CN101032195A - 单机架单元交换机中的双层叠10吉比特x2上行链路 - Google Patents

单机架单元交换机中的双层叠10吉比特x2上行链路 Download PDF

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CN101032195A
CN101032195A CNA200580024458XA CN200580024458A CN101032195A CN 101032195 A CN101032195 A CN 101032195A CN A200580024458X A CNA200580024458X A CN A200580024458XA CN 200580024458 A CN200580024458 A CN 200580024458A CN 101032195 A CN101032195 A CN 101032195A
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motherboard
connector
module
pcb
circuit board
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瑟蜜尔·瓦塞夫达
威廉姆斯·F·小爱德华兹
迈克尔·克伦波斯特
大卫·纳尔逊
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Cisco Technology Inc
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    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
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    • G02B6/4274—Electrical aspects
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
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    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1428—Housings for small modular apparatus with terminal block
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/04—Connectors or connections adapted for particular applications for network, e.g. LAN connectors
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

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Abstract

一种用于在单机架单元交换机的前表面中提供双10GB上行链路的系统，所述单机架单元交换机在有限的空间中层叠两个MSA X2 I/O设备。在一个实施例中，这两个X2 I/O设备被设置在安装在母板上方的一个电路板的两侧面上。

Description

单机架单元交换机中的双层叠10吉比特X2上行链路
背景技术
单机架单元(1RU)交换机或者比萨盒(pizza box)在办公和商业中是非常普遍的，并且制造商已经努力在降低成本的同时增加越来越多的功能。目前的1RU交换机提供用于连接到端设备的48个端口。另外，这些单元必须提供上行链路以连接到干线或核心路由器或交换机。一般地，需要两个上行链路以提供冗余。
单RU交换机的前表面的尺寸只有1.75”×17.5”。可用于48个端口和上行链路的实际空间更小，因为产品本身包括框架边(bezel facing)，该框架边包括图形和包括与以前的产品类似的用户接口的其它项目。
以前的上行链路I/O设备(例如GBIC(吉比特接口转换器)或SFP(小形状因子可插拔)模块)具有相对较小的形状因子，并且在1RU交换机的前表面上有足够的空间可用于48个端口和两个上行链路。但是，随着10吉比特以太网(10GE)的出现，上行链路I/O设备的尺寸变大了。
一种类型的10GE上行链路I/O设备是MSA(多供应源协议)X2，该协议是在X2 MSA的说明书中定义的，其说明书通过引用结合于此。X2系统利用被安装在PCB(印刷电路板)上的侧轨道(side rail)支撑系统，PCB具有设置来容纳X2收发器的连接器端的连接器。X2收发器被插入交换机中，并且由轨道系统引导，因此X2收发器的连接器与PCB连接器相接合。该模块的前部包括框架，用于安装用于EMI保护的垫片。
由于X2 10 GE I/O设备的尺寸变大，已经不可能在48个端口的1RU交换机中提供两个10GE上行链路。
发明内容
在本发明的一个实施例中，两个X2模块相向地设置在双面PCB的两侧上。该双面PCB利用垂直支撑物被安装在母板的上方，并且被利用垂直连接器连接到母板。
在本发明的另一实施例中，双面PCB的厚度大约为0.2英寸，以提供X2模块的前面板之间的间隙并且为X2模块提供结构支撑。
在本发明的另一实施例中，利用带状连接器将X2模块耦合到母板。
在本发明的另一实施例中，在PCB模块下母板被切割以提供额外的空间用于通风。
在本发明的另一实施例中，这些模块具有相同的朝向，并且上方的模块被设置在上方PCB的上表面上，所述上方PCB被利用插入连接器连接到母板。
在本发明的另一实施例中，这些模块具有相反的朝向，并且上方模块被连接在上方PCB的下表面上，所述上方PCB被利用插入连接器连接到母板。
参考下面的详细描述和附图将清楚本发明的其它特征和优点。
附图说明
图1是本发明实施例的透视图；
图2是本发明实施例的详细的侧视图；
图3是具有被切割的母板的本发明实施例的侧视图；
图4是本发明另一实施例的侧视图；以及
图5是本发明另一实施例的侧视图。
具体实施方式
现在将详细参考本发明的各个实施例。在附图中示出了这些实施例的示例，其中相似的标号表示相同或相似的元件。虽然将结合这些实施例描述本发明，但是应当理解不希望将本发明局限于任何实施例。相反，希望覆盖可以包括在所附权利要求书所限定的本发明的精神和范围内的替换方式、修改方式和等同物。在下面的描述中，为了提供对各个实施例的全面理解，给出了许多具体的细节。但是，本发明可以在没有这些具体细节的中的一些或全部的情况下被实现。在其它一些示例中，没有详细描述熟知的处理操作，以免不必要地模糊本发明。
图1是本发明实施例的透视图。1RU交换机20具有前表面，前表面具有用于容纳48个端口的第一区域22和容纳2个MSA X2 10 GE上行链路模块26a和26b的第二区域24。前表面还具有为用户接口或控制接口预留的空间，以与现有的产品兼容。
X2模块26a和26b被利用轨道28安装在PCB板上。在本实施例中，利用2003年2月28日的X2MS修订版1.0b中定义的X2的MidPak版本。该模块的前部包括用于容纳TX和RX连接器插头的框架26和插座28。该框架与换机的前侧板22邻接。X2模块包括用于冷却的散热片。MSA XENPAK 70引线连接器将X2模块中的电子电路连接到印刷电路板上的迹线。
第一和第二X2模块26a和26b相向地设置在双面PCB 32上，该双面PCB通过垂直连接器36被连接到母板34，垂直连接器36将双面PCB 32的两个面上的迹线连接到母板34上的迹线。
图2是图1中所示的实施例的侧视图。双面PCB 32通过连接到底座43的支撑杆40和42被安装在母板的上方。在本实施例中，双面PCB的厚度大约为0.200英寸，以提供第一和第二X2模块26a和26b的框架26之间的分离，并且提供机械支撑。在一个实施例中，如图3中所示，在模块下母板34被部分切除，所以只有三或四个支撑物可用于支撑双面PCB32。
如图3中所示，第一X2模块26a被连接到第一XENPAK连接器44，连接器44将第一X2模块中的电路连接到双面PCB 32的上表面上的迹线，并且第二X2模块26b被连接到第二XENPAK连接器46，连接器46将第二X2模块中的电路连接到双面PCB 32的下表面上的迹线上。
1RU交换机中的48个前置端口所需要的空间要求两个10GE的上行链路被层叠，因为由于例如包括模式按钮、图形和形成类似于其它产品的用户接口的其它组件的限制，在1RU交换机的前部没有足够的水平空间来允许这些模块并排放置。
在图1和图2中所示的“相向”的配置中，第二X2模块26b相对于第一X2模块26a颠倒放置。因此需要较厚的PCB来支撑层叠在第一模块上的第二模块。通过将X2模块安装在双面PCB 32的上侧面和下侧面，可以将这两个模块层叠在1RU交换机的前表面上未被48个端口所占据的小区域24中。
当使用光组件时，充分的冷却对于防止信号恶化或分组丢失是至关重要的。图1和图2中所示的配置为模块提供了足够的空间来实现必要的空气循环以冷却组件。
在替代实施例中，第一和第二X2模块26和28可以通过带状连接器被连接到母板。
在本发明的第二实施例中，如图4中所示，第一X2模块26a被安装在单面PCB 60的上表面上，并且第二X2模块26b被安装在母板34上。垂直连接器36将单面PCB 60连接到母板。或者，第一模块26a可以通过带状连接器(未示出)被连接到母板。
在第三实施例中，如图5中所示，第一模块26a被连接到单面PCB 70的下侧面，并且该单面PCB通过垂直连接器36或带状连接器(未示出)被连接到母板。第二X2模块26b被安装在母板34上。
已参考优选实施例对本发明进行了描述。本领域的技术人员应当清楚其它替换方式。因此，除了所附的权利要求之外，不希望限制本发明。

Claims (6)

1.一种在单机架单元交换机的底座的前表面上有限区域内提供两个X2 10吉比特上行链路I/O设备的系统，其中所述交换机中包括有母板，所述系统包括：
具有上侧面和下侧面的双面印刷电路板；
被安装在所述双面电路板的上侧面上的第一连接器和安装在下侧面上的第二连接器；
被安装在所述双面电路板的上侧面上并且耦合到所述第一连接器的第一X2模块；
被安装在所述双面电路板的下侧面上并且耦合到所述第二连接器的第二X2模块；
被连接到所述底座的底部用于支撑所述母板上方的所述双面电路板的机械支撑物；以及
将所述双面电路板连接到所述母板的垂直连接器。
2.如权利要求1所述的系统，其中所述双面电路板的厚度约为0.2英寸。
3.一种在单机架单元交换机的底座的前表面上有限区域内提供两个X2 10吉比特上行链路I/O设备的系统，其中所述交换机中包括有母板，所述系统包括：
具有上侧面和下侧面的双面印刷电路板；
被安装在所述双面电路板的上侧面上的第一X2模块；
被安装在所述双面电路板的下侧面上的第二X2模块；
被连接到所述底座的底部用于支撑所述母板上方的所述双面电路板的机械支撑物；以及
安装的用于将所述第一X2模块耦合到所述母板的第一带状连接器和安装的用于将所述第二X2模块耦合到所述母板的第二带状连接器。
4.一种在单机架单元交换机的底座的前表面上有限区域内提供两个X2 10吉比特上行链路I/O设备的系统，其中所述交换机中包括有母板，所述系统包括：
具有上侧面的印刷电路板；
被安装在所述印刷电路板的上侧面上的第一连接器和被安装在所述母板上的第二连接器；
被安装在所述电路板的上侧面上并且耦合到所述第一连接器的第一X2模块；
被安装在所述母板上并且耦合到所述第二连接器的第二X2模块；
被连接到所述底座的底部用于支撑所述母板上方的所述电路板的机械支撑物；以及
将所述电路板连接到所述母板的垂直连接器。
5.一种在单机架单元交换机的底座的前表面上有限区域内提供两个X2 10吉比特上行链路I/O设备的系统，其中所述交换机中包括有母板，所述系统包括：
具有下侧面的印刷电路板；
被安装在所述印刷电路板的下侧面上的第一连接器和被安装在所述母板上的第二连接器；
被安装在所述电路板的下侧面上并且耦合到所述第一连接器的第一X2模块；
被安装在所述母板上并且耦合到所述第二连接器的第二X2模块；
被连接到所述底座的底部用于支撑所述母板上方的所述电路板的机械支撑物；以及
将所述电路板连接到所述母板的垂直连接器。
6.一种在单机架单元交换机的底座的前表面上有限区域内提供两个X2 10吉比特上行链路I/O设备的系统，其中所述交换机中包括有母板，所述系统包括：
用于将第一和第二X2模块的下侧面彼此相向的层叠配置中的第一和第二X2模块耦合的装置；以及
用于将耦合的第一和第二模块安装到印刷电路板上方并且将所述X2模块上的电路连接到所述母板上的电路的装置。
CNA200580024458XA 2004-08-30 2005-08-24 单机架单元交换机中的双层叠10吉比特x2上行链路 Pending CN101032195A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113473764A (zh) * 2020-03-31 2021-10-01 华为技术有限公司 一种交换机插框及机柜系统

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4037810B2 (ja) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 小型無線装置及びその実装方法
US7859849B2 (en) * 2008-05-14 2010-12-28 Finisar Corporation Modular heatsink mounting system
US8098493B2 (en) * 2008-08-15 2012-01-17 Finisar Corporation CFP mechanical platform
US11294136B2 (en) 2008-08-29 2022-04-05 Corning Optical Communications LLC High density and bandwidth fiber optic apparatuses and related equipment and methods
US8452148B2 (en) 2008-08-29 2013-05-28 Corning Cable Systems Llc Independently translatable modules and fiber optic equipment trays in fiber optic equipment
US20100322583A1 (en) 2009-06-19 2010-12-23 Cooke Terry L High Density and Bandwidth Fiber Optic Apparatuses and Related Equipment and Methods
EP2221932B1 (en) 2009-02-24 2011-11-16 CCS Technology Inc. Holding device for a cable or an assembly for use with a cable
US9032057B2 (en) 2009-04-06 2015-05-12 Brocade Communications Systems, Inc. Secure stacking setup implementing user interface of stacking device
US8699838B2 (en) 2009-05-14 2014-04-15 Ccs Technology, Inc. Fiber optic furcation module
US9075216B2 (en) 2009-05-21 2015-07-07 Corning Cable Systems Llc Fiber optic housings configured to accommodate fiber optic modules/cassettes and fiber optic panels, and related components and methods
US8280216B2 (en) 2009-05-21 2012-10-02 Corning Cable Systems Llc Fiber optic equipment supporting moveable fiber optic equipment tray(s) and module(s), and related equipment and methods
US8712206B2 (en) 2009-06-19 2014-04-29 Corning Cable Systems Llc High-density fiber optic modules and module housings and related equipment
WO2010148325A1 (en) 2009-06-19 2010-12-23 Corning Cable Systems Llc High fiber optic cable packing density apparatus
US8625950B2 (en) 2009-12-18 2014-01-07 Corning Cable Systems Llc Rotary locking apparatus for fiber optic equipment trays and related methods
US8593828B2 (en) 2010-02-04 2013-11-26 Corning Cable Systems Llc Communications equipment housings, assemblies, and related alignment features and methods
EP2354827B1 (en) * 2010-02-04 2016-10-26 Corning Optical Communications LLC Optical interface cards, assemblies, and related methods, suited for installation and use in antenna system equipment
US8913866B2 (en) 2010-03-26 2014-12-16 Corning Cable Systems Llc Movable adapter panel
AU2011265751B2 (en) 2010-04-16 2015-09-10 Corning Optical Communications LLC Sealing and strain relief device for data cables
EP2381284B1 (en) 2010-04-23 2014-12-31 CCS Technology Inc. Under floor fiber optic distribution device
US9519118B2 (en) 2010-04-30 2016-12-13 Corning Optical Communications LLC Removable fiber management sections for fiber optic housings, and related components and methods
US9720195B2 (en) 2010-04-30 2017-08-01 Corning Optical Communications LLC Apparatuses and related components and methods for attachment and release of fiber optic housings to and from an equipment rack
US8879881B2 (en) 2010-04-30 2014-11-04 Corning Cable Systems Llc Rotatable routing guide and assembly
US9075217B2 (en) 2010-04-30 2015-07-07 Corning Cable Systems Llc Apparatuses and related components and methods for expanding capacity of fiber optic housings
US8705926B2 (en) 2010-04-30 2014-04-22 Corning Optical Communications LLC Fiber optic housings having a removable top, and related components and methods
US8660397B2 (en) 2010-04-30 2014-02-25 Corning Cable Systems Llc Multi-layer module
US9632270B2 (en) 2010-04-30 2017-04-25 Corning Optical Communications LLC Fiber optic housings configured for tool-less assembly, and related components and methods
US8718436B2 (en) 2010-08-30 2014-05-06 Corning Cable Systems Llc Methods, apparatuses for providing secure fiber optic connections
US9279951B2 (en) 2010-10-27 2016-03-08 Corning Cable Systems Llc Fiber optic module for limited space applications having a partially sealed module sub-assembly
US9116324B2 (en) 2010-10-29 2015-08-25 Corning Cable Systems Llc Stacked fiber optic modules and fiber optic equipment configured to support stacked fiber optic modules
US8662760B2 (en) 2010-10-29 2014-03-04 Corning Cable Systems Llc Fiber optic connector employing optical fiber guide member
WO2012074982A1 (en) 2010-11-30 2012-06-07 Corning Cable Systems Llc Fiber device holder and strain relief device
CN103415797B (zh) 2011-02-02 2016-01-27 康宁光缆系统有限责任公司 适用于为设备机架中的光学底板建立光学连接的稠密光纤连接器总成及相关的连接器与缆线
US9008485B2 (en) 2011-05-09 2015-04-14 Corning Cable Systems Llc Attachment mechanisms employed to attach a rear housing section to a fiber optic housing, and related assemblies and methods
AU2012275598A1 (en) 2011-06-30 2014-01-16 Corning Optical Communications LLC Fiber optic equipment assemblies employing non-U-width-sized housings and related methods
US8953924B2 (en) 2011-09-02 2015-02-10 Corning Cable Systems Llc Removable strain relief brackets for securing fiber optic cables and/or optical fibers to fiber optic equipment, and related assemblies and methods
US9038832B2 (en) 2011-11-30 2015-05-26 Corning Cable Systems Llc Adapter panel support assembly
US9250409B2 (en) 2012-07-02 2016-02-02 Corning Cable Systems Llc Fiber-optic-module trays and drawers for fiber-optic equipment
US9042702B2 (en) 2012-09-18 2015-05-26 Corning Cable Systems Llc Platforms and systems for fiber optic cable attachment
EP2725397B1 (en) 2012-10-26 2015-07-29 CCS Technology, Inc. Fiber optic management unit and fiber optic distribution device
US9559897B2 (en) 2012-12-21 2017-01-31 Brocade Communications Systems, Inc. Device ID assignment in a system of devices
US8985862B2 (en) 2013-02-28 2015-03-24 Corning Cable Systems Llc High-density multi-fiber adapter housings
US9148387B2 (en) 2013-05-10 2015-09-29 Brocade Communications Systems, Inc. Hardware hash table virtualization in multi-packet processor networking systems
US9313102B2 (en) 2013-05-20 2016-04-12 Brocade Communications Systems, Inc. Configuration validation in a mixed node topology
US9853889B2 (en) 2013-05-20 2017-12-26 Brocade Communications Systems, Inc. Broadcast and multicast traffic reduction in stacking systems
US10284499B2 (en) 2013-08-22 2019-05-07 Arris Enterprises Llc Dedicated control path architecture for systems of devices
US9185049B2 (en) 2013-10-31 2015-11-10 Brocade Communications Systems, Inc. Techniques for simplifying stacking trunk creation and management
US9577932B2 (en) 2014-02-12 2017-02-21 Brocade Communications Systems, Inc. Techniques for managing ternary content-addressable memory (TCAM) resources in heterogeneous systems
US9692695B2 (en) 2014-03-27 2017-06-27 Brocade Communications Systems, Inc. Techniques for aggregating hardware routing resources in a multi-packet processor networking system
US9692652B2 (en) 2014-04-03 2017-06-27 Brocade Communications Systems, Inc. Framework for reliably communicating port information in a system of devices
US20150370021A1 (en) * 2014-06-24 2015-12-24 Avago Technologies General Ip (Singapore) Pte. Ltd. High port density optical transceiver module
US10091059B2 (en) 2014-12-16 2018-10-02 Arris Enterprises Llc Handling connections between network devices that support multiple port communication modes
US10368437B2 (en) * 2017-04-06 2019-07-30 Dell Products, L.P. Cable assembly for an information handling system
US10381761B2 (en) 2017-07-21 2019-08-13 Quanta Computer Inc. Add-on processing unit with I/O connectors
WO2019241100A1 (en) * 2018-06-15 2019-12-19 Siemens Mobility, Inc. Vital relay assembly with modular solid-state current-limiting
US11366500B1 (en) * 2021-02-10 2022-06-21 Quanta Computer Inc. System chassis

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757998A (en) * 1996-10-02 1998-05-26 International Business Machines Corporation Multigigabit adaptable transceiver module
US6047172A (en) * 1998-03-10 2000-04-04 3Com Corporation Transceiver assembly with an electromagnetic shield
US6366471B1 (en) * 2000-06-30 2002-04-02 Cisco Technology, Inc. Holder for closely-positioned multiple GBIC connectors
US6558191B2 (en) * 2000-08-22 2003-05-06 Tyco Electronics Corporation Stacked transceiver receptacle assembly
JP2002158420A (ja) * 2000-11-21 2002-05-31 Nec Yonezawa Ltd プリント基板の電源線および信号線の接続方法ならびに電気機器
GB2373374B (en) * 2001-03-15 2004-03-17 Agilent Technologies Inc Novel fiber optic transceiver module
US6600865B2 (en) * 2001-06-21 2003-07-29 Hon Hai Precision Ind. Co., Ltd. Stacked GBIC guide rail assembly
US6469905B1 (en) * 2001-08-22 2002-10-22 Hon Hai Precision Ind. Co., Ltd. Guide rail device for receiving a GBIC module
US7177157B2 (en) * 2001-10-22 2007-02-13 Finisar Corporation Multiple width transceiver host board system
US6778399B2 (en) * 2002-05-15 2004-08-17 Stratos International, Inc. Wire lever actuator mechanism for optical transceiver

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113473764A (zh) * 2020-03-31 2021-10-01 华为技术有限公司 一种交换机插框及机柜系统

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