CN101009345A - Encapsulation device of the LED - Google Patents
Encapsulation device of the LED Download PDFInfo
- Publication number
- CN101009345A CN101009345A CNA2006100070014A CN200610007001A CN101009345A CN 101009345 A CN101009345 A CN 101009345A CN A2006100070014 A CNA2006100070014 A CN A2006100070014A CN 200610007001 A CN200610007001 A CN 200610007001A CN 101009345 A CN101009345 A CN 101009345A
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- lead foot
- radiator
- led wafer
- emitting diode
- light emitting
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Abstract
A LBD encapsulation device includes the first foot, a second foot, a radiator, a shell, a conducting object and a LBD wafer, the radiator is collocated between the first and the second foot, the shell covers the radiator and part of the first and second foot, and the shell possesses a upper surface which exposes the radiator and the first and the second foot, the conducting object is connected between the first foot and the radiator, besides, the LBD possesses the first surface and the second surface which are corresponding with each other, the second surface is collocated to the radiator, and the LBD wafer is electric connected with the first and second foot. Because the conducting object is connected between the first foot and radiator, when the first contact cushion of the LBD wafer is on the second surface, the radiator and the conducting object can be directly connected to the first foot, so, the red light, green light or the blue light LBD wafer also can be used.
Description
[technical field]
The invention relates to a kind of encapsulating structure of light-emitting component, particularly about a kind of encapsulation device of light emitting diode.
[background technology]
In recent years, because the luminous efficiency of light-emitting diode constantly promotes, make light-emitting diode replace fluorescent lamp and incandescent lamp bulb gradually, for example need the scanner lamp source, Backlight For Liquid Crystal Display Panels of at a high speed reaction etc. in some field, all with light-emitting diode as light source.
Please refer to Fig. 1, the generalized section of known package structure for LED.Known package structure for LED 100 is made of a foot rest 102, a packing colloid 104, a LED wafer 106 and two bonding wire 108a, bonding wire 108b.Wherein, foot rest 102 is made of the crystal chip bearing seat 102c that two lead foot 102a, 102b and are disposed on the lead foot 102a.LED wafer 106 is to be adhered among the crystal chip bearing seat 102c, and electrically connects with lead foot 102a, 102b respectively by bonding wire 108a, 108b.Particularly, have two contact mat 106a, 106b on the LED wafer 106, and bonding wire 108a, 108b are then on contact mat 106a, the 106b of LED wafer 160.In addition, packing colloid 104 is lead foot 102a, the 102b that coat bonding wire 108a, bonding wire 108b, LED wafer 106 and part.
It should be noted that, above-mentioned package structure for LED 100 is only applicable to the LED wafer (as blue light, green light LED wafer) that two contact mat 106a, 106b all are positioned at same surface, and the LED wafer (as the red light-emitting diode wafer) that two contact mats lay respectively at two opposite surfaces then can't be applicable to this encapsulating structure.
In addition, in the existing package structure for LED 100, because the heat sinking function of crystal chip bearing seat 102c is relatively poor, so that the heat that LED wafer 106 is produced can't effectively be discharged, particularly order about down at high electric current, LED wafer 106 is often damaged because of overheated easily.
[summary of the invention]
The objective of the invention is to be to provide a kind of encapsulation device of light emitting diode, make ruddiness, green glow and blue light-emitting diode wafer, and can prevent that LED wafer from damaging because of overheated all applicable to this framework.
In order to achieve the above object, the invention provides a kind of encapsulation device of light emitting diode, it comprises one first lead foot, one second lead foot, a radiator, a housing, an electric conductor and a LED wafer; Wherein, radiator is to be disposed between first and second lead foot; Housing is to coat radiator and first and second lead foot of part, and housing has a upper surface, and it is to expose radiator and first and second lead foot; Electric conductor is to be connected between first lead foot and the radiator; In addition, LED wafer has a relative first surface and a second surface, and second surface is to be disposed on the radiator, and LED wafer is to electrically connect with first and second lead foot; In the encapsulation device of light emitting diode of the present invention, because electric conductor is to be connected between first lead foot and the radiator, when first contact mat of LED wafer is positioned on its second surface, can directly see through radiator and electric conductor and be electrically connected to first lead foot, therefore, no matter be that ruddiness, green glow or blue light-emitting diode wafer are all in the framework applicable to the present invention.
In sum, encapsulation device of light emitting diode of the present invention has following advantage at least:
1. the present invention has an electric conductor and is connected between first lead foot and the radiator, when first contact mat of LED wafer is positioned on its second surface, can directly sees through radiator and electric conductor and is electrically connected to first lead foot.Therefore, no matter be that ruddiness, green glow or blue light-emitting diode wafer are all applicable in the framework of the present invention.
Therefore 2. because radiator can directly dispel the heat to LED wafer, can prevent effectively that LED wafer from damaging because of overheated.
[description of drawings]
Fig. 1 is the generalized section of existing package structure for LED.
Fig. 2 is the stereogram of a kind of encapsulation device of light emitting diode of first embodiment of the invention.
Fig. 3 is the generalized section of the encapsulation device of light emitting diode of Fig. 2.
Fig. 4 is the stereogram of the lens of encapsulation device of light emitting diode.
Fig. 5 is the lower surface schematic diagram of the encapsulation device of light emitting diode of Fig. 2.
Fig. 6 is the stereogram of the encapsulation device of light emitting diode of second embodiment of the invention.
Fig. 7 is the stereogram of the encapsulation device of light emitting diode of third embodiment of the invention.
Fig. 8 is the profile of the encapsulation device of light emitting diode of fourth embodiment of the invention.
[embodiment]
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
In the encapsulation device of light emitting diode of the present invention, two contact mats of LED wafer can or be positioned on the two opposite surfaces on same surface.In other words, LED wafer can be ruddiness, green glow or blue light-emitting diode wafer in the present invention.Following for first embodiment and second embodiment promptly be positioned at same lip-deep structure and describe at two contact mats of LED wafer, describe and the 3rd embodiment is the structure that two contact mats at LED wafer are positioned on the two opposite surfaces.In addition, the 4th embodiment is the technology that explanation encapsulating structure of the present invention also can adopt chip bonding.Please refer to following explanation.
First embodiment
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the stereogram of a kind of encapsulation device of light emitting diode of first embodiment of the invention, and Fig. 3 is the generalized section of the encapsulation device of light emitting diode of Fig. 2.The encapsulation device of light emitting diode 200 of present embodiment comprises one first lead foot 210, one second lead foot 220, a radiator 230, a housing 240, an electric conductor 250 and a LED wafer 260.Wherein, radiator 230 is to be disposed between first lead foot 210 and second lead foot 220.Housing 240 is to coat radiator 230 and part first lead foot 210 and second lead foot 220, and housing 240 has a upper surface 242, and it is to expose radiator 230 and first lead foot 210, second lead foot 220.Electric conductor 250 is to be connected between first lead foot 210 and the radiator 230.In addition, LED wafer 260 has a relative first surface 262 and a second surface (not indicating), and second surface is to be disposed on the radiator 230, and LED wafer 260 is to electrically connect with first lead foot 210 and second lead foot 220.
In the above-mentioned encapsulation device of light emitting diode 200, the material of first lead foot 210 and second lead foot 220 for example is a metal, and its surface can plate as nickel (Ni), silver (Ag), aluminium (Al), platinum (Pt), palladium (Pd) or gold metal materials such as (Au).Radiator 230 for example be fin or by fin and be disposed at fin and LED wafer between thermal diffusion plate formed.Wherein, the material of fin can be silver (Ag), copper (Cu) or aluminium nitride (AlN), and its surface also can plate as nickel (Ni), silver (Ag), aluminium (Al), platinum (Pt), palladium (Pd) or gold metal materials such as (Au).In addition, thermal diffusion plate is that the material of this thermal diffusion plate for example is copper/molybdenum/copper (Cu/Mo/Cu), copper/tungsten/copper (Cu/W/Cu) in order to reduction fin expanded by heating degree, but not as limit.In addition, the material of housing 240 for example be liquid crystal polymer (liquid-crystal polymer, LCP), many phthalic acids ammoniate (polyphthal amide, PPA) or high temperature resistant nylon (high temperature nylon, HTN).
In the present embodiment, LED wafer 260 for example is mode and first lead foot 210 and 220 electric connections of second lead foot that engage with routing.Particularly, be by bonding wire 270a in encapsulation device of light emitting diode 200 and bonding wire 270b is connected between first lead foot 210 and first contact mat 264 and between second lead foot 220 and second contact mat 266, so that the LED wafer 260 and first lead foot 210 and second lead foot 220 electrically connect.Wherein, bonding wire 270a, 270b for example are gold thread, aluminum steel, copper cash or other metal wires that is suitable for.In addition, after routing engages, can be coated with a protective layer (not illustrating) on LED wafer 260, the material of this protective layer for example is transparent adhesive tape materials such as epoxy resin (epoxy), silica gel (silicone) or UV glue.
Because the LED wafer 260 of present embodiment is directly to be disposed on the radiator 230, so heat that LED wafer 260 is produced, can directly discharge by radiator 230, even order about down at high electric current, LED wafer 260 also is not easy to damage because of overheated.
Please refer to Fig. 2 and Fig. 4, Fig. 4 is the stereogram of the lens of encapsulation device of light emitting diode.The encapsulation device of light emitting diode 200 of present embodiment for example also comprises lens 275, and it is to be disposed on the upper surface 242 of housing 240, and coats LED wafer 260.Wherein, the upper surface 242 of housing 240 for example has at least one slot 242a, and lens 275 for example have at least one fitting portion 275a, and it is suitable for embedding among the slot 242a.In addition, surface 242 for example has more one of adjacent with slot 242a location notch 242b on the housing 240, and lens 275 for example have more and are disposed at the last positioning protrusion 275b of fitting portion 275a, and it is suitable for embedding among the location notch 242b.In addition, the material of lens 275 is a light-transmitting materials, as Merlon (polycarbonate, PC), polymethyl methacrylate (PMMA), silica gel or epoxy resin etc.
Because housing 240 has slot 242a and location notch 242b, can make lens 275 and housing 240 be easy to assembling, and, can prevent lens 275 rotations by the cooperating of location notch 242b and positioning convex 275b.In addition, before assembling lens 275 and housing 240, can assemble again afterwards, to utilize colloid cemented lens 275 and housing 240 prior to being coated with colloid in slot 242a and the location notch 242b.
Please refer to Fig. 5 and Fig. 2, Fig. 5 is the lower surface schematic diagram of the encapsulation device of light emitting diode of Fig. 2.In the encapsulation device of light emitting diode 200 of present embodiment, a lower surface 244 that housing 240 and upper surface 242 are relative, it is a surface 232 that exposes radiator 230, and the profile on this surface 232 is to have a circular contour of cutting edge, and rotates to prevent radiator 230.
Second embodiment
Please refer to Fig. 6, Fig. 6 is the stereogram of the encapsulation device of light emitting diode of second embodiment of the invention.The encapsulation device of light emitting diode 200a of present embodiment is similar to the encapsulation device of light emitting diode 200 of first embodiment, difference is in encapsulation device of light emitting diode 200a, the upper surface 242 of housing 240 for example has a groove 246, it is to expose radiator 230, and LED wafer 260 is on the radiator 230 that is disposed in the groove 246.Wherein, groove 246 can be used to assemble the light that LED wafer 260 is sent, to improve luminous efficiency.
The 3rd embodiment
In the encapsulation device of light emitting diode 200 of first embodiment, first contact mat 264 of LED wafer 260 and second contact mat 266 are to be positioned at (as blue light, green light LED wafer) on the first surface 262 simultaneously, yet in the LED wafer of another type, first contact mat 264 and second contact mat 266 are to lay respectively at (as the red light-emitting diode wafer) on opposite first and the second surface.Below will describe at the encapsulating structure of the LED wafer of this type.
Please refer to Fig. 7, the stereogram of the encapsulation device of light emitting diode of third embodiment of the invention.
In encapsulation device of light emitting diode 200b, first contact mat (not illustrating) of LED wafer 260a for example is to be disposed at respectively on opposing second surface (not illustrating) and the first surface 262 with second contact mat 266.Second contact mat 266 for example is to see through bonding wire 270b and 220 electric connections of second lead foot, and first contact mat is to contact with radiator 230, and is electrically connected to first lead foot 210 through radiator 230 with electric conductor 250.Wherein, electric conductor 250 for example is an elargol, but not as limit.
Because encapsulation device of light emitting diode of the present invention has the electric conductor 250 that is connected between the radiator 230 and first lead foot 210, when first contact mat is positioned at first surface 262, can see through bonding wire and 210 electric connections of first lead foot, and when first contact mat is positioned at second surface, can see through radiator 230 and electric conductor 250 and 210 electric connections of first lead foot.Therefore, no matter be that ruddiness, green glow or blue light-emitting diode wafer are all applicable in the framework of the present invention.
The 4th embodiment
Please refer to Fig. 8, the profile of the encapsulation device of light emitting diode of fourth embodiment of the invention.The encapsulation device of light emitting diode 200c of present embodiment is to use the mode of chip bonding (flip chipbonding), LED wafer 260b is disposed on the subbase seat 280, sees through the subbase seat 280 and first lead foot 210 and 220 electric connections of second lead foot again.Wherein, the mode that electrically connects of the subbase seat 280 and first lead foot 210 and second lead foot 220 for example is to see through bonding wire 270a, 270b to be connected between the subbase seat 280 and first lead foot 210 and between the subbase seat 280 and second lead foot 220.LED wafer 260b is electrically connected to subbase seat 280 by projection 290.In addition, the material of subbase seat 280 for example is aluminium nitride (AlN), silicon (silicon).
In sum, encapsulation device of light emitting diode of the present invention has following advantage at least:
1. the present invention has an electric conductor and is connected between first lead foot and the radiator, when first contact mat of LED wafer is positioned on its second surface, can directly sees through radiator and electric conductor and is electrically connected to first lead foot.Therefore, no matter be that ruddiness, green glow or blue light-emitting diode wafer are all applicable in the framework of the present invention.
Therefore 2. because radiator can directly dispel the heat to LED wafer, can prevent effectively that LED wafer from damaging because of overheated.
Though the present invention discloses as above with preferred embodiment, yet it is not in order to limit the present invention.
[main element symbol description]
100,200,200a, 200b, 200c: encapsulation device of light emitting diode
102: foot rest
102a, 102b: lead foot
120c: crystal chip bearing seat
104: packing colloid
106,260,260a, 260b: LED wafer
106a, 106b: contact pad
108a, 108b, 270a, 270b: bonding wire
210: the first lead foots
220: the second lead foots
230: radiator
232: the surface
240: housing
242: upper surface
242a: slot
242b: location notch
244: lower surface
246: groove
250: electric conductor
262: first surface
264: the first contact mats
266: the second contact mats
275: lens
275a: fitting portion
275b: positioning convex
280: the subbase seat
290: projection.
Claims (10)
1. encapsulation device of light emitting diode is characterized in that: comprising:
One first lead foot;
One second lead foot;
One radiator is disposed between this first lead foot and this second lead foot;
One housing coats this radiator and this first lead foot of part and this second lead foot, and wherein this housing has a upper surface, exposes this radiator and this first lead foot and this second lead foot;
One electric conductor is connected between this first lead foot and this radiator; And
One LED wafer has a relative first surface and a second surface, and wherein this second surface is to be disposed on this radiator, and this LED wafer is to electrically connect with this first lead foot and this second lead foot.
2. encapsulation device of light emitting diode as claimed in claim 1, it is characterized in that: this LED wafer has one first contact mat and one second contact mat, be disposed on this first surface of this LED wafer, and this LED wafer be see through this first contact mat and this second contact mat respectively with this first lead foot and the electric connection of second lead foot, two bonding wires are to connect between this first lead foot and this first contact mat respectively and between this second lead foot and this second contact mat.
3. encapsulation device of light emitting diode as claimed in claim 1, it is characterized in that: this LED wafer has one first contact mat and one second contact mat, be disposed at respectively on this second surface and this first surface of this LED wafer, and this LED wafer is to electrically connect with this first lead foot and this second lead foot respectively through this first contact mat and this second contact mat, and a bonding wire is to be connected between this second contact mat and this second lead foot.
4. encapsulation device of light emitting diode as claimed in claim 1, it is characterized in that: also comprise a subbase seat, a plurality of projection and two bonding wires, this subbase seat is disposed between this LED wafer and this radiator, and this LED wafer is to be electrically connected to this first lead foot and this second lead foot through this subbase seat, this each projection is connected between this LED wafer and this subbase seat, and this each bonding wire is to be connected between this subbase seat and this first lead foot and between this subbase seat and this second lead foot.
5. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: this electric conductor comprises elargol.
6. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: this upper surface of this housing has a groove, exposes this radiator, and this LED wafer is on this radiator that is disposed in this groove.
7. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: this radiator comprises:
One fin; And
One thermal diffusion plate is disposed between this fin and this LED wafer.
8. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: also comprise lens, be disposed on this upper surface of this housing, and coat this LED wafer.
9. encapsulation device of light emitting diode as claimed in claim 8, it is characterized in that: this upper surface of this housing has a slot and a location notch adjacent with this slot, and having a fitting portion and, these lens are located at positioning protrusion on this fitting portion, this fitting portion is suitable for embedding in this slot, and this positioning convex is suitable for embedding in this location notch.
10. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: this housing has a lower surface relative with this upper surface, exposes a surface of this radiator, and profile that should the surface is to have a circular contour of cutting edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100070014A CN101009345A (en) | 2006-01-25 | 2006-01-25 | Encapsulation device of the LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100070014A CN101009345A (en) | 2006-01-25 | 2006-01-25 | Encapsulation device of the LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101009345A true CN101009345A (en) | 2007-08-01 |
Family
ID=38697600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100070014A Pending CN101009345A (en) | 2006-01-25 | 2006-01-25 | Encapsulation device of the LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101009345A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102255030A (en) * | 2010-12-24 | 2011-11-23 | 友达光电股份有限公司 | Light emitting module |
| CN102610738A (en) * | 2012-03-22 | 2012-07-25 | 任永斌 | High-power LED (Light Emitting Diode) lamp bead with integrated heat-radiating pad and heat-radiating substrate |
-
2006
- 2006-01-25 CN CNA2006100070014A patent/CN101009345A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102255030A (en) * | 2010-12-24 | 2011-11-23 | 友达光电股份有限公司 | Light emitting module |
| CN102255030B (en) * | 2010-12-24 | 2013-10-16 | 友达光电股份有限公司 | Light emitting module |
| CN102610738A (en) * | 2012-03-22 | 2012-07-25 | 任永斌 | High-power LED (Light Emitting Diode) lamp bead with integrated heat-radiating pad and heat-radiating substrate |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |