CN101069922A - Method for making radiator supporting column - Google Patents

Method for making radiator supporting column Download PDF

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Publication number
CN101069922A
CN101069922A CN 200610080174 CN200610080174A CN101069922A CN 101069922 A CN101069922 A CN 101069922A CN 200610080174 CN200610080174 CN 200610080174 CN 200610080174 A CN200610080174 A CN 200610080174A CN 101069922 A CN101069922 A CN 101069922A
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CN
China
Prior art keywords
supporting column
making
aggregate
radiator supporting
substrate
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Granted
Application number
CN 200610080174
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Chinese (zh)
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CN100496811C (en
Inventor
杨琇妃
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Inventec Corp
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Inventec Corp
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Priority to CNB2006100801749A priority Critical patent/CN100496811C/en
Publication of CN101069922A publication Critical patent/CN101069922A/en
Application granted granted Critical
Publication of CN100496811C publication Critical patent/CN100496811C/en
Expired - Fee Related legal-status Critical Current
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Abstract

The present invention relates to a method for making supporting column of radiator. Said method includes the following steps: preparing base plate with recessed portion; preparing injection plate with at least one through hole on the recessed portion of said base plate, said through hole is correspondent to the position where the supporting column can be formed on said base plate; injecting aggregate into said through hole; placing said base plate, injection plate and aggregate into a high-temperature environment and sintering; after the aggregate is solidified, removing said injection plate so as to form supporting column on the recessed portion of said base plate.

Description

The method for making of radiator supporting column
Technical field
The invention relates to the method for making of radiating piece, particularly about the method for making of radiating piece support member.
Background technology
Along with the continuous progress of IC design and manufacturing technology, the integrated level of integrated circuit also constantly promotes thereupon.With the CPU is example, because the lifting of integrated level, how dissipation becomes problem demanding prompt solution to the high temperature that produces during operation.Generally speaking, keep the normal operation of integrated circuit, radiating piece can be installed on the integrated circuit for reaching the heat radiation purpose, by radiating piece with heat dissipation.
Traditional radiating piece is to utilize radiating piece body material to have the characteristic of quick heat absorption and heat radiation, yet only utilize the heat dissipation characteristics of material can't further promote radiating effect, for further promoting the radiating effect of radiating piece, the radiating piece of collocation radiating fin, fan or water-cooling structure is proposed.In the above-mentioned various heat spreader structure, again with radiating effect the best of water-cooling spare.
See also Fig. 2 A, it is the STRUCTURE DECOMPOSITION figure of existing water-cooled radiating piece.As shown in the figure, this radiating piece 2 comprises the infrabasal plate 21 and the upper substrate 22 of this infrabasal plate 21 relatively, this infrabasal plate 21 has recess 211, and also has a plurality of support columns 23 that are used to support this upper substrate 22 on this recess 211, and one jiao of this upper substrate 22 then has perforation 221.See also Fig. 2 B, at this infrabasal plate 21 with upper substrate 22 during by mode tight engagement such as fixture (not marking) or welding, these support columns 23 can effectively support this upper substrate 22, after cooling liquid 25 injects this space 24 and seals this perforation 221 by this perforation 221, this cooling liquid 25 carries out liquid state according to different operating temperatures in this space 24 and gaseous state changes, and increases the radiating efficiency of this radiating piece 2.
The generation type of the support column 23 of above-mentioned existing heat spreader structure is sprinkled upon aggregate on the default position that forms support columns 23 of this recess 211 as shown in Figure 3, and stops to spill material after making this support column 23 reach predetermined height, and this support column 23 forms cone shape structure.The shortcoming of this processing procedure is in the process of this support column formation, wayward and the easy fragmentation of the density of its capillary structure, in addition, because the density of capillary structure is less, so after injecting cooling liquid 25, can reduce the capillary force of these support column 23 absorption cooling liquids 25, so influence cooling liquid 25 in this space 24 circulate efficient, the just efficiency of cycle.
In sum, how to provide a kind of density and the capillary structure that can control and promote radiator supporting column, the method for making of the radiator supporting column of the radiating efficiency of increase radiating piece becomes the problem that needs to be resolved hurrily at present.
Summary of the invention
For overcoming the various shortcoming of above-mentioned prior art, main purpose of the present invention is to provide the method for making of the radiator supporting column of a kind of density that can control radiator supporting column and capillary structure.
For achieving the above object, the method for making of radiator supporting column of the present invention comprises: preparation has the substrate of recess; Preparation has the material feeding plate of at least one perforation on the recess of this substrate, and this perforation corresponds to the default position that forms support column of this substrate; Injecting aggregate is in this perforation; This substrate, material feeding plate and aggregate are inserted sintering in the hot environment; And after this aggregate typing, this material feeding plate is removed, on the recess of this substrate, form support column.
Compared with prior art, the density and the capillary structure of radiator supporting column can be controlled and promote to the method for making of radiator supporting column of the present invention, increases the radiating efficiency of radiating piece.
Description of drawings
Figure 1A to 1E is the schematic diagram of the method for making of radiator supporting column of the present invention;
Fig. 2 A is the STRUCTURE DECOMPOSITION figure of existing water-cooled radiating piece;
Fig. 2 B is the state that existing water-cooled radiating piece is finished combination; And
Fig. 3 is the processing procedure schematic diagram of existing water-cooled radiator supporting column.
The specific embodiment
Embodiment
See also Figure 1A to 1E, it is the schematic diagram of the method for making of radiator supporting column of the present invention.
At first, shown in Figure 1A, preparation substrate 11.In the present embodiment, the mid portion of this substrate 11 has recess 111.The material of this substrate 11 can be materials such as copper, aluminium or albronze.The volume of this recess 111 then can be decided according to the amount of follow-up injection cooling liquid.
Secondly, shown in Figure 1B, preparation has the material feeding plate 12 of at least one perforation 121 on the recess 111 of this substrate 11, and this perforation 121 corresponds to this substrate 11 default positions that form support column.In the present embodiment, this perforation 121 is column structures, and in other embodiments, this perforation 121 can be other geometry, and this perforation 121 has consistent aperture.
Then, shown in Fig. 1 C, injecting aggregate 13 is in this perforation 121.The material of this aggregate 13 can be materials such as copper, aluminium or albronze.In the present embodiment aggregate 13 being filled into the mode of this perforation 121, is this aggregate 13 to be laid in advance material feeding plate 12 tops, and makes aggregate 13 inject this perforation 121 in the mode of rocking.
Moreover, shown in Fig. 1 D, this substrate 11, material feeding plate 12 are inserted sintering in the hot environment with aggregate 13.In the present embodiment, this hot environment can for example be a high temperature furnace.
At last, shown in Fig. 1 E, after these aggregate 13 typings, this material feeding plate 12 is removed, on the recess of this substrate 11, form support column 131.In the present embodiment, after these aggregate 13 sintering are finished, this substrate 11, material feeding plate 12 are shifted out this hot environment with aggregate 13, treat to remove this material feeding plate 12 formation support columns 131 behind these aggregate 13 cooling and shapings.
In sum, the density and the capillary structure of radiator supporting column can be controlled and promote to the method for making of radiator supporting column of the present invention, increases the radiating efficiency of radiating piece.

Claims (8)

1. the method for making of a radiator supporting column is characterized in that, the method for making of this radiator supporting column comprises:
Preparation has the substrate of recess;
Preparation has the material feeding plate of at least one perforation on the recess of this substrate, and this perforation corresponds to the default position that forms support column of this substrate;
Injecting aggregate is in this perforation;
This substrate, material feeding plate and aggregate are inserted sintering in the hot environment; And
After this aggregate typing, this material feeding plate is removed, on the recess of this substrate, form support column.
2. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, this recess is formed on the mid portion of this substrate.
3. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, the material of this substrate can be copper, aluminium or albronze.
4. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, this perforation is a column structure.
5. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, this perforation has consistent aperture.
6. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, the material of this aggregate can be copper, aluminium or albronze.
7. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, this hot environment is a high temperature furnace.
8. the method for making of radiator supporting column as claimed in claim 1 is characterized in that, this injecting aggregate is that this aggregate is laid in material feeding plate top, and makes this aggregate inject this perforation in the mode of rocking in the step of this perforation.
CNB2006100801749A 2006-05-10 2006-05-10 Method for making radiator supporting column Expired - Fee Related CN100496811C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2006100801749A CN100496811C (en) 2006-05-10 2006-05-10 Method for making radiator supporting column

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006100801749A CN100496811C (en) 2006-05-10 2006-05-10 Method for making radiator supporting column

Publications (2)

Publication Number Publication Date
CN101069922A true CN101069922A (en) 2007-11-14
CN100496811C CN100496811C (en) 2009-06-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100801749A Expired - Fee Related CN100496811C (en) 2006-05-10 2006-05-10 Method for making radiator supporting column

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CN (1) CN100496811C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105324018A (en) * 2015-12-05 2016-02-10 重庆元创自动化设备有限公司 Special heat-dissipating device for integrated circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105324018A (en) * 2015-12-05 2016-02-10 重庆元创自动化设备有限公司 Special heat-dissipating device for integrated circuits
CN105324018B (en) * 2015-12-05 2017-08-25 重庆元创自动化设备有限公司 Integrated circuit heat radiating device special

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Publication number Publication date
CN100496811C (en) 2009-06-10

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Granted publication date: 20090610

Termination date: 20120510