CN101075132A - Method for controlling administration robot by statistical process - Google Patents
Method for controlling administration robot by statistical process Download PDFInfo
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- CN101075132A CN101075132A CN 200610084823 CN200610084823A CN101075132A CN 101075132 A CN101075132 A CN 101075132A CN 200610084823 CN200610084823 CN 200610084823 CN 200610084823 A CN200610084823 A CN 200610084823A CN 101075132 A CN101075132 A CN 101075132A
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 230000008569 process Effects 0.000 title claims abstract description 42
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 238000004458 analytical method Methods 0.000 claims abstract description 14
- 230000002159 abnormal effect Effects 0.000 claims abstract description 5
- 238000005516 engineering process Methods 0.000 claims description 70
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 230000004044 response Effects 0.000 claims description 13
- 238000004886 process control Methods 0.000 claims description 8
- 238000004364 calculation method Methods 0.000 claims description 4
- 238000004590 computer program Methods 0.000 claims description 2
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- 239000004065 semiconductor Substances 0.000 description 9
- 238000003070 Statistical process control Methods 0.000 description 2
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- 238000012544 monitoring process Methods 0.000 description 2
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Abstract
A method of utilizing statistical process to control supervisor includes sending chip to measurer after a process is finished by said chip and said chip is moved out from reaction chamber, obtaining number of said chip and obtaining number of reaction chamber as per number of chip then obtaining an image point according to measurement result, enabling to obtain multiple image point by said means, using obtained multiple image point to make group operation for discomposing control drawing to be multiple control drawing and carrying out regulation on abnormal reaction chamber according to analysis result of each control drawing.
Description
Technical field
The present invention relates to the statistics technology controlling and process of semiconductor technology, and particularly relate to a kind of method of utilizing statistics technology controlling and process handle machine.
Background technology
Along with the growth that semiconductor is made correlation technique, the complexity of semiconductor product manufacturing grows with each passing day.Semiconductor product manufacturing at present is because factors such as size or arrangement are very little for the permission of mistake.Yet, in the technology of complexity, regular meeting's generation that leads to errors because of bad technological parameter.Because semiconductor product is when just beginning to produce, not having previous process data can be for reference, therefore can't set technology or instrument related process parameter appositely, so semiconductor product aforesaid mistake takes place especially easily when just having begun to produce.
In a semiconductor manufacturing enterprise, making machine can be with to carry out such as semiconductor wafer manufacturing, supervision manufacturing operation and to transport wafer or other similar work in machine.When machine operation, many parameters can continued to monitor.For example, wafer can be processed in a reaction chamber (chamber), and machine can be controlled parameter wherein, such as pressure, temperature and manufacturing time interval.During manufacture,, can produce very lot of data, and must a large amount of time of cost from data, detect a defective in order to continue to monitor these parameters.
In traditional manufacturing system, (Manufacturing Execution System MES) receives this technological parameter and process data to manufacturing execution system, analyzes this technological parameter and process data, and controls the running of machine according to this.(Statistical Process Control SPC) is necessary management of all manufacture processes and monitoring means to the statistics technology controlling and process.At present in semiconductor is made, usually each wafer is made a control chart (Control Chart) unit (figure point (Chart Point)) at the measurement parameter of measuring after machine is carried out in batches, and the technology machine with last station is a monitored object, and the formed control chart of a plurality of figure points is again so that (Weight Efficiency, index WE) is assessed its technology degree of variation as weighting efficient.Above-mentioned statistics industrial analysis method does not further analyze the stage (Level) of wafer and reaction chamber to analyze with machine (Lot-based andTool-based) in batches, and its shortcoming is as follows.The manufacturing cost of 12 cun wafers of cause is higher, so if can't learn that with every wafer the variation of its control chart is to carry out corresponding technological operation when carrying out technology in real time, but adjust again when waiting each wafer in batches to finish this road technology, then may cause bigger wafer infringement (WaferDamage). totallyIn addition, in the technology machine, different reaction chambers may produce different Manufacturing Status, so the wafer of being produced in the differential responses chamber can produce otherness.If control with each figure point of the statistics technology controlling and process of level (Lot-level) in batches, then the difference that produced of differential responses chamber can on average be diluted on chart shows in the same point statistics process-control chart point, and the wafer that causes so can't reflect the variation of a certain reaction chamber usefulness in real time damages.
In view of this, the invention provides a kind of method of utilization statistics technology controlling and process handle machine of improvement, effectively to address the above problem.
Summary of the invention
Based on above-mentioned purpose, the embodiment of the invention has disclosed a kind of method of utilizing statistics technology controlling and process handle machine.The record wafer is in the technology course of the reaction chamber of technology machine.After this wafer is finished the technology of this technology machine and shifted out this reaction chamber, then be transported to the measurement machine.Obtain the numbering of this wafer by this measurement machine, obtain corresponding process reaction chamber numbering according to this wafer number then, and obtain the figure point of numbering with this process reaction chamber should wafer number according to measurement result.According to a plurality of wafer number that obtain and corresponding a plurality of process reaction chambers numbering, a plurality of figure points of corresponding same reaction chamber numbering are carried out groups operation, to disassemble control chart that should the technology machine is become a plurality of control charts.Add up industrial analysis according to each control chart of disassembling gained, and issue alarm so that an abnormal response chamber is adjusted according to analysis result.
Description of drawings
Fig. 1 adds up the method step process flow diagram of technology controlling and process handle machine for the utilization that shows example of the present invention.
The control chart of Fig. 2～4 for being produced during the manufacturing process.
Embodiment
For allow purpose of the present invention, feature, and advantage can become apparent, preferred embodiment cited below particularly, and cooperate Fig. 1 and Fig. 2～4 is described in detail.Instructions of the present invention provides different embodiment that the technical characterictic of the different embodiments of the present invention is described.Wherein, the usefulness that is configured to explanation of each element among the embodiment is not in order to restriction the present invention.And the part of reference numerals repeats among the embodiment, for the purpose of simplifying the description, is not the relevance that means between the different embodiment.
The embodiment of the invention has disclosed a kind of method of utilizing statistics technology controlling and process handle machine.
Fig. 1 adds up the method step process flow diagram of technology controlling and process handle machine for the utilization that shows example of the present invention.
At first, write down the detailed course (step S1) of which the reaction chamber execution technology of each wafer in the technology machine in each wafer batch by manufacturing execution system.Each technology machine has a plurality of reaction chambers, and each wafer enters after wherein reaction chamber is finished technology traditionally, and the quality of each wafer that may cause producing gained because of the variation of the condition of reacting chamber space is inconsistent.Therefore, in the present invention, when wafer enters one of them reaction chamber of technology machine, promptly can write down this reaction chamber numbering, and write down this wafer and carry out technology to all situations of finishing this technology entering this reaction chamber.
Then, after this wafer is finished technology and shifted out this reaction chamber, then be transported to the measurement machine.This measurement machine is obtained the numbering of the wafer of this measurement, and produce should wafer number and the figure point (step S2) of this process reaction chamber numbering according to measurement result, obtain corresponding process reaction chamber according to the wafer number that obtains then and number (step S3).According to a plurality of wafer number that obtain and corresponding a plurality of process reaction chamber numberings, a plurality of figure point execution groups operation of corresponding same reaction chamber numbering on the statistics process-control chart of level (Lot Level) or wafer scale (Wafer Level) in batches become a plurality of control charts (step S4) to disassemble to control chart that should the technology machine.According to each new control chart of disassembling gained, the usefulness that can reflect and express the differential responses chamber separately changes, and add up industrial analysis according to each control chart, issue alarm so that (step S5) adjusted in the abnormal response chamber according to analysis result then.
Below illustrate the example of implementing utilization statistics technology controlling and process handle machine of the present invention with several.
With reference to figure 2, each control chart have standard value, upper control limit (Upper Control Limit, UCL) with lower control limit (Lower Control Limit, LCL).Existing statistics industrial analysis utilization is measured machine all wafers of technology machine output is analyzed, and produces control chart according to analysis result then, wherein comprises the wafer of differential responses chamber institute output.If a certain reaction chamber occurrence condition is unusual, its may because another reaction chamber also occurrence condition is unusual and make manufacturing execution system that this condition is considered as normal condition unusually, thereby can not send the alarm that need are adjusted this technology machine, so the inconsistent situation of wafer quality can take place.Utilize statistics industrial analysis method of the present invention, can produce control chart that should reaction chamber according to the differential responses chamber.Statistics industrial analysis method of the present invention disassembles control chart shown in Fig. 3 and 4 according to the wafer of differential responses chamber output with the control chart of Fig. 2, wherein Fig. 3 represents the control chart of one of them reaction chamber (reaction chamber A) of this technology machine, and Fig. 4 represents the control chart of another reaction chamber (reaction chamber B) of this technology machine.
With reference to the control chart of figure 2, wherein great majority figure point is all between upper control limit and lower control limit, and quite near standard value, expression there is no unusual condition to technology machine that should control chart, so do not need to adjust.With reference to the control chart of figure 3, wherein there are a plurality of figure points to drop on outside the lower control limit, so expression is unusual to reaction chamber A occurrence condition that should control chart, so need be adjusted to avoid producing the not good wafer of quality again it.With reference to the control chart of figure 4, wherein great majority figure point is all between upper control limit and lower control limit, and quite near standard value, expression there is no unusual condition to reaction chamber B that should control chart, so do not need to adjust.
The method of utilization statistics technology controlling and process handle machine of the present invention is disassembled the statistics process-control chart with the differential responses chamber of technology machine, can effectively see through the statistics process-control chart and learn that certain reaction chamber usefulness changes in the very first time, handle with the real-time release alert news, and effectively reduce the risk of wafer infringement.In addition, when handling the process data of a large amount of wafer scales (Wafer Level) and reaction chamber level (Chamber Level), but effective monitoring state of the art and at short notice production line is made best adjustment to reduce the wafer infringement.
The invention still further relates to a kind of Storage Media, in order to store computer program, aforementioned calculation machine program comprises a plurality of program codes, and it is in order to be loaded in the computer system and to make aforementioned calculation machine system carry out the method for above-mentioned utilization statistics technology controlling and process handle machine.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with claim the person of being defined be as the criterion.
Claims (10)
1, a kind of method of utilizing statistics technology controlling and process handle machine comprises the following steps:
The record wafer is in the technology course of the reaction chamber of technology machine;
After this wafer is finished the technology of this technology machine and shifted out this reaction chamber, then be transported to the measurement machine;
Obtain the numbering of this wafer by this measurement machine;
Obtain corresponding process reaction chamber numbering according to this wafer number, and produce the figure point of numbering with this process reaction chamber should wafer number according to measurement result;
According to a plurality of wafer number that obtain and corresponding a plurality of process reaction chambers numbering,, control chart that should the technology machine is become a plurality of control charts to disassemble with a plurality of figure point execution groups operation of corresponding same reaction chamber numbering; And
Add up industrial analysis according to each control chart of disassembling gained, and issue alarm so that the abnormal response chamber is adjusted according to analysis result.
2, the method for utilization statistics technology controlling and process handle machine as claimed in claim 1, it also comprises the course that writes down the reaction chamber execution technology of each wafer in this technology machine by manufacturing execution system.
3, the method for utilization statistics technology controlling and process handle machine as claimed in claim 2, wherein, when wafer enters one of them reaction chamber of this technology machine, write down this reaction chamber numbering, and write down this wafer and carry out technology to the whole journey of finishing this technology entering this reaction chamber.
4, the method for utilization statistics technology controlling and process handle machine as claimed in claim 3, it comprises that also the figure point to corresponding same reaction chamber numbering on the statistics process-control chart of batch level or wafer scale carries out this groups operation, becomes this a plurality of control charts to disassemble this statistics process-control chart.
5, the method for utilization statistics technology controlling and process handle machine as claimed in claim 4, it also comprises the usefulness variation that reflects the differential responses chamber of this technology machine according to these a plurality of control charts of disassembling gained.
6, a kind of Storage Media, in order to store computer program, aforementioned calculation machine program comprises a plurality of program codes, and it comprises the following steps: in order to be loaded in the computer system and to make aforementioned calculation machine system carry out a kind of method of utilizing statistics technology controlling and process handle machine
The record wafer is in the technology course of the reaction chamber of technology machine;
After this wafer is finished the technology of this technology machine and shifted out this reaction chamber, then be transported to the measurement machine;
Obtain the numbering of this wafer by this measurement machine;
Obtain corresponding process reaction chamber numbering according to this wafer number, and obtain the figure point of numbering with this process reaction chamber should wafer number according to measurement result;
According to a plurality of wafer number that obtain and corresponding a plurality of process reaction chambers numbering, a plurality of figure points of corresponding same reaction chamber numbering are carried out groups operation, to disassemble control chart that should the technology machine is become a plurality of control charts; And
Add up industrial analysis according to each control chart of disassembling gained, and issue alarm so that the abnormal response chamber is adjusted according to analysis result.
7, Storage Media as claimed in claim 6, it also comprises the course that writes down the reaction chamber execution technology of each wafer in this technology machine by manufacturing execution system.
8, Storage Media as claimed in claim 7 wherein, writes down this reaction chamber numbering when wafer enters one of them reaction chamber of this technology machine, and writes down this wafer and carry out technology to the whole journey of finishing this technology entering this reaction chamber.
9, Storage Media as claimed in claim 8, it comprises that also the figure point to corresponding same reaction chamber numbering on the statistics process-control chart of batch level or wafer scale carries out this groups operation, becomes this a plurality of control charts to disassemble this statistics process-control chart.
10, Storage Media as claimed in claim 9, it also comprises the usefulness variation that reflects the differential responses chamber of this technology machine according to these a plurality of control charts of disassembling gained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610084823 CN101075132A (en) | 2006-05-18 | 2006-05-18 | Method for controlling administration robot by statistical process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200610084823 CN101075132A (en) | 2006-05-18 | 2006-05-18 | Method for controlling administration robot by statistical process |
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| CN101075132A true CN101075132A (en) | 2007-11-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800564A (en) * | 2011-05-26 | 2012-11-28 | 中国科学院微电子研究所 | Method and system for avoiding misoperation during debugging of semiconductor process menu |
| CN105335833A (en) * | 2014-06-18 | 2016-02-17 | 上海华力微电子有限公司 | Off-line management and control method of silicon wafer groups |
-
2006
- 2006-05-18 CN CN 200610084823 patent/CN101075132A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800564A (en) * | 2011-05-26 | 2012-11-28 | 中国科学院微电子研究所 | Method and system for avoiding misoperation during debugging of semiconductor process menu |
| CN102800564B (en) * | 2011-05-26 | 2015-04-08 | 中国科学院微电子研究所 | Method and system for avoiding misoperation during debugging of semiconductor process menu |
| CN105335833A (en) * | 2014-06-18 | 2016-02-17 | 上海华力微电子有限公司 | Off-line management and control method of silicon wafer groups |
| CN105335833B (en) * | 2014-06-18 | 2020-06-30 | 上海华力微电子有限公司 | Offline management and control method for silicon wafer set |
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