CN101002304A - Method for measuring heating plate temperature, substrate processing equipment, and computer program for measuring heating plate temperature - Google Patents

Abstract

A heating plate (34) performs heat treatment to a substrate (W) by a wireless wafer (Ww) provided with a temperature detecting part (41), a storing part (42) and a controller (42). In the case of measuring the temperature of the heating plate, the temperature can be easily and highly accurately measured and deterioration of operation efficiency due to measuring operation is suppressed. A temperature measurement start instruction is outputted to the controller (42) of the wireless wafer (Ww) at a position in a wireless wafer carrier (Cw), the wireless wafer (Ws) starts temperature detection by the instruction, and time-series data of temperature detection values is stored in the storing part (42). The wireless wafer (Ww) is transferred to a heating unit along a previously determined transfer path. Based on a transfer time until the wireless wafer (Ww) is placed on the heating plate (34) and the time-series data of the temperature detection values in the storing part (42), the time-series data of the temperature detection values after the wireless wafer (Ww) is placed on the heating plate (34) is fetched.

Description

The temperature measuring computer program of the temperature-measuring method of heating plate, substrate board treatment and heating plate

Technical field

The present invention relates to the substrate board treatment of the surface of for example semiconductor wafer, photomask base plate and LCD (Liquid Crystal Display) substrate substrates such as (liquid crystal display glass substrates) being heat-treated, particularly the temperature measuring computer program of the temperature-measuring method of heating plate, substrate board treatment and heating plate by heating plate.

Background technology

In the manufacturing process of semiconductor device and LCD substrate,, substrate is carried out the formation of resist figure by being called as the technology of photoetching.In this technology, carry out following a succession of operation, promptly, to for example semiconductor wafer coating of substrates resist liquid such as (hereinafter referred to as wafers), form liquid film on the surface of wafer, use photomask that resist film is exposed, afterwards, carry out development treatment, obtain the figure of expecting thus.

Such resist figure forms to handle and typically uses the resist figure that has connected exposure device on the coating/developing apparatus of the coating of carrying out resist liquid and development and form that device carries out.

Figure 20 is a vertical view of representing an example of resist figure formation device in the past.

With reference to this figure, resist figure in the past forms device to be possessed: have conveyer unit 1A, processing unit 1B, interface unit 1C, the exposure device 1D of conveyer platform 11, described conveyer platform 11 will be taken in the conveyer C input and output of 25 wafer W.Processing unit 1B has delivery section 12 in central authorities, and has around delivery section 12: coating assembly 13A is used for wafer coating resist liquid; Liquid handling component groups, multi-layer configuration have developing device 13B etc., and described developing device 13B is used for the wafer after the exposure is carried out development treatment; Heating component is used for before and after the processing of coating assembly and developing device wafer being carried out set heat treated; Shelf assembly 14 (14A～14C), have handing-over assembly etc.In addition, processing unit 1A has handing-over arm 15, and described handing-over arm 15 is in conveyer C and carry out the handing-over of wafer W between the processing unit 1B.

Set heat treated by being set at mounting wafer W on the heating plate of both fixed temperatures, and is carried out to wafer W in for example built-in heating part of heating component.As such heating component, a plurality of kinds of carrying out following processing are arranged, and described processing comprises: be used for making the prebake of the diluent volatilization of resist composition to handle, relax oven dry after the exposure at edge of resist figure and handle and make the residual rinse liquid evaporation when developing and remove or make back oven dry processing that resist solidifies etc.

In addition, in heating component, be split at for example heating plate under the situation of a plurality of heating regions that a plurality of heaters by concentric circles independently heat, the uniformity in face in order to ensure thickness and development line width need make the heating mode unanimity of each heating region.In addition, the uniformity between heating component in order to ensure thickness and development line width need make the heating mode unanimity of the heating plate in each heating component of handling equally.Therefore,, carry out the control of heating part,, and in the heating component of handling equally, guarantee same heating mode so that can make the heating mode unanimity of heating region installing the temperature characterisitic of starting when or making regular check on the heating plate of heating component.

Figure 21 is the stereogram of the temperature measuring of expression heating plate with wafer.

In the past, the temperature characterisitic of heating plate was measured and was undertaken by following manner, that is, the wafer W that for example 40 positions in face are provided with temperature sensor is positioned on the heating plate, measures temperature every given time.Under these circumstances, as shown in the drawing, need connect temperature sensor 16 and analyzer 17 by serial cable 18, described analyzer 17 is arranged on the outside of wafer W, has the memory of preservation from the temperature data of each temperature sensor 16.

Therefore, under the situation of the temperature characterisitic of measuring heating plate, must unload the back side lid that the resist figure forms device, the wafer W mounting that is provided with temperature sensor 16 on heating plate, and is connected temperature sensor 16 and the analyzer 17 that is arranged on outside the wafer W by serial cable 18.Like this, the back side lid that the temperature characterisitic of at every turn measuring heating plate all must device for opening, inconvenient operation.In addition, if open lid and cause heat radiation, then close and wait for that the heating component temperature inside settles out behind the lid and need the time, but, form in the device in the past resist figure because each heating component all needs this operation, so sometimes the summation of stand-by period above 20 hours.

Therefore, the present inventor has studied the technology of using the wireless chip that do not need the serial cable of extending laterally from wafer W to carry out temperature measuring.So-called wireless chip is to have temperature sensor, battery, memory and controller from one's body at wafer, can temperature data be stored in wafer in the memory with for example 1 second cycle.As using such wireless chip to estimate the inhomogeneity method of heat treatment time substrate temperature, disclose the technology that the spy opens flat 11-307606 communique (patent documentation 1).

Patent documentation 1: the spy opens flat 11-307606 communique

If use wireless chip, then have equally with common wafer W can be transported to advantage on the heating component by delivery section, be input in which heating component constantly or from which heating component output but what wireless chip can not be identified in.Therefore, do not know the moment of wireless chip mounting to the heating plate, be difficult to grasp the temperature data in the accurate moment.

Given this, people of the present invention judge the moment of wireless chip mounting to the heating plate according to temperature data, for example, with rise for 5 seconds more than 10 ℃ point as wireless chip W mounting on heating plate the moment and grasp.

Here, Figure 22 A is the performance plot of an example of the heating mode of expression heating plate.Figure 22 B is the enlarged drawing of the part represented of the B by Figure 22 A.

With reference to this figure, temperature rises slowly during owing to the heating beginning, so be difficult to the accurate point that for example rises for 5 seconds more than 10 ℃ of grasping.

On the other hand, if the temperature data of inscribing when not knowing wireless chip mounting accurate to heating plate, then the setting of the heating mode of heating plate will be upset.For example heating plate by the situation of a plurality of heater heats under, can not grasp the accurate heating mode of each heating region, it is consistent and carry out the high heat treatment of inner evenness to be difficult to control the heating mode that makes in each zone.When particularly heating up beginning, after temperature rose slowly, temperature sharply rose, so if produce 1 second error in assurance constantly, then the deviation of heating mode will be very big just.

And then, if there is deviation in heating mode between each heating component, then be difficult to carry out the high heat treatment of uniformity between heating component.Opening in the flat 11-307606 communique (patent documentation 1) the spy does not have just the recognition methods in the moment of wireless chip mounting on heating plate to be put down in writing yet, so in fact the spy can not be opened the temperature measuring that the method for flat 11-307606 communique (patent documentation 1) is used for heating plate.

Summary of the invention

The present invention makes under these circumstances, its purpose is to provide a kind of temperature measuring computer program of temperature-measuring method, substrate board treatment and heating plate of heating plate, the temperature-measuring method of described heating plate can be easily and is measured the temperature of the heating plate that substrate is heat-treated accurately, can suppress by the reduction of measuring the running efficiency that operation causes.

In order to solve above-mentioned problem, the temperature-measuring method of the heating plate of one aspect of the present invention is a method of temperature of measuring heating plate with regard to substrate board treatment, and described substrate board treatment comprises: the conveyer input part, will take in the conveyer input of a plurality of substrates; Processing components is included in mounting substrate on the heating plate and the heating component of heat-treating; Delivery section accesses substrate and is transported to the processing components from the conveyer input part; Described method comprises following operation: by delivery section, will comprise that the substrate that the temperature detection of temperature detecting part, storage part and substrate controller is used is transported in the heating component along predetermined transport path; Sign on output operation on the precalculated position in transport path, is measured sign on to temperature detection with the substrate controller output temperature of substrate; Temperature detection stores the time series data of temperature detection value in the storage part into substrate reception temperature measuring sign on; Take out operation with time series data, temperature detection plays temperature detection with the time of delivery till substrate-placing is to the heating plate and the time series data of the temperature detection value in the storage part with the position of substrate when measuring sign on from output temperature, and the taking-up temperature detection is with the time series data of the temperature detection value after substrate-placing is to heating plate.

Preferably, take out in the operation, adjust with computer and take out the time series data of temperature detection with the temperature detection value after substrate-placing is to heating plate in time series data.

More preferably, the temperature-measuring method of heating plate also comprises following operation: based on the time series data of temperature detection with the temperature detection value after substrate-placing is to heating plate, the Control Parameter of the heating part that is contained in heating plate is revised.

More preferably, heating plate is divided into a plurality of heating regions, and heats each cut zone independently by a plurality of heating parts, and temperature detection is arranged on the position corresponding with the cut zone difference with the temperature detecting part that comprises in the substrate.

More preferably, heating plate is divided into a plurality of heating regions in a circumferential direction, and heat each cut zone independently by a plurality of heating parts, temperature detection is provided with a plurality of with the temperature detecting part that comprises in the substrate, so that carry out the temperature detection of each cut zone, the temperature-measuring method of heating plate also comprises following operation: based on the time series data of the temperature detection value of each cut zone, revise the Control Parameter of each heating part, the time series data of the temperature detection value of described each cut zone is that the temperature detection to heating plate the time obtains with the time series data towards with the temperature detection value of each temperature detecting part of substrate with substrate-placing according to temperature detection.

More preferably, in sign on output operation, take in temperature detection with substrate and be placed in the conveyer controller output temperature that is provided with on the conveyer of conveyer input part and measure sign on, the temperature measuring sign on by delivery section with temperature detection with substrate output when this conveyer takes out.

Preferably, the temperature-measuring method of heating plate also comprises following operation: based on the time series data of temperature detection with the temperature detection value after substrate-placing is to heating plate, the Control Parameter of the heating part that comprises in the heating plate is revised.

Preferably, heating plate is divided into a plurality of heating regions, and heats each cut zone independently by a plurality of heating parts, and temperature detection is arranged on the position corresponding with the cut zone difference with the temperature detecting part that comprises in the substrate.

Preferably, heating plate is divided into a plurality of heating regions in a circumferential direction, and heat each cut zone independently by a plurality of heating parts, temperature detection is provided with a plurality of with the temperature detecting part that comprises in the substrate, so that carry out the temperature detection of each cut zone, the temperature-measuring method of heating plate also comprises following operation: based on the time series data of the temperature detection value of each cut zone, revise the Control Parameter of each heating part, the time series data of the temperature detection value of described each cut zone is that the temperature detection to heating plate the time obtains with the time series data towards with the temperature detection value of each temperature detecting part of substrate with substrate-placing according to temperature detection.

Preferably, in sign on output operation, take in temperature detection with substrate and be placed in the conveyer controller output temperature that is provided with on the conveyer of conveyer input part and measure sign on, the temperature measuring sign on by delivery section with temperature detection with substrate output when this conveyer takes out.

In order to solve above-mentioned problem, the present invention's substrate board treatment on the other hand possesses: the conveyer input part, will take in the conveyer input of a plurality of substrates; Processing components is included in mounting substrate on the heating plate and the heating component of heat-treating; Delivery section accesses substrate and is transported to the processing components from the conveyer input part; Control part, the control delivery section is transported in the heating component along predetermined transport path so that will comprise the substrate that the temperature detection of temperature detecting part, storage part and substrate controller is used; The conveyer controller is measured sign on to temperature detection with the substrate controller output temperature of substrate on the precalculated position in transport path; Adjust and use computer, temperature detection plays temperature detection with the time of delivery till substrate-placing is to the heating plate with receive the temperature measuring sign on and store the time series data of temperature detection with the temperature detection value in the storage part that comprises the substrate into the position of substrate when measuring sign on from output temperature, and the taking-up temperature detection is with the time series data of the temperature detection value after substrate-placing is to heating plate.

Preferably, control part is also based on the time series data of temperature detection with the temperature detection value after substrate-placing is to heating plate, and the Control Parameter of the heating part that comprises in the heating plate is revised.

More preferably, heating plate is divided into a plurality of heating regions, and heats each cut zone independently by a plurality of heating parts, and temperature detection is arranged on the position corresponding with the cut zone difference with the temperature detecting part that comprises in the substrate.

More preferably, heating plate is divided into a plurality of heating regions in a circumferential direction, and heat each cut zone independently by a plurality of heating parts, temperature detection is provided with a plurality of with the temperature detecting part that comprises in the substrate, so that carry out the temperature detection of each cut zone, control part is also based on the time series data of the temperature detection value of each cut zone, revise the Control Parameter of each heating part, the time series data of the temperature detection value of described each cut zone is that the temperature detection to heating plate the time obtains with the time series data towards with the temperature detection value of each temperature detecting part of substrate with substrate-placing according to temperature detection.

More preferably, the conveyer controller is arranged on takes in temperature detection with substrate and be placed on the conveyer of conveyer input part, by delivery section temperature detection is being measured sign on substrate output temperature when this conveyer takes out.

Preferably, heating plate is divided into a plurality of heating regions, and heats each cut zone independently by a plurality of heating parts, and temperature detection is arranged on the position corresponding with the cut zone difference with the temperature detecting part that comprises in the substrate.

Preferably, heating plate is divided into a plurality of heating regions in a circumferential direction, and heat each cut zone independently by a plurality of heating parts, temperature detection is provided with a plurality of with the temperature detecting part that comprises in the substrate, so that carry out the temperature detection of each cut zone, control part is also based on the time series data of the temperature detection value of each cut zone, revise the Control Parameter of each heating part, the time series data of the temperature detection value of described each cut zone is that the temperature detection to heating plate the time obtains with the time series data towards with the temperature detection value of each temperature detecting part of substrate with substrate-placing according to temperature detection.

Preferably, the conveyer controller is arranged on takes in temperature detection with substrate and be placed on the conveyer of conveyer input part, by delivery section temperature detection is being measured sign on substrate output temperature when this conveyer takes out.

In order to solve above-mentioned problem, the temperature measuring computer program of the present invention's heating plate on the other hand, be used for measuring with regard to substrate board treatment the temperature of heating plate, described substrate board treatment comprises: the conveyer input part, will take in the conveyer input of a plurality of substrates; Processing components is included in mounting substrate on the heating plate and the heating component of heat-treating; Delivery section accesses substrate and is transported to the processing components from the conveyer input part; Described program makes computer carry out following step: by delivery section, will comprise that the substrate that the temperature detection of temperature detecting part, storage part and substrate controller is used is transported in the heating component along predetermined transport path; Sign on output step on the precalculated position in transport path, is measured sign on to temperature detection with the substrate controller output temperature of substrate; Temperature detection stores the time series data of temperature detection value in the storage part into substrate reception temperature measuring sign on; Take out step with time series data, temperature detection plays temperature detection with the time of delivery till substrate-placing is to the heating plate and the time series data of the temperature detection value in the storage part with the position of substrate when measuring sign on from output temperature, and the taking-up temperature detection is with the time series data of the temperature detection value after substrate-placing is to heating plate.

Preferably, take out in the step, adjust with computer taking-up temperature detection and use substrate by the time series data of the temperature detection value after mounting is to heating plate in time series data.

According to the present invention, use temperature detection substrate with temperature detecting part, storage part and controller, measure the temperature of heating plate, so can be easily and measure the temperature of heating plate accurately.When measuring the temperature of heating plate, when measuring sign on from output temperature temperature detection with the position of substrate play temperature detection with substrate-placing till the heating plate time of delivery and the time series data of the temperature detection value in the storage part, take out the time series data of temperature detection with the temperature detection value after substrate-placing is to heating plate, so can grasp exactly temperature detection is transported to moment on the heating plate with substrate, the time series data of temperature detection value can be taken out with high accuracy, high-precision temperature measuring can be carried out.

Description of drawings

Fig. 1 is the vertical view of the substrate board treatment (the resist figure forms device) 100 of the present invention's the 1st execution mode.

Fig. 2 is the approximate three-dimensional map of the substrate board treatment (the resist figure forms device) 100 of the present invention's the 1st execution mode.

Fig. 3 is the end view of the shelf assembly of expression substrate board treatment 100.

Fig. 4 A is the cutaway view of the heating component of expression substrate board treatment 100.

Fig. 4 B is the cutaway view of the heating component of expression substrate board treatment 100.

Fig. 5 is the vertical view of heating plate 34.

Fig. 6 is the stereogram of wireless chip Ww.

Fig. 7 is the expression wireless chip with the figure in the cross section of conveyer Cw etc.

Fig. 8 is that the figure with the structure of computer 5 is adjusted in expression.

Fig. 9 is the figure of the structure of expression control part 6.

Figure 10 is the flow chart of the substrate board treatment 100 of stipulating the present invention's the 1st execution mode sequence of movement when measuring the temperature of heating plates 34.

Figure 11 is the performance plot of the time series data of expression temperature of heating plate detected value.

Figure 12 A is the approximate three-dimensional map of an example of expression heating plate in the present invention's the 2nd execution mode.

Figure 12 B is the approximate three-dimensional map of the example of expression wireless chip Ww in the present invention's the 2nd execution mode.

Figure 13 A is the approximate three-dimensional map of an example of expression heating plate in the present invention's the 2nd execution mode.

Figure 13 B is the approximate three-dimensional map of the example of expression wireless chip Ww in the present invention's the 2nd execution mode.

Figure 14 is the vertical view of the substrate board treatment 100 of the present invention's the 2nd execution mode.

Figure 15 is the figure of the structure of expression control part 9.

Figure 16 is the figure of input angle that is used for illustrating the wireless chip Ww of input heating component.

Figure 17 is the performance plot that expression utilizes the time series data of the temperature of heating plate detected value that each temperature sensor detects.

Figure 18 is the figure of the form of the expression heater locations that writes the input angle of the wireless chip Ww that is input in each heating component and each temperature sensor.

Figure 19 is the performance plot of the time series data of each heter temperature detected value of expression.

Figure 20 is a vertical view of representing an example of resist figure formation device in the past.

Figure 21 is the stereogram of the temperature measuring of expression heating plate with wafer,

Figure 22 A is the performance plot of an example of the heating mode of expression heating plate.

Figure 22 B is the enlarged drawing of the part represented with B in Figure 22 A.

Description of reference numerals

W semiconductor wafer (substrate), Ww wireless chip (substrate), C conveyer, Cw conveyer (wireless chip conveyer), B1 conveyer input part, B2 processing unit, the B3 interface portion, B4 exposure device, A1 join arm (the 1st delivery section), A2, A3 main conveyor structure (the 1st delivery section), A4 master's delivery section (the 2nd delivery section), A5 assists delivery section (the 2nd delivery section), 34 heating plates, 33 coldplates, 41 temperature detecting parts, the controller of 42 wireless chip Ww, the 45 wireless chips controller of conveyer Cw, 5 adjustment computers, 502 temperature data obtaining sections, 503 total data operational parts, 504 deviation operational parts, 6,9 control parts, 604 Control Parameter correction portions, H1, H2, H3 heater (heating part), U1, U2, the U3 processing components, 100 resist figures form device (substrate board treatment).

Embodiment

Below, with reference to accompanying drawing embodiments of the present invention are described.In addition, to part mark same reference numerals identical or suitable among the figure, and do not repeat its explanation.

＜the 1 execution mode 〉

Fig. 1 is the vertical view of the substrate board treatment (the resist figure forms device) 100 of the present invention's the 1st execution mode.

Fig. 2 is the approximate three-dimensional map of the substrate board treatment (the resist figure forms device) 100 of the present invention's the 1st execution mode.

Substrate board treatment 100 is the structures that are connected with exposure device on coating/developing apparatus.Conveyer input part B1 with the airtight conveyer C that for example to take in 13 substrates be wafer W and the wireless chip of taking in wireless wafer W w with conveyer Cw input and output.Conveyer input part B1 has: mounting table 20, but a plurality of conveyer C of mounting and wireless chip conveyer Cw; Switching portion 21 sees on the wall that is arranged on the place ahead from this conveyer 20; Handing-over arm A1 is used for taking out wafer W via switching portion 21 from conveyer C, or takes out wireless chip Ww from wireless chip conveyer Cw.

Inboard at conveyer input part B1, be connected with the handling part B2 that is surrounded by framework 22 on every side, in this handling part B2, alternately be disposed with shelf assembly U1, U2, U3 and main conveyor structure A2, A3 successively from side direction inboard nearby, described shelf assembly U1, U2, U3 will heat the assembly multiple stratification of cooling class, be provided with three, described main conveyor structure A2, A3 carry out the handing-over of wafer W between other processing components described later.Promptly, before and after observing shelf assembly U1, U2, U3 and main conveyor structure A2, A3, conveyer input part B1 side is arranged in row, be formed with not shown wafer transport peristome at separately connecting portion, wafer W can be free to travel to another distolateral shelf assembly U3 from a distolateral shelf assembly U1 in handling part B2.

In addition, main conveyor structure A2, A3 are placed in the space that is surrounded by interval wall 23, and described interval wall 23 comprises: observe shelf assembly U1, the U2 that is configured on the fore-and-aft direction, a face, right side liquid handling assembly U4, a face of U5 side and the back side portion of the one side on the left of the formation of U3 side from conveyer input part B1.

Main conveyor structure A2, A3 advance and retreat and lifting are rotated freely freely and around vertical axle, can be at each inter-module transfer wafers W of shelf assembly U1, U2, U3 and liquid handling assembly U4, U5.The driving of main conveyor structure A2, A3 is based on from the instruction of aftermentioned control part 6 and by controller drives. Humiture adjusting part 24,25 has the temperature-adjusting device of managing the treatment fluid that uses in the assembly throughout and humiture and regulates with pipeline etc.

The structure of liquid handling assembly U4, U5 is, on the incorporating section 26 in the space that is configured for supplying with the soups such as soup, resist liquid and developer solution that antireflection film uses, with the coating assembly (BARC) of for example antireflection film, the coating assembly (COT) and the stacked multilayer of developing device (DEV) of resist, for example 5 layers.In addition, the coating assembly for word is simplified with antireflection film is called the antireflection film assembly, and the coating assembly of resist is called coating assembly.

Fig. 3 is the end view of the shelf assembly in the expression substrate board treatment 100.

With reference to this figure, the structure of shelf assembly U1, U2, U3 is, will be used to carry out the pre-treatment of the processing undertaken by liquid handling assembly U4, U5 and the stacked multilayer of various processing components of reprocessing.Various processing components being used for carrying out above-mentioned pre-treatment and reprocessing comprise: handing-over assembly (TRS), be used for wafer W is adjusted into both temperature adjustment components of fixed temperature (CPL), be used for before coating resist liquid, carrying out the heating component (BAKE) of the heat treated of wafer W, be used for behind coating resist liquid, carrying out the heating component (PAB) that is called as prebake assembly etc. of the heat treated of wafer W, wafer W after the exposure is carried out the heating component (PEB) that is called as exposure back oven dry assembly etc. of heat treated, and the wafer W after the development treatment is carried out the heating component (POST) that being called as back oven dry assembly etc. etc. of heat treated.The figure shows an example of the layout of these assemblies, this layout is the consideration of aspect for convenience, in the device of reality, consider each assembly decision assemblies such as processing time number is set.

The inboard of shelf assembly U3 in processing unit B2 is connected with exposure device B4 via interface portion B3.Interface portion B3 is made of the 1st conveying chamber 27 and the 2nd conveying chamber 28, be respectively arranged with the main delivery section A4 and the auxiliary delivery section A5 that constitute the 2nd delivery section in each chamber, described the 1st conveying chamber 27 and the 2nd conveying chamber 28 front and back between handling part B2 and exposure device B4 are provided with.

In substrate board treatment 100, heating component, handing-over assembly, temperature adjustment component, coating assembly, antireflection film formation assembly and developing device are equivalent to processing components.In addition, handing-over arm A1 and main conveyor structure A2, A3 are equivalent to the 1st delivery section in the embodiment of the present invention.That is, the 1st delivery section accesses wafer W and wireless chip Ww and carries to processing components from conveyer B1.

Here, one example of the transport path of wafer W when if expression forms the resist figure with substrate board treatment 100 on the goods wafer W, then before the processing of mounting in the conveyer C of conveyer input part B1 wafer W joined arm A1 be transported to the handing-over assembly (TRS), then wafer W is applied resist liquid here by main conveyor structure A2, the A3 batch transportation with temperature adjustment component (CPL) → antireflection film formation assembly (BARC) → heating component (BAKE) → temperature adjustment component (CPL) → coating assembly (COT).Then, wafer W is admitted to exposure device B4 via heating component (PAB) → temperature adjustment component (CPL) → handing-over assembly (TRS) → interface portion B3, carries out set exposure-processed.

Wafer W after the exposure-processed turns back among the handling part B2 with opposite path.Promptly, wafer W after the exposure-processed is transported to heating component (PEB) → temperature adjustment component (CPL) → developing device (DEL), carry out development treatment here, then, with the batch transportation of the handing-over assembly (TRS) of heating component (POST) → temperature adjustment component (CPL) → shelf assembly U1, A1 turns back among the conveyer C of conveyer input part B1 by the handing-over arm.

Then, as an example of heating component, PAB handles and the simple structure of the heating component that PEB handles describes to carrying out.Fig. 4 A and Fig. 4 B are the cutaway views of the heating component in the expression substrate board treatment 100.

With reference to this figure, heating component comprises: framework 31, platform 32, can be on platform the input/ output port 35,36 of the coldplate with slit 30 33 of move left and right, heating plate 34, wafer W in the directional diagram, open and close the valve 37,38 of input/ output port 35,36 and respectively respectively by three lifter pin 39a, 39b that constitute 1 group.

For the heating component that is arranged at shelf assembly U2 (PAB), can visit in the framework 31 from main conveyor structure A2, A3, and for the heating component that is arranged at shelf assembly U3 (PEB), then can be in main conveyor structure A3, main delivery section A4 visit framework 31.

That is, in this heating component (PAB, PEB), after main conveyor structure A2 (main delivery section A4) entered via input/output port 35 (36), the wafer W on the main conveyor structure A2 (main delivery section A4) was handed off on the coldplate 33 via lifter pin 39a.Then, by the lifting that reaches lifter pin 39b of moving of coldplate 33, between coldplate 33 and heating plate 34, carry out the handing-over of wafer W.Then, the wafer W of having been carried out heat treated by heating plate 34 is handed off to coldplate 33 once more from heating plate 34, and after here slightly cooling off, A3 connects away by the main conveyor structure, carries to subsequent processing.

Fig. 5 is the vertical view of heating plate 34.

With reference to this figure, heating plate 34 has in inside and is used for heating plate 34 is heated to both heating parts of fixed temperature.The heating part comprises the heater H that is made of the resistive heater of for example three concentric circles (ring-type) (H1～H3).Thus, heating plate 34 is so that (H1～H3) is divided into the state of three heating regions (zone), is heated independently, and temperature control is carried out in three zones respectively by each heater H on diametric(al).

In addition, dry in the heating component handle or the back oven dry handle (POST) though heating component not shown, for example have the mounting wafer W and to wafer W with both heating plates 34 of fixed temperature enforcement heat treated.And then, temperature adjustment component (CPL) though not shown, have mounting wafer W for example and the wafer of having implemented each heat treated implemented the temperature control panel that adjustment is handled with set temperature.

Fig. 6 is the stereogram of wireless chip Ww.

With reference to this figure, wireless chip Ww possesses temperature sensor 41 that constitutes temperature detecting part and the controller (substrate controller) 42 that is provided with battery and storage part in inside at wafer from one's body.Each temperature sensor 41 for example is connected on the controller 42 by cable 43 respectively.Each temperature sensor 41 for example is separately positioned on the position corresponding with three heating regions of heating plate 34.

And, wireless chip Ww for example as described later, can be by detecting sign on to controller 42 output temperatures, and by temperature sensor 41 with both fixed cycles 1 second cycle detection temperature data for example, and the time series data of the temperature detection value that will obtain like this stores in the storage part.

Fig. 7 is the expression wireless chip with the figure in the cross section of conveyer Cw etc.

With reference to this figure, wireless chip has with conveyer Cw: controller (conveyer controller) 45, can be with controller 42 receiving and transmitting signals of wireless mode and wireless chip Ww, sign on is measured in 41 outputs to temperature detecting part, and, the time series data of reading the temperature detection value in the storage part that is stored in controller 42; With maintaining part 44, keep wireless chip Ww.Controller 45 can be in wireless or wired mode, and is arranged on wireless chip and carries out the transmitting-receiving of data with the adjustment of conveyer Cw outside with computer 5.

Fig. 8 is that the figure with the structure of computer 5 is adjusted in expression.Adjust with computer 5 in fact by formations such as CPU (central processing unit), program and memories, but here a part of modularization of inscape is described.

With reference to this figure, adjustment has with computer 5: bus 500, and with the temperature data storage part 501 that is connected with bus 500, temperature data obtaining section 502, total data operational part 503, deviation operational part 504, data display part 505, data transmit-receive portion 506.

The time series data of the temperature detection value that temperature data storage part 501 storage is measured by wireless chip Ww and sent via controller 45.The time series data of the temperature detection value that temperature data obtaining section 502 is measured according to wireless chip Ww and by the conveying historical record of the wireless chip Ww of aftermentioned control part 6 management, the time series data (hereinafter referred to as " temperature data of heating plate ") of taking out the temperature detection value of wireless chip Ww mounting after to heating plate 34 at each heating component.Total data operational part 503 is based on the temperature data of heating plate 34, the temperature information of calculating heating plate 34 is a total data, the interior temperature difference of for example mean value (hereinafter referred to as " mean value ") of the interior temperature of the face of heating plate 34 in the given time band, and the face of heating plate 34, each the regional temperature difference (hereinafter referred to as " mobility scale ") that for example heats by heater H 1～H3.

Deviation operational part 504 based on temperature difference result relatively in the mean value of temperature in the face of heating plate and mobility scale and target temperature range and the target face, is calculated deviate.Here, deviate is following obtaining, and, carries out the combination of temperature objectives value that is, makes mean value and mobility scale based on temperature in the face of the heating plate of each regional temperature detection value, is in the target temperature range and in the target face in the temperature difference.

Data display part 505 for example is shown to temperature data, total data and the deviate of the heating plate 34 obtained and adjusts with on the operation screen of computer 5.In addition, data transmit-receive portion 506 and control part described later 6 between carry out both transmitting-receivings of given data.

And then, substrate board treatment 100 has control part 6, and described control part 6 is controlled heating component (BAKE, PAB, PEB, POST), coating assembly (COT), developing device (DEV) and temperature adjustment component (CPL) at least and waited other each processing components and handing-over arm A1 and main conveyor structure A2, A3 and the 2nd delivery section conveying systems such as (A4, A5) etc.

Fig. 9 is the figure of the structure of expression control part 6.In fact control part 6 is made of CPU, program and memory etc., but here a part of modularization of inscape is described.

With reference to this figure, control part 6 has: bus 600 and the scheme storage part 601 that is connected with bus 600, Scheme Choice portion 602, scheme generating unit 603, Control Parameter correction portion 604, data display part 605, data transmit-receive portion 606.In scheme storage part 601, store multiple scheme, for example, the temperature measuring scheme of in the temperature measuring pattern of the temperature measuring of carrying out heating plate 34, using, and in the goods wafer W being carried out the tupe that the resist figure form to handle the processing scheme etc. of treatment conditions that use, that record transport path and each processing components etc.

The temperature measuring scheme is selected in when starting device or when regularly carrying out the temperature measuring of heating plate 34, is only to be used for carrying wireless chip Ww and carrying out common heat treatment process, and measure the scheme of heating plate 34 temperature of this moment at each heating component to heating component.

For example, in the temperature measuring scheme, record the incident and the moment.Specifically, according to set time shaft record the sequence of batching products of heating component, data such as the heat treatment period of being undertaken by heating component and time of delivery.Thus, according to predetermined transport path and preset time, wireless chip Ww is joined arm A1 and main conveyor structure A2, A3 and is transported in the heating component.

The scheme that the Scheme Choice of Scheme Choice portion 602 from be stored in scheme storage part 601 is suitable.In more detail, the operator uses not shown operating portion (operation screen) to select suitably scheme such as temperature measuring scheme and processing scheme, thus, and the scheme that the Scheme Choice of Scheme Choice portion 602 from be stored in scheme storage part 601 is suitable.Like this, changeable temperature measuring pattern and tupe.In addition, the operator also can use operating portion to import for example the processing number of wafer and the kind of resist etc.Scheme generating unit 603 generates new temperature measuring scheme, processing scheme and transportation scheme etc. based on operations of operators.

Control Parameter correction portion 604 is based on the deviate that sends with computer 5 from adjustment, carry out the correction of the Control Parameter of the heater H 1～H3 in the heating plate 34, so that the heating plate 34 of each heating component falls in the set specification, and revised Control Parameter is outputed in the controller 61 of each heating component.Here, in heating component 34, with PID (proportion integration differentiation) control and fixing control (MV (controlled value, Manipulated Value) control) temperature control is carried out in combination, described PID control is based on the deviation between temperature detection value and the temperature objectives value, computing and output and the corresponding signal of supplying with to heater H 1～H3 of electric power amount, described fixedly control are used timer to carry out electric power with fixing output mode to heater H 1～H3 and are supplied with.Therefore, Control Parameter correction portion 604 is adjusted the input pattern of PID control and MV control based on from adjusting the deviate of sending with computer 5 with set algorithm.

Data display part 605 is shown to temperature data, total data and the deviate etc. of the heating plate 34 that generates for example on the operation screen as the computer of control part 6.Data transmit-receive portion 606 carries out both transmitting-receivings of given data with adjustment with computer 5.Thus, control part 6 is as stating, can wireless or wired mode carry out the transmitting-receiving of data with the adjustment of conveyer Cw with computer 5 with the wireless chip that is arranged on the device outside, can and adjust with between the computer 5 signal that the temperature measuring of transmitting/receiving wireless wafer W w begins and finishes and deviate etc.

And then, control part 6 via each controller 61～63 and various heating components (PAB, PEB, POST, BAKE), heating component (PAB, PEB, POST, BAKE) in addition be arranged at various processing components such as coating assembly (COT), developing device (DEV) and temperature adjustment component (CPL) in shelf assembly U1～U5 among the handling part B2 and handing-over arm A1, main conveyor structure A2, A3 and conveying systems such as the 2nd delivery section A4, A5 are connected.The action of each processing components etc. is based on the instruction of control part 6 and controlled device 61～63 controls.

Then, be example with the situation of the temperature of the heating plate 34 of measuring heating component (PAB), the action of the substrate board treatment of the present invention's the 1st execution mode is described.

Figure 10 is the flow chart of the substrate board treatment 100 of stipulating the present invention's the 1st execution mode sequence of movement when measuring the temperature of heating plates 34.Adjust with computer 5, control part 6, wireless chip with conveyer Cw, wireless chip Ww never the program of reading each step such as illustrated memory with flow chart also carried out.This program can be loaded from the outside.

With reference to this figure, at first, the operator selects the temperature measuring scheme (step S1) of heating component.After selecting this scheme, for example the summary and the temperature measuring of displays temperature mensuration scheme begin switch on the operation screen of control part 6.Then, if the operator presses this switch, then control part 6 is measured commencing signal (step S2) to wireless chip with controller 45 output temperatures of conveyer Cw via adjusting with computer 5.Then, slave controller 45 is measured sign on to controller 42 output temperatures of wireless chip Ww.Controller 42 receives the temperature measuring commencing signals, with both fixed cycles for example 1 second cycle make temperature sensor 41 beginning temperature measurings, store the time series data of the temperature detection value measured in the storage part (step S3).

In this embodiment, owing to operation from sign on to controller 42 output temperatures of wireless chip Ww that measure is carried out with the inside of conveyer Cw at wireless chip,, the precalculated position on the predetermined transport path uses the interior position of conveyer Cw so being equivalent to wireless chip.

On the other hand, in substrate board treatment 100, based on the temperature measuring commencing signal, A1 takes out from wireless chip wireless chip Ww with conveyer Cw by the handing-over arm, according to the predetermined transport path and the scheduled time, be transported to heating component (being to carry out the 1st heating component that PAB handles in this example) (step S4) as the determination object of temperature data.

Then, in the 1st heating component, as stating, wireless chip Ww is positioned on the heating plate 34, the moment sensor that descends at lifter pin 39b and begin heat treatment.Then, after having carried out given time heat treatment, wafer W w is handed off on the coldplate 33 and begins to cool down processing,, wireless chip Ww is exported from the 1st heating component through behind the given time.Here, be to determine by the moment that is handed off on the coldplate 33 by the sensor wafer W zero hour of cooling processing.

Then, the wafer W w that exports from the 1st heating component is transported to the 2nd heating component that then carries out temperature measuring by main conveyor structure A2, A3, similarly utilizes wireless chip Ww to carry out temperature measuring (step S5) with the 1st heating component.Next, wireless chip Ww is transported to the 3rd heating component that then carries out temperature measuring, similarly carries out temperature measuring (step S6).

Like this, according to predetermined transport path and the time, wireless chip Ww is transported in all heating components as the determination object of temperature data, carry out the mensuration of temperature data, then, by main conveyor structure A2, A3 and handing-over arm A1, send wireless chip Ww back to wireless chip conveyer Cw.Like this, in the time of for example in wireless chip Ww turns back to wireless chip usefulness conveyer Cw, to measure END instruction via adjusting the controller 42 that is transported to wireless chip Ww with computer 5 and controller 45, the mensuration (step S7, S8) of wireless chip Ww end temp data by control part 6.Then, in wireless chip Ww, for example carry out the charging of battery.

Then, adjust the time series data that will be collected in the temperature detection value in the storage part of wireless chip Ww via controller 45 and read with computer 5, and with this storage (step S9) in temperature data storage part 501.On the other hand, in control part 6, will carry historical record to output to and adjust with in the computer 5, described conveying historical record comprises by data transmit-receive portion 606 and is documented in the temperature measuring scheme, predetermined transport path and time (step S10).Then, adjust temperature data obtaining section 502 with computer 5, when measuring sign on from output temperature the position of wireless chip Ww play wireless chip Ww mounting till the heating plate 34 time of delivery and via the time series data of the temperature detection value of storage portion stores temperature data storage part 501 of wireless chip Ww, take out the time series data (step S11) of the temperature detection value of wireless chip Ww mounting after to the heating plate 34.

Figure 11 is the performance plot of time series data of the temperature detection value of expression heating plate.

With reference to this figure, in the time series data of the temperature detection value of heating plate, the temperature data and the expression that include heating plate 34 are carried constantly and the conveying historical record of incident.

Then, based on the temperature data of heating plate 34, total data operational part 503 is calculated total data, that is, and and the mean value and the mobility scale (step S12) of temperature in the face of heating plate.Then, the interior temperature difference of the mean value of temperature and mobility scale and target temperature range and target face compares (step S13) in the face of 504 pairs of heating plates of deviation operational part, if the mean value of temperature and mobility scale then finish the temperature measuring scheme of heating component in the face of heating plate in specification.Here, be meant the mean value of temperature in the face of heating plate and mobility scale in the so-called specification in target temperature range and in the target face in the temperature difference, target temperature range for example is in target temperature ± 0.1 ℃, and temperature difference is in 0.2 ℃ in the target face.

On the other hand, if the mean value of temperature and mobility scale are outside specification in the face of heating plate, then deviation operational part 504 is calculated deviate, and the deviate of calculating is outputed to (step S14) in the control part 6.Then, in control part 6, Control Parameter correction portion 604 is carried out the correction of the Control Parameter of the heater H 1～H3 in the heating component based on deviate, and the correction value of Control Parameter is outputed in the controller 61 of heating component.Then, heating component carries out later processing (step S15) with revised Control Parameter.

Then, control part 6 selection schemes, so that begin the temperature measuring of revised heating component (PAB) once more, output temperature is measured sign on and is carried out the temperature measuring scheme.Like this, control part 6, automatically utilize the obtaining of temperature data of temperature detection that wireless chip Ww implements, heating plate 34, the computing of total data, the computing of deviate repeatedly, in based on the face of the heating plate of temperature detection value the temperature-averaging value and mobility scale becomes in the target temperature range and target face in the temperature difference.Here, for example the temperature measuring conceptual design is become, after the 2nd time, wireless chip Ww only is transported in the corrected heating component.

Like this, in the substrate board treatment of the present invention's the 1st execution mode, measure the temperature of heating plate 34 by wireless chip Ww with temperature detecting part 41, storage part, controller 42, measure the temperature of heating plate 34, so can by handing-over arm A1 and main conveyor structure A2, A3 with wireless chip Ww automatic transport in the heating component of the determination object that becomes temperature data, and become the mensuration of the temperature characterisitic of the heating plate 34 in the heating component of determination object of temperature data.Therefore, with use by serial cable with temperature sensor, be arranged on and measure the situation of measuring the temperature characterisitic of heating plate 34 with wafer with the mensuration of the analyzer connecting-type in the outside of wafer and compare, be easier to the mounting of wafer on heating plate owing to measure, so it is easy to measure with the processing of wafer, and, do not need to wait for that the heating component temperature inside stablizes the required time, so can suppress by the reduction of measuring the operating efficiency that operation causes.

At this moment, in substrate board treatment 100, according to predetermined transport path, Ww is transported in the heating component with wireless chip by control part 6, so can be according to constantly grasping the position of wireless chip Ww in substrate board treatment 100 exactly.Therefore, can discern moment on the heating plate 34 that wireless chip Ww is positioned in set heating component and wireless chip Ww is handed off to moment on the coldplate exactly from heating plate 34.

On the other hand, at wireless chip Ww on the precalculated position on the predetermined transport path, be in this embodiment on the position of mounting in the wireless chip usefulness conveyer Cw of conveyer input part B1, controller 42 output temperatures of wireless chip Ww are measured sign on, thus can grasp exactly wireless chip Ww from wireless chip with the time of delivery till on the heating plate 34 of the heating component of position in the conveyer Cw to mounting to determination object.

Therefore, after the temperature measuring that utilizes wireless chip Ww to carry out finishes, according to the time of delivery of the wireless chip Ww that grasps be stored in the time series data of the temperature detection value in the storage part of wireless chip Ww, grasp in the heating component wireless chip Ww mounting moment on heating plate 34 and the mensuration temperature of the wireless chip Ww during wireless chip Ww moment of being handed off to coldplate etc. exactly, can be easily and the time series data of taking out the temperature detection value of mounting after to heating plate 34 accurately.

At this moment, the time temperature data inscribed that can the action of specific each heating component in processing, for example by the decline of lifter pin with wireless chip Ww mounting to the heating plate 34 the moment and wireless chip Ww to the time temperature data inscribed of coldplate mounting, so can be based on the time series data of temperature detection value, the temperature data of grasping the period of respectively moving can be analyzed more accurately exactly.

And then, owing to can obtain the time series data of the temperature detection value accurately of heating plate 34, begin temperature data till the fixed time and the temperature data that each is regional so can obtain from processing, can grasp the mean value and the mobility scale of temperature in the face of heating plate exactly with high accuracy.Therefore, can carry out high-precision deviate computing, and, by carry out the Control Parameter correction of heating plate 34 based on the deviate of calculating, can in each heating plate 34, adjust so that each regional heating mode unanimity.Thus, Temperature Distribution unanimity in the face when heated up in each zone, thus can carry out the higher heat treatment of inner evenness.

And then, because each heating plate 34 is made temperature curve accurately, so can compare the temperature data between the heating component that carries out same processes and the membranous data such as line width and thickness of for example developing simply.And, can carry out the Control Parameter correction of the controller 61 of each heating component, so that the result obtains set membranous film based on the comparison, thus, can improve the heat treated uniformity of each heating component.

In addition, owing to can obtain the time series data of the temperature detection value accurately of each heating plate 34, so even the temperature measuring of wireless chip Ww was carried out with 1 second cycle, also can between its measuring interval, carry out interpolation by common interpolating method, and make and for example can calculate accurately integrated value (area) etc., thereby can obtain the higher secondary operations data of precision.

In addition, the substrate board treatment of the 1st execution mode according to the present invention, in above-mentioned heating component (PAB, PEB), with wireless chip mounting given time on heating plate 34, then, with wireless chip Ww mounting given time on coldplate, up to reach stable temperature, for example till 24 ℃, with it as the 1st temperature measuring data.Then, with wireless chip Ww mounting given time on heating plate 34 once more, then, with wireless chip Ww mounting given time on coldplate, till reaching stable temperature, with it as the 2nd temperature measuring data.By repeatedly carrying out such action repeatedly, can repeatedly obtain the temperature data of heating plate 34, from this repeatedly data calculate total data and deviate respectively, and set their mean value.In this case, only by wireless chip Ww is transported to as in the heating component of determination object once, just can repeatedly measure the temperature of heating plate.

And then in the substrate board treatment of the present invention's the 1st execution mode, control part 6 also can carry out the time series data of the temperature detection value of heating plate 34, the computing of total data and the computing of deviate.In this case, adjust and to carry out following actions with computer 5, that is, the mensuration of sending based on control part 6 begins and measures END instruction, begins and END instruction to controller 45 output temperatures mensuration; And the time series data of the temperature detection value that will read from the storage part of wireless chip Ww sends to control part 6 etc.In addition, adjustment also can be carried out the Control Parameter correction of the controller 61 of heating component based on deviate with computer 5.

In addition, in the substrate board treatment of the present invention's the 1st execution mode, the heat treatment that wafer is carried out comprises the heat treatment under the negative temperature of heat treatment under the positive temperature of heated chip and cooling wafer.Thus, the substrate board treatment of the present invention's the 1st execution mode also can be used for measuring the situation of following temperature characterisitic, and the oven dry of described temperature characterisitic fingering row is handled and the temperature characterisitic of the heating plate that heating component comprised 34 that the back oven dry is handled and the temperature characterisitic of wafer being implemented the temperature control panel of the temperature adjustment component that adjustment handles with both fixed temperatures.

In addition, in the substrate board treatment of the present invention's the 1st execution mode, also can when using conveyer Cw to take out substrate, measure sign on to controller 42 output temperatures of wireless chip Ww from the controller 45 of conveyer Cw from wireless chip.In addition, also can be when substrate turns back to wireless chip and confirms existing of wireless chip Ww with conveyer Cw and wireless chip with the controller 45 of conveyer Cw, END instructions are measured in controller 42 output to wireless chip Ww, and in wireless chip Ww the mensuration of end temp data.

In addition, in the substrate board treatment of the present invention's the 1st execution mode, in the transport path controller 42 output temperatures of wireless chip Ww are measured the precalculated position of sign on, for utilizing wireless chip Ww to carry out the starting point of temperature detection, and be the starting point of wireless chip Ww to the time that heating plate 34 is carried.But, be not limited to such scheme, output temperature is measured the precalculated position of sign on, so long as before wireless chip Ww is transported to heating plate 34, can measure the position of sign on to controller 42 output temperatures, the wireless chip of then also not being mounting in the conveyer input part B1 for example also can be arranged on the position in the buffer pocket in conveyer input part B1 or the handling part B2 with the position in the conveyer Cw.

In addition, in the substrate board treatment of the present invention's the 1st execution mode, wireless chip Ww turns back to wireless chip with in the conveyer Cw time after the mensuration of all heating components as the temperature data determination object being carried out temperature data, the instruction that utilizes control part 6 to measure to finish is exported to the controller 42 of wireless chip Ww via adjusting with computer 5 and controller 45.But, be not limited to such scheme, also can be designed to, transport path before wireless chip Ww turns back in the wireless chip usefulness conveyer Cw after the mensuration of all heating components as the temperature data determination object being carried out temperature data midway, utilize control part 6 directly the instruction that finishes to be measured in controller 42 outputs of wireless chip Ww, and the temperature data that finishes to utilize wireless chip Ww to carry out is measured.

Even in this case, wireless chip Ww is transported to heating component along predetermined transport path, precalculated position on predetermined transport path, controller 42 delivery temperatures to wireless chip Ww are measured sign on, so can be when measuring sign on from output temperature the position of wireless chip Ww play wireless chip Ww mounting till the heating plate 34 time of delivery and be kept at the time series data of the temperature detection value the storage part of wireless chip Ww, take out the time series data of the temperature detection value of wireless chip Ww mounting after to heating plate 34.

Then, use accompanying drawing that other execution modes of the present invention are described.In addition, identical among the figure or considerable part are marked same reference numerals and do not repeat its explanation.

＜the 2 execution mode 〉

Present embodiment relates to adjusting so that the substrate board treatment that change has been carried out in the action of the regional heating mode unanimity of each in each heating plate.Structure except that the content of following explanation and action are the same with the substrate board treatment of the 1st execution mode.

For example as shown in Figure 5, disposing to concentric circles a plurality of heaters on the heating plate 34 for example under the situation of three heater H 1～H3, can be in the cut zone (zone) by grasping the heating region of being shared at each heater H 1～H3 in advance, which zone and which temperature sensor correspondence is adjusted temperature in the face of heating plate 34.Specifically, if the zone that will be respectively adds thermal control by heater H 1～H3 is made as zone 1～3, then can grasp the mean value of the temperature detection value in each zone 1～3, therefore, also know mean value poor (mobility scale) each other of the temperature detection value in each zone 1～3, so can adjust the electric power quantity delivered of each heater H 1～H3 based on mean value and mobility scale.

Figure 12 A is the approximate three-dimensional map of an example of expression heating plate in the present invention's the 2nd execution mode.Figure 12 B is the approximate three-dimensional map of the example of expression wireless chip Ww in the present invention's the 2nd execution mode.

With reference to this figure A and this figure B, also cut apart under the situation of setting in a circumferential direction in the heater H that is arranged at heating plate 34 inside, in order to obtain each temperature sensor 41 and to add the correspondence in the zone of thermal control by each heater H, need to consider when wireless chip Ww is positioned on the heating plate 34 towards.

Under these circumstances, how to hold each regional temperature data for easy understanding, the situation to further simplification describes below.

Figure 13 A is the approximate three-dimensional map of an example of expression heating plate in the present invention's the 2nd execution mode.Figure 13 B is the approximate three-dimensional map of the example of expression wireless chip Ww in the present invention's the 2nd execution mode.

With reference to Figure 13 A and Figure 13 B, be divided in a circumferential direction in the heating plate 34 two parts heater H 10, H11 accordingly, in wireless chip Ww side two temperature sensors 70,71 are set.

Shown in Figure 13 B, on the part of the periphery of wireless chip Ww, being formed with the V-shape breach that is used for the presentation surface orientation is recess 80.The 1st temperature sensor 70 and the 2nd temperature sensor 71 clip temperature controller 42 and are arranged to the diagonal angle wire.

Figure 14 is the vertical view of the substrate board treatment 100 of the present invention's the 2nd execution mode.

The substrate board treatment 100 of the present invention's the 2nd execution mode with respect to the substrate board treatment 100 of the present invention's the 1st execution mode, replace to be adjusted with computer 5 and control part 6 and is had control part 9.

Figure 15 is the figure of the structure of expression control part 9.In fact control part 9 is made of CPU, program and memory etc., but here a part of modularization of inscape is described.

With reference to this figure, control part 9 comprises: bus 90, and with the scheme storage part 601 that is connected with bus 90, Scheme Choice portion 602, scheme generating unit 603, data communication section 701, temperature sensor data store 702, heater data store 703, program storage part 710.In addition, because scheme storage part 601, Scheme Choice portion 602, scheme generating unit 603 are identical with the structure of the substrate board treatment of the 1st execution mode, so not repeat specification here.

Data communication section 701 with wireless chip Ww between carry out communicating by letter of various data.Data communication section 701 is carried out following actions, for example detects sign on via output port 81 to controller 82,83 output temperatures, and receives the temperature data that detected by the 1st temperature sensor 70 and the 2nd temperature sensor 71 etc.

Each heating component of temperature sensor data store 702 storage by the 1st temperature sensor 70 and the 2nd temperature sensor 71 detected temperature datas.

Heater data store 703 is based on the temperature data that is stored in the temperature sensor data store 702, for example carry out aftermentioned temperature data generator, at each heating component, with heater accordingly, promptly the cut zone of sharing with heater (heating control area) accordingly, the storing temperature data.

Program storage part 710 storing temperature data generators 704 and heter temperature revision program 705.Heter temperature revision program 705 has following function, promptly, based on temperature data that is stored in heating plate 34 each cut zone in the heater data store 703 and predefined temperature measuring data, to temperature controller 82, the 83 output Control Parameter correction values of each heater.

Here, temperature data generator 704 and heter temperature revision program 705 are stored in storage medium for example in floppy disk, compressed disc, magneto optical disk (MO) and the storage card etc.And it is in the computer that temperature data generator 704 and heter temperature revision program 705 are installed in control part 9, is stored in the program storage part 710.

Referring again to Figure 15, the temperature correcting mode of the cut zone of each heating component is described.As illustrated in fig. 10, if pressing, the operator carries the beginning switch, then wireless chip Ww is joined arm A1 and is taken out with conveyer Cw from wireless chip, and is transported to (the step S4 of Figure 10) in the 1st heating component that is stored among the shelf assembly U1.

Figure 16 is the figure that is used for illustrating the input angle of the wireless chip Ww that is input to heating component.With reference to this figure, for wireless chip Ww, if the input angle of recess 80 under the state of the direction of importing to heating component is defined as 0 degree, then in this embodiment, the input angle that is input to the wireless chip Ww in the 1st heating component is 90 degree.In addition, the 1st heating component constitutes, and coldplate slides between above the position of handing-over arm A1 or main conveyor structure A2 visit wireless chip Ww and the heating plate 34, therefore, recess 80 be set as shown in this figure towards.In the 1st heating component, as stating, wireless chip Ww is positioned on the heating plate 34, heat-treats.

Then, the wireless chip Ww that exports from the 1st heating component is transported in the 2nd heating component that is stored in the shelf assembly U2 by main conveyor structure A2, carries out same processing (the step S5 of Figure 10).And then wireless chip Ww is transported in the 3rd heating component that is stored among the shelf assembly U3 by main conveyor structure A3, carries out same processing (the step S6 of Figure 10).In this embodiment, suppose that the input angle that is input to the wireless chip Ww in the 2nd heating component and the 3rd heating component is respectively 270 degree and 90 degree.

Figure 17 is the performance plot that expression utilizes the time series data of the temperature of heating plate detected value that each temperature sensor detects.

As stating, according to predetermined transport path and the time, carry wireless chip Ww to all heating components (being made as the 1st heating component, the 2nd heating component and the 3rd heating component for convenience), thus, as shown in the drawing, in each heating component, obtain the temperature data of the heating region that the 1st temperature sensor 70 shared and the temperature data of the heating region that the 2nd temperature sensor 71 is shared.

Figure 18 is the figure of the form of the expression heater locations that writes the input angle of the wireless chip Ww that is input in each heating component and each temperature sensor.

As shown in the drawing, utilize temperature data generator 704, consider the angle of wireless chip Ww to heating plate 34 inputs of each heater, use form to judge which heater heats control area of each heating plate 34 is corresponding with the temperature data of which temperature sensor.That is,, obtain the temperature of the cut zone of each heating plate 34 based on the input angle of wireless chip Ww and the temperature data of the 1st temperature sensor 70 and the 2nd temperature sensor 71.

Figure 19 is the performance plot of the time series data of each heter temperature detected value of expression.

With reference to this figure,, obtain the temperature data that respectively heats control area (cut zone) that each heater is shared to the 1st temperature sensor 70 and the 2nd temperature sensor 71 and each heating component.Temperature data generator 704 has following function, promptly, based on temperature data shown in this figure and for example predefined temperature data (these data for example are stored in the not shown memory), the same with Control Parameter correction portion 604, supply with the input pattern that control data is PID control and MV control with the electric power that set algorithm adjustment is sent each heater.Specifically, by carrying out temperature data generator 704, and the temperature objectives value and the time constant of adjustment PID control, and the level of the supply capability in the adjustment MV control and service time etc., will be based on the correction value of adjusting content from the temperature controller output (the step S15 of Figure 10) of control part 9 to each heater.

Then, control part 9 selection schemes, to begin the temperature measuring of revised heating component once more, output temperature is measured sign on and is carried out the temperature measuring scheme.Like this, control part 9 automatically utilizes the obtaining of temperature data of temperature detection that wireless chip Ww implements, heating plate 34, the computing of total data, the computing of deviate repeatedly, in based on the heating plate face of temperature detection value the mean value of temperature and mobility scale reach in the target temperature range and target face in temperature difference with till interior.

As previously discussed, in the substrate board treatment of the present invention's the 2nd execution mode, when predetermined transport path is transported to wireless chip Ww in each heating component, based on the input angle of the wireless chip Ww in the input heating component, judge the heating region of sharing separately at the 1st temperature sensor 70 and the 2nd temperature sensor 71 of the formation of the surface of wireless chip Ww.That is corresponding between each temperature sensor of understanding the surface that is formed on wireless chip Ww in each heating component and each heater that is arranged on heating plate 34 inside.Therefore, can adjust the temperature control parameter of each heater based on temperature data by each temperature sensor measurement of each heating component.

Claims (21)

1. the temperature-measuring method of a heating plate is measured the temperature of heating plate (34) with regard to substrate board treatment, and described substrate board treatment comprises: conveyer input part (B1), conveyer (C, the Cw) input that will take in a plurality of substrates (W, Ww); (U1～U3) is included in that heating plate (34) is gone up mounting aforesaid base plate (W, Ww) and the heating component of heat-treating to processing components; (A1～A3) accesses aforesaid base plate (W, Ww) and is transported to the aforementioned processing assembly (the U1～U3) from conveyer input part (B1) delivery section;

Described method comprises following operation:

(A1～A3) will comprise that the aforesaid base plate (Ww) that the temperature detection of temperature detecting part (41), storage part (42) and substrate controller (42) is used is transported in the aforementioned heating component along predetermined transport path by aforementioned delivery section;

Sign on output operation on the precalculated position in aforementioned transport path, is measured sign on to aforementioned temperature detection with substrate controller (42) output temperature of substrate (Ww);

Aforementioned temperature detects with substrate (Ww) reception aforementioned temperature mensuration sign on the time series data of temperature detection value is stored in the aforementioned storage part (42); With

Time series data is taken out operation, detect based on aforementioned temperature when the output aforementioned temperature is measured sign on and to play aforementioned temperature with the position of substrate (Ww) and detect the time of delivery till going up to aforementioned heating plate (34) with substrate (Ww) mounting and the time series data of the temperature detection value in the aforementioned storage part (42), take out aforementioned temperature and detect with substrate (Ww) mounting to last afterwards the time series data of aforementioned temperature detected value of aforementioned heating plate (34).

2. the temperature-measuring method of heating plate as claimed in claim 1, it is characterized in that, take out in the operation in aforementioned time series data, adjust with computer (5) taking-up aforementioned temperature and detect the time series data that goes up aforementioned temperature detected value afterwards with substrate (Ww) mounting to aforementioned heating plate (34).

3. the temperature-measuring method of heating plate as claimed in claim 2, it is characterized in that, the temperature-measuring method of aforementioned heating plate also comprises following operation: detect the time series data of the aforementioned temperature detected value after going up to aforementioned heating plate (34) with substrate (Ww) mounting based on aforementioned temperature, (Control Parameter of H1～H3) is revised to the heating part that is contained in aforementioned heating plate (34).

4. the temperature-measuring method of heating plate as claimed in claim 2 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

Aforementioned temperature detects with the temperature detecting part (41) that comprises in the substrate (Ww) and is arranged on the position corresponding with previous segmentation zone difference.

5. the temperature-measuring method of heating plate as claimed in claim 2 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions in a circumferential direction, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

The aforementioned temperature detection is provided with a plurality of with the temperature detecting part (41) that comprises in the substrate (Ww), so that carry out the temperature detection of aforementioned each cut zone,

The temperature-measuring method of aforementioned heating plate also comprises following operation: based on the time series data of the temperature detection value of aforementioned each cut zone, (Control Parameter of H1～H3), the time series data of the temperature detection value of described each cut zone are that the aforementioned temperature detection when detecting with substrate (Ww) mounting to aforementioned heating plate (34) according to aforementioned temperature obtains with the time series data towards with the temperature detection value of aforementioned each temperature detecting part (41) of substrate (Ww) to revise aforementioned each heating part.

6. the temperature-measuring method of heating plate as claimed in claim 2, it is characterized in that, in aforementioned sign on output operation, take in aforementioned temperature and detect and to go up conveyer controller (45) the output aforementioned temperature that is provided with substrate (Ww) and the conveyer (Cw) that is placed in conveyer input part (B1) and measure sign on, aforementioned temperature is measured sign in that (A1～A3) detects aforementioned temperature with substrate (Ww) and exports by aforementioned delivery section when aforementioned conveyor apparatus (Cw) is taken out.

7. the temperature-measuring method of heating plate as claimed in claim 1, it is characterized in that, the temperature-measuring method of aforementioned heating plate also comprises following operation: detect the time series data of the aforementioned temperature detected value after going up to aforementioned heating plate (34) with substrate (Ww) mounting based on aforementioned temperature, (Control Parameter of H1～H3) is revised to the heating part that comprises in the aforementioned heating plate (34).

8. the temperature-measuring method of heating plate as claimed in claim 1 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

Aforementioned temperature detects with the temperature detecting part (41) that comprises in the substrate (Ww) and is arranged on the position corresponding with previous segmentation zone difference.

9. the temperature-measuring method of heating plate as claimed in claim 1 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions in a circumferential direction, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

The aforementioned temperature detection is provided with a plurality of with the temperature detecting part (41) that comprises in the substrate (Ww), so that carry out the temperature detection of aforementioned each cut zone,

The temperature-measuring method of aforementioned heating plate also comprises following operation: based on the time series data of the temperature detection value of aforementioned each cut zone, (Control Parameter of H1～H3), the time series data of the temperature detection value of described each cut zone are that the aforementioned temperature detection when detecting with substrate (Ww) mounting to aforementioned heating plate (34) according to aforementioned temperature obtains with the time series data towards with the temperature detection value of aforementioned each temperature detecting part (41) of substrate (Ww) to revise aforementioned each heating part.

10. the temperature-measuring method of heating plate as claimed in claim 1, it is characterized in that, in aforementioned sign on output operation, take in aforementioned temperature and detect and to go up conveyer controller (45) the output aforementioned temperature that is provided with substrate (Ww) and the conveyer (Cw) that is placed in conveyer input part (B1) and measure sign on, aforementioned temperature is measured sign in that (A1～A3) detects aforementioned temperature with substrate (Ww) and exports by aforementioned delivery section when aforementioned conveyor apparatus (Cw) is taken out.

11. a substrate board treatment possesses:

Conveyer input part (B1), conveyer (C, the Cw) input that will take in a plurality of substrates (W, Ww);

(U1～U3) is included in that heating plate (34) is gone up mounting aforesaid base plate (W, Ww) and the heating component of heat-treating to processing components;

(A1～A3) accesses aforesaid base plate (W, Ww) and is transported to the aforementioned processing assembly (the U1～U3) from conveyer input part (B1) delivery section;

Control part (6,9), control aforementioned delivery section (A1～A3), be transported in the aforementioned heating component along predetermined transport path so that will comprise the aforesaid base plate (Ww) that the temperature detection of temperature detecting part (41), storage part (42) and substrate controller (42) is used;

Conveyer controller (45) is measured sign on to aforementioned temperature detection with substrate controller (42) output temperature of substrate (Ww) on the precalculated position in aforementioned transport path;

Adjust with computer (5), detect based on aforementioned temperature when the output aforementioned temperature is measured sign on and to play aforementioned temperature with the position of substrate (Ww) and detect the time of delivery till going up to aforementioned heating plate (34) with substrate (Ww) mounting and receive aforementioned temperature and measure sign on and store aforementioned temperature into and detect time series data, take out aforementioned temperature and detect and use substrate (Ww) mounting to arrive upward afterwards the time series data of aforementioned temperature detected value of aforementioned heating plate (34) with the temperature detection value in the storage part (42) that comprises the substrate (Ww).

12. substrate board treatment as claimed in claim 11, it is characterized in that, aforementioned control part (6) also detects the time series data of the aforementioned temperature detected value after going up to aforementioned heating plate (34) with substrate (Ww) mounting based on aforementioned temperature, (Control Parameter of H1～H3) is revised to the heating part that comprises in the aforementioned heating plate (34).

13. substrate board treatment as claimed in claim 12 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

Aforementioned temperature detects with the temperature detecting part (41) that comprises in the substrate (Ww) and is arranged on the position corresponding with previous segmentation zone difference.

14. substrate board treatment as claimed in claim 12 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions in a circumferential direction, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

The aforementioned temperature detection is provided with a plurality of with the temperature detecting part (41) that comprises in the substrate (Ww), so that carry out the temperature detection of aforementioned each cut zone,

Aforementioned control part (9) is also based on the time series data of the temperature detection value of aforementioned each cut zone, (Control Parameter of H1～H3), the time series data of the temperature detection value of described each cut zone are that the aforementioned temperature detection when detecting with substrate (Ww) mounting to aforementioned heating plate (34) according to aforementioned temperature obtains with the time series data towards with the temperature detection value of aforementioned each temperature detecting part (41) of substrate (Ww) to revise aforementioned each heating part.

15. substrate board treatment as claimed in claim 12, it is characterized in that, aforementioned conveyor apparatus controller (45) is arranged on to be taken in aforementioned temperature and detects with substrate (Ww) and be placed on the conveyer (Cw) of conveyer input part (B1), in that (A1～A3) detects aforementioned temperature with substrate (Ww) and export aforementioned temperature mensuration sign on when aforementioned conveyor apparatus (Cw) is taken out by aforementioned delivery section.

16. substrate board treatment as claimed in claim 11 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

Aforementioned temperature detects with the temperature detecting part (41) that comprises in the substrate (Ww) and is arranged on the position corresponding with previous segmentation zone difference.

17. substrate board treatment as claimed in claim 11 is characterized in that, aforementioned heating plate (34) is divided into a plurality of heating regions in a circumferential direction, and by a plurality of heating parts (H1～H3) heats each cut zone independently,

The aforementioned temperature detection is provided with a plurality of with the temperature detecting part (41) that comprises in the substrate (Ww), so that carry out the temperature detection of aforementioned each cut zone,

Aforementioned control part (9) is also based on the time series data of the temperature detection value of aforementioned each cut zone, (Control Parameter of H1～H3), the time series data of the temperature detection value of described each cut zone are that the aforementioned temperature detection when detecting with substrate (Ww) mounting to aforementioned heating plate (34) according to aforementioned temperature obtains with the time series data towards with the temperature detection value of aforementioned each temperature detecting part (41) of substrate (Ww) to revise aforementioned each heating part.

18. substrate board treatment as claimed in claim 11, it is characterized in that, aforementioned conveyor apparatus controller (45) is arranged on to be taken in aforementioned temperature and detects with substrate (Ww) and be placed on the conveyer (Cw) of conveyer input part (B1), in that (A1～A3) detects aforementioned temperature with substrate (Ww) and export aforementioned temperature mensuration sign on when aforementioned conveyor apparatus (Cw) is taken out by aforementioned delivery section.

19. the temperature measuring computer program of a heating plate, be used for measuring the temperature of heating plate (34) with regard to substrate board treatment, described substrate board treatment comprises: conveyer input part (B1), conveyer (C, the Cw) input that will take in a plurality of substrates (W, Ww); (U1～U3) is included in that heating plate (34) is gone up mounting aforesaid base plate (W, Ww) and the heating component of heat-treating to processing components; (A1～A3) accesses aforesaid base plate (W, Ww) and is transported to the aforementioned processing assembly (the U1～U3) from conveyer input part (B1) delivery section; Described program makes computer (5,6,9) carry out following step:

(A1～A3) will comprise that the aforesaid base plate (Ww) that the temperature detection of temperature detecting part (41), storage part (42) and substrate controller (42) is used is transported in the aforementioned heating component along predetermined transport path by aforementioned delivery section;

Sign on output step on the precalculated position in aforementioned transport path, is measured sign on to aforementioned temperature detection with substrate controller (42) output temperature of substrate (Ww);

Aforementioned temperature detects with substrate (Ww) reception aforementioned temperature mensuration sign on the time series data of temperature detection value is stored in the aforementioned storage part (42); With

Time series data is taken out step, detect based on aforementioned temperature when the output aforementioned temperature is measured sign on and to play aforementioned temperature with the position of substrate (Ww) and detect the time of delivery till going up to aforementioned heating plate (34) with substrate (Ww) mounting and the time series data of the temperature detection value in the aforementioned storage part (42), take out aforementioned temperature and detect with substrate (Ww) mounting to last afterwards the time series data of aforementioned temperature detected value of aforementioned heating plate (34).

20. the temperature measuring computer program of heating plate as claimed in claim 19, it is characterized in that, take out in the step in aforementioned time series data, adjust with computer (5) taking-up aforementioned temperature and detect the time series data that is gone up aforementioned temperature detected value afterwards with substrate (Ww) by mounting to aforementioned heating plate (34).

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