CN101046969B - Manufacturing method of magnetic head with micro-veins - Google Patents
Manufacturing method of magnetic head with micro-veins Download PDFInfo
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- CN101046969B CN101046969B CN2006100750728A CN200610075072A CN101046969B CN 101046969 B CN101046969 B CN 101046969B CN 2006100750728 A CN2006100750728 A CN 2006100750728A CN 200610075072 A CN200610075072 A CN 200610075072A CN 101046969 B CN101046969 B CN 101046969B
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- magnetic head
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Abstract
The present invention relates to a method for manufacturing magnetic head with micro-texture. Said method includes the following steps: (1), providing a magnetic bar formed from several magnetic heads, in which every magnetic head includes an air bearing surface and a pole tip region placed on said air bearing surface; (2), forming first protective film on the pole tip region of described every magnetic head; (3), etching the air bearing surface of the described magnetic head so as to form micro-texture; (4), removing first protective film from pole tip region of the magnetic head; and (5), forming second protective film on the air bearing surface of said magnetic head.
Description
Technical field
The present invention relates to a kind of magnetic head processing method, (Air BearingSurface is formed with the manufacture method of the magnetic head of required rough surface or little line on ABS) to relate more specifically to a kind of air-supported.
Background technology
Hard disk drive is along with digital device, need such as digital camera, digital audio/video equipment even digital television etc. the high capacity storage space equipment development and develop rapidly.Therefore, the market demand of hard disk drive is very big, and this market demand impels hard disk drive to develop to two aspects: high surface density and little volume.
Described hard disk drive comprises plural disk, and each magnetic disk surface has the magnetic coating that is used for digital-information recording.Described magnetic head can be moving on the magnetic surface of described disk the data of access on it.High area recording density can be by improving magnetic disk surface the performance of magnetic coating or the size that reduces the magnetic head of access data on magnetic coating obtain.The size that reduces magnetic head means that then read/write signal dies down, and correspondingly, track width and/or track pitch are also corresponding to be reduced.Yet; the key that reduces track width and/or track pitch is to improve the position control ability of magnetic head; the control ability of flying height for example; its representative is when the distance of magnetic head magnetic head and magnetic disk surface when magnetic disk surface moves, and also comprises the thickness of protective coating of magnetic head and magnetic disk surface and magnetic head pole tip cave in (recess ion) or the like.
On the other hand, the volume that reduces hard disk drive is a systems engineering, not only will relate to the physical size that changes each parts of hard disk drive, also relates to the optimization again of the flying power performance of magnetic head.Hard disk drive at present commonly used be used for desk-top computer 3.5 " hard disk drive and be used for notebook computer 2.5 " hard disk drive.And the size that is used for the hard disk drive of portable digital audio-frequency/video equipment has dropped to 1 " even 0.85 ".
Magnetic head is the critical component of hard disk drive.For the clear structure of understanding magnetic head, Fig. 1 a shows from air-supported of magnetic head and (faces the surface of disk, ABS) the magnetic head view of direction observation.As shown in the figure, this magnetic head 10 have air-supported 12, with air-supported 12 vertical leading edge (leading edge) 15 and the trailing edge (trailing edge) 13 relative with this leading edge 15.Be provided with pole tip zone (pole tip region) 11 near the described trailing edge 13.Fig. 1 b is the amplification assumption diagram in pole tip zone among Fig. 1 a.This pole tip zone 13 be a layer structure, comprises inductive write head second magnetic pole (inductive write head pole2) 116, and this second magnetic pole 116 inductive write head first magnetic pole (inductive writehead pole1) 118, secondary shielding layer 111 and first screen layer 113 separated by a distance from top to bottom successively.Above-mentioned parts are arranged on the ceramic bases (substrate) 122 of control head flying height.The conductor layer (lead layer) 114 that also is provided with magnetoresistive element (magneto-resistive element) 112 between the described secondary shielding layer 111 and first screen layer 113 and is positioned at these magnetoresistive element 112 two ends and electrically connects with this magnetoresistive element 112.Adopt sedimentation or etching method to form on the surface of described ceramic matrix 122 such as patterns (pattern) 118 such as " contact of taking off, land ", " air cushion surface " and negative pressure cavities.Described magnetic head has a very smooth surface at 11 places, magnetic pole tip zone.Described smooth surface forms by the matrix of lapping magnetic heads usually.The roughness on the very smooth surface of described magnetic head is less than 0.3nm.Polish process (lapping process) also can help to control the pole tip depression.
For undersized hard disk drive (being generally known as miniature hard disk drive), taking off (take-off) and land (touch-down) performance when flying with respect to disk in order to improve magnetic head, industry increases air-supported surfaceness of magnetic head matrix usually, for example forms concavo-convex alternate little line (micro-texture) on the magnetic head matrix.With reference to figure 1d, described magnetic head matrix material is used AlTiC usually, and wherein AlTiC is Al
2O
3The mixing phase of (aluminium oxide) and TiC (titanium carbide) comprises embedding Al
2O
3Matrix mutually in and be higher than Al
2O
3The island TiC particle of matrix phase, the surface that this height rises and falls is air-supported that is formed with little line.
United States Patent (USP) the 5th, 010,429 and 5,052, disclosed the technology that employing sputtering technology (sputteringprocess) forms magnetic head matrix rough surface for No. 099.The object height of magnetic head matrix roughness (distance from the top to the bottom, promptly little line height) is about the 50-300 dust, and peak value (outburst area) width and peak separation are from being about the 5-20 micron.But this is for present magnetic head, and its little line height is excessive, and we need highly be the little line of 10 dusts to 50 dusts usually.
In order to obtain more optimal little line (micro-texture) on air-supported (ABS) of magnetic read/write magnetic head, with the further flying quality of improving magnetic head, industry works out a kind of improved manufacture method with magnetic head of little line.Shown in Fig. 1 c, this method comprises the steps: at first, and the microscler magnetic stripe that is made of plural magnetic head (row bar) is provided, and wherein each magnetic head comprises one air-supported and pole tip zone (pole tip region) provided thereon; Secondly, on air-supported of each magnetic head, form little line by etching technique; Then, on air-supported of microscler magnetic stripe, form diamond-like-carbon (DLC, diamond-like carbon) film.
Yet; in the forming process of above-mentioned little line; owing to safeguard measure is not taked in the pole tip zone of magnetic head; cause the oxygen in the etching process; argon gas and ethylene gas not only carry out etching to air-supported face; and simultaneously etching is also carried out in the pole tip zone; because the conductor layer (lead) in the pole tip zone is formed by copper or gold copper usually; other parts with respect to the pole tip zone; the easier oxygen that is subjected to of conductor layer that forms by copper or gold copper; the etching of argon gas and ethylene gas; in the forming process of above-mentioned little line, conductor layer is by serious etching and form darker conductor layer groove (lead recess) like this.Fig. 4 a has shown the etching situation in the pole tip zone that is caused by classic method.Number in the figure 115 represents promptly that conductor layer is etched and the conductor layer groove that forms.As seen from the figure, the little line height that forms at said method is under the situation of 2nm, and the degree of depth of the conductor layer groove that produces at conductor layer can reach 6-7nm.The diamond-like carbon protective film that this very dark conductor layer groove 115 will cause forming subsequently can't intactly be formed on air-supported and the pole tip zone; for example present incomplete distribution at conductor layer; this imperfect distribution has reduced the resistance to corrosion in the pole tip zone of magnetic head, makes magnetic head be subjected to extraneous the erosion and the reduction performance easily.
Therefore be necessary to provide a kind of manufacture method of the magnetic head with little line of improvement, to overcome the deficiencies in the prior art.
Summary of the invention
One aspect of the present invention provides a kind of manufacture method with magnetic head of little line, makes in little line forming process, and the pole tip zone of magnetic head, for example the conductor layer in pole tip zone is not etched, thus the readwrite performance that guarantees magnetic head is unaffected.
The present invention provides a kind of manufacture method with magnetic head of little line on the other hand, can form complete diaphragm on air-supported of magnetic head and pole tip zone, diamond-like carbon film for example, thus improved the corrosion resistance of magnetic head.
For achieving the above object, a kind of manufacture method with magnetic head of little line (micro-texture), comprise the steps: that (1) provides the microscler magnetic stripe that is made of plural magnetic head, wherein each magnetic head comprises one air-supported and pole tip zone (pole tip region) provided thereon; (2) on the pole tip zone of described each magnetic head, form first diaphragm; (3) air-supported of the described magnetic head of etching and form concavo-convex alternate little line (micro-texture) thereon, described pole tip zone avoids etched owing to the protection of first diaphragm; (4) remove first diaphragm that is covered on the described magnetic head pole tip zone; (5) on air-supported of described magnetic head, form second diaphragm.Wherein, comprise the steps: to form supporting layer on (a) air-supported forming first diaphragm on the described magnetic head pole tip zone at described magnetic head; (b) on described supporting layer, form the diamond like carbon carbon-coating; (c) on the position in corresponding magnetic head pole tip zone on the described diamond like carbon carbon-coating, cover one deck photoresist (photo-resist film); (d) zone that is not covered by described photoresist of described diamond like carbon carbon-coating is removed, thereby come out in described supporting layer part; (e) described photoresist is removed; And (f) etch away the supporting layer that is not covered by the diamond like carbon carbon-coating, thereby form on the described magnetic head pole tip zone by remaining supporting layer and on first diaphragm that forms of diamond like carbon carbon-coating.
In one embodiment of the invention, the formation of little line is implemented in same operation successively in the etched and step (3) of the supporting layer in the described step (f).Described supporting layer is the supporting layer that is formed by silicon materials.
In addition, the step that forms little line on air-supported of described magnetic head is achieved in that to be etching gas carry out ion etching by ion etching equipment to the air-supported face of magnetic head forms by the mixed gas of inert gas and hydrocarbon gas in employing.In the present invention, described inert gas is at least a in argon gas (Ar), neon (Neon), krypton gas (Krypton), the xenon (Xenon); Described hydrocarbon gas is ethene (C
2H
4), methane (CH
4), acetylene (C
2H
2) or benzene (benzenoid) at least a.In one embodiment, also can comprise diluents in the described etching gas, as helium (He).
In the present invention, described step (4) comprises following operation: (A) etch away the diamond like carbon carbon-coating on the magnetic head pole tip zone; (B) etch away supporting layer on the magnetic head pole tip zone.The diamond like carbon carbon-coating of first diaphragm on the described magnetic head pole tip zone is that etchant gas is fallen with oxygen.Described second diaphragm comprises supporting layer that is formed on the pole tip zone and the diamond like carbon carbon-coating (DLClayer) that forms on described supporting layer.The formed little line height of this method is 1-5nm, and the spacing between little line is 0.2-3.0 μ m.Described photoresist is positive photoetching rubber or negative photoresist, and thickness is between 1-20 μ m.
In one embodiment, described mixed gas is that percent by volume is the argon gas of 7:3 and the potpourri of ethene, and the flow velocity of the inflow ion etching equipment of described mixed gas is 30sccm, the ion energy that is produced by described mixed gas disassociation is 200eV, ion beam current is 120mA, and the ion beam incident angle is 55 degree.
In the present invention; form provisional diaphragm (first diaphragm) by pole tip zone at magnetic head; make that in little line forming process, magnetic head pole tip zone is not influenced by etching process, for example avoid magnetic head pole tip zone conductor layer etched and form darker conductor layer groove.Avoid the readwrite performance of magnetic head to be affected so on the one hand; make second diaphragm in operation subsequently on the other hand; for example diamond-like carbon film can intactly be formed on air-supported and the pole tip zone, thereby guarantees that magnetic head has good etch resistant properties.
By following description also in conjunction with the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used to explain embodiments of the invention.
Description of drawings
Fig. 1 a is from the magnetic head view of air-supported observation in the present technique field.
Fig. 1 b is the structure enlarged drawing in the pole tip zone of magnetic head shown in Fig. 1 a.
Fig. 1 c is traditional method flow diagram that forms little line on the magnetic head air bearing face.
Fig. 2 is the described method flow block diagram that forms little line on the magnetic head air bearing face of one embodiment of the invention.
Fig. 3 a-3h is the concrete serial of methods block diagram corresponding with FB(flow block) shown in Figure 2.
Fig. 4 a has showed the dark groove that utilizes the conductor layer of classic method in magnetic head pole tip zone to form.
Fig. 4 b showed utilize the inventive method the conductor layer in magnetic head pole tip zone form than shallow grooves.
Embodiment
With reference now to accompanying drawing, embodiments of the invention is described.As mentioned above, the invention provides a kind of manufacture method with magnetic head of little line, described magnetic head can be magnetic head or other any suitable magnetic head of the magnetic head, 20% (femto) of 30% (pico).As previously mentioned, described magnetic head can move on the surface scribbles the surface of spinning disk of one deck magnetic material, it has is positioned at air-supported the pole tip zone (poletip region) on (ABS), reads or write data towards magnetic disk surface and from this disk.
As shown in Figure 2, a kind of manufacture method of the present invention with magnetic head of little line, comprise the steps: to provide the microscler magnetic stripe that is made of plural magnetic head (step S1), wherein each magnetic head comprises one air-supported and pole tip zone (pole tip region) provided thereon; On the pole tip zone of described each magnetic head, form first diaphragm (step S2); Air-supported of the described magnetic head of etching and form concavo-convex alternate little line thereon, described pole tip zone avoids etched (step S3) owing to the protection of first diaphragm; Removal is covered in first diaphragm (step S4) on the described magnetic head pole tip zone; On air-supported of described magnetic head, form second diaphragm (step S5).In the present invention; form provisional diaphragm (first diaphragm) by pole tip zone at magnetic head; make that in little line forming process, magnetic head pole tip zone is not influenced by etching process, for example avoid magnetic head pole tip zone conductor layer etched and form darker conductor layer groove.Avoid the readwrite performance of magnetic head to be affected so on the one hand; make second diaphragm in operation subsequently on the other hand; for example diamond-like carbon film can intactly be formed on air-supported and the pole tip zone, thereby guarantees that magnetic head has good etch resistant properties.
Embodiments of the invention are described now.For convenience of description, a magnetic head that constitutes microscler magnetic stripe only is shown among the described embodiment, in this embodiment, described first diaphragm is a diamond-like carbon film, and described second diaphragm also is a diamond-like carbon film.Wherein, described diamond-like carbon film is by supporting layer and form that thereon diamond like carbon carbon-coating constitutes.Can utilize chemical vapour deposition technique (CVD), ion beam depositing method (IBD) and filtering cathode arc method (FCA) on magnetic head, to form diamond-like carbon film traditionally.Generally speaking, the technology of formation diamond-like carbon film generally included for three steps: prerinse, plating supporting layer (adhesion layer) and coating diamond-like carbon-coating (DLC layer).Set forth with regard to above-mentioned each processing step respectively below.
At first, the pending surface of described magnetic head is owing to clean in air usually, to such an extent as to the organic solvent may absorb moisture, carbon dioxide even erase head the time.In pre-etching process, magnetic head is loaded in the vacuum processing chamber that is evacuated, and then by inert gas, for example argon gas etc. carries out the surface contamination that plasma etching or ion beam milling are removed the pending surface of magnetic head.Through etching process, the minute quantity material is removed from the magnetic head matrix surface, and marked change does not take place the roughness on surface yet.In other words, the surfaceness of magnetic head (Ra) still remains on about 0.3nm.
After the pre-etching, on the processed surface of magnetic head, plate one deck supporting layer.The most handy silicon of described supporting layer forms, because silicon can make easier the plating of diamond-like-carbon layer (DLC layer).In addition, when the coating diamond-like carbon-coating, methane or ethene are usually at CVD technology and the IBD technology carrier (precursor) as carbon, and pure graphite post (graphite cylinder) is used as the FCA target.
With reference to figure 3a-3e, the magnetic head 20 that constitutes microscler magnetic stripe includes one as air-supported surface 22 and pole tip zone 24 provided thereon.Wherein, at described each magnetic head, for example form first diaphragm on the pole tip zone 24 of magnetic head 20, for example the technology of diamond-like carbon film comprises the steps:
The first step, shown in Fig. 3 a, at first, the surface 22 of described magnetic head 20 will make it smooth through fine lapping, and surfaceness reaches 0.2-0.4nm, then by for example chemical vapour deposition technique (CVD), ion beam depositing method (IBD) or filtering cathode arc method methods such as (FCA) form on the magnetic head by supporting layer (adhesive layer) 26 and on the diamond-like carbon film that constitutes of diamond like carbon carbon-coating (DLC layer) 28.
In second step, shown in Fig. 3 b, the position in corresponding pole tip zone 24 covers one deck photoresist (photo-resist film) 21 on above-mentioned diamond like carbon carbon-coating 28.Wherein, this photoresist 21 with air-supported 22 vertical direction on view field preferably slightly greater than described pole tip zone 24, so that in follow-up etching process, can protect pole tip zone 24 better.In the present invention, described photoresist 21 can be positive photoetching rubber, also can be negative photoresist, and the thickness of described photoresist 21 can be between 1-20 μ m.In addition, if described photoresist 21 is dried photoresist, then can photoresist be covered on the above-mentioned diamond-like-carbon layer 28 by the mode of laminating; If described photoresist 21 is wet photoresist, then can photoresist be covered on the above-mentioned diamond-like-carbon layer 28 by the mode that applies.
In the 3rd step, shown in Fig. 3 c, the zone that is not covered by photoresist 21 on the above-mentioned diamond like carbon carbon-coating 28 is removed, thereby supporting layer 26 is come out partly.In this step, can be by suitable method ion-etching for example, and be that etching gas is removed described diamond like carbon carbon-coating 28 with for example oxygen etc.
In the 4th step, shown in Fig. 3 d, described photoresist 21 is removed.In one embodiment of the invention, described photoresist 21 can be removed by soaking with organic solvents such as ammoniacal liquor, alcohol.
In the 5th step, shown in Fig. 3 e, the supporting layer 26 that is not covered by diamond-film-like 28 is removed, thereby on pole tip zone 24, form first diaphragm that forms by supporting layer 26 and diamond-film-like 28.
Fig. 3 e has also showed air-supported of the described magnetic head 20 of etching and has formed the synoptic diagram of concavo-convex alternate little line thereon.In the process of the little line of described formation; owing to be formed with first diaphragm that forms by supporting layer 26 and diamond-film-like 28 on the pole tip zone 24; therefore little line etching only occurs over just the zone that is not covered by first diaphragm on air-supported 22; and the not influence of pole tip zone 24 to being covered by first diaphragm, number in the figure 23 promptly is illustrated in the little line that forms on air-supported 22.
In one embodiment of the invention, step that the supporting layer 26 that is not covered by diamond-film-like 28 is removed and the step that forms little line 23 can be implemented in same operation successively, for example realize by ion etching technology.
In one embodiment of the invention, by processing gas with proper proportion, for example argon gas (Ar) and ethene (C
2H
2), disassociation forms ion in the vacuum ionic etching chamber, and carries out etching and at the little line that forms on air-supported about the high 2nm in rank by the air-supported face of described ion pair magnetic head 20.Wherein, described processing gas is by the flow velocity inflow vacuum ionic etching chamber of mass flow controller (MFC) valve with 30sccm (standard cubiccentimeter), the ion of the ion that produces can be 200eV, ion beam current is 120mA, the ion beam incident angle is 55 degree, and argon content is 70% in the described processing gas, and ethylene contents is 30%.Because influence the key factor that the ion etching method forms little line comprises: the type of processing gas, the incident angle of ion beam, etch voltage and etching period.Etching period is then set by the Desired Height of little line and previous energy incident angle and is determined.Generally between 0.2-3.0 μ m, the rank height of little line also can be other values between the 1-5nm to spacing between described little line, and according to the needs that form little line, above-mentioned parameter also can carry out adaptive adjustment.
In the present invention, described processing gas also can be made up of other inert gases and hydrocarbon gas except that being made up of argon gas and ethene, and for example inert gas can be neon (Neon), krypton gas (Krypton), xenon (Xenon); Hydrocarbon gas can be methane (C
2H
4), acetylene (C
2H
2) and benzene (benzenoid).In another embodiment of the present invention, in the described processing gas, can also add diluents, helium (He) for example is so that regulate the content ratio of all gases.
In the present invention, the step that first diaphragm that is covered on the magnetic head 20 pole tip zones 24 is removed can realize by the step shown in Fig. 3 f-3g.Particularly; shown in Fig. 3 f; at first; by proper method such as being that etching gas removes the diamond like carbon carbon-coating 28 in described first diaphragm with oxygen; thereby the supporting layer 26 that will be covered on the pole tip zone 24 comes out, and then, with the processing gas of being made up of inert gas and hydrocarbon gas described supporting layer 26 is etched away; thereby come out in pole tip zone 24, shown in Fig. 3 g.Subsequently, shown in Fig. 3 h, on air-supported of magnetic head 20, form second diaphragm that constitutes by supporting layer 26 ' and diamond like carbon carbon-coating 28 '.In one embodiment, described supporting layer 26 ' is a silicon layer.
Fig. 4 b has showed and utilizes magnetic head manufacturing method of the present invention to form the conductor layer groove 215 that causes the conductor layer in magnetic head pole tip zone to form in the process of little line on air-supported of magnetic head.On air-supported of magnetic head, forms in the process of little line at the conductor layer groove (lead recess) 115 of the conductor layer formation in magnetic head pole tip zone with utilization shown in Fig. 4 a tradition magnetic head manufacturing method and to compare, can find that the conductor layer groove 215 that the present invention forms has the more shallow degree of depth relatively, 2-3nm or is still less only arranged usually, and the degree of depth of conductor layer groove 115 is 6-7nm in the classic method, and visible magnetic head manufacturing method provided by the invention is very little to the influence in magnetic head pole tip zone.This is because safeguard measure has been taked in the pole tip zone of magnetic head, and the pole tip zone also suffers etching in the process of little line thereby avoid forming on air-supported.
Above invention has been described in conjunction with most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various equivalent combinations of carrying out according to essence of the present invention.
Claims (13)
1. the manufacture method with magnetic head of little line comprises the steps:
(1) provide the microscler magnetic stripe that is made of plural magnetic head, wherein each magnetic head comprises one air-supported and pole tip zone provided thereon;
(2) on the pole tip zone of described each magnetic head, form first diaphragm;
(3) air-supported of the described magnetic head of etching and form concavo-convex alternate little line thereon, described pole tip zone avoids etched owing to the protection of first diaphragm;
(4) remove first diaphragm that is covered on the described magnetic head pole tip zone;
(5) on air-supported of described magnetic head, form second diaphragm;
Wherein forming first diaphragm on described magnetic head pole tip zone comprises the steps:
(a) on air-supported of described magnetic head, form supporting layer;
(b) on described supporting layer, form the diamond like carbon carbon-coating;
(c) on the position in corresponding magnetic head pole tip zone on the described diamond like carbon carbon-coating, cover one deck photoresist;
(d) zone that is not covered by described photoresist of described diamond like carbon carbon-coating is removed, thereby come out in described supporting layer part;
(e) described photoresist is removed;
(f) etch away the supporting layer that is not covered by the diamond like carbon carbon-coating, thus form on the described magnetic head pole tip zone by remaining supporting layer and on first diaphragm that forms of diamond like carbon carbon-coating.
2. the method for claim 1 is characterized in that: the formation of little line is implemented in same operation successively in the etched and step (3) of the supporting layer in the described step (f).
3. method according to claim 1 is characterized in that: the supporting layer of described supporting layer for being formed by silicon materials.
4. method according to claim 1 is characterized in that: the step that forms little line on air-supported of described magnetic head is achieved in that to be etching gas carry out ion etching by ion etching equipment to the air-supported face of magnetic head forms by the mixed gas of inert gas and hydrocarbon gas in employing.
5. method according to claim 4 is characterized in that: described inert gas is at least a in argon gas, neon, krypton gas, the xenon; Described hydrocarbon gas is at least a in ethene, methane, acetylene or the benzene.
6. method according to claim 4 is characterized in that: also can comprise helium in the described etching gas.
7. method according to claim 4 is characterized in that: described step (4) comprises following operation: (A) etch away the diamond like carbon carbon-coating on the magnetic head pole tip zone; (B) etch away supporting layer on the magnetic head pole tip zone.
8. method according to claim 1 is characterized in that: the diamond like carbon carbon-coating of first diaphragm on the described magnetic head pole tip zone is that etchant gas is fallen with oxygen.
9. method according to claim 1 is characterized in that: described second diaphragm comprises supporting layer that is formed on the pole tip zone and the diamond like carbon carbon-coating that forms on described supporting layer.
10. method according to claim 1 is characterized in that: the formed little line height of this method is 1-5nm, and the spacing between little line is 0.2-3.0 μ m.
11. method according to claim 1 is characterized in that: described photoresist is positive photoetching rubber or negative photoresist.
12. method according to claim 1 is characterized in that: the thickness of described photoresist is between 1-20 μ m.
13. according to the described method of claim 4, it is characterized in that: described mixed gas is that percent by volume is 7: 3 the argon gas and the potpourri of ethene, and the flow velocity of the inflow ion etching equipment of described mixed gas is 30sccm, the ion energy that is produced by described mixed gas disassociation is 200eV, ion beam current is 120mA, and the ion beam incident angle is 55 degree.
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