CN101004625A - Host device with shielded enclosure for anti electromagnetic interference - Google Patents
Host device with shielded enclosure for anti electromagnetic interference Download PDFInfo
- Publication number
- CN101004625A CN101004625A CN 200610033091 CN200610033091A CN101004625A CN 101004625 A CN101004625 A CN 101004625A CN 200610033091 CN200610033091 CN 200610033091 CN 200610033091 A CN200610033091 A CN 200610033091A CN 101004625 A CN101004625 A CN 101004625A
- Authority
- CN
- China
- Prior art keywords
- motherboard
- metallic shield
- electromagnetic interference
- guide
- host apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A host device with shielding cover in resisting electromagnetic interference is prepared for forming a metal layer at edge of surface on host board, arranging electronic element on host board, setting I/O port at an edge of host board and not contacting said I/O port with metal layer on host board, covering metal shielding cover on host board, enabling to contain said electronic element in cover body and guide-connecting guide connection plate of said metal shielding cover with metal layer on host board.
Description
Ji Intraoperative field
The present invention is relevant for a kind of host apparatus, is particularly to that a kind of have can be in case the host apparatus of the metallic shield of electromagnetic interference (EMI).
Bei Jing Ji Intraoperative
Consult Fig. 1, owing to have for example oscillator on the motherboard 8 of being pacified in the housing 9 of host apparatus commonly used at present more, central processing units etc. send the electronic component of high frequency noise easily, and numerous other circuit and elements that are subject to external interference, in order to make this element and circuit can not discharge a large amount of electromagnetic radiation easily, or ensure that this element and circuit are not subjected to the external electromagnetic wave interference, common shielding mode is that motherboard 8 is assembled on the sidewall 922 of metal framework 92 of housing 9, and metal framework 92 cooperates an external plate body (figure does not show) to fasten the back reaches isolating electromagnetic with the part that covers in metal framework 92 and expose function again.
Wherein, this metal framework 92 has a base plate 921, and by base plate 921 upwardly extending sidewalls 922 and front and back walls 923,924, base plate 921, sidewall 922 have an accommodation space 90 with front and back walls 923,924 definition, still can hold for example other computer components such as hard disk, CD-ROM drive, radiator fan, adapter and winding displacement in the accommodation space 90 except that motherboard 8.
Motherboard 8 is fixed on the sidewall 922 of metal framework 92, by being convexly equipped with some screws on the sidewall 922 and motherboard 8 is fixed in the mode that is spirally connected, in addition, motherboard 8 is provided with the metal level (figure do not show) of ground connection purposes in its part 81 that is spirally connected, and just the electromagnetic wave that the electronic component on the motherboard 8 produces can be exported to outside the metal framework 92 by metal framework 92 by the part 81 that is spirally connected thus.
As shown in Figure 2, illustrate and a metal partion (metp) 7 is set: mainly be to utilize metal partion (metp) 7 to surround electromagnetic wave to produce the source to weaken the principle of electromagnetic effect, when making electromagnetic wave produce one of source incident wave 701 through metal partion (metp) 7, because the obstruct of metal partion (metp) 7, except meeting has the reflection wave 702 at metal partion (metp), also can in the motherboard of metal partion (metp) 7, there be a multiple inner counter ejected wave 703 to produce, so allow the energy of incident wave 701 of original electromagnetic wave be absorbed and decay by metal partion (metp) 7, the a small amount of penetrated wave 704 energy reduction that leaks at last just is unlikely to cause too big harm, therefore not only can effectively suppress the internal electromagnetic leaked wave, also can while isolating exterior Electromagnetic Interference.
Yet, above-mentioned motherboard 8 is in the housing 90 of the host apparatus of for example desktop PC, still need in the housing 90 of host apparatus and hold other computer components of for example hard disk, CD-ROM drive, radiator fan, adapter and winding displacement etc., therefore assemble in the mode of external common metal framework 92, and can't be suitable for the electromagnetic wave isolation purposes of general small-sized simple and easy host apparatus.
Summary of the invention
Because in the past host apparatus housing be for numerous computer components as electromagnetic wave proof; and do not have separately for protective device is set on the motherboard; when only using motherboard; wish that again unlikely the generating electromagnetic waves of protection motherboard leak and by external electromagnetic wave interference, just need many settings to protect electromagnetic isolation facility together.
Therefore, one of the present invention purpose is promptly at the host apparatus with anti-electromagnetic interference shield that provides a kind of effectively isolating electromagnetic to disturb.
So, the present invention has the host apparatus of anti-electromagnetic interference shield, comprise a motherboard, some electronic components, at least one input/output port and a metallic shield, this motherboard has a surface, and be formed with a metal level at the edge on this surface, this electronic component is arranged on this motherboard, and this I/O port is arranged on the edge of this motherboard, and this input/output port does not contact with this metal level of this motherboard; This metallic shield covers on this motherboard, has a hollow lid and is positioned at some guide-joining plates of this lid edge of opening, can ccontaining this electronic component within this lid, and this guide-joining plate of this metallic shield connects on this metal level of this motherboard.
Description of drawings
Fig. 1 is the stereographic map of the present host apparatus of using always.
Fig. 2 is the principle schematic that metal partion (metp) can weaken electromagnetic effect.
Fig. 3 is the motherboard synoptic diagram that the present invention has.
Fig. 4 is the radome stereographic map that the present invention has.
Fig. 5 is the present invention's metallic shield and a motherboard coupling part synoptic diagram.
Fig. 6 is a side and the motherboard coupling part synoptic diagram that the present invention's metallic shield is provided with drawing piece.
Embodiment
About addressing other technology contents, characteristics and effect before the present invention, in the following detailed description that cooperates with reference to one of graphic preferred embodiment, can clearly present.
Cooperate shown in Fig. 3,4, show that respectively the present invention has a motherboard 1 and that the host apparatus 10 of shielded enclosure for anti electromagnetic interference has in order to cover the metallic shield 2 on motherboard 1, and mandatory declaration is, the motherboard 1 of this preferred embodiment can be to be applied in for example information household appliances, radio network product, industrial control field, and perhaps other need intercept or suppress the electronic product of Electromagnetic Interference.
As shown in Figure 3, motherboard 1 outward appearance generally is square, and is provided with for example electronic component 12 of CPU (central processing unit), internal memory etc. on a surface 111 of motherboard 1, and the edge is formed with metal level 13 outside the surface 111 of motherboard 1.Wherein, this metal level 13 can be divided into a first metal layer 131, one second metal level 132 and one the 3rd metal level 133, and first, second and third metal level 131,132,133 roughly is distributed on three edges of motherboard 11; Wherein, first, second metal level 131,132 is for being arranged on relative two sides, and each has another edge that a bending segment 1311,1321 extends to place, the 3rd metal level 133 place, and the 3rd metal level 133 respectively keeps a segment distance with bending segment 1311,1321.
Shown in Fig. 4,5, metallic shield 2 has a lid 21 and is arranged on some guide-joining plates 22 of lid 21 sides, lid 21 tops are formed with some through holes 23, in the lid 21 and be formed with an accommodation space 20, and the electronic component 12 that this accommodation space 20 can ccontaining motherboard 1.In the present embodiment, metallic shield 2 is provided with outside first, second guide-joining plate 221,222 in lid 21 two relative sides, at opposite side and have one the 3rd guide-joining plate 223.
To shown in Figure 5, owing to need allow this input/output port 142,143 be arranged on the motherboard 11 by outer open country, the 3rd guide-joining plate 223 offers some openings 241,242 as Fig. 3.
Shown in Fig. 4,6, in order to make isolation effect better, at metallic shield 2 with respect to the offside that this opening 241,242 is set, that is on the input/output port 141 of motherboard 1 and be connected with a metal drawing piece 134, and this drawing piece 134 is for being connected on the metallic shield 2, and having some dew hole 1341, this dew hole 1341 is set according to the distinct interface that input/output port 141 has.
Mandatory declaration be must be assembled in the action that packing is finished in the inner just calculation of plastic casing at metallic shield 2 and motherboard 1 again with the packing of a plastic casing (figure does not show) at last after above-mentioned metallic shield 2 and motherboard 1 assembling as electronic product.
Conclude above-mentioned; because the motherboard 1 of hope protection electronic product can not generate electromagnetic waves because of the element that it had and leak; perhaps disturbed by external electromagnetic wave; therefore motherboard 1 needs many settings to protect electromagnetic isolation facility together; the invention provides host apparatus 10 with the metallic shield 2 of imitating the isolating electromagnetic interference; first and second guide-joining plate 221 with metallic shield 2; 222; and the 3rd guide-joining plate 223 is first and second metal levels 131 that paste respectively at motherboard 1; on the 132 and the 3rd metal level 133; and with drawing piece 134 for being connected on the metallic shield 2, make host apparatus 10 have more tight electromagnetic wave proof effect.
Claims (7)
1. host apparatus with shielded enclosure for anti electromagnetic interference, it includes a motherboard, some electronic components and one or more input/output port, this motherboard has a surface, and be formed with a metal level at the edge on this surface, this electronic component is arranged on this motherboard, this input/output port is arranged on the edge of this motherboard, and this input/output port does not contact with this metal level of this motherboard, it is characterized in that: described host apparatus with anti-electromagnetic interference shield also includes a metallic shield, it overlays on this motherboard, some guide-joining plates that it has a hollow lid and is positioned at this lid edge of opening, can ccontaining this electronic component within this lid, and this guide-joining plate of this metallic shield connects on this metal level of this motherboard.
2. the host apparatus with shielded enclosure for anti electromagnetic interference according to claim 1, it is characterized in that: the lid top of described metallic shield more is formed with some through holes.
3. the host apparatus with shielded enclosure for anti electromagnetic interference according to claim 2, it is characterized in that: this guide-joining plate of described metallic shield is divided into one first guide-joining plate, one second guide-joining plate and one the 3rd guide-joining plate, and first, second and third guide-joining plate of this metallic shield all pastes on the metal level on this motherboard.
4. the host apparatus with shielded enclosure for anti electromagnetic interference according to claim 3, it is characterized in that: described input/output port is arranged on the different edges of this motherboard, and this metallic shield covers on the corresponding edge and offers some openings so that this input/output port to be set.
5. the host apparatus with shielded enclosure for anti electromagnetic interference according to claim 4, it is characterized in that: described metallic shield has more the drawing piece of solid this input/output port of a frame, and this drawing piece has some dew hole, and this dew hole is set according to the distinct interface that an input/output port wherein has.
6. the host apparatus with shielded enclosure for anti electromagnetic interference according to claim 1, tool is characterised in that: described metallic shield is with some element and this motherboard Joints of connecting.
7. the host apparatus with shielded enclosure for anti electromagnetic interference according to claim 6, it is characterized in that: the mode of described metallic shield and this motherboard Joint is to be provided with some screws on this guide-joining plate and this substrate, connects element by this and wears the mode of this screw with this metallic shield and this motherboard bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610033091 CN101004625A (en) | 2006-01-20 | 2006-01-20 | Host device with shielded enclosure for anti electromagnetic interference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610033091 CN101004625A (en) | 2006-01-20 | 2006-01-20 | Host device with shielded enclosure for anti electromagnetic interference |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101004625A true CN101004625A (en) | 2007-07-25 |
Family
ID=38703821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610033091 Pending CN101004625A (en) | 2006-01-20 | 2006-01-20 | Host device with shielded enclosure for anti electromagnetic interference |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101004625A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101943436A (en) * | 2010-06-07 | 2011-01-12 | 司红康 | Excess/waste heat reutilization structure of little sun heater |
| US8451622B2 (en) | 2009-11-27 | 2013-05-28 | Asustek Computer Inc. | Circuit board module |
| CN105843339A (en) * | 2016-04-08 | 2016-08-10 | 吉首大学 | Anti-radiation case |
| CN108932027A (en) * | 2017-05-26 | 2018-12-04 | 技嘉科技股份有限公司 | Connection port protection structure |
-
2006
- 2006-01-20 CN CN 200610033091 patent/CN101004625A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8451622B2 (en) | 2009-11-27 | 2013-05-28 | Asustek Computer Inc. | Circuit board module |
| CN101943436A (en) * | 2010-06-07 | 2011-01-12 | 司红康 | Excess/waste heat reutilization structure of little sun heater |
| CN101943436B (en) * | 2010-06-07 | 2013-11-13 | 安徽红叶节能电器科技有限公司 | Excess/waste heat reutilization structure of little sun heater |
| CN105843339A (en) * | 2016-04-08 | 2016-08-10 | 吉首大学 | Anti-radiation case |
| CN108932027A (en) * | 2017-05-26 | 2018-12-04 | 技嘉科技股份有限公司 | Connection port protection structure |
| CN108932027B (en) * | 2017-05-26 | 2021-11-26 | 技嘉科技股份有限公司 | Connection port protection structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7035087B2 (en) | Electronic apparatus with a housing for seeing inside | |
| US8444439B2 (en) | Connector mounting apparatus having a bracket with recesses abutting resisting tabs of a member received therein | |
| US20090086420A1 (en) | Rugged conductive housing structure for portable computing device display | |
| US7760515B2 (en) | Electronic device with EMI shielding assembly | |
| US5617296A (en) | Printed circuit board covers for an electronics package | |
| JP2019212832A (en) | Electronic apparatus | |
| US11687129B1 (en) | Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same | |
| CN101004625A (en) | Host device with shielded enclosure for anti electromagnetic interference | |
| CN111478017A (en) | Electronic device | |
| US6567276B2 (en) | Electromagnetic interference shield | |
| KR100990400B1 (en) | Printed circuit board assembly and information technology equipment | |
| US20110182022A1 (en) | Waterproof casing with multiple isolated compartments | |
| CN105955417A (en) | Cabinet | |
| JP2007207847A (en) | Electronic apparatus | |
| CN101498960A (en) | Method for manufacturing computer with good electromagnetic compatibility | |
| CN201119132Y (en) | An electronic device and its enclosure | |
| CN105338772A (en) | Front shell component and metal front shell structure of electronic equipment | |
| CN101528012A (en) | Heat radiating shell | |
| US5929377A (en) | Apparatus for preventing leakage of electromagnetic radiation from electronic enclosures | |
| US20130279127A1 (en) | Electronic device with shield for receiving digital card | |
| CN201153363Y (en) | Electromagnetic shielding device for data interface | |
| JP2018014406A (en) | Enclosure and electronic apparatus | |
| CN107300956B (en) | Noise suppression assembly and mainboard with same | |
| CN215269344U (en) | Shielding case and shielding system | |
| CN105592677B (en) | The masking structure of the anti-electromagnetic interference of electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |