CN101029505A - Plate temperature equalizing method and structure - Google Patents
Plate temperature equalizing method and structure Download PDFInfo
- Publication number
- CN101029505A CN101029505A CN 200610058830 CN200610058830A CN101029505A CN 101029505 A CN101029505 A CN 101029505A CN 200610058830 CN200610058830 CN 200610058830 CN 200610058830 A CN200610058830 A CN 200610058830A CN 101029505 A CN101029505 A CN 101029505A
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- heat
- plate
- conducting plate
- temperature equalizing
- structure according
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Abstract
This invention is a heating plate with a heat transmitter attached to the bottom. When heat is transmitted to the transmitter, it conducts heat to the whole plate which works like a heater.
Description
Technical field
The present invention relates to a kind of structure and method thereof of plate temperature equalizing,
Background technology
The general summer coolness area in floor or wallboard construction, is buried hot-water line underground usually for increasing indoor temperature in floor or wallboard, this hot-water line evenly is set around in wallboard or the floor, and this hot-water line can form the loop; When injecting hot water in the hot-water line, this hot water promptly can be by the guiding of hot-water line, and evenly flow through floor or wallboard, make the temperature conduction of hot water to the hot-water line surface, conduct to again in floor or the wallboard, make floor or wallboard can give out the heat temperature, and then improve indoor temperature; Yet, though existing method can promote interior temperature, but still have following shortcoming:
1, existing construction method quite consuming time and effort when construction, and need the hot-water line of use quite a lot of, cause cost significantly to increase, do not meet economic benefit in fact.
2, by existing construction method, in case when hot-water line broke, its suitable difficulty on repairing caused maintenance difficult.
Summary of the invention
The object of the present invention is to provide and a kind ofly be laid with heat carrier in the heat-conducting plate bottom surface, when thermal source when heat carrier conducts to the heat-conducting plate bottom surface, this heat-conducting plate promptly can form heater, make it can be applicable to the plate temperature equalizing of cold district and be applied to that object is heated, baked and banked up with earth, drying means and structure thereof.
Of the present invention time a purpose is to be to provide a kind of plate temperature equalizing method and structure thereof that can be used as purposes such as floor, brick plate, wallboard or room plate.
Another object of the present invention is to be to provide a kind of temperature that conducts to heat carrier of controlling, and makes plate temperature equalizing method and the structure thereof that temperature that heat-conducting plate distributed can not damage human body.
The plate temperature equalizing method and the structure thereof of foregoing invention purpose be can reach, heat-conducting plate and heat carrier included; The bottom surface of this heat-conducting plate is provided with draw-in groove, and both sides then respectively are provided with the joint portion, makes heat-conducting plate can infinitely and connect extension; This heat carrier is combined in the draw-in groove of heat-conducting plate bottom surface, this heat carrier is connected with the thermal source feedway, make the thermal source feedway thermal source can be conducted in the heat carrier, make heat carrier form heater, and this thermal source conducted on the heat-conducting plate, make heat-conducting plate be subjected to the thermal source conduction influence of heat carrier, and conversion form hot plate, make heat-conducting plate can be applicable to cold district, to reach the purpose that heating is gone to a winter resort.
Plate temperature equalizing method provided by the present invention and structure thereof when comparing mutually with other prior art, have more following advantage:
1. the present invention is laid with heat carrier in the heat-conducting plate bottom surface, when thermal source when heat carrier conducts to the heat-conducting plate bottom surface, this heat-conducting plate promptly can form heater, makes it can be applicable to cold district.
2. the present invention can be used as purposes such as floor, brick plate, wallboard or roofing slab.
3. the present invention can control the temperature that conducts to heat carrier, makes the temperature that heat-conducting plate distributed can not cause any harm to human body.
Description of drawings
Fig. 1 for plate temperature equalizing method of the present invention and structure thereof in conjunction with schematic diagram;
Fig. 2 is the schematic perspective view of plate temperature equalizing method of the present invention and structure thereof;
Fig. 3 is the assembling schematic diagram of plate temperature equalizing method of the present invention and structure thereof;
Fig. 4 A for plate temperature equalizing method of the present invention and structure thereof in conjunction with the plaque schematic diagram;
Fig. 4 B for plate temperature equalizing method of the present invention and structure thereof in conjunction with the plaque schematic diagram;
Fig. 5 is another enforcement schematic diagram of plate temperature equalizing method of the present invention and structure thereof;
Fig. 6 is the operation chart of plate temperature equalizing method of the present invention and structure thereof;
1, heat-conducting plate, 11, draw-in groove, 12, the joint portion, 2, heat carrier, 21, heat pipe, 3, plaque, 4, the thermal source feedway.
The specific embodiment
Plate temperature equalizing method of the present invention, mainly be at heat-conducting plate bottom applying heat carrier, the end and the heat source accommodation device of this heat carrier are connected, make the thermal source of heat source accommodation device to conduct in the heat-conducting plate through heat pipe, cause heat-conducting plate can form hot plate, cause this heat-conducting plate to can be used as purposes such as floor, wallboard, roofing slab, with the indoor heating usefulness of going to a winter resort as cold district.In addition, this heat-conducting plate can constantly and connect extension, makes it quite easy in the construction assembling.
See also Fig. 1 to shown in Figure 4, plate temperature equalizing method not provided by the present invention and structure thereof mainly include:
Heat-conducting plate 1, the bottom of this heat-conducting plate 1 are provided with several draw-in grooves 11, and respectively are provided with joint portion 12 in both sides, this joint portion 12 can be flange or groove, make two heat-conducting plates 1 can connected with each otherly assemble (as shown in Figure 3), and this heat-conducting plate 1 can be the preferable metal sheet of heat conduction, for example: aluminium sheet, copper coin etc.; Moreover shown in Fig. 4 A and Fig. 4 B, for increasing the attractive in appearance of heat-conducting plate 1 integral body, can be at the heat-conducting plate 1 end face printed patterns or the plaque 3 of directly fitting, this plaque 3 can be timber or brick or PVC material and is made;
Seeing also shown in Figure 5ly again, is that of the present invention another implemented schematic diagram, and wherein, this heat carrier 2 can be heating wire 22, it only will be connected with power supply can produce thermal source, causes this thermal source can conduct in the heat-conducting plate 1 equally, makes heat-conducting plate 1 can form hot plate equally.See also shown in Figure 6, it is operation chart of the present invention, wherein, the heat-conducting plate 1 that this knot bottom surface is fitted with heat carrier 2 can be used as purposes such as floor, wallboard, roofing slab, and by the characteristic that the joint portion 12 of heat-conducting plate 1 both sides can be connected with each other, makes this heat-conducting plate 1 quite easy in the construction assembling, and if during as floor or wallboard, can make the interior space have dispeling cold the effect of heating,, then can be used as the usefulness of snow melt if during as roofing slab.
Claims (13)
1. plate temperature equalizing method, it is characterized in that: at heat-conducting plate bottom applying heat carrier, the end of this heat carrier is connected with heat source accommodation device, makes the thermal source of heat source accommodation device to conduct in the heat-conducting plate through heat pipe, causes heat-conducting plate can form hot plate.
2. plate temperature equalizing structure, it is characterized in that: it comprises:
Heat-conducting plate, its bottom is provided with draw-in groove, and respectively is provided with the joint portion in both sides;
Heat carrier, this heat carrier has high thermal conduction characteristic, and its end is connected with the thermal source feedway;
Heat carrier is combined in the draw-in groove of heat-conducting plate bottom, causes heat carrier and heat-conducting plate bottom surface to fit tightly, and makes the thermal source feedway provide thermal source to conduct on the heat-conducting plate through heat carrier, causes heat-conducting plate can form heating board.
3. plate temperature equalizing structure according to claim 2 is characterized in that: wherein the joint portion of these heat-conducting plate both sides can be flange or groove, makes two heat-conducting plates connected with each otherly to assemble.
4. plate temperature equalizing structure according to claim 2 is characterized in that: wherein this heat-conducting plate can be aluminium sheet or copper coin.
5. plate temperature equalizing structure according to claim 2 is characterized in that: but this heat-conducting plate end face printed patterns wherein.
6. plate temperature equalizing structure according to claim 2 is characterized in that: this heat-conducting plate end face plaque of can fitting wherein.
7. plate temperature equalizing structure according to claim 6 is characterized in that: wherein this plaque can be timber or brick or PVC material and is made.
8. plate temperature equalizing structure according to claim 2 is characterized in that: wherein this heat carrier can be heat pipe.
9. plate temperature equalizing structure according to claim 2 is characterized in that: wherein this heat carrier can be heating wire.
10. plate temperature equalizing structure according to claim 2 is characterized in that: wherein this thermal source feedway can be hot water jacket.
11. plate temperature equalizing structure according to claim 2 is characterized in that: wherein this thermal source feedway can be heating wire.
12. plate temperature equalizing structure according to claim 2, it is characterized in that: wherein can connect temperature controller on this thermal source feedway, this temperature controller can be controlled the temperature that conducts to heat carrier, and the temperature that makes heat-conducting plate distribute can not damage human body skin.
13. plate temperature equalizing structure according to claim 2; it is characterized in that: wherein can connect the excess temperature safety protection switch on this thermal source feedway, when temperature surpassed setting value, this excess temperature safety protection switch can cut off thermal source automatically; avoid temperature to continue to increase, cause the injury of human body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610058830 CN101029505A (en) | 2006-03-01 | 2006-03-01 | Plate temperature equalizing method and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610058830 CN101029505A (en) | 2006-03-01 | 2006-03-01 | Plate temperature equalizing method and structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101029505A true CN101029505A (en) | 2007-09-05 |
Family
ID=38715039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610058830 Pending CN101029505A (en) | 2006-03-01 | 2006-03-01 | Plate temperature equalizing method and structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101029505A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728237A (en) * | 2012-10-12 | 2014-04-16 | 广州赛宝仪器设备有限公司 | Composite salt spray test box heating device and composite salt spray test box |
| CN103758268A (en) * | 2014-01-29 | 2014-04-30 | 上海朗思人居建筑科技服务有限公司 | Ceiling radiation type pipe burying process |
| CN104005526A (en) * | 2014-05-07 | 2014-08-27 | 李为民 | Interior architecture heating decorative wallboard |
-
2006
- 2006-03-01 CN CN 200610058830 patent/CN101029505A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728237A (en) * | 2012-10-12 | 2014-04-16 | 广州赛宝仪器设备有限公司 | Composite salt spray test box heating device and composite salt spray test box |
| CN103758268A (en) * | 2014-01-29 | 2014-04-30 | 上海朗思人居建筑科技服务有限公司 | Ceiling radiation type pipe burying process |
| CN104005526A (en) * | 2014-05-07 | 2014-08-27 | 李为民 | Interior architecture heating decorative wallboard |
| CN104005526B (en) * | 2014-05-07 | 2016-08-24 | 李为民 | Interior architecture heating decorative wall panels |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070905 |