CN101062491A - Fluid ejecting device and method for making the same - Google Patents
Fluid ejecting device and method for making the same Download PDFInfo
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- CN101062491A CN101062491A CN 200610080102 CN200610080102A CN101062491A CN 101062491 A CN101062491 A CN 101062491A CN 200610080102 CN200610080102 CN 200610080102 CN 200610080102 A CN200610080102 A CN 200610080102A CN 101062491 A CN101062491 A CN 101062491A
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- ejection apparatus
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- fluid ejection
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Abstract
The invention relates to a fluid spray device. Firstly, it forms a patterned sacrifice layer on the liner, a plating starting layer, at least covering the patterned sacrifice layer. It forms structural layer on the plating start layer and the liner, figuring the structural layer to form spray holes. Then, remove the plating starting layer inside the spray hole and the sacrifice layer to form a fluid cavity. Then, form into a structural protective layer with selective coating structure and plating starting layer.
Description
Technical field
The present invention relates to a kind of fluid ejection apparatus and manufacture method thereof, more particularly, relate to a kind of micro-fluid ejecting device and manufacture method thereof.
Background technology
Micro-fluid ejecting device has been widely used in IT industry recently, for example in ink-jet printer or the similar devices.Progressively exploitation along with micro-system engineering (micro system engineering), this fluid ejection apparatus has the application of other various fields gradually, for example fuel injection system (fuel injectionsystem), cell screening (cell sorting), drug delivery system (drug delivery system), spray printing photoetching technique (print lithography) and micro-injection propulsion system (micro jet propulsionsystem) etc.
Fig. 1 discloses a kind of known fluid ejection apparatus 100, please refer to Fig. 1, in substrate 102, be formed with fluid cavity 104 and fluid passage 106, on substrate 102, then form and electroplate initial layers 108, and electroplate and form structure sheaf 110 on the initial layers 108, yet, in this structure, it is exposed and touch the ink of being filled still to have parcel plating initial layers 108 in spray orifice 112 and fluid cavity 104, and it can cause electroplating initial layers 108 and be corroded by ink and make ink rotten or electroplating initial layers 108 peels off.
Summary of the invention
According to the problems referred to above, the purpose of this invention is to provide a kind of fluid ejection apparatus and manufacture method thereof, overcome plating initial layers and structure sheaf and corroded the relevant issues that produced, thereby obtain the ink discharge device that stability is higher and the life-span is long by ink.
Therefore, according to above-mentioned purpose, the invention provides a kind of manufacture method of fluid ejection apparatus.At first, on substrate, form patterned sacrificial layers, form and electroplate initial layers, coat patterned sacrificial layers at least.Thereafter, form structure sheaf on plating initial layers and substrate, the patterned structures layer is to form spray orifice.Then, remove the plating initial layers in the spray orifice, remove sacrifice layer, to form fluid cavity.Follow-up, the structure protective layer of formation selectivity clad structure layer and plating initial layers.
The invention provides a kind of manufacture method of fluid ejection apparatus.At first, form patterned sacrificial layers on substrate, form and electroplate initial layers, coat patterned sacrificial layers at least, wherein electroplating initial layers is the titanium copper composite bed.Thereafter, form structure sheaf on plating initial layers and substrate, the patterned structures layer is to form spray orifice.Next, remove the plating initial layers in the spray orifice, patterned substrate back crystal face exposes sacrifice layer to form the fluid passage.Follow-up; remove sacrifice layer, to form fluid cavity, electroless plating structure protective layer clad structure layer and plating initial layers; and insert between the two interface, wherein structure protective layer comprises direct contact structures layer and electroplates the nickel metal layer of initial layers and be positioned at gold metal layer on the nickel metal layer.
The invention provides a kind of fluid ejection apparatus, comprising: be positioned on the substrate to form the structure sheaf of fluid cavity, this structure sheaf comprises spray orifice; Be positioned at the plating initial layers on the inwall of fluid cavity; And the structure protective layer with chemical stability, this structure protective layer over-plated initial layers, structure sheaf and both interfaces.
Description of drawings
Fig. 1 discloses a kind of known fluid ejection apparatus;
Fig. 2 A～2F discloses the manufacture method of the fluid ejection apparatus of one embodiment of the invention.
The main element description of reference numerals:
100～fluid ejection apparatus; 102～substrate;
104～fluid cavity; 106～fluid passage;
108～plating initial layers; 110～structure sheaf;
112～spray orifice; 200～substrate;
201～the first; 202～control grid;
204～gate dielectric layer; 206～the first conductive layers;
207～source electrode; 209～drain electrode;
213～fluid control elements; 215～heating element heater;
217～contact mat; 216～resistive layer;
218～the second conductive layers; 220～passivation layer;
222～coat of metal; 224～sacrifice layer;
226～plating initial layers; 228～photoresist layer;
230～structure sheaf; 232～spray orifice;
234～fluid passage; 236～fluid cavity;
238～structure protective layer; 240～structure sheaf and plating initial layers interface.
The specific embodiment
To describe embodiment below in detail with as reference of the present invention, and the accompanying drawings example.At accompanying drawing or in describing, the similar or identical identical Reference numeral of part use.In the accompanying drawings, the shape of embodiment or thickness can enlarge, to simplify or convenient the sign.To describe the part of each element of explanation in the accompanying drawing respectively, it should be noted that the element that does not illustrate among the figure or describe, can have the various forms of well known to a person skilled in the art.In addition, when narration layer was positioned at substrate or another layer and goes up, this layer can be located immediately on substrate or another layer, perhaps the intermediate layer can also be arranged therebetween.
Fig. 2 A～2F is the technology cross-sectional schematic that discloses the fluid ejection apparatus of one embodiment of the invention, at first, please refer to Fig. 2 A, substrate 200 is provided, substrate 200 comprises silicon, glass and/or other material, preferably, substrate 200 is silicon substrates, thereafter, on substrate 200, form the control grid 202 that polysilicon for example or metal are formed, then, form for example first dielectric layer 204, Coverage Control grid 202 and the part substrate 200 of silica, silicon nitride or silicon oxynitride composition.Follow-up, on gate dielectric layer 204 and part substrate 200, form first conductive layer 206 of aluminium for example or copper, wherein, first conductive layer 206 that is positioned at control grid 202 both sides can be used separately as source electrode 207 and drain electrode 209, and control grid 202 and interlock circuit thereof are the fluid control elements 213 of the fluid ejection apparatus of present embodiment.
Then, on part first conductive layer 206, first dielectric layer 204 and substrate 200, form for example second dielectric layer 208 of silica, silicon nitride or silicon oxynitride composition, be noted that, the drain electrode 209 of second dielectric layer 208 expose portions, first conductive layer 206 and part, with as connector (via), follow-up, forming resistive layer 216 covers on part first conductive layer 206 and the part source electrode 207, then, form second conductive layer 218 of aluminium for example or copper on resistive layer 216, wherein second conductive layer 218 and resistive layer 216 closely link.Follow-up, with graphical second conductive layer 218 of for example lithography technology and resistive layer 216, then, second conductive layer 218 in patterning heating element heater district, make part resistive layer 216 exposed, so, resistive layer 216 and first conductive layer 206 under it constitute heating element heater 215.Thereafter; on second conductive layer 218 and resistive layer 216, form the passivation layer 220 that for example comprises SiC and SiN; and on the resistive layer 216 of heating element heater 215, form for example coat of metal 222 of Ta composition, and follow-up, thus patterned passivation layer 220 forms contact mats 217.
Next,, and carry out little shadow definition step, on first 201 of substrate, form patterned sacrifice layer 224, be the face identical in the present embodiment for first 201 with fluid control elements 213 via for example deposition or coating.Sacrifice layer 224 can by the dielectric layer of for example oxide or for example the macromolecule layer of photoresist and/or polymer form, the thickness of sacrifice layer 224 can be between 2 μ m～100 μ m.
Follow-up, please refer to Fig. 2 B, vapour deposition method or sputtering method with for example physical vaporous deposition (PVD), on passivation layer 220 and sacrifice layer 224, form and electroplate initial layers 226, electroplate initial layers 226 and need good tack be arranged with the sacrifice layer 224 under it, preferably, electroplate initial layers 226 and can comprise titanium coating and the copper metal layer that is positioned on the titanium coating, titanium is used to strengthen the adhesive force of metal and wafer surface, thickness is preferably less than 1000 dusts, the copper metal is used for playing electroplates initial effect, and thickness is about 2000 dusts～8000 dusts.In addition, electroplate initial layers 226 and also can comprise titanium coating and the nickel metal layer that is positioned on the titanium coating.
Next, please refer to Fig. 2 C,, form the photoresist layer 228 of patterning with method of spin coating and follow-up lithography process, the photoresist layer 228 of patterning covers the position of electroplating the predetermined formation spray orifice on the initial layers 226, and the zone beyond the predetermined formation structure sheaf.
Then, use electro-plating method, on plating initial layers 226, form for example structure sheaf 230 of nickel, in electroplate liquid, can not produced reaction by the part that aforementioned photic resist layer 228 covers owing to electroplate initial layers 226, therefore, in electroplating technology, structure sheaf 230 can be formed on electroplates the part that initial layers 226 is not covered by photoresist layer 228, and wherein the thickness of structure sheaf 230 can be between 5 μ m～100 μ m.Follow-up, please refer to Fig. 2 D, remove above-mentioned photoresist layer 228 with development, remover (stripper) or plasma ashing, and after removing above-mentioned photoresist layer 228, can in structure sheaf 230, form spray orifice 232, then, can remove plating initial layers 226 in the spray orifice 232 with engraving method.Be noted that at this, though the present invention discloses the above-mentioned photoresist layer 228 that removes to form the method for spray orifice 232, the invention is not restricted to this, the present invention also can form structure sheaf 230 earlier, carry out the graphical structure sheaf 230 of lithography step again, to define spray orifice 232.In a preferred embodiment of the invention, the thickness of structure sheaf is substantially between 10 μ m～100 μ m.
Then, please refer to Fig. 2 E, carry out for example lithography method, or the method that sandblasts, second 203 of patterned substrate, thereby form fluid passage 234, expose sacrifice layer 224, afterwards, via fluid passage 234, remove sacrifice layer 224 with engraving method, thereby form the fluid cavity 236 of communication of fluid passage 234.When sacrifice layer 224 is made of macromolecule, can remove the sacrifice layer 224 that macromolecule constitutes with plasma ashing method or with remover (stripper).The invention is not restricted to this, that is, the sequence of steps that forms fluid channel 234 is commutative, for example, can remove sacrifice layer 224 via spray orifice 232 earlier, and afterwards, second 203 at substrate forms fluid passage 234 again.
Next; please refer to Fig. 2 F; carry out electroless plating; form for example structure protective layer 238 of 3000 dusts～8000 dusts; optionally clad structure layer 230, the plating initial layers 226 that exposes and/or both interfaces 240; be noted that structure protective layer 238 needs for structure sheaf 230 and electroplate initial layers 226 to have good tack.The technology that forms structure protective layer 238 can comprise the following steps: at first; on structure sheaf 230 and exposed plating initial layers 226, plate one deck nickel metal layer with electroless process; follow-up; on nickel metal layer, plate one deck gold metal layer with electroless process; the nickel metal layer of structure protective layer 238 and structure sheaf 230 have good tack, and gold metal layer then has good chemical stability.
Therefore; according to the abovementioned embodiments of the present invention; structure sheaf 230, plating initial layers 226 and/or both interfaces 240 all are coated with the structure protective layer 238 with good chemical stability; make structure in fluid cavity 236 and the fluid channel 234 contact nextpage and can not corroded, and obtain the ink discharge device that stability is higher and the life-span is grown at long-time ink.
Though disclosed the present invention with preferred embodiment; but it is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; can carry out some changes and retouching, so protection scope of the present invention should be as the criterion with the scope of appended claim definition.
Claims (20)
1. the manufacture method of a fluid ejection apparatus comprises:
Substrate is provided;
On this substrate, form patterned sacrificial layers;
Form and electroplate initial layers, coat this patterned sacrificial layers at least;
On this plating initial layers and this substrate, form structure sheaf;
Graphical this structure sheaf, thus spray orifice formed;
Remove the described plating initial layers in this spray orifice; Remove this sacrifice layer, thereby form fluid cavity; And
Form the structure protective layer that selectivity coats this structure sheaf and this plating initial layers.
2. the manufacture method of fluid ejection apparatus as claimed in claim 1, wherein this structure protective layer has chemical stability.
3. the manufacture method of fluid ejection apparatus as claimed in claim 1, wherein this plating initial layers comprises titanium coating and is positioned at copper metal layer on this titanium coating.
4. the manufacture method of fluid ejection apparatus as claimed in claim 1, wherein this structure protective layer has good tack for this structure sheaf and this plating initial layers.
5. the manufacture method of fluid ejection apparatus as claimed in claim 1, wherein this structure protective layer comprises the nickel metal layer of this structure sheaf of direct contact and this plating initial layers and is positioned at gold metal layer on this nickel metal layer.
6. the step that the manufacture method of fluid ejection apparatus as claimed in claim 1, wherein said formation selectivity coat the structure protective layer of this structure sheaf and this plating initial layers is to adopt electroless plating.
7. the manufacture method of fluid ejection apparatus as claimed in claim 1, wherein this structure sheaf is made of the nickel metal.
8. the manufacture method of fluid ejection apparatus as claimed in claim 1 also comprises graphical this substrate, to form the fluid passage, is communicated with this fluid cavity.
9. the manufacture method of fluid ejection apparatus as claimed in claim 1, also was included in and forms the fluid driving element on this substrate before forming the step of patterned sacrificial layers on this substrate described.
10. the manufacture method of a fluid ejection apparatus comprises:
Substrate is provided;
On this substrate, form patterned sacrificial layers;
Form and electroplate initial layers, coat this patterned sacrificial layers at least, wherein this plating initial layers is the titanium copper composite bed;
On this plating initial layers and this substrate, electroplate structure sheaf;
Graphical this structure sheaf, thus spray orifice formed;
Remove the described plating initial layers in this spray orifice;
Graphical this substrate exposes this sacrifice layer thereby form the fluid passage;
Remove this sacrifice layer, thereby form fluid cavity; And
The electroless plating structure protective layer; this structure protective layer coats this structure sheaf and this plating initial layers; and insert between the two interface, wherein this structure protective layer comprises the nickel metal layer of this structure sheaf of direct contact and this plating initial layers and is positioned at gold metal layer on this nickel metal layer.
11. the manufacture method of fluid ejection apparatus as claimed in claim 10, wherein this patterned sacrificial layers is made of macromolecule.
12. the manufacture method of fluid ejection apparatus as claimed in claim 10, wherein this structure sheaf is made of the nickel metal.
13. a fluid ejection apparatus comprises:
Substrate;
Structure sheaf forms fluid cavity thereby be positioned on this substrate, wherein this structure sheaf comprises spray orifice;
Electroplate initial layers, be positioned on the inwall of this fluid cavity; And
Structure protective layer with chemical stability, this structure protective layer coat this plating initial layers, this structure sheaf and both interfaces.
14. fluid ejection apparatus as claimed in claim 13, wherein this plating initial layers comprises titanium coating and the copper metal layer that is positioned on this titanium coating.
15. fluid ejection apparatus as claimed in claim 13, wherein this structure protective layer has good tack for this structure sheaf and this plating initial layers.
16. fluid ejection apparatus as claimed in claim 13, wherein this structure protective layer comprises the nickel metal layer of this structure sheaf of direct contact and this plating initial layers and is positioned at gold metal layer on this nickel metal layer.
17. fluid ejection apparatus as claimed in claim 13, wherein this structure sheaf is made of the nickel metal.
18. fluid ejection apparatus as claimed in claim 13, wherein this substrate is a silicon substrate.
19. fluid ejection apparatus as claimed in claim 13 also comprises the fluid drive apparatus that is positioned on this substrate.
20. fluid ejection apparatus as claimed in claim 13 wherein also comprises the fluid passage, is arranged in this substrate, is communicated with this fluid cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610080102 CN101062491A (en) | 2006-04-28 | 2006-04-28 | Fluid ejecting device and method for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610080102 CN101062491A (en) | 2006-04-28 | 2006-04-28 | Fluid ejecting device and method for making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101062491A true CN101062491A (en) | 2007-10-31 |
Family
ID=38963897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610080102 Pending CN101062491A (en) | 2006-04-28 | 2006-04-28 | Fluid ejecting device and method for making the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101062491A (en) |
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2006
- 2006-04-28 CN CN 200610080102 patent/CN101062491A/en active Pending
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