CN101022694A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN101022694A CN101022694A CN 200610003562 CN200610003562A CN101022694A CN 101022694 A CN101022694 A CN 101022694A CN 200610003562 CN200610003562 CN 200610003562 CN 200610003562 A CN200610003562 A CN 200610003562A CN 101022694 A CN101022694 A CN 101022694A
- Authority
- CN
- China
- Prior art keywords
- conduction region
- circuit board
- conductive layer
- present
- conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A circuit board is prepared as setting the first conduction region on the first surface, arranging the second surface opposite to the first one, setting the third surface between the first and the second surfaces and connecting the third surface to the first and the second surfaces, setting the second conduction region on the third surface and electric-connecting partial part of the first conduction region to partial part of the second one.
Description
Technical field
The present invention relates to a kind of circuit board, and be particularly related to a kind of have good Electro Magnetic Compatibility (Electromagnetic Compatibility, circuit board EMC).
Background technology
In the evaluation criteria of various electronic installations, (ElectromagneticCompatibility EMC) is the quality index of a key to Electro Magnetic Compatibility.The assessment of Electro Magnetic Compatibility comprise electromagnetic interference (Electromagnetic Interference, EMI) and electromagnetic susceptibility (ElectromagneticSusceptibility, EMS).Electromagnetic interference is meant whether electronic installation itself can cause electromagnetic effect to other electronic installations, and electromagnetic susceptibility is meant that then electronic installation whether can be because of the electromagnetic effect of other electronic installation, and makes the electronic installation itself can't normal operation.
Be installed in the suitable height of electronic component closeness on the interior circuit board of electronic installation.Under the high situation of electronic component closeness, the signal transmission of electronic component in circuit board can interact unavoidably and produce cross-talk noise (cross talk).In addition, mostly electronic component is to utilize high-frequency signal transmission at present, is easy to take place electromagnetic interference each other so be provided to the electronic component of electronic installation inside, and then influences the normal operation of electronic installation.
The signal transmission of Electromagnetic Interference outside the electronic installation within the electronic installation; or the electromagnetic wave of avoiding the signal transmission within the electronic installation to be produced can not be radiated to outside the electronic installation; electronic installation is used for holding and protects the housing of electronic component to adopt conductive material (for example metal) usually; or at the surface of housing formation conductive layer; so that the effect of electromagnetic shielding to be provided, or set up crown cap so that the effect of electromagnetic shielding to be provided in the periphery of the particular electronic component of circuit board.
Summary of the invention
The present invention's purpose provides a kind of circuit board with good Electro Magnetic Compatibility.
For reaching above-mentioned or other purpose, the present invention proposes a kind of circuit board, comprises first, second and the 3rd.First mask has first conduction region, and second face is positioned at first opposite face.The 3rd and the 3rd be connected with first and second face between first and second, and the 3rd mask has second conduction region, and first conduction region is electrically connected with at least a portion of second conduction region.
In one of the present invention embodiment, first conduction region is the access area.
In one of the present invention embodiment, first mask has cabling (trace), and this first conduction region is naked copper district (Pad), and cabling (trace) links first conduction region and second conduction region.
In one of the present invention embodiment, second conduction region is printed conductive layer, electroplated conductive layer, conducting layer sputtering or dipping conductive layer.
The present invention proposes another kind of circuit board, comprises first conduction region, first, second and the 3rd, and wherein first conduction region is positioned within the circuit board, and second face is positioned at first opposite face.The 3rd and the 3rd be connected with first and second face between first and second, and the 3rd mask has at least one second conduction region, and first conduction region is electrically connected with second conduction region at least a portion.
In one of the present invention embodiment, first conduction region is the access area.
In one of the present invention embodiment, second conduction region is printed conductive layer, electroplated conductive layer, conducting layer sputtering or dipping conductive layer.
The present invention becomes second conduction region in the trihedral of circuit board, with the metallic shield as circuit board, makes circuit board have good Electro Magnetic Compatibility.
State with other purpose, feature and advantage and can become apparent on the present invention for allowing, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A is the schematic diagram of the circuit board of first embodiment of the invention.
Figure 1B is the schematic diagram of A-A hatching in Figure 1A.
Fig. 2 is the profile of the circuit board of second embodiment of the invention.
Fig. 3 A is the schematic diagram of the circuit board of third embodiment of the invention.
Fig. 3 B is the schematic diagram of B-B hatching in Fig. 3 A.
Fig. 4 is the profile of the circuit board of fourth embodiment of the invention.
Fig. 5 A is the schematic diagram of the circuit board of fifth embodiment of the invention.
Fig. 5 B is the schematic diagram of C-C hatching in Fig. 5 A.
The main element description of symbols
100a, 100b, 100c, 100d, 100e: circuit board
102: insulating barrier
104,104b, 104d: line layer
110: the first
112a, 112b, 112c, 112d, 112e: first conduction region
114: cabling
120: the second
130: the three
132: the second conduction regions
140: conductive through hole
Embodiment
Figure 1A is the schematic diagram of the circuit board of first embodiment of the invention.Please be simultaneously with reference to Figure 1A and Figure 1B, circuit board 100a comprises first 110, second 120 and the 3rd 130.Have the first conduction region 112a for first 110, the first conduction region 112a is the naked copper district.Second 120 opposite face that is positioned at first 110, and the 3rd 130 and first 110 and second 120 be connected, wherein have at least one second conduction region 132 for the 3rd 130, and the first conduction region 112a is electrically connected with second conduction region, 132 at least a portion.
Figure 1B is the schematic diagram of A-A hatching in Figure 1A.Please be simultaneously with reference to Figure 1A and Figure 1B, the circuit board 100a of present embodiment is made of a plurality of line layers 104 and a plurality of insulating barrier 102, wherein line layer 104 comprises cabling 114, and the first conduction region 112a promptly is to be electrically connected with second conduction region 132 by cabling 114.In addition, insulating barrier 102 is between two adjacent line layers 104.Electronic component (not shown) on the circuit board 100a promptly is to transmit signal by line layer 104, and wherein these line layers 104 can be electrically connected mutually by buried via hole (not shown) or the plated-through-hole (not shown) of circuit board 100a.In first embodiment, the material of line layer 104 is a copper, and second conduction region 132 can be the conductive layer that forms with printing, plating, sputter or impregnating mode.
It should be noted that, because the circuit board 100a of present embodiment has second conduction region 132, and second conduction region 132 covers whole the 3rd 130, when therefore signal transmits in the circuit board 100a of first embodiment, second conduction region 132 can provide the good metal shielding action, make the signal that is transmitted in the circuit board 100a more can not be subjected to disturbing, and make that being transmitted to the interior electromagnetic wave that signal produced of circuit board 100a more can not be radiated to beyond the circuit board 100a from the 3rd 130 electromagnetic wave in addition of circuit board 100a.Therefore, circuit board 100a will have good Electro Magnetic Compatibility because of second conduction region 132.
Fig. 2 is the profile of the circuit board of second embodiment of the invention.Please refer to Fig. 2, compare with first embodiment of Figure 1B, the first conduction region 112b of second embodiment can be the access area within the circuit board 100b, and it is made of one of these line layers 104, and the edge of the first conduction region 112b can directly be electrically connected on second conduction region 132.Among the embodiment that does not represent in another figure, the first conduction region 112b also can be connected to second conduction region 132 by the cabling 114 of Figure 1A.
Fig. 3 A is the schematic diagram of the circuit board of third embodiment of the invention, and Fig. 3 B is the schematic diagram of B-B hatching in Fig. 3 A.Same or analogous label is represented same or analogous element among Figure 1A and Fig. 3 A, repeats no more in this.Please be simultaneously with reference to Figure 1A, Figure 1B, Fig. 3 A and Fig. 3 B, the circuit board 100c of the 3rd embodiment and the circuit board 100a of first embodiment are similar, its difference is: the first conduction region 112c of the 3rd embodiment is hole pad (via pad), and the first conduction region 112c also is electrically connected to second conduction region 132 by cabling 114.Circuit board 100c also comprises conductive through hole (through via) 140, and the first conduction region 112c is connected to one of conductive through hole 140 end.
Fig. 4 is the profile of the circuit board of fourth embodiment of the invention.Please refer to Fig. 4, compare with the 3rd embodiment of Fig. 3 B, the first conduction region 112d of the 4th embodiment is positioned at the inside of circuit board 100d, and the hole pad (not indicating) that is positioned at first 110 can directly not be electrically connected on second conduction region 132, but is electrically connected with second conduction region 132 with the first conduction region 112d by conductive through hole 140.
Fig. 5 A is the schematic diagram of the circuit board of fifth embodiment of the invention, and Fig. 5 B is the schematic diagram of C-C hatching in Fig. 5 A.Same or analogous label is represented same or analogous element among Fig. 3 A and Fig. 5 A, repeats no more in this.Please be simultaneously with reference to Fig. 3 A, Fig. 5 A and Fig. 5 B, the circuit board 100e of the 5th embodiment and the circuit board 100c of the 3rd embodiment are similar, its difference is: the first conduction region 112e of the 5th embodiment is the naked copper district, and the first conduction region 112e also is electrically connected to second conduction region 132 by cabling 114.
In sum, the present invention utilizes printing, plating, sputter or impregnating method to become conductive layer in the trihedral of circuit board, with metallic shield as circuit board, be subjected to being disturbed with the signal of avoiding being transmitted in the circuit board, or avoid being transmitted to the interior electromagenetic wave radiation that signal produced of circuit board to circuit board from the outer electromagnetic wave of circuit board.Therefore, the electronic installation of the present invention's circuit board and use the present invention's circuit board has good Electro Magnetic Compatibility.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the invention; when can doing a little change and improvement, so the present invention's protection range is as the criterion when looking the claim person of defining.
Claims (7)
1. circuit board is characterized in that comprising:
First, has at least one first conduction region;
Second, be positioned at this opposite face of first; And
The 3rd, between this first and this second, and the 3rd be connected with this first and this second face, and the 3rd mask has at least one second conduction region, and this first conduction region is electrically connected with this second conduction region at least a portion.
2. the circuit board according to claim 1 is characterized in that this first conduction region is the access area.
3. the circuit board according to claim 1 is characterized in that this first mask has cabling, and this first conduction region is the naked copper district, and this first conduction region of this cabling electrical ties and this second conduction region.
4. the circuit board according to claim 1 is characterized in that this second conduction region is printed conductive layer, electroplated conductive layer, conducting layer sputtering or dipping conductive layer.
5. circuit board is characterized in that comprising:
First conduction region is positioned within this circuit board;
First;
Second, be positioned at this opposite face of first; And
The 3rd, between this first and this second, and the 3rd be connected with this first and this second face, and the 3rd mask has at least one second conduction region, and this first conduction region is electrically connected with this second conduction region at least a portion.
6. the circuit board according to claim 5 is characterized in that this first conduction region is the access area.
7. the circuit board according to claim 5 is characterized in that this second conduction region is printed conductive layer, electroplated conductive layer, conducting layer sputtering or dipping conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610003562 CN101022694A (en) | 2006-02-13 | 2006-02-13 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610003562 CN101022694A (en) | 2006-02-13 | 2006-02-13 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101022694A true CN101022694A (en) | 2007-08-22 |
Family
ID=38710310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610003562 Pending CN101022694A (en) | 2006-02-13 | 2006-02-13 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101022694A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427744A (en) * | 2013-08-30 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN110113923A (en) * | 2016-06-20 | 2019-08-09 | 海信集团有限公司 | Laser cinema equipment |
-
2006
- 2006-02-13 CN CN 200610003562 patent/CN101022694A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427744A (en) * | 2013-08-30 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN110113923A (en) * | 2016-06-20 | 2019-08-09 | 海信集团有限公司 | Laser cinema equipment |
| CN110213953A (en) * | 2016-06-20 | 2019-09-06 | 海信集团有限公司 | Laser cinema equipment |
| CN110113923B (en) * | 2016-06-20 | 2020-10-30 | 海信集团有限公司 | Laser cinema equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102023338B1 (en) | Printed wiring board | |
| EP2701471B1 (en) | High speed input/output connection interface element and interconnection system with reduced cross-talk | |
| CN204968221U (en) | Flexible circuit board | |
| CN102349201A (en) | Telecommunications jack with a multilayer pcb | |
| US9282632B2 (en) | Multilayer circuit substrate | |
| CN103117440B (en) | Low-loss flat transmission line | |
| TW200740331A (en) | Hybrid multilayer circuit board and method of manufacturing the same | |
| US20060081990A1 (en) | Circuit structure | |
| KR101021548B1 (en) | Printed circuit board having electromagnetic bandgap structure | |
| CA2891678A1 (en) | Electrical connection interface for connecting electrical leads for high speed data transmission | |
| CN204810807U (en) | Electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof | |
| US8067700B2 (en) | Via structure of printed circuit board | |
| CN101022694A (en) | Circuit board | |
| CN201491368U (en) | Electromagnetic interference resistant flexible circuit board | |
| CN111010798B (en) | Circuit board and electronic device | |
| CN101686597A (en) | Printed circuit board and electronic device | |
| KR102040790B1 (en) | Flexible printed circuit board for RF | |
| JP6528576B2 (en) | Cable with connector | |
| CN113473724B (en) | Printed circuit board and wiring method thereof | |
| CN102573435B (en) | Printed circuit board grounding structure of communication equipment | |
| CN112770493B (en) | Flexible circuit board and electronic equipment | |
| CN110035606B (en) | PCB lamination method and structure suitable for circuit comprising analog sensor | |
| CN101814644B (en) | Filter | |
| CN209949551U (en) | Anti-electromagnetic interference PCB circuit board | |
| CN221178008U (en) | Printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |