CN101009419A - A semiconductor pump micro-slice laser - Google Patents
A semiconductor pump micro-slice laser Download PDFInfo
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- CN101009419A CN101009419A CN 200610038137 CN200610038137A CN101009419A CN 101009419 A CN101009419 A CN 101009419A CN 200610038137 CN200610038137 CN 200610038137 CN 200610038137 A CN200610038137 A CN 200610038137A CN 101009419 A CN101009419 A CN 101009419A
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Abstract
The invention relates to a semiconductor pumping micro laser that includes pumping source semiconductor laser, optical lens coupled system, laser gain medium and multiple frequency crystal, the laser gain medium and multiple frequency crystal are felted to form micro laser, thereinto the mode of moving pumping light as piecewise time is used to move the pumping point or micro laser which is set on the machine construction, by adopting said structure, damage area of long time working of general micro laser is little, normal damage area of micro laser is phi0.2mm, with the character of perfect uniformity of different pumping point in middle area of flat structure micro laser, the pumping is shift to prolong the life of the micro laser, so the integral life of the laser is prolonged, or using machine construction to change micro laser, the structure is simple, the realization is easy to realize, the effect of prolonging life and saving cost are also achieved.
Description
Technical field
The present invention relates to a kind of laser, relate in particular to a kind of semiconductor pump micro-slice laser.
Technical background
Present micro sheet structure laser, the micro-slice intracavity frequency-doubling laser of especially average resonator end surface pumping, because endovenous laser power is stronger, the density of laser power progressively sustains damage frequency-doubling crystal, thereby influence laser life-span, micro-slice laser comprises pumping source semiconductor laser 101, optical lens coupled system 102, gain medium Nd:YVO as shown in Figure 1
4103 and frequency-doubling crystal KTP104, gain medium Nd:YVO
4103 and frequency-doubling crystal KTP104 adopt bonding or gummed mode to link together, form the micro-slice laser of an average cavity configuration.Because frequency-doubling crystal KTP104 can progressively sustain damage at long-term high-power operation state, produces so-called gray line, so frequency doubled light output progressively reduces in time, thereby influences the life-span of whole laser.Usually as the pumping source laser life-span on 10,000 hours, have 100,000 hours at most, and usually the higher-wattage micro-slice laser life-span at hundreds of hour by several thousand hours.Conventional frequency-doubling crystal KTP104 microplate is very little, adopts gluing fixing in Optical Maser System, promptly damages the back in institute pumping zone and just should abandon using, and has a strong impact on the application and the cost of semiconductor pumped device structure like this.
Summary of the invention
The object of the invention provides and a kind ofly improves frequency-doubling crystal useful life to prolong the semiconductor pump micro-slice laser of laser life-span.
The object of the invention is achieved through the following technical solutions: laser comprises pumping source semiconductor laser, optical lens coupled system, gain medium and frequency-doubling crystal, gain medium and frequency-doubling crystal bonding forms micro-slice laser, and the time piecemeal of wherein adopting is moved the mode of the pumping point of pump light on micro-slice laser.
Another kind method is that laser comprises pumping source semiconductor laser, optical lens coupled system, gain medium and frequency-doubling crystal, gain medium and frequency-doubling crystal bonding form micro-slice laser, and wherein micro-slice laser is arranged on the mechanical structure of conveniently assemble and disassemble.
The present invention adopts above structure, usually the micro-slice laser damage field that works long hours is less, conventional micro-slice laser damage field is φ 0.2mm, utilize the different pumping points of average cavity configuration micro-slice laser zone line that better consistency characteristics are arranged, come the mode of mobile pumping, with the life-span of prolongation micro-slice laser, thereby prolong whole laser life-span; Perhaps utilize mechanical structure, directly change micro-slice laser, this is simple in structure, implements to adjust easily and realizes, the effect of also can reach life-saving, saving cost.
Description of drawings
Now the present invention is further elaborated in conjunction with the accompanying drawings:
Fig. 1 is the structural representation of existing micro-slice laser;
Fig. 2 is the structural representation of one of the present invention method embodiment of moving pumping;
Fig. 3 is two the structural representation of the present invention method embodiment of moving pumping;
Fig. 4 is three the structural representation of the present invention method embodiment of moving pumping;
Fig. 5 is four the structural representation of the present invention method embodiment of moving pumping;
Fig. 6 is five the structural representation of the present invention method embodiment of moving pumping;
Fig. 7 is six the structural representation of the present invention method embodiment of moving pumping;
Fig. 8 is seven the structural representation of the present invention method embodiment of moving pumping;
Fig. 9 is the structural representation that the present invention changes micro-slice laser;
Figure 10 is the sectional structure schematic diagram of the present invention's laser of changing micro-slice laser;
Figure 11 is the sectional structure schematic diagram of the present invention's mechanical structure of changing micro-slice laser.
Embodiment
The present invention such as Fig. 2,3,4,5,6,7 and shown in Figure 8, laser comprises pumping source semiconductor laser 101, optical lens coupled system 102, gain medium 103 and frequency-doubling crystal 104, gain medium 103 and frequency-doubling crystal 104 bondings form micro-slice laser 11, adopt wherein that the time is moved the mode of pumping, the pumping point on the mobile micro-slice laser 11 piecemeal.
One of embodiment: as shown in Figure 2, optics plain film or angle of wedge sheet 105 between optical lens coupled system 102 and micro-slice laser 11, have been inserted, optics plain film or angle of wedge sheet 105 can rotate pump light is moved on a circumference around an axis, its different-thickness or the different angle of wedge can make the pumping point rotate on different circumference, to make full use of micro-slice laser 11 most of end faces, also can adopt successively and insert optics plain film or the angle of wedge sheet 105 that one group of normal line of butt end direction with micro-slice laser 11 forms an angle, reach the mobile spot purpose.
Two of embodiment: as shown in Figure 3, optical lens coupled system 102 is made turnable, and its central shaft line parallel skew center of rotation axis, to reach mobile pumping point target.
Three of embodiment: as shown in Figure 4, one of in pumping source semiconductor laser 101, optical lens coupled system 102 and micro-slice laser 11, two or three outside mechanical structure 114 is set, make their translations on the face of vertical optical direction, the pumping point is moved the position on micro-slice laser 11.
Four of embodiment: as shown in Figure 5, between optical lens coupled system 102 and micro-slice laser 11, insert the first optical parallel plain film 106, mobile pumping point is the position on micro-slice laser 11, after micro-slice laser 11, insert the second optical parallel plain film 108 again, original outgoing position is returned in the light path translation.
Five of embodiment: as shown in Figure 6, a flat-concave cavity laser, gain medium 103 front surfaces plating laser cavity mould, frequency-doubling crystal 104 rear surfaces plating anti-reflection film, gain medium 103 and frequency-doubling crystal 104 mutual optical cements or in-depth optical cement micro-slice laser 11 in aggregates, its translation on the face of vertical optical direction, the outbound course of laser is constant.
Six of embodiment: as shown in Figure 7, with embodiment one, two is the same with four the pumping point is moved, the second optical parallel plain film 108 is the first optical parallel plain film 106 to be produced the pumping points cause that optical path change compensates, and realizes laser generation.
Seven of embodiment: as shown in Figure 8, gain medium 103 can be to separate with frequency-doubling crystal 104 in micro-slice laser 11.
The another kind of structure of the present invention as shown in Figure 9, laser comprises pumping source semiconductor laser 101, optical lens coupled system 102, gain medium 103 and frequency-doubling crystal 104, gain medium 103 and frequency-doubling crystal 104 bondings form micro-slice laser 11, wherein micro-slice laser 11 is arranged on the mechanical structure 114 of conveniently assemble and disassemble, be locked by screw 120, in a single day micro-slice laser 11 sustains damage, and can change immediately, and the laser machine life is significantly prolonged.
Concrete performance such as Figure 10 of said structure, shown in 11, laser is provided with heat sink 119, heat sink 119 are provided with refrigerating sheet 118, metallic support 110,115 are located on the refrigerating sheet 118, pumping source semiconductor laser 101, optical lens coupled system 102 is fixed on the metallic support 110, optical parallel plain film 106,108 are separately fixed at metallic support 111, on 116, metallic support 111,116 are provided with the V-type groove 112 that there is the location side, 117, respectively by screw 113,118 are locked in metallic support 110, on 115, mechanical structure 114 is locked on the metallic support 115 by screw 120, it is provided with along X, the miniature translation adjustment rack 121 of Y direction, 122, micro-slice laser 11 is fixed on miniature translation adjustment rack 121, in 122, mechanical structure 114 and miniature translation adjustment rack 121,122 can change or move, to reach mobile micro-slice laser 11, adjust the purpose of pumping point position or replacing micro-slice laser 11.
Claims (9)
1, a kind of semiconductor pump micro-slice laser, comprise pumping source semiconductor laser, optical lens coupled system, gain medium and frequency-doubling crystal, gain medium and frequency-doubling crystal bonding forms micro-slice laser, it is characterized in that: its time piecemeal of adopting is moved the mode of the pumping point of pump light on micro-slice laser.
2, a kind of semiconductor pump micro-slice laser according to claim 1, it is characterized in that: its micro-slice laser is arranged on the mechanical structure of conveniently assemble and disassemble.
3, a kind of semiconductor pump micro-slice laser according to claim 1, it is characterized in that: it has inserted optics plain film or angle of wedge sheet between optical lens coupled system and micro-slice laser, optics plain film or angle of wedge sheet rotate pumping are moved on a circumference around an axis, and its different-thickness or the different angle of wedge can make the pumping point rotate on different circumference; Perhaps between optical lens coupled system and micro-slice laser, adopt to insert optics plain film or angle of wedge sheet that one group of normal line of butt end direction with micro-slice laser forms an angle successively.
4, a kind of semiconductor pump micro-slice laser according to claim 1 is characterized in that: its optical lens coupled system is made turnable, and its central shaft line parallel skew center of rotation axis.
5, a kind of semiconductor pump micro-slice laser according to claim 1, it is characterized in that: its one of in pumping source semiconductor laser, optical lens coupled system and micro-slice laser, two or three outside mechanical structure is set, make their translations on the face of vertical optical direction.
6, a kind of semiconductor pump micro-slice laser according to claim 1 is characterized in that: it inserts the first optical parallel plain film between optical lens coupled system and micro-slice laser, insert the second optical parallel plain film after micro-slice laser again.
7, a kind of semiconductor pump micro-slice laser according to claim 1, it is characterized in that: its gain medium front surface plating laser cavity mould, frequency-doubling crystal rear surface plating anti-reflection film, mutual optical cement of gain medium and frequency-doubling crystal or in-depth optical cement are in aggregates, the translation on the face of vertical optical direction of its integral body.
8, a kind of semiconductor pump micro-slice laser according to claim 1, it is characterized in that: gain medium separates with frequency-doubling crystal in its micro-slice laser.
9, a kind of semiconductor pump micro-slice laser according to claim 2, it is characterized in that: its mechanical structure is provided with the miniature translation adjustment rack along X, Y direction, micro-slice laser is fixed in the miniature translation adjustment rack, and mechanical structure and miniature translation adjustment rack all can be changed or move.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610038137 CN101009419A (en) | 2006-01-28 | 2006-01-28 | A semiconductor pump micro-slice laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610038137 CN101009419A (en) | 2006-01-28 | 2006-01-28 | A semiconductor pump micro-slice laser |
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| CN101009419A true CN101009419A (en) | 2007-08-01 |
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| CN 200610038137 Pending CN101009419A (en) | 2006-01-28 | 2006-01-28 | A semiconductor pump micro-slice laser |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872933A (en) * | 2010-05-31 | 2010-10-27 | 清华大学 | Semiconductor pumped full-cavity microchip laser device with stable output wavelength |
| CN104966980A (en) * | 2015-07-01 | 2015-10-07 | 苏州紫光伟业激光科技有限公司 | Frequency doubling crystal holder in high power solid laser |
| CN106711749A (en) * | 2017-01-10 | 2017-05-24 | 鞍山紫玉激光科技有限公司 | Long-life end-face pumped ultraviolet laser |
-
2006
- 2006-01-28 CN CN 200610038137 patent/CN101009419A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872933A (en) * | 2010-05-31 | 2010-10-27 | 清华大学 | Semiconductor pumped full-cavity microchip laser device with stable output wavelength |
| CN104966980A (en) * | 2015-07-01 | 2015-10-07 | 苏州紫光伟业激光科技有限公司 | Frequency doubling crystal holder in high power solid laser |
| CN104966980B (en) * | 2015-07-01 | 2017-11-28 | 苏州紫光伟业激光科技有限公司 | Frequency-doubling crystal support in high power solid state laser |
| CN106711749A (en) * | 2017-01-10 | 2017-05-24 | 鞍山紫玉激光科技有限公司 | Long-life end-face pumped ultraviolet laser |
| CN106711749B (en) * | 2017-01-10 | 2023-11-10 | 鞍山紫玉激光科技有限公司 | End-pumped ultraviolet laser with long service life |
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Open date: 20070801 |