CN101049778A - Card with tessera, and fabricating method - Google Patents

Card with tessera, and fabricating method Download PDF

Info

Publication number
CN101049778A
CN101049778A CN200610072603.8A CN200610072603A CN101049778A CN 101049778 A CN101049778 A CN 101049778A CN 200610072603 A CN200610072603 A CN 200610072603A CN 101049778 A CN101049778 A CN 101049778A
Authority
CN
China
Prior art keywords
insert
sandwich layer
film
card
lamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200610072603.8A
Other languages
Chinese (zh)
Other versions
CN100556708C (en
Inventor
吴纯
王琳
杜时明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongchao Credit Card Industry Development Co ltd
China Banknote Printing and Minting Group Co Ltd
Original Assignee
China Banknote Printing and Minting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Banknote Printing and Minting Corp filed Critical China Banknote Printing and Minting Corp
Priority to CN200610072603.8A priority Critical patent/CN100556708C/en
Publication of CN101049778A publication Critical patent/CN101049778A/en
Application granted granted Critical
Publication of CN100556708C publication Critical patent/CN100556708C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Credit Cards Or The Like (AREA)

Abstract

A card with an embedded object is prepared through providing a laminated substrate layer, coating the laminating oil on its both surfaces, perforating on said substrate according to the sizes of said object to be embedded, embedding the object in the hole on substrate, generating a PC film layer on at least one surface of substrate, dot fusing, laminating, and die cutting to obtain cards.

Description

The card and the manufacture method thereof that have insert
Technical field
The present invention relates to a kind of card and manufacture method thereof that has insert, relate in particular to and a kind ofly having the manufacture method of covering the PC film on the card of insert and the card of inlaying that is covered with the PC film by this method manufacturing.
Background technology
At present, for example bank card, VIP card and storing-up card, souvenir card etc. are widely used various cards.Common jig has following structure: two-layer up and down is transparent overlay film layer, and the internal layer that blocks is played protection and waterproof effect; The centre is a sandwich layer, and it adopts the PVC material as substrate as the important component part of card usually, adopts the method for flat stamping or silk-screen, can be at the lower surface printed patterns of the upper surface of last sandwich layer and following sandwich layer or literal etc.; Magnetic stripe and signature strip are attached to down the lower surface of transparent overlay film layer, and hologram is attached to the upper surface of transparent overlay film layer.In the prior art, the manufacture process of card generally includes following four steps: printing-pressure Ka-Qie Ka-thermoprint.Printing is arrives the surface of sandwich layer up and down with pattern or text printout; Press card be with sandwich layer and transparent up and down overlay film up and down stacked put neat, compress; Cutting card is many cards that connect together is cut into single card; Thermoprint is the surface that signature strip, hologram pattern etc. is imprinted on transparent overlay film layer by high temperature.
In being the Chinese patent of CN1167069, publication number introduced a kind of souvenir card that has insert.As shown in Figure 1, souvenir 3 (can be gold, silver noble metal or jewellery etc.) is embedded in the hole 2 that the hard sheet 1 in plane has, and at hard sheet surface coverage thin layer 4 (being generally the PVC film) souvenir is wrapped up.Yet, simple storing-up card can not satisfy the individual demand of people to blocking in recent years, except can inlaying the trove for example precious metal material such as gold, silver or bijouterie material etc. that meets individual demand in card, people also wish to prevent for a long time the oxidation of insert, keep its high gloss and texture for a long time; And can on insert, process (for example laser imaging etching) and go out to meet the pattern of consumer self sexual demand or literal etc.But existing manufacturing process and the card that has an insert all can't satisfy the demand of people, therefore, will be very favourable if a kind of design and fabrication technology that satisfies the card of the demand can be provided.
Summary of the invention
In order to overcome above-mentioned the problems of the prior art, the object of the present invention is to provide a kind ofly having the manufacture method of covering the PC film on the card of insert and the card of inlaying that is covered with the PC film by this method manufacturing.
According to a first aspect of the invention, a kind of manufacture method that has the card of insert may further comprise the steps: 1) provide the lamination sandwich layer of card, at the double spread lamination oil of described sandwich layer; 2) according to size machining hole on the sandwich layer that is coated with lamination oil of insert; 3) described insert is embedded in the described hole on the sandwich layer; 4) described sandwich layer and insert at least the one side on the PC film is set; 5) to the spot welding of gathering leaves of a book of described PC film and the sandwich layer that has an insert; And 6) product that a postwelding of gathering leaves of a book is obtained carries out lamination.
Further, the manufacture method that has the card of insert according to the present invention also comprises: 7) implant the IC chip in sandwich layer; 8) product behind the lamination in the step 6 is die-cut to card.
Preferably, the laminating temperature of sandwich layer described in the step 1) is 135 ℃~150 ℃, and pressure is 110~125 crust, 20~25 minutes lamination time.
Preferably, the thickness of PC film is 0.06~0.1mm.
Preferably, alignment PC film and the position that has the sandwich layer of insert in step 5), the temperature of the laggard spot welding of alignment is 250 ℃.
Preferably, the laminating temperature of step 6) is 110~120 ℃, and pressure is 120 crust, and the time is 20~25 minutes.
Preferably, further be included in the step that magnetic stripe is set on the PC film before the step 4), the temperature of wherein mounting magnetic stripe on the PC film is up to 400 ℃.
Preferably, above-mentioned insert is any of gold, silver or jewel.
According to a further aspect in the invention, a kind of card that has insert comprises sandwich layer and the insert that is embedded in the described sandwich layer, and described card also comprises the PC film on the one side at least that covers described sandwich layer and described insert.
Preferably, described PC film is formed on the two sides of described sandwich layer and described insert.
In some embodiments, there is one deck to be provided with magnetic stripe in the described PC film.
In some embodiments, described card also comprises the IC chip of implantation.
The PC film is a kind of noncrystal engineering material, also is the ep-type material that a kind of stability is high, light transmission is good, and it has good anti-laser ablation performance, favorable elasticity and shock resistance.The present invention adopts specific technology to form the PC film on the surface of the card that has insert, no matter be in process of manufacture, still in the use of finished product card, all can not cause any pollution, and the insert oxidation that can prevent from for a long time to inlay, keep its high gloss and texture for a long time human body and environment; And can on insert, process (for example laser imaging etching) and go out to meet the pattern of consumer self sexual demand or literal etc.
Description of drawings
Fig. 1 is the existing exploded view that has the souvenir card of insert;
Fig. 2 is according to a preferred embodiment of the invention, is having the manufacturing process flow diagram that covers the PC film on the card of insert;
Fig. 3 is the exploded view of inlaying card that is covered with the PC film according to a preferred embodiment of the invention manufacturing;
Fig. 4 is the partial enlarged drawing of inlaying card of the PC of being covered with film shown in Figure 3, wherein is carved with personalized literal and pattern etc. on the insert.
The specific embodiment
Next, with reference to accompanying drawing preferred implementation of the present invention is elaborated.
As shown in Figures 2 and 3, according to one embodiment of the present invention, the manufacture method of covering PC film 30,31 on the card 100 that has insert 20 may further comprise the steps:
1) provides the lamination sandwich layer 10 of card 100, at the double spread lamination oil of sandwich layer 10;
2) according to size machining hole 12 on the sandwich layer 10 that is coated with lamination oil of insert 20;
3) insert 20 is embedded in the hole 12 on the sandwich layer 10;
4) on the one side at least of sandwich layer 10 and insert 20, form the PC film;
5) to the spot welding of gathering leaves of a book of PC film and the sandwich layer 10 that has an insert 20; And
6) product that a postwelding of gathering leaves of a book is obtained carries out lamination.
In this embodiment, a PC film and the 2nd PC film 30,31 paste respectively on two surfaces of PVC sandwich layer 10.
Next, will be elaborated to above-mentioned steps.At first, insert 20 is provided and measures its size, the insert 20 among the present invention can be any of gold, silver or jewel.Insert preferably is flat circle, square, can certainly be other shape, but should guarantee that the thickness of card 100 is suitable.At this, measured size comprises the thickness of insert and other sizes corresponding with its profile, for example diameter or length and width etc.Certainly, the insert 20 of different batches can be made different shapes, and same batch insert 20 is made unified shape so that produce in batches.
In step 1), form sandwich layer.According to a preferred version of the present invention, sandwich layer can adopt the PVC material.For this reason, can provide multilayer PVC substrate 11 and it is carried out lamination to form PVC sandwich layer 10.In this step, the thickness of PVC sandwich layer 10 should be substantially equal to the thickness of measured insert 20, so that sandwich layer 10 and insert 20 are substantially on same plane.The existing laminating apparatus that is adopted among the present invention.This laminating apparatus belongs to prior art, does not repeat them here.
In step 1), preferably, the laminating temperature of sandwich layer is 135 ℃~150 ℃, and pressure is 110~125 crust, 20~25 minutes lamination time.And double spread lamination oil at the PVC sandwich layer 10 that forms by above-mentioned PVC laminating technology lamination.Lamination oil can be water base lamination oil, can use the water base lamination oil of AMS, or APOLLO the company water base lamination oil of Hui Lipu, the water base lamination wet goods of Tianjin Bo Yuan that provide.
In step 2) in, be coated with machining hole 12 on the PVC sandwich layer 10 of lamination oil according to the size of measured insert 20, and insert 20 is being embedded in the hole 12, and in the aftermentioned step, fixing by the bonding force of PC film.The size in hole 12 and thickness must be decided according to the size and the thickness of insert 20, can be circular hole, square hole or irregular hole.The size in hole 12 must be corresponding with the size of insert 20, to embed above-mentioned insert 20 and it is come off.But, will be understood by those skilled in the art that hole 12 both can be a through hole, the thickness of insert 20 equals the thickness of sandwich layer 10 in fact at this moment; Hole 12 also can be non-through hole (being blind hole), and the thickness of insert 20 is less than the thickness of sandwich layer 10 at this moment.In a preferred embodiment of the invention shown in Figure 3, hole 12 is a through hole, and the thickness of insert 20 equals the thickness of sandwich layer 10 in fact.
Secondly, provide a PC film 30 and the 2nd PC film 31, preferably, the thickness of PC film is 0.06~0.1mm.Before carrying out step 4), can on the 2nd PC film 31, magnetic stripe be set, the temperature that magnetic stripe is set on the 2nd PC film is 400 ℃.Then a PC film 30 and the 2nd PC film 31 are arranged on two surfaces of sandwich layer 10 and insert 20 by laminating machine respectively.The thickness of above-mentioned PC film 30,31 helps keeping the globality of card 100, help simultaneously preventing insert 20 oxidation, keep its high gloss and texture; And the pattern that helps on insert 20, utilizing the laser imaging etching to process and meet consumer self sexual demand or literal etc.
In step 5), adopt the method for the spot welding of gathering leaves of a book to process to a PC film 30, the 2nd PC film 31 that has the PVC sandwich layer 10 of insert 20 and be provided with magnetic stripe.That is, two- layer PC film 30,31 and sandwich layer 10 carried out register lock after, weld them together by mash welder in the marginal portion, wherein the temperature of the laggard spot welding of alignment is 250 ℃.After the step 5) of spot welding of gathering leaves of a book finished, the product that a postwelding of gathering leaves of a book is obtained carried out lamination, i.e. step 6).In step 6), the laminating temperature that the product that a postwelding of gathering leaves of a book is obtained carries out lamination is 110~120 ℃, and pressure is 120 crust, and the time is 20~25 minutes.
After lamination finished, manufacture method of the present invention further comprised:
Step 7) is implanted the IC chip in sandwich layer; With
The product of step 8) after with lamination in the step 6) is die-cut to card.
Can produce the card 100 of the band insert that is covered with the PC film by above-mentioned steps of the present invention.
Though above-mentioned embodiment is to run through the two-sided of sandwich layer with insert, and describe, it will be understood by those skilled in the art that the single face that obviously also can only insert be embedded in sandwich layer in the technology of the two-sided PC of the setting film of sandwich layer.In this case, the thickness of sandwich layer should be greater than the thickness of insert.Preferred core layer thickness should go out 0.1mm at least greatly than insert.
According to the card that has insert of aforesaid way made of the present invention, comprise sandwich layer and the insert that is embedded in the described sandwich layer, wherein, this card also comprises the PC film on the one side at least that covers sandwich layer and insert.Preferably, can on the two sides of sandwich layer and insert, all form the PC film.
Fig. 3 and Fig. 4 have shown a schematic example that has the card 100 of insert according to of the present invention.This card comprises: insert 20 and PVC sandwich layer 10.Wherein PVC sandwich layer 10 is formed by multilayer PVC substrate 11 laminations, and the thickness of PVC sandwich layer 10 equals the thickness of insert 20 substantially, and wherein forms porose 12 to inlay above-mentioned insert 20.In addition, card 100 also comprises a PC film and the 2nd PC film 30,31.Wherein the 2nd PC film 31 can be provided with magnetic stripe, and by the mode of gather leaves of a book spot welding and lamination, a PC film and the 2nd PC film 30,31 paste respectively on two surfaces of PVC sandwich layer 10.
In the present invention, insert 20 can be gold, silver or jewel etc., also can be that other is suitable for being embedded in the material in the card.In addition, the thickness that has a PC film in the card of insert in the present invention is 0.06~0.1mm.Because the card that the present invention has an insert is covered with the PC film of above-mentioned thickness, therefore can uses for example laser imaging etching mode to pass the PC film and on insert, process the pattern that meets consumer self sexual demand or literal etc.; And, still in the use of finished product card, all can not cause any pollution to human body and environment no matter be in process of manufacture; And can prevent the oxidation of insert for a long time, keep its high gloss and texture for a long time.
Though above preferred implementation of the present invention is described in detail, the present invention is not limited thereto.It should be appreciated by those skilled in the art that under the situation that does not break away from feature category of the present invention and spirit, the present invention can also carry out various modifications and equivalent transformation, these are revised and conversion is included in the scope that the present invention contains equally.

Claims (10)

1. manufacture method that has the card of insert comprises:
1) provides the lamination sandwich layer of card, at the double spread lamination oil of described sandwich layer;
2) according to size machining hole on the sandwich layer that is coated with lamination oil of insert;
3) described insert is embedded in the described hole on the sandwich layer;
4) described sandwich layer and insert at least the one side on the PC film is set;
5) to the spot welding of gathering leaves of a book of described PC film and the sandwich layer that has an insert; And
6) product that a postwelding of gathering leaves of a book is obtained carries out lamination.
2. manufacture method according to claim 1, wherein the laminating temperature of sandwich layer described in the step 1) is 135 ℃~150 ℃, pressure is 110~125 crust, 20~25 minutes lamination time.
3. manufacture method according to claim 1, the thickness of wherein said PC film are 0.06~0.1mm.
4. manufacture method according to claim 1, wherein said step 5) further comprises: described PC film of alignment and the position that has the sandwich layer of insert, the temperature of the laggard spot welding of alignment is 250 ℃.
5. manufacture method according to claim 1, wherein the laminating temperature of step 6) is 110~120 ℃, and pressure is 120 crust, and the time is 20~25 minutes.
6. according to each described manufacture method of claim 1-5, further comprise the steps:
7) in described sandwich layer, implant the IC chip; With
8) product behind the lamination in the step 6) is die-cut to card.
7. manufacture method according to claim 6 wherein further is being included in the step that magnetic stripe is set on the described PC film before the step 4), the temperature that magnetic stripe wherein is set on described PC film is 400 ℃.
8. a card that has insert comprises sandwich layer and the insert that is embedded in the described sandwich layer, it is characterized in that, described card also comprises the PC film on the one side at least that covers described sandwich layer and described insert.
9. the card that has insert according to claim 8 is characterized in that, all is formed with described PC film on the two sides of described sandwich layer and described insert.
10. according to Claim 8 or the 9 described cards that have insert, it is characterized in that the thickness of described PC film is 0.06~0.1mm.
CN200610072603.8A 2006-04-05 2006-04-05 The card and the manufacture method thereof that have insert Active CN100556708C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200610072603.8A CN100556708C (en) 2006-04-05 2006-04-05 The card and the manufacture method thereof that have insert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200610072603.8A CN100556708C (en) 2006-04-05 2006-04-05 The card and the manufacture method thereof that have insert

Publications (2)

Publication Number Publication Date
CN101049778A true CN101049778A (en) 2007-10-10
CN100556708C CN100556708C (en) 2009-11-04

Family

ID=38781457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610072603.8A Active CN100556708C (en) 2006-04-05 2006-04-05 The card and the manufacture method thereof that have insert

Country Status (1)

Country Link
CN (1) CN100556708C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331789A (en) * 2013-07-22 2013-10-02 李中伟 Wooden card manufacturing technology and wooden card
CN108205697A (en) * 2016-12-20 2018-06-26 第资本服务有限责任公司 Two-piece type transactional cards with fabric insert object

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331789A (en) * 2013-07-22 2013-10-02 李中伟 Wooden card manufacturing technology and wooden card
CN103331789B (en) * 2013-07-22 2015-08-05 李中伟 A kind of wooden card manufacture craft and wooden card
CN108205697A (en) * 2016-12-20 2018-06-26 第资本服务有限责任公司 Two-piece type transactional cards with fabric insert object
CN108205697B (en) * 2016-12-20 2024-02-23 第一资本服务有限责任公司 Two-piece transaction card with fabric inlay

Also Published As

Publication number Publication date
CN100556708C (en) 2009-11-04

Similar Documents

Publication Publication Date Title
TWI305118B (en) Rigid-flexible printed circuit board and method of manufacturing the same
CA2678157C (en) Method of fabricating electronic cards including at least one printed pattern
JP2005516829A5 (en)
IL153644A (en) Method for producing a contactless chip card using transfer paper
TW200619856A (en) Printing plate and method for fabricating the same
WO2014153902A1 (en) Capacitive touch screen and manufacturing method thereof
EP1876876A4 (en) Transparent electrically conductive film and process for producing the same
TW201104718A (en) Method of fabricating keycaps
EP2220585B1 (en) Electronic inlay structure and method of manufacture therof
KR20210107154A (en) Card, and method for manufacturing card
CN101049778A (en) Card with tessera, and fabricating method
TW200606968A (en) Method for manufacturing multilayer electronic component
EP1635625A3 (en) Substrate manufacturing method and circuit board
WO2004001774A1 (en) Chip resistor having low resistance and its producing method
CA2502157A1 (en) Value document
CN108944232A (en) Without gum base materials and the compound imprint process of noble metal
CN201020959Y (en) Transaction card inlaid with diamond or other decoration
CN102511977B (en) Noble metal coin with transparent anti-counterfeit window, and manufacturing technology thereof
JP5482746B2 (en) Card, card manufacturing method
TW200618707A (en) Multi-layer printed circuit board layout and manufacturing method thereof
CN111465721A (en) Circuit, electronic module of a chip card implemented on said circuit and method for implementing such a circuit
CN210617721U (en) Noble metal and base material composite imprinting process product
KR20100116754A (en) Manufacturing process of precious metal card
JP2005072539A (en) Method of manufacturing ceramic green sheet, and method of manufacturing electronic component using the ceramic green sheet
JP2005072540A (en) Method of manufacturing ceramic green sheet and method of manufacturing electronic component using ceramic green sheet

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 100085, No. 10, Pioneer Road, Haidian District information industry base, Beijing

Patentee after: ZHONGCHAO CREDIT CARD INDUSTRY DEVELOPMENT Co.,Ltd.

Patentee after: China Banknote Printing and Minting Group Co.,Ltd.

Address before: 100085, No. 10, Pioneer Road, Haidian District information industry base, Beijing

Patentee before: ZHONGCHAO CREDIT CARD INDUSTRY DEVELOPMENT Co.,Ltd.

Patentee before: CHINA BANKNOTE PRINTING AND MINTING Corp.