CN101068016A - Photoelectric system for realizing multi-CCD seamless paste-up - Google Patents
Photoelectric system for realizing multi-CCD seamless paste-up Download PDFInfo
- Publication number
- CN101068016A CN101068016A CNA2007100690524A CN200710069052A CN101068016A CN 101068016 A CN101068016 A CN 101068016A CN A2007100690524 A CNA2007100690524 A CN A2007100690524A CN 200710069052 A CN200710069052 A CN 200710069052A CN 101068016 A CN101068016 A CN 101068016A
- Authority
- CN
- China
- Prior art keywords
- image planes
- width
- ccd
- imaging lens
- short transverse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Studio Devices (AREA)
Abstract
This invention discloses a photoelectric system realizing multiple CCD seamless splicing including four sets of imaging systems, each one of which is composed of an imaging lens and a CB, the optical axes of all imaging lenses are parallel and the CB is set on the surface of its corresponding imaging lens and mounted with several CCD blocks uniformly, the central distance of two adjacent CCD on the width direction is not larger than two times of actual sensitization width on the width direction and greater than the encapsulation width, the distance of two adjacent CCD on the height direction is not greater than two times of actual sensitization width and greater than the encapsulation width on the height direction, and the four CB and axes centers of the corresponding image lenses are mounted staggeredly to the four directions to be conjugated and all CCD are full of the image view field so as to realize seamless splicing of CCD.
Description
Technical field
The present invention relates to a kind of big visual field digital imaging system, refer in particular to the seamless spliced electro-optical system of a kind of CCD of realization.
Background technology
In image acquisition fields such as CCD (Charge Coupled Device, charge coupled device) as imageing sensor, is widely used in taking photo by plane, remote sensing, ordinary digital camera, infrared imaging system and the system.
With CCD be the image sensing receiver the digital imaging system development rapidly, but because the restriction of CCD device number of picture elements, even the optical imagery camera lens has very large visual field and high-resolution, system still is difficult to obtain very big amount of information.With LONG WAVE INFRARED CCD imaging system is example, can be 384 * 288 to the high pixel of the non-refrigeration device of the open supply of China in the world at present, the once single CCD imaging of imaging system can only obtain the amount of information of 11 everything elements, and imaging viewing field, resolution, the detection range of our infrared detection system are restricted.Present optical digital imaging system, restriction system imaging viewing field angle and resolution mainly be the CCD device.
Obtaining bigger amount of information needs other method, mainly is scanning technique and splicing.Yet scanning system needs moving component, and the reliability of system is reduced greatly, is the biggest obstacle that use in the national defence field.Though splicing does not need moving component, but since generally all have around the CCD device imaging region one can not imaging the edge, about or two its sizes of edge addition are near the imaging region size up and down, therefore directly the CCD splicing will cause a very large imaging blind area.Also have the optics of employing light-splitting method that image planes are separated into different locus, obtain the scheme of image information more respectively with a plurality of CCD, but the optics beam split is subjected to the restriction of system's rear cut-off distance, and beam splitting system still can cause certain visual field disappearance.
Therefore, invention is a kind of does not have moving component, imaging viewing field the big visual field, the imaging system meaning of high pixel number of disappearance is not very huge.
Summary of the invention
The invention provides does not a kind ofly have moving component, does not have the visual field disappearance, can realize the multiple CCD seamless splicing imaging system.
A kind of electro-optical system that realizes the multiple CCD seamless splicing, it is characterized in that: comprise the quadruplet imaging system, every cover imaging system is made up of an imaging lens and a circuit board, the optical axis of all imaging lens is parallel, each circuit board is arranged on the image planes of its corresponding imaging lens, some CCD evenly are installed on the circuit board, and the centre-to-centre spacing of adjacent two CCD is not more than 2 times of the actual sensitization width of each CCD image planes Width on the image planes Width, and greater than the package width of each CCD image planes Width; The centre-to-centre spacing of adjacent two CCD is not more than 2 times of the actual sensitization width of each CCD image planes short transverse on the image planes short transverse, and package width greater than each CCD image planes short transverse, four circuit boards imaging lens optical axis center corresponding with it is respectively to the four direction arranged in dislocation, whole CCD are full of whole image planes visual field behind the optical conjugate, and realization CCD's is seamless spliced.
In the first cover imaging system, the upper left side that is centered close to imaging lens A image planes center of circuit board A, with imaging lens A image planes center is initial point, be offset left along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, along the image planes short transverse upwards skew be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
In the second cover imaging system, the upper right side, the imaging lens B image planes center that is centered close to of circuit board B, with imaging lens B image planes center is initial point, be offset to the right along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, along the image planes short transverse upwards skew be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
In the 3rd cover imaging system, the lower left, the imaging lens C image planes center that is centered close to of circuit board C, with imaging lens C image planes center is initial point, be offset left along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, offset downward along the image planes short transverse and be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
In the quadruplet imaging system, the lower right, the imaging lens D image planes center that is centered close to of circuit board D, with imaging lens D image planes center is initial point, be offset to the right along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, offset downward along the image planes short transverse and be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
Because imaging system is to remote object image-forming, and four imaging lens optical axises are parallel, has only the hundreds of millimeter apart, therefore visual field, center, every suit picture side correspondence of quadruplet imaging system is same true field, be visual field, native system center (differ in theory between the optical axis apart from the hundreds of millimeter, but can ignore during for remote imaging).Because the CCD on four circuit boards in the quadruplet imaging system distributes and optical centre satisfies certain rule, if that is: four circuit boards are with their the optical centre alignment back (being optical conjugate) that is stacked together, complete image planes that all photosurface of CCD is seamless filled fully.The all corresponding a part of true field of each CCD, so in fact whole CCD of native system quadruplet imaging system have constituted a complete and seamless big visual field.
There is not the blind area, visual field in the present invention, really realizes field stitching seamless, movement-less part, and the visual field size do not limit by the CCD device, as long as the optical imagery camera lens allows, the theoretic imaging viewing field of native system is infinitely-great.
The present invention is very suitable for needing big visual field, high-resolution remote imaging system, as satellite remote sensing, aircraft take photo by plane, field such as infrared reconnaissance air defense uses.
Description of drawings
Fig. 1 adopts the overall structure schematic diagram of quadruplet imaging system for the present invention;
Fig. 2 (a)-(d) is the layout of CCD on the every circuit board and the location diagram at imaging lens image planes center;
Fig. 3 is the visual field figure after adopting quadruplet imaging system image synthetic.
Embodiment
As shown in Figure 1, a kind of electro-optical system that realizes the multiple CCD seamless splicing, comprise imaging system A, imaging system B, imaging system C and imaging system D, every cover imaging system is made up of an imaging lens and a circuit board, the optical axis of all imaging lens is parallel, each circuit board is arranged on the image planes of its corresponding imaging lens, some CCD evenly are installed on the circuit board, the centre-to-centre spacing of adjacent two CCD is not more than 2 times of the actual sensitization width of each CCD image planes Width on the image planes Width, and greater than the package width of each CCD image planes Width; The centre-to-centre spacing of adjacent two CCD is not more than 2 times of the actual sensitization width of each CCD image planes short transverse on the image planes short transverse, and package width greater than each CCD image planes short transverse, four circuit boards imaging lens optical axis center corresponding with it is respectively to the four direction arranged in dislocation, whole CCD are full of whole image planes visual field behind the optical conjugate, and realization CCD's is seamless spliced.
Fig. 2 (a)-Fig. 2 (d) is the layout of CCD on four circuit boards and the location diagram at imaging lens image planes center.As shown in the figure, the shadow region is the actual photosensitive region of CCD among the figure, and the frame of broken lines of each CCD periphery is the profile after the CCD encapsulation, and the outside great circle is the imaging scope of imaging lens.
Imaging lens A1 and circuit board A5 form the first cover imaging system, and circuit board A5 is installed on the image planes of imaging lens 1, and the center P 1 of circuit board A5 is positioned at the upper left side of imaging lens 1 optics image planes center O 1, sees Fig. 2 (a).
Imaging lens B2 and circuit board B6 form the second cover imaging system, and circuit board B6 is installed on the image planes of imaging lens 2, and the center P 2 of circuit board B6 is positioned at the upper right side of imaging lens 2 optics image planes center O 2, sees Fig. 2 (b).
Imaging lens C3 and circuit board C7 form the 3rd cover imaging system, and circuit board C7 is installed on the image planes of imaging lens C3, and the center P 3 of circuit board C7 is positioned at the lower left of imaging lens C3 optics image planes center O 3, sees Fig. 2 (c).
Imaging lens D4 and circuit board D8 form the quadruplet imaging system, and circuit board D8 is installed on the image planes of imaging lens D4, and the center P 4 of circuit board D8 is positioned at the lower right of imaging lens D4 optics image planes center O 4, sees Fig. 2 (d).
Because imaging system is to remote object image-forming, and four imaging lens optical axises are parallel, has only the hundreds of millimeter apart, therefore visual field, center, every suit picture side correspondence of quadruplet imaging system is an identical true field, be visual field, native system center (differ in theory between the optical axis apart from the hundreds of millimeter, but can ignore during for remote imaging).Because the CCD on four circuit boards in the quadruplet imaging system distributes and optical centre satisfies certain rule, if that is: four circuit boards are with their the optical centre alignment back (being optical conjugate) that is stacked together, complete image planes that all photosurface of CCD is seamless filled fully.The all corresponding a part of true field of each CCD, so in fact whole CCD of native system quadruplet imaging system have constituted a complete and seamless big visual field.Visual field figure after quadruplet imaging system image is synthetic as shown in Figure 3, if promptly with the optical centre alignment of all circuit boards overlapping after, whole complete image planes of the seamless spliced one-tenth of photosurface of CCD.Whole CCD on all corresponding object space imaging viewing field of every CCD, four circuit boards have covered whole true fields, and a small amount of overlapping region is arranged.
Though four imaging lens are not coaxial installations, their optical axis can be parallel.Distance between the optical axis is by the decision of the overall dimension of imaging lens, but generally is far smaller than 1 meter, and for the taking photo by plane of hundreds of kilometer, remote sensing, the military surveillance system, such optical axis gap almost can be ignored for several kilometers of image-forming ranges.After each CCD obtains image, by follow-up software processes synthetic after, become a complete big view field imaging system.
Claims (5)
1. electro-optical system that realizes multiple CCD seamless splicing, it is characterized in that: comprise the quadruplet imaging system, every cover imaging system is made up of an imaging lens and a circuit board, the optical axis of all imaging lens is parallel, each circuit board is arranged on the image planes of its corresponding imaging lens, some CCD evenly are installed on the circuit board, the centre-to-centre spacing of adjacent two CCD is not more than 2 times of the actual sensitization width of each CCD image planes Width on the image planes Width, and greater than the package width of each CCD image planes Width; The centre-to-centre spacing of adjacent two CCD is not more than 2 times of the actual sensitization width of each CCD image planes short transverse on the image planes short transverse, and package width greater than each CCD image planes short transverse, four circuit boards imaging lens optical axis center corresponding with it is respectively to the four direction arranged in dislocation, whole CCD are full of whole image planes visual field behind the optical conjugate, and realization CCD's is seamless spliced.
2. the system as claimed in claim 1, it is characterized in that: in the first cover imaging system, the upper left side that is centered close to imaging lens A (1) image planes center of circuit board A (5), with imaging lens A (1) image planes center is initial point, be offset left along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, along the image planes short transverse upwards skew be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
3. the system as claimed in claim 1, it is characterized in that: in the second cover imaging system, the upper right side, imaging lens B (2) the image planes center that is centered close to of circuit board B (6), with imaging lens B (2) image planes center is initial point, be offset to the right along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, along the image planes short transverse upwards skew be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
4. the system as claimed in claim 1, it is characterized in that: in the 3rd cover imaging system, the lower left, imaging lens C (3) the image planes center that is centered close to of circuit board C (7), with imaging lens C (3) image planes center is initial point, be offset left along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, offset downward along the image planes short transverse and be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
5. the system as claimed in claim 1, it is characterized in that: in the quadruplet imaging system, the lower right, imaging lens D (4) the image planes center that is centered close to of circuit board D (8), with imaging lens D (4) image planes center is initial point, be offset to the right along the image planes Width and be not more than 1/2nd of the actual sensitization width of each CCD image planes Width, offset downward along the image planes short transverse and be not more than 1/2nd of the actual sensitization width of each CCD image planes short transverse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100690524A CN101068016A (en) | 2007-06-11 | 2007-06-11 | Photoelectric system for realizing multi-CCD seamless paste-up |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100690524A CN101068016A (en) | 2007-06-11 | 2007-06-11 | Photoelectric system for realizing multi-CCD seamless paste-up |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101068016A true CN101068016A (en) | 2007-11-07 |
Family
ID=38880505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100690524A Pending CN101068016A (en) | 2007-06-11 | 2007-06-11 | Photoelectric system for realizing multi-CCD seamless paste-up |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101068016A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100465699C (en) * | 2007-12-05 | 2009-03-04 | 浙江大学 | Electro-optical system for implementing multiple CCD seamless concatenation using prismatic decomposition vignetting compensation |
| CN101819375A (en) * | 2010-04-16 | 2010-09-01 | 浙江大学 | Total parallax three-dimensional display device |
| CN101867709A (en) * | 2010-05-17 | 2010-10-20 | 哈尔滨工业大学 | Spherical imaging device and imaging method thereof |
| CN101692447B (en) * | 2009-09-30 | 2011-02-02 | 浙江大学 | Multi-CCD super field of view image mosaic photoelectric system |
| CN102231793A (en) * | 2011-06-15 | 2011-11-02 | 中国科学院紫金山天文台 | Industrial split jointed charge coupled device (CCD) camera with extra large target surface |
| CN102231794A (en) * | 2011-06-15 | 2011-11-02 | 中国科学院紫金山天文台 | Equipment with multipath universal serial buses (USB) for acquiring charge coupled device (CCD) camera data |
| CN101650423B (en) * | 2009-09-11 | 2011-12-21 | 北京空间机电研究所 | Optical splicing method of large-array photoelectric device |
| CN103607532A (en) * | 2013-11-30 | 2014-02-26 | 中南林业科技大学 | Image pick-up system with integrated type camera lens and multiple image sensors |
| CN104238115A (en) * | 2014-09-15 | 2014-12-24 | 中国科学院上海光学精密机械研究所 | Combined type large-visual-field high-resolution photoelectronic imaging system |
| CN104301590A (en) * | 2014-09-28 | 2015-01-21 | 中国科学院长春光学精密机械与物理研究所 | Three-lens detector array video acquisition device |
| CN104317156A (en) * | 2014-09-28 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Concentric spherical objective lens detector spherical surface array video acquisition device |
| CN104320565A (en) * | 2014-09-28 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Multi-lens detector array curved image surface splicing method |
| CN105187698A (en) * | 2015-08-13 | 2015-12-23 | 南昌欧菲光电技术有限公司 | Dual-camera module assembling device and method |
| CN106813781A (en) * | 2016-12-21 | 2017-06-09 | 北京空间机电研究所 | A kind of super large area array compound splicing method of Infrared Detectors |
| CN106960442A (en) * | 2017-03-01 | 2017-07-18 | 东华大学 | Based on the infrared night robot vision wide view-field three-D construction method of monocular |
| CN107333036A (en) * | 2017-06-28 | 2017-11-07 | 驭势科技（北京）有限公司 | Binocular camera |
| CN107734220A (en) * | 2017-10-13 | 2018-02-23 | 中国科学院上海技术物理研究所 | A kind of polyphaser stares detection system and imaging joint method |
| CN109120826A (en) * | 2018-09-30 | 2019-01-01 | 北京空间机电研究所 | Visual field mixes joining method inside and outside a kind of large format camera |
-
2007
- 2007-06-11 CN CNA2007100690524A patent/CN101068016A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100465699C (en) * | 2007-12-05 | 2009-03-04 | 浙江大学 | Electro-optical system for implementing multiple CCD seamless concatenation using prismatic decomposition vignetting compensation |
| CN101650423B (en) * | 2009-09-11 | 2011-12-21 | 北京空间机电研究所 | Optical splicing method of large-array photoelectric device |
| CN101692447B (en) * | 2009-09-30 | 2011-02-02 | 浙江大学 | Multi-CCD super field of view image mosaic photoelectric system |
| CN101819375A (en) * | 2010-04-16 | 2010-09-01 | 浙江大学 | Total parallax three-dimensional display device |
| CN101819375B (en) * | 2010-04-16 | 2012-05-30 | 浙江大学 | Total parallax three-dimensional display device |
| CN101867709A (en) * | 2010-05-17 | 2010-10-20 | 哈尔滨工业大学 | Spherical imaging device and imaging method thereof |
| CN102231793A (en) * | 2011-06-15 | 2011-11-02 | 中国科学院紫金山天文台 | Industrial split jointed charge coupled device (CCD) camera with extra large target surface |
| CN102231794A (en) * | 2011-06-15 | 2011-11-02 | 中国科学院紫金山天文台 | Equipment with multipath universal serial buses (USB) for acquiring charge coupled device (CCD) camera data |
| CN103607532A (en) * | 2013-11-30 | 2014-02-26 | 中南林业科技大学 | Image pick-up system with integrated type camera lens and multiple image sensors |
| CN104238115A (en) * | 2014-09-15 | 2014-12-24 | 中国科学院上海光学精密机械研究所 | Combined type large-visual-field high-resolution photoelectronic imaging system |
| CN104301590A (en) * | 2014-09-28 | 2015-01-21 | 中国科学院长春光学精密机械与物理研究所 | Three-lens detector array video acquisition device |
| CN104317156A (en) * | 2014-09-28 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Concentric spherical objective lens detector spherical surface array video acquisition device |
| CN104320565A (en) * | 2014-09-28 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Multi-lens detector array curved image surface splicing method |
| CN104301590B (en) * | 2014-09-28 | 2017-06-09 | 中国科学院长春光学精密机械与物理研究所 | Three-lens detector array video acquisition device |
| CN104317156B (en) * | 2014-09-28 | 2017-06-09 | 中国科学院长春光学精密机械与物理研究所 | Homocentric sphere object lens detector spherical array video acquisition device |
| CN105187698A (en) * | 2015-08-13 | 2015-12-23 | 南昌欧菲光电技术有限公司 | Dual-camera module assembling device and method |
| CN106813781A (en) * | 2016-12-21 | 2017-06-09 | 北京空间机电研究所 | A kind of super large area array compound splicing method of Infrared Detectors |
| CN106813781B (en) * | 2016-12-21 | 2019-06-18 | 北京空间机电研究所 | A kind of super large area array compound splicing method of infrared detector |
| CN106960442A (en) * | 2017-03-01 | 2017-07-18 | 东华大学 | Based on the infrared night robot vision wide view-field three-D construction method of monocular |
| CN107333036A (en) * | 2017-06-28 | 2017-11-07 | 驭势科技（北京）有限公司 | Binocular camera |
| CN107734220A (en) * | 2017-10-13 | 2018-02-23 | 中国科学院上海技术物理研究所 | A kind of polyphaser stares detection system and imaging joint method |
| CN109120826A (en) * | 2018-09-30 | 2019-01-01 | 北京空间机电研究所 | Visual field mixes joining method inside and outside a kind of large format camera |
| CN109120826B (en) * | 2018-09-30 | 2021-02-09 | 北京空间机电研究所 | Method for splicing inner and outer view fields of large-format camera in mixed mode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101068016A (en) | Photoelectric system for realizing multi-CCD seamless paste-up | |
| CN100465699C (en) | Electro-optical system for implementing multiple CCD seamless concatenation using prismatic decomposition vignetting compensation | |
| US9769458B2 (en) | Multi-aperture device and method for detecting an object region | |
| CN104317156B (en) | Homocentric sphere object lens detector spherical array video acquisition device | |
| CN104601953B (en) | A kind of video image fusion processing system | |
| US20080297612A1 (en) | Image pickup device | |
| CN103115685B (en) | Infrared multi-detector combined detecting device and infrared detecting method | |
| WO2007014293A1 (en) | Digital imaging system and method to produce mosaic images | |
| US11024010B2 (en) | Super-resolution image sensor and producing method thereof | |
| CN101042525A (en) | Omni-directional stereo camera and method of controlling thereof | |
| US20220172380A1 (en) | Three-dimensional light field technology-based optical unmanned aerial vehicle monitoring system | |
| CN104574332A (en) | Image fusion method for airborne optoelectronic pod | |
| CN203163728U (en) | Multi-spectral light field camera | |
| CN104301590B (en) | Three-lens detector array video acquisition device | |
| CN101692447B (en) | Multi-CCD super field of view image mosaic photoelectric system | |
| CN112040140A (en) | Wide-view-field high-resolution hybrid imaging device based on light field | |
| CN204964860U (en) | Optical lens | |
| CN106842492B (en) | Space optical remote sensor focal plane multimirror splicing construction | |
| CN101329453A (en) | Large visual field high resolution imaging apparatus based on optical fiber and split joint method thereof | |
| CN115375549A (en) | Multi-camera image splicing algorithm design for multi-wrapping separation system | |
| CN112037132A (en) | Multi-aperture compact multi-spectral imaging system and deep learning image super-resolution reconstruction method | |
| CN207460354U (en) | Seven camera lens unmanned plane panoramic cameras | |
| CN107850775B (en) | Image forming apparatus with a plurality of image forming units | |
| CN107613168A (en) | A kind of high-resolution panorama night vision system based on deformation eyepiece and OLED micro-displays | |
| US20230266171A1 (en) | Method for seamlessly splicing based on three lenses and area array detectors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |