CN101067212A - Electrolytic copper foil surface low-coarsing processing method - Google Patents
Electrolytic copper foil surface low-coarsing processing method Download PDFInfo
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- CN101067212A CN101067212A CN 200710200110 CN200710200110A CN101067212A CN 101067212 A CN101067212 A CN 101067212A CN 200710200110 CN200710200110 CN 200710200110 CN 200710200110 A CN200710200110 A CN 200710200110A CN 101067212 A CN101067212 A CN 101067212A
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Abstract
The present invention discloses one low roughening treatment process for the surface of electrolytic copper foil. The low roughening treatment process is one multiple stage DC electrodeposit process including four stages with different electrolytes and electrodeposit parameters. The electrolytic copper foil through the low roughening treatment process has surface roughness not greater than 3 micron, thickness of 18 micron, peel strength not lower than 1.2 kg/cm, and no oxidation after being set at high temperature of 260 deg.c for 30 min. The low roughening treatment process is environment friendly and low in cost.
Description
Technical field:
The present invention relates to a kind of low roughening treatment technology in surface of the electrolytic copper foil as the base electronic material, belong to the electrolytic copper foil surface processing technology field.
Background technology:
Copper Foil can be divided into rolled copper foil and electrolytic copper foil according to the production technique branch.Electrolytic copper foil is used for the production of rigidity copper-clad plate more, and then makes the rigidity printed circuit board.The density of rolled copper foil is higher, and the surface is comparatively level and smooth, is beneficial to the signal of making behind the printed circuit board and transmits fast, therefore transmits at high-frequency high-speed, also uses some rolled copper foils on the printed circuit board of fine-line.But the manufacturing cost of rolled copper foil is far longer than electrolytic copper foil, in addition because the restriction of processing condition makes the fabric width of Copper Foil be restricted.Present global electrolytic copper foil product is still based on 1oz (35 μ m) and 1/2oz (18 μ m), along with 3G products such as electronics, information and communication all develop towards wireless penetration, portability direction, every high-performance for product also strides forward toward the target of " light, thin, short, little ", and electronic product also obviously increases the demand of the thin copper foil of 1/2oz (18 μ m), 3/8oz (12 μ m).At present additive has all been adopted in the low roughening treatment in the surface of electrolytic copper foil, contained poisonous elements such as arsenic, selenium in the general additive, all harmful to environment and human body, and because this type of metal price height certainly will cause increasing of cost.Therefore adopt cost method cheap relatively and more environmental protection that the low roughening treatment that electrolytic copper foil carries out hair side is had and important meaning.
Summary of the invention:
The objective of the invention is, a kind of surface low-coarsing processing method of new electrolytic copper foil is provided.The present invention is a reasonable disposition of taking electrolytic solution and electro-deposition process parameter, and the hair side of electrolytic copper foil is hanged down roughening treatment.The present invention can make hair side surfaceness RZ≤3 μ m, realizes reducing the hair side roughness, reduces the relative thickness of Copper Foil, improves the purpose of oxidation susceptibility.The present invention can realize asepsis environment-protecting production, and reduces production costs.
The present invention realizes like this.The surface low-coarsing processing method of electrolytic copper foil, characteristics are to take dc electrodeposition technology, take the cooperation of different electrolyte combination and electro-deposition process parameter to handle in electrolyzer by four-stage, and roughening treatment is hanged down on the surface of electrolytic copper foil; That is: in the alligatoring copper stage, take copper concentration 16～24g/L, H
2SO
4Concentration 80～120g/L, T20～25 ℃, electrolysis density 1500～2500A/m
2Solidify the copper stage, take copper concentration 55～70g/L, H
2SO
4Concentration 60～80g/L, T35～50 ℃, electrolysis density 500～1000A/m
2In the zinc-plated stage, take zinc concentration 18～25g/L, nickel concentration 1～5g/L, T20～29 ℃, electrolysis density 600～1000A/m
2Chrome plating treatment is taked chromium concn 1～2g/L, zinc concentration 0.2～1.0g/L, T23～25 ℃, electrolysis density 10～20A/m
2
In the surface low-coarsing processing method of above-mentioned electrolytic copper foil, the alligatoring copper stage is divided three sections given electric current depositions of difference; Solidify the given electric currents deposition of two sections differences of copper stage branch; The zinc-plated stage is divided two sections given electric current depositions of difference; Chrome plating treatment is divided two sections given electric current depositions of difference.
In the surface low-coarsing processing method of aforesaid electrolytic copper foil, three sections given electric currents in alligatoring copper stage are 2500A, 1500A and 2500A; Two sections given electric currents that solidify the copper stage are 500～600A and 800～1000A; Two sections given electric currents in zinc-plated stage are 600～800A and 800～1000A; Two sections given electric currents of chrome plating treatment are 10～15A and 15A～20A.
Owing to adopted above technical scheme, the whole process of the present invention is taked dc electrodeposition technology, electrolyte combination and electro-deposition process parameter are carried out reasonable disposition, through after the low roughening treatment of the present invention, the hair side surfaceness Rz of this electrolytic copper foil≤3 μ m, can realize that thickness is the goods of 18 μ m, at this moment its peel strength 〉=1.3kg/cm; Can also realize that thickness is the goods of 12 μ m, its peel strength 〉=1.2kg/cm; And through after the processing of the technology of the present invention means, 260 ℃ of high temperature, non-oxidation phenomenon under the 30min condition (international standard is 180 ℃ of 1h non-oxidation phenomenons), general electrolytic copper foil high temperature oxidation destructive test is 225 ℃, 30min.Because the present invention does not adopt additive, in whole low roughening treatment process, toxic substances such as arsenic, selenium can not occur in addition, realize the process environments of asepsis environment-protecting, so not only reduce cost, also help the realization Sustainable development.The present invention has mainly adopted dc electrodeposition technology, is simple and easy to realize.
Embodiment:
Embodiments of the invention: whole process is taked dc electrodeposition technology, and by taking different electrolyte combination and electro-deposition process parameter in the four-stage, its technological process is as follows:
In electrolyzer, add copper concentration 18～21g/L, H earlier
2SO
4The electrolytic solution of concentration 100～110g/L, temperature T adopts 21～23 ℃, electrolysis density 2300～2500A/m
2Electrolytic condition, divide three sections given electric currents (2500A, 1500A and 2500A) depositions, be the alligatoring copper stage; Enter then and solidify the copper stage, add copper concentration 60～66g/L in the electrolyzer, H
2SO
4Concentration 65～72g/L takes 38～42 ℃ of temperature T, electrolysis density 800～950A/m
2Electrolytic condition, divide two sections given electric currents (500～600A, 800～1000A) deposition; Phase III is the plating Zn stage, adds zinc concentration 20～23g/L, and nickel concentration 2～3g/L takes 24～26 ℃ of temperature T, electrolysis density 750～880A/m
2Electrolytic condition, divide two sections given electric currents (600～800A, 800～1000A) deposition; Final stage is the plating Cr stage, adds chromium concn 1～2g/L, and zinc concentration 0.4～0.8g/L takes 23～25 ℃ of temperature T, electrolysis density 15～18A/m
2Electrolytic condition, divide two sections given electric currents (deposition of 10～15A, 15A～20A).
By the segmented deposition of above four different stepss, can make and the hair side surfaceness Rz≤3 μ m of electrolytic copper foil can realize that thickness is the goods of 18 μ m, this moment its peel strength 〉=1.3kg/cm; Can also realize that thickness is the thin goods of 12 μ m, its peel strength 〉=1.2kg/cm; And through after the processing of the technology of the present invention means, 260 ℃ of high temperature, non-oxidation phenomenon under the 30min condition (international standard is 180 ℃ of 1h non-oxidation phenomenons), general electrolytic copper foil high temperature oxidation destructive test is 225 ℃ of 30min.Compared with prior art, after the technology of the present invention means are handled, electrolytic copper foil has not only had the low roughness of treated side Rz≤3 μ m, high performance 18 μ m have also been realized, even the thin goods of 12 μ m, the development trend that has met modern electrolytic copper foil has guaranteed the peel strength of goods and more excellent oxidation susceptibility simultaneously again; The present invention owing to do not contain poisonous additive, therefore than prior art environmental protection more, and has reduced cost in implementation procedure in addition, helps realizing Sustainable development, also has the present invention mainly to adopt dc electrodeposition technology, is simple and easy to realize.
Claims (3)
1. the surface low-coarsing processing method of electrolytic copper foil, take dc electrodeposition technology, it is characterized in that: in electrolyzer, take the cooperation of different electrolyte combination and electro-deposition process parameter to handle by four-stage, roughening treatment is hanged down on the surface of electrolytic copper foil; That is: in the alligatoring copper stage, take copper concentration 16～24g/L, H2SO4 concentration 80～120g/L, T20～25 ℃, electrolysis density 1500～2500A/m2; Solidify the copper stage, take copper concentration 55～70g/L, H2SO4 concentration 60～80g/L, T35～50 ℃, electrolysis density 500～1000A/m2; In the zinc-plated stage, take zinc concentration 18～25g/L, nickel concentration 1～5g/L, T20～29 ℃, electrolysis density 600～1000A/m2; Chrome plating treatment is taked chromium concn 1～2g/L, zinc concentration 0.2～1.0g/L, T23～25 ℃, electrolysis density 10～20A/m2.
2. the surface low-coarsing processing method of electrolytic copper foil according to claim 1 is characterized in that: the given electric currents deposition of three sections differences of alligatoring copper stage branch; Solidify the given electric currents deposition of two sections differences of copper stage branch; The zinc-plated stage is divided two sections given electric current depositions of difference; Chrome plating treatment is divided two sections given electric current depositions of difference.
3. the surface low-coarsing processing method of electrolytic copper foil according to claim 2, it is characterized in that: three sections given electric currents in alligatoring copper stage are 2500A, 1500A and 2500A; Two sections given electric currents that solidify the copper stage are 500～600A and 800～1000A; Two sections given electric currents in zinc-plated stage are 600～800A and 800～1000A; Two sections given electric currents of chrome plating treatment are 10～15A and 15A～20A.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200710200110A CN100591809C (en) | 2007-01-25 | 2007-01-25 | Electrolytic copper foil surface low-coarsing processing method |
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| CN200710200110A CN100591809C (en) | 2007-01-25 | 2007-01-25 | Electrolytic copper foil surface low-coarsing processing method |
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| CN101067212A true CN101067212A (en) | 2007-11-07 |
| CN100591809C CN100591809C (en) | 2010-02-24 |
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Cited By (8)
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|---|---|---|---|---|
| CN101962789A (en) * | 2010-09-30 | 2011-02-02 | 湖北中科铜箔科技有限公司 | Electrolytic copper foil for high-power LED flexible circuit board and preparation method thereof |
| CN102212853A (en) * | 2011-04-30 | 2011-10-12 | 山东金宝电子股份有限公司 | Surface treatment coarsening process for improving peel strength of copper foil |
| CN102586831A (en) * | 2012-03-12 | 2012-07-18 | 山东金宝电子股份有限公司 | Surface treatment process for reducing roughness of electrolytic copper foil |
| CN103469267A (en) * | 2013-08-07 | 2013-12-25 | 江西铜业股份有限公司 | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same |
| CN105163518A (en) * | 2015-08-28 | 2015-12-16 | 灵宝华鑫铜箔有限责任公司 | Method for improving anti-stripping value between copper foil and base material |
| TWI630289B (en) * | 2015-07-03 | 2018-07-21 | 三井金屬鑛業股份有限公司 | Roughened copper foil, copper laminated board and printed circuit board |
| CN113943954A (en) * | 2021-12-01 | 2022-01-18 | 青海诺德新材料有限公司 | Preparation method of 2-3 micron pinhole-free carrier electrolytic copper foil |
| CN117156708A (en) * | 2023-10-30 | 2023-12-01 | 江苏汉印机电科技股份有限公司 | Surface treatment equipment for copper foil of copper-clad plate before solder resist spray printing |
-
2007
- 2007-01-25 CN CN200710200110A patent/CN100591809C/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101962789B (en) * | 2010-09-30 | 2013-01-23 | 湖北中科铜箔科技有限公司 | Electrolytic copper foil for high-power LED flexible circuit board and preparation method thereof |
| CN101962789A (en) * | 2010-09-30 | 2011-02-02 | 湖北中科铜箔科技有限公司 | Electrolytic copper foil for high-power LED flexible circuit board and preparation method thereof |
| CN102212853A (en) * | 2011-04-30 | 2011-10-12 | 山东金宝电子股份有限公司 | Surface treatment coarsening process for improving peel strength of copper foil |
| CN102586831B (en) * | 2012-03-12 | 2014-11-19 | 山东金宝电子股份有限公司 | Surface treatment process for reducing roughness of electrolytic copper foil |
| CN102586831A (en) * | 2012-03-12 | 2012-07-18 | 山东金宝电子股份有限公司 | Surface treatment process for reducing roughness of electrolytic copper foil |
| CN103469267B (en) * | 2013-08-07 | 2015-11-25 | 江西省江铜-耶兹铜箔有限公司 | A kind of processing method of surface-treated electro-deposited copper foil and the Copper Foil of process thereof |
| CN103469267A (en) * | 2013-08-07 | 2013-12-25 | 江西铜业股份有限公司 | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same |
| TWI630289B (en) * | 2015-07-03 | 2018-07-21 | 三井金屬鑛業股份有限公司 | Roughened copper foil, copper laminated board and printed circuit board |
| CN105163518A (en) * | 2015-08-28 | 2015-12-16 | 灵宝华鑫铜箔有限责任公司 | Method for improving anti-stripping value between copper foil and base material |
| CN105163518B (en) * | 2015-08-28 | 2018-06-29 | 灵宝华鑫铜箔有限责任公司 | A kind of method for improving antistripping value between copper foil and base material |
| CN113943954A (en) * | 2021-12-01 | 2022-01-18 | 青海诺德新材料有限公司 | Preparation method of 2-3 micron pinhole-free carrier electrolytic copper foil |
| CN117156708A (en) * | 2023-10-30 | 2023-12-01 | 江苏汉印机电科技股份有限公司 | Surface treatment equipment for copper foil of copper-clad plate before solder resist spray printing |
| CN117156708B (en) * | 2023-10-30 | 2024-01-23 | 江苏汉印机电科技股份有限公司 | Surface treatment equipment for copper foil of copper-clad plate before solder resist spray printing |
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|---|---|
| CN100591809C (en) | 2010-02-24 |
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