CN101069606A

CN101069606A - Cooling-heating cup

Info

Publication number: CN101069606A
Application number: CN 200710068778
Authority: CN
Inventors: 程淑娟; 朱开波; 李武
Original assignee: NINGBO LIXIN TOUR PRODUCTS CO Ltd
Current assignee: NINGBO LIXIN TOUR PRODUCTS CO Ltd
Priority date: 2007-05-24
Filing date: 2007-05-24
Publication date: 2007-11-14
Anticipated expiration: 2027-05-24
Also published as: CN100493418C

Abstract

The present invention relates to a cold and hot cup. It is characterized by that it includes a cup body, an internal container with containing space, heat-insulating layer, cup seat with air inlet and air outlet upper temperature-conducting component close to the bottom portion of said internal container, lower temperature-conducting component, semiconductor cold and hot chip whose upper end surface is close to upper temperature-conducting component and whose lower end surface is close to lower temperature-conducting component, heat-insulating plate and radiation mechanism formed from radiator and blower fan positioned under the radiator. Besides, the air inlet of said cup seat also is equipped with a filtering dust-preventing device.

Description

A kind of cold and hot cup

Technical field

The present invention relates to a kind of cold and hot cup, relate in particular to and a kind ofly go out to carry and the cold and hot cup of use aspect.

Background technology

Semiconductor refrigerating claims temperature-difference refrigerating or thermoelectric cooling again, and this technology is based on the operation principle of pal card (peltire) effect, promptly can produce heat release and heat absorption phenomenon when the electric current node place that two different conductors form that flows through.From late 1950s, along with thermoelectricity capability preferably this technology of fast development of semi-conducting material just by the people paid attention to, because it is pollution-free that it has, noiselessness, volume is little, life-span is long, in light weight, reliable, easy to maintenance, can reach cooling and heat two kinds of advantages such as various objectives by changing sense of current, be applied to now in many military domain.

Recently, this technology also increases on civilian household electrical appliance gradually, as water dispenser, refrigerator, computer CPU, air-conditioning and cold and hot cup.The application in China on the cold and hot cup just had the careless mistake mistake as far back as 1985 in the CN85202561U patent.

At present, emerge a lot of patents about the cold and hot cup aspect, as Chinese utility model patent: ZL98215283.3, a kind of " Bo Er pastes cold and hot cup " (publication number: CN2328308Y), be made of cup, bowl cover, cup courage, the cup end, heat-insulation layer, conduction sole piece, conductor refrigeration sheet, radiator, fan, temperature controller, the plug etc. that has a polarity switch of switching on is disclosed.

Also can be with reference to CN2237817Y, CN2815075Y, CN2839925Y, CN2728962Y, CN2702244Y, CN2391147Y, CN2566766Y etc.

Can see that from above-mentioned patent documentation cold and hot cup consists essentially of cup, cup courage, heat-insulation layer, cup, semiconductor chilling plate, heat transfer mechanism and cooling mechanism, cup is provided with able to turn on or off bowl cover, the cup courage is located in the cup and is had spatial accommodation, heat-insulation layer is located between cup and the cup courage, play insulation effect, cup is located at bottom of cup, is glued with heat transfer mechanism on the semiconductor chilling plate, and cooling mechanism is made up of radiator and blower fan.Because work the time has a large amount of air turnover, of long duration just have the dust in air impurities accumulation on heat transfer mechanism and cooling mechanism, thereby influence its effect, the electric energy that waste is valuable.If disassemble cleaning, because heat transfer mechanism and cooling mechanism arrange that compact cleaning is not thorough, and exist and damage the wherein possibility of parts, so often reach the effect of getting half the result with twice the effort.And the effective measures that solve this technical problem are not mentioned in existing technology the inside.

Summary of the invention

Technical problem to be solved by this invention is to provide a kind of cold and hot cup at above-mentioned prior art present situation, and this cold and hot cup cooling mechanism is difficult for the accumulation dust, and radiating efficiency can keep for a long time.

The present invention solves the problems of the technologies described above the technical scheme that is adopted: this cold and hot cup comprises

One cup;

One is located at the inner bag in the cup, and it has spatial accommodation;

One heat-insulation layer is located between cup and the inner bag;

One cup has air inlet and air outlet, is located at the cup bottom;

Lead warm part on one, be close to the inner bag bottom;

Lead warm part once;

The cold and hot wafer of semiconductor, its upper surface are close to and are led warm part on above-mentioned, and the lower surface is close to and is led warm part under above-mentioned;

One is used to intercept out the thermal insulation board of leading warm part and leading heat transmission between the warm part down, is located at above-mentioned semiconductor cold-hot wafer periphery; And

One cooling mechanism is located at cup and is close to and leads warm part under above-mentioned, forms by radiator and the blower fan that is positioned at its below,

It is characterized in that described cup air inlet also is furnished with one and filters dust guard.

Filtering dust guard can be screen pack, also can adopt filter bag or filter core.

As improvement, described cup is made up of cup lower body and backplate, backplate is that cylindric backplate is provided with air outlet around the cup lower body outside, and described cup lower body is one to have the support body in ccontaining cooling mechanism space, its bottom has air inlet, and described filter net cloth places on this air inlet, and the framework formula structural design of cup lower body makes the parts of the inside install compact, it is smooth and easy to ventilate, light practicality.

Described screen pack can be in the form of annular discs, and described screen pack also can be to be extended upwardly to air outlet and formed cylindric by card.

As improvement, the air inlet diameter of described cup lower body bottom is less than screen pack card diameter, and described screen pack is embedded on the air inlet that is arranged in glass lower body from top to bottom, and the layout of screen pack is convenient to assembling and is installed firmly.

Lead warm part middle part on described and be provided with the cavity that stretches into for the inner bag bottom, guarantee the heat conduction fully.

Lead warm part under described and comprise the horizontal part of upper end and the extension of lower end, be provided with in the middle of the described thermal insulation board and be used to place down the groove of leading warm part horizontal part, be provided with in the middle of this groove for leading the through hole that warm part extension passes down, described radiator is the fin shape, the middle part is provided with for leading the space that warm part extension holds down, it is compact that integral installation seems, makes heat transfer and radiating effect reach maximization.

Compared with prior art, the invention has the advantages that: because air inlet filters setting up of dust guard, greatly reduce the invasion of dust, reduced the accumulation of dust on cooling mechanism and heat transfer mechanism, prolong their working time, strengthened operating efficiency, in the time of cleaning, as long as it is just passable to unload the cleaning of filtration dust guard, easily and effectively; The framework formula structural design of cup lower body makes the parts of the inside that compactness is installed, and it is smooth and easy to ventilate, light practicality; On lead warm part and inner bag snug fit, lead the assembling of warm part and dividing plate and radiator down, seem compact, make and conduct heat and radiating effect reaches maximization.

Description of drawings

Fig. 1 is the structural representation (after removing cup and backplate) of embodiment 1.

Fig. 2 is the three-dimensional exploded view that dwindles of embodiment 1.

Fig. 3 is the filter screen structure schematic diagram of embodiment 2.

Fig. 4 is the perspective exploded view of embodiment 3.

The specific embodiment

Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.

Embodiment 1, with reference to figure 1 and Fig. 2.

In the present embodiment, cup 101 is provided with able to turn on or off bowl cover 100, and cup 101 outer walls are provided with handle 105 and control panel 103, and control panel 103 inboards are provided with circuit control module 104 and are electrically connected with circuit control module 104.

Inner bag 106 is located in the cup 101, and it has spatial accommodation, is used to hold food liquid, and inner bag bottom 107 is to lower convexity, and heat-insulation layer is located between cup 101 and the inner bag 106, plays the heat-insulation and heat-preservation effect;

Cup 8 is made up of cup lower body 81 and backplate 82, it is cylindric around cup lower body 81 outsides that backplate 82 is, backplate 82 is provided with exhaust vent, several exhaust vents constitute air outlets 821, and a cup lower body 81 is one to have the support body in ccontaining cooling mechanism 5 spaces, and its bottom has air inlet, the air inlet place is furnished with screen pack 7, screen pack 7 is in the form of annular discs, and best 150 orders that adopt of screen pack 7 mesh can be selected between 100～250 orders.Screen pack 7 in the present embodiment also can adopt filter core to substitute.

Cup 101 and cup 8 can also can adopt build-in type connection etc. in the prior art by the setting that is threaded.

The air inlet diameter is less than screen pack 7 card diameters, and cup lower body 81 bottoms radially have extension 811, be used to hold screen pack 7, and screen pack 7 are embedded from top to bottom on the air inlet that is arranged in glass lower body 81.

On lead warm part 1 middle part and be provided with the cavity 11 that stretches into for inner bag bottom 101, on lead warm part 1 and adopt aluminum.

Under lead warm part 3 and also adopt aluminum, it comprises the horizontal part 31 of upper end and the extension 32 of lower end.

Semiconductor cold-hot wafer 2 has the two poles of the earth, and semiconductor cold-hot wafer 2 upper surfaces are close to and are led warm part 1, lead warm part 3 under the lower surface is close to, and after the energising, the two poles of the earth produce opposite cooling and intensification phenomenon respectively.

Thermal insulation board 4 is made by insulating materials, be located at semiconductor cold-hot wafer 2 peripheries, the centre is provided with and is used to place down the groove 41 of leading warm part horizontal part 31, are provided with in the middle of the groove 41 for leading the through hole 42 that warm part extension 32 passes down, thermal insulation board 4 be used for intercepting open lead warm part 1 and under lead heat transmission between the warm part 3.External power supply plug 108 is located on cup 101 outer walls.

On lead warm part 1 and be provided with screw, also be provided with screw on the thermal insulation board 4, by the mating reaction of bolt 12 and nut 13, on lead warm part 1, semiconductor cold-hot wafer 2, temperature conducting block 3 and thermal insulation board 4 are fixed in one down.

Cooling mechanism 5 is located at cup 8 and is led warm part 3 under being close to, and is made up of radiator 5 and blower fan 6, and radiator 5 is made up of radial fin, and is made by aluminium, and the middle part is provided with for leading the space that warm part extension 32 holds down.Blower fan is positioned at radiator 5 belows, is used to quicken cross-ventilation.

The refrigeration of cold and hot cup and heating can be achieved by the flow direction switching of control electric current.During refrigeration, semiconductor cold-hot wafer 2 upper surfaces one utmost point temperature descends, and lower surface one utmost point temperature rises, and the heat of the food liquid in the inner bag 106 conducts from top to bottom like this, and the effect by radiator 5 and blower fan 6 at last is discharged into heat in the air.During heating, the heat conduction pattern is then opposite.

Embodiment 2, and with reference to figure 3, the screen pack 7 in the present embodiment extends upwardly to air outlet 821 by card and forms cylindricly, and design can make air intake and air-out process all reach the free from dust purpose like this, each parts in the better protection cup 8.Other structures are identical with embodiment 1.

Embodiment 3, with reference to figure 4, bowl cover 100 tops are provided with a bowl cover shifting block 107, on lead warm part 1 side and see and be inverse-T-shaped, its top is provided with for the ccontaining groove in inner bag 106 bottoms, backplate 82 is provided with a plurality of manholes, constitute air outlet 821, present embodiment adopts filter bag 7a as filtering dust guard, and filter bag 7a opening goes out to be provided with elastic wire 7b and is used to prop up filter bag 7a, executes to be placed on glass lower body 81 inside after external force is compressed elastic wire 7b, when decontroling sack, the compressed elastic wire 7b original state of rebounding itself, thus be pressed into voluntarily in the inner card cage 811 on glass lower body 81 tops, to realize its location.And radiator 5 and blower fan 6 are arranged in filter bag 7a.Other structures are identical with embodiment 1.

Claims

1, a kind of cold and hot cup comprises

One cup (101);

One is located at the inner bag (106) in the cup (101), and it has spatial accommodation;

One heat-insulation layer is located between cup (101) and the inner bag (106);

One cup (8) has air inlet and air outlet, is located at cup (101) bottom;

Lead warm part (1) on one, be close to inner bag (106) bottom;

Lead warm part (3) once;

The cold and hot wafer of semiconductor (2), its upper surface are close to and are led warm part (1) on above-mentioned, and the lower surface is close to and is led warm part (3) under above-mentioned;

One is used for obstruct opens the thermal insulation board (4) of leading warm part (1) and leading heat transmission between the warm part (3) down, is located at above-mentioned semiconductor cold-hot wafer (2) periphery; And

One cooling mechanism (5) is located at cup (8) and is close to and leads warm part (3) under above-mentioned, forms by radiator (5) and the blower fan (6) that is positioned at its below,

It is characterized in that described cup (8) air inlet also is furnished with one and filters dust guard.

2, cold and hot cup according to claim 1 is characterized in that described filtration dust guard is screen pack (7).

3, cold and hot cup according to claim 1 is characterized in that described filtration dust guard is filter bag (7a) or filter core.

4, cold and hot cup according to claim 2, it is characterized in that described cup (8) is made up of cup lower body (81) and backplate (82), it is cylindric around cup lower body (81) outside that backplate (82) is, backplate (82) is provided with air outlet (821), described cup lower body (81) is one to have the support body in ccontaining cooling mechanism (5) space, its bottom has air inlet, and described screen pack (7) is arranged on this air inlet.

5, cold and hot cup according to claim 4 is characterized in that described screen pack (7) is in the form of annular discs.

6, cold and hot cup according to claim 4 is characterized in that described screen pack (7) is extended upwardly to air outlet (821) and formed cylindric by card.

7, according to claim 4 or 5 or 6 described cold and hot cups, the air inlet diameter that it is characterized in that described cup lower body (81) bottom is less than screen pack (7) card diameter, and described screen pack (7) is embedded on the air inlet that is arranged in a glass lower body (81) from top to bottom.

8,, it is characterized in that leading on described warm part (1) middle part and be provided with the cavity (11) that stretches into for inner bag bottom (101) according to the described cold and hot cup of arbitrary claim in the claim 1 to 6.

9, according to the described cold and hot cup of arbitrary claim in the claim 1 to 6, it is characterized in that the described warm part (3) of leading down comprises the horizontal part (31) of upper end and the extension (32) of lower end, be provided with in the middle of the described thermal insulation board (4) and be used for placing the groove (41) of leading warm part horizontal part (31) down, be provided with in the middle of this groove (41) for leading the through hole (42) that warm part extension (32) passes down, described radiator (5) is the fin shape, and the middle part is provided with and supplies to lead down the space that warm part extension (32) holds.

10, cold and hot cup according to claim 8, it is characterized in that the described warm part (3) of leading down comprises the horizontal part (31) of upper end and the extension (32) of lower end, be provided with in the middle of the described thermal insulation board (4) and be used for placing the groove (41) of leading warm part horizontal part (31) down, be provided with in the middle of this groove (41) for leading the through hole (42) that warm part extension (32) passes down, described radiator (5) is the fin shape, and the middle part is provided with and supplies to lead down the space that warm part extension (32) holds.