CN101040379A - Feeding apparatus and feeding method for semiconductor lead frame - Google Patents

Feeding apparatus and feeding method for semiconductor lead frame Download PDF

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Publication number
CN101040379A
CN101040379A CN200480044187.XA CN200480044187A CN101040379A CN 101040379 A CN101040379 A CN 101040379A CN 200480044187 A CN200480044187 A CN 200480044187A CN 101040379 A CN101040379 A CN 101040379A
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CN
China
Prior art keywords
lead frame
retainer
rear end
moved beyond
plotter
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Granted
Application number
CN200480044187.XA
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Chinese (zh)
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CN100481419C (en
Inventor
梁海春
申允锡
郑显权
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Hanmi Semiconductor Co Ltd
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Hanmi Semiconductor Co Ltd
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Publication of CN101040379A publication Critical patent/CN101040379A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Disclosed are an apparatus and a method for feeding a semiconductor lead frame from an on-loader unit to a press unit. The apparatus includes a second stopper installed on a front end of a plotter of the press unit and individually driven by means of a separate drive unit in order to control a feeding time for the lead frame to a third stopper installed adjacent to an upstream portion of a pressing area formed in the press unit, and a third sensor installed adjacent to the second stopper so as to check whether a rear end of the lead frame has moved beyond the second stopper. When the third sensor detects that. the rear end of the lead frame has moved beyond the second stopper, a new lead frame is fed toward the second stopper.

Description

The conveying device and the carrying method that are used for semiconductor lead frame
Technical field
The present invention relates to be used for the conveying device and the carrying method of semiconductor lead frame.The invention particularly relates to by receiving semiconductor lead frame, described semiconductor lead frame is transported to the device of press unit from load units.
Background technology
Usually, come the production semiconductor packages by various manufacture processes: prepare semiconductor chip, this semiconductor chip comprises the silicon semiconductor substrate that forms with the high density integrated circuit having as transistor and capacitor, semiconductor chip is attached to lead frame or printed circuit board (PCB), use lead that described semiconductor chip is electrically connected to described lead frame or described printed circuit, and with the molded described semiconductor chip of EMC (epoxy molding plastic epoxy molding compound), thereby make described semiconductor chip avoid the influence of external environment.
By dressing process, forming process and cutting process, such encapsulated semiconductor lead frame is divided into single semiconductor lead frame, and described then single semiconductor lead frame unloads from described semiconductor manufacturing facility.Usually, above-mentioned finishing, formation and cutting process are carried out by the press unit that comprises upper die and lower die, are necessary so be used for described semiconductor lead frame is transported to the device of described press unit.
Simultaneously, applicant of the present invention is that Korean Patent Application No. that title is submitted to is the accompanying drawing 9a of 10-1996-0064585 (registration number is 10-0215937) has illustrated the conveying device that is used for semiconductor lead frame to 13b a example with " being used for making the device (Apparatus for manufacturing a semiconductor lead frame) of semiconductor lead frame ".Hereinafter, will be referred to application number and be the disclosed device that is used to make semiconductor lead frame of the Korean Patent of 10-1996-0064585 and be described, emphasis is provided by the conveying device of the semiconductor lead frame that provides in the said apparatus simultaneously.
Fig. 1 is the plan view that is used to make the conventional apparatus of semiconductor lead frame, and Fig. 2 is the front view that the conventional apparatus of semiconductor lead frame is made in shown in Figure 1 being used to.
As depicted in figs. 1 and 2, the conventional apparatus that is used to make semiconductor lead frame mainly comprises load units 100, lead frame supply unit and press unit 200.Here, because described lead frame (L) advances to described press unit 200 from described load units 100, the componentry of therefore contiguous described load units 100 will be defined as " upstream portion ", and the componentry of contiguous described press unit 200 is defined as " downstream part ".In addition, when describing one when having two elements to end parts, an end parts of neighbouring element upstream portion is called as " front end ", and the other end of neighbouring element downstream part partly is called as " rear end ".
At first, described load units 100 is provided with pending lead frame L, and under predetermined condition described lead frame L is loaded on the described lead frame supply unit.Described load units 100 comprises storing platform with a plurality of lead frame L (not shown go out) and is used for the described lead frame at storing platform stacking is risen to the lift (not shown go out) of service position.
Described press unit 200 receives described lead frame L from described lead frame supply unit, and by the interaction between the upper and lower mould 212 and 214 that is arranged relative to each other, described lead frame L is divided into single semiconductor chip.
Described lead frame supply unit is from load units 100 receive leg frame L, and described lead frame L is delivered to press unit 200.Described lead frame supply unit mainly comprises conveyer 300, plotter 400 and conveyer 500.
When lead frame L was loaded on the conveyer 300 by described load units 100, described conveyer 300 transmitted described lead frame L towards described plotter 400.Described conveyer 300 has the conveyer belt 314 that is used to transmit loading described lead frame L thereon.
In addition, as shown in Figure 3, first retainer (stopper) 320 is installed in the rear end of described conveyer 300, thereby controls the time of delivery of described lead frame L to described plotter 400.First sensor 330 be arranged on first retainer, 320 upstream portion near, thereby check whether described lead frame L normally is sent to first retainer 320.Second transducer 340 be arranged on described first retainer 320 downstream parts near, thereby checking whether described lead frame L has moved exceeds described first retainer 320.Here, described first retainer 320 relies on first cylinder (not shown go out) to move up and down.
In addition, as shown in Figure 4, roller unit is installed in the rear end of described conveyer 300, so that described lead frame L is transported to described plotter 400.Thereby described roller unit comprises the driven roller 350 that is used to described lead frame L that actuating force is provided and engages the dummy roll 360 of carrying described lead frame L with described driven roller 350.Described dummy roll 360 is granted elastic bias force by spring on downward direction, and rely on the idle running lifter be installed in the described plotter 400 (not shown go out) and the described plotter 400/following moving hormany and do not stop to move up and down.
The described lead frame L of described plotter 400 guiding relies on the vertical delivery unit 420 that is connected with rotating shaft simultaneously and moves up and down repeatedly.Described plotter 400 comprises plotter 412 and the following plotter of arranging corresponding to described upward plotter 412 414.Described lead frame L is directed to by the gathering sill 416 that forms between upper and lower plotter 412 and 414.The described plotter 421 of going up is formed with the elongated pores 418 that plotter 412 is vertically arranged on described in its both sides.
In addition, idle running lifter (not shown go out) is installed in the described front end of plotter 414 down, moves up and down described dummy roll 360 thereby cooperate with plotter 400.That is to say that when described plotter 400 moved up, described idle running lifter (not shown go out) also moved up, and upwards promotes described dummy roll 360 simultaneously.Therefore, described dummy roll 360 and driven roller 350 interval preset distances.On the contrary, when described plotter 400 moved down, described idle running lifter (not shown go out) also moved down, and moves down described dummy roll 360 simultaneously.Therefore, described dummy roll 360 flexibly contacts described driven roller 350, thereby transmits described lead frame L.
Simultaneously, as shown in Figure 3 and Figure 4, second retainer 430 is arranged on the front end of described plotter 400, when described plotter 400 moves up described lead frame L's is mobile thereby stop, the 3rd retainer 440 is installed in the next door of second retainer 430 according to processing order, and when described plotter 400 moves down described lead frame L's is mobile thereby stop.Be similar to described dummy roll 360, the described second and the 3rd retainer 430 and 440 along with on the described plotter 400/move down and move up and down repeatedly, thereby stop moving of described lead frame L.For reaching this purpose, described second retainer 430 is resiliently mounted on the bottom of described plotter 400, thereby stop the mobile of when described plotter 400 moves up described lead frame, described the 3rd retainer 440 is resiliently mounted on the pedestal 230 of described press unit 200, and when described plotter 400 moves down described lead frame L's is mobile thereby stop.
In addition, the 3rd transducer 452 be arranged on described the 3rd retainer 440 upstream portion near, thereby check whether described lead frame L has been moved beyond described the 3rd retainer 440.When described the 3rd transducer 452 detected the lead frame L that is moved beyond described the 3rd retainer 440, described first retainer 320 moved down, and described like this lead frame L is passed to described second retainer 430.Simultaneously, described the 3rd transducer 452 checks also whether the front end of described lead frame L normally arrives described the 3rd retainer 440.
Pin 510 front ends that are arranged in such a way at described conveyer 500: described pin 510 can be inserted into patchhole 102 by the described elongated pore 418 that forms in the plotter on described 412.In addition, described conveyer 500 and rotating shaft (not shown go out) are connected, thus described conveyer 500 can with described plotter 400 cooperative operation.Described conveyer 500 is being handled reciprocating motion repeatedly on the direction, thereby described lead frame L is transmitted a spacing unit (pitch unit) on downstream direction.
Described press unit 200, plotter 400, second retainer 430 and dummy roll 360 are connected to the cam drive unit (device) that is connected with rotating shaft (not shown go out), so they can cooperate with one another.
Hereinafter, the operation that description is had the conventional lead frame supply unit of said structure.Purpose for convenience of explanation is called the first lead frame L1 with the lead frame of at first carrying, and the lead frame that will carry after the first lead frame L1 is called the second lead frame L2.
Fig. 5 is the flow chart that conventional lead frame supply unit operating process shown in Figure 1 is shown.Fig. 6 is the schematic diagram that described conventional lead frame supply unit mode of operation is shown to Fig. 9.
At first, detect the first lead frame L1 that is moved beyond described first retainer 320 if be arranged near second transducer 340 of described first retainer 320 downstream parts, then first retainer 320 relies on first cylinder (not shown go out) to move up.At this moment, the second lead frame L2 that relies on load units 100 to be loaded on the conveyer belt 314 is passed to first retainer 320, touches first retainer 320 (referring to Fig. 6) up to it.Simultaneously, near the described first sensor 330 that is arranged on first retainer, 320 upstream portion checks whether the described second lead frame L2 normally is delivered to first retainer 320 zero defect.Do not arrived described first retainer 320 if judge the described second lead frame L2, then show error message by normal delivery.
In this state, if near described the 3rd transducer 452 that is arranged on described the 3rd retainer 440 upstream portion detects the rear end that relies on conveyer 500 to be moved beyond the described first lead frame L1 of the 3rd retainer 440, then first retainer 320 relies on first cylinder (not shown go out) to move down, and the second lead frame L2 relies on roller driver element 354 to touch second retainer 430, mobile being stopped (referring to Fig. 7) of the described like this second lead frame L2.At this moment, when the rear end of the first lead frame L1 during through the 3rd retainer 440, its operation of driven roller 350 beginnings of roller driver element 354 when the front end of the second lead frame L2 arrives the 3rd retainer 440, finishes its operation.
In this state, if described plotter 400 moves down, described second retainer 430 also moves down, thereby the described second lead frame L2 relies on roller driver element 354 to be passed to the 3rd retainer 440 (referring to Fig. 8).
At this moment, described the 3rd transducer 452 checks whether normally the front end of the second lead frame L2 arrives the 3rd retainer 440 in zero defect ground.If conclude that the described second lead frame L2 not by normal delivery to the three retainers 440, then shows error message.
Then, if described plotter 400 moves up, then described the 3rd retainer 440 also moves up, thereby relies on the conveyer 500 described second lead frame L2 that are installed in the press unit 200 to be transported to 200 1 spacing units of described press unit (referring to Fig. 9).
By this way, by on control and the plotter 400/the down operation of mobile described second retainer 430, described the 3rd retainer 440 and dummy roll 360 of cooperating, traditional lead frame supply unit can be transported to press unit with new lead frame.
Yet, according to traditional lead frame supply unit, when near the 3rd transducer 452 being arranged on the 3rd retainer 440 upstream portion detects the first lead frame L1 and has been moved beyond the 3rd retainer 440, after first retainer 320 moved down, the described second lead frame L2 was passed to described second retainer 430.Then, after second retainer 430 and plotter 400 moved down together, the described second lead frame L2 was passed to the 3rd retainer 440.Therefore, the described second lead frame L2 may not can be transported to the 3rd retainer 440 soon.That is to say, when lead frame by when first retainer 320 is transported to second retainer 430, possible time of origin postpones.
In addition because the 3rd retainer 440 that is fixed to pedestal 230 corresponding on the described plotter 400/move down and operate, so have only when described plotter 400 is moved upward, conveyer 500 can transmit lead frame.That is to say, though when the pin 510 of conveyer 500 is inserted into the patchhole 102 of lead frame L, described conveyer 500 may transmit described lead frame, but, in fact, when described lead frame L had been moved beyond described the 3rd retainer 440 after plotter 400 fully moves up, described conveyer 500 transmitted described lead frame L.Therefore, when lead frame was delivered to press unit, possible time of occurrence postponed.
In addition, because before described lead frame is transported to the 3rd retainer 440, described second retainer 430 is used to the anchor leg frame, thereby lead frame is transported to the 3rd retainer 440 apace.Therefore, if described lead frame has been transported to described the 3rd retainer 440, then there is no need to move up and down second retainer 430.Similarly, described dummy roll 360 and described driven roller 350 cooperative operation are to be transported to lead frame the second and the 3rd retainer 430 and 440.Therefore, if the front end of lead frame then there is no need to move up and down repeatedly through the 3rd retainer 440.Because described second retainer 430 and dummy roll 360 are designed to and plotter 400 cooperative operation, therefore second retainer 430 and dummy roll 360 such on/move down and may take place.Since on described second retainer 430 and the dummy roll 360/and moving down, lead frame produces unnecessary vibration, therefore causes the slip of described lead frame.
Summary of the invention
Therefore, the present invention considers the problems referred to above, and an object of the present invention is to provide a kind of conveying device and carrying method of lead frame, by using independent drive unit drives retainer and transducer, thereby described retainer and transducer can be operated discretely with plotter, fast lead frame is transported to press unit, and described lead frame does not produce vibration.
In order to finish above-mentioned purpose, according to an aspect of the present invention, the device that semiconductor lead frame is transported to press unit from load units is provided, this device comprises: second retainer, be installed in the plotter front end of press unit and drive individually, so that control is transported to lead frame the time of delivery of the 3rd retainer that the contiguous nip region upstream portion that forms installs in press unit by independent driver element; And the 3rd transducer, contiguous described second retainer is installed, whether be moved beyond described second retainer so that check the rear end of described lead frame, wherein when described the 3rd sensor has been moved beyond described second retainer to the rear end of described lead frame, carry new lead frame towards second retainer.
Described second retainer comprises stopper arms (stopper arm), it has actuation part (actuating part), be rotatably connected to the plotter bottom so that receive actuating force, protuberance, from described actuation part to upper process so that hinder lead frame, and elasticity support sector, extend downwards so that receive elastic force from described actuation part; Second Flexible element is connected to described elasticity support sector so that elastic force is applied to described stopper arms, and second cylinder, connects described actuation part so that actuation force is offered described stopper arms.
Four-sensor, contiguous the 3rd retainer is installed, and whether has been moved beyond described the 3rd retainer so that check the rear end of described lead frame.When the rear end that described four-sensor detects described lead frame has been moved beyond the 3rd retainer, carry towards the 3rd retainer by the described lead frame that described second retainer hinders.
Described second retainer is maintained at the position that moves down, and has been moved beyond described second retainer up to the rear end of described lead frame.
Roller unit is installed in the rear end of the conveyer of load units, so that described lead frame is transported to the described second and the 3rd retainer.Described roller unit comprises the driven roller that is used for providing to lead frame actuating force; And dummy roll, it is installed corresponding to described driven roller, and is driven individually by independent driver element, so as with transporting lead frame when described driven roller engages.
When being necessary that described lead frame is transported to the described second and the 3rd retainer, described dummy roll engages with described driven roller; When the front end of described lead frame had been moved beyond described the 3rd retainer, described dummy roll separated with described driven roller.
According to another aspect of the present invention, a kind of device that semiconductor lead frame is transported to press unit from load units is provided, this device comprises: first retainer, be installed in the rear end of the conveyer that is connected to load units, so that the control transporting lead frame is to the time of delivery of the plotter of press unit; The 3rd retainer, the upstream portion of the nip region of contiguous described press unit is installed, so that the time of delivery of described lead frame to the nip region of described press unit carried in control; Second retainer, the upstream portion of contiguous described the 3rd retainer is installed, so that the time of delivery of described lead frame to described the 3rd retainer carried in control; The 3rd transducer, contiguous described second retainer is installed, and whether has been moved beyond described second retainer so that check the rear end of described lead frame; Four-sensor, contiguous described the 3rd retainer is installed, whether be moved beyond described the 3rd retainer so that check the rear end of described lead frame, wherein first to the 3rd retainer is by independent driver element institute operation separately, according to signal, control described driver element from described the 3rd transducer or the transmission of described four-sensor.
According to another aspect of the present invention, provide a kind of semiconductor lead frame is transported to the method for press unit from load units, the method comprising the steps of: whether the rear end of detecting described lead frame has been moved beyond second retainer of the plotter front end that is installed in described press unit; When being moved beyond described second retainer when the rear end of concluding described lead frame, immediately new lead frame is carried towards described second retainer.
Described method further comprises step: whether the rear end of detecting described lead frame has been moved beyond the 3rd retainer of the nip region upstream portion installation of contiguous described press unit; When being moved beyond described the 3rd retainer when the rear end of concluding described lead frame, the lead frame that will be arranged in described second retainer is immediately carried towards described the 3rd retainer.
Description of drawings
From following detailed description with the accompanying drawing, it is more clear that above and other objects of the present invention, feature and advantage will become, wherein:
Fig. 1 is the plan view of conventional apparatus that is used to make semiconductor lead frame that comprises the lead frame supply unit;
Fig. 2 is the front view that the conventional apparatus of semiconductor lead frame is made in shown in Figure 1 being used to;
Fig. 3 illustrates to be installed in the interior retainer of conventional lead frame supply unit shown in Figure 1 and the amplification plan view of sensor arrangement;
Fig. 4 illustrates the amplification plan view that is installed in the second and the 3rd interior retainer of conventional lead frame supply unit shown in Figure 1 and roller unit arrangement;
Fig. 5 is the flow chart that conventional lead frame supply unit operating process shown in Figure 1 is shown;
Fig. 6 is the schematic diagram that conventional lead frame supply unit mode of operation shown in Figure 1 is shown to Fig. 9;
Figure 10 illustrates the plan view of device that is used to make semiconductor lead frame that comprises the lead frame supply unit according to an embodiment of the invention;
Figure 11 illustrates the front view that the device of semiconductor lead frame is made in shown in Figure 10 being used to;
Figure 12 illustrates to be installed in the interior retainer of lead frame supply unit shown in Figure 10 and the amplification plan view of sensor arrangement;
Figure 13 illustrates the amplification plan view that is installed in the second and the 3rd interior retainer of lead frame supply unit shown in Figure 10 and roller unit arrangement;
Figure 14 illustrates the front view of dummy roll and dummy roll driver element according to an embodiment of the invention;
Figure 15 illustrates the front view of dummy roll and dummy roll driver element in accordance with another embodiment of the present invention;
Figure 16 illustrates described second and the view of the 3rd retainer mode of operation;
Figure 17 is the sectional view that the second and the 3rd retainer and third and fourth sensor installation method are shown;
Figure 18 is the flow chart that lead frame supply unit operating process shown in Figure 10 is shown; With
Figure 19 is the schematic diagram that lead frame supply unit mode of operation shown in Figure 10 is shown to Figure 23.
Embodiment
Hereinafter, the preferred embodiments of the present invention will be described in conjunction with the accompanying drawings.
Because lead frame advances to press unit 200 from described load units 100, the componentry of contiguous described load units 100 will be defined as " upstream portion ", and the componentry of contiguous described press unit 200 is defined as " downstream part ".In addition, when explaining one when having two elements to end parts, an end parts of the upstream portion of neighbouring element is called as " front end ", and the other end of the downstream part of adjacent element partly is called as " rear end ".In addition, for convenience of the purpose of explaining, components identical is used identical Reference numeral in whole specification.
Figure 10 illustrates the plan view of device that is used to make semiconductor lead frame that comprises the lead frame supply unit according to an embodiment of the invention.Figure 11 illustrates the front view that the device of semiconductor lead frame is made in shown in Figure 10 being used to.
As shown in figure 10, the device that is used to make semiconductor lead frame mainly comprises load units 100, press unit 200, lead frame supply unit and be used to control the control unit (not shown go out) of said units operation.Because the structure of described load units 100 and press unit 200 and operation and of the prior art basic identical, so hereinafter they only are briefly described, and stressing the lead frame supply unit, this lead frame supply unit is a chief component of the present invention.
At first, as shown in figure 10, described load units 100 is provided with pending lead frame L, and under predetermined condition described lead frame L is loaded on the described lead frame supply unit.Described load units 100 comprises storing platform with a plurality of lead frame L (not shown go out) and the described lead frame that is used for being stacked in the storing platform rises to the lift (not shown go out) of service position.Simultaneously, the structure of described load units 100 can diversely be designed, as long as it can be under predetermined condition be loaded into lead frame described lead frame supply unit.
As shown in figure 11, described press unit 200 receives described lead frame L from described lead frame supply unit, and by the interaction between the upper and lower mould 212 and 214 that is arranged relative to each other, described lead frame L is divided into single semiconductor chip.Here, the zone that forms between described upper and lower mould 212 and 214 is defined as nip region, and described lead frame is handled therein.
Described lead frame supply unit is from load units 100 receive leg frame L, and described lead frame L is delivered to press unit 200.Described lead frame supply unit mainly comprises conveyer 300, plotter 400 and conveyer 500.
When lead frame L was loaded on the conveyer 300 by described load units 100, described conveyer 300 transmitted described lead frame L towards described plotter 400.Described conveyer 300 has the framework 310 of transmission; Be rotatably installed in the transfer roller 312 in the described transmission framework 310; Conveyer belt 314 is installed in and is used to transmit loading described lead frame L thereon on the described transfer roller 312; And transmit driver element 316, for transfer roller 312 provides actuating force.
In addition, as shown in figure 12, first retainer 320 is installed in the rear end of described conveyer 300, thereby the described lead frame L that control is transmitted by conveyer belt 314 is to the time of delivery of described plotter 400.Described first retainer 320 is connected to first cylinder 322, and this first cylinder 322 is operated under the control of described control unit.Described first retainer 320 relies on first cylinders 322 and moves up and down, thus described first retainer 320 from described conveyer 300 to upper process, and return its initial position, therefore the described lead frame L's that moves along conveyer 300 of control moves.Described first cylinder 322 can be manufactured into the form that relies on the Pneumatic pressure operation or rely on solenoid-actuated rotary cylinder.
In addition, first sensor 330 be arranged on first retainer, 320 upstream portion near so that check described lead frame L whether by normal delivery to first retainer 320.Second transducer 340 be arranged on described first retainer 320 downstream parts near exceed described first retainer 320 so that check whether described lead frame L has moved.
In addition, as shown in figure 12, roller unit is installed in the rear end of described conveyer 300, and is relative with described first retainer 320, so that described lead frame L is transported to described plotter 400.Thereby described roller unit comprises and being connected with roller driver element 354 so that the driven roller 350 of actuating force is provided and engages the dummy roll 360 of carrying described lead frame L with described driven roller 350 for described lead frame L.
Referring to Figure 14, described dummy roll 360 comprises the idle running support 362 (idle bracket) that is connected to described transmission framework 310.The core of lazy arm (idle arm) 364 is hinged to described idle running support 362.Described dummy roll 360 is rotatably connected to an end of described lazy arm 360.The other end of described lazy arm 364 is granted elastic bias force by elastomeric element 366 on downward direction, and is boosted by the idle running driver element of operating under the control of control unit 368.Described idle running driver element 368 comprises pneumatic cylinder, hydraulic cylinder or solenoid.
When described control unit generated lead frame conveying signal, described idle running driver element 368 was rotated counterclockwise described lazy arm 364, so described dummy roll 360 moves down, suppresses described lead frame simultaneously.In this state, if described driven roller 350 is rotated, then rely on the dummy roll 360 described lead frames that engage with described driven roller 350 to be carried towards described second retainer 430 or the 3rd retainer 440.Simultaneously, if do not need to carry described lead frame, then discharge the actuating force of described idle running driver element 368, so described lazy arm 364 moves up, because the elastic force of described elastomeric element 366 is rotated in the clockwise direction, therefore stop to carry described lead frame simultaneously.
Described dummy roll 360 moves down up to described lead frame and arrives described the 3rd retainer 440.Then, described dummy roll 360 Be Controlled make it can be maintained at the state that moves up.That is to say, according to the present invention, described dummy roll 360 by no matter described plotter 400 on/following mobile and operated described idle running driver element 368 controlled.Therefore, there is no need to install respectively described idle running lifter, it is cooperated with described plotter 400 and moves up and down described dummy roll 360 repeatedly.Therefore, when described lead frame had entered into described press unit 200, described dummy roll 360 was separated with described driven roller 350, so do not produce vibration in described lead frame, prevented that therefore described lead frame from sliding.
Simultaneously, as shown in figure 15, the position of the idle running driver element 366 of described elastomeric element 366 and described dummy roll 360 can exchange mutually.
The described lead frame of described plotter 400 guiding relies on vertical delivery unit 420 simultaneously and moves up and down repeatedly, this vertical delivery unit 420 and the cam drive unit that has been connected rotating shaft (not shown go out) (not shown go out) cooperative operation.
As shown in Figure 10 and Figure 11, described plotter 400 comprises plotter 412 and the following plotter of arranging corresponding to described upward plotter 412 414.Described lead frame L is directed to by the gathering sill 416 that forms between upper and lower plotter 412 and 414.The described plotter 421 of going up is formed with the elongated pores 418 that plotter 412 is vertically arranged on described in its both sides.In addition, described down plotter 414 is formed with stop hole 419, and the described second and the 3rd retainer 430 and 440 projection 433 are inserted into wherein (referring to Figure 17).
In addition, as Figure 12 and shown in Figure 13, described the 3rd retainer 440 is installed near the upstream portion of the nip region that forms in press unit 200, so that control the time of delivery of described lead frame to described press unit 200.Described second retainer 430 is installed near described the 3rd retainer 440 upstream portion, so that control the time of delivery of described lead frame to described the 3rd retainer 440.That is to say, described second retainer 430 is fixing described lead frame near described the 3rd retainer 440 upstream portion, so that described lead frame is transported to described the 3rd retainer 440 fast, and the 3rd retainer 440 is fixed described lead frame near the upstream portion of the nip region of press unit 200, so that described lead frame is transported to described press unit 200 fast.
As Figure 16 and shown in Figure 17, described second retainer 430 comprises stopper arms 432, and these stopper arms 432 cores are rotatably connected to down the bottom of plotter 414; Second elastomeric element 436 is used for applying bias force to stopper arms 432; And second cylinder 438, be used to activate described stopper arms 432.Described stopper arms 432 comprises protuberance 433, its from an end of described stopper arms 432 to upper process, so that hinder lead frame; Actuation part 434 is from the other end extension of described stopper arms 432, so that receive actuating forces from described second cylinder 438; And elasticity support sector 435, extend downwards from described stopper arms 432, thereby the elastic force of described second elastomeric element 436 can be applied to described elasticity support sector 435.Described second retainer 430 has along the structure of described plotter 400 lateral symmetry.Preferably, described second cylinder 438 comprises pneumatic cylinder.Yet it also is possible making described second cylinder 438 with the form of hydraulic cylinder or solenoid cylinder.
According to the operation of described second cylinder 438 under the control of described control unit, described second retainer 430 with said structure is inserted into the stop hole 419 of plotter 400, or therefrom detaches, thereby the described lead frame L's of restriction/permission is mobile.That is to say that in the time of in air under the control at described control unit is transported to described second cylinder 438, the actuation part 434 of described stopper arms 432 can move up owing to the air pressure that is applied to the there, so described stopper arms 432 rotates in the clockwise direction.Therefore, the protuberance 433 of described stopper arms 432 moves down, and opens described stop hole 419 simultaneously.On the contrary, if under the control of described control unit, the air that is transported to described second cylinder 438 is cut off, then owing to be applied to elastic force there from described second elastomeric element 436, described elasticity support sector 435 is biased, so described stopper arms 432 rotates in the counterclockwise direction.Therefore, the protuberance 433 of described stopper arms 432 moves up, and closes described stop hole 419 (referring to Figure 17) simultaneously.
The structure of the 3rd retainer 440 and mechanism are basic identical with second retainer 430, so will be not described further hereinafter for fear of tediously long.
Unlike the prior art, the second and the 3rd retainer 430 and 440 on/move down can be not with described plotter 400 on/move down and cooperate.That is to say, described the and the 3rd retainer 430 and 440 according on the control signal of control unit and the described plotter 400/move down and control moving of described lead frame discretely.Because under the control of the unit of described control, operate the described second and the 3rd retainer 430 and 440,, do not cause the vibration of described lead frame so they can stop to move of described lead frame apace by independent driver element.
Be installed in the bottom of described plotter 400 though the described second and the 3rd retainer 430 and 440 has been described, they can be arranged on all places according to its application.In addition, the described second and the 3rd retainer 430 and 440 structure and shape can be made various modifications, as long as they can controls the mobile of described lead frame under the control of described control unit.
In addition, the 3rd transducer 450 be arranged on described second retainer 430 downstream parts near whether be moved beyond described second retainer 430 so that check described lead frame rear end.If described the 3rd transducer 450 detects the described lead frame L that is moved beyond described second retainer 430, then described first retainer 320 moves down under the control of described control unit, and described second retainer 430 moves up.Therefore, the new lead frame that is hindered by described first retainer 320 passes to described second retainer 430 from described first retainer 320, and touches described second retainer 430.That is to say that be moved beyond described second retainer 430 in case entered into the lead frame of described press unit 200, new lead frame just is transported to described second retainer 430, can improve the transporting velocity of described lead frame.Yet, though near the 3rd transducer 450 that is installed in described second retainer 430 downstream parts can detect the lead frame that has been moved beyond described second retainer 430, also be impossible check described new lead frame described second retainer 430 that whether arrives safe and sound for described the 3rd transducer 450.
Simultaneously, described the 3rd transducer 450 can rely on its application be installed in described second retainer, 430 upstream portion near.In this case, described the 3rd transducer 450 can not only detect the lead frame that has been moved beyond described second retainer 430, and can also detect the new lead frame that arrives described second retainer 430.At this moment, even described the 3rd transducer 450 has been passed through in the rear end of described lead frame, described second retainer 430 also may no longer move up.That is to say, preferably, the decoder of drive motor that is used for the conveyer 500 of press unit 200 detects the position of described conveyer 500 by this way: after described lead frame had been moved beyond described second retainer 430, described second retainer 430 can be moved upward.In this case, described second retainer 430 may not cause the vibration of described lead frame.
In addition, four-sensor 460 be arranged on described the 3rd retainer 440 upstream portion near whether be moved beyond described the 3rd retainer 440 so that check the rear end of the lead frame of the nip region enter into press unit 200.When described four-sensor 460 detected the lead frame that is moved beyond described the 3rd retainer 440, described second retainer 430 moved down under the control of described control unit, and described the 3rd retainer 440 moves up.Therefore, the lead frame that is hindered by described second retainer 430 is passed to described the 3rd retainer 440 from described second retainer 430.Simultaneously, described four-sensor 460 checks also whether the front end of new lead frame normally arrives the 3rd retainer 440.
Simultaneously, described four-sensor 460 can rely on its application be installed in described the 3rd retainer 440 downstream parts near.Yet in this case, described four-sensor 460 can not detect near the new lead frame described the 3rd retainer 440 upstream portion.Therefore, be necessary near the extra transducer of installation described the 3rd retainer 440 upstream portion, so that detect the new lead frame that arrives described the 3rd retainer 440.
In addition, as shown in figure 16, described third and fourth transducer 450 and 460 is installed on the sensing framework 480 that is fixed to plotter 400, for convenience of the maintenance and the maintenance work of described third and fourth transducer 450 and 460.Yet described third and fourth transducer 450 and 460 installation site can differently be selected, as long as they can easily detect the position of described lead frame.
In this manner, when described the 3rd transducer 450 detected the lead frame that is moved beyond described second retainer 430, described first retainer 320 moved down, so new lead frame is transported to described second retainer 430 immediately.In addition, when described four-sensor 460 detected the lead frame that is moved beyond described the 3rd retainer 440, described second retainer 430 moved down, so new lead frame is transported to described the 3rd retainer 440 immediately.Therefore, transporting lead frame that may be quick and continuous.
In addition, whether the further installation direction detecting sensor 470 of energy between the described second and the 3rd retainer 430 and 440 is so that it is correct to detect the lead frame position of the plotter 400 of shifting to press unit 200.
Described conveyer 500 is arranged in the top of described plotter 400, and cooperate and move back and forth repeatedly handling on the direction with the rotation of rotating shaft (not shown go out) in being installed in press unit 200, therefore spacing unit of transmission lead frame on downstream direction.Pin 510 front ends that are arranged in such a way at described conveyer 500: described pin 510 can be inserted into the patchhole 102 that forms in lead frame L both sides by the elongated pore 418 that forms in last plotter 412.
When described plotter 400 moved up, the pin 510 of described conveyer 500 was inserted into the patchhole 102 of described lead frame L, so described lead frame L is in the downstream side spacing unit that moves up.In addition, when described plotter 400 moved down, the pin 510 of described conveyer 500 was discharged from described patchhole 102, and flatly is returned to its initial position.Described pin 510 such moving can be repeated to carry out.
Hereinafter, the operation that description is had the lead frame supply unit of said structure.Purpose for convenience of explanation is called the first lead frame L1 with the lead frame of at first carrying, and the lead frame that will carry after the first lead frame L1 is called the second lead frame L2.
Figure 18 illustrates the flow chart of lead frame supply unit operating process according to an embodiment of the invention.Figure 19 is that the schematic diagram of lead frame supply unit mode of operation according to an embodiment of the invention is shown to Figure 22.
At first, if near described second transducer 340 that is arranged on described first retainer 320 downstream parts detects the first lead frame L1 that is moved beyond described first retainer 320, then described first retainer 320 is moved up by described first cylinder 322.At this moment, the second lead frame L2 that is loaded on the conveyer belt 314 by described load units 100 is passed to described first retainer 320, contacts described first retainer 320 (referring to Figure 19) up to it.
Simultaneously, be arranged near the described first sensor of described first retainer, 320 upstream portion 330 and check whether the described second lead frame L2 normally is delivered to described first retainer 320 zero defect.Do not arrived described first retainer 320 if conclude the described second lead frame L2, then show error message by normal delivery.
In this state, if being arranged near described second retainer 430 downstream parts described the 3rd transducer 450 detects by conveyer 500 and carries the rear end of the first lead frame L1 of a spacing unit to be moved beyond described second retainer 430, then described first retainer 320 is moved down by described first cylinder 322, and described second retainer 430 is moved up by described second cylinder 438, and described like this dummy roll 360 moves down.Therefore, described dummy roll 360 engages with described driven roller 350, thereby the described second lead frame L2 relies on described dummy roll 360 to be passed to described second retainer 430, and contacts with described second retainer 430, so mobile being stopped (referring to Figure 20) of the described second lead frame L2.
In addition, if being arranged near described the 3rd retainer 440 upstream portion described four-sensor 460 detects by conveyer 500 and carries the rear end of the first lead frame L1 of a spacing unit to be moved beyond described the 3rd retainer 440, then described second retainer 430 is moved down by described second cylinder 438, and described the 3rd retainer 440 is moved up by described the 3rd cylinder (not shown go out), so described dummy roll 360 engages with described driven roller 350.Therefore, described dummy roll 360 is with described driven roller 350 rotations, so the described second lead frame L2 relies on described dummy roll 360 to be passed to described the 3rd retainer 440, and contacts with described the 3rd retainer 440, so described second the mobile of lead frame L2 is stopped.At this moment, the described first lead frame L1 carries a spacing unit towards press unit 200.
Simultaneously, be arranged near the four-sensor of described the 3rd retainer 440 upstream portion 460 and check whether normal zero defect ground arrives described the 3rd retainer 440 to the described second lead frame L2.If conclude that the described second lead frame L2 not by normal delivery to the three retainers 440, then shows error message.
In this manner, if move up described plotter 400 after the described first lead frame L1 has been conveyed into press unit 200, then described dummy roll 360 is moved up by idle running driver element 368, so described dummy roll 360 separates with driven roller 350.Simultaneously, described the 3rd retainer 440 relies on described the 3rd cylinder (not shown go out) to move down, and the described second lead frame L2 is by being installed in the spacing unit of nip region (referring to Figure 23) that conveyers 500 in the press unit 200 are transported to press unit 200.It is processed having reservation shape to be transported to the lead frame of nip region of press unit 200, and is passed to the next stage.
For lead frame is transported to press unit 200 from load units 100, repeat said process.
Although think that in conjunction with current the most practical and preferred embodiment describe the present invention, but be appreciated that the present invention is not limited to the disclosed embodiments and accompanying drawing, but on the contrary, the invention is intended to cover the interior various modifications and variations of spirit and scope of additional claim.
Commercial Application
As can be seen from the above description, according to the present invention, the described second and the 3rd retainer 430 Can move with the up/down of plotter 400 and separate and operate with 440, and according to described lead-in wire The position of frame and transporting velocity, described lead frame is carried individually by independent driver element, institute Continuously described lead frame being transported to the compacting unit. By convention, described second and Three retainers 430 and 440 up/down corresponding to plotter 400 move and repeatedly move up and down, Even so might carry immediately described lead frame, described lead frame also must be in second stop Device 430 or the 3rd retainer 440 places wait for the scheduled time. According to the present invention, with such side Formula is controlled the described second and the 3rd retainer 430 and 440: based on the state of first lead frame, and institute Stating second lead frame can be carried immediately.
In addition, described after plotter 400 is removed at the 3rd retainer 440 with prior art Lead frame is carried different by conveyer 500, the present invention can move down described the 3rd retainer 440, Even described plotter 400 does not also move up fully because described the 3rd retainer 440 by Independent driver element drives. Therefore, the pin 510 1 of conveyer 500 is inserted into lead-in wire The patchhole 102 of frame, described the 3rd retainer 440 just can move down, so described lead-in wire Frame can be carried rapidly by conveyer 500.
According to the present invention, examine when being installed near second retainer, 430 the 3rd sensors 450 When measuring described lead frame and being moved beyond described second retainer 430, ended by described first The new lead frame that moving device 320 hinders is transported to described second retainer 430 immediately, so institute State lead frame and can be transported to second retainer 430 from first retainer 320 rapidly.
In addition, according to the present invention, when the front end of described lead frame arrives described the 3rd retainer 440 The time, the described second and the 3rd retainer 430 and 440 maintains the position that moves down, and Described dummy roll 360 moves up, and separates with described driven roller 350 simultaneously. Therefore, can Do not produce by the described second and the 3rd retainer 430 and 440 and described dummy roll 360 upper/ The vibration that lower movement causes is so can prevent the conveying mistake that described lead frame slides and brings.

Claims (9)

1, a kind of semiconductor lead frame is transported to the device of press unit from load units, this device comprises:
Second retainer is installed in the plotter front end of press unit and utilizes independent driver element to drive individually, so that control is transported to lead frame the time of delivery of the 3rd retainer of the contiguous nip region upstream portion installation that forms in press unit; And
The 3rd transducer, contiguous described second retainer is installed, and whether has been moved beyond described second retainer so that check the rear end of described lead frame,
Wherein when described the 3rd sensor has been moved beyond described second retainer to the rear end of described lead frame, carry new lead frame towards second retainer.
2, device as claimed in claim 1 is characterized in that, described second retainer comprises:
Stopper arms, it has: actuation part, described actuation part are rotatably connected to the plotter bottom so that receive actuating force; Protuberance, described protuberance from described actuation part to upper process so that hinder lead frame; With elasticity support sector, described elasticity support sector extends downwards so that receive elastic force from described actuation part;
Second Flexible element is connected to described elasticity support sector so that elastic force is applied to described stopper arms; And
Second cylinder connects described actuation part so that actuation force is imposed on described stopper arms.
3, device as claimed in claim 1, further comprise four-sensor, its contiguous the 3rd retainer is installed, whether be moved beyond described the 3rd retainer so that check the rear end of described lead frame, wherein when the rear end that described four-sensor detects described lead frame has been moved beyond the 3rd retainer, carry towards the 3rd retainer by the described lead frame that described second retainer hinders.
4, device as claimed in claim 3 is characterized in that, described second retainer is maintained at the position that moves down, and has been moved beyond described second retainer up to the rear end of described lead frame.
5, device as claimed in claim 3, further comprise roller unit, it is installed in the rear end of the conveyer of load units, so that described lead frame is transported to the described second and the 3rd retainer, wherein said roller unit comprises the driven roller that actuating force is provided to lead frame; And dummy roll, it is installed corresponding to described driven roller, and is driven individually by independent driver element, so as with transporting lead frame when described driven roller engages.
6, device as claimed in claim 5 is characterized in that, when being necessary that described lead frame is transported to the described second and the 3rd retainer, described dummy roll engages with described driven roller; When the front end of described lead frame had been moved beyond described the 3rd retainer, described dummy roll separated with described driven roller.
7, a kind of semiconductor lead frame is transported to the device of press unit from load units, this device comprises:
First retainer is installed in the rear end of the conveyer that is connected to load units, so that control the time of delivery of transporting lead frame to the plotter of press unit;
The 3rd retainer, the upstream portion of the nip region of contiguous described press unit is installed, so that the time of delivery of described lead frame to the nip region of described press unit carried in control;
Second retainer, the upstream portion of contiguous described the 3rd retainer is installed, so that the time of delivery of described lead frame to described the 3rd retainer carried in control;
The 3rd transducer, contiguous described second retainer is installed, and whether has been moved beyond described second retainer so that check the rear end of described lead frame; With
Four-sensor, contiguous described the 3rd retainer is installed, and whether has been moved beyond described the 3rd retainer so that check the rear end of described lead frame,
Wherein the independent driver element of first to the 3rd retainer utilization is operated separately, according to the signal from described the 3rd transducer or the transmission of described four-sensor, controls described driver element.
8, a kind of semiconductor lead frame is transported to the method for press unit from load units, the method comprising the steps of:
Whether the rear end of detecting described lead frame has been moved beyond second retainer of the plotter front end that is installed in described press unit; With
When the rear end of concluding described lead frame has been moved beyond described second retainer, immediately new lead frame is carried towards described second retainer.
9, method as claimed in claim 8 further comprises step: whether the rear end of detecting described lead frame has been moved beyond the 3rd retainer of the nip region upstream portion installation of contiguous described press unit; When being moved beyond described the 3rd retainer when the rear end of concluding described lead frame, the lead frame that will be arranged in described second retainer is immediately carried towards described the 3rd retainer.
CN200480044187.XA 2004-10-09 2004-10-09 Feeding apparatus and feeding method for semiconductor lead frame Expired - Fee Related CN100481419C (en)

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PCT/KR2004/002586 WO2006038746A1 (en) 2004-10-09 2004-10-09 Feeding apparatus and feeding method for semiconductor lead frame

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CN100481419C CN100481419C (en) 2009-04-22

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100215937B1 (en) * 1996-12-12 1999-08-16 곽노권 Equipment for manufacturing lead frame of a semiconductor
KR20000007549A (en) * 1998-07-04 2000-02-07 윤종용 Lead frame shifter
JP2003077938A (en) * 2001-09-07 2003-03-14 Nidec Tosok Corp Lead frame conveying device
KR20040031375A (en) * 2002-10-05 2004-04-13 삼성전자주식회사 Trim/form device for semiconductor package

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