CN101019078A - A device for generating light in the extreme ultraviolet and its application to a source for lithography using radiation in the extreme ultraviolet - Google Patents
A device for generating light in the extreme ultraviolet and its application to a source for lithography using radiation in the extreme ultraviolet Download PDFInfo
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- CN101019078A CN101019078A CNA2005800195526A CN200580019552A CN101019078A CN 101019078 A CN101019078 A CN 101019078A CN A2005800195526 A CNA2005800195526 A CN A2005800195526A CN 200580019552 A CN200580019552 A CN 200580019552A CN 101019078 A CN101019078 A CN 101019078A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70166—Capillary or channel elements, e.g. nested extreme ultraviolet [EUV] mirrors or shells, optical fibers or light guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/003—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/008—Production of X-ray radiation generated from plasma involving an energy-carrying beam in the process of plasma generation
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Abstract
The device comprises a device ( 2 ) for creating an essentially linear target ( 4 ) in an evacuated space where laser beams ( 1 ) are focused, the target being suitable for interacting with the focused laser beams ( 1 ) to emit a plasma emitting radiation in the extreme ultraviolet. A receiver device ( 3 ) receives the target ( 4 ) after it has interacted with the focused laser beams ( 1 ), and a collector device ( 110 ) collects the EUV radiation emitted by the target ( 4 ). The focusing elements ( 11 ) for focusing the laser beams on the target ( 4 ) are arranged in such a manner that the laser beams ( 1 ) are focused on the target ( 4 ) laterally, being situated in a common half-space relative to the target ( 4 ) and being inclined at a determined angle lying in the range about 60 DEG. to about 90 DEG. relative to a mean collection axis ( 6 ) perpendicular to the target ( 4 ). The collector device ( 110 ) is disposed symmetrically about the mean collection axis ( 6 ) in the half-space containing the laser beams ( 1 ) focused on the target ( 4 ) and inside a conical space ( 8 ) centered on the mean collection axis ( 6 ) with a vertex situated at the target ( 4 ) and a half-angle at the vertex that is less than the angle of inclination of the focused laser beams ( 1 ) relative to the mean collection axis ( 6 ). The device is suitable for use as a source for EUV radiation in lithography for fabricating integrated circuits.
Description
Technical field
The present invention relates to a kind of equipment that is used for producing the light of far-ultraviolet region, and relate to of the application of this equipment, be particularly useful for making integrated circuit for the photolithographic source of utilizing far ultraviolet radiation.
Below description in, the radiation in extreme ultraviolet zone (typically cover and be in the wavelength of 1 nanometer (nm) to the 15nm scope) also is called " EUV " radiation more simply.
Background technology
Photoetching process has been in dominant position decades at the manufacture view of integrated circuit.Through the development that continues, this technology can the integrated circuit of fine-resolution have adapted to market demand by making day by day.The improvement of resolution aspect is mainly by utilizing shorter wavelength to obtain.
Therefore, when microelectronics begins period, use mercury lamp the sixties, initial wavelength is 436nm, and wavelength was 365nm afterwards.The nineties in 20th century, excimer laser was taken over mercury lamp.After the KrF of 248nm laser instrument produces, be to use the ArF excimer laser of emission 193nm wavelength in the present practice, might obtain the stroke width (strokes of width) of about 130nm thus, be also referred to as " limit " size.
Although dimension limit is longer than employed wavelength in the past, along with the introduction of technical know-how (trick), photoetching at present can produce the etched pattern of size than employed wavelength much shorter since the mid-90 in 20th century.Especially, mentioned thing relates to utilizes interference technique, more and more perfect mask and more and more accurate projection optics.Compare with the 110nm of the present standard of performance, just imagining at present and utilizing the dimension limit that is shorter than 50nm to make integrated circuit.
In order to obtain to have the etching of fineness (fineness) less than 50nm, proposed to use the source of emission 13.5nm wavelength radiation, with the high-repetition-rate of at least 7 KHz (KHz), introduce photoetching in the EUV zone.Usually, be heated to 20 electron-volts (eV) by generation and obtain the EUV emission to the plasma of the suitable electron temperature of 40eV magnitude.This provenance is called as " heat ".A kind of possibility in the research that produces this plasma is to utilize the one or more laser beam that focus in a vacuum on the target (target).This notion is called as " plasma generation with laser light source " or LPP light source.
In order to have the EUV light source that is suitable for industrial use, need still to guarantee that its average EUV power level is useful, promptly this power is really useful for photoetching, and is easy to be about 100 watts collecting and transmitting the very high loss of generation in the EUV radiation.Having carried out big quantity research increases for the useful EUV power from the LPP light source of photoetching transponder of future generation (repeater).This research has caused the improvement of the coupling aspect between laser and the target especially, has increased the source efficiency that the ratio by the EUV power that produces and the electric power of consumption limits, and finally makes the efficiency optimizationization of collection EUV radiation.In order to obtain enough EUV power, determined to inject the very high average laser power that substantially exceeds 10 kilowatts (kW).This increase of laser power aspect must take into account (spatial property of laser must be not be subjected to and can damages with the increase of laser power) with keeping the laser and the coupling efficiency of target, and keeps simultaneously the maximal efficiency of collection by the EUV radiation of plasma emission.
The increase of EUV light source power is the key point of the permanance of this light source in the photoetching.
European patent document EP 1 319 988 A2 have proposed in conjunction with the light source of a plurality of EUV light sources with the acquisition higher-wattage, but such solution has increased cost greatly.
For the EUV light source that produces plasma by laser excitation (LPP light source), the power that increases the EUV light source by increase laser power (for example utilizing iraser) is feasible.Usually, the laser power that is incident upon on the target can be increased by using oscillator and one or more amplifier.This has caused complicated, expensive and electricity has been converted to the growth that the light time shows inefficient laser instrument usually.
In order to collect the homogeneous by plasma emission (isotropic) EUV radiation more or less, the equipment that European patent document EP 1 255 163 A2 have proposed to have two laser beam, these two laser beam are by two different openings in first gathering element, and first gathering element is the mirror that has large-numerical aperture and be provided with near the plasma of launching in the normal incidence direction.Yet such equipment only has 70% maximum reflectivity, and this causes a large amount of radiation to be absorbed, and therefore causes high-caliber thermal stress.In addition, there is the limited life-span in this equipment, and this is because piling up of a plurality of meticulous (fine) layer is unable to bear a large amount of fragments (debris) that provided by plasma.
For the EUV light source by discharge generation plasma in " discharge generation plasma source " (DPP light source), International Patent Application WO 01/99143 has been described a possible embodiment that utilizes the EUV radiation collector of anti-fragment filter operation when glancing incidence.The equipment of the type is not used in the LPP light source usually.
Summary of the invention
A target of the present invention is to eliminate the defective of prior art and LPP type EUV radiation source can be made with high-average power.
The present invention is more special to seek to make a plurality of laser beam can be used simultaneously to strengthen incident laser power greatly, be kept at simultaneously to collect the effective equipment in EUV radiation aspect, and restriction is simultaneously made and the cost of use aspect.
These targets realize that by the equipment that is used to produce the light in the far-ultraviolet region this equipment comprises:
A) a plurality of power laser source is used to launch a plurality of laser beam;
B) focalizer is used for focussed laser beam to produce the laser beam that focuses on;
C) be used to produce the device of vacuum space, it has the pressure that is lower than 1 handkerchief (Pa) at least in the zone that the laser beam of described focusing is focused;
D) be used for producing in the described space that the laser beam in described focusing is focused the equipment of intensive target, this intensive target is suitable for interacting to be transmitted in the plasma that has at least one emission line in the far-ultraviolet region with the laser beam of described focusing;
E) receiving equipment is used for receiving this target after it interacts with the laser beam of described focusing; And
F) at least one first equipment is used to collect the EUV radiation by this target emission;
This equipment is characterised in that: it has the centre (mean) that is used for the EUV radiation and collects axle, and this intermediate collection axle is perpendicular to the axle that is limited by linear in fact intensive target; It is characterized in that, be arranged in such a way for focusing the laser beam to the focalizer on this target: the laser beam side direction focuses in the public semispace that is in simultaneously on this target with respect to this target, and simultaneously favour predetermined angular with respect to described intermediate collection axle, this predetermined angular be in about 60 ° to about 90 ° scope; And it is characterized in that, described first collecting device is arranged in about described intermediate collection rotational symmetry and comprises in the semispace that focuses to the laser beam on this target, and being in this intermediate collection axle is in the cone space at center, the summit of this cone space is on this target, and the half-angle at this place, summit is less than the incident angle of the laser beam that focuses on respect to this intermediate collection axle.
The equipment that is used to produce linear in fact intensive target can comprise injector arrangement, is used for producing the mist of thread injection, fluid jet or droplet in vacuo.
This target also can be advantageously by constituting by forming to spray with the synchronous quick continuous independent droplet of laser pulse.The quantity that the material of vacuum seal closed zone was introduced in restriction when this solution make to keep thread injection advantage becomes possibility.
Advantageously, the laser beam arrangement of this focusing of tilting with respect to this intermediate collection axle is in the ring of described intermediate collection axle.
If the number of employed lasing light emitter is excessive, then the focussed laser beam of Qing Xieing also can be distributed in a plurality of rings of this intermediate collection axle.
The number of the laser beam that focuses on is more than or equal to 2, preferably is in 3 to 20 the scope.
The laser beam that focuses on can be with respect to the plane that comprises the intermediate collection axle with symmetrical manner (for example, the laser beam of two groups of five focusing) or (for example in asymmetric mode, the laser beam of one group of four focusing on one side, and the laser beam of two focusing of another group on the opposite side) arrange.
Focalizer designs by this way, that is, be created in and be in the laser beam that focuses on about 20 microns (μ m) minor diameter to 300 mu m ranges.
Yet, the present invention for EUV microscope and/or tomographic application in the water transmission window in, promptly in 2.3nm to 4.4nm scope, can carry out focusing on so that realize little minimum diameter to about 10 μ m.This makes microscopical spatial resolution to be increased.
In specific embodiment, focalizer comprises the optical focusing device that is used to focus on a plurality of power laser bundles, and what this power laser bundle showed multiply by this product big several times of the product of diameter than Gaussian laser beam by divergence.
Advantageously, this focalizer comprises at least one mirror, and this mirror can advantageously be made by metal or such as the semiconductor material of silicon.
In this case, cooling device can be arranged in the back side of the mirror that constitutes focalizer.
According to favourable characteristic, the mirror that constitutes focalizer is elliptical area or hyperboloid shape, and laser beam can be generated between the equipment and first collecting device by target before focusing on.
Preferably, focalizer is arranged in the one or more rings of first collecting device.
In first possible embodiment, first collecting device is included in the equipment that the normal incidence place comprises the multiple-level stack of Mo/Si insulator.
In another possible embodiment, first collecting device comprises optical device at the glancing incidence place, and this optical device is the surface of cash, ruthenium or palladium.
In this case, first collecting device can comprise first and second alternative expressions (interleaved) gathering element.
In first variant, each of the first and second alternative expression gathering elements all presents around the elliptical area shape of intermediate collection axle rotation.
In another variant, the first alternative expression gathering element is the inner member that presents around the elliptical area shape of intermediate collection axle rotation, the second alternative expression gathering element is an outer member simultaneously, and this outer member begins to present in succession from the end towards target: the hyperboloid shape of rotation then is the ellipsoidal shape (Wolter lens) of rotation.
Equipment of the present invention also can comprise second collecting device, and it is arranged on by target with respect to the intermediate collection rotational symmetry and limits and do not comprise in the semispace that focuses on the laser beam on the target.
In this case, and advantageously, second collecting device comprises the normal incidence mirror of the multiple-level stack with sphere.
Description of drawings
Other features and advantages of the present invention are manifested with reference to the accompanying drawings by the description of the following specific implementations that provides as an example, wherein:
Fig. 1 is the Ning section on the plane that comprises the intermediate collection axle, shows the embodiment that is used for the equipment on the target that a plurality of power laser bundles are focused to, and is applicable to the equipment use that produces EUV light for the present invention;
Fig. 2 be figure l perpendicular to the diagrammatic view on the II-II plane of intermediate collection axle, show and be used to focus on the equipment that is distributed in ten power laser bundles in the ring with symmetrical manner;
Fig. 3 is the diagrammatic view that is similar to Fig. 1, shows the useful EUV light emission tapered zone from target, and the laser of focusing and this target interact;
Fig. 4 is the diagrammatic view that is similar to Fig. 3, shows the enforcement of first embodiment of the EUV emission collection equipment with normal incidence;
Fig. 5 is the diagrammatic view that is similar to Fig. 3, shows the enforcement of second embodiment of the EUV emission collection equipment with glancing incidence and two alternative expression gathering elements;
Fig. 6 shows the diagram of two curves, and this curve has provided as the reflectivity with respect to the function of the incident angle of EUV collector surface for the single gathering element of elliptical area shape with for the second other gathering element (corresponding to the Wolter lens) of hyperboloid+elliptical area shape respectively;
Fig. 7 is the diagrammatic view that comprises on the plane of intermediate collection axle of this equipment, shows the embodiment of EUV photogenerated equipment of the present invention, and it comprises two different EUV radiation collectors that are positioned at the target both sides, and the laser of focusing and this target interact; And
Fig. 8 is the diagrammatic view that comprises on the plane of intermediate collection axle of this equipment, shows the specific implementations that the present invention utilizes the EUV photogenerated equipment of mirror focalizer.
Embodiment
Fig. 1 shows the injector arrangement 2 of the injection that is suitable for producing the thread injection that constitutes target 4 or fluid microjet or independent droplet (for example, such as the droplet of the liquefaction rare gas of xenon, or the real metal droplet of lithium or tin for example).The injection that produces in a vacuum by injector arrangement 2 regains by receiving equipment 3.
Fig. 1 shows by the focalizer 11 such as lens, diffraction optics equipment (for example grating) or real mirror and focuses on two power laser bundles 1 on the target 4.
This invention utilizes in a large number the power laser bundle 1 more than or equal to 2 focusing.Each of the laser beam 1 of two focusing shown in Fig. 1 is all with respect to the intermediate collection axle 6 of this equipment angle beta that tilts, this angle beta be in about 60 ° to about 90 ° scope.Usually, the EUV radiation that allows to be produced for the path (lateral approach) of the side that focuses on the laser beam 1 on the target 4 obtains to collect better.
Fig. 1 shows the EUV launch site 5 that is produced by each independent laser beam 1.Usually, this EUV emission 5 is concentrated to corresponding incoming laser beam 1, but this EUV emission can be very even, if especially utilize the target 4 of thread ejection-type or droplet ejection type.
As shown in fig. 1, when two laser beam 1 side direction focus on the target 4, with respect to perpendicular to the intermediate collection axle 6 angulation β of target 4 time, each of light beam 1 that produces two focusing of EUV launch site 5 produces total EUV transmitted-reference 7, and it presents maximal value along intermediate collection axle 6.
Fig. 2 shows one group of ten laser beam that is arranged in about in the ring of intermediate collection axle 6 (it is perpendicular to this plane of Fig. 2) symmetry corresponding to the xsect on the II-II face of Fig. 1.All laser beam 1 all are focused on the target 4, and this target 4 tilts a little with respect to the plane of Fig. 2.These laser beam can be distributed on a plurality of concentric rings.They also can be arranged in asymmetric mode about the plane that comprises intermediate collection axle 6.Therefore, might for example on a side, have two laser beam and on opposite side, have four laser beam.
Whether can observe resulting emission 7 can illuminate target 4 to produce EUV fully according to each independent laser beam, perhaps whether only the overlapping feasible acquisition of a plurality of laser beam suitable lightening that is used for the EUV emission become may and different.In both cases, emission maximum takes place along the direction of axle 6, but emission is more concentrated about intermediate collection axle 6 down in second kind of situation (needing overlapping).
Fig. 3 shows tapered zone 8, and when utilizing the transmitter of kind shown in Fig. 1 and Fig. 2, this tapered zone 8 really is easy to collect EUV radiation 7.The summit of tapered zone 8 is in laser beam 1 focuses on zone on the target 4, and the intermediate collection axle 6 of equipment is as the axle of tapered zone 8, because existing with respect to intermediate collection axle 6, laser beam 1 is in 60 ° to the 90 ° inclination angle beta in the scope, so there is the half-angle α that constitutes big possible collection angle (may above 60 °) at the place, summit of this tapered zone 8.As an example, inclination angle beta can equal 75 °.
The equipment that is used to collect the EUV radiation that is produced by the laser beam 1 with target 4 interactional focusing can be designed to pick up the radiation 9 that is in the angle γ direction in 0 to the α scope with the intermediate collection axle 6 with respect to equipment.
Fig. 4 shows first embodiment of EUV radiation collector 10, and this EUV radiation collector 10 is arranged symmetrically in about intermediate collection axle 6 and comprises in the laser beam 1 and the semispace in cone space 8 (with respect to target 4) that focuses on the target 4.In the embodiment of Fig. 4, EUV radiation collector 10 is included in the normal incidence place and piles up the equipment of making by the multilevel insulator of Mo and Si.
Multilevel insulator is stacked on the angle acceptance that the normal incidence place shows 70% maximum reflectivity and ± 10 °, promptly has reflectivity less than 20% greater than the ray of 10 ° incident angle.
Fig. 5 shows second embodiment of EUV radiation collector 110, and this EUV radiation collector 110 presents the advantage of gatherer 10 somes that exceed shown in Fig. 4.
Collecting device 110 also can about intermediate collection axle 6 be arranged symmetrically in comprise the laser beam 1 that focuses on the target 4 with respect in target 4 and the semispace in cone space 8.
In Fig. 5, EUV radiation collector 110 is in glancing incidence, and the reflectivity that makes acquisition is greater than having the similar reflectivity of accepting the gatherer 10 of angle.
Advantageously, for the gatherer 110 of glancing incidence, it is feasible utilizing the first and second alternative expression gathering element 110a, 110b about intermediate collection axle 6 symmetries.
In the first variant embodiment, each of two gathering element 110a, 110b is the elliptical area form about 6 rotations of intermediate collection axle.In these cases, gatherer 110 for collect send by plasma and make that the angle with respect to the intermediate collection axle 6 of gatherer is efficient less than about 50 ° EUV ray.
In order to calculate the collection efficiency that depends on the aperture, the equation that is enough to be used for collector surface combines with the curve that the reflectivity aspect of the material that is used as the glancing angle function provides variation.In Fig. 3, γ represents the angle that the ray 9 by the EUV light emitted constitutes with respect to intermediate collection axle 6.
Curve E among Fig. 6 shows for the gatherer of the elliptical area type that comprises the rotation of being made by ruthenium, and reflectivity is how along with the function of the angle γ between the intermediate collection axle 6 of EUV emission and gatherer.This curve E represents to collect that to make angle γ be in 0 ° to the 50 ° EUV emission in the scope be feasible.Yet only the EUV ray of 25% 50 ° of angles place's ejaculation is collected.
In order to increase the collection of the ray that penetrates greater than 40 ° angle γ place, it is feasible will being associated with the outer member 110b that is made of the Wolter lens by the inner member 110a that gatherer constitutes with the elliptical area form of rotation.The Wolter lens are combinations of hyperboloid (left side of hyperbolic curve part element 110b in Fig. 5) that rotates and the elliptical area (right side of element 110b in Fig. 5) that rotates.The ray from pointolite greater than 40 ° angle γ places is reflected on hyperboloid, is reflected on elliptical area then,, two secondary reflections is arranged on element 110b that is.This equipment can be known in U.S. Patent No. 4,063 088.The advantage of Wolter lens is with little glancing angle two secondary reflections to take place, and wherein the reflectivity of material is its maximum reflectivity (typically being 90%).
Curve H among Fig. 6 shows by elliptical area gathering element 110a and is associated with the gathering element 110b that combines hyperboloid and elliptical area and the reflectivity that obtains.Related the making of this gatherer might significantly increase the number percent that is collected the EUV ray.It is feasible that this expression is collected in the ray that sends greater than 60 ° angle γ place expeditiously.Yet, collect the relative efficiency that becomes greater than 70 ° angle lower.
Should observe, the glancing incidence EUV gatherer of similar gatherer 110 is under the situation that is used for the LPP light source, show and make the advantage that between vacuum chamber and the chamber that self forms by gatherer 110, can use differential pump, in this vacuum chamber, produce target and form and spray 4.Differential pump makes to have the more vacuum of good quality in the closed area that is formed by gatherer, and this is really used the EUV radiation then for transmitting the EUV radiation, and it is very favorable being particularly useful for lithography application.
The present invention in conjunction with embodiment with reference to the feature shown in figure 2 and 5 in, it is feasible utilizing optical device 11 to focus on the laser beam that presents large-numerical aperture.
This is necessary, at first in order to utilize power laser, this power laser often have than Gaussian laser beam big several times multiply by the product (M of diameter by divergence
2), next purpose for laser beam is focused on minor diameter (typically in 10 μ m to 300 mu m ranges), and in order to realize 10
11Every square centimeter of (W/cm of watt
2) to 10
15(W/cm
2) illumination of magnitude, it is necessary for the plasma temperature that need to obtain.
Yet the equipment of this invention is not limited to the EUV lithography application of about 13.5nm.Also can offer the equipment that needs slightly different wavelength, especially shorter wavelength, as long as for for the irrelevant various physical phenomenons of any discontinuous or change of scale of knowing, the enough approaching scope that is used for the EUV photoetching of selected frequency of operation.
Therefore, for example, microscope in the far-ultraviolet region and chromatographic imaging constitute other application for the extreme ultraviolet light generation equipment of this invention.Its utilization even shorter wavelength especially are positioned at 2.3nm to 4.4nm scope corresponding to transmission window in the water.It is short that the wavelength ratio that produces is used for the wavelength of EUV photoetching, and can only other is used for the emissive material of target by choosing some, such as nitrogen, oxygen or carbon, and by increasing laser focusing to 10
13W/cm
2To 10
15W/cm
2Illumination during the value of magnitude and realizing.Experience is presented in this case, the desired temperature T of plasma
eBe 40eV to 200eV magnitude.
The equipment of Huo Deing is characterised in that target constitutes by being suitable for launching the material that is in the wavelength in 2.3nm to the 4.4nm scope, is characterised in that the illumination at laser focusing place has 10 by this way
13W/cm
2To 10
15W/cm
2The value of magnitude, and be characterised in that it comprises securing member and engagement device, be used to be connected to microscope or chromatographic imaging device in far-ultraviolet region work.
Therefore large aperture optical focusing system 11 can make a plurality of light beams merge at three dimensions.In this case, come a plurality of light beams of self-excitation light source to pass through identical optical element, thereby focus in an identical manner on the identical point.
As mentioned above, optical focusing device can be lens, mirror or such as the dioptric system of grating.The use of mirror shows certain advantage aspect temperature treatment, because mirror can effectively cool off via its rear surface.This is impossible for dioptrics device (lens) that only is suitable for cooling off via its edge or diffractive optical device (grating).
Fig. 7 shows second specific embodiment, wherein not only be implemented with reference to the collecting device 110 of figure 5 type of describing, and be disposed in the semispace that comprises focussed laser beam 1 (focusing on the right-hand of target 4 among Fig. 7), and having utilized other collecting device 210, this collecting device 210 is arranged symmetrically in the semispace of the laser beam 1 (focusing on the left of target 4 among Fig. 7) that does not comprise focusing about axis of symmetry 6.
As an example, other gatherer 210 can be the normal incidence mirror that comprises multiple-level stack with sphere.EUV radiation towards this mirror 210 is reflected among element 110a, the 110b of gatherer 110 thus.
Embodiment shown in Fig. 7 has the first glancing incidence gatherer 110 of laser beam 1 same side that is positioned at target 4 and focuses on, with be positioned at target 4 the second normal incidence gatherer 210 with laser beam 1 opposition side that focuses on, constituting from the viewpoint of the validity of collecting the EUV radiation thus is optimized embodiment.
By utilizing ray tracing software,, determine to be transferred to the EUV power of second focusing or middle focusing (image that constitutes the collection light source that makes by collection system) for various types of gatherers.The calculating of its execution is considered as the variation of reflectivity aspect on surface of the function of ray incident angle.Utilize the ruthenium layer to obtain fabulous result.
The laser beam side direction that utilize to focus on is followed the trail of target 4 and is made and might avoid restrictions to collection angle, still has the laser beam at the identical semispace inner focusing that is limited with first gatherer 10 or 110 simultaneously.Laser beam 1 approximately is in thus with respect to axle 6 the incident angle of gatherer 10 or 110 in 60 ° to 90 ° the scope.
Another advantage of utilizing side direction to follow the trail of is to utilize enough optical focusing systems away from plasma, is not upset by plasma to guarantee its function.In fact at first should limit the heated degree of optical focusing system, secondly be the degree that they suffer damage.Plasma is that main thermal source also is the charged ion source of damaging neighbouring surface.
Fig. 8 shows a specific implementations, and wherein focalizer comprises mirror 111.
As an example, mirror surfaces 111 can be the elliptical area form shown in Fig. 8.This mirror 111 at first is used to make laser beam 1 to focus on the minor diameter that typically is 50 μ m, and next is used to reduce the size of the laser beam of first prefocusing.Usually, laser beam is collimated before focusing on.Yet the use of collimated laser light bundle is with to implement EUV light source of the present invention incompatible, because this light beam can be large diameter and do not reserved the space that is used for by collimated light beam by the space that the multiple element of this light source occupies.Can produce the path that the structure of target 4, the structure of collecting the structure of EUV energy and being used for obtaining vacuum in the light source closed area do not make laser beam 1 obtain leading to target 4 and become easy.On the contrary, the mirror 111 of elliptical area shape makes self-excitation light source 13 and the laser beam 12 before focusing at the ingredient of gatherer 110 be used to produce between the element 2,3 of target 4 by becoming easy.
Optical focusing system can be positioned at around gatherer 110 ring of (being called " tripod (spider) " structure).
Put around being periphery of gatherer 10,110 and to show the advantage of introduction about the symmetrical a large amount of laser beam 1 of axle 6 circles that limit by EUV gatherer 10,110.This symmetry makes for illumination and therefore is transmitted in three dimensions for EUV and obtain good homogeneous and become possibility, and this homogeneity is an important criterion very, especially for photolithographic source.In order to adapt with the sort of mask luminaire of having developed, this circular symmetry is essential when focusing in the centre.
The optimization that the invention provides a plurality of laser beam that are used to make high-average power LPP type EUV light source focuses on, incident laser power is increased greatly, and the EUV radiation is collected with the same high efficient when using single laser beam, and effectively available EUV emission collection angle can not reduce owing to the existence of the optical devices that are used to focus on multiple laser beam.
The quantity of employed laser beam is more than or equal to 2, and preferably is in 3 to 20 the scope.
The equipment of this invention is used to carry out the device of Semiconductor substrate photoetching advantageously with the light source that is applied as in the extreme ultraviolet zone.
Be used to produce such as the mist of thread injection, fluid jet, droplet in the vacuum or the equipment 2 of the target 4 of the injection of droplet can be according to the embodiment described in for example patent documentation WO02/085080 and the WO01/30122 separately.
For the purpose of simplifying, Fig. 8 does not directly illustrate the power laser source, but Reference numeral 13 expressions are used for beam Propagation is focused in the middle of the optical system that focuses on mirror 111.
Select to utilize the mirror 111 that makes by metal or semiconductor material to make that the good compromise of realization becomes possibility between heat conduction and expansion coefficient.
The equipment of this invention is suitable for being created in the radiation in the far-ultraviolet region in 1nm to the 15nm scope.
Claims (25)
1. equipment that is used for producing the light of far-ultraviolet region (EUV), this equipment comprises:
A) a plurality of power laser source is used to launch a plurality of laser beam (12);
B) focalizer (11; 111), be used for focussed laser beam (12) to produce the laser beam (1) that focuses on;
C) be used to produce the device of vacuum space, it has the air pressure that is lower than 1Pa at least in the zone that the laser beam (1) of described focusing focuses on;
D) be used for producing in the described space that the laser beam (1) in described focusing focuses on the equipment (2) of intensive target (4), this intensive target (4) is suitable for laser beam (1) interaction with described focusing to be transmitted in the plasma (7) that has at least one emission line in the far-ultraviolet region;
E) receiving equipment (3) is used for receiving this target (4) after it interacts with the laser beam (1) of described focusing; And
F) at least one first equipment (10; 110), be used for collecting the EUV radiation of launching by this target (4);
This equipment is characterised in that: it has the intermediate collection axle that is used for the EUV radiation, and this intermediate collection axle is perpendicular to the axle that is limited by linear in fact intensive target (4); It is characterized in that, for focusing the laser beam to the focalizer (11 on this target (4); 111) be arranged in such a way: laser beam (1) side direction focuses in the public semispace that is in simultaneously on this target (4) with respect to this target (4), and simultaneously with respect to described intermediate collection axle (6) predetermined oblique angle (β), this predetermined angular (β) be in about 60 ° to about 90 ° scope; And it is characterized in that described first collecting device (10; 110) be arranged symmetrically in about described intermediate collection axle (6) and comprise in this this semispace that focuses on this laser beam (1) on this target (4), and be in the cone space at center with this intermediate collection axle (6), the summit of this cone space is on this target (4), and the half-angle (α) at place, this summit is less than the laser beam (1) of this focusing incident angle (β) with respect to this intermediate collection axle (6).
2. according to the equipment of claim 1, it is characterized in that: this equipment (2) that is used to produce linear in fact intensive target (4) comprises injector arrangement (2), is used for producing the mist of thread injection, fluid jet or droplet or the injection of droplet separately in vacuo.
3. according to the equipment of claim 1 or claim 2, it is characterized in that: the laser beam (1) of this focusing of tilting with respect to this intermediate collection axle (6) is arranged in the ring of this intermediate collection axle (6).
4. according to any one equipment of claim 1 to 3, it is characterized in that: comprising the number of laser beam (1) of this focusing be in 3 to 20 the scope.
5. according to any one equipment of claim 1 to 4, it is characterized in that: the laser beam of this focusing (1) is to arrange about the asymmetric mode of this intermediate collection axle (6).
6. according to any one equipment of claim 1 to 4, it is characterized in that: the laser beam of this focusing (1) is about this intermediate collection axle (6) symmetric arrangement.
7. according to any one equipment of claim 1 to 6, it is characterized in that: this focalizer (11; 111) design by this way: be created in and be in the laser beam that focuses on the minor diameter of about 10 μ m to about 300 mu m ranges.
8. according to any one equipment of claim 1 to 7, it is characterized in that: this focalizer (11; 111) comprise the optical focusing device (11) that is used to focus on a plurality of power laser bundles (12), what this power laser bundle (12) showed multiply by this product big several times of the product of diameter than Gaussian laser beam by divergence.
9. according to any one equipment of claim 1 to 8, it is characterized in that: this focalizer (111) comprises at least one mirror.
10. according to the equipment of claim 9, it is characterized in that: this mirror is made by semiconductor or metal material.
11. the equipment according to claim 10 is characterized in that: this mirror is made by silicon.
12. any one the equipment according to claim 9 to 11 is characterized in that: cooling device (112) is arranged on the back side of this mirror that constitutes this focalizer (111).
13. any one equipment according to claim 9 to 12, it is characterized in that: this mirror that constitutes this focalizer (111) is elliptical area or hyperboloid shape, be suitable for making laser beam (12) before focusing on by being used to produce this equipment (2) and described first collecting device (10 of target; 110) between.
14. any one the equipment according to claim 7 to 13 is characterized in that: this focalizer (11; 111) self be arranged on this inside, vacuum space.
15. the equipment according to claim 3 is characterized in that: this focalizer (11; 111) be arranged in around described first collecting device (10; 110) in the ring.
16. any one the equipment according to claim 1 to 15 is characterized in that: described first collecting device (10) comprises the piling up of a plurality of insulation courses of Mo and Si at the normal incidence place.
17. according to any one equipment of claim 1 to 15, it is characterized in that: described first collecting device (110) comprises an optical device at the glancing incidence place, there is the surface of gold, ruthenium or palladium in this optical device.
18. the equipment according to claim 17 is characterized in that: described first collecting device (110) comprise the first and second alternative expression gathering elements (110a, 110b).
19. the equipment according to claim 18 is characterized in that: (110a, 110b) each all shows the elliptical area shape about this intermediate collection axle (6) rotation to this first and second alternative expressions gathering element.
20. equipment according to claim 18, it is characterized in that: this first alternative expression gathering element (110a) is the inner member that shows about the elliptical area shape of this intermediate collection axle (6) rotation, this second alternative expression gathering element (110b) is an outer member simultaneously, and this outer member begins to show in succession from the end towards this target (4): the hyperboloid shape of rotation then is the elliptical area shape of rotation.
21. any one equipment according to claim 1 to 20, it is characterized in that: it also comprises second collecting device (210), and it is arranged symmetrically in by this target (4) about this intermediate collection axle (6) and limits and do not comprise in the semispace of the laser beam (1) that focuses on this target (4).
22. the equipment according to claim 21 is characterized in that: this second collecting device (210) comprises the normal incidence mirror of the multiple-level stack with sphere.
23. any one the equipment according to claim 1 to 22 is characterized in that: it is suitable for being created in the radiation in the far-ultraviolet region in 1nm to the 15nm scope.
24. any one the equipment according to claim 1 to 23 is characterized in that: its device that is applied to be used for the Semiconductor substrate photoetching is as the light source in the extreme ultraviolet zone of about 13.5nm.
25. according to any one equipment of claim 1 to 23, it is characterized in that: this target is made by being suitable for launching the material that is in the wavelength in 2.3 nm to the 4.4nm scopes, it is characterized in that the illumination during laser focusing has 10
13W/cm
2To 10
15W/cm
2The value of value, and it is characterized in that it comprises securing member and coupling arrangement, be used to be connected to microscope or chromatographic imaging device in far-ultraviolet region work.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0406429A FR2871622B1 (en) | 2004-06-14 | 2004-06-14 | ULTRAVIOLET LIGHT GENERATING DEVICE AND APPLICATION TO A RADIATION LITHOGRAPHIC SOURCE IN THE EXTREME ULTRAVIOLET |
| FR0406429 | 2004-06-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101019078A true CN101019078A (en) | 2007-08-15 |
| CN100541336C CN100541336C (en) | 2009-09-16 |
Family
ID=34946881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800195526A Expired - Fee Related CN100541336C (en) | 2004-06-14 | 2005-06-14 | Produce the equipment of light in the far-ultraviolet region and to utilizing the application of the photolithographic source of radiation in the far-ultraviolet region |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7399981B2 (en) |
| EP (1) | EP1800188B1 (en) |
| JP (1) | JP2008503078A (en) |
| KR (1) | KR20070058386A (en) |
| CN (1) | CN100541336C (en) |
| AT (1) | ATE394708T1 (en) |
| DE (1) | DE602005006599D1 (en) |
| FR (1) | FR2871622B1 (en) |
| RU (1) | RU2006143322A (en) |
| WO (1) | WO2006000718A1 (en) |
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Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7439530B2 (en) * | 2005-06-29 | 2008-10-21 | Cymer, Inc. | LPP EUV light source drive laser system |
| US7034320B2 (en) * | 2003-03-20 | 2006-04-25 | Intel Corporation | Dual hemispherical collectors |
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| CN103782662B (en) | 2011-09-02 | 2016-09-07 | Asml荷兰有限公司 | Radiation source |
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| DE102016205893A1 (en) * | 2016-04-08 | 2017-10-12 | Carl Zeiss Smt Gmbh | EUV collector for use in an EUV projection exposure system |
| RU2658314C1 (en) * | 2016-06-14 | 2018-06-20 | Общество С Ограниченной Ответственностью "Эуф Лабс" | High-frequency source of euf-radiation and method of generation of radiation from laser plasma |
| KR102669150B1 (en) | 2016-07-27 | 2024-05-27 | 삼성전자주식회사 | Extreme ultraviolet(EUV) exposure system comprising ultraviolet(UV) exposure apparatus |
| US10959318B2 (en) * | 2018-01-10 | 2021-03-23 | Kla-Tencor Corporation | X-ray metrology system with broadband laser produced plasma illuminator |
| US10109473B1 (en) | 2018-01-26 | 2018-10-23 | Excelitas Technologies Corp. | Mechanically sealed tube for laser sustained plasma lamp and production method for same |
| US11086226B1 (en) * | 2020-06-03 | 2021-08-10 | Lawrence Livermore National Security, Llc | Liquid tamped targets for extreme ultraviolet lithography |
| US11587781B2 (en) | 2021-05-24 | 2023-02-21 | Hamamatsu Photonics K.K. | Laser-driven light source with electrodeless ignition |
| RU2765486C1 (en) * | 2021-06-07 | 2022-01-31 | Федеральное государственное бюджетное учреждение науки Физико-технический институт им. А.Ф. Иоффе Российской академии наук | Thermonuclear target for indirect initiation |
| DE102023104013A1 (en) * | 2023-02-17 | 2024-08-22 | TRUMPF Laser SE | Laser system and method for generating secondary radiation by interaction of a primary laser beam with a target material |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4063088A (en) * | 1974-02-25 | 1977-12-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method of and means for testing a glancing-incidence mirror system of an X-ray telescope |
| US4704718A (en) * | 1985-11-01 | 1987-11-03 | Princeton University | Apparatus and method for generating soft X-ray lasing action in a confined plasma column through the use of a picosecond laser |
| JPH0675200B2 (en) * | 1990-05-18 | 1994-09-21 | 株式会社オーク製作所 | Cooling structure for exposure equipment |
| EP1083777A4 (en) * | 1998-05-29 | 2004-03-05 | Nippon Kogaku Kk | Laser-excited plasma light source, exposure apparatus and its manufacturing method, and device manufacturing method |
| US6307913B1 (en) * | 1998-10-27 | 2001-10-23 | Jmar Research, Inc. | Shaped source of soft x-ray, extreme ultraviolet and ultraviolet radiation |
| US6831963B2 (en) * | 2000-10-20 | 2004-12-14 | University Of Central Florida | EUV, XUV, and X-Ray wavelength sources created from laser plasma produced from liquid metal solutions |
| FR2802311B1 (en) * | 1999-12-08 | 2002-01-18 | Commissariat Energie Atomique | LITHOGRAPHY DEVICE USING A RADIATION SOURCE IN THE EXTREME ULTRAVIOLET AREA AND MULTI-LAYER SPECTRAL BAND MIRRORS IN THIS AREA |
| FR2823949A1 (en) | 2001-04-18 | 2002-10-25 | Commissariat Energie Atomique | Generating extreme ultraviolet radiation in particular for lithography involves interacting a laser beam with a dense mist of micro-droplets of a liquefied rare gas, especially xenon |
| US6633048B2 (en) * | 2001-05-03 | 2003-10-14 | Northrop Grumman Corporation | High output extreme ultraviolet source |
| JP3944008B2 (en) * | 2002-06-28 | 2007-07-11 | キヤノン株式会社 | Reflective mirror apparatus, exposure apparatus, and device manufacturing method |
| KR100589236B1 (en) * | 2002-08-15 | 2006-06-14 | 에이에스엠엘 네델란즈 비.브이. | Lithographic projection apparatus and reflector assembly for use in said apparatus |
| US6973164B2 (en) * | 2003-06-26 | 2005-12-06 | University Of Central Florida Research Foundation, Inc. | Laser-produced plasma EUV light source with pre-pulse enhancement |
| JP4327799B2 (en) * | 2003-08-27 | 2009-09-09 | カール・ツァイス・エスエムティー・アーゲー | Tilt mirror normal incidence collector system for light source, especially EUV plasma discharge source |
-
2004
- 2004-06-14 FR FR0406429A patent/FR2871622B1/en not_active Expired - Fee Related
-
2005
- 2005-06-13 US US11/151,696 patent/US7399981B2/en not_active Expired - Fee Related
- 2005-06-14 DE DE602005006599T patent/DE602005006599D1/en active Active
- 2005-06-14 WO PCT/FR2005/001465 patent/WO2006000718A1/en active IP Right Grant
- 2005-06-14 EP EP05777195A patent/EP1800188B1/en not_active Not-in-force
- 2005-06-14 KR KR1020067027662A patent/KR20070058386A/en not_active Application Discontinuation
- 2005-06-14 CN CNB2005800195526A patent/CN100541336C/en not_active Expired - Fee Related
- 2005-06-14 RU RU2006143322/28A patent/RU2006143322A/en not_active Application Discontinuation
- 2005-06-14 AT AT05777195T patent/ATE394708T1/en not_active IP Right Cessation
- 2005-06-14 JP JP2007515990A patent/JP2008503078A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103079327A (en) * | 2013-01-05 | 2013-05-01 | 中国科学院微电子研究所 | Target source pre-shaping enhanced extreme ultraviolet light generating device |
| CN103079327B (en) * | 2013-01-05 | 2015-09-09 | 中国科学院微电子研究所 | Target source pre-shaping enhanced extreme ultraviolet light generating device |
| CN105453704A (en) * | 2013-08-06 | 2016-03-30 | Asml荷兰有限公司 | System and method for return beam metrology with optical switch |
| CN105453704B (en) * | 2013-08-06 | 2019-01-08 | Asml荷兰有限公司 | System and method for carrying out Returning beam measurement using photoswitch |
| CN106165061A (en) * | 2014-04-01 | 2016-11-23 | 科磊股份有限公司 | The most pumped system and method for laser-sustained plasma |
| CN106165061B (en) * | 2014-04-01 | 2018-06-22 | 科磊股份有限公司 | For the pumped system and method for the transverse direction of laser-sustained plasma |
| CN105651463A (en) * | 2014-11-27 | 2016-06-08 | 三星电子株式会社 | Apparatus and method of sensing liquid leakage for lithography apparatus |
| CN105651463B (en) * | 2014-11-27 | 2019-09-24 | 三星电子株式会社 | For sensing the device and method of the liquid leakage of lithographic equipment |
| CN104914680A (en) * | 2015-05-25 | 2015-09-16 | 中国科学院上海光学精密机械研究所 | LPP-EUV light source system based on collosol jet target |
| CN113330651A (en) * | 2019-01-22 | 2021-08-31 | 相干公司 | Diode-pumped solid-state laser device for laser annealing |
| CN113433804A (en) * | 2021-07-26 | 2021-09-24 | 广东省智能机器人研究院 | Extreme ultraviolet lithography method and system |
| CN113433805A (en) * | 2021-07-26 | 2021-09-24 | 广东省智能机器人研究院 | Extreme ultraviolet lithography method and system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008503078A (en) | 2008-01-31 |
| FR2871622B1 (en) | 2008-09-12 |
| EP1800188A1 (en) | 2007-06-27 |
| US20060039435A1 (en) | 2006-02-23 |
| US7399981B2 (en) | 2008-07-15 |
| CN100541336C (en) | 2009-09-16 |
| EP1800188B1 (en) | 2008-05-07 |
| KR20070058386A (en) | 2007-06-08 |
| WO2006000718A1 (en) | 2006-01-05 |
| ATE394708T1 (en) | 2008-05-15 |
| FR2871622A1 (en) | 2005-12-16 |
| RU2006143322A (en) | 2008-07-20 |
| DE602005006599D1 (en) | 2008-06-19 |
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