CN101069920A - Process for making SiC particle reinforced composite material electronic package shell using semi-soild-state technology - Google Patents
Process for making SiC particle reinforced composite material electronic package shell using semi-soild-state technology Download PDFInfo
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Abstract
The present invention relates to a technological process for preparing SiC granules reinforced composite material electronic packaging shell body by utilizing semi-solid process. Said technological process includes the following steps: making block-like matrix metal alloy undergo the process of heat treatment at 80deg.C-120deg.C, in a resistance furnace heating said metal alloy and making it be molten, after the metal alloy is completely molten, heat-insulating and standing still for 20-30 min, then adding SiC granules whose volume percentage content is 10%-30% into the alloy liquor under the condition of uniformly stirring, at the same time controlling cooling temperature to semi-solid temperature zone so as to obtain granules rein forced composite material semi-solid slurry material, designing forming cavity of electronic packaging shell body, and press forming so as to obtain the invented product.
Description
Technical field
The invention belongs to technical field of electronic encapsulation, particularly provide a kind of and prepared SiC particle reinforced composite material electronic package shell technology with semi-soild-state technology.
Background technology
Progress of modern technology improves day by day to the requirement of Materials Science and Engineering technology, the development of new high-performance composite materials with and advanced machining technology become vast high-tech enterprise and needed the urgent problem that solves, this phenomenon embodies more obviously in the Electronic Packaging field.The develop rapidly of Aero-Space, electronic communication requires electronic devices and components can have higher integrated level, quicker operation speed and bigger capacity, the complexity and the intensive of components and parts in electronic device and the electronic installation are improved day by day, this will inevitably cause, and the circuit caloric value improves, operating temperature rises, and stability decreases.It is calculated that, in semiconductor devices, 18 ℃ of the every risings of temperature, the possibility of inefficacy just increases 2-3 doubly.At present, composite material electronic package shell is mainly by processing with powder metallurgic method (SiC prefabricated blank+liquid metal infiltration) preparation.Because there are shortcomings such as process route length, processing cost height in this method, the short flow process, the near-net-shape process technology that explore high-performance for a long time, particularly have a thin-wall complicated shape composite material electronic package shell of excessive heat conductance and low thermal coefficient of expansion characteristics have become the problem that the electronic information industry presses for solution.How to find a kind of manufacturing process cleverly to become one of numerous scientists and engineers and have creative and challenging work.At present, the main bottleneck of problem is the material forming technology of how preparing the novel electron encapsulating material and proposing short flow process, near-net-shape and be easy to control.
On the other hand, in the medium-term and long-term development plan of national Eleventh Five-Year Plan, clearly propose following processing industry and must walk low energy consumption, oligosaprobic road, and proposed corresponding performance assessment criteria.Be high energy consumption, heavily contaminated and the low cost performance of reversing the materials processing industry of in China's economic construction, occupying critical role as early as possible, improve the quality of products, alleviate environmental pollution, strengthen its international competitiveness, press for from metallurgical material scientific development forward position, break through traditional metallurgy and processing technology theory and notion, utilize new and high technology that new technology exploration is carried out in materials processing and control technology, realize short flow process, low energy consumption and the high-quality of production process.The appearance of phase early 1970s semi-solid processing has brought hope for addressing the above problem undoubtedly.
So-called semi-solid processing is that the solid-liquid mixed slurry with certain liquid phase component is carried out die casting, extruding or die-forging forming, be a kind of manufacturing process (M.C.Flemings.Behavior of Alloys in Semi-solid State.Metallurgical Transactions between conventional cast (pure liquid state) and forging and pressing (pure solid-state), 1990, Vol.22B:269-293).Compare with common processing method, semi-solid-state metal processing has following advantage: 1. have wide range of applications, all metal and alloys with solid-liquid two-phase region all can be realized semi-solid processing, as die casting, extruding and the excellent suitability for press forming of aluminium alloy, magnesium alloy and steel; 2. semi-solid alloy partly discharges crystallization latent heat, thereby has alleviated the thermal shock to processing mold, and its life-span is increased substantially; 3. semi solid slurry has rheological characteristic and thixotropy, and resistance of deformation is very little, thereby the very complicated parts of section that can be shaped, and realizes near-net-shape, and has shortened the process-cycle, has improved stock utilization, helps energy-saving material-saving; 4. the semi solid slurry filling is steady, no turbulent flow and splash, and processing temperature is relatively low, and solidification shrinkage is little, thereby the drip molding surfacing is smooth, dense internal organization, crystal grain is tiny, and mechanical property is good.As seen semi-solid processing is compared with traditional process technology and is had great advantage (Simon Kleiner, Erhard Ogris, Oliver Beffort and Peter J.Uggowitzer.Semi-Solid Metal Processing of Aluminum Alloy A356 and Magnesium Alloy AZ91:Comparison Based on Metallurgical Considerations.Advanced Engi.Mater.2003,5 (9): 653-658).
Since the seventies in 20th century, this technology has obtained the U.S., Italy, the scientific workers' of developed country such as Germany and Japan generally attention, and successively to aluminium, magnesium, plumbous, alloys such as copper have been carried out extensive studies at aspects such as semisolid technological experiment and theories, obtained impressive progress, part company has entered large-scale production (M Fehlbier.Herstellung, Charakterisierung und Verarbeitung Teilfluessiger MetallischerWerkstoffe am Beispiel Verschiedener Aluminum-und Magnesiumlegierungen.Aachen, Techn.Hochsch., Diss, 2002.ISBN3-8322-1064-4).Production capacity as two semi-solid aluminium alloy shaping auto parts production plants in 1997 of Alumax company of the U.S. reaches annual 5000 ten thousand respectively.The semi-solid aluminium alloy auto parts quality that gondola Stampal SPA and Fiat Auto company produce reaches 7kg, and complex-shaped; Gondola MM (Magneti Marelli) produced the fuelinjection rail part that semi-solid aluminium alloy is shaped for motor corporation, reached 7500 of daily outputs in 2000.In Germany, metal forming institute of world-renowned RWTH (IBF der RWTH-Aachen) under Reiner Kopp professor and EFU president of a company professor GerhaltHirt lead, just carrying out one large-scale, the semisolid research project SFB289 (Sonderforschungbereich) that level is very high, this project continuous 12 years from 1996 obtains subsidy from the German scientific research DFG of federation (Deutsche Forschungsgemeinschaft), semisolid has been carried out comprehensively, deeply and the basic research and commercial development (the M Kiuchi of system, R.Kopp.Mushy/Semi-solid metal formingtechnology-Present and future.Annals of the CIRP.2002,51 (2): 1-18).The SpeedStar Wheel company of Japan produces aluminium alloy wheel hub (heavy 5kg) with semi-solid processing.In addition, produce mobile communication phone shell and notebook computer casing etc. with semi-solid magnesium alloy thixotropic forming technology in some companies of Japan.In worldwide, successively hold 9 international academic conferences (S2P) of semisolid, obtained important academy's successes.
China is since the later stage eighties, in state natural sciences fund, under the support of plans such as 863 and 973, successively there are many colleges and universities and R﹠D institution to carry out the research of this respect, as (the Zhang Jingxin of Beijing Non-Ferrous Metal Research General Academy, Zhang Kui, Xu Jun, Shi Li opens second semisolid nd Annual Meeting collection of Semi-solid Processing of AZ91D Alloy. China. Beijing, 2002:204-208), (the Zuo Hongzhi of University Of Chongqing, Liu Changming, Zou Maohua, Gu Zhongming, model increases, Li Dequan, Wu Jun, the semisolid casting forming of the auspicious .ZL112Y pack alloy of Qiu's filial piety semisolid remelting technology and motorcycle parts. second semisolid nd Annual Meeting collection of China. Beijing, 2002:102-109) etc.Obtaining encouraging progress aspect the fundamental research of semi-solid processing forming technique, and idiomorphism design and developed dissimilar testing equipments, even test production with business tie-up.JH70 type motor generator magnesium alloy semi solid state support as University Of Chongqing and Chongqing nine sides of China Jialing group casting Co., Ltd cooperation research and development; The Beijing Non-Ferrous Metal Research General Academy cooperates with the Dong Feng Auto Corporation, the aluminium alloy automobile air-conditioner part that adopts semisolid die casting to produce.
By can find that the domestic and international research work major part of doing all is by adopting parts such as semi-solid state forming technique processing automobile, motorcycle at present both at home and abroad to above researching and analysing.Being used for notebook, handset shell etc. mainly is magnesium alloy materials for the 3C Product of representative.To semisolid die casting the time in the research process of slurry flow behavior (fraction solid about 50%), the semisolid research center of Aachen, Germany polytechnical university (RWTH-Aachen) once specialized designs a T shape slurry fills device.According to its result of study, the semi solid slurry liquid form can be divided into turbulent flow, transient process and laminar flow (turbulent, transient and laminar).Its basic form depends on the temperature and pressure in slurry fills speed, the process of setting, and can use the two-phase model of non-newtonian fluid that the semi solid slurry liquid form is simulated.Also have an important discovery in addition: half thus the attitude slurry very easily produces liquid phase and solid phase in stowing operation segregation with separate, its segregation and the degree of separating depend on the temperature and pressure in slurry fills speed, the process of setting.In the slurry fills research process of semisolid A356 aluminium alloy, applicant once specialized designs different moulds the filling situation of slurry is studied, found that, semi solid slurry very easily produces the segregation and the segregation phenomenon of liquid phase and solid phase in the stowing operation of die cavity, the speed of its order of severity and shape, structure and the slurry fills of mold cavity, temperature and pressure etc. are relevant.
It is generally acknowledged that liquid phase and solid phase segregation and branch defection cause composition Tissue distribution inequality in the drip molding in the semi-solid-state shaping process, thereby produce structure property and mechanical property distribution inequality, and serviceability is had a negative impact.In SiC particle reinforced A 356 aluminium alloy semi-solid thixotroping extrusion molding, find by microstructure observation the drip molding subregion, SiC strengthens distribution of particles density along with the continuous increase of semi solid slurry filling stroke is the trend of continuous rising, this with semi-solid-state shaping in liquid phase flow that to reach the regularity of distribution consistent.Its underlying cause be since in semi solid slurry SiC strengthen particle and mainly be distributed in cause in the liquid phase that exists with β-eutectic phase, SiC strengthens particle along with liquid phase flow to the limit portion or the top of part in semisolid extrusion molding subsequently, thereby its volume distributed median rule is consistent with the liquid phase fraction rule.This shows, the raising of SiC grain volume fraction can realize by the liquid phase fraction regularity of distribution is controlled, the particulate reinforced composite of just available low SiC volume fraction obtains the electronic package shell part of high SiC volume fraction by the semisolid extrusion molding, thereby reduces thermal coefficient of expansion.Favorable factor when realization is converted into preparation with shaping high SiC volume fraction electronic package shell to liquid phase in the semi-solid-state shaping and solid phase segregation and the unfavorable factor of separating.
In fact, the heat conduction of metal (compound) material and superconductor, electric conductivity except with the constituent structure of (compound) material own mutually outside the Pass, with the deformation texture that forms in its process very important relation is arranged.The domestic and international at present road that the Al liquid or the Cu liquid profit method of soaking of SiC prefabricated blank are still away the conventional cast moulding, no obvious deformation texture that is to say in the resulting composite microscopic structure, the electronic package shell of prepared processing is an isotropism.In Tsing-Hua University superconduction research center, the Bi-system high-temperature superconducting investigation of materials that ceramic material and silver metal are made shows, has the place of obvious texture in the ceramet based composites, the increase that its electrical and thermal conductivity performance can tenfold.And the formation of deformation texture must obtain by the method for metal forming.In the semisolid extrusion process, slurry is to clamp-on die cavity by mould under certain pressure, and α wherein-can be elongated in stowing operation forms and the corresponding to favorable texture of filling direction.
Summary of the invention
The object of the present invention is to provide and a kind ofly prepare SiC particle reinforced composite material electronic package shell technology with semi-soild-state technology, overcome and prepared problems such as processing route length that the high SiC volume fraction composite material electronic package shell exists, production cost height with powder metallurgic method, utilize liquid phase and solid phase segregation and the feature of separating in the semisolid extrusion molding, the thin-wall complicated shape SiC metal-base composites of preparation processing high-performance electronic package shell.
Concrete processing step is as follows:
1, block parent metal alloy carried out after drying handles at 80 ℃-120 ℃, heat fused in resistance furnace, alloy left standstill 20-30 minute in fusing back insulation fully.
Parent metal alloy of the present invention is for A356 aluminium closes, AZ91 magnesium alloy or CuZn31Al2 brass alloys.
To use argon gas as protective gas to the magnesium alloy that is easy to oxidizing fire, and use the liquid magnesium alloy of foamed magnesium alloy covering agent protection fusing.The complete fusion temperature of A356 aluminium alloy is 640 ℃-650 ℃, and the complete fusion temperature of AZ91 magnesium alloy is 635 ℃-650 ℃, and the complete fusion temperature of CuZn31Al2 brass alloys is 971 ℃-980 ℃.。
2, the adding of the alloy liquid after insulation is left standstill volume fraction is the 10%-30%SiC particle.For preventing the SiC particle aggregation, in adition process, want gradation progressively to add, and be sprinkling upon the surface of molten metal, evenly to stir while adding, control simultaneously is cooled to the semi-solid temperature interval, thereby obtains the particulate reinforced composite semi solid slurry.
A356 aluminium alloy semi-solid slurry temperature is 577 ℃-581 ℃, and AZ91 magnesium alloy semisolid slurry temperature is 579 ℃-584 ℃, and CuZn31Al2 brass alloys semi solid slurry temperature is 958 ℃-963 ℃.
3, semisolid extrusion molding electronic package shell mould design.The forming cavity design of electronic package shell is in the bottom margin horizontal direction of extrusion die matrix cavity, and this is in order to guarantee that slurry produces segregation in the horizontal direction and separates when vertical direction is pushed.
4, SiC particles reiforced metal-base composition semisolid extrusion molding electronic package shell: forming speed is controlled at 80mm/s-140mm/s, forming temperature is determined according to alloy, mold preheating temperature is made as 200 ℃-300 ℃, and forming pressure is made as 400KN-600KN, and the dwell time is made as 5-10 second.
Semisolid extrusion molding electronic package shell is divided into thixotroping extrusion molding and two kinds of methods of rheology extrusion molding.When using the rheology extrusion forming method to prepare electronic package shell, directly semi solid slurry is transported to extrusion molding in the mould; For preparing electronic package shell with the thixotroping extrusion forming method, need carry out semi-solid blank secondary eddy-current heating, semi-solid blank behind the eddy-current heating is put into the extrusion die extrusion molding obtain electronic package shell.
Process chart is seen figure-1 in the description of drawings.
The advantage of invention reaches and prior art difference part:
Utilize liquid phase and solid phase segregation and separation characteristic in the semi-solid-state shaping process, with of the preparation of semi-solid-state shaping process application in the SiC particle reinforced composite material electronic package shell.Resulting technology prototype and versatility core technology can apply to the metal shell part of other (SiC) particulate reinforced composite shaping high-volume fractional equally, as Al
2O
3/ Cu alloy and Si
3N
4/ Cu alloy etc.
Electronic package shell with low SiC volume fraction Composite Preparation high SiC volume fraction.
At present, thin-wall complicated electronic package shell part mainly uses aluminium base or Cu-base composites, as alloys such as SiC/Al, SiC/Cu, Al/Si, Mo/Cu, W/Cu and Invar, Kovar.Can adopt stamping technology to process when using the Kovar alloy, can adopt powder forming (mechanical alloying+powder injection) technology to process when using Mo/Cu, W/Cu, can adopt powder metallurgic method (SiC prefabricated blank+molten metal infusion method) to process when using SiC/Al, SiC/Cu.Though and Cu and Al thermal conductivity are good, but thermal coefficient of expansion is excessive, usually adopt the way that improves the SiC grain volume fraction for reducing thermal coefficient of expansion, yet the method that adopts powder metallurgic method to prepare the high SiC grain volume fraction electronic package shell exists that processing route is long, cost is high, has many key technologies not solve.
The market demand that the present invention processes at the high SiC grain volume fraction electronic package shell just, prepare the high SiC grain volume fraction composite material electronic package shell with low SiC grain volume fraction composite by the semisolid extrusion forming process, enlarged the application of semi-soild-state technology, having expanded the manufacturing approach of electronic package shell, is a kind of brand-new forming technology of finishing.Use this technology, not only can realize the short flow process of electronic package shell, the shaping manufacturing of nearly end form, and can reduce energy resource consumption, improve the quality of products.China will be reached a higher level, for its high performance and low-cost production provide strong guarantee in the preparation and the forming technique of high strength, excessive heat conductance and the contour performance composite material electronic package shell of low thermal coefficient of expansion.
Description of drawings
Fig. 1 prepares SiC particle reinforced composite material electronic package shell process chart for the present invention uses the Semi-Solid Thixoforming extrusion forming process.
The specific embodiment
Embodiment 1: use the Semi-Solid Thixoforming extrusion forming method to prepare SiC particle reinforced A 356 Al alloy composite electronic package shell part.
Buy SiC particle (20% volume fraction) the enhancing A356 Al alloy composite that diameter is φ 56mm from Duralcan company (Duralcan company).After cut processing, at first with induction heater with the blank rapid and uniform heating to semi-solid temperature: 580 ℃.The project organization form is the mould of backward extrusion cup shell, and processes the forming cavity of electronic package shell in the bottom margin horizontal direction of matrix cavity.Semi-solid blank after the heating is put in the die of extrusion die (mold preheating temperature is made as 200 ℃) with anchor clamps rapidly.The extrusion speed of forcing press is adjusted into 120mm/s, uses the graphite releasing agent, and forming pressure is made as 600KN, and the dwell time was made as 10 seconds.But use above parameter extrusion molding to obtain thin-wall complicated electronic package shell part (SiC volume fraction 50%).
Embodiment 2: use the semi-solid rheological extrusion forming method to prepare SiC particle reinforced A 356 Al alloy composite electronic package shell part.
Block parent metal aluminium alloy A356 carried out after drying handles heat fused in resistance furnace at 100 ℃.Fusion temperature is made as 640 ℃, and alloy insulation after melting was fully left standstill 30 minutes.Alloy liquid adding volume fraction after insulation is left standstill is 25% thin SiC particle.For preventing the SiC particle aggregation, in adition process, to progressively add several times, and be sprinkling upon the surface of molten metal, evenly to stir while adding, control simultaneously is cooled to 579 ℃ of semi-solid temperature.The project organization form is the mould of backward extrusion cup shell, and processes the forming cavity of electronic package shell in the bottom margin horizontal direction of matrix cavity.Use simple and easy slurry conveying device semi solid slurry to be put into the die (mold preheating temperature is made as 280 ℃) of extrusion die.The extrusion speed of forcing press is adjusted into 130mm/s, uses the graphite releasing agent, and forming pressure is made as 600KN, and the dwell time was made as 8 seconds.But use above parameter extrusion molding to obtain thin-wall complicated electronic package shell part (SiC volume fraction 55%).
Embodiment 3: use the Semi-Solid Thixoforming extrusion forming method to prepare the SiC particle and strengthen brass alloys CuZn31Al2 composite material electronic package shell part.
Block parent metal brass alloys CuZn31Al2 carried out after drying handles heat fused in resistance furnace at 100 ℃.Fusion temperature is made as 970 ℃, and alloy insulation after melting was fully left standstill 30 minutes.Alloy liquid adding volume fraction after insulation is left standstill is 26% thin SiC particle.For preventing the SiC particle aggregation, in adition process, to progressively add several times, and be sprinkling upon the surface of molten metal, evenly to stir while adding, control simultaneously is cooled to 960 ℃ of semi-solid temperature.The project organization form is the mould of backward extrusion cup shell, and processes the forming cavity of electronic package shell in the bottom margin horizontal direction of matrix cavity.Use simple and easy slurry conveying device semi solid slurry to be put into the die (mold preheating temperature is made as 260 ℃) of extrusion die.The extrusion speed of forcing press is adjusted into 140mm/s, uses the graphite releasing agent, and forming pressure is made as 600KN, and the dwell time was made as 7 seconds.But use above parameter extrusion molding to obtain thin-wall complicated electronic package shell part (SiC volume fraction 58%).
Claims (4)
1, prepare SiC particle reinforced composite material electronic package shell technology with semi-soild-state technology, it is characterized in that, processing step is:
(1) block parent metal alloy carried out after drying handles at 80 ℃-120 ℃, heat fused in resistance furnace, alloy left standstill 20-30 minute in fusing back insulation fully; Described parent metal alloy is A356 aluminium alloy, AZ91 magnesium alloy or CuZn31Al2 brass alloys;
(2) adding of the alloy liquid after insulation is left standstill volume fraction is the 10%-30%SiC particle, evenly stirs while adding, and control simultaneously is cooled to the semi-solid temperature interval, obtains the particulate reinforced composite semi solid slurry;
(3) semisolid extrusion molding electronic package shell mould design: the forming cavity design of electronic package shell is in the bottom margin horizontal direction of extrusion die matrix cavity;
(4) SiC particles reiforced metal-base composition semisolid extrusion molding obtains the electronic package shell that the SiC grain volume fraction is 40%-60%: forming speed is controlled at 80mm/s-140mm/s, forming temperature is determined according to alloy, mold preheating temperature is made as 200 ℃-300 ℃, forming pressure is made as 400KN-600KN, and the dwell time is made as 5-10 second.
2, in accordance with the method for claim 1, it is characterized in that, semisolid extrusion molding electronic package shell is divided into two kinds of thixotroping extrusion molding and rheology extrusion moldings, when using the rheology extrusion forming method to prepare electronic package shell, directly semi solid slurry is transported to extrusion molding in the mould; For preparing electronic package shell with the thixotroping extrusion forming method, need carry out semi-solid blank secondary eddy-current heating, semi-solid blank behind the eddy-current heating is put into the extrusion die extrusion molding obtain electronic package shell.
3, in accordance with the method for claim 1, it is characterized in that the electronic package shell forming cavity should be opened in the bottom position of extrusion die die, and vertical with the direction of extrusion.
4, in accordance with the method for claim 1, it is characterized in that forming temperature: to SiC particle reinforced A 356 aluminium alloy, temperature is at 577 ℃-581 ℃; The SiC particle is strengthened the AZ91 magnesium alloy, and temperature is at 579 ℃-584 ℃; To SiC Particles Reinforced Cu Zn31Al2 brass alloys, temperature is at 958 ℃-963 ℃.
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| CN112725651A (en) * | 2020-11-12 | 2021-04-30 | 北京科技大学 | Semi-solid forming technology for aluminum-based composite material electronic packaging shell |
| CN113493876A (en) * | 2021-07-07 | 2021-10-12 | 重庆大学 | Method for modifying surface of magnesium alloy through iron-based amorphous modification |
| CN113493876B (en) * | 2021-07-07 | 2022-07-01 | 重庆大学 | Method for modifying surface of magnesium alloy through iron-based amorphous modification |
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