board 101 includes an insulating layer 106 is provided in a conductive circuit 107 on the insulating layer 106, a connection terminal 107 of the conductive circuit is subjected to the welding portions 107a; and a protective insulating protective conductive layer 108 of the flexible circuit 107.

根据在连接终端104a和107a间提供焊料109的方法,对连接终端104a和107a两者的表面或对其中任一个的表面执行焊料电镀(solderplating),或替换性地,在连接终端107a的表面上印刷焊糊(creamsolder)。 The connection between the terminals 104a and 107a provide a method of solder 109, on the surface of the connection terminals 104a and 107a of both or either of a surface of the solder plating performed (solderplating), or an alternative, the upper surface of the connection terminal 107a printing solder paste (creamsolder). 在将焊料109提供在连接终端104a和107a之间后,连接终端104a和107a彼此面对,并将刚性线路板101和柔性线路板102在位置上彼此对齐并堆叠。 After the solder 109 is provided between the connection terminals 104a and 107a, 104a and 107a connected to terminal face each other and align rigid wiring board 101 and the flexible circuit board 102 in position with each other and stacked. 在保持这种状态的同时,通过诸如加热片等的加热器对整个连接部分进行加热直至焊料109熔化。 While maintaining this state, heating is conducted until the solder connection portion 109 is melted by a heater to the entire sheet such as heating or the like. 接着,如图1B所示,连接终端104a和107a互连。 Subsequently, as shown in FIG. 1B, the connection terminals 104a and 107a are interconnected. 结果,在刚性线路板101和柔性线路板102间的导电是可能的。 As a result, the rigid wiring board 101 and the conductive flexible circuit board 102 are possible.

但,近年来,由于印刷线路板的导电电路的微型化制造和间距精缩(pitch fining)得以发展,因此在上述连接方法中就会产生问题。 However, in recent years, due to the miniaturization of printed wiring board for producing a conductive circuit minified and spacing (pitch fining) is developed, thus a problem arises in the connection process. 具体地,在图1A和图1B所示的连接结构中,如果在连接终端104a和107a间过量地提供焊料109,则当连接终端104a和107a通过使用焊料109进行热压焊接互连时,熔化的焊料109会被挤出。 In particular, the connecting structure 1A and FIG 1B, if the connection between the terminals 104a and 107a provide excess solder 109, when the connection terminals 104a and 107a are interconnected by thermocompression soldering using solder 109 is melted solder 109 would be extruded. 因此,存在如下的隐忧,挤出的焊料可能接触到在相邻终端上的焊料,并可能在连接终端间形成未曾预料的焊料桥接(solder bridge)。 Thus, there is a worry, extruded solder may touch adjacent solder on the terminal, and may form a solder bridge unexpected (solder bridge) between the connection terminals.

因此,作为解决这个问题的提议,日本专利公开文本No.H8-23147显示了在柔性线路板上的连接终端,其形成为在宽度上比相对的电路板上的连接终端要窄。 Therefore, proposed to solve this problem, Japanese Patent Publication No.H8-23147 shows the connection terminal of the flexible circuit board, which is formed to connect a terminal board in the width narrower than the opposite. 据此,在柔性线路板上的连接终端被布置在电路板的连接终端的宽度内,在电路板的连接终端上沿纵向方向形成焊料焊角(solder fillet)。 Accordingly, the connecting terminal of the flexible circuit board is disposed within the width of the connecting terminal of the circuit board, a solder fillet (solder fillet) on the connection terminal of the circuit board in the longitudinal direction. 结果,防止了焊料流出到相邻连接终端区域。 As a result, the connection terminal is prevented from flowing out to the adjacent area of ​​the solder. 但,在上述的提议中,在连接终端和柔性绝缘层间的连接强度成问题。 However, in the above proposal, the connection strength between the connecting terminals and the flexible insulating layer is a problem. 在将通过焊料而将连接终端彼此粘合时的连接强度与在连接终端和柔性绝缘层间的连接强度作比较的情况下,由于金属焊接形成于在前一个中,因此前者的连接强度要高于后者。 In the case where the connecting strength of the connecting terminal bonded to each other via a solder connection strength between the connecting terminals and the flexible insulating layer for comparison, since the metal is formed in a weld in the front, so that the connection strength of the former is higher in the latter. 因此,在考虑连接强度的情况下,在连接终端和柔性绝缘层间的连接就变得很重要。 Accordingly, in consideration of the connection strength of the connection between the connection terminals and the flexible insulating layer becomes very important. 在这种情况下,连接终端越宽越有利。 In this case, the more favorable the wider the connection terminals. 但,由于在上述提议中一侧上的连接终端变薄,因此在拉伸方向或剥离方向上抗应力的连接强度很脆弱。 However, since the above-mentioned proposals connection terminals on the side of thin, so the resistance to stress in the tensile direction or the direction connecting the peeling strength is very fragile.

而且,上述的提议在连接部分的微型制造上具有不良影响。 Further, the proposal has an adverse effect on the connecting portion of the micro-fabrication. 在印刷线路板中,强制限制可处理的导线宽度和其间的间距的最小值。 In the printed wiring board, the forced limit the minimum conductor width and spacing can be processed therebetween. 在上述的提议中,必须使得在至少一侧上的连接终端的宽度宽于能够处理导线的最小宽度。 In the above proposal, such that the width of the connecting terminals must be on at least one side is wider than the minimum width of the wire can be processed. 这制约了微型连接部分的实现。 This restricts the realization of micro-connector portion.

在这种连接中,日本专利公开文本No.H9-46031提出了在柔性线路板的连接终端上形成狭缝以增加上述的连接强度,即,板间的拉伸强度或剥离强度。 In this connection, Japanese Patent Publication No.H9-46031 proposed to form a slit on the connection terminal of the flexible wiring board described above to increase the connection strength, i.e., tensile strength or peel strength between the plates. 根据这个公开文本,过量的焊料存储在狭缝中。 According to this publication, the excess solder is stored in the slit. 因此,防止了由于过量焊料导致的短路,此外,通过形成在狭缝两侧的焊角增强了连接强度。 Thus, short circuit is prevented due to the excessive solder leads, in addition, the angle formed by welding on both sides of the slot enhances the connection strength.

考虑使用蚀刻处理作为形成连接终端上狭缝的方式。 Consider using an etching process for forming the slit connecting terminal mode. 但,由于宽度以及可由蚀刻处理形成的狭缝(即,电路间隙),电路的微型制造受到限制。 However, since the width and a slit (i.e., circuit gap) may be formed by etching, micro-fabrication circuit is limited. 例如,当在如图1B所示的每个连接终端104a的中心上形成一个狭缝,并将每个连接终端104a分成两部分时,必须将连接部分所必须的电路宽度设定为等于或大于通过将可形成狭缝的宽度加入到可形成电路的至少两倍的宽度所获得的宽度。 For example, when a slit is formed in the center as shown in FIG. 1B each connection terminal 104a, and 104a into two portions of each connection terminal portion must be connected to the necessary circuitry to a width set equal to or greater than the width of the slit may be formed to a width of at least twice the added width may be formed of the obtained circuit. 即,必须加厚电路的宽度。 That is, the width of the circuit must be thickened. 这制约了使电路间的间距更小。 This restricts the pitch between the circuit smaller. 而且,当在一侧的导电电路上的连接终端上形成狭缝时,减小了连接终端在绝缘层上经过的区域。 Further, when a slit is formed on the connection terminals on the side of the conductive circuit, reducing the region of the connecting terminal through the insulating layer. 因此,当对其施加将柔性线路板从刚性线路板剥离的应力时,在连接终端和绝缘层间的接触面上很容易发生剥离,从而导致整个连接强度的降低。 Thus, when a stress is applied thereto to release the flexible circuit board from rigid wiring board, the contact surface between the connecting terminal and the insulating layer is easily peeled off, resulting in a reduction of the strength of the whole connection.

发明内容 SUMMARY

本发明的一个方面提供了一种印刷线路板,用于形成印刷线路板的方法和板互连结构,其能防止在连接终端和绝缘层间的剥离强度的降低,并能通过存储过量焊料而防止短路,且不会制约电路间的间距进一步减小,从而增强在连接终端间的连接强度。 One aspect of the invention there is provided a printed wiring board interconnect structure and method for forming a printed wiring board, which can prevent a decrease in peeling strength between the connection terminals and the insulating layer, and by storing excess solder preventing a short circuit, and does not restrict the spacing between circuits is further reduced, thereby enhancing the connection strength between the connecting terminals.

本发明的第一方面是一种印刷线路板,包括:绝缘层;布置在绝缘层上的导电电路,该导电电路在其端部具有连接终端,连接终端中的上表面宽度窄于底面宽度。 The first aspect of the present invention is a printed wiring board comprising: an insulating layer; a conductive circuit disposed on the insulating layer, the conductive circuit having a connection terminal at an end portion of the upper surface of the connecting terminal narrower than the width of the bottom surface.

这里,连接终端可以通过在导电电路延伸方向上提供凸出部分而形成。 Here, the connecting terminal may be formed by providing a conductive pattern in the extending direction of the projecting portion.

本发明的第二方面是一种板互连结构,包括:第一印刷线路板,其中在第一绝缘层上布置有第一导电电路,该第一导电电路在其端部具有第一连接终端,该第一连接终端的上表面宽度窄于底面宽度;第二印刷线路板,其中在第二绝缘层上布置具有第二连接终端的第二导电电路;和连接层,其沿第一连接终端的纵向侧面形成焊角,并将第一连接终端和第二连接终端互连。 A second aspect of the present invention is a board interconnection structure, comprising: a first printed wiring board, wherein a first insulating layer disposed on the first conductive circuit, the first circuit having a first conductive terminal is connected at its end the first terminal is connected to the upper surface of a width narrower than the bottom surface; and a second printed wiring board, wherein the second insulating layer on the conductive circuit having a second terminal connected to a second arrangement; and a connection layer, which is connected to a first terminal longitudinal side fillet is formed, and a first connection terminal and second connection terminal are interconnected.

这里,在上述的互连结构中,凸起部分可以沿第一导电电路延伸方向提供在第一导电电路的第一连接终端上。 Here, in the above-mentioned interconnect structure, the convex portion may be provided on a first terminal connected to the first conductive circuit extending along the direction of the first conductive circuit.

本发明的第三方面是一种用于形成印刷线路板的方法,包括:在布置了具有连接终端的导电电路的表面上制备绝缘层;在绝缘层和导电电路上涂覆抗蚀膜(resist);将抗蚀膜形成所需的图案;通过使用图案化的抗蚀膜,沿导电电路延伸的方向在导电电路上形成凸起部分;并除去图案化的抗蚀膜。 A third aspect of the present invention is a method for forming a printed wiring board, comprising: preparing an insulating layer disposed on the conductive circuit surface having a connection terminal; on the insulating layer and the conductive circuit resist coating film (a resist ); the resist film to form a desired pattern; by using the patterned resist film, a conductive circuit in a direction extending convex portion formed on the conductive circuit; and removing the patterned resist film.

根据本发明,可以防止在连接终端和绝缘层间剥离强度的降低,以及由于过量的焊料而导致的在连接终端间的焊料桥接(短路),而不会制约在电路间的间距进一步缩减。 According to the present invention, it is possible to prevent the peeling strength is reduced between the connection terminals and the insulating layer, and due to the excess solder of the solder caused by the connection bridge (short circuit) between terminals, without constraints between the circuit further reduce pitch. 因此,提供了能增强在连接终端间的连接强度的印刷线路板、用于形成这样的印刷线路板的方法,以及板连接结构。 Thus, the connection strength can be enhanced between the printed wiring board connected to the terminal, a method for forming such a printed wiring board, and the board connection structure.

附图说明 BRIEF DESCRIPTION

图1A是传统的板互连结构的连接部分的截面图。 1A is a cross-sectional view of the connection portion of the conventional plate interconnection structure.

图1B是当从图1A的线1B-1B方向看图1A的板互连结构时的截面图。 Figure 1B is when the board interconnection structure 1A from the direction of the line 1B-1B of FIG. 1A in cross section in FIG.

图2是根据本发明的第一非限制性实施例的印刷线路板的平面图。 FIG 2 is a plan view of the first printed wiring board non-limiting embodiment of the present invention.

图3是当从图2的线3-3方向看图2的印刷线路板时的截面图。 Figure 3 when the printed wiring board 2 from the direction of line 3-3 in FIG. 2 a sectional view.

图4是根据第一非限制性实施例的板互连结构的截面图。 FIG 4 is a sectional view of a plate of a first interconnect structure in accordance with non-limiting embodiment.

图5是根据第二非限制性实施例的板互连结构的截面图。 5 is a sectional view of a plate of the second interconnect structure in accordance with non-limiting embodiment.

图6是根据第三非限制性实施例的印刷线路板的平面图。 FIG 6 is a plan view of the third printed wiring board of a non-limiting embodiment.

图7是当从图6中的线7-7方向看图6的印刷线路板时的截面图。 7 is a sectional view when the direction 7-7 in Figure 6 Figure 6 is a line printed wiring board.

图8A至图8E是制造步骤的截面图,其显示了用于形成根据第三非限制性实施例的印刷线路板的方法。 8A to 8E are sectional views of manufacturing steps showing a method for forming a printed wiring board according to a third embodiment of a non-limiting embodiment.

图9是根据第三非限制性实施例的板互连结构的截面图。 9 is a sectional view of a plate interconnection structure of the third non-limiting embodiment in accordance with.

图10A至图10B是制造步骤的截面图,其显示了根据第三非限制性实施例的板互连结构的连接方法。 10A to 10B are sectional views of manufacturing steps showing a method of connecting plate interconnection structure of the third non-limiting embodiment in accordance with.

图11A至11E是制造步骤的截面图,其显示了用于形成根据第四非限制性实施例的印刷线路板的方法。 11A to 11E are sectional views of manufacturing steps showing a method for forming a printed wiring board according to a fourth embodiment of a non-limiting embodiment.

图12A是根据第五非限制性实施例的印刷线路板的截面图。 12A is a cross-sectional view of a printed wiring board of a fifth embodiment of a non-limiting embodiment.

图12B是根据第五非限制性实施例的板互连结构的截面图。 12B is a cross-sectional view of a plate interconnection structure according to a fifth embodiment of the non-limiting embodiment.

图13是根据其他的非限制性实施例的印刷线路板的平面图。 FIG 13 is a plan view of a printed wiring board other non-limiting embodiments.

具体实施方式 detailed description

以下将参考附图描述本发明的非限制性实施例。 The following will be described with reference to the accompanying non-limiting embodiments of the present invention. 在以下的描述中,附图的相同或相似的部分由相同或相似的参考数字标识。 In the following description, the same or similar parts throughout the drawings are identified by the same or similar reference numerals. 要注意的是,附图仅仅是示意性的,在厚度和平面尺寸间的关系、各个层的厚度的比率等都与实际的不同。 It is noted that the drawings are merely schematic, the relationship between the thickness and planar dimension, the ratio of the thickness of the individual layers so different from actual ones. 因此,具体的厚度和尺寸通过参考以下的描述来确定。 Thus, the specific thickness and size is determined by reference to the following description. 而且,在附图中,包括了尺寸关系和比率互相不同的部分也是必然的。 Moreover, in the drawings, including the dimensional relationships and ratios are different from each other necessary portions.

(第一非限制性实施例)(印刷线路板)如在图2中所示,根据本发明第一实施例的印刷线路板包括绝缘层10、其端部上具有连接终端11a的导电电路11,在每个连接终端11a中,上表面的宽度W1窄于底面的宽度W2。 (First non-limiting embodiment) (printed circuit board) as shown in FIG. 2, according to the present invention comprises a printed wiring board according to the first embodiment of the insulating layer 10, the conductive circuit 11a is connected to a terminal end portion thereof having 11 in each connection terminal 11a, the upper surface width W1 is narrower than the bottom surface W2. 图3是从图2的线3-3方向上看的印刷线路板的截面图。 FIG 3 is a sectional view of a printed wiring board as viewed from the line 3-3 in FIG. 2.

作为绝缘层10,可以使用诸如聚酰亚胺板、聚乙烯(PET)板和聚萘乙稀(PEN)板等的柔性板。 As the insulating layer 10, may be used such as a polyimide board, a polyethylene (PET) and poly naphthylethyl dilute plate (PEN) is a flexible plate or the like plate. 替换地,作为绝缘层10,也可以使用诸如玻璃环氧板、玻璃合成板以及纸质环氧板等的硬刚性板。 Alternatively, as the insulating layer 10 may be used such as a glass epoxy board, glass epoxy composite board and paper board a hard rigid plate. 优选地,绝缘层10具有对焊料熔点温度或更高温度的耐热性。 Preferably, the insulating layer 10 has a solder heat resistance temperature or higher of the melting point. 在使用刚性板作为绝缘层10的情况中,可以使用2.4mm、2.0mm、1.6mm、1.2mm、1.0mm、0.8mm、0.6mm、0.4mm、0.2mm等的厚度。 In the case of using the rigid board as the insulating layer 10 may be used 2.4mm, 2.0mm, 1.6mm, 1.2mm, 1.0mm, 0.8mm, thickness 0.6mm, 0.4mm, 0.2mm and the like. 此外,在使用柔性板作为绝缘层10的情况中,可以使用25μm、12.5μm、8μm、6μm、等的厚度。 Further, the case of using the flexible sheet as the insulating layer 10 may be used 25μm, 12.5μm, 8μm, 6μm, thickness and the like.

导电电路11形成导线的电路图案,其在绝缘层10上进行设计。 A conductive circuit pattern formed conductor circuit 11, which is designed on the insulating layer 10. 在绝缘层10上,导电电路11通过图案处理由轧制铜箔、电解铜箔等形成。 On the insulating layer 10, a conductive circuit 11 is formed by patterning a rolled copper foil, an electrolytic copper foil. 在导电电路11中,除了铜箔外也可以使用其他的金属箔作为导线。 In the conductive circuit 11, in addition to copper foil may be used as the other metal foil conductor. 在导电电路11中的导线间的间距被设定在10至500μm,导线的宽度被设定在10至500μm。 The spacing between the conductive circuit conductor 11 is set at 10 to 500μm, width of the wire is set at 10 to 500μm. 对于导电电路11的厚度,可以使用35μm、18μm、12μm、9μm等。 The thickness of the conductive circuit 11 may be used 35μm, 18μm, 12μm, 9μm like. 在导电电路11上,布置覆盖膜等作为覆盖层(未示出),所述覆盖膜使用在粘附后仍然具有极好柔韧性的绝缘聚酰亚胺膜作为基材。 On conductive circuit 11, is arranged as a cover film or a cover layer (not shown), an insulating film for covering the polyimide film having excellent flexibility remains in the adhesive as a base material.

连接终端11a由缩减法(subtractive method)形成,从而可以形成上表面宽度W1被设定为小于底面宽度W2。 Connection terminals 11a is formed by the reduction method (subtractive method), can be formed on the surface of the width W1 is set smaller than the bottom surface width W2. 当绝缘层10是柔性板时,可以布置连接终端11a以使其延伸到绝缘层10的端部。 When the insulating layer is a flexible sheet 10, the connection terminals 11a may be arranged so as to extend to the end portion of the insulating layer 10. 同时,当绝缘层10是刚性板时,优选地,布置连接终端11a以使其与绝缘层10的端部保持一点空间。 Meanwhile, when the insulating layer is a rigid plate 10, preferably, are arranged so as to connect the terminal end portion 11a of the insulating layer 10 remains a little space. 连接终端11a通过预涂熔剂处理、热空气调整(HAL)、电解焊料电镀、非电解焊料电镀等进行表面处理。 Connection terminals 11a by a preflux treatment, hot air is adjusted (the HAL), the electrolytic solder plating, electroless solder plating or the like surface treatment.

根据上述的印刷线路板,在绝缘层10和连接终端11a间的连接区域不会减少,因此在绝缘层10和连接终端11a间的连接强度也不会降低。 According to the printed wiring board, the connection area between the insulating layer 11a and the connecting terminal 10 is not reduced, and therefore not reduced in connection strength between the insulating layer 10 and the connection terminals 11a. 而且,每个连接终端11a的上表面宽度W1都比底面宽度W2要窄,这样可以沿连接终端11a的纵向侧面形成焊角23(在图4中所示)。 Further, each of the upper surface of the connection terminal 11a of a width W1 narrower than the width W2 of the bottom surface, so that the fillet 23 can be formed (shown in FIG. 4) along a longitudinal side of the connector terminal 11a. 因此,能防止焊料桥接的形成以及在连接层19(图4中所示)中的连接故障。 Thus, it is possible to prevent a solder bridge and a connection failure (shown in FIG. 4) of the connection layer 19.

而且,根据上述的印刷线路板,可以形成连接终端11a以使在能被处理的连接终端11a上具有最小的宽度。 Further, according to the printed wiring board, connection terminals 11a may be formed so as to have a minimum width at the connection terminal 11a can be processed. 因此,可以实现微小的连接部分。 Therefore, it is possible to achieve the small connecting sections.

此外,连接终端11a可以通过缩减法形成,因此当导电电路11由缩减法处理时,可以形成导电电路11而不会增加制造步骤的数量。 Further, the connection terminal 11a may be formed by reducing method, when the conductive circuit 11 is thus processed by the reduction method, the conductive circuit 11 can be formed without increasing the number of manufacturing steps.

(板互连结构)如图4中所示,根据本发明的第一实施例的板互连结构包括:第一印刷线路板1,其中在第一绝缘层10上布置第一导电电路,该第一导电电路在其端部上具有第一连接终端11a,在其中上表面的宽度W1窄于底面的宽度W2;第二印刷线路板2,其中在第二绝缘层12上布置具有第二连接终端13a的第二导电电路;和连接层19,其中沿第一连接终端11a的纵向侧面形成焊角23。 (Board interconnection structure) shown in Figure 4, an interconnect structure according to a first embodiment of the plate of the present invention comprises: a first printed wiring board 1, wherein the first insulating layer 10 is disposed a first electrically conductive circuit, which a first electrically conductive circuit having a first end portion thereof connected to the terminal 11a, in which the upper surface of narrower width W1 than the width W2 of the bottom surface; a second printed wiring board 2, which is disposed on the second insulating layer 12 having a second connector a conductive circuit 13a of the second terminal; and a connection layer 19, wherein a first longitudinal side edge 11a of the connecting terminal 23 is formed fillet. 连接层19将第一连接终端11a和第二连接终端13a互连。 A first connection layer 19 is connected to terminal 11a and a second terminal connected to the interconnection 13a.

作为第二绝缘层12,可以使用诸如玻璃环氧板、玻璃合成板以及纸质环氧板等的硬刚性板。 As the second insulating layer 12, may be used such as a glass epoxy board, glass epoxy composite board and paper board a hard rigid plate. 而且,也可以使用柔性板作为第二绝缘层12。 Further, the flexible board may be used as the second insulating layer 12. 优选地,第二绝缘层12具有对焊料的熔点温度或更高温度的耐热性。 Preferably, the second insulating layer 12 has heat resistance to the solder melting temperature or higher temperatures. 在使用刚性板的情况中,可以使用2.4mm、2.0mm、1.6mm、1.2mm、1.0mm、0.8mm、0.6mm、0.4mm、0.2mm等的厚度。 In the case where the rigid board, may be used 2.4mm, 2.0mm, 1.6mm, 1.2mm, 1.0mm, 0.8mm, thickness 0.6mm, 0.4mm, 0.2mm and the like. 此外,在使用柔性板的情况中,可以使用25μm、12.5μm、8μm、6μm等的厚度。 Further, in the case of using the flexible board can be used 25μm, 12.5μm, 8μm, thickness of 6μm like.

第二导电电路形成导线的电路图案,其在第二绝缘层12上设计。 Forming a conductive circuit pattern of the second circuit conductor, which is designed on the second insulating layer 12. 第二导电电路通过在第二绝缘层12上对轧制铜箔、电解铜箔执行图案处理而形成。 A second conductive circuit formed on the rolled copper foil, an electrolytic copper foil by performing patterning on the second insulating layer 12. 对于第二导电电路,除了铜箔外也可以使用其他的金属箔。 For the second conductive circuit, in addition to copper foil may be used other metal foil. 在第二导电电路中的导线间的间距被设定在10至500μm,导线的宽度被设定在10至500μm。 Spacing between the second conductive wire circuit is set at 500μm, the width of the wire 10 is set to 10 to 500μm. 对于第二导电电路的厚度,可以使用35μm、18μm、12μm、9μm等。 The thickness of the second electrically conductive circuit can be used 35μm, 18μm, 12μm, 9μm like. 在第二导电电路上,可以布置覆盖膜等作为覆盖层(未示出)。 On the second conductive circuit, it may be arranged as a cover film or a cover layer (not shown). 在使用刚性基板的情况中,覆盖膜使用阻焊膜(solderresist)作为基材,而在使用柔性板的情况中,使用在粘附后仍然具有极好柔韧性的绝缘聚酰亚胺膜等作为基材。 In the case of using a rigid substrate, using solder resist cover film (solderresist) as a base, and in the case of using a flexible board, an insulating polyimide film having excellent flexibility remains after adhesion as substrate.

第二连接终端13a的宽度被设定为基本上等于第一连接终端11a的底面宽度W2。 The second connection terminal 13a is set to be substantially equal to the width of the bottom surface of the first connection terminals 11a of width W2. 例如,第二连接终端13a的厚度可以设定在15μm。 For example, the second connection terminal 13a may be set at a thickness of 15μm. 当第二绝缘层12是柔性板时,布置第二连接终端13a以使其延伸到第二绝缘层12的端部。 When the second insulating layer 12 is a flexible plate, the second connection terminal 13a is disposed so as to extend to the end portion of the second insulating layer 12. 同时,当第二绝缘层12是刚性板时,优选地,布置连接终端13a以使其与第二绝缘层12的端部保持一点空间。 Meanwhile, when the second insulating layer is a rigid plate 12 when, preferably, arranged so as to connect the terminal end portion 13a of the second insulating layer 12 remains a little space. 第二连接终端13a通过预涂熔剂处理、热空气调整(HAL)、电解焊料电镀、非电解焊料电镀等进行表面处理。 The second connection terminal 13a through preflux treatment, hot air adjustment (the HAL), the electrolytic solder plating, electroless solder plating or the like surface treatment.

现将描述根据本发明的第一实施例的板互连结构的连接方法。 The method will now be described a first embodiment of the connector plate interconnection structure of the present invention.

首先,对第一连接终端11a和第二连接终端13a中的至少一个施加焊膏或对其进行焊料电镀,从而在其上布置具有大约3μm厚度的焊料。 First, solder paste is applied to at least one of its first or second connecting terminal 11a and the terminal 13a is connected to a solder plating, so that solder having a thickness of approximately 3μm disposed thereon. 接着,布置第一连接终端11a和第二连接终端13a以使其彼此相对。 Next, the arrangement of the first connection terminals 11a and the second connection terminal 13a so as to oppose each other. 而且,通过诸如加热片等的加热器将这些板加热到200℃或更高,从而在其间形成连接层19。 Further, heating by a heater such as a sheet or the like of the plates was heated to 200 ℃ or higher, thereby forming a connection layer 19 therebetween. 结果,第一连接终端11a和第二连接终端13a彼此粘合。 As a result, the first connection terminals 11a and the second connection terminals 13a bonded to each other. 当焊料熔化以形成连接层19时,焊料沿第一连接终端11a的纵向侧面方向存储,其是在第一连接终端11a和第二连接终端13a间的间隙,从而形成焊角23。 When the solder is melted to form 19, the longitudinal direction of the side surface of the solder in the first connection terminals 11a is connected to the storage layer, which is the gap between the first connection terminals 11a and the second connection terminals 13a, 23 to form a fillet. 通过使用毛细现象将环氧底部填充树脂(epoxy underfill resin)等(未示出)填充到连接层19的外围。 By filling a resin (epoxy underfill resin) and the like (not shown) filled in the periphery of the bottom connecting layer 19 using epoxy capillary phenomenon. 将底部填充树脂填充在那,这样可以增加连接层19的连接强度,并防止焊料流入相邻的连接终端。 The underfill resin is filled in it, which can increase the connection strength of the connecting layer 19, and to prevent the connection terminal adjacent solder inflow. 通过上述的制造步骤,形成图3所示的板互连结构。 Through the above manufacturing steps, the plate forming the interconnection structure shown in FIG. 要注意的是,作为在连接层19中所使用的粘合材料,可以使用含铅焊膏、无铅焊膏、焊料电镀、锡镀等。 It is noted that, as the adhesive material used in the connecting layer 19 may be leaded solder paste, lead-free solder paste, solder plating, tin plating.

根据上述的板互连结构,在第一绝缘层10和第一连接终端11a间的连接区域并不会减少,因此,在第一绝缘层10和第一连接终端11a间的连接强度不会降低。 According to the plate an interconnect structure, the connection region between the first insulating layer 10 and the first connection terminal 11a is not reduced, and therefore, does not decrease in connection strength between the first insulating layer 10 and the first connection terminal 11a . 而且,每个第一连接终端11a的上表面宽度W1都窄于其底面宽度W2,从而可以沿第一连接终端11a的纵向侧面形成焊角。 Further, the width W1 of the upper surface of each of the first connection terminals 11a are narrower than the width W2 of the bottom surface, a fillet can be formed along a first longitudinal side of the connector terminal 11a. 因此,可以防止焊料桥接的形成以及在连接层19中的连接故障。 Thus, it is possible to prevent a solder bridge and a connection fault in the connection layer 19.

而且,根据上述的板互连结构,第一连接终端11a和第二连接终端13a两者可以形成为具有两者都能被处理的最小宽度。 Further, according to the interconnect structure plate, 13a both connected to a first terminal and a second connection terminal 11a may be formed to have both a minimum width can be processed. 因此,可以实现微小的连接部分。 Therefore, it is possible to achieve the small connecting sections.

此外,第一连接终端11a的底面宽度W2和第二连接终端13a的宽度可以被设定为基本上彼此相同,从而两个连接终端11a和13a都不会降低在第一绝缘层10和第二绝缘层12间的连接强度。 In addition, a second width W2 and the width of the first connection terminals 13a of the bottom surface of the connection terminals 11a may be set to be substantially identical to each other, so that two connection terminals 11a and 13a are not reduced in the first insulating layer 10 and the second the insulating layer 12 of the connection strength.

(第二非限制性实施例)如图5所示,根据本发明的第二实施例的板互连结构与图4中的相比,不同之处在于,连接终端13b的上表面宽度W3比第二印刷线路板2a的连接终端13b的底面宽度W4要窄得多。 (Second non-limiting embodiment) FIG. 5, according to the second embodiment as compared to the embodiment of the present invention interconnection structure of FIG plate 4, except that the width of the terminal 13b connected to the upper surface of the ratio of W3 connection terminals 2a of the bottom surface of the second printed wiring width W4 13b to be much narrower. 在图5中的其他元件基本上与在图4中所示的板互连结构中的相似,因此省略对其的重复描述。 Other elements in FIG. 5 is substantially similar to board interconnection structure shown in FIG. 4, and thus repeated description thereof is omitted.

根据第二实施例的板互连结构,在第一绝缘层10和第一连接终端11a间以及在第二绝缘层12和第二连接终端13b间的连接区域都没有减少。 The plate interconnection structure of the second embodiment, between the first insulating layer 10 and the first connection terminal 11a, and no decrease in the connection area between the second insulating layer 12 and the second connection terminals 13b. 因此,在第一绝缘层10和第一连接终端11a以及在第二绝缘层12和第二连接终端13b间的连接强度也都没有降低。 Thus, it did not reduce the terminal 11a and the first connection 10 and a connection between the strength of the first insulating layer a second insulating layer 12 and the second connection terminals 13b. 而且,第一连接终端11a的上表面宽度W1比其底面宽度W2要窄,从而可以在沿第一连接终端11a的纵向侧面形成焊角。 Further, the width W1 of the upper surface of the first connection terminals 11a is narrower than the width W2 of the bottom surface, so that the fillet can be formed along the first longitudinal side of the connector terminal 11a. 因此,可以防止焊料桥接的形成和在连接层19a中的连接故障。 Thus, it is possible to prevent the formation of solder bridging and connection failure in the connection layer 19a. 以类似的方式,第二连接终端13b的上表面宽度W3比其底面宽度W4要窄,从而可以在沿第二连接终端13b的纵向侧面形成焊角。 In a similar manner, the upper surface of the second connection terminal 13b of a width W3 narrower than the width W4 of the bottom surface thereof, a fillet can be formed along the longitudinal sides of the second connection terminal 13b. 因此,可以防止焊料桥接的形成和在连接层19a中的连接故障。 Thus, it is possible to prevent the formation of solder bridging and connection failure in the connection layer 19a.

而且,根据第二实施例的板互连结构,第一连接终端11a和第二连接终端13b两者可以形成为具有两者都能被处理的最小宽度。 Further, according to board interconnection structure of the second embodiment, 13b connected to both the first terminal and the second connection terminal 11a may be formed to have both a minimum width can be processed. 因此,可以实现微小的连接部分。 Therefore, it is possible to achieve the small connecting sections.

此外,第一连接终端11a的底面宽度W3和第二连接终端13b的底面宽度W4可以被设定地彼此基本相同,从而连接终端11a和13b不会降低在第一绝缘层10和第二绝缘层12间的连接强度。 Further, the bottom surface of the bottom surface width W4 width W3 of the first connection terminal 11a and a second connection terminal 13b may be set to be substantially identical to each other, so that the connection terminals 11a and 13b of the first insulating layer 10 is not reduced and the second insulating layer 12 between the connection strength.

要注意的是,在第一和第二实施例中,第一连接终端11a和第二连接终端13b的交叉部分的每个都形成其侧面是线性的梯形形状;但,侧面也可以弯曲成弧形。 It is noted that, in the first embodiment and the second embodiment, each cross section of the first connection terminals 11a and the second connection terminals 13b are formed in the side surface thereof is linear trapezoidal shape; however, the side surface may be curved in an arc shape. 如果侧面弯成弧形,则第一连接终端11a和第二连接终端13b的侧面的表面积就增加了,那么这些连接终端对焊料的连接区域也就增加了,从而可以增强其间的连接强度。 If the arced side, the surface area of ​​the side surface of the first connection terminals 11a and 13b of the second connecting terminal has increased, these terminals are connected to the solder connection region also increased, which can enhance the connecting strength therebetween.

(第三非限制性实施例)(印刷线路板)如图6中所示,根据本发明第三实施例的印刷线路板包括绝缘层10、布置在绝缘层10上并在其端部具有连接终端15的导电电路14、和提供在导电电路14延伸的方向上的凸起部分16。 (Third non-limiting embodiment) (printed circuit board) as shown in Figure 6, a printed wiring board according to the third embodiment of the present invention includes an insulating layer 10, arranged and having a connection portion at its end 10 on the insulating layer the conductive circuit 15 of the terminal 14, and the convex portion 16 provided in a direction of the conductive circuit 14 extends. 图7是从图6的线7-7方向上看的印刷线路板的截面图。 FIG. 7 is a sectional view of a printed wiring board viewed from the direction of line 7-7 in FIG. 6.

绝缘层10类似于第一实施例的。 Insulating layer 10 is similar to the first embodiment.

导电电路14形成导线的电路图案,其在绝缘层10上设计。 A conductive circuit pattern 14 is formed wire circuit, which is designed on the insulating layer 10. 在使用缩减法的图案形成的情况中,通过在绝缘层10上蚀刻轧制铜箔、电解铜箔等而形成导电电路14。 In the case of using the reduced pattern forming method, a conductive circuit 14 is formed on the insulating layer 10 by etching a rolled copper foil, an electrolytic copper foil. 也可以使用除铜箔外的其他金属箔作为导线。 Other metals may also be used in addition to copper foil as lead. 对于导电电路14的厚度,可以使用35μm、18μm、12μm、9μm、5μm等。 The thickness of the conductive circuit 14 may be used 35μm, 18μm, 12μm, 9μm, 5μm like. 当导电电路14由缩减法形成时,考虑到电路的宽度最小为15μm,而在电路间的空间宽度最小为20μm,因此在导电电路14间的最小间距为35μm。 When the conductive circuit 14 is formed by the reduction method, taking into account the minimum width of the circuit 15 m, and the width of the space between the circuits minimum of 20 m, and therefore the minimum spacing between the conductive circuit 14 to 35μm. 在通过电镀在绝缘层10上形成导电电路14的半加成(semi-additive)法的情况中,考虑到电路的宽度最小为10μm,而在电路间的空间宽度最小为10μm,因此在电路间的最小间距为20μm。 In the case of forming a conductive semi-additive circuit (semi-additive) 14 in the law on the insulating layer 10 by plating, in consideration of the minimum width of the circuit 10 m, and the space width between the minimum circuit 10 m, and therefore the circuit between the the minimum spacing of 20μm. 具体地,半加成法比缩减法能更加微型化。 In particular, semi-additive method can be more miniaturized than the reduction process. 在导电电路14上,作为覆盖层(未示出),布置有覆盖膜等,其使用在粘附后仍然具有极好柔韧性的绝缘聚酰亚胺膜等作为基材。 On conductive circuit 14, as the cap layer (not shown), is arranged with a cover film, using an insulating polyimide film having excellent flexibility remains in the adhesive as a base material.

例如,可以将连接终端15的厚度设定为15μm和8μm。 For example, the thickness of the connecting terminal 15 is set to 15μm and 8μm. 当绝缘层10为柔性板时,可以布置连接终端15以使其延伸到绝缘层10的端部。 When the insulating layer 10 is a flexible board, connection terminals 15 may be arranged so as to extend to the end portion of the insulating layer 10. 同时,当绝缘层10为刚性板时,优选地,布置连接终端15以使其与绝缘层10的端部保持一点空间。 Meanwhile, when the rigid board 10 is an insulating layer, preferably, it arranged so as to connect the terminal 15 and the end portion of the insulating layer 10 remains a little space.

如图7中所示,凸起部分16提供在连接终端15上。 As shown in FIG. 7, the raised portion 16 provided on the connection terminals 15. 凸起部分16的宽度,即,在垂直于导电电路14延伸方向上的宽度,可以设定为例如是连接终端15的宽度的75%。 Width of raised portion 16, i.e. the width perpendicular to the extending direction of the conductive circuit 14 may be set to, for example, 75% of the width of the connecting terminal 15. 当连接终端15的宽度为20μm时,凸起部分16的宽度为15μm(=20μm×0.75)。 When the width of the connecting terminal 15 is 20μm, the width of the convex portion 16 is 15μm (= 20μm × 0.75). 对于凸起部分16的厚度,优选地,所涉及的厚度和连接终端15的厚度的总和等于传统的印刷线路板的连接终端的厚度。 The thickness of the convex portion 16, preferably, the sum of the thicknesses involved thickness and a connection terminal 15 is equal to the thickness of the connecting terminal of the conventional printed wiring board. 例如,凸起部分16的厚度可以设定为10μm。 For example, the thickness of the convex portion 16 may be set to 10μm. 凸起部分16的材料可以是与导电电路14相同的材料,或替换地,可以与导电电路14的材料不同,只要材料的熔点高于焊料的熔点就行了。 Material raised portion 16 may be the same material, the conductive circuit 14, or alternatively, the material of the conductive circuit 14 may be different, as long as the melting point of the solder material is higher than the melting point of the line. 作为凸起部分的材料,可以使用镀铜(Cu)、镀镍(Ni)、镀金(Au)、在镀Ni上进一步形成镀Au的镀Ni/Au等。 As the material of the raised portion, may be used copper (Cu), nickel (Ni), gold plating (Au), is further formed Au-plated Ni / Au plating or the like plated Ni. 例如,镀Ni/Au的厚度大约为镀Ni的厚度(2至8μm)和镀Au的厚度(0.03μm)之和。 For example, the thickness of the plated Ni / Au-Ni plating thickness of about (2 to 8 m) and the thickness of the Au plating (0.03 m) and the sum. 在选择凸起部分16的材料时,电气特性(导电电阻、迁移特性)、机械强度和用于电镀形状的可控性都很重要。 When selecting material portion of the projection 16, the electrical characteristics (conduction resistance, migration characteristics), mechanical strength and shape controllability is important for electroplating.

根据第三实施例的印刷线路板,在绝缘层10和连接终端15间的连接区域不会减少。 Printed wiring board according to the third embodiment, the connecting region 15 between the connecting terminal 10 and the insulating layer will not be reduced. 因此,在绝缘层10和连接终端15间的剥离强度也不会降低。 Thus, the peel strength at 10 and 15 is connected to the terminal insulating layer is not reduced. 而且,提供了凸起部分16,从而增加了每个连接终端15的表面积。 Furthermore, a raised portion 16, thereby increasing the surface area of ​​each connection terminal 15. 因此,可以增强连接强度。 Thus, coupling strength can be enhanced.

(用于形成印刷线路板的方法)以下将参考图8描述用于形成根据第三非限制性实施例的印刷线路板的非限制性方法。 (Method for forming a printed wiring board) is described below with reference to FIG 8 the third non-limiting method of a printed wiring board in accordance with non-limiting embodiment for forming.

(I)首先,准备绝缘层10,在其上布置具有连接终端15的导电电路。 (I) First, a 10, a conductive circuit disposed thereon having a connection terminal 15 of the insulating layer. 接着,在绝缘层10和连接终端15上形成抗蚀膜30(参考图8A)。 Next, a resist film 30 (see FIG. 8A) on the insulating layer 10 and a connection terminal 15. 作为抗蚀膜30,例如可以使用光固化光刻胶。 As the resist film 30, for example, a photocurable photoresist.

(II)接着,在不形成凸起部分16的部位上照射光线并曝光,从而使抗蚀膜30变性以固化并形成固化的抗蚀膜32(参考图8B)。 (II) Next, the projection is not formed on the light irradiation portion 16 and exposed portions, thereby denaturing the resist film 30 to cure and cured resist film 32 is formed (see FIG. 8B). 接着,将还未转成固化的抗蚀膜32的抗蚀膜30通过碱性溶液等去除(参考图8C)。 Subsequently, the resist film 30 is not turned into the cured resist film 32 is removed by (see FIG. 8C) alkaline solution or the like. 以这样的方式,使得抗蚀膜30形成所需的图案。 In this manner, the resist film 30 so that a desired pattern is formed.

(III)接着,通过使用由此形成图案的固化抗蚀膜32而执行电镀,从而可以在导电电路延伸的方向上在连接终端15上形成凸起部分16(参考图8D)。 (III) Next, the resist thereby forming a cured film pattern by using the plating 32 is performed, so that the raised portion 16 may be formed on the connection terminal 15 extending in the direction of the conductive circuit (see FIG. 8D).

(IV)接着,去除由此形成图案的固化的抗蚀膜32(参考图8E)。 Resist film (IV) is then removed thereby forming a cured pattern 32 (see FIG. 8E).

通过上述的制造步骤,形成根据第三实施例的印刷线路板。 Through the above manufacturing steps, a printed wiring board according to the third embodiment.

依照形成根据第三实施例的印刷线路板的方法,通过电镀形成凸起部分16,从而可以微型制造凸起部分16。 The method of forming a printed wiring board in accordance with the third embodiment, the raised portion 16 is formed by plating, thereby manufacturing a micro projection portion 16. 而且,由于通过使用形成图案的固化抗蚀膜32而执行电镀,因此很容易选择并使用合适的电镀材料。 Further, since the cured resist film 32 is formed using a pattern plating is performed, it is easy to select and use an appropriate plating material.

(板互连结构)如图9中所示,根据本发明第三实施例的板互连结构包括:第一印刷线路板1,其中在第一绝缘层10上布置在其端部上具有第一连接终端15的第一导电电路,并且在第一导电电路延伸的方向上在第一连接终端15上提供凸起部分16;第二印刷线路板2,其中在第二绝缘层20上布置具有第二连接终端22的第二导电电路;和连接层42,其在凸起部分16的侧面部分上形成焊角并将第一连接终端15和第二连接终端22互连。 (Board interconnection structure) as shown in FIG. 9, an interconnect structure according to a third embodiment of the plate of the present invention comprises: a first printed wiring board 1, which is arranged on the first insulating layer 10 has a first end portion thereof on a first conductive circuit connection terminal 15, and provides a raised portion 16 in a direction extending a first conductive circuit on the first connector terminal 15; a second circuit board 2, which is disposed on the second insulating layer 20 having a second terminal connected to a second electrically conductive circuit 22; and a connection layer 42, which forms a fillet and connected to a first terminal and a second connection terminal 15 on the side portion 16 of the convex portion 22 interconnects.

作为第二绝缘层20,可以使用诸如玻璃环氧板、玻璃合成板以及纸质环氧板等的硬刚性板。 A second insulating layer as a hard rigid plate 20 may be used such as a glass epoxy plate, a glass plate, and a synthetic paper epoxy board or the like. 而且,也可以使用柔性板作为第二绝缘层20。 Further, the flexible board may be used as the second insulating layer 20. 在使用刚性板的情况中,可以使用2.4mm、2.0mm、1.6mm、1.2mm、1.0mm、0.8mm、0.6mm等的厚度。 In the case where the rigid board, may be used 2.4mm, 2.0mm, 1.6mm, 1.2mm, thickness 1.0mm, 0.8mm, 0.6mm and the like. 此外,在使用柔性板的情况中,可以使用25μm、12.5μm、8μm、6μm、等的厚度。 Further, in the case of using the flexible board can be used 25μm, 12.5μm, 8μm, 6μm, thickness and the like.

第二导电电路形成导线的电路图案,其在第二绝缘层20上设计。 Forming a conductive circuit pattern of the second circuit conductor, which is designed on the second insulating layer 20. 第二导电电路通过在第二绝缘层20上对轧制铜箔、电解铜箔执行图案处理而形成。 A second conductive circuit formed on the rolled copper foil, an electrolytic copper foil by performing patterning on the second insulating layer 20. 对于第二导电电路,除了铜箔外也可以使用其他的金属箔。 For the second conductive circuit, in addition to copper foil may be used other metal foil. 对于第二导电电路的厚度,可以使用35μm、18μm、12μm、9μm等。 The thickness of the second electrically conductive circuit can be used 35μm, 18μm, 12μm, 9μm like. 当第二导电电路由缩减法形成时,考虑到电路的宽度最小为15μm而在电路间的空间宽度最小为20μm,因此在第二导电电路间的最小间距为35μm。 When the second conductive circuit formed by the reduction method, taking into account the minimum circuit width and 15μm in width of the space between the circuits minimum of 20 m, and therefore the minimum spacing between the second conductive circuit is 35μm. 同时,当在通过半加成法形成第二导电电路时,考虑到电路的宽度最小为10μm而在电路间的空间宽度最小为10μm,因此在第二电路间的最小间距为20μm。 Meanwhile, when the second electrically conductive circuit formed by a semi-additive method, considering the width of the circuit is a minimum of 10 m and a space width between a minimum of circuit 10 m, thus minimizing the distance between the second circuit is 20μm. 在第二导电电路上,布置覆盖膜等作为覆盖层(未示出)。 On the second conductive circuit, is arranged as a cover film or a cover layer (not shown). 在使用刚性板的情况中,覆盖膜使用阻焊膜作为基材,而在使用柔性板的情况中,覆盖膜使用在粘附后仍然具有极好柔韧性的绝缘聚酰亚胺膜等作为基材。 In the case of using a rigid plate, solder resist cover film used as a base, and in the case of using a flexible board, an insulating cover film using a polyimide film having excellent flexibility remains in the adhesive as a group material.

可以将第二连接终端22的厚度设定为例如是15μm和8μm。 The thickness of the second connecting terminal 22 may be set to, for example, 15μm and 8μm. 当绝缘层20为柔性板时,可以布置第二连接终端22以使其延伸到第二绝缘层20的端部。 When the insulating layer 20 is a flexible plate, the second connection terminal 22 may be arranged so as to extend to the end portion of the second insulating layer 20. 同时,当第二绝缘层20为刚性板时,优选地,布置第二连接终端22以使其与第二绝缘层20的端部保持一点空间。 Meanwhile, when the second insulating layer is a rigid plate 20, preferably, the second connecting terminal 22 is disposed a little space so as to maintain the end portion of the second insulating layer 20. 第二连接终端22通过预涂熔剂处理、热空气调整(HAL)、电解焊料电镀、非电解焊料电镀等进行表面处理。 A second terminal 22 connected to a surface treatment by preflux treatment, hot air adjustment (the HAL), the electrolytic solder plating, electroless solder plating or the like.

以下参考图10A和图10B描述形成根据第三非限制性实施例的板互连结构的非限制性方法。 Below with reference to FIGS. 10A and 10B described a non-limiting method of forming an interconnect structure of the third plate non-limiting embodiment.

(I)首先,为第一印刷线路板1的第一连接终端15和凸起部分16形成焊料电镀40(参见图10A)。 (I) First, a first printed wiring board 1 is connected to a first terminal 15 and the convex portion 16 is formed a solder plating 40 (see FIG. 10A).

(II)接下来,布置第一连接终端15和第二连接终端22以使其彼此面对(参见图10B)。 (II) Next, the arrangement of the first and the second connecting terminal 15 connected to terminal 22 so as to face each other (see FIG. 10B).

(III)接着,通过诸如加热片等的加热器加热在第一连接终端15和第二连接终端22之间的连接部分,从而熔化焊料电镀40,形成如图9所示的连接层42。 (III) Subsequently, by heating the sheet such as a heater or the like in the connecting portion 15 and the connection between the first terminal 22 connected to a second terminal, whereby the molten solder plating 40, the connection layer 42 is formed as shown in FIG. 9. 形成连接层42,从而互连第一连接终端15和第二连接终端22。 Forming a connection layer 42, thereby interconnecting the first and the second connecting terminal 15 connected to terminal 22. 当焊料电镀40熔化以形成连接层42时,过量的焊料存储在凸起部分16的侧面部分,其为在第一连接终端15和第二连接终端22之间的间隙,从而形成焊角。 When the solder 40 is melted to connect the plating layer 42 is formed, the excess solder is stored in the protrusion portion 16 side, which is a gap between the first connecting terminal 22 and the second connection terminal 15, thereby forming fillets.

通过上述的制造步骤,形成图9中所示的根据第三实施例的板互连结构。 Through the above manufacturing steps, shown in FIG. 9 forming plate according to a third embodiment of an interconnect structure.

根据第三实施例的板互连结构,过量的焊料存储在凸起部分16的侧面部分,其为在第一连接终端15和第二连接终端22之间的间隙。 The board interconnection structure of the third embodiment, the excess solder is stored in the protrusion portion 16 side, which is the gap between the first and the second connecting terminal 15 connected to terminal 22. 因此,可以防止由于焊料造成的短路。 Thus, a short circuit can be prevented because the solder caused. 而且,由于焊角形成在凸起部分16的侧面部分上,因此增强了在第一连接终端15和第二连接终端22之间的连接强度。 Further, since the solder fillet is formed on the convex side of portion 16, thus enhancing the connection strength between 15 and 22 connected to a first terminal connected to a second terminal. 具体地,对于由三个表面包围的每个区域增加了所涉及的区域的表面积,其中这三个表面为:第一连接终端15的表面;第二连接终端22的表面;凸起部分16的侧面,由此增加了具有焊料的区域的接触面积。 Specifically, for each region surrounded by three surface increases the surface area of ​​the region concerned, to which the three surfaces: a first surface of the connection terminal 15; terminal 22 is connected to a second surface; convex portion 16 side, thereby increasing the contact area with the solder regions. 因此,可以增强所涉及的连接强度。 Thus, coupling strength can be enhanced involved.

(第四非限制性实施例)如在图11A至11E中所示,根据本发明第四实施例的用于形成印刷线路板的方法与图8A至8E中的不同,对其比较,不同之处在于凸起部分16a由半蚀刻形成。 (Fourth non-limiting embodiment) As shown in FIGS. 11A to 11E, are formed in different 8A to 8E and FIG method of the printed wiring board according to a fourth embodiment of the present invention, its comparison, except that the convex portion 16a is formed by half-etching. 在图11A至11E中所示的其他特征都基本上与在图8A至8E中的相同,因此,省略对其的重复描述。 11A are substantially identical to the other features shown in FIG. 11E 8A to 8E are, therefore, repeated description thereof is omitted.

以下参考图11A至11E描述用于形成根据第四实施例的印刷线路板的方法。 Below with reference to FIGS. 11A to 11E described method for a printed wiring board according to the fourth embodiment is formed.

(I)首先,准备绝缘层10,在其表面上布置具有连接终端15的导电电路。 (I) First, the insulating layer 10, disposed on the surface thereof a conductive circuit 15 is connected to a terminal. 接着,在绝缘层10和连接终端15上涂抗蚀膜50(参考图11A)。 Subsequently, the resist film is coated on the insulating layer 10 and a connection terminal 1550 (see FIG. 11A). 作为抗蚀膜50,例如可以使用光固化光刻胶。 As the resist film 50, for example, a photocurable photoresist.

(II)接着,在形成凸起部分16a的部位上照射光线并暴露,从而使抗蚀膜50变性以固化并形成固化的抗蚀膜52(参考图11B)。 (II) Subsequently, the irradiated portion is formed in the convex portion 16a and the light exposure, so that the resist film 50 to cure and denatured form a cured resist film 52 (see FIG. 11B). 接着,将还未转成固化的抗蚀膜52的抗蚀膜50通过碱性溶液等去除(参考图11C)。 Subsequently, the resist film is not turned into the cured resist film 52, 50 is removed by an alkaline solution or the like (see FIG. 11C). 以这样的方式,使得抗蚀膜50形成所需的图案。 In this manner, the resist film 50 is formed such that a desired pattern.

(III)接着,通过使用由此形成图案的固化抗蚀膜52而执行半蚀刻,从而在其上没有沉积固化的抗蚀膜52的连接终端15的部位变薄并转为薄的连接终端15a(参见图11D)。 (III) Next, the resist film 52 thereby forming a cured pattern by use of half-etching is performed, so that no parts of the connection terminals 52 deposited cured resist film 15 is thinned into a thin and connection terminals 15a thereon (see FIG. 11D). 同时,在其上沉积固化的抗蚀膜52的连接终端15的部位在厚度上没有变化,因此转为凸起部分16a。 Meanwhile, the terminal connection portion thereof deposited on the cured resist film 52 is not 15 vary in thickness, and therefore into the convex portion 16a.

(IV)接着,去除由此形成图案的固化的抗蚀膜52(参考图11E)。 (IV) Next, the resist film 52 is removed to thereby form a pattern of a cured (refer to FIG. 11E).

通过上述的制造步骤,形成根据第四实施例的印刷线路板。 Through the above manufacturing steps, a printed wiring board according to the fourth embodiment.

依照形成根据第四实施例的印刷线路板的方法,通过半蚀刻形成凸起部分16a,从而使得薄的连接终端15a和凸起部分16a的高度恒定。 The method of forming a printed wiring board in accordance with the fourth embodiment, the projection is formed by half-etching portion 16a, so that the thin connecting terminals 15a and 16a of the raised portion a constant height.

(第五非限制性实施例)如在图12A中所示,根据本发明第五实施例的印刷线路板与在图6中所示的印刷线路板的不同在于,两个凸起部分16提供在每个连接终端15上。 (Fifth non-limiting embodiment) As shown in 12A, the printed wiring board according to the fifth embodiment of the present invention is different from the printed wiring board shown in FIG. 6 in that two raised portions 16 provide on each connection terminal 15. 而且,如在图12B中所示,根据第五实施例的使用在图12中所示的印刷线路板的板互连结构与在图9中所示的根据第三实施例的板互连结构的不同之处在于,间隙60提供在每对凸起部分16之间。 Further, as shown in 12B, the use according to the fifth embodiment of the printed wiring board shown in FIG. 12 and plate interconnection structure shown in FIG. 9 according plate interconnection structure of the third embodiment the difference is that the gap 60 is provided between each pair of raised portions 16. 在图12A和图12B中所示的其他特征与在图7中所示的印刷线路板以及在图8A至8E中所示的用于形成印刷线路板的方法的特征基本类似,因此省略重复的描述。 FIGS 12A and substantially similar in other characteristics and features shown in FIG. 12B in a method for forming a printed wiring board shown in FIGS. 8A to 8E in the printed wiring board shown in FIG. 7, and therefore repetitive explanations are omitted description.

图12A和12B显示了提供在每个连接终端15上的两个凸起部分16;但,提供在每个连接终端15上的凸起部分16的数量可以多于两个。 12A and 12B show the connection terminals provided on each of the two raised portions 15, 16; however, the projections provided on each connector terminal portion 16 of the number 15 may be more than two. 凸起部分16可以通过电镀或半蚀刻形成。 Raised portion 16 may be formed by half-etching or electroplating. 多个凸起部分16可以由彼此不同的材料形成。 A plurality of raised portions 16 may be formed of different materials from each other.

依照使用根据第五实施例的印刷线路板的板互连结构,提供了间隙60,从而可以在间隙60中存储过量的焊料。 In accordance with a printed wiring board using the board interconnection structure according to the fifth embodiment, there is provided a gap 60, can be stored in the excess solder 60 in the gap. 因此,可以防止由于焊料导致的短路。 Thus, it is possible to prevent a short circuit due to the lead solder. 而且,焊角通过使用间隙60形成,从而可以增强在第一绝缘层10和第二绝缘层20之间的连接强度。 Further, the solder fillet 60 formed by using the space, thereby enhancing the connection strength between the first insulating layer 10 and the second insulating layer 20. 具体地,增加了由四个表面包围的每个间隙60的表面积,这四个表面为:第一连接终端15的表面;第二连接终端22的表面;和凸起部分16的两个侧面,从而可以增强连接强度。 Specifically, increasing the surface area of ​​each gap 60 is surrounded by four surfaces, four surfaces of which: a surface of the first connector terminal 15; terminal 22 is connected to the second surface; and two side surfaces of the raised portions 16, which can enhance the connection strength.

(其他的非限制性实施例)以上基于非限制性实施例描述了本发明。 (Other non-limiting embodiments) The present invention is based on the above described non-limiting examples. 但,应当理解的是,形成本公开文本一部分的说明书和附图都未限制本发明。 However, it should be understood that the present invention is neither to limit the present disclosure is formed of a part of the specification and drawings. 从本公开文本,本领域的技术人员很显然可以做出各种替换的实施例和应用技术。 From the present disclosure, one skilled in the art it will be apparent to embodiments and applications of various alternative technologies.

例如,在第一和第二非限制性实施例中,第一连接终端11a和第二连接终端13b的每个交叉部分形成了侧面是线性的梯形形状;但,侧面也可以弯曲成弧形。 For example, the first and second non-limiting embodiment, each cross section of the first connection terminals 11a and the second connection terminals 13b is formed on the side surface is linear trapezoidal shape; however, the side surface may be curved in an arc shape. 如果侧面被弯曲成了弧形,则增加了第一连接终端11a和第二连接终端13b的侧面的表面积,那么这些连接终端对焊料的连接区域就增加了,从而可以增强其间的连接强度。 If the sides are arcuate become bent, the side surface increases the surface area of ​​the first connection terminals 11a and 13b and the second connection terminal, these terminals are connected to the connection area of ​​the solder is increased, which can enhance the connecting strength therebetween.

此外,在第三和第四非限制性实施例中,凸起部分16仅形成在第一印刷线路板1上;但,凸起部分16也可以提供在第二印刷线路板2上。 Further, in the third and fourth non-limiting embodiment, the raised portion 16 is formed only on the first printed wiring board 1; however, raised portion 16 may also be provided on the second printed wiring board 2. 在这种情况中,交替性布置第一印刷线路板1的凸起部分16和第二印刷线路板2的凸起部分16以使其彼此不接触,从而增加第一连接终端15的表面、第二连接终端22的表面和凸起部分16的侧面的表面积。 In this case, the first printed wiring board alternately disposed raised portion 16 and a second printed wiring board 2 so as raised portions 16 do not contact each other, thereby increasing the surface of the first connector terminal 15, the first two connection terminals and the projection surface area of ​​the side surface portion 16 22. 因此,以与上述类似的方式,可以增强连接强度。 Thus, similar to the above manner, it can enhance the connection strength.

而且,做出描述以便如图6中所示,在第三实施例中的每个凸起部分16在导电电路14延伸的方向上跨越连接终端15的整个宽度而形成;但,如在图13中所示,每个凸起部分16在导电电路14延伸方向上也可以形成为比连接终端15的整个宽度要短。 Further, in order to make the description shown in FIG. 6, in the third embodiment, each of the raised portion 16 is formed across the width of the connecting terminal 15 in the direction of extending the conductive circuit 14; however, as in FIG. 13 as shown, each of the raised portions 16 may be formed for the entire width 15 is shorter than the connection terminals 14 extend in the direction of the conductive circuit. 每个凸起部分16在导电电路14延伸方向上形成为比连接终端15的整个宽度要短,从而能通过在每个凸起部分16的末端表面上形成焊角来防止短路,即便在电路14延伸方向上流有熔化的焊料。 Each raised portion 16 is formed on the conductive circuit 14 extends the entire width direction is shorter than 15 connecting terminal, by forming such a fillet on each end surface of the raised portion 16 to prevent a short circuit, even in the circuit 14 extending in a direction upstream of melting solder. 此外,焊角形成在每个凸起部分16的末端表面上,这样也可以增强在连接终端15和绝缘层10间的连接强度。 Further, a fillet formed on the end surface of each boss portion 16, which can also enhance the strength of the connection terminals 15 and 10 connected to the insulating layer.

如上所述,应当理解的是,本发明合并了在此未描述的各种实施例。 As described above, it should be understood that the present invention incorporates various embodiments not described herein. 因此,本发明仅通过指定本发明的各项而限定在从本公开文本合理所得的权利要求的范围中。 Accordingly, the present invention is only defined within the scope of the claim of the present disclosure reasonably resulting from the requirements specified by the present invention.

Claims (17)

  1. 1.一种印刷线路板,包括:绝缘层;和布置在所述绝缘层上的导电电路,所述导电电路在其端部上包括连接终端,所述连接终端具有比其底面宽度要窄的上表面宽度。 1. A printed wiring board comprising: an insulating layer; and a conductive circuit on the insulating layer is disposed, said conductive circuitry on their ends comprises a connection terminal connected to a terminal having a narrower width than the bottom surface the width of the upper surface.
  2. 2.根据权利要求1的印刷线路板,其中所述连接终端具有在其上形成的凸起部分,所述凸起部分在所述导电电路延伸的方向上延伸。 2. The printed wiring board according to claim 1, wherein said connecting terminal has a projection portion formed thereon, said raised portion extending in the direction of extending the conductive circuit.
  3. 3.根据权利要求2的印刷线路板,其中所述凸起部分由镀铜、镀镍、镀金以及镀镍和金的组合中的任意一种形成。 3. The printed wiring board according to claim 2, wherein said raised portion of copper, nickel, gold and any combination of nickel and gold is formed of one.
  4. 4.根据权利要求2的印刷线路板,其中所述凸起部分的宽度为所述连接终端的宽度的75%。 4. A printed wiring board according to claim 2, wherein the width of said protrusion 75% of the width of the connecting portion of the terminal.
  5. 5.一种板互连结构,包括:第一印刷线路板,其中在第一绝缘层上布置第一导电电路,所述第一导电电路在其端部上包括第一连接终端,所述第一连接终端具有比其底面宽度要窄的上表面宽度;第二印刷线路板,其中在第二绝缘层上布置包括了第二连接终端的第二导电电路;和连接层,其沿所述第一连接终端的纵向侧面形成焊角,并将所述第一连接终端和所述第二连接终端互连。 A board interconnection structure, comprising: a first printed wiring board, wherein a first insulating layer disposed on the first conductive circuit, the first conductive circuit comprises a first connecting terminal on its end portion, said first a connection terminal having a width narrower than the bottom surface of the upper surface width; second printed wiring board, which is disposed on the second insulating layer comprises a second circuit connected to the second conductive terminal; and a connection layer, along the first a connection terminal formed fillet of longitudinal sides and the first connecting terminal and said second terminal connector interconnection.
  6. 6.根据权利要求5的板互连结构,其中所述第二连接终端的上表面宽度窄于其底面宽度。 The board interconnect structure as claimed in claim 5, wherein the width of the upper surface of the second connector terminal width narrower than its bottom surface.
  7. 7.根据权利要求5的板互连结构,其中所述第一连接终端和所述第二连接终端由缩减法形成。 7. The plate of claim 5 interconnect structure, wherein the first connecting terminal and said second connecting terminal is formed by a reduction process.
  8. 8.根据权利要求5的板互连结构,其中所述第一连接终端的底面宽度基本上等于所述第二连接终端的宽度。 8. A panel according to claim 5 interconnect structure, wherein a width of a bottom surface of the first connection terminal is substantially equal to the width of the second connection terminal.
  9. 9.根据权利要求5的板互连结构,其中底部填充材料提供在所述连接层的外围。 9. A panel according to claim 5 interconnect structure, wherein the underfill material provided on the periphery of the connection layer.
  10. 10.根据权利要求5的板互连结构,其中所述第一连接终端具有在其上形成的凸起部分,所述凸起部分在所述第一导电电路延伸的方向上延伸。 10. The board interconnection structure according to claim 5, wherein said first connection terminal has a raised portion formed thereon, extending in the direction of the first conductive circuit extending from the raised portion.
  11. 11.根据权利要求10的板互连结构,其中所述第二连接终端具有在其上形成的凸起部分,所述凸起部分在所述第二导电电路延伸的方向上延伸。 Plate 11. The interconnect structure of claim 10, wherein the second connector terminal having a raised portion formed thereon, said raised portion extending in the direction of extending the second conductive circuit.
  12. 12.一种用于形成印刷线路板的方法,包括:制备绝缘层;在所述绝缘层的表面上提供导电电路,所述导电电路具有连接终端;在所述绝缘层和所述导电电路上涂覆抗蚀膜;将抗蚀膜形成所需的图案;通过使用形成图案的抗蚀膜,在所述导电电路上形成凸起部分,所述凸起部分在所述导电电路延伸的方向上延伸;和去除所述形成图案的抗蚀膜。 12. A method for forming a printed wiring board, comprising: preparing an insulating layer; providing a conductive circuit on a surface of the insulating layer, the conductive circuit having a connection terminal; on the insulating layer and the conductive circuit coating a resist film; a resist film to form a desired pattern; by using the resist film pattern is formed, a convex portion is formed on the conductive circuit, portions of the conductive circuit extending direction of said projection extension; and removing the resist film pattern is formed.
  13. 13.根据权利要求12的用于形成印刷线路板的方法,其中所述凸起部分由电镀形成。 13. The method of claim 12 for forming a printed wiring board, wherein said convex portion is formed by electroplating.
  14. 14.根据权利要求12的用于形成印刷线路板的方法,其中所述凸起部分由半蚀刻形成。 14. The method of claim 12 for forming a printed wiring board, wherein said convex portion is formed by half-etching.
  15. 15.根据权利要求5的板互连结构,其中所述第一连接终端具有在其上形成的至少两个凸起部分,所述至少两个凸起部分在所述第一导电电路延伸的方向上延伸。 15. A panel according to claim 5 interconnect structure, wherein the first connection terminal having at least two convex portions formed thereon, said at least two convex portions in the direction of the first conductive circuit extending extending.
  16. 16.根据权利要求15的板互连结构,其中所述至少两个凸起部分的每个由不同的材料形成。 Plate 16. The interconnect structure of claim 15, wherein said at least two projections are each formed of a different material portions.
  17. 17.根据权利要求15的板互连结构,其中在所述至少两个凸起部分间形成间隙,其中所述连接层的过量焊料存储在所述间隙中。 Plate 17. The interconnect structure of claim 15, wherein the at least two convex portions are formed between the gap, wherein said storing excess solder connection layer in the gap.
CN 200710104529 2006-05-25 2007-05-25 Printed wiring board, method for forming the printed wiring board, and board interconnection structure CN101080138B (en)

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CN102111952A (en) * 2009-12-28 2011-06-29 日本特殊陶业株式会社 Multilayer wiring substrate
CN102254871A (en) * 2010-05-20 2011-11-23 台湾积体电路制造股份有限公司 Semiconductor eevice and manufacturing method thereof
US9299674B2 (en) 2012-04-18 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Bump-on-trace interconnect
US9508668B2 (en) 2012-09-18 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive contacts having varying widths and method of manufacturing same
US9646923B2 (en) 2012-04-17 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
US10056345B2 (en) 2012-04-17 2018-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Conical-shaped or tier-shaped pillar connections

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CN102593626A (en) * 2011-01-14 2012-07-18 富士康(昆山)电脑接插件有限公司 Flexible flat cable assembly and assembling method thereof
JP2014072241A (en) * 2012-09-27 2014-04-21 Rohm Co Ltd Chip component
US9723725B2 (en) 2013-05-29 2017-08-01 Finisar Corporation Rigid-flexible circuit interconnects

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Cited By (14)

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CN102111952A (en) * 2009-12-28 2011-06-29 日本特殊陶业株式会社 Multilayer wiring substrate
CN102111952B (en) 2009-12-28 2014-06-04 日本特殊陶业株式会社 Multilayer wiring substrate
CN102254871A (en) * 2010-05-20 2011-11-23 台湾积体电路制造股份有限公司 Semiconductor eevice and manufacturing method thereof
US9142533B2 (en) 2010-05-20 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate interconnections having different sizes
US9773755B2 (en) 2010-05-20 2017-09-26 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate interconnections having different sizes
CN105590900A (en) * 2010-05-20 2016-05-18 台湾积体电路制造股份有限公司 Semiconductor device and manufacturing method
US9646923B2 (en) 2012-04-17 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
US10056345B2 (en) 2012-04-17 2018-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Conical-shaped or tier-shaped pillar connections
US9299674B2 (en) 2012-04-18 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Bump-on-trace interconnect
US9991224B2 (en) 2012-04-18 2018-06-05 Taiwan Semiconductor Manufacturing Company, Ltd. Bump-on-trace interconnect having varying widths and methods of forming same
US9953939B2 (en) 2012-09-18 2018-04-24 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive contacts having varying widths and method of manufacturing same
US9966346B2 (en) 2012-09-18 2018-05-08 Taiwan Semiconductor Manufacturing Company Bump structure and method of forming same
US10008459B2 (en) 2012-09-18 2018-06-26 Taiwan Semiconductor Manufacturing Company Structures having a tapering curved profile and methods of making same
US9508668B2 (en) 2012-09-18 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive contacts having varying widths and method of manufacturing same

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