CN101038865A - A method of fabricating a thin film - Google Patents
A method of fabricating a thin film Download PDFInfo
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- CN101038865A CN101038865A CNA2007100855974A CN200710085597A CN101038865A CN 101038865 A CN101038865 A CN 101038865A CN A2007100855974 A CNA2007100855974 A CN A2007100855974A CN 200710085597 A CN200710085597 A CN 200710085597A CN 101038865 A CN101038865 A CN 101038865A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000010409 thin film Substances 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 238000002513 implantation Methods 0.000 claims abstract description 26
- 239000000356 contaminant Substances 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 230000002776 aggregation Effects 0.000 claims description 29
- 238000004220 aggregation Methods 0.000 claims description 29
- 238000002347 injection Methods 0.000 claims description 27
- 239000007924 injection Substances 0.000 claims description 27
- 239000003344 environmental pollutant Substances 0.000 claims description 25
- 231100000719 pollutant Toxicity 0.000 claims description 25
- 238000000137 annealing Methods 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052734 helium Inorganic materials 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
- 238000005473 Guinier-Preston zone Methods 0.000 claims description 4
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 4
- 230000003628 erosive effect Effects 0.000 claims description 4
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims description 4
- 238000010849 ion bombardment Methods 0.000 claims description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 33
- 239000000463 material Substances 0.000 abstract description 6
- 239000012779 reinforcing material Substances 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 description 36
- 229940090044 injection Drugs 0.000 description 23
- 239000012535 impurity Substances 0.000 description 21
- 229910052731 fluorine Inorganic materials 0.000 description 14
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 13
- 239000011737 fluorine Substances 0.000 description 13
- 229910052799 carbon Inorganic materials 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical compound Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- -1 helium ion Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
Abstract
A thin film manufacturing method includes: (a) an implementation step to form an implemented-ion concentration layer, where ion is driven into one of the surfaces of a substrate formed from semiconductor material and a thin film is demarcated at the upper part of the substrate in a predetermined depth in the substrate; (b) a step to closely contact the surface of the substrate with a reinforcing material; and (c) a step to peel the thin film touching the reinforcing material after the film is peeled between layers in a concentrated ionization layer. The method of this invention further includes a heat treatment step to trap contaminants so as to prevent peeling between layers in the concentrated ionization layer after the implantation step (a) and before the peeling step (c), and also a step to remove zones disturbed in the peeling step (c) by trapping contaminants after the step (c).
Description
Technical field
The present invention relates to make the method for semiconductor material thin film, comprise Smart Cut
TMTechnology.
Background technology
Use Smart Cut
TMThe example of technology american documentation literature US-A-5 374564 or by people such as A.J.Auberton-Herv é write, title for " Why can SmartCut change the future of microelectronics? " article in be described, described paper is published the Systems in Int.Journal of High Speed Electronics and, 2000, the 10th volume, the 1st phase is in the 131-146 page or leaf.This technology is used the following step:
A) utilize hydrogen or rare gas type light ion (for example helium) to bombard a surface of substrate (for example making), inject substrate and produce the reduction micro-cavity layer with described ion with enough concentration by silicon;
B) make described substrate surface form tight the contact with rigid body or reception substrate; With
C) by using heat treatment and/or mechanical separation stress, for example blade is inserted on the micro-cavity layer plane and/or applies tensile stress and/or bending stress and/or shear stress, and/or use the ultrasonic wave of suitable power and frequency or microwave and break/peel off at the micro-cavity layer place.
Injected substrate by separating a part, this method can produce the film with uniform thickness, and described thickness equals to be bombarded substrate surface and substantially by the distance between the micro-cavity layer that inject to form.With other known methods of making film, the method that for example is called " SIMOX " (is described in document " SIMOX SOI for integrated circuit fabrication ", Hon WaiLam, IEEE Circuits and Devices Magazine, in July, 1987) or by chemistry or the abrasion of any other chemical-mechanical the method for wafer attenuation is compared, this method neither needs high injection rate, does not also need etching to stop the barrier layer.
But, utilize this method, the divert film main body comprises simple metal (Al), transition metal (Ti, Cr, Fe, Co, Ni, Cu, Zn etc.), alkali metal (Li, Na, K etc.), alkaline-earth metal (Mg, Ca, Ba etc.), halogen (F, Br, Cl), nonmetal (As) or organic pollution (C, N, O) are as polluting impurity.These impurity are corresponding to impurity that exists in starting substrate and/or the impurity introduced by method therefor.For instance, the existence of transition metal type impurity may cause the electrical properties of divert film that very big change takes place.
Summary of the invention
The objective of the invention is to overcome above-mentioned defective, and propose to make the solution of film by a method, described method comprises that injecting light ion is equivalent to the step of the micro-cavity layer of weakening region with generation, and described substrate can be stripped from (Smart Cut at this weakening region place
TMMethod), reduce the volumetric concentration that is present in the impurity in the separating film simultaneously.
This purpose realizes by the method for making film, comprising:
A) at least one implantation step, it utilizes hydrogen or helium type light ion separately or a surface of the substrate of being made by semi-conducting material with other materials (for example injecting jointly by boron-hydrogen) bombardment, thereby the desired depth place in substrate forms one deck, described injection ion aggregation is at this layer, and described Guinier-Preston zone defines the film that is arranged in substrate top;
B) make the described surface of substrate form the tight step that contacts with a rigid body;
C) the film separation steps that will contact of peeling off by ion aggregation layer place with described rigid body;
In the method, implantation step a) afterwards and separating step c) before, carry out a heat treatment step to catch pollutant injecting the ion aggregation layer, described processing can not cause injecting the strippable substrate at ion aggregation layer place.After step c), by catching pollutant and the zone by the separating step disorder is removed.
The heat treatment step of execution is at first injecting ion aggregation layer place's generation/formation microcavity after injecting, and described microcavity forms capture chamber, secondly, allows Pollutants Diffusion and is captured in the described chamber.Except the surface, be positioned at the substrate portion of catching the microcavity top and therefore have the pollutant levels of minimizing, this substrate portion is corresponding to the film that will shift.Chemical-mechanical polishing and/or the chemical erosion of suitably selecting can be removed described surf zone, and contaminant trap and separating step make this zone become disorderly and polluted.Therefore, method of the present invention allows to make the film of the pollutant levels with minimizing.
Described substrate can be the substrate of being made by silicon, germanium, silicon-germanium, gallium nitride, GaAs or carborundum.
In one aspect of the invention, described method also comprises additional implantation step, this step is by being different from bombardment substrate surface formation under implantation step injection condition a), carry out under the condition of the described additional injection energy of implantation step in being higher than step a), thereby the ion aggregation layer that produces during than step a) more produces the additional ions Guinier-Preston zone in the depths.
In this case, the generation/formation in additional ion aggregation layer of described capture chamber, this layer is positioned at below the ion aggregation layer that forms plane of weakness, and described film will separate along described plane of weakness.Described pollutant is trapped in the zone that is positioned at below the film separated region subsequently, and is limited in the base main body that does not become a part of wanting divert film.
Described additional implantation step can utilize the helium ion to carry out.
In step c), divided thin film can cause by being applied to the separation stresses of injecting ion aggregation layer place from (substrate breakage).Described separation stresses can be by applying heat treatment (being higher than the annealing in process of carrying out under the situation of catching heat treatment temperature in temperature) and/or apply separation machinery stress (for example blade is inserted in inject ion aggregation layer place), and/or apply tensile stress and/or apply ultrasonic wave or microwave with suitable power and frequency and form.
Description of drawings
Figure 1A-1E is a schematic cross sectional views, shows a scheme according to the present invention and makes the Si film;
Fig. 2 is a flow chart, shows the step of carrying out in Figure 1A-1E;
Fig. 3 A-3F is a schematic cross sectional views, shows and makes the Si film according to another aspect of the present invention;
Fig. 4 is a flow chart, shows the step of carrying out in Fig. 3 A-3F;
Fig. 5 has shown the fluorine concentration in the Si substrate relevant with the contaminant trap heat treatment duration of the present invention;
Fig. 6 has shown the fluorine concentration in the Si substrate relevant with the heat treated duration of contaminant trap of the present invention; With
Fig. 7 has shown and has of the present inventionly caught heat treatment to having pollutant effects of different nature.
Embodiment
Method of the present invention be applicable to usually by with Smart Cut
TMThe substrate of any kind that method adapts is made semiconductor material thin film.The substrate that this substrate is particularly made by silicon (Si), germanium (Ge), silicon-germanium (SiGe), gallium nitride (GaN), GaAs (GaAs), carborundum (SiC) etc.
The present invention proposes, and is using Smart Cut
TMMethod is made during the film, use additional heat treatment step, after implantation step and before the separating step, this additional step is used for forming microcavity at implanted layer, wherein is present in starting substrate and/or is hunted down at the pollutant that injects and integrating step is introduced.Described microcavity has incomplete chemical bond on the wall within it, and it can catch the atom of polluter.
Should additional heat treatment must under sufficiently high temperature, carry out to allow Pollutants Diffusion to catching in the microcavity, but be no more than limiting temperature, described limiting temperature causes the substrate breakage at implanted layer place by crystal transformation in the substrate and the pressure in the microcavity.Catch microcavity and can produce and/or be formed directly into (Smart Cut in the implanted layer that causes strippable substrate
TMMethod) or be formed in the implanted layer of separating below the described layer.
Write by people such as M.Zhang, publish in the Journal ofApplied Physics on January 1st, 1999, the 85th volume, the document of the 1st phase " Comparison of Cu getteringto H+ and He+ implantation-induced cavities inseparation-by-implantation-of-oxygen wafers " and write by people such as A.Kinomura, publish in Nuclear Instruments and Methods in Physics Research B127/128 (1997), disclose in the document of 297-300 " Gettering of platinum and silver tocavities formed by hydrogen implantation in silicon " by H+ or He and injected, heat-treated thereafter and form capture chamber.But this capture chamber is not used in the substrate that breaks/peel off.On the contrary, in these two pieces of documents, pollutant injects by ion has a mind to introduce and be kept at substrate.
The method of making film according to one embodiment of the invention is described below with reference to Figure 1A-1E and 2.
In this embodiment, starting substrate or donor substrate 1 are by being coated with silicon dioxide (SiO
2) layer 2 silicon single crystal wafer constitute, described silicon dioxide layer obtains and has the thickness of about 1450 (Angstroms) by heated oxide.
In first implantation step (S1), substrate 1 stands to pass and comprises (SiO
2) layer 2 is in the ion bombardment 10 of the hydrogen ion H+ of interior base plan 7.The H+ ion is infused in the injection energy and about 5.75 * 10 of about 37keV (kilo electron volt)
16Atoms/cm
2Carry out under the situation of the implantation dosage of (atom/square centimeter).These injection conditions allow the desired depth place in substrate 1 to be parallel to substrate surface 7 and form ion aggregation layer 3, thereby define the film 4 and the part 5 that is arranged in the lower area of substrate of the upper area that is arranged in substrate 1, this part 5 is corresponding to the remainder (Figure 1A) of substrate 1.
Select implantation dosage, make that the H+ ion concentration in the layer 3 is enough to produce micro-cavity layer after injecting or during the heat treatment step subsequently.But people should be noted that microcavity may form in injection period.The H+ ion enters the penetration depth of substrate mainly by injecting the energy level decision.In the embodiment described here, be infused under the injection energy of about 37keV and carry out, its allow H+ ion aggregation layer 3 below the surface 7 of bombardment substrate 1 approximately 300nm (nanometer) locate formation.
The starting substrate 1 that is injected into subsequently for example by the molecule solder bond to rigid body 6, for example on the silicon wafer (step S2, Figure 1B).Starting substrate 1 comprises residual impurity (for example fluorine F, carbon C etc.).In addition, oxidation (forms SiO
2Layer), ion injection and integrating step may increase the amount of pollutant by the impurity generation of starting substrate 1.
According to the present invention, carry out suitable heat treatment step, it produces microcavity and/or forms and all contaminations is diffused in the microcavity in H+ ion aggregation layer 3, and described contaminant trap is (step S3, Fig. 1 C) in described microcavity.In this embodiment, microcavity not only constitutes by the trap of diffuse pollution material, and constitutes by applying the plane of weakness that mechanical stress is broken substrate subsequently.
This heat treatment step for example can under 350 ℃, carry out 18h (hour) annealing in process.This annealing in process can be with the local fluorine ion amount that increases in the layer 3 of 1/50 (a factor of 50), thereby reduces in the substrate remainder, particularly corresponding to the fluorinion concentration in the film 4 that will separate that part of.The annealing in process of 350 ℃ of following 18h reduces by half the carbon impurity concn in the film 4.At last, described (350 ℃-18h) annealing in process causes microcavity to form, and described microcavity is local to be weakened substrate and this zone (i.e. layer 3) is had and the feature of the density that adapts of breaking, size, distribution, form aspects such as (morphological).
In the example of Miao Shuing, heat treatment step carries out afterwards in the step (step S2) that is attached on the rigid body herein.But this heat treatment step can carry out before the step that is attached on the rigid body 6.
After heat treatment step, film 4 separates (step S4, Fig. 1 D) by peeling off from substrate 1.This step is for example undertaken by blade is inserted on the microcavity region for example by applying mechanical stress, and diffusion along described zone causes breaking.
Transfer to film 4 on the rigid body 6 except its plane of disruption 8 places, contain pollutant hardly in its main body, the described plane of disruption 8 makes the polluter that has spread and be captured in the microcavity assemble after heat treatment step.
Carry out traditional polishing step (chemical-mechanical polishing) subsequently to remove surperficial 8 disorderly Polluted area and to reduce its degree of roughness (step S5, Fig. 1 E).The thickness of removing by polishing is about 1500 .Pollution/zone of turbulence also can be removed by selectable chemical erosion (etching), selects polishing to improve surface roughness thereafter.
Can carry out final high-temperature heat treatment (1100 ℃) subsequently and also repair any defective (step S6) that is present in the divert film with ruggedized construction.
Fig. 3 A-3F and 4 has shown the distortion of membrane according to the invention manufacture method.The place that this embodiment is different from scheme mentioned above is that the different depth place in substrate forms two-layer micro-cavity layer, and one deck is used to catch pollutant, another the layer be used to make divided thin film from.
Starting substrate 10 is by being coated with silicon dioxide (SiO
2) layer 11 silicon single crystal wafer constitute, described silicon dioxide layer obtains and has the thickness of about 1450 by heated oxide.
In first implantation step (S10), substrate 1 at first stands to pass and comprises (SiO
2) layer 11 is in the ion bombardment 20 of the helium IONS OF H e of interior base plan 13.The He ion is infused in the injection energy and about 1.5 * 10 of about 60keV
16Atoms/cm
2Implantation dosage under carry out.These injection conditions make the approximately degree of depth place of the 300nm generation (Fig. 3 A) in substrate 10 of He ion aggregation layer 12.
In second implantation step (S11), described step can be carried out before or after a He ion implantation step, and substrate 1 stands to pass the ion bombardment 21 of the hydrogen ion H+ on plane 13.The H+ ion is infused in the injection energy and about 1.5 * 10 of about 32keV
16Atoms/cm
2Implantation dosage under carry out.These injection conditions allow the degree of depth place of about 230nm in substrate 10 to form H+ ion aggregation layer 14, thereby define the thin layer 15 and the part 16 that is arranged in the lower area of substrate of the upper area that is arranged in substrate 10, this part 16 is corresponding to the remainder (Fig. 3 B) of substrate 10.
In first implantation step (step S10), described injection energy is higher than the injection energy of second implantation step (step S11).Compare with the H+ ion aggregation layer 14 that second injection period produced, this energy can produce He ion aggregation layer 12 in the darker position of distance substrate surface.
The starting substrate 10 that is injected into for example arrives rigid body 17, for example (step 12, Fig. 3 C) on the silicon wafer by the molecule solder bond subsequently.Starting substrate 1 comprises residual impurity (for example fluorine F, carbon C etc.).In addition, oxidation (forms SiO
2Layer), ion injection and integrating step may increase the amount of pollutant by the impurity generation of starting substrate 10.
According to the present invention, carry out a heat treatment step, it allows to produce in He ion aggregation layer 12 (that is, 300nm under the surface of substrate 10) and/or forms microcavity and make the diffusion of all contaminations matter and be trapped in (step S13, Fig. 3 D) in the described microcavity.In this embodiment, the microcavity of layer 12 can only constitute the trap of diffuse pollution material.
This heat treatment step for example can be for carrying out the annealing in process of 1h under 400 ℃, with fluorine ion and the carbon impurity level in the part increase layer 12, thereby reduce in the substrate remainder, particularly corresponding to fluorine ion and carbon impurity concn in the film 15 that will separate that part of.Part impurity also is captured in the H+ ion aggregation layer 14, but with reference Figure 1A-1E and 2 description schemes in H+ ion aggregation layer 3 in impurity level compare negligible amounts.
This heat treatment step was identical before or after the step in conjunction with rigid body.
Under a temperature, carry out annealing in process subsequently, this temperature is higher than the heat treatment temperature of catching pollutant, and be enough to make by the pressure in the microcavity of crystal transformation in the substrate and H+ ion aggregation layer 14 produce between the part 16 in the remainder of film 15 and substrate 10 and peel off (step S14, Fig. 3 E).500 ℃ of following 30min (minute) annealing in process can cause substrate 10 to break at H+ ion aggregation layer 14 place, described H+ ion aggregation layer is positioned under the surface of substrate 10 approximately 230nm.
The thickness of transferring to the film 15 on the rigid body 17 is approximately 230nm, and in its main body He on the surface, comprise pollutant hardly, this is that described non-transfer layer is present in the part 16 of substrate remainder because a part of pollutant has been limited in catching in the microcavity of non-transfer layer 12.
Carry out traditional polishing step (chemical-mechanical polishing) subsequently with the zone of turbulence on the surface of removing film 15 and reduce its degree of roughness (step S15, Fig. 3 F).The thickness of removing by polishing is 1500 .Zone of turbulence also can be removed by selectable chemical erosion (etching), selects polishing to improve surface roughness thereafter.
Can carry out final high temperature (1100 ℃) heat treatment steps (S16) to improve the quality of divert film.
Measure (Fig. 5-7) with proof, for the injection condition that the step of breaking with subsequently injection zone place adapts, heat treatment is injected in the back can will be present in the contaminant trap of injecting substrate.
Fig. 5-7 has shown the measurement result of the pollutant levels that obtain in monocrystalline silicon substrate, described monocrystalline silicon substrate in the described condition of step S1, the S2 of reference Figure 1A, 1B and Fig. 2 (that is, with the injection energy and about 5.75 * 10 of about 37keV
16Atoms/cm
2Implantation dosage the H+ ion is injected in the Si substrate) inject down.Fig. 5-7 has shown the relevant result that obtains of condition (duration and/or temperature) with heat treatment step according to the present invention (step S3, Fig. 1 C).(SIMS) carries out measurement of concetration by secondary ion mass spectrometry.
Fig. 5 has shown the pollutant effects of heat treatment duration to catching of the present invention under the fluorine situation.Four curves of Fig. 5, P
350 ℃-50h, P
350 ℃-30h, P
350 ℃-18hAnd P
350 ℃-6hCorresponding to being injected with the fluorine concentration of observing on the hydrionic Si substrate thickness direction, wherein the time of carrying out is the heat treatment of 50h, 30h, 18h and 6h respectively under 350 ℃.People should observe, and the degree of depth place of fluorine concentration about 300nm in substrate enlarges markedly, and the described degree of depth is corresponding to the captive injection zone of pollutant.
It is bigger when the heat treatment of 50h is carried out in the increase of fluorine concentration in the capture region (that is the degree of depth place of about 300nm in substrate) under 350 ℃.
Fig. 6 has shown the influence that heat treatment temperature of the present invention is caught fluorine contaminant.Three curves of Fig. 6, P
350 ℃-51h, P
400 ℃-2hAnd P
450 ℃-8minCorresponding to the fluorine concentration of observing on Si substrate thickness direction, described Si substrate utilizes hydrogen ion to inject, and is carrying out 51h under 350 ℃, carrying out 2h under 400 ℃ and carry out the heat treatment of 8min under 450 ℃ respectively.People should observe, and the degree of depth place of fluorine concentration about 300nm in substrate enlarges markedly, and the described degree of depth is corresponding to the captive injection zone of pollutant.The increase of fluorine concentration is bigger when carrying out the heat treatment of 350 ℃ of following 51h in the capture region (that is the degree of depth place of about 300nm in substrate).But people should observe, at high temperature (400 ℃ and 450 ℃) but the time much smaller than 51h, that is, the heat treatment of carrying out under the situation of 400 ℃ of following 2h and 450 ℃ of following 8min also can be caught fluorine effectively.
Fig. 7 has shown the back injection heat treated influence relevant with pollutant character, and pollutant is organic oxygen (O) and carbon (C) type in this case.Four curves among Fig. 7, P
O-injects, P
O-400 ℃-1h, P
C-injectsAnd P
C-400 ℃-1hCorrespond respectively to:
Under the situation of not heat-treating, be injected with the oxygen impurity concentration of observing on the hydrionic Si substrate thickness direction;
Standing under 400 ℃ of heat treated situations of following 1h the oxygen impurity concentration of on the thickness direction that is injected with hydrionic Si substrate, observing;
Under the situation of not heat-treating, be injected with the carbon impurity concn of observing on the hydrionic Si substrate thickness direction;
Standing under 400 ℃ of heat treated situations of following 1h the carbon impurity concn of on the thickness direction that is injected with hydrionic Si substrate, observing;
In whole injection substrate (whole analysis depth) scope, particularly observe impurity concentration in whole thickness (between the 0-300nm) scope of substrate and reduce corresponding to the film that will shift.Like this, carbon impurity concn power with ten in the following film that will shift reduces.
Claims (13)
1. method of making film comprises:
A) at least one implantation step, it is by a surface of the substrate that utilizes ion bombardment and made by semi-conducting material, thereby the desired depth place in substrate forms one deck, and described injection ion aggregation is at this layer, and described Guinier-Preston zone defines the film that is arranged in substrate top;
B) make the described surface of substrate form the tight step that contacts with a rigid body;
C) the film separation steps that will contact of peeling off by ion aggregation layer place with described rigid body;
Wherein, implantation step a) afterwards and separating step c) before, described method comprises that also heat treatment step is to catch pollutant, this step can not cause the strippable substrate at ion aggregation layer place, and after step c), comprise with by catch pollutant and by separating step c) step removed of disorderly zone.
2. the method for claim 1, wherein in step a), described ion is the hydrogen ion.
3. the substrate of the method for claim 1, wherein described substrate for making by silicon, germanium, silicon-germanium, gallium nitride, GaAs or carborundum.
4. the method for claim 1, wherein described substrate is a monocrystalline silicon substrate, and wherein said contaminant trap heat treatment is carried out in 350 ℃-450 ℃ temperature range.
5. the method for claim 1, wherein described contaminant trap heat treatment is carried out about 18h to 30h under about 350 ℃ temperature.
6. the method for claim 1, also comprise additional implantation step, described step is by utilizing ion to form being different under the condition that implantation step a) adopts the bombardment substrate surface, described additional implantation step carries out being higher than under the injection energy of step a) at least, thereby the ion aggregation layer that produces during than step a) more produces the ion aggregation layer in the depths.
7. method as claimed in claim 6, wherein, in described additional implantation step, described ion is the helium ion.
8. method as claimed in claim 7, wherein, described substrate is a monocrystalline silicon substrate, and wherein said contaminant trap heat treatment step carries out about 1h under about 400 ℃ temperature.
9. the method for claim 1, wherein in step c), separation stresses acts on the Guinier-Preston zone that injects ion.
10. method as claimed in claim 9, wherein, described separation stresses is formed by applying heat treatment and/or mechanical separation stress and/or tensile stress and/or bending stress and/or tangential stress and/or ultrasonic wave or microwave.
11. the method for claim 1, wherein in step c), under the temperature that is higher than the contaminant trap heat treatment temperature, carry out annealing in process, thereby the ion aggregation layer place generation that causes forming is peeled off during step a).
12. the step of the method for claim 1, wherein described removal zone of turbulence is carried out by chemical-mechanical polishing or by chemical erosion optionally.
13. the method for claim 1 also is included in after the step c), makes the step of the film annealing of transferring on the rigid body under about 1000 ℃.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0650832 | 2006-03-13 | ||
| FR0650832A FR2898431B1 (en) | 2006-03-13 | 2006-03-13 | METHOD FOR MANUFACTURING THIN FILM |
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| CN101038865A true CN101038865A (en) | 2007-09-19 |
| CN101038865B CN101038865B (en) | 2010-06-02 |
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| CN2007100855974A Active CN101038865B (en) | 2006-03-13 | 2007-03-12 | A method of fabricating a thin film |
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|---|---|
| US (1) | US7588997B2 (en) |
| EP (1) | EP1835534A1 (en) |
| JP (1) | JP5214160B2 (en) |
| KR (1) | KR100864065B1 (en) |
| CN (1) | CN101038865B (en) |
| FR (1) | FR2898431B1 (en) |
| SG (2) | SG136060A1 (en) |
| TW (1) | TWI337762B (en) |
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| CN110534474A (en) * | 2019-09-03 | 2019-12-03 | 中国科学院上海微系统与信息技术研究所 | The preparation method of film on substrate |
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| FR2681472B1 (en) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | PROCESS FOR PRODUCING THIN FILMS OF SEMICONDUCTOR MATERIAL. |
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| JP3456521B2 (en) * | 1998-05-12 | 2003-10-14 | 三菱住友シリコン株式会社 | Method for manufacturing SOI substrate |
| KR100545990B1 (en) | 2000-06-02 | 2006-01-25 | 주식회사 실트론 | How to remove metal impurities in silicon wafer |
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| FR2845518B1 (en) | 2002-10-07 | 2005-10-14 | Commissariat Energie Atomique | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
| FR2847075B1 (en) * | 2002-11-07 | 2005-02-18 | Commissariat Energie Atomique | PROCESS FOR FORMING A FRAGILE ZONE IN A SUBSTRATE BY CO-IMPLANTATION |
| FR2861497B1 (en) * | 2003-10-28 | 2006-02-10 | Soitec Silicon On Insulator | METHOD FOR CATASTROPHIC TRANSFER OF A FINE LAYER AFTER CO-IMPLANTATION |
| US7772087B2 (en) * | 2003-12-19 | 2010-08-10 | Commissariat A L'energie Atomique | Method of catastrophic transfer of a thin film after co-implantation |
| FR2867307B1 (en) * | 2004-03-05 | 2006-05-26 | Soitec Silicon On Insulator | HEAT TREATMENT AFTER SMART-CUT DETACHMENT |
| FR2867310B1 (en) * | 2004-03-05 | 2006-05-26 | Soitec Silicon On Insulator | TECHNIQUE FOR IMPROVING THE QUALITY OF A THIN LAYER TAKEN |
-
2006
- 2006-03-13 FR FR0650832A patent/FR2898431B1/en active Active
- 2006-08-14 US US11/504,295 patent/US7588997B2/en active Active
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2007
- 2007-02-01 TW TW096103715A patent/TWI337762B/en active
- 2007-02-02 KR KR1020070010916A patent/KR100864065B1/en active IP Right Grant
- 2007-03-08 SG SG200701724-7A patent/SG136060A1/en unknown
- 2007-03-08 SG SG200906090-6A patent/SG155915A1/en unknown
- 2007-03-08 EP EP07103778A patent/EP1835534A1/en not_active Withdrawn
- 2007-03-12 CN CN2007100855974A patent/CN101038865B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| EP1835534A1 (en) | 2007-09-19 |
| US20070212852A1 (en) | 2007-09-13 |
| SG136060A1 (en) | 2007-10-29 |
| FR2898431B1 (en) | 2008-07-25 |
| FR2898431A1 (en) | 2007-09-14 |
| TW200741864A (en) | 2007-11-01 |
| KR100864065B1 (en) | 2008-10-16 |
| JP2007251172A (en) | 2007-09-27 |
| US7588997B2 (en) | 2009-09-15 |
| CN101038865B (en) | 2010-06-02 |
| SG155915A1 (en) | 2009-10-29 |
| KR20070093328A (en) | 2007-09-18 |
| TWI337762B (en) | 2011-02-21 |
| JP5214160B2 (en) | 2013-06-19 |
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